PN7462AUHN/C300E

PN7462 family NFC Cortex-M0 microcontroller Rev. 4.6 — 10 July 2020 406346 1 Product data sheet COMPANY PUBLIC General description The PN7462 family is a family of 32-bit Arm Cortex-M0-based NFC microcontrollers offering high performance and low power consumption. It has a simple instruction set and memory addressing along with a reduced code size compared to existing architectures. PN7462 family offers an all in one solution, with features such as NFC, supporting all NFC Forum modes, microcontroller, optional contact smart card reader, and software in a single chip. It operates at CPU frequencies of up to 20 MHz. Table 1. Comparison of the PN7462 family members PN7462AUHN PN7462AUEV PN7412AUHN PN7362AUHN PN7362AUEV PN7360AUHN PN7360AUEV Contact smart card reader Class A, B, C No Class A, B, C No No No No ISO/IEC Yes 7816 UART Yes Yes No No No No Contactless Yes interface Yes No Yes Yes Yes Yes Available Flash memory 160 kB 160 kB 160 kB 160 kB 80 kB 80 kB SRAM data 12 kB memory 12 kB 12 kB 12 kB 12 kB 12 kB 12 kB General 12 up-to 21 purposes I/ O 14 up-to 21 12 up-to 21 14 up-to 21 14 up-to 21 14 up-to 21 14 up-to 21 Package type VFBGA64 HVQFN64 HVQFN64 VFBGA64 HVQFN64 VFBGA64 160 kB HVQFN64 Having the differences listed in the table above, all products within the PN7462 family are equipped with 12 kB of SRAM data memory and 4 kB EEPROM. All products within 2 the family also include one host interface with either high-speed mode I C-bus, SPI, USB 2 or high-speed UART, and two master interfaces, SPI and Fast-mode Plus I C-bus. Four general-purpose counter/timers, a random number generator, one CRC coprocessor and up to 21 general-purpose I/O pins. The PN7462 family NFC microcontroller offers a one chip solution to build contactless, or contact and contactless applications. It is equipped with a highly integrated high-power output NFC-IC for contactless communication at 13.56 MHz enabling EMV-compliance on RF level, without additional external active components. By integrating a contact ISO/IEC 7816 interface on a single chip, the PN7462AUHN provides a solution for dual interface smart card readers. Whereas the PN7412AUHN offers a solution for a contact reader only. The PN7462AUHN and PN7412AUHN contact PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller interfaces offer a high level of security for the card by performing current limiting, shortcircuit detection, ESD protection as well as supply supervision. On PN7462AUHN, PN7412AUHN and PN7462AUEV, an additional UART output is also implemented to address applications where more than one contact card slot is needed. It enables an easy connection to multiple smart card slot interfaces like TDA8026. PN7462AUHN and PN7412AUHN provide thermal and short-circuit protection on all card contacts. It also provides automatic activation and deactivation sequences initiated by software or hardware. PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 2 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller 2 Features and benefits 2.1 Integrated contact interface frontend This chapter applies to the products with contact interface only. • Class A, B, and C cards can work on 1.8 V, 3 V, and 5 V supply • Specific ISO UART, variable baud rate through frequency or division ratio programming, error management at character level for T = 0, and extra guard time register • DC-to-DC converter for class A support starting at 3 V, and class B support starting at 2.7 V • Thermal and short-circuit protection on contact cards • Automatic activation and deactivation sequence, initiated by software or by hardware in case of short-circuit, card removal, overheating, and VDD or VDD drop-out • Enhanced ESD protection (> 12 kV) • ISO/IEC 7816 compliant • Compliance with EMV contact protocol specification • Clock generation up to 13.56 MHz • Synchronous card support • Possibility to extend the number of contact interfaces, with the addition of slot extenders such as TDA8026 2.2 Integrated ISO/IEC 7816-3&4 UART interface This chapter applies to the products with Integrated ISO/IEC 7816 UART interface only. The PN7462 family offers the possibility to extend the number of contact interfaces available. It uses an I/O auxiliary interface to connect a slot extension (TDA8035 - 1 slot, TDA8020 - 2 slots, and TDA8026 - 5 slots). • • • • Class A (5 V), class B (3 V), and class C (1.8 V) smart card supply Protection of smart card Three protected half-duplex bidirectional buffered I/O lines (C4, C7, and C8) Compliant with ISO/IEC 7816 and EMVCo standards 2.3 Integrated contactless interface frontend This chapter applies to the products with integrated contactless interface only. • • • • • • • • • • PN7462_FAM Product data sheet COMPANY PUBLIC High RF output power frontend IC for transfer speed up to 848 kbit/s NFC IP1 and NFC IP2 support Full NFC Forum tag support (type 1, type 2, type 3, type 4A, type 4B and type 5) P2P active and passive, target, and initiator Card emulation ISO14443 type A ISO/IEC 14443 type A and type B MIFARE products using Crypto 1 ISO/IEC 15693, and ISO/IEC 18000-3 mode 3 Low-power card detection Dynamic Power Control (DPC) All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 3 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller • Adaptive Wave Control (AWC) • Adaptive Range Control (ARC) • Compliance with EMV contactless protocol specification 2.4 Cortex-M0 microcontroller • Processor core – Arm Cortex: 32-bit M0 processor – Built-in Nested Vectored Interrupt Controller (NVIC) – Non-maskable interrupt – 24-bit system tick timer – Running frequency of up to 20 MHz – Clock management to enable low power consumption • Memory – Flash: 160 kB / 80 kB – SRAM: 12 kB – EEPROM: 4 kB – 40 kB boot ROM included, including USB mass storage primary boot loader for code download • Debug option – Serial Wire Debug (SWD) interface • Peripherals – Host interface: – USB 2.0 full speed with USB 3.0 hub connection capability – HSUART for serial communication, supporting standards speeds from 9600 bauds to 115200 bauds, and faster speed up to 1.288 Mbit/s – SPI with half-duplex and full duplex capability with speeds up to 7 Mbit/s 2 – I C supporting standard mode, fast mode, and high-speed mode with multiple address supports – Master interface: – SPI with half-duplex capability from 1 Mbit/s to 6.78 Mbit/s 2 – I C supporting standard mode, fast mode, fast mode plus, and clock stretching • Up to 21 General-Purpose I/O (GPIO) with configurable pull-up/pull-down resistors • GPIO1 to GPIO12 can be used as edge and level sensitive interrupt sources • Power – Two reduced power modes: standby mode and hard power-down mode – Supports suspend mode for USB host interface – Processor wake-up from hard power-down mode, standby mode, suspend mode via host interface, GPIOs, RF field detection – Integrated PMU to adjust internal regulators automatically, to minimize the power consumption during all possible power modes – Power-on reset – RF supply: external, or using an integrated LDO (TX LDO, configurable with 3 V, 3.3 V, 3.6 V, 4.5 V, and 4.75 V) – Pad voltage supply: external 3.3 V or 1.8 V, or using an integrated LDO (3.3 V supply) • Timers – Four general-purpose timers PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 4 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller – Programmable Watchdog Timer (WDT) • CRC coprocessor • Random number generator • Clocks – Crystal oscillator at 27.12 MHz – Dedicated PLL at 48 MHz for the USB – Integrated HFO 20 MHz and LFO 365 kHz • General – HVQFN64 package – VFBGA64 package – Temperature range: -40 °C to +85 °C PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 5 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller 3 Applications • • • • • • PN7462_FAM Product data sheet COMPANY PUBLIC Physical access control Gaming USB NFC reader, including dual interface smart card readers Home banking, payment readers EMVCo compliant High integration devices NFC applications All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 6 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller 4 Quick reference data Table 2. Quick reference data Operating range: -40 °C to +85 °C unless specified; contact interface: VDDP(VBUSP) = VDDP(VBUS); contactless interface: internal LDO not used Symbol Parameter Conditions Min Typ Max Unit VDDP(VBUS) power supply voltage on pin VBUS card emulation, passive target (PLM) 2.3 - 5.5 V all RF modes; class B and class C contact interface support 2.7 - 5.5 V all RF modes; class A, class B and class C contact interface support 3 - 5.5 V 1.8 V 1.65 1.8 1.95 V 3 3.3 3.6 V - 12 18 μA stand by mode; T = 25 °C; VDDP(VBUS) = 3.3 V; external PVDD LDO used - 18 - μA stand by mode; T = 25 °C; VDDP(VBUS) = 5.5 V; internal PVDD LDO used - 55 - μA suspend mode, USB interface; VDDP(VBUS) = 5.5 V; external PVDD supply; T = 25 °C - 120 250 µA on pin TVDD_IN; maximum supported operating current by the contactless interface - - 250 mA - - 1050 mW -40 - +85 °C VDD(PVDD) PVDD supply voltage 3.3 V IDDP(VBUS) power supply current on in hard power-down mode; T pin VBUS = 25 °C; VDDP(VBUS) = 5.5 V; RST_N = 0 IDD(TVDD) TVDD supply current Pmax maximum power dissipation Tamb ambient temperature [1] [1] JEDEC PCB If the USB interface is used, PVDD_IN voltage must be between 3.0 and 3.6 V, according to the USB specification. PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 7 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller 5 Ordering information The table below lists the ordering information of the PN7462 family. Table 3. Ordering information Type number Package Name Description PN7462AUHN HVQFN64 160 kB memory; contact interface; ISO/IEC 7816-3&4 SOT804-4 UART interface; plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 × 9 × 0.85 mm PN7462AUEV VFBGA64 160 kB memory; no contact interface; ISO/IEC 7816-3&4 UART interface; plastic very thin fine-pitch ball grid array package; 64 balls; 4.5 mm x 4.5 mm x 0.80 mm PN7412AUHN HVQFN64 160 kB memory; contact interface; ISO/IEC 7816-3&4 SOT804-4 UART interface; no contactless interface plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 × 9 × 0.85 mm PN7362AUHN HVQFN64 160 kB memory; no contact interface; no ISO/IEC SOT804-4 7816-3&4 UART interface; plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 × 9 × 0.85 mm PN7362AUEV VFBGA64 160 kB memory; no contact interface; no ISO/IEC 7816-3&4 UART interface; plastic very thin fine-pitch ball grid array package; 64 balls; 4.5 mm x 4.5 mm x 0.80 mm PN7360AUHN HVQFN64 80 kB memory; no contact interface; no ISO/IEC SOT804-4 7816-3&4 UART interface; plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 × 9 × 0.85 mm PN7360AUEV VFBGA64 80 kB memory; no contact interface; no ISO/IEC 7816-3&4 UART interface; plastic very thin fine-pitch ball grid array package; 64 balls; 4.5 mm x 4.5 mm x 0.80 mm PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 Version SOT1307-2 SOT1307-2 SOT1307-2 © NXP B.V. 2020. All rights reserved. 8 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller 6 Block diagram 6.1 Block diagram PN7462 HVQFN64 ARM-CORTEX M0 SWD SRAM 12 kB EEPROM 4 kB ROM 40 kB FLASH 160 kB system bus slave CODE PATCH slave slave AHB LITE I2C SPI master slave POWER, CLOCK AND RESET HSU HOST INTERFACES GPIO CLOCK GENERATORS HFO LFO XTAL USB PLL AHB TO APB AHB LITE BUFFER MANAGEMENT USB master BM2AHB BRIDGE master CLIF PMU MAIN LDO PVDD LDO TX LDO VCC LDO SC LDO DC-DC TEMPERATURE SENSOR SPI MASTER TIMERS TIME 0, 1, 2, 3 WATCHDOG I2C MASTER CTIF ISO7816 UART I/O AUX RNG CRC aaa-021334 Figure 1. Block diagram PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 9 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller 6.2 Block diagram PN7462 VFBGA64 ARM-CORTEX M0 SWD SRAM 12 kB EEPROM 4 kB ROM 40 kB FLASH 160 kB system bus slave CODE PATCH slave slave AHB LITE I2C SPI master slave POWER, CLOCK AND RESET HSU HOST INTERFACES GPIO CLOCK GENERATORS HFO LFO XTAL USB PLL AHB TO APB AHB LITE BUFFER MANAGEMENT USB master BM2AHB BRIDGE master CLIF PMU MAIN LDO PVDD LDO TX LDO VCC LDO SC LDO DC-DC TEMPERATURE SENSOR SPI MASTER TIMERS TIME 0, 1, 2, 3 WATCHDOG I2C MASTER ISO7816 UART I/O AUX RNG CRC aaa-029225 Figure 2. Block diagram PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 10 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller 6.3 Block diagram PN7412 HVQFN64 ARM-CORTEX M0 SWD SRAM 12 kB EEPROM 4 kB ROM 40 kB FLASH 160 kB system bus slave CODE PATCH slave slave AHB LITE master master slave POWER, CLOCK AND RESET AHB LITE BUFFER MANAGEMENT USB SPI CLOCK GENERATORS HFO HSU HOST INTERFACES LFO XTAL USB PLL AHB TO APB I2C GPIO PMU MAIN LDO PVDD LDO TX LDO VCC LDO SC LDO DC-DC TEMPERATURE SENSOR SPI MASTER TIMERS TIME 0, 1, 2, 3 WATCHDOG I2C MASTER CTIF ISO7816 UART I/O AUX RNG CRC aaa-030118 Figure 3. Block diagram PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 11 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller 6.4 Block diagram PN736X ARM-CORTEX M0 SWD SRAM 12 kB EEPROM 4 kB ROM 40 kB FLASH 160 / 80 kB system bus slave CODE PATCH slave slave AHB LITE I2C SPI master slave POWER, CLOCK AND RESET HSU HOST INTERFACES GPIO CLOCK GENERATORS HFO LFO XTAL USB PLL AHB TO APB AHB LITE BUFFER MANAGEMENT USB master BM2AHB BRIDGE master PMU MAIN LDO PVDD LDO TX LDO CLIF TEMPERATURE SENSOR SPI MASTER TIMERS TIME 0, 1, 2, 3 WATCHDOG I2C MASTER RNG CRC aaa-025625 Figure 4. Block diagram PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 12 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller 7 Pinning information ATX_C 8 ATX_D 9 SWDCLK 14 SWDIO 15 8 40 XTAL1 ATX_D 9 TVSS 32 TX2 31 VMID 30 RXP 29 RXN 28 GPIO12 27 GPIO11 26 GPIO10 25 GPIO9 24 GPIO8 23 GPIO7 22 GPIO6 21 GPIO5 20 GPIO4 19 GPIO2 17 GPIO3 18 39 VDD 38 VUP_TX 35 ANT1 SWDCLK 14 37 TVDD_OUT GND 36 ANT2 35 ANT1 SWDIO 15 34 TVDD_IN GPIO1 16 33 TX1 aaa-025629 aaa-021124 Transparent top view Figure 6. Pin configuration PN7462 49 SAP 50 VUP 51 VCC 52 RST 53 CLK 54 GNDC 55 AUX1 56 AUX2 57 IO 58 USB_VBUS 59 PVDD_M_IN 60 SPIM_SSN 61 SPI_SCLK 62 SPIM_MOSI 63 SPIM_MISO 40 XTAL1 DWL_REQ 12 Transparent top view 64 I2CM_SCL 41 XTAL2 DVDD 11 IRQ 13 33 TX1 42 RST_N PN7462AU PVDD_IN 10 36 ANT2 Figure 5. Pin configuration PN736X terminal 1 index area 49 SAP ATX_C 34 TVDD_IN GPIO1 16 50 VUP 41 XTAL2 GPIO2 17 GND 51 VCC 7 37 TVDD_OUT IRQ 13 52 RST ATX_B 38 VUP_TX DWL_REQ 12 53 CLK 43 VBUS 42 RST_N 39 VDD DVDD 11 54 GNDC 6 TVSS 32 7 55 AUX1 ATX_A TX2 31 ATX_B 56 AUX2 44 PVDD_OUT 43 VBUS VMID 30 6 57 IO 5 RXP 29 ATX_A 58 USB_VBUS 45 GNDP PRES RXN 28 44 PVDD_OUT 59 PVDD_M_IN 4 GPIO12 27 5 60 SPIM_SSN 46 SAM INT_AUX GPIO11 26 n.c. 61 SPI_SCLK 47 SCVDD IO_AUX 3 GPIO10 25 45 GNDP 62 SPIM_MOSI 48 VBUSP 2 GPIO9 24 4 63 SPIM_MISO 1 CLK_AUX GPIO8 23 GPIO16 PVDD_IN 10 l2CM_SDA GPIO7 22 GPIO15 46 n.c. GPIO6 21 47 n.c. 3 GPIO5 20 48 VBUSP 2 GPIO4 19 1 GPIO14 GPIO3 18 l2CM_SDA PN736XAU 64 I2CM_SCL terminal 1 index area 49 n.c. 50 n.c. 51 n.c. 52 n.c. 53 n.c. 54 GNDC 55 n.c. 56 n.c. 57 n.c. 58 USB_VBUS 59 PVDD_M_IN 60 SPIM_SSN 61 SPI_SCLK 62 SPIM_MOSI terminal 1 index area 63 SPIM_MISO 64 I2CM_SCL 7.1 Pinning HVQFN64 l2CM_SDA 1 48 VBUSP CLK_AUX 2 47 SCVDD IO_AUX 3 46 SAM INT_AUX 4 45 GNDP PRES 5 44 PVDD_OUT ATX_A 6 43 VBUS ATX_B 7 ATX_C 8 ATX_D 9 42 RST_N 41 XTAL2 PN7412AU 40 XTAL1 PVDD_IN 10 39 VDD DVDD 11 38 VUP_TX DWL_REQ 12 37 TVDD_OUT GND IRQ 13 36 n.c. TVSS 32 n.c. 31 n.c. 30 n.c. 29 n.c. 28 GPIO12 27 GPIO11 26 GPIO10 25 GPIO9 24 GPIO8 23 GPIO7 22 GPIO6 21 GPIO5 20 33 n.c. GPIO4 19 34 n.c. GPIO1 16 GPIO3 18 35 n.c. SWDIO 15 GPIO2 17 SWDCLK 14 aaa-030468 Transparent top view Figure 7. Pin configuration PN7412 Important note: the inner leads below the package are internally connected to the PIN. Special care needs to be taken during the design so that no conductive part is present under these PINs, which could cause short cuts. PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 13 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller 7.2 Pin description HVQFN64 Table 4. Pin description Pin Symbol Description PN736X PN736X Symbol Description PN7462 PN7462 2 2 Symbol Description PN7412 PN7412 I2CM_ SDA I C-bus serial data I/O master/GPIO13 I2CM_ SDA I C-bus serial data I/O master/GPIO13 2 CLK_ AUX GPIO14 CLK_ AUX auxiliary card contact clock/ CLK_ GPIO14 AUX 3 IO_AUX GPIO15 IO_AUX auxiliary card contact I/O/ GPIO15 IO_AUX auxiliary card contact I/O/ GPIO15 4 INT_ AUX GPIO16 INT_ AUX auxiliary card contact interrupt/GPIO16 INT_ AUX auxiliary card contact interrupt/GPIO16 5 n.c. not connected PRES card presence PRES card presence 6 ATX_A SPI slave select input 2 (NSS_S)/I C-bus serial clock input (SCL_S)/ HSUART RX ATX_A SPI slave select input 2 (NSS_S)/I C-bus serial clock input (SCL_S)/ HSUART RX ATX_A SPI slave select input 2 (NSS_S)/I C-bus serial clock input (SCL_S)/ HSUART RX 7 ATX_B SPI slave data input ATX_B 2 (MOSI_S)/I C-bus serial data I/O (SDA_S)/HSUART TX SPI slave data input ATX_B 2 (MOSI_S)/I C-bus serial data I/O (SDA_S)/HSUART TX SPI slave data input 2 (MOSI_S)/I C-bus serial data I/O (SDA_S)/HSUART TX 8 ATX_C USB D+/SPI slave data ATX_C 2 output (MISO_S)/I C-bus address bit0 input/HSUART RTS USB D+/SPI slave data ATX_C 2 output (MISO_S)/I C-bus address bit0 input/HSUART RTS USB D+/SPI slave data 2 output (MISO_S)/I C-bus address bit0 input/HSUART RTS 9 ATX_D USB D-/SPI clock input 2 (SCK_S)/I C-bus address bit1 input/HSUART CTS ATX_D USB D-/SPI clock input 2 (SCK_S)/I C-bus address bit1 input/HSUART CTS ATX_D USB D-/SPI clock input 2 (SCK_S)/I C-bus address bit1 input/HSUART CTS 10 PVDD_ IN pad supply voltage input PVDD_ IN pad supply voltage input PVDD_ IN pad supply voltage input 11 DVDD digital core logic supply voltage input DVDD digital core logic supply voltage input DVDD digital core logic supply voltage input 12 DWL_ REQ entering in download mode DWL_ REQ entering in download mode DWL_ REQ entering in download mode 13 IRQ interrupt request output IRQ interrupt request output IRQ interrupt request output 14 SWDC LK SW serial debug line clock SWDC LK SW serial debug line clock SWDC LK SW serial debug line clock 15 SWDIO SW serial debug line input/ output SWDIO SW serial debug line input/ output SWDIO SW serial debug line input/ output 16 GPIO1 general-purpose I/O/SPI master select2 output GPIO1 general-purpose I/O/SPI master select2 output GPIO1 general-purpose I/O/SPI master select2 output 17 GPIO2 general-purpose I/O GPIO2 general-purpose I/O GPIO2 general-purpose I/O 18 GPIO3 general-purpose I/O GPIO3 general-purpose I/O GPIO3 general-purpose I/O 19 GPIO4 general-purpose I/O GPIO4 general-purpose I/O GPIO4 general-purpose I/O 20 GPIO5 general-purpose I/O GPIO5 general-purpose I/O GPIO5 general-purpose I/O 21 GPIO6 general-purpose I/O GPIO6 general-purpose I/O GPIO6 general-purpose I/O PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 I2CM_ SDA 2 1 I C-bus serial data I/O master/GPIO13 auxiliary card contact clock/ GPIO14 © NXP B.V. 2020. All rights reserved. 14 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller Pin Symbol Description PN736X PN736X Symbol Description PN7462 PN7462 Symbol Description PN7412 PN7412 22 GPIO7 general-purpose I/O GPIO7 general-purpose I/O GPIO7 general-purpose I/O 23 GPIO8 general-purpose I/O GPIO8 general-purpose I/O GPIO8 general-purpose I/O 24 GPIO9 general-purpose I/O GPIO9 general-purpose I/O GPIO9 general-purpose I/O 25 GPIO10 general-purpose I/O GPIO10 general-purpose I/O GPIO10 general-purpose I/O 26 GPIO11 general-purpose I/O GPIO11 general-purpose I/O GPIO11 general-purpose I/O 27 GPIO12 general-purpose I/O GPIO12 general-purpose I/O GPIO12 general-purpose I/O 28 RXN receiver input RXN receiver input n.c. See UM10858 for connection details 29 RXP receiver input RXP receiver input n.c. See UM10858 for connection details 30 VMID receiver reference voltage input VMID receiver reference voltage input n.c. See UM10858 for connection details 31 TX2 antenna driver output TX2 antenna driver output n.c. keep unconnected 32 TVSS ground for antenna power supply TVSS ground for antenna power supply TVSS ground for antenna power supply 33 TX1 antenna driver output TX1 antenna driver output n.c. keep unconnected 34 TVDD_ IN antenna driver supply voltage input TVDD_ IN antenna driver supply voltage input n.c. Connect to GND 35 ANT1 antenna connection for load modulation in card emulation and P2P passive target modes ANT1 antenna connection for load modulation in card emulation and P2P passive target modes n.c. See UM10858 for connection details 36 ANT2 antenna connection for load modulation in card emulation and P2P passive target modes ANT2 antenna connection for load modulation in card emulation and P2P passive target modes n.c. See UM10858 for connection details 37 TVDD_ OUT antenna driver supply, output of TX_LDO TVDD_ OUT antenna driver supply, output of TX_LDO TVDD_ OUT antenna driver supply, output of TX_LDO 38 VUP_ TX supply of the contactless TX_LDO VUP_ TX supply of the contactless TX_LDO VUP_ TX supply of the contactless TX_LDO 39 VDD 1.8 V regulator output for digital blocks VDD 1.8 V regulator output for digital blocks VDD 1.8 V regulator output for digital blocks 40 XTAL1 27.12 MHz clock input for crystal XTAL1 27.12 MHz clock input for crystal XTAL1 27.12 MHz clock input for crystal 41 XTAL2 27.12 MHz clock input for crystal XTAL2 27.12 MHz clock input for crystal XTAL2 27.12 MHz clock input for crystal 42 RST_N reset pin RST_N reset pin RST_N reset pin 43 VBUS main supply voltage input of VBUS microcontroller main supply voltage input of VBUS microcontroller main supply voltage input of microcontroller 44 PVDD_ OUT output of PVDD_LDO for pad voltage supply PVDD_ OUT output of PVDD_LDO for pad voltage supply PVDD_ OUT output of PVDD_LDO for pad voltage supply 45 GNDP Ground GNDP Ground GNDP Ground PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 15 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller Pin Symbol Description PN736X PN736X Symbol Description PN7462 PN7462 Symbol Description PN7412 PN7412 46 n.c. not connected SAM SAM 47 n.c. not connected SCVDD input LDO for DC-to-DC converter SCVDD input LDO for DC-to-DC converter 48 VBUSP Connected to VBUS VBUSP main supply for the contact interface VBUSP main supply for the contact interface 49 n.c. not connected SAP DC-to-DC converter connection SAP DC-to-DC converter connection 50 n.c. not connected VUP reserved; connected to GND through a decoupling capacitance VUP reserved; connected to GND through a decoupling capacitance 51 n.c. not connected VCC card supply output of contact interface VCC card supply output of contact interface 52 n.c. not connected RST reset pin of contact interface RST reset pin of contact interface 53 n.c. not connected CLK clock pin of contact interface CLK clock pin of contact interface 54 GNDC connected to the ground GNDC connected to the ground GNDC connected to the ground 55 n.c. not connected AUX1 C4 card I/O pin of contact interface AUX1 C4 card I/O pin of contact interface 56 n.c. not connected AUX2 C8 card I/O pin of contact interface AUX2 C8 card I/O pin of contact interface 57 n.c. not connected IO card I/O IO card I/O 58 USB_ VBUS used for USB VBUS detection USB_ VBUS used for USB VBUS detection USB_ VBUS used for USB VBUS detection 59 PVDD_ M_IN pad supply voltage input for PVDD_ master interfaces M_IN pad supply voltage input for PVDD_ master interfaces M_IN pad supply voltage input for master interfaces 60 SPIM_ SSN SPI master select 1 output/ GPIO17 SPIM_ SSN SPI master select 1 output/ GPIO17 SPIM_ SSN SPI master select 1 output/ GPIO17 61 SPI_ SCLK SPI master clock output/ GPIO18 SPI_ SCLK SPI master clock output/ GPIO18 SPI_ SCLK SPI master clock output/ GPIO18 62 SPIM_ MOSI SPI master data output/ GPIO19 SPIM_ MOSI SPI master data output/ GPIO19 SPIM_ MOSI SPI master data output/ GPIO19 63 SPIM_ MISO SPI master data input/ GPIO20 SPIM_ MISO SPI master data input/ GPIO20 SPIM_ MISO SPI master data input/ GPIO20 64 I2CM_ SCL I C-bus serial clock output master/GPIO21 I2CM_ SCL I C-bus serial clock output master/GPIO21 I2CM_ SCL I C-bus serial clock output master/GPIO21 Ground GND Ground GND Ground Die GND pad 2 PN7462_FAM Product data sheet COMPANY PUBLIC DC-to-DC converter connection 2 All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 DC-to-DC converter connection 2 © NXP B.V. 2020. All rights reserved. 16 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller 7.3 Pinning VFBGA64 H G F E D C B A ball A1 index area 1 2 3 4 5 6 7 8 aaa-027834 Figure 8. Pin configuration VFBGA64 (bottom view) 7.4 Pin description VFBGA64 Table 5. Pin description Pin Symbol PN736X Description PN736X Symbol PN7462 Description PN7462 A1 I2CM_SDA I C-bus serial data I/O master/GPIO13 I2CM_SDA I C-bus serial data I/O master/GPIO13 A2 SPIM_MISO SPI master data input/GPIO20 SPIM_MISO SPI master data input/GPIO20 A3 PVDD_M_IN pad supply voltage input for master interfaces PVDD_M_IN pad supply voltage input for master interfaces A4 VBUSP Connected to VBUS VBUSP Connected to VBUS A5 VBUS main supply voltage input of microcontroller VBUS main supply voltage input of microcontroller A6 PVSS Pad ground PVSS Pad ground A7 PVDD_OUT output of PVDD_LDO for pad voltage supply PVDD_OUT output of PVDD_LDO for pad voltage supply A8 XTAL2 27.12 MHz clock input for crystal XTAL2 27.12 MHz clock input for crystal B1 INT_AUX GPIO16 INT_AUX auxiliary card contact interrupt/GPIO16 2 2 2 2 B2 ATX_A SPI slave select input (NSS_S)/I C-bus serial clock input (SCL_S)/HSUART RX ATX_A SPI slave select input (NSS_S)/I C-bus serial clock input (SCL_S)/HSUART RX B3 SPIM_MOSI SPI master data output/GPIO19 SPIM_MOSI SPI master data output/GPIO19 B4 SPIM_SSN SPI master select 1 output/GPIO17 SPIM_SSN SPI master select 1 output/GPIO17 B5 USB_VBUS used for USB VBUS detection USB_VBUS used for USB VBUS detection B6 PVSS Pad ground PVSS Pad ground B7 PVSS Pad ground PVSS Pad ground B8 XTAL1 27.12 MHz clock input for crystal XTAL1 27.12 MHz clock input for crystal C1 CLK_AUX GPIO14 CLK_AUX auxiliary card contact clock/GPIO14 ATX_B SPI slave data input (MOSI_S)/I C-bus serial data I/O (SDA_S)/HSUART TX C2 ATX_B PN7462_FAM Product data sheet COMPANY PUBLIC 2 SPI slave data input (MOSI_S)/I C-bus serial data I/O (SDA_S)/HSUART TX All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 2 © NXP B.V. 2020. All rights reserved. 17 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller Pin Symbol PN736X Description PN736X Symbol PN7462 Description PN7462 C3 I2CM_SCL I C-bus serial clock output master/ GPIO21 I2CM_SCL I C-bus serial clock output master/ GPIO21 C4 SPI_SCLK SPI master clock output/GPIO18 SPI_SCLK SPI master clock output/GPIO18 C5 DVSS Digital ground DVSS Digital ground C6 PVSS Pad ground PVSS Pad ground C7 RST_N reset pin RST_N reset pin C8 VDD 1.8 V regulator output for digital blocks VDD 1.8 V regulator output for digital blocks D1 PVDD_IN pad supply voltage input PVDD_IN pad supply voltage input D2 ATX_C USB D+/SPI slave data output 2 (MISO_S)/I C-bus address bit0 input/ HSUART RTS ATX_C USB D+/SPI slave data output 2 (MISO_S)/I C-bus address bit0 input/ HSUART RTS D3 IRQ interrupt request output IRQ interrupt request output D4 IO_AUX GPIO15 IO_AUX auxiliary card contact I/O/GPIO15 D5 DVSS Digital ground DVSS Digital ground D6 PVSS Pad ground PVSS Pad ground D7 PVSS Pad ground PVSS Pad ground D8 VUP_TX supply of the contactless TX_LDO VUP_TX supply of the contactless TX_LDO E1 DVDD digital core logic supply voltage input DVDD digital core logic supply voltage input 2 2 2 2 E2 ATX_D USB D-/SPI clock input (SCK_S)/I C-bus ATX_D address bit1 input/HSUART CTS USB D-/SPI clock input (SCK_S)/I C-bus address bit1 input/HSUART CTS E3 GPIO1 general-purpose I/O/SPI master select2 output GPIO1 general-purpose I/O/SPI master select2 output E4 GPIO5 general-purpose I/O GPIO5 general-purpose I/O E5 DVSS Digital ground DVSS Digital ground E6 AVSS Analog ground AVSS Analog ground E7 ANT2 antenna connection for load modulation ANT2 in card emulation and P2P passive target modes antenna connection for load modulation in card emulation and P2P passive target modes E8 TVDD_OUT antenna driver supply, output of TX_LDO TVDD_OUT antenna driver supply, output of TX_LDO F1 DWL_REQ entering in download mode DWL_REQ entering in download mode F2 SWDIO SW serial debug line input/output SWDIO SW serial debug line input/output F3 GPIO6 general-purpose I/O GPIO6 general-purpose I/O F4 GPIO9 general-purpose I/O GPIO9 general-purpose I/O F5 GPIO12 general-purpose I/O GPIO12 general-purpose I/O F6 AVSS Analog ground AVSS Analog ground F7 ANT1 antenna connection for load modulation ANT1 in card emulation and P2P passive target modes antenna connection for load modulation in card emulation and P2P passive target modes F8 TVDD_IN antenna driver supply voltage input antenna driver supply voltage input PN7462_FAM Product data sheet COMPANY PUBLIC TVDD_IN All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 18 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller Pin Symbol PN736X Description PN736X Symbol PN7462 Description PN7462 G1 SWDCLK SW serial debug line clock SWDCLK SW serial debug line clock G2 GPIO4 general-purpose I/O GPIO4 general-purpose I/O G3 GPIO7 general-purpose I/O GPIO7 general-purpose I/O G4 GPIO8 general-purpose I/O GPIO8 general-purpose I/O G5 GPIO10 general-purpose I/O GPIO10 general-purpose I/O G6 GPIO11 general-purpose I/O GPIO11 general-purpose I/O G7 AVSS Analog ground AVSS Analog ground G8 TX1 antenna driver output TX1 antenna driver output H1 GPIO3 general-purpose I/O GPIO3 general-purpose I/O H2 GPIO2 general-purpose I/O GPIO2 general-purpose I/O H3 VMID receiver reference voltage input VMID receiver reference voltage input H4 RXN receiver input RXN receiver input H5 RXP receiver input RXP receiver input H6 TVSS Antenna driver ground TVSS Antenna driver ground H7 TX2 antenna driver output TX2 antenna driver output H8 TVSS Antenna driver ground TVSS Antenna driver ground PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 19 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller 8 Functional description 8.1 Arm Cortex-M0 microcontroller The PN7462 family is an Arm Cortex-M0-based 32-bit microcontroller, optimized for lowcost designs, high energy efficiency, and simple instruction set. The CPU operates on an internal clock, which can be configured to provide frequencies such as 20 MHz, 10 MHz, and 5 MHz. The peripheral complement of the PN7462 family includes a 160 kB flash memory, a 12 kB SRAM, and a 4 kB EEPROM. It also includes one configurable host interface (Fast2 mode Plus and high-speed I C, SPI, HSUART, and USB), two master interfaces (Fast2 mode Plus I C, SPI), 4 timers, 12 general-purpose I/O pins, one ISO/IEC 7816 contact card interface (PN7462AUHN only), one ISO/IEC 7816-3&4 UART (PN7462AUHN and PN7462AUEV only) and one 13.56 MHz NFC interface. 8.2 Memories 8.2.1 On-chip flash programming memory The PN7462 family contains160 / 80 kB on-chip flash program memory depending on the version. The flash can be programmed using In-System Programming (ISP) or InApplication Programming (IAP) via the on-chip boot loader software. The flash memory is divided into two instances of 80 kB each, with each sector consisting of individual pages of 64 bytes. 8.2.1.1 Memory mapping The flash memory mapping is described in Figure 9. 0x0021 6FFF 0x0022 AFFF RESERVED 2 KBytes 0x0022 A7FF FLASH user application 80 KBytes user application 0x0020 3000 PN7360 PN7362 / PN7462 158 KBytes 0x0020 3000 aaa-025626 Figure 9. Flash memory mapping PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 20 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller 8.2.2 EEPROM The PN7462 family embeds 4 kB of on-chip byte-erasable and byte-programmable EEPROM data memory. The EEPROM can be programmed using In-System Programming (ISP). 8.2.2.1 Memory mapping 0x201FFF 3.5 KBytes 512 Bytes user space 0x201200 RESERVED 0x201000 aaa-021125 Figure 10. EEPROM memory mapping 8.2.3 SRAM The PN7462 family contains a total of 12 kB on-chip static RAM memory. 8.2.3.1 Memory mapping The SRAM memory mapping is shown in Figure 11. RAM_Sys_End = 0x00102FFF RAM_SYSTEM RESERVED 256 Bytes RAM USER RW 12000 Bytes RESERVED 32 Bytes RAM_Sys_Start = 0x00102F00 RAM_User_Start = 0x00100020 RAM_User_RO_Start = 0x100000 aaa-021126 Figure 11. SRAM memory mapping PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 21 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller 8.2.4 ROM The PN7462 family contains 40 kB of on-chip ROM memory. The on-chip ROM contains boot loader, USB mass storage primary download, and the following Application Programming Interfaces (APIs): • In-Application Programming (IAP) support for flash • Lifecycle management of debug interface, code write protection of flash memory and USB mass storage primary download • USB descriptor configuration • Configuration of timeout and source of pad supply 8.2.5 Memory map The PN7462 family incorporates several distinct memory regions. Figure 12 shows the memory map, from the user program perspective, following reset. The APB peripheral area is 512 kB in size, and is divided to allow up to 32 peripherals. Only peripherals from 0 to 15 are accessible. Each peripheral allocates 16 kB, which simplifies the address decoding for the peripherals. APB memory map is described in Figure 13 and Figure 14. PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 22 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller 4 GB 0xFFFF FFFF RESERVED 4 GB 0xFFFF FFFF RESERVED 0xE0FF FFFF 0xE0FF FFFF PRIVATE PERIPHERAL BUS PRIVATE PERIPHERAL BUS 0xE000 0000 0xE000 0000 RESERVED RESERVED 0x4007 FFFF 0x4007 FFFF APB PERIPHERAL APB PERIPHERAL 0x4000 0000 1 GB 0x4000 0000 1 GB RESERVED RESERVED 0x0022 AFFF 0x0022 AFFF 80 kB FLASH 160 kB FLASH 0x0020 3000 0x0020 3000 RESERVED RESERVED 0x0020 1FFF 0x0020 1FFF 4 kB EEPROM 4 kB EEPROM 0x0020 1000 0x0020 1000 EEPROM REG EEPROM REG 0x0020 0000 2 MB 0x0020 0000 2 MB RESERVED RESERVED 0x0010 2FFF 0x0010 2FFF 12 kB SRAM 12 kB SRAM 0x0010 0000 1 MB 0x0010 0000 1 MB RESERVED RESERVED 0x0000 9FFF 0x0000 9FFF 40 kB ROM 0 MB 40 kB ROM 0x0000 0000 0 MB PN7360 0x0000 0000 PN7362 / PN7462 aaa-025628 Figure 12. PN7462 family memory map PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 23 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller APB ID APB IF name Connected IP 16 to 31 Reserved 15 Reserved 14 Reserved 0x4004 0000 0x4003 C000 13 SPIMASTER_APB SPI Master IF 12 I2CMASTER_APB I2C Master IF 11 Reserved 10 USB_APB HostIF (USB) IP 9 PCR_APB PowerClockResetModule IP 8 HOST_APB HostIF (I2C/SPI/HSU/BufMgt) IP 7 TIMERS_APB Timer IP 6 RNG_APB RNG IP Reserved 5 4 CLOCKGEN_APB Clock Gen module 3 CRC_APB CRC IP 2 PMU_APB PMU modules 1 CL_APB Contactless IP Reserved 0 0x4004 8000 0x4003 8000 0x4003 4000 0x4003 0000 0x4002 C000 0x4002 8000 0x4002 4000 0x4002 0000 0x4001 C000 0x4001 8000 0x4001 4000 0x4001 0000 0x4000 C000 0x4000 8000 0x4000 4000 0x4000 0000 aaa-021127 Figure 13. APB memory map PN736X APB ID APB IF name Connected IP 16 to 31 Reserved 15 Reserved 14 Reserved 0x4004 0000 0x4003 C000 13 SPIMASTER_APB SPI Master IF 12 I2CMASTER_APB I2C Master IF 11 Reserved 10 USB_APB HostIF (USB) IP 9 PCR_APB PowerClockResetModule IP 8 HOST_APB HostIF (I2C/SPI/HSU/BufMgt) IP 7 TIMERS_APB Timer IP 6 RNG_APB RNG IP 5 CTUART_APB Contact UART IP 4 CLOCKGEN_APB Clock Gen module 3 CRC_APB CRC IP 2 PMU_APB PMU modules 1 CL_APB Contactless IP 0 0x4004 8000 Reserved 0x4003 8000 0x4003 4000 0x4003 0000 0x4002 C000 0x4002 8000 0x4002 4000 0x4002 0000 0x4001 C000 0x4001 8000 0x4001 4000 0x4001 0000 0x4000 C000 0x4000 8000 0x4000 4000 0x4000 0000 aaa-028697 Figure 14. APB memory map PN7462 PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 24 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller APB ID APB IF name Connected IP 16 to 31 Reserved 15 Reserved 14 Reserved 0x4004 0000 0x4003 C000 13 SPIMASTER_APB SPI Master IF 12 I2CMASTER_APB I2C Master IF 11 Reserved 10 USB_APB HostIF (USB) IP 9 PCR_APB PowerClockResetModule IP 8 HOST_APB HostIF (I2C/SPI/HSU/BufMgt) IP 7 TIMERS_APB Timer IP 6 RNG_APB RNG IP 5 CTUART_APB Contact UART IP 4 CLOCKGEN_APB Clock Gen module 3 CRC_APB CRC IP 2 PMU_APB PMU modules 1 Reserved 0 Reserved 0x4004 8000 0x4003 8000 0x4003 4000 0x4003 0000 0x4002 C000 0x4002 8000 0x4002 4000 0x4002 0000 0x4001 C000 0x4001 8000 0x4001 4000 0x4001 0000 0x4000 C000 0x4000 8000 0x4000 4000 0x4000 0000 aaa-030119 Figure 15. APB memory map PN7412 8.3 Nested Vectored Interrupt Controller (NVIC) Cortex-M0 includes a Nested Vectored Interrupt Controller (NVIC). The tight coupling to the CPU allows for low interrupt latency and efficient processing of late arriving interrupts. 8.3.1 NVIC features • • • • • System exceptions and peripheral interrupts control Support 32 vectored interrupts Four interrupt priority levels with hardware priority level masking One Non-Maskable Interrupt (NMI) connected to the watchdog interrupt Software interrupt generation 8.3.2 Interrupt sources The following table lists the interrupt sources available in the PN7462 family microcontroller. Table 6. Interrupt sources PN7462_FAM Product data sheet COMPANY PUBLIC EIRQ# Source Description 0 timer 0/1/2/3 general-purpose timer 0/1/2/3 interrupt 1 - reserved 2 CLIF NFC interface module interrupt 3 EECTRL EEPROM controller 4 - reserved 5 - reserved 6 host IF TX or RX buffer from I C, SPI, HSU, or USB module 2 All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 25 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller EIRQ# Source Description 7 contact IF ISO7816 contact module interrupt 8 - reserved 9 PMU power management unit (temperature sensor, over current, overload, and VBUS level) 10 SPI master TX or RX buffer from SPI master module 2 I C master TX or RX buffer from I C master module 12 PCR high temperature from temperature sensor 0 and 1; interrupt to CPU from PCR to indicate wake-up from suspend mode; out of standby; out of suspend; event on GPIOs configured as inputs 13 PCR interrupt common GPIO1 to GPIO12 14 PCR interrupt (rise/fall/both-edge/level-high/level-low interrupt as programmed) GPIO1 15 PCR interrupt (rise/fall/both-edge/level-high/level-low interrupt as programmed) GPIO2 16 PCR interrupt (rise/fall/both-edge/level-high/level-low interrupt as programmed) GPIO3 17 PCR interrupt (rise/fall/both-edge/level-high/level-low interrupt as programmed) GPIO4 18 PCR interrupt (rise/fall/both-edge/level-high/level-low interrupt as programmed) GPIO5 19 PCR interrupt (rise/fall/both-edge/level-high/level-low interrupt as programmed) GPIO6 20 PCR interrupt (rise/fall/both-edge/level-high/level-low interrupt as programmed) GPIO7 21 PCR interrupt (rise/fall/both-edge/level-high/level-low interrupt as programmed) GPIO8 22 PCR interrupt (rise/fall/both-edge/level-high/level-low interrupt as programmed) GPIO9 23 PCR interrupt (rise/fall/both-edge/level-high/level-low interrupt as programmed) GPIO10 24 PCR interrupt (rise/fall/both-edge/level-high/level-low interrupt as programmed) GPIO11 25 PCR interrupt (rise/fall/both-edge/level-high/level-low interrupt as programmed) GPIO12 26 - reserved 27 - reserved 28 - reserved 29 - reserved 30 - reserved - reserved WDT watchdog interrupt is connected to the non-maskable interrupt pin 31 NMI PN7462_FAM Product data sheet COMPANY PUBLIC 2 11 [1] All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 26 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller [1] The NMI is not available on an external pin. 8.4 GPIOs The PN7462 family has up to 21 general-purpose I/O (GPIO) with configurable pull-up 2 and pull-down resistors, up to 9 of those GPIOs are multiplexed with SPI master, I C-bus master and AUX pins (if available). Pins can be dynamically configured as inputs or outputs. GPIO read/write are made by the FW using dedicated registers that allow reading, setting, or clearing inputs. The value of the output register can be read back, as well as the current state of the input pins. 8.4.1 GPIO features • • • • • • • • • Dynamic configuration as input or output 3.3 V and 1.8 V signaling Programmable weak pull-up and weak pull-down Independent interrupts for GPIO1 to GPIO12 Interrupts: edge or level sensitive GPIO1 to GPIO12 can be programmed as wake-up sources Programmable spike filter (3 ns) Programmable slew rate (3 ns and 10 ns) Hysteresis receiver with disable option 8.4.2 GPIO configuration The GPIO configuration is done through the PCR module (power, clock, and reset). 8.4.3 GPIO interrupts GPIO1 to GPIO12 can be programmed to generate an interrupt on a level, a rising or falling edge or both. 8.5 CRC engine 16/32 bits The PN7462 family has a configurable 16/32-bit parallel CRC coprocessor. The 16-bit CRC is compliant to X.25 (CRC-CCITT, ISO/IEC 13239) standard with a generator polynomial of: The 32-bit CRC is compliant to the ethernet/AAL5 (IEEE 802.3) standard with a generator polynomial of: CRC calculation is performed in parallel, meaning that one CRC calculation is performed in one clock cycle. The standard CRC 32 polynomial is compliant with FIPS140-2. Note: No final XOR calculation is performed. PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 27 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller Following are the CRC engine features: • • • • • Configurable CRC preset value Selectable LSB or MSB first CRC 32 calculation based on 32-bit, 16-bit, and 8-bit words CRC16 calculation based on 32-bit, 16-bit, and 8-bit words Supports bit order reverse 8.6 Random Number Generator (RNG) The PN7462 family integrates a random number generator. It consists of an analog True Random Number Generator (TRNG), and a digital Pseudo Random Number Generator (PRNG). The TRNG is used for loading a new seed in the PRNG. The random number generator features: • 8-bit random number • Compliant with FIPS 140-2 • Compliant with BSI AIS20 and SP800-22 8.7 Master interfaces 2 8.7.1 I C master interface 2 8.7.1.1 I C features 2 The I C master interface supports the following features: • • • • • • • • 2 Standard I C-compliant bus interface with open-drain pins Standard-mode, fast mode, and fast mode plus (up to 1 Mbit/s). 2 Support I C master mode only. Programmable clocks allowing versatile rate control. Clock stretching 2 7-bit and 10-bit I C slave addressing LDM/STM instruction support Maximum data frame size up to 1024 bytes 8.7.2 SPI interface The PN7462 family contains one SPI master controller and one SPI slave controller. The SPI master controller transmits the data from the system RAM to the SPI external slaves. Similarly, it receives data from the SPI external slaves and stores them into the system RAM. It can compute a CRC for received frames and automatically compute and append CRC for outgoing frames (optional feature). 8.7.2.1 SPI features The SPI master interface provides the following features: • SPI master interface: synchronous, half-duplex • Supports Motorola SPI frame formats only (SPI block guide V04.0114 (Freescale) specification) • Maximum SPI data rate of 6.78 Mbit/s PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 28 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller • • • • • • • Multiple data rates such as 1, 1.51, 2.09, 2.47, 3.01, 4.52, 5.42 and 6.78 Mbit/s Up to two slaves select with selectable polarity Programmable clock polarity and phase Supports 8-bit transfers only Maximum frame size: 511 data bytes payload + 1 CRC byte Optional 1 byte CRC calculation on all data of TX and RX buffer AHB master interface for data transfer 8.8 Host interfaces The PN7462 family embeds four different interfaces for host connection: USB, HSUART, 2 I C, and SPI. The four interfaces share the buffer manager and the pins; see Table 7. Table 7. Pin description for host interface 2 Name SPI I C USB HSU ATX_A NSS_S SCL_S - HSU_RX ATX_B MOSI_S SDA_S ATX_C ATX_D MISO_S SCK_S - HSU_TX 2 DP HSU_RTS_N 2 DM HSU_CTS_N I C_ADR0 I C_ADR1 The interface selection is done by configuring the Power Clock Reset (PCR) registers. Note: The host interface pins should not be kept floating. 8.8.1 High-speed UART The PN7462 family has a high-speed UART which can operate in slave mode only. Following are the HSUART features: • • • • • Standard bit-rates are 9600, 19200, 38400, 57600, 115200, and up to 1.288 Mbit/s Supports full duplex communication Supports only one operational mode: start bit, 8 data bits (LSB), and stop bits The number of "stop bits" programmable for RX and TX is 1 stop bit or 2 stop bits Configurable length of EOF (1-bit to 122-bits) Table 8. HSUART baudrates Bit rate (kBd) 9.6 19.2 38.4 57.6 115.2 230.4 460.8 921.6 1288 K PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 29 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller 2 8.8.2 I C host interface controller 2 The I C-bus is bidirectional and uses only two wires: a Serial Clock Line (SCL) and a 2 Serial Data Line (SDA). I C standard mode (100 kbit/s), fast mode (400 kbit/s and up to 1 Mbit/s), and high-speed mode (3.4 Mbit/s) are supported. 2 8.8.2.1 I C host interface features 2 The PN7462 family I C slave interface supports the following features: 2 • • • • Support slave I C bus Standard mode, fast mode (extended to 1 Mbit/s support), and high-speed modes Supports 7-bit addressing mode only 2 Selection of the I C address done by two pins – It supports multiple addresses 2 – The upper bits of the I C slave address are hard-coded. The value corresponds to 2 the NXP identifier for I C blocks. The value is 0101 0XXb. • General call (software reset only) • Software reset (in standard mode and fast mode only) 2 Table 9. I C interface addressing I C_ADR1 I C_ADR0 I C address (R/W = 0, write) 2 2 2 I C address (R/W = 0, read) 2 0 0 0 × 28 0 × 28 0 1 0 × 29 0 × 29 1 0 0 × 2A 0 × 2A 1 1 0 × 2B 0 × 2B 8.8.3 SPI host/Slave interface The PN7462 family host interface can be used as SPI slave interface. The SPI slave controller operates on a four wire SSI: Master In Slave Out (MISO), Master Out Slave In (MOSI), Serial Clock (SCK), and Not Slave Select (NSS). The SPI slave select polarity is fixed to positive polarity. 8.8.3.1 SPI host interface features The SPI host/slave interface has the following features: • • • • • • • SPI speeds up to 7 Mbit/s Slave operation only 8-bit data format only Programmable clock polarity and phase SPI slave select polarity selection fixed to positive polarity Half-duplex in HDLL mode Full-duplex in native mode If no data is available, the MISO line is kept idle by making all the bits high (0xFF). Toggling the NSS line indicates a new frame. Note: Programmable echo-back operation is not supported. PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 30 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller Table 10. SPI configuration connection CPHA switch: Clock phase: Defines the sampling edge of MOSI data • CPHA = 1: Data are sampled on MOSI on the even clock edges of SCK, after NSS goes low • CPHA = 0: Data are sampled on MOSI on the odd clock edges of SCK, after NSS goes low CPOL switch: Clock polarity • IFSEL1 = 0: The clock is idle low, and the first valid edge of SCK is a rising one • IFSEL1 = 0: The clock is idle high, and the first valid edge of SCK is a falling one 8.8.4 USB interface The Universal Serial Bus (USB) is a 4-wire bus that supports communication between a host and up to 127 peripherals. The host controller allocates the USB bandwidth to attached devices through a token-based protocol. The bus supports hot-plugging and dynamic configuration of devices. The host controller initiates all transactions. The PN7462 family USB interface consists of a full-speed device controller with on-chip PHY (physical layer) for device functions. 8.8.4.1 Full speed USB device controller The PN7462 family embeds a USB device peripheral, compliant with USB 2.0 specification, full speed. It is interoperable with USB 3.0 host devices. The device controller enables 12 Mbit/s data exchange with a USB host controller. It consists of a register interface, serial interface engine, and endpoint buffer memory. The serial interface engine decodes the USB data stream and writes data to the appropriate endpoint buffer. The status of a completed USB transfer or error condition is indicated via status registers. If enabled, an interrupt is generated. Following are the USB interface features: • • • • • • • Fully compliant with USB 2.0 specification (full speed) Dedicated USB PLL available Supports 14 physical (7 logical) endpoints including one control endpoint Each non-control endpoint supports bulk, interrupt, or isochronous endpoint types Single or double buffering allowed Support wake-up from suspend mode on USB activity and remote wake-up Soft-connect supported 8.9 Contact interface Note: This following chapter applies to PN7462AUHN, PN7412AUHN and PN7462AUEV only. PN7462AUHN and PN7412AUHN embed a contact interface and I/O auxiliary interface. PN7462AUEV embeds the I/O auxiliary interface only. The PN7462 and PN7412 integrate an ISO/IEC 7816 interface to enable the communication with a contact smart card. It does not require addition of an external contact frontend for reading payment cards, SAM for secure applications, etc. It offers a high level of security for the card by performing current limitation, short-circuit detection, ESD protection as well as supply supervision. PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 31 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller PN7462 and PN7412 also offer the possibility to extend the number of contact interfaces available. They use an I/O auxiliary interface to connect a slot extension (TDA8035 - 1 slot, TDA8020 - 2 slots, and TDA8026 - 5 slots). • • • • Class A (5 V), class B (3 V), and class C (1.8 V) smart card supply Protection of smart card Three protected half-duplex bidirectional buffered I/O lines (C4, C7, and C8) Compliant with ISO/IEC 7816 and EMVCo 4.3 standards 8.9.1 Contact interface features and benefits • Protection of the smart card – Thermal and current limitation in the event of short-circuit (pins I/O, VCC) – VCC regulation: 5 V, 3 V, and 1.8 V – Automatic deactivation initiated by hardware in the event of a short-circuit, card takeoff, overheating, falling of PN7462 supply – Enhanced card-side ElectroStatic Discharge (ESD) protection of greater than 8 kV • Support of class A, class B, and class C contact smart cards • DC-to-DC converter for VCC generation to enable support of class A and class B cards with low input voltages • Built-in debouncing on card presence contact • Compliant with ISO/IEC 7816 and EMVCo 4.3 standards • Card clock generation up to 13.56 MHz using external crystal oscillator (27.12 MHz); provides synchronous frequency changes of fXTAL / 2, fXTAL / 3, fXTAL / 4, fXTAL / 5, fXTAL / 6, fXTAL / 8, and fXTAL / 16 • Specific ISO/IEC UART with APB access for automatic convention processing, variable baud rate through frequency or division ratio programming, error management at character level for T = 0 and extra guard time register – FIFO 1 character to 32 characters in both reception and transmission mode – Parity error counter in reception mode and transmission mode with automatic retransmission – Cards clock stop (at HIGH or LOW level) – Automatic activation and deactivation sequence through a sequencer – Supports the asynchronous protocols T = 0 and T = 1 in accordance with ISO/IEC 7816 and EMV – Versatile 24-bit timeout counter for Answer To Reset (ATR) and waiting times processing – Specific Elementary Time Unit (ETU) counter for Block Guard Time (BGT); 22 ETU in T = 1 and 16 ETU in T = 0 – Supports synchronous cards 8.9.2 Voltage supervisor The PN7462 integrates a voltage monitor to ensure that sufficient voltage is available for the contact interface; see Section 8.15.4 and Section 9.1.3. In order to provide the right voltage needed for the various ISO/IEC 7816 contact card classes (A, B, or C), the following voltages are needed: • VDDP(VBUSP) > 2.7 V for support of class B and class C contact cards • VDDP(VBUSP) > 3 V for support of class A contact cards PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 32 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller • Remark: To support class A cards, DC-to-DC converter is used in doubler mode. To support class B cards with VDDP(VBUSP) < 3.9 V, DC-to-DC converter is used in doubler mode. To support class B cards with VDDP(VBUSP) > 3.9 V, DC-to-DC converter is used in follower mode. Figure 16 shows the classes that are supported, depending on VDDP(VBUSP). VDDP(VBUSP) class A cards class B cards class C cards DC-to-DC converter needed in doubler mode 3.9 V DC-to-DC converter needed in follower mode VDDP(VBUSP) threshold value card deactivation to be performed when VDDP(VBUSP) is going below the threshold value 3.0 V 2.7 V aaa-021128 Figure 16. VDDP(VBUS), supported contact cards classes, and card deactivation When the VDDP(VBUSP) is going below the threshold value, in the one of the conditions indicated below, a card deactivation is performed: • Class A card activated, and VDDP(VBUSP) going below 3 V • Class B card activated, and VDDP(VBUSP) going below 3.9 V (DC-to-DC converter in follower mode) • Class B card activated, and VDDP(VBUSP) going below 2.7 V (DC-to-DC converter in doubler mode) • Class C card activated, and VDDP(VBUSP) going below 2.7 V The VBUSP voltage monitor can be configured so that an automatic "card deactivation" sequence is performed automatically when VDDP(VBUSP) is going below the threshold value. 8.9.3 Clock circuitry The card clock is generated from the crystal oscillator, connected on the pin XTAL1 and XTAL2. The card frequency is configured through the contact interface registers. The following value can be chosen: fXTAL / 2, fXTAL / 3, fXTAL / 4, fXTAL / 5, fXTAL / 6, fXTAL / 8, and fXTAL / 16. It is possible to put the card clock to a logical level 0 or 1 (clock stop feature). The duty cycle on the pin CLK is between 45 % and 55 %, for all the available clock dividers. 8.9.4 I/O circuitry The three data lines I/O, AUX1, and AUX2 are identical. I/O is referenced to VCC. To enter in the idle state, the I/O line is pulled HIGH via a 10 kΩ resistor (I/O to VCC). PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 33 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller The active pull-up feature ensures fast LOW to HIGH transitions. At the end of the active pull-up pulse, the output voltage depends on the internal pull-up resistor and the load current. The maximum frequency on these lines is 1.5 MHz. 8.9.5 VCC regulator VCC regulator delivers up to 60 mA for class A cards (0 V to 5 V). It also delivers up to 55 mA for class B cards (0 V to 3 V) and up to 35 mA for class C cards (from 0 V to 1.8 V). The VCC has an internal overload detection at approximately 110 mA for class A and B, and 90 mA for class C. This detection is internally filtered, allowing the card to draw spurious current pulses as defined in EMVCo specification, without causing a deactivation. The average current value must remain below the maximum. 8.9.6 Activation sequence The presence of a contact card is indicated to PN7462 through PRESN signal. If all supply conditions are met, the PN7462 may start an activation sequence. Figure 17 shows the activation sequence. The sequencer clock is based on the crystal oscillator: fseq = fXTAL /10. When the contact interface is active, the period for activation phases is: T = 64/fseq = 23.6 μs. T/2 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 Start VUP VCC IO CLK RST t0 t1 t2 t3 t4 t5 aaa-021129 Figure 17. Contact interface - activation sequence Once the activation sequence is triggered, the following sequence takes place: • Contact LDOs and DC-to-DC converter (when relevant) starts at t1 • VCC starts rising from 0 to the required voltage (5 V, 3 V, and 1.8 V) at t2 PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 34 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller • IO rises to VCC at t3 • CLK starts at t4 • RST pin is enabled at t5 8.9.7 Deactivation sequence When triggered by the PN7462, the deactivation following sequence takes place: • • • • Card reset (pin RST) status goes LOW Clock (CLK) stopped at LOW level Pin IO falls to 0 V VCC falls to 0 V T/2 0 1 2 3 t0 t1 t2 t3 4 5 6 7 8 9 10 11 12 13 14 Start RST CLK IO VCC DC-to-DC converter/ LDOs t4 aaa-021130 Figure 18. Deactivation sequence for contact interface The deactivation sequence is performed in the following cases: • • • • • Removal of card; generated automatically by the PN7462 Overcurrent detection on pin VCC; generated automatically by the PN7462 Overcurrent detection on pin IO; generated automatically by the PN7462 Detection for overheating; generated automatically by the PN7462 Pin VBUSP going below relevant voltage threshold (optional); part of the pin VBUSP monitor • Reset request through software 8.9.8 I/O auxiliary - connecting TDA slot extender To address applications where multiple ISO/IEC 7816 interfaces are needed, the PN7462 integrates the possibility to connect contact slot extenders like TDA8026, TDA8020, or TDA8035. The following pins are available: PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 35 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller • INT_AUX • CLK_AUX • IO_AUX For more details about the connection, refer to the slot extender documentation. 8.10 Contactless interface - 13.56 MHz This chapter applies to the products with contactless interface only. The PN7462 family embeds a high power 13.56 MHz RF frontend. The RF interface implements the RF functionality like antenna driving, the receiver circuitry, and all the low-level functionalities. It helps to realize an NFC forum or an EMVCo compliant reader. The PN7462 family allows different voltages for the RF drivers. For information related to the RF interface supply, refer Section 8.15. The PN7462 family uses an external oscillator, at 27.12 MHz. It is a clock source for generating RF field and its internal operation. Key features of the RF interface are: • • • • • • • • • • ISO/IEC 14443 type A & B compliant MIFARE functionality, including MIFARE Classic encryption in read/write mode ISO/IEC 15693 compliant NFC Forum - NFCIP-1 & NFCIP-2 compliant – P2P, active and passive mode – reading of NFC forum tag types 1, 2, 3, 4, and 5 FeliCa ISO/IEC 18000-3 mode 3 EMVCo contactless 2.6 – RF level can be achieved without the need of booster circuitry (for some antenna topologies the EMV RF-level compliance might physically not be achievable) Card mode - enabling the emulation of an ISO/IEC 14443 type A card – Supports Passive Load Modulation (PLM) and Active Load Modulation (ALM) Low Power Card Detection (LPCD) Adjustable RX-voltage level A minimum voltage of 2.3 V helps to use card emulation, and P2P passive target functionality in passive load modulation. A voltage above 2.7 V enables all contactless functionalities. 8.10.1 RF functionality 8.10.1.1 Communication mode for ISO/IEC 14443 type A and for MIFARE Classic The physical level of the communication is shown in Figure 19. PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 36 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller (1) ISO/IEC 14443 A READER (2) ISO/IEC 14443 A CARD 001aam268 1. Reader to Card: 100 % ASK; modified miller coded; transfer speed 106 kbit/s to 848 kbit/s 2. Card to Reader: Subcarrier load modulation Manchester coded or BPSK, transfer speed 106 kbit/s to 848 kbit/s Figure 19. Read/write mode for ISO/IEC 14443 type A and read/write mode for MIFARE Classic The physical parameters are described in Table 11 Table 11. Communication overview for ISO/IEC 14443 type A and read/write mode for MIFARE Classic Communication direction Signal type reader to card (send data from the PN7462 family to a card) fc = 13.56 MHz Transfer speed 106 kbit/s 212 kbit/s 424 kbit/s 848 kbit/s reader side modulation 100 % ASK 100 % ASK 100 % ASK 100 % ASK bit encoding modified miller encoding modified miller encoding modified miller encoding modified miller encoding bit rate (kbit/s) fc / 128 fc / 64 fc / 32 fc / 16 sub carrier load modulation sub carrier load modulation sub carrier load modulation sub carrier load modulation fc / 16 fc / 16 fc / 16 fc / 16 Manchester encoding BPSK BPSK BPSK card to reader (PN7462 card side family receives data modulation from a card) subcarrier frequency bit encoding Figure 20 shows the data coding and framing according to ISO/IEC 14443 A. ISO/IEC 14443 A framing at 106 kBd start 8-bit data 8-bit data odd parity start bit is 1 8-bit data odd parity odd parity ISO/IEC 14443 A framing at 212 kBd, 424 kBd and 848 kBd start 8-bit data start bit is 0 even parity 8-bit data odd parity 8-bit data odd parity burst of 32 subcarrier clocks even parity at the end of the frame 001aak585 Figure 20. Data coding and framing according to ISO/IEC 14443 A card response The internal CRC coprocessor calculates the CRC value based on the selected protocol. In card mode for higher baudrates, the parity is automatically inverted as end of communication indicator. PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 37 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller 8.10.1.2 ISO/IEC14443 B functionality The physical level of the communication is shown in Figure 21 (1) ISO/IEC 14443 B READER ISO/IEC 14443 B CARD (2) 001aal997 1. Reader to Card: NRZ; transfer speed 106 kbit/s to 848 kbit/s 2. Card to reader: Subcarrier load modulation Manchester coded or BPSK, transfer speed 106 kbit/s to 848 kbit/s Figure 21. ISO/IEC 14443 B read/write mode communication diagram The physical parameters are described in Table 12 Table 12. Communication overview for ISO/IEC 14443 B reader/writer Communication direction Signal type reader to card (send data from the PN7462 family to a card) fc = 13.56 MHz Transfer speed 106 kbit/s 212 kbit/s 424 kbit/s 848 kbit/s reader side modulation 10 % ASK 10 % ASK 10 % ASK 10 % ASK bit encoding NRZ NRZ NRZ NRZ bit rate [kbit/s] 128/fc 64/fc 32/fc 16/fc sub carrier load modulation sub carrier load modulation sub carrier load modulation sub carrier load modulation fc / 16 fc / 16 fc / 16 fc / 16 BPSK BPSK BPSK BPSK card to reader (PN7462 card side family receives data modulation from a card) sub carrier frequency bit encoding 8.10.1.3 FeliCa functionality The FeliCa mode is a general reader/writer to card communication scheme, according to the FeliCa specification. The communication on a physical level is shown in Figure 22. FeliCa READER (PCD) 1. PCD to PICC 8-30 % ASK Manchester Coded, baudrate 212 to 424 kbaud 2. PICC to PCD, > Load modulation Manchester Coded, baudrate 212 to 424 kbaud FeliCa CARD (PICC) 001aam271 Figure 22. FeliCa read/write communication diagram The physical parameters are described in Table 13. PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 38 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller Table 13. Communication overview for FeliCa reader/writer Communication direction Signal type Transfer speed FeliCa FeliCa higher transfer speeds 212 kbit/s 424 kbit/s reader to card (send data from the PN7462 family to a card) fc = 13.56 MHz reader side modulation 8 % to 30 % ASK 8 % to 30 % ASK bit encoding Manchester encoding Manchester encoding bit rate fc / 64 fc / 32 card to reader (PN7462 family receives data from a card) card side modulation load modulation load modulation bit encoding Manchester encoding Manchester encoding Note: The PN7462 family does not manage FeliCa security aspects. PayLoad XXX Status Len PN7462 family supports FeliCa multiple reception cycles. Status ClError DataError RFU [15:13] ProtError RFU [23:16] LenError RFU [31:24] CollError 32 byte RFU [7:5] Len [4:0] 4 byte aaa-021253 Figure 23. Multiple reception cycles - data format 8.10.1.4 ISO/IEC 15693 functionality The physical level of the communication is shown in Figure 24. (1) ISO / IEC 15693 READER (2) ISO / IEC 15693 CARD aaa-021138 1. Reader to Card: 1/256 and 1/4 encoding 2. Card to Reader: Manchester coding Figure 24. ISO/IEC 15693 read/write mode communication diagram The physical parameters are described in Table 14. Table 14. Communication overview for ISO/IEC 15693 reader to label Communication direction reader to label (send data from the PN7462 family to a card) PN7462_FAM Product data sheet COMPANY PUBLIC Signal type Transfer speed fc / 8192 kbit/s fc / 512 kbit/s reader side modulation 10 % to 30 % ASK or 100 % ASK 10 % to 30 % ASK or 90 % to 100 % ASK bit encoding 1/256 1/4 bit length 4.833 μs 302.08 μs All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 39 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller Table 15. Communication overview for ISO/IEC 15693 label to reader Communication direction Signal type 6.62 kbit/s 13.24 kbit/s not supported [1] 26.48 kbit/s 52.96 kbit/s not supported single (dual) sub carrier load modulation ASK single sub carrier load modulation ASK - - 37.76 18.88 bit encoding - - Manchester coding Manchester coding subcarrier frequency (MHz) - - fc / 32 fc / 32 card side label to reader (PN7462 family modulation receives data from a card) fc = 13.56 MHz bit length (μs) [1] Transfer speed Fast inventory (page) read command only (ICODE proprietary command). pulse modulated carrier ~9.44 µs ~18.88 µs 0 1 2 3 4 . . . 2 . . . . . . . . . . 2 5 ~4,833 ms . . . . . . . . . . 2 2 2 2 5 5 5 5 2 3 4 5 001aam272 Figure 25. Data coding according to ISO/IEC 15693 standard mode reader to label 8.10.1.5 ISO/IEC18000-3 mode 3 functionality The ISO/IEC 18000-3 mode 3 is not described in this document. For a detailed explanation of the protocol, refer to the ISO/IEC 18000-3 standard. PN7462 family supports the following features: • TARI = 9.44 μs or 18.88 μs • Downlink: Four subcarrier pulse Manchester and two subcarrier pulse Manchester • Subcarrier: 423 kHz (fc / 32) with DR = 0 kHz and 847 kHz (fc / 16) with DR = 1 8.10.1.6 NFCIP-1 modes The NFCIP-1 communication differentiates between an active and a passive communication mode. • In active communication mode, both initiator and target use their own RF field to transmit data • In passive communication mode, the target answers to an initiator command in a load modulation scheme. The initiator is active in terms of generating the RF field • The initiator generates RF field at 13.56 MHz and starts the NFCIP-1 communication • In passive communication mode, the target responds to initiator command in load modulation scheme. In active communication mode, it uses a self-generated and selfmodulated RF field. PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 40 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller PN7462 family supports NFCIP-1 standard. It supports active and passive communication mode at transfer speeds of 106 kbit/s, 212 kbit/s, and 424 kbit/s, as defined in the NFCIP-1 standard. Initial command host NFC INITIATOR powered to generate RF field NFC TARGET 1. initiator starts communication at selected transfer speed host powered for digital processing response host NFC INITIATOR powered for digital processing NFC TARGET 2. target answers at the same transfer speed host powered to generate RF field 001aan216 Figure 26. Active communication mode Table 16. Communication overview for active communication mode Communication direction Transfer speed 106 kbit/s 212 kbit/s 424 kbit/s initiator to target according to ISO/IEC 14443 A 100 % ASK, modified miller coded according to FeliCa, 8-30 % ASK Manchester coded according to FeliCa, 8-30 % ASK Manchester coded target to initiator Note: Transfer speeds above 424 kbit/s are not defined in the NFCIP-1 standard. 1. initiator starts communication at selected transfer speed host NFC INITIATOR NFC TARGET 2. targets answers using load modulated data at the same transfer speed powered to generate RF field host powered for digital processing 001aan217 Figure 27. Passive communication mode PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 41 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller Table 17. Communication overview for passive communication mode Communication direction Transfer speed 106 kbit/s 212 kbit/s 424 kbit/s initiator to target according to ISO/IEC 14443 A 100 % ASK, modified miller coded according to FeliCa, 8-30 % ASK Manchester coded according to FeliCa, 8-30 % ASK Manchester coded target to initiator according to ISO/IEC 14443 A @106 kB modified miller coded according to FeliCa, > according to FeliCa, > 12 % ASK Manchester 12 % ASK Manchester coded coded The NFCIP-1 protocol is managed in the PN7462 family customer application firmware. Note: Transfer speeds above 424 kbit/s are not defined in the NFCIP-1 standard. ISO/IEC14443 A card operation mode PN7462 family can be addressed as a ISO/IEC 14443 A card. It means that it can generate an answer in a load modulation scheme according to the ISO/IEC 14443 A interface description. Note: PN7462 family components do not support a complete card protocol. The NFC controller customer application firmware handles it. The following table describes the physical layer of a ISO/IEC14443 A card mode: Table 18. ISO/IEC14443 A card operation mode Communication direction ISO/IEC 14443 A (transfer speed: 106 kbit per second) reader/writer to PN7462 family modulation on reader side 100 % ASK bit coding modified miller bit length 128/fc modulation on PN7462 family side sub carrier load modulation subcarrier frequency fc / 16 bit coding Manchester coding PN7462 family to reader/writer NFCIP-1 framing and coding The NFCIP-1 framing and coding in active and passive communication mode is defined in the NFCIP-1 standard. PN7462 family supports the following data rates: Table 19. Framing and coding overview PN7462_FAM Product data sheet COMPANY PUBLIC Transfer speed Framing and coding 106 kbit/s according to the ISO/IEC 14443 A/MIFARE scheme 212 kbit/s according to the FeliCa scheme 424 kbit/s according to the FeliCa scheme All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 42 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller NFCIP-1 protocol support The NFCIP-1 protocol is not elaborated in this document. The PN7462 family component does not implement any of the high-level protocol functions. These high-level protocol functions are implemented in the microcontroller. For detailed explanation of the protocol, refer to the NFCIP-1 standard. However, the datalink layer is according to the following policy: • Speed shall not be changed while there is continuous data exchange in a transaction. • Transaction includes initialization, anticollision methods, and data exchange (in a continuous way means no interruption by another transaction). In order not to disturb current infrastructure based on 13.56 MHz, the following general rules to start NFCIP-1 communication are defined: 1. 2. 3. 4. By default, NFCIP-1 device is in target mode. It means that its RF field is switched off. The RF level detector is active. Only if the application requires, the NFCIP-1 device switches to initiator mode. An initiator shall only switch on its RF field if the RF level detector does not detect external RF field during a time of TIDT. 5. The initiator performs initialization according to the selected mode. 8.10.2 NFC interface 8.10.2.1 Transmitter (TX) The transmitter is able to drive an antenna circuit connected to outputs TX1 and TX2 with a 13.56 MHz carrier signal. The signal delivered on pins TX1 and pin TX2 is a 13.56 MHz carrier, modulated by an envelope signal for energy and data transmission. It can be used to drive an antenna directly, using a few passive components for matching and filtering. For a differential antenna configuration, either TX1 or TX2 can be configured to put out an inverted clock. 100 % modulation and several levels of amplitude modulation on the carrier can be performed to support 13.56 MHz carrier-based RF-reader/writer protocols. The standards ISO/IEC14443 A and B, FeliCa, and ISO/IEC18092 define the protocols. The PN7462 family embeds an overshoot and undershoot protection. It is used to configure additional signals on the transmitter output, for controlling the signal shape at the antenna output. TVDD envelope hs_gate clk_highside M2 TX1 TVDD ls_gate clk_lowside M1< PRE-DRIVERS aaa-021254 Figure 28. PN7462 family output driver PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 43 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller 8.10.2.2 Receiver (RX) In reader mode, the response of the PICC device is coupled from the PCB antenna to the differential input RXP/RXN. The reader mode receiver extracts this signal by first removing the carrier in passive mixers (direct conversion for I and Q). It then filters and amplifies the baseband signal before converting to digital values. The conversion to digital values is done with two separate ADCs, for I and Q channels. Both I and Q channels have a differential structure, which improves the signal quality. The I/Q mixer mixes the differential input RF-signal down to the baseband. The mixer has a bandwidth of 2 MHz. The down-mixed differential RX input signals are passed to the BBA and a band-pass filter. For considering all the protocols (type A/B, FeliCa), the high-pass cut-off frequency of BBA is configured between 45 kHz and 250 kHz. The configuration is done in four different steps. The low-pass cut-off frequency is greater than 2 MHz. The output of band-pass filter is further amplified with a gain factor which is configurable between 30 dB and 60 dB. The baseband amplifier (BBA)/ADC I-channel and Q-channel can be enabled separately. It is required for ADC-based card mode functionality as only the I-channel is used in this case. BBA RXP DATA AGC I-CLK MIX CLK VMID Q-CLK BBA DATA RXN aaa-021388 Figure 29. Receiver block diagram VMID A resistive divider between AVDD and GND generates VMID. The resistive divider is connected to the VMID pin. An external blocking capacitor of typical value 100 nF is connected. Automatic Gain Control (AGC) The NFC interface AGC is used to control the amplitude of 13.56 MHz sine-wave input signal received. The signal is received at the antenna connected between the pins RXP and RXN. A comparator is used to compare the peak value of the input signal with a reference voltage. A voltage divider circuit is used to generate the reference voltage. An external resistor (typically 3.3 kΩ) is connected to the RX input, which forms a voltage divider with an onchip variable resistor. The voltage divider circuit so formed has a 10-bit resolution. Note: The comparator monitors the RXP signal only. By varying the on-chip resistor, the amplitude of the input signal can be modified. The value of on-chip resistor is increased or decreased, depending on the output of the sampled comparator. The on-chip resistor value is adjusted until the peak of the input PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 44 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller signal matches the reference voltage. Thus, the AGC circuit automatically controls the amplitude of the RX input. The internal amplitude controlling resistor in the AGC has a default value of 10 KΩ. It means that, when the resistor control bits in AGC_VALUE_REG are all 0, the resistance is 10 KΩ. As the control bits are increased, resistors are switched in parallel to the 10 KΩ resistor. It lowers the resultant resistance value to 5 kΩ (AGC_VALUE_REG , all bits set to 1). Mode detector The mode detector is a functional block of the PN7462 family which senses for an RF field generated by another device. The mode detector facilitates to distinguish between type A and FeliCa target mode. The host responds depending on the recognized protocol generated by an initiator peer device. Note: The PN7462 family emulates type A cards and peer-to-peer active target modes according to ISO / IEC18092. 8.10.3 Low-Power Card Detection (LPCD) The low-power card detection is an energy saving feature of the PN7462 family. It detects the presence of a card without starting a communication. Communication requires more energy to power the card and takes time, increasing the energy consumption. It is based on antenna detuning detection. When a card comes close to the reader, it affects the antenna tuning, which is detected by PN7462 family. The sensitivity can be varied for adjusting to various environment and applications constraints. Remark: Reader antenna detuning may have multiple sources such as cards and metal near the antenna. Hence it is important to adjust the sensitivity with care to optimize the detection and power consumption. As the generated field is limited, distance for card detection might be reduced compared to normal reader operation. Performances depend on the antenna and the sensitivity used. 8.10.4 Active Load Modulation (ALM) When PN7462 family is used in card emulation mode or P2P passive target mode, it modulates the field emitted by the external reader or NFC passive initiator. PN7462 family CARD TYPE A EMULATION OR P2P PASSIVE TARGET (1) (2) aaa-021139 1. Type A reader or NFC passive initiator generate the RF and sends commands 2. PN7462 family modulates the field of reader for sending its answer Figure 30. Communication in card emulation of NFC passive target To modulate the field, PN7462 family offers two possibilities: • Passive Load Modulation (PLM): The PN7462 family modifies the antenna characteristics, which are detected by the reader through antenna coupling. PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 45 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller • Active Load Modulation (ALM): The PN7462 family generates a small field, in phase opposition with the field emitted by the reader. This modulation is detected by the reader reception stage. The modulation type to use depends on the external reader and the antenna of PN7462 family and the application. 8.10.5 Dynamic Power Control (DPC) The PN7462 family supports the Dynamic Power Control (DPC) feature. A lookup table is used to configure the output voltage and to control the transmitter current. In addition to the control of the transmitter current, wave shaping settings can be controlled as well, depending on the selected protocol and the measured antenna load. 8.10.5.1 RF output control The DPC controls the RF output current and output voltage depending on the loading condition of the antenna. 8.10.5.2 Adaptive Waveform Control (AWC) The DPC includes the Adaptive Waveform Control (AWC) feature. Depending on the level of detected detuning on the antenna, RF wave shaping related register settings can be automatically updated, according to the selected protocol. A lookup table is used to configure the modulation index, the rise time and the fall time. 8.11 Timers The PN7462 family includes two 12-bit general-purpose timers (on LFO clock domain) with match capabilities. It also includes two 32-bit general-purpose timers (on HFO clock domain) and a Watchdog Timer (WDT). The timers and WDT can be configured through software via a 32-bit APB slave interface. Table 20. Timer characteristics Name Clock source Frequency Counter length Resolution Maximum delay Chaining Timer 0 LFO/2 182.5 kHz 12 bit 300 μs 1.2 s No Timer 1 LFO/2 182.5 kHz 12 bit 300 μs 1.2 s Yes Timer 2 HFO 20 MHz 32 bit 50 ns 214 s No Timer 3 HFO 20 MHz 32 bit 50 ns 214 s No Watchdog LFO/128 2.85 kHz 10 bit 21.5 ms 22 s No 8.11.1 Features of timer 0 and timer 1 • 12-bit counters • One match register per timer, no capture registers and capture trigger pins are needed • One common output line gathering the four timers (Timer 0, Timer 1, Timer 2, and Timer 3) • Interrupts PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 46 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller • • • • Timer 0 and timer 1 can be concatenated (multiplied) Timer 0 and timer 1 have two count modes: single-shot or free-running Timer 0 and timer 1 timeout interrupts can be individually masked Timer 0 and timer 1 clock source is LFO clock (LFO/2 = 182.5 kHz) Remark: The timers 0 and 1 are dedicated for NFC communication. 8.11.2 Features of timer 2 and timer 3 • • • • • • • 32-bit counters 1 match register per timer, no capture registers and capture trigger pins are needed 1 common output line gathering four timers (Timer 0, Timer 1, Timer 2, and Timer 3) Interrupts Timer 2 and timer 3 have two count modes: single-shot and free-running Timer 2 and timer 3 timeout interrupts can be individually masked Timer 2 and timer 3 clock source is the system clock 8.12 System tick timer The PN7462 family microcontroller includes a standard Arm system tick timer (SYSTICK) that generates a dedicated SYSTICK exception. 8.13 Watchdog timer If the microcontroller enters an erroneous state, the watchdog timer resets the microcontroller. When the watchdog timer is enabled, if the user program fails to "feed" (reload) the watchdog timer within a predetermined time, it generates a system reset. The watchdog timer can be enabled through software. If there is a watchdog timeout leading to a system reset, the timer is disabled automatically. • • • • • 10-bit counter Based on a 2.85 kHz clock Triggers an interrupt when a predefined counter value is reached Connected to the Arm subsystem NMI (non-maskable interrupt) If the watchdog timer is not periodically loaded, it resets PN7462 family 8.14 Clocks The PN7462 family clocks are based on the following clock sources: • • • • • 27.12 MHz external quartz 27.12 MHz crystal oscillator Internal oscillator: 20 MHz High Frequency Oscillator (HFO) Internal oscillator: 365 kHz Low Frequency Oscillator (LFO) Internal PLL at 48 MHz for the USB interface Figure 31 indicates the clocks used by each IP. PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 47 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller PLL I/P BUFFER XTAL1 clif_pll_in_sel dk_input_buffer clk_xtal tie `'0'' tie `'0'' 00 01 10 11 pll_bypass pll_clkin pll_clkout CLIF PLL 10 pll_clkout2 CLIF_DIG pll_clkout2 00 PLL_INPUT_BUFFER_BYPASS pll_clkin XTAL_SEL_EXTERNAL_CLOCK 11 CLIF_PLL_REF_CLK_SELECT[1:0] clk_pll_27m12 XTAL2 clk_xtal CLIF_ANA PCR 01 XTAL clk_pll_27m12 1 CLIF_PLL_CLOCK_SELECT[1:0] usb_pll_clkin clk_ip_27m12 0 usb_pll_in_sel tie `'0'' tie `'0'' clk_xtal clk_input_buffer PCR_CLK_CFG2.EXT_CLK_SEL 11 10 usb_pll_clkin USB PLL 01 clk_usb_48 MHz tie `'0'' 00 00 10 /2 01 tie `'0'' USB_PLL_REF_CLK_SELECT[1:0] usb_pll_clkout_div2 11 USB_PLL_CLKOUT_SELECT[1:0] usb_pll_clkout aaa-021248 Figure 31. Clocks and IP overview 8.14.1 Crystal oscillator (27.12 MHz) The 27.12 MHz quartz oscillator is used as a reference for all operations where the stability of the clock frequency is important for reliability. It includes contactless interface, 2 SPI and I C master interfaces, USB PLL for the USB interface, and HSUART. Regular and low-power crystals can be used. Figure 32 shows the circuit for generating stable clock frequency. The quartz and trimming capacitors are off-chip. PN7462 family XTAL1 XTAL2 crystal 27.12 MHz C C aaa-021140 Figure 32. Crystal oscillator connection Table 21 describes the levels of accuracy and stability required on the crystal. Table 21. Crystal requirements PN7462_FAM Product data sheet COMPANY PUBLIC Symbol Parameter Conditions Min Typ Max Unit fxtal crystal frequency ISO/IEC and FCC compliancy - 27.12 - MHz Δfxtal crystal frequency accuracy -50 - +50 ppm ESR equivalent series resistance - 50 100 Ω All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 [1] © NXP B.V. 2020. All rights reserved. 48 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller Symbol Parameter CL Pdrive [1] Conditions Min Typ Max Unit load capacitance - 10 - pF drive power - - 100 μW This requirement is according to FCC regulations requirements. The frequency should be +/- 7 kHz. 8.14.2 USB PLL The PN7462 family integrates a dedicated PLL to generate a low-noise 48 MHz clock, by using the 27.12 MHz from the external crystal. The 48 MHz clock generated is used as the USB main clock. Following are the USB PLL features: • Low-skew, peak-to-peak cycle-to-cycle jitter, 48 MHz output clock • Low power in active mode, low power-down current • On-chip loop filter, external RC components not needed 8.14.3 High Frequency Oscillator (HFO) The PN7462 family has an internal low-power High Frequency Oscillator (HFO) that generates a 20 MHz clock. The HFO is used to generate the system clock. The system clock default value is 20 MHz, and it can be configured to 10 MHz and 5 MHz for reducing power consumption. 8.14.4 Low Frequency Oscillator (LFO) The PN7462 family has an internal low-power Low Frequency Oscillator (LFO) that generates a 365 kHz clock. The LFO is used by EEPROM, POR sequencer, NFC interface, timers, and watchdog. 8.14.5 Clock configuration and clock gating In order to reduce the overall power consumption, the PN7462 family facilitates adjustment of system clock. It integrates clock gating mechanisms. The system clock can be configured to the following values: 20 MHz, 10 MHz, and 5 MHz. The clock of the following blocks can be activated or deactivated, depending on the peripherals used: • • • • • • • • • • • PN7462_FAM Product data sheet COMPANY PUBLIC NFC interface Contact interface Host interfaces 2 I C master interface SPI master interface CRC engine Timers Random generator System clock EEPROM Flash memory All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 49 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller 8.15 Power management 8.15.1 Power supply sources The PN7462 family is powered using the following supply inputs: • • • • VBUS: main supply voltage for internal analog modules, digital logic, and memories VBUSP: supply voltage for the contact interface TVDD_IN: supply for the NFC interface 2 PVDD_IN: pad voltage reference and supply of the host interface (HSU, USB, I C, and SPI) and the GPIOs PVDD_IN supply voltage is independent from VBUS supply level. Note: Any digital IO pad (host interface, GPIO) must not be externally driven, when PVDD_IN supply voltage is absent. 2 • PVDD_M_IN: pad voltage reference and supply for the master interface (SPI and I C) Note: Any digital IO pad (master interface, IO_AUX) must not be externally driven, when PVDD_M_IN supply voltage is absent. • DVDD: supply for the internal digital blocks 8.15.2 PN7462 Power Management Unit (PMU) The integrated Power Management Unit (PMU) provides supply for internal analog modules, internal digital logic and memories, pads. It also provides supply voltages for the contactless and contact interface. It automatically adjusts internal regulators to minimize power consumption during all possible power states. The power management unit embeds a mechanism to prevent the IC from overheat, overconsumption, or overloading the DC-to-DC converter: • • • • • PN7462_FAM Product data sheet COMPANY PUBLIC TXLDO 5 V monitoring VCC current limiter DC-to-DC converter current overload SCVDD current overload Temperature sensor All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 50 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller VUP VBUSP SC_LDO VCC_LDO DC-to-DC converter Digital logic and memories VCC DVDD internal analog blocks VBUS MILDO VDD PVDD_LDO PVDD_OUT pad supply master interface pads VUP_TX mandatory TX_LDO PVDD_IN optional PVDD_M_IN TVDD_OUT RF transmitter TVDD_IN aaa-021141 Figure 33. PN7462 LDOs and power pins overview PN7462 embeds five Low Drop-Out regulators (LDO) for ensuring the stability of power supply, while the application is running. • MLDO (main LDO): It provides 1.8 V supply for internal analog, digital and memory modules • TXLDO: This LDO can be used to supply the RF transmitter • PVDD_LDO: PVDD_LDO provides 3.3 V that can be used for all pads supply • SCLDO: This LDO provides a 2.4 V output to be used for contact card supply. The main aim is to be able to address class B operation when the voltage available is below 3.9 V. It is achieved by providing a stable input voltage to the internal DC-to-DC converter. • VCC_LDO: the VCC_LDO provides the supply for the contact smart card Some are used while some are optional, like the TX_LDO which is proposed for the RF interface. It is up to the application designer to decide whether LDOs should be used. 8.15.2.1 Main LDO The Main LDO (MLDO) provides a 1.8 V supply for all internal, digital and memory modules. It takes input from VBUS. MLDO includes a current limiter that avoids damage to the output transistors. Output supply is available on VDD pin which must be connected externally to the DVDD pin. Following are the main LDO features: • Main Low-Drop-Out (MLDO) voltage regulator powered by VBUS (external supply) • Current limiter to avoid damaging the output transistors PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 51 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller 8.15.2.2 PVDD_LDO The PVDD_LDO provides 3.3 V supply, that can be used for all digital pads. It may also be used to provide 3.3 V power to external components, avoiding an external LDO. It is supplied by VBUS, and requires a minimum voltage of 4 V to be functional. It delivers a maximum of 30 mA. The output pin for PVDD_LDO is PVDD_OUT. PVDD_LDO is used to provide the necessary supply to PVDD_IN and PVDD_M_IN (pad supply for master interfaces). When an external supply is used, PVDD_OUT must be connected to the ground. When the LDO output is connected to the ground, the chip switches off the PVDD_LDO. The PVDD_LDO has a low-power mode, which is used automatically when the chip is in standby mode or suspend mode. It facilitates supply to HOST pads and GPIOS, and to detect wake-up signals coming from these interfaces. Following are the PVDD_LDO features: • Low-Drop-Out voltage regulator powered by VDDP(VBUS) (external supply) • Supports soft-start mode to limit inrush current during the initial charge of the external capacitance when the LDO is powered up • Current limiter to avoid damaging the output transistors Note: When PVDD_LDO is used, there must not be any load current drawn from PVDD_LDO during the soft start of the PVDD_LDO. 8.15.2.3 Contact interface - SCLDO LDO The SCLDO provides a regulated voltage to the DC-to-DC converter, to enable class B operation when VDDP(VBUS) is in between 2.7 V to 3.9 V. Following are the contact interface features: • Current limiter for short circuit protection • Supports soft-start mode to limit the inrush current during the initial charge of the external capacitance when the LDO is powered up 8.15.2.4 Contact interface DC-to-DC converter The PN7462 includes a DC-to-DC converter that supports class A and class B cards, when the input voltage VDDP(VBUSP) is not sufficient. The DC-to-DC converter is a capacitance voltage doubler. It takes power from the SCLDO. The DC-to-DC converter can be bypassed. Its output (VUP) is regulated between 3.3 V to 5.5 V. The DC-to-DC converter can work in the following modes: • Follower mode: This mode is used when VDDP(VBUSP) is high enough to provide the desired power to the VCC LDO • Doubler mode: This mode is used when VDDP(VBUSP) is not high enough to supply the requested VCC output The doubler mode is used in the following conditions: • Class A cards support • Class B cards support, when VDDP(VBUSP) is less than 3.9 V PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 52 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller For class C cards, the DC-to-DC converter is always in a follower mode. An external capacitor (470 nF) should be connected between SAM and SAP pins, to ensure the functioning of the DC-to-DC converter. Table 22. SCLDO and DC-to-DC converter modes Supported card VDDP(VBUSP) SCLCO mode DC-to-DC converter mode Class A >3V follower mode doubler mode Class B 2.7 V < VDDP(VBUSP) < 3.9 V LDO mode doubler mode Class B > 3.9 V follower mode follower mode Class C > 2.7 V follower mode follower mode 8.15.2.5 VCC LDO The VCC LDO supplies contact interface supply VCC. Following are the VCC LDO features: • Low drop-out voltage regulator • Current limiter for chip and card protection • Automatic deactivation in case of overload 8.15.2.6 TXLDO The PN7462 family consists of an internal transmitter supply LDO. The TXLDO can be used to maintain a constant output voltage for the NFC interface. The TXLDO is designed to protect the chip from voltage ripple introduced by the power supply on the pin VUP_TX. It is powered through the pin VUP_TX. The programmable output voltages are: 3.0 V, 3.3 V, 3.6 V, 4.5 V, and 4.75 V. For a given output voltage, VUP_TX shall always be higher than 0.3 V. In other words, to supply a 3 V output, the minimum voltage to be applied on VUP_TX is 3.3 V. If the voltage is not sufficient, then the voltage at the pin TVDD_OUT follows the voltage at the pin VUP_TX, lowered of 0.3 V. When it is not used, TVDD_OUT shall be connected to TVDD_IN and VUP_TX, and TX_LDO shall be turned off. It must be ensured, that TVDD_IN and TVDD_OUT are never higher than VUP_TX. Following are the TXLDO features: • Low-Drop-Out (TXLDO) voltage regulator • Supports soft-start mode to limit inrush current during the initial charge of the external capacitance • Current limiter to avoid damaging the output transistors 8.15.3 PN736X Power Management Unit (PMU) The integrated Power Management Unit (PMU) provides supply for internal analog modules, internal digital logic and memories, pads. It also provides supply voltages for the contactless interface. It automatically adjusts internal regulators to minimize power consumption during all possible power states. PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 53 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller The power management unit embeds a mechanism to prevent the IC from overheat, overconsumption, or overloading the DC-to-DC converter: • TXLDO 5 V monitoring • Temperature sensor Digital logic and memories DVDD internal analog blocks VBUS MLDO mandatory VDD mandatory VBUSP PVDD_LDO PVDD_OUT pad supply master interface pads VUP_TX TX_LDO PVDD_IN optional PVDD_M_IN TVDD_OUT optional RF transmitter TVDD_IN aaa-025627 Figure 34. PN736X LDOs and power pins overview PN736X embeds three Low Drop-Out regulators (LDO) for ensuring the stability of power supply, while the application is running. • MLDO (main LDO): It provides 1.8 V supply for internal analog, digital and memory modules • TXLDO: This LDO can be used to supply the RF transmitter • PVDD_LDO: PVDD_LDO provides 3.3 V that can be used for all pads supply Some are used while some are optional, like the TX_LDO which is proposed for the RF interface. It is up to the application designer to decide whether LDOs should be used. 8.15.3.1 Main LDO The Main LDO (MLDO) provides a 1.8 V supply for all internal, digital and memory modules. It takes input from VBUS. MLDO includes a current limiter that avoids damage to the output transistors. Output supply is available on VDD pin which must be connected externally to the DVDD pin. Following are the main LDO features: • Main Low-Drop-Out (MLDO) voltage regulator powered by VBUS (external supply) • Current limiter to avoid damaging the output transistors 8.15.3.2 PVDD_LDO The PVDD_LDO provides 3.3 V supply, that can be used for all digital pads. It may also be used to provide 3.3 V power to external components, avoiding an external LDO. It is supplied by VBUS, and requires a minimum voltage of 4 V to be functional. It delivers a maximum of 30 mA. PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 54 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller The output pin for PVDD_LDO is PVDD_OUT. PVDD_LDO is used to provide the necessary supply to PVDD_IN and PVDD_M_IN (pad supply for master interfaces). When an external supply is used, PVDD_OUT must be connected to the ground. When the LDO output is connected to the ground, the chip switches off the PVDD_LDO. The PVDD_LDO has a low-power mode, which is used automatically when the chip is in standby mode or suspend mode. It facilitates supply to HOST pads and GPIOS, and to detect wake-up signals coming from these interfaces. Following are the PVDD_LDO features: • Low-Drop-Out voltage regulator powered by VDDP(VBUS) (external supply) • Supports soft-start mode to limit inrush current during the initial charge of the external capacitance when the LDO is powered up • Current limiter to avoid damaging the output transistors Note: When PVDD_LDO is used, there must not be any load current drawn from PVDD_LDO during the soft start of the PVDD_LDO. 8.15.3.3 TXLDO The PN7462 family consists of an internal transmitter supply LDO. The TXLDO can be used to maintain a constant output voltage for the NFC interface. The TXLDO is designed to protect the chip from voltage ripple introduced by the power supply on the pin VUP_TX. It is powered through the pin VUP_TX. The programmable output voltages are: 3.0 V, 3.3 V, 3.6 V, 4.5 V, and 4.75 V. For a given output voltage, VUP_TX shall always be higher than 0.3 V. In other words, to supply a 3 V output, the minimum voltage to be applied on VUP_TX is 3.3 V. If the voltage is not sufficient, then the voltage at the pin TVDD_OUT follows the voltage at the pin VUP_TX, lowered of 0.3 V. When it is not used, TVDD_OUT shall be connected to TVDD_IN and VUP_TX, and TX_LDO shall be turned off. It must be ensured, that TVDD_IN and TVDD_OUT are never higher than VUP_TX. Following are the TXLDO features: • Low-Drop-Out (TXLDO) voltage regulator • Supports soft-start mode to limit inrush current during the initial charge of the external capacitance • Current limiter to avoid damaging the output transistors PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 55 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller 8.15.4 Power-up sequence U VBUS VUP_TX tVBUS;VUP_TX T aaa-032963 Figure 35. TX_LDO used U VBUS TVDD_IN/TVDD_OUT/VUP_TX tVBUS;TVDD_IN T aaa-032967 Figure 36. TX_LDO not used Table 23. Power-up sequence Symbol Min Max Description tVBUS;VUP_TX 0 μs - VUP_TX must not be supplied before VBUS tVBUS;TVDD_IN 0 μs - TVDD_IN must not be supplied before VBUS VUP_TX, TVDD_IN must never rise before VBUS at any time. TVDD_IN shall be lower or equal to VUP_TX. 8.15.5 Power modes The PN7462 family offers four different power modes, that enable the user to optimize its energy consumption. They are: PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 56 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller • • • • Hard power-down mode Standby mode USB suspend mode Active mode 8.15.5.1 Active mode In active mode, all functionalities are available and all IPs can be accessed. It is possible to configure the various clocks (IP clock, system clock) using register settings so that chip consumption is reduced. If IPs are not used, they can be disabled. 8.15.5.2 Standby mode In standby mode, only a reduced part of the digital and the analog is active. It reduces the chip power consumption. The possible wake-up sources are still powered. The LFO clock is used to lower the energy needs. Active part in standby mode: Main LDO is active, in a low-power mode, plus all configured wake-up sources. Depending on the application requirements, it is possible to configure PVDD_LDO in active mode, low-power mode or shut down mode when PN7462 family is going to standby mode. PVDD_LDO is active in a low-power mode by default. Entering in standby mode: The application code triggers standby mode. Before entering in standby mode, the PN7462 manages the deactivation of the contact card. The PN7462 family has two internal temperature sensors. If these sensors detect an overheat, the chip is put into standby mode by the application firmware. It leaves the standby mode when both temperature sensors indicate that the temperature has come below the configured limit. Limitations: Standby mode is not possible in the following cases: • A host communication is in progress. • A wake-up condition is fulfilled. For example, external NFC field presence is a wake-up source, and a field is detected. • The NFC field detector is a possible wake-up source, and the NFC field detector is disabled. • PVDD is not present. 8.15.5.3 Suspend mode In suspend mode, clock sources are stopped except LFO. It reduces the chip power consumption. Entering in suspend mode: An interrupt indicates to the application firmware when no activity has been detected on the USB port for more that 3 ms. The application code triggers the suspend mode. Before entering in suspend mode, the PN7462 manages automatically, the deactivation of the contact card. Limitations: Suspend mode is prevented in the following cases: • A host communication is in progress. • A wake-up condition is fulfilled. For example, external RF field presence is a wake-up source, and a field is detected. PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 57 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller • The RF field detector is a possible wake-up source, and the RF field detector is disabled. • No voltage at pin PVDD. 8.15.5.4 Wake-up from standby mode and suspend mode PN7462 family can be woken-up from standby mode, and suspend mode, using the following means: 2 • Host Interface: SPI, HSUART, I C, and USB if already selected before standby mode 2 (SPI, HSUART, and I C) or suspend mode (USB). • RF field detection (presence of a reader or an NFC device in reader mode or P2P initiator) • GPIO • Contact card insertion, contact card removal (PN7462AUHN only) • Interrupt generated on the auxiliary UART interface, through the interrupt pin (PN7462AUHN and PN7462AUEV only) • Wake-up counter, for example to timely check for the presence of any contact or contactless card • Current overconsumption on the PVDD_OUT, voltage above 5 V on TVDD_IN • Temperature sensor: When the chip goes in to standby mode because of over-heating, and when the temperature goes below the sensor configured value, it wakes-up automatically. Each temperature sensor can be configured separately. It is possible to configure the sources as enabled or disabled. 8.15.5.5 Hard Power-Down (HPD) mode The Hard Power-Down (HPD) reduces the chip power consumption, by powering down most of its blocks. All clocks and LDOs are turned off, except the main LDO which is set in low-power mode. Entering in HPD mode: If the RST_N pin is set to low, the NFC controller enters in to Hard Power Down (HPD) mode. It also enters in to HPD mode if the VDDP(VBUS) goes below the critical voltage necessary for the chip to work (2.3 V) and the auto HPD feature is enabled. Exiting the HPD mode: The NFC controller leaves the HPD mode, when both RST_N pin is set to high level and the VDDP(VBUS) voltage is above 2.3 V. 8.15.6 Voltage monitoring The voltage monitoring mode detects whether the voltage is within the operational conditions to enable a proper operation of the RF interface or the contact interface. The following power supplies are monitored: VBUS (two voltage monitors), VBUS_P (one voltage monitor). Section 9.1.2 discusses about the minimum voltages necessary for NFC interface operation and Section 9.1.3 for the contact interface operation. Table 24. Threshold configuration for voltage monitor PN7462_FAM Product data sheet COMPANY PUBLIC Voltage monitor Threshold 1 Threshold 2 Threshold 3 VBUSMON1 2.3 V 2.7 V n.a. VBUSMON2 2.7 V 4.0 V n.a. All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 [1] [1] © NXP B.V. 2020. All rights reserved. 58 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller Voltage monitor Threshold 1 Threshold 2 Threshold 3 VBUSP 2.7 V 3.0 V 3.9 V [1] n.a. means not applicable. 8.15.6.1 VBUS monitor The PN7462 family includes up to two levels (2.3 V or 2.7 V) for monitoring the voltage on the VBUS pin. If this voltage falls below one of the selected levels, the BOD asserts an interrupt signal to the PCR. This signal may be enabled for interrupt in the interrupt enable register in the PCR, to cause a CPU interrupt. Alternatively, software can monitor the signal by reading a dedicated status register. Two threshold levels (2.3 V or 2.7 V) can be selected to cause a forced Hard Power-Down (HPD) of chip. 8.15.6.2 VBUSP monitor The PN7462 family includes three levels (2.7 V, 3.0 V, and 3.9 V) for monitoring the voltage on the VBUSP pin. In addition to the above, the following applies to products with contact interface: When the voltage falls below the selected threshold value, and CT automatic deactivation is enabled in the PCR system register, hardware automatically de-activates the CT interface. An interrupt signal is also asserted to the PCR. This signal can be enabled for interrupt in the interrupt enable register in the PCR, to cause a CPU interrupt. Software must check VBUSP monitor levels by reading dedicated status registers before starting card activation sequence. 8.15.6.3 PVDD LDO supply monitor The PN7462 family includes up to two levels (VBUSMON2: 2.7 V or 4.0 V) for monitoring the voltage on the PVDD LDO input supply. If supply voltage is 4.0 V or above, PVDD LDO can be enabled. The software has to check whether the voltage is sufficient before enabling the LDO. 8.15.7 Temperature sensor The PN7462 family power management unit provides temperature sensors, associated to the TX_LDO. It detects problems that would result in high power consumption and heating, which could damage the chip and the user device. Triggering levels are configurable. Following temperatures can be chosen: 135 °C, 130 °C, 125 °C, and 120 °C. By default, the temperature sensor is set to 120 °C. Once the configured threshold is reached, an interrupt is generated. The application decides whether to enter standby or suspend mode. The triggering temperature sensor is indicated in the interrupt register. Once the temperature goes below the configured threshold temperature, the NFC controller wakes up automatically. 8.16 System control PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 59 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller 8.16.1 Reset PN7462 family has six possible sources for reset. The list of sources is described in Table 21. Table 25. Reset sources Source Description software - PCR soft reset from the PCR peripheral software - Arm software reset form the Arm processor 2 2 2 I C interface I C Standard 3.0 defines a method to reset the chip via an I C command watchdog reset the chip if the watchdog threshold is not periodically reloaded VBUS voltage power-on reset sequence; if the voltage is above 2.3 V, reset the chip [1] [1] This feature can be disabled. 2 The watchdog reset, I C reset and soft resets from PCR and Arm processor resets the chip except the PCR and the Arm debug interface. The Power-On Reset (POR) resets the complete chip including the PCR and Arm debug interface. Upon reset, the processor executes the first instruction at address 0, which is initially the reset vector mapped from the boot block. At that point, all the processor and peripheral registers are initialized to predetermined values. 8.16.2 Brown-Out Detection (BOD) The PN7462 family includes up to two levels for monitoring the voltage on the VBUS pin. If this voltage falls below one of the selected voltages (2.3 V or 2.7 V), the BOD asserts an interrupt signal to the PCR. This signal can be enabled for interrupt in the interrupt enable register in the PCR, to cause a CPU interrupt. Alternatively, software can monitor the signal by reading a dedicated status register. Two threshold levels (2.3 V and 2.7 V) can be selected to cause a forced Hard Power-Down (HPD) of the chip. 8.16.3 APB interface and AHB-Lite All APB peripherals are connected to one APB bus. The AHB-Lite connects the AHB masters. The AHB masters include the CPU bus of the Arm Cortex-M0, host interface, NFC interface, SPI interface to the flash memory. It also includes EEPROM memory, SRAM, ROM, and AHB to APB bridge. 8.16.4 External interrupts PN7462 family enables the use of 12 GPIOs as edge or level sensitive inputs (GPIO1 to GPIO12). 8.17 SWD debug interface TM The Cortex-M0 processor-based devices use serial wire Arm CoreSight Debug technology. The PN7462 family is configured to support four break points and two watch points. The SWD interface can be disabled for having code (or data) read/write access protection. A dedicated SWD disable bit is available in the protected area of the PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 60 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller EEPROM memory. Once the SWD interface is disabled, it is not possible to enable it anymore. 8.17.1 SWD interface features • • • • • PN7462_FAM Product data sheet COMPANY PUBLIC Run control of the processor allowing to start and stop programs Single step one source or assembler line Set breakpoints while the processor is running Read/write memory contents and peripheral registers on-the-fly "printf" like debug messages through the SWD interface All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 61 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller 9 Application design-in information 9.1 Power supply connection The following table indicates the power sources for all the PN7462 family power inputs. Table 26. Power supply connection Power inputs Power sources VBUS external source VBUSP external source; connected to VBUS TVDD_IN external supply or using the TX_LDO PVDD_IN external supply or using PVDD_LDO Comment VBUSP is connected to VBUS, with the addition of a decoupling capacitor PVDD_LDO can be used, when VDDP(VBUS) > 4 V. It makes a regulated 3.3 V supply available to GPIO and host interface pads, without the addition of an external LDO for 1.8 V, external supply has to be used PVDD_M_IN external supply or using PVDD_LDO PVDD_LDO can be used, when VDDP(VBUS) > 4 V. It makes a regulated 3.3 V supply available to GPIO and host interface pads, without the addition of an external LDO for 1.8 V, external supply has to be used DVDD connected to the VDD output VDD provides 1.8 V stabilized supply, out of the MAIN_LDO Note: When PVDD_IN and PVDD_M_IN are externally supplied, PVDD_OUT must be connected to ground, with a ground resistance of less than 10 Ω. PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 62 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller 9.1.1 Powering up the microcontroller (1) VBUS GND VBUSP VDDP(VBUS), IDDP(VBUS) TVSS PN7462 family GNDC GNDP (2) DVDD (3) VBUS VBUS VDDP(VBUS), IDDP(VBUS) VBUSP PN7462 family VDD PVDD_OUT VBUSP PN7462 family VDDP(VBUS), IDDP(VBUS) PVDD_OUT PVDD_IN PVDD_IN PVDD_M_IN PVDD_M_IN external supply aaa-025630 1. Powering up the microcontroller and the digital blocks (DVDD). 2. Two possibilities for powering the pad interfaces (PVDD_IN and PVDD_M_IN (3)). Remark: The capacitance must be chosen so that the capacitance value is correct at 5 V Figure 37. Powering up the microcontroller The schematics in Figure 37 describe the power supply of the chip (VDDP(VBUS)), including the digital blocks supply (DVDD). It indicates two possibilities to supply the pads, using the internal LDO, or using an external supply. The internal LDO requires that VDDP(VBUS) > 4 V. It avoids the requirement of a separate LDO when VDDP(VBUS) has a sufficient voltage. Power supply is available to pads through PVDD_IN (host interface). Similarly, power supply is available to master interface pads through PVDD_M_IN. When PVVD _LDO is used, maximum total current available from PVDD_OUT for the pads supply is 30 mA. When an external source is used for PVDD_IN and PVDD_M_IN, PVDD_OUT must be connected to the ground, with a ground resistance of less than 10 Ω. 9.1.2 Powering up the contactless interface Powering of contactless interface is done though TVDD_IN. Internal LDO (TXLDO) or external supply can be used. PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 63 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller (1) (2) VBUS VBUS PN7462 family supply antenna supply TX2 TX1 PN7462 family antenna supply VUP_TX supply TX2 TX1 PN7462 family TVDD_OUT VUP_TX TVDD_OUT TVDD_IN TVSS PN7462 family TVDD_IN TVSS aaa-021143 The capacitance value must be chosen so that the capacitance value is correct at 5 V. 1. Using TXLDO 2. Without using TXLDO Figure 38. Powering up the contactless interface using a single power supply (1) antenna supply (2) VBUS PN7462 family VUP_TX PN7462 family TX2 TX1 PN7462 family VBUS supply RF transmitter supply antenna supply TVDD_IN supply TX2 VUP_TX TX1 PN7462 family TVDD_OUT TVSS PN7462 family TVDD_OUT TVSS TVDD_IN PN7462 family RF transmitter supply aaa-021144 The capacitance value must be chosen so that the capacitance value is correct at 5 V. 1. Using TXLDO. 2. Without using TXLDO. Figure 39. Powering up the contactless interface using an external RF transmitter supply Note: The TVDD_OUT pin must not be left floating. It should be at the same voltage as the TVDD_IN pin. The power design must be designed properly to be able to deliver a clean power supply voltage. In any case (external TVDD or internal TX_LDO internal supply), TVDD_IN supply must be stable before turning on the RF field. The capacitor shall be 6.8 μF or higher (up to 10 μF) Every noise level on top of the supply voltage can disturb the RF communication performance of the PN7462 family. Therefore, special attention must be paid to the filtering circuit. PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 64 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller When powering up the device through the USB interface, TVDD capacitor value shall be chosen so that the maximum capacitance on VBUS remains as per the USB specification. 9.1.3 Powering up the contact interface SAM SCVDD SAP VUP GDNP PN7462 VBUSP VCC VBUS GNDC VDDP(VBUS), IDDP(VBUS) aaa-021145 1. The capacitances values must be chosen so that the capacitance values are correct at 5.6 V. Figure 40. Powering up the contact interface Contact interface is powered through VBUSP. VBUSP must be connected to VBUS, as per the schematic in Figure 40. In order to provide the right voltage needed for the various ISO/IEC 7816 contact card classes (A, B, or C), the following voltages are needed: • VDDP(VBUSP) > 2.7 V: Support of class B and class C contact cards • VDDP(VBUSP) > 3 V: Support of class A contact cards Remark: To support class A cards, DC-to-DC converter is used. To support class B cards with VDDP(VBUSP) < 3.9 V, DC-to-DC converter is used. Figure 41 indicates the method to connect the pins related to contact interfaces, when no contact interface is used. n.c. SAM SCVDD n.c. GDNP n.c. n.c. n.c. SAP VUP PN7462 VBUSP VCC GNDC VBUS connections when CT interface is not used VDDP(VBUS), IDDP(VBUS) aaa-021146 Figure 41. Contact interface power supply connection when contact interface is not used PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 65 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller 9.2 Connecting the USB interface PN7462 family VBUS USB_VBUS USB_DP USB_DM USB connector Rs = 1 kΩ OVP aaa-021147 Figure 42. USB interface on a bus-powered device The resistor Rs is used to minimize the impact of transient responses on the USB line. When the USB interface is not used, the USB_VBUS pin shall be connected to the ground. 9.3 Connecting the contact interface The following diagrams indicate the method to connect the contact interface, when the contact interface is used, and when it is not used. PRES AUX1 CLK RST C1 C2 C3 C4 PRES C = 100 nF(1) PN7462 VPVDD_IN GNDC C5 C6 C7 C8 C = 470 nF(2) VCC R=0Ω IO AUX2 aaa-021148 1. To place close to C1 (VCC) pin of the card connector, with good connection to the ground. 2. Place close to VCC pin, with good connection to GNDC. Figure 43. Connecting the contact interface PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 66 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller PRES AUX1 CLK RST PN7462 n.c. n.c. n.c. n.c. GNDC VCC IO n.c. n.c. AUX2 n.c. connections when CT interface is not used aaa-021149 Figure 44. Connection of contact interface when not used 9.4 Connecting the RF interface Cant ANT1 RX1 C3=1 nF R TX1 TVSS PN7462 family TX2 RX2 C1 L L C3=1 nF antenna C0 C2 C0 C2 antenna R C1 Cant ANT2 VMID C=100 nF aaa-021150 Figure 45. RF interface - example of connection to an antenna 9.5 Unconnected I/Os When not used, the following pins need to be "not connected": • I2C Master interface: I2CM_SDA, I2CM_SCL • SPI Master interface: SPIM_SSN, SPIM_SCLK, SPIM_MOSI, SPIM_MISO • AUX interface: INT_AUX, IO_AUX, CLK_AUX (PN7462 only) Pads have to be configured in GPIO mode, pad input and output driver need to be disabled. PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 67 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller 10 Limiting values Table 27. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VESD Parameter Conditions Min Max Unit on card pins IO, RST, VCC, AUX1, CLK, AUX2, PRESN -12 +12 kV on all pins except contact interface pins -2 +2 kV on all pins -1 +1 kV non-operating -55 +150 °C - +125 °C - 1050 mW electrostatic discharge voltage human body model (HBM) [1] [2] charged device model (CDM) Tstg storage temperature Tj(max) maximum junction temperature Ptot total power dissipation [1] [2] reader mode; VDDP(VBUS) = 5.5 V According to ANSI/ESDA/JEDEC JS-001. According to ANSI/ESDA/JEDEC JS-002. Table 28. Limiting values for GPIO1 to GPIO12 Symbol Parameter Vi input voltage Conditions Min Max Unit -0.3 4.2 V Min Max Unit -0.3 4.2 V Min Max Unit -0.3 4.2 V 2 Table 29. Limiting values for I C master pins (i2cm_sda, i2cm_scl) Symbol Parameter Vi input voltage Conditions Table 30. Limiting values for SPI master pins ( spim_nss, spim_miso, spim_mosi and spi_clk) Symbol Parameter Vi input voltage Conditions Table 31. Limiting values for host interfaces atx_a, atx_b, atx_c, atx_d in all configurations (USB, HSUART, SPI and 2 I C) Symbol Parameter Vi input voltage PN7462_FAM Product data sheet COMPANY PUBLIC Conditions All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 Min Max Unit -0.3 4.2 V © NXP B.V. 2020. All rights reserved. 68 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller Table 32. Limiting values for crystal oscillator In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VIH high-level input voltage XTAL1, XTAL2 0 2.2 V Table 33. Limiting values for power supply In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VDDP(VBUS) Parameter Conditions Min Max Unit [1] -0.3 7 V [1] -0.3 7 V [1] -0.3 4.2 V on pin PVDD_M_IN; power supply for master interfaces [1] -0.3 4.2 V for RF interface LDO [1] -0.3 7 V for RF interface transmitter [1] -0.3 6 V power supply voltage on pin VBUS VDDP(VBUSP) power supply voltage on pin VBUSP pin supply voltage for host interface and GPIOs (on pin PVDD_IN) VDD(PVDD) PVDD supply voltage on pin PVDD_IN; power supply for host interfaces and GPIOs pin supply voltage for master interfaces (on pin PVDD_M_IN) VDD(PVDD) PVDD supply voltage RF interface LDO (pin VUP_TX) VI(LDO) LDO input voltage RF transmitter (pin TVDD_IN) VDD(TVDD) [1] TVDD supply voltage Maximum/minimum voltage above the maximum operating range and below ground that can be applied for a short time (< 10 ms) to a device without leading to irrecoverable failure. Failure includes the loss of reliability and shorter life time of the device. Table 34. Limiting values for contact interface In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VIH high-level input voltage on card pins IO, RST, AUX1, AUX2, CLK -0.3 5.75 V Table 35. Protection and limitations for contact interface Symbol Parameter Conditions Min Typ Max Unit IOlim output current limit on IO, C4, C8 class A, B, C 5 8 15 mA Isd shutdown current on pin VCC = 5 V 70 85 110 mA on pin VCC = 3 V (doubler mode) 75 90 110 mA on pin VCC = 3 V (follower mode) 75 90 110 mA on pin VCC = 1.8 V 60 70 90 mA PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 69 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller Table 36. Limiting values for RF interface In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Vi input voltage on pins RXN and RXP 0 2.2 V 1. Maximum/minimum voltage above the maximum operating range and below ground that can be applied for a short time (< 10 ms) to a device without leading to irrecoverable failure. Failure includes the loss of reliability and shorter life time of the device. Table 37. Limiting values for USB interface Symbol Parameter Conditions [1] VDDP(USB_VBUS) Voltage on pin USB_VBUS [1] Min Max Unit -0.3 7 V Maximum/minimum voltage above the maximum operating range and below ground that can be applied for a short time (< 10 ms) to a device without leading to irrecoverable failure. Failure includes the loss of reliability and shorter life time of the device. PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 70 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller 11 Recommended operating conditions Table 38. Operating conditions Symbol Parameter Conditions Min Typ Max Unit Tamb ambient temperature JDEC PCB - 0.5 -40 25 85 °C VDDP(VBUS) power supply voltage on pin VBUS external PVDD supply, card emulation and passive target (PLM) 2.3 - 5.5 V external PVDD supply, reader mode, NFC initiator and passive/ active target mode (ALM and PLM) 2.7 - 5.5 V internal PVDD_LDO supply, reader mode, NFC initiator and passive/active target mode (ALM and PLM) 4 - 5.5 V 2.7 - 5.5 V 3 - 5.5 V 1.8 V pin supply 1.65 1.8 1.95 V 3.3 V pin supply 3 3.3 3.6 V 1.8 V pin supply 1.65 1.8 1.95 V 3.3 V pin supply 3 3.3 3.6 V TX_LDO supply for powering up RF interface 3 5 5.5 V on pin TVDD_IN - - 250 mA VDDP(VBUSP) power supply voltage on pin VBUSP class B and class C contact card class A, class B, and class C contact card host interface and GPIOs pin power supply (pin PVDD_IN) VDD(PVDD) PVDD supply voltage for digital pins 2 SPI master and I C master interfaces pin power supply (on pin PVDD_M_IN) VDD(PVDD) PVDD supply voltage for master pins RF interface LDO (pin VUP_TX) VI(LDO) LDO input voltage RF interface transmitter IDD(TVDD) TVDD supply current PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 71 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller 12 Thermal characteristics Table 39. Thermal characteristics Symbol Parameter Conditions Typical VFBGA64 package Typical HVQFN64 package Unit Rth(j-a) thermal resistance from junction to ambient in free air with exposed pad soldered on a four-layer JEDEC PCB 53.4 40.0 °K/W Ψj-top thermal characterization parameter from junction to top not dependend on PCB 11.2 5.75 °K/W PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 72 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller 13 Characteristics 13.1 Static characteristics Table 40. Static characteristics for RST_N input pin Data are given for Tamb = -40 °C to +85 °C; unless otherwise specified Symbol Parameter VIH Conditions Min Typ Max Unit high-level input voltage 1.1 - VDDP(VBUS) V VIL low-level input voltage 0 - 0.4 V IIH high-level input current Vi = VDDP(VBUS) - - 1 μA IIL low-level input current -1 - - μA Cin input capacitance - 5 - pF Vi = 0 V Table 41. Static characteristics for IRQ output pin Data are given for Tamb = -40 °C to +85 °C; unless otherwise specified Symbol Parameter Conditions Min Typ Max Unit VOH high-level output voltage IOH < 3 mA VPVDD_IN 0.4 - VPVDD_IN V VOL low-level output voltage IOL < 3 mA 0 - 0.4 V CL load capacitance - - 20 pF Rpull-down extra pull-down 0.45 - 0.8 MΩ Min Typ Max Unit extra pull-down is activated in HDP Table 42. Static characteristics for DWL_REQ Symbol Parameter VIH high-level input voltage VVPVDD_IN= 1.8 V 0.65 × VPVDD_IN - - V VIL high-level input voltage VVPVDD_IN= 1.8 V - - 0.35 × VPVDD_IN V VIH high-level input voltage VVPVDD_IN = 3.3 V 2 - - V VIL high-level input voltage VVPVDD_IN = 3.3 V - - 0.8 V IIH high-level input current VI = PVDD_IN - - 1 μA IIL low-level input current -1 - - μA CL load capacitance - 5 - pF PN7462_FAM Product data sheet COMPANY PUBLIC Conditions VI = 0 V All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 73 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller 13.1.1 GPIO static characteristics Table 43. Static characteristics for GPIO1 to GPIO21 Symbol Parameter Conditions Min Typ Max Unit VOH high-level output voltage IOH < 3 mA VPVDD_IN 0.4 - VPVDD_IN V VOL low-level output voltage IOH < 3 mA 0 - 0.4 V VIH high-level input voltage VPVDD_IN = 3.3 V 2 - - V VPVDD_IN = 1.8 V 0.65 × VPVDD_IN - - V VPVDD_IN = 3.3 V - - 0.8 V VPVDD_IN = 1.8 V - - 0.35 × VPVDD_IN V VIL low-level input voltage Vhys hysteresis voltage VPVDD_IN = 1.8 V and VPVDD_IN = 3.3 V 0.1 × VPVDD_IN - - V IOZ OFF-state output current VO = 0 V; VO = VPVDD_IN; on-chip pullup/pull-down resistors disabled - - 1000 nA Rpd pull-down resistance VPVDD_IN = 3.3 V 65 90 120 kΩ VPVDD_IN = 1.8 V 65 90 120 kΩ VPVDD_IN = 3.3 V 65 90 120 kΩ VPVDD_IN = 1.8 V 65 90 120 kΩ Drive high; cell connected to ground; VPVDD_IN = 3.3 V - - 58 mA Drive low; cell connected to PVDD_IN; VPVDD_IN = 1.8 V - - 30 mA VOH = VPVDD_IN = 3.3 V - - 54 mA VOH = VPVDD_IN = 1.8 V - - 37 mA VI = 0 V -1 - - µA Rpu IOSH IOSL pull-up resistance short circuit current output high short circuit current output low IIL low-level input current IIH high-level input current VI = VPVDD_IN - - 1 µA IOH high-level output current VOH = VPVDD_IN - - 3 mA IOL low-level output current VOL = 0 V - - 3 mA PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 74 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller 2 13.1.2 Static characteristics for I C master 2 2 Table 44. Static characteristics for I CM_SDA, I CM_SCL - S Symbol Parameter Conditions Min Typ Max Unit VOH high-level output voltage IOH < 3 mA 0.7 × VPVDD_M_IN - VPVDD_M_IN V VOL low-level output voltage IOL < 3 mA 0 - 0.4 V CL load capacitance - - 10 pF VIH High-level input voltage 0.7 × VPVDD_M_IN - - V VIL low-level input voltage - - 0.3 × VPVDD_M_IN V IIH high-level input current VI = VPVDD_M_IN - - 1 μA IIL low-level input current -1 - - μA Cin input capacitance - 5 - pF VI = 0 V 13.1.3 Static characteristics for SPI master Table 45. Static characteristics for SPIM_MOSI Symbol Parameter Conditions Min Typ Max Unit VOH high-level output voltage IOH < 3 mA VPVDD_M_IN - 0.4 - VPVDD_M_IN V VOL low-level output voltage IOL< 3 mA 0 - 0.4 V CL load Capacitance - - 20 pF Table 46. Static characteristics for SPIM_NSS Symbol Parameter Conditions Min Typ Max Unit VOH high-level output voltage IOH < 3 mA VPVDD_M_IN - 0.4 - VPVDD_M_IN V VOL low-level output voltage IOL < 3 mA 0 - 0.4 V CL load Capacitance - - 20 pF Typ Max Unit V Table 47. Static characteristics for SPIM_MISO Symbol Parameter Conditions Min VIH high-level input voltage VPVDD_M_IN = 1.8 V 0.65 × VPVDD_M_IN - - VIL low-level input voltage VPVDD_M_IN = 1.8 V - - 0.35 × VPVDD_M_IN V VIH high-level input voltage VPVDD_M_IN = 3.3 V 2 - - V VIL low-level input voltage VPVDD_M_IN = 3.3 V - - 0.8 V IIH high-level input current Vi = VPVDD_M_IN - - 1 µA IIL low-level input current Vi = 0 V -1 - - µA Cin input capacitance - 5 - pF PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 75 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller Table 48. Static characteristics for SPI_SCLK Symbol Parameter Conditions Min Typ Max Unit VOH high-level output voltage IOH < 3 mA VPVDD_M_IN - 0.4 - VPVDD_M_IN V VOL low-level output voltage IOL < 3 mA 0 - 0.4 V CL load capacitance - - 20 pF 13.1.4 Static characteristics for host interface 2 Table 49. Static characteristics for ATX_ used as SPI_NSS, ATX_ used as I CADR0, ATX_ used as SPI_SCK, ATX_ used as SPI_MOSI Symbol Parameter Conditions Min VIH high-level input voltage VPVDD_IN = 1.8 V VIL low-level input voltage VIH Max Unit 0.65 × VPVDD_M_IN - - V VPVDD_IN = 1.8 V - - 0.35 × VPVDD_M_IN V high-level input voltage VPVDD_IN = 3.3 V 2 - - V VIL low-level input voltage VPVDD_IN = 3.3 V - - 0.8 V IIH high-level input current Vi = VPVDD_IN - - 1 µA IIL low-level input current Vi = 0 V -1 - - µA Cin input capacitance - 5 - pF 2 Typ 2 Table 50. Static characteristics of ATX_ used as I CSDA, ATX_ used as I CSCL Symbol Parameter Conditions Min Typ Max Unit VOH high-level output voltage IOH < 3 mA 0.7 × VPVDD_IN - VPVDD_IN V VOL low-level output voltage IOL < 3 mA 0 - 0.4 V CL load capacitance - - 10 pF VIH high-level input voltage 0.7 × VPVDD_IN - - V VIL low-level input voltage - - 0.3 × VPVDD_IN V IIH high-level input current Vi = VPVDD_IN - - 1 μA IIL low-level input current Vi = 0 V -1 - - μA Cin Input capacitance - 5 - pF Min Typ Max Unit Table 51. Static characteristics of ATX_ used as SPIMISO Symbol Parameter VOH high-level output voltage IOH < 3 mA VPVDD_IN - 0.4 - VPVDD_IN V VOL low-level output voltage 0 - 0.4 V CL load capacitance - - 20 pF PN7462_FAM Product data sheet COMPANY PUBLIC Conditions IOL < 3 mA All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 76 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller Table 52. USB characteristics Data are given for Tamb = -40 °C to +85 °C; unless otherwise specified Symbol Parameter Conditions IOZ OFF-state output current 0 V < Vi < 3.3 V VDDP(VBUS) power supply voltage on pin VBUS Min Typ Max Unit -10 - 10 μA 4 - 5.5 V VDI differential input sensitivity voltage (D+) - (D-) 0.2 - - V VCM differential common mode voltage range includes VDI range 0.8 - 2.5 V Vth(rs)se single-ended receiver switching threshold voltage 0.8 - 2 V VOL low-level output voltage - - 0.3 V VOH high-level output voltage driven; for low- speed or full-speed; RL of 15 kΩ to GND 2.8 - VPVDD_IN V Ctrans transceiver capacitance - 15 - pF ZDRV driver output impedance with 33 Ω series for driver which is not resistor; steady state high-speed capable drive 28 - 44 Ω VCRS output signal crossover voltage 1.3 - 2 V Min Typ Max Unit for low-speed or fullspeed; RL of 1.5 kΩ to 3.6 V pin to GND Table 53. Static characteristics of HSU_TX and HSU RTS pin Data are given for Tamb = -40 °C to +85 °C; unless otherwise specified Symbol Parameter Conditions VOH high-level output voltage IOH < 3 mA VPVDD_IN - 0.4 - VPVDD_IN V VOL low-level output voltage 0 - 0.4 V CL load capacitance - - 20 pF IOL < 3 mA Table 54. Static characteristics of HSU_RX, HSU_CTS Data are given for Tamb = -40 °C to +85 °C; unless otherwise specified Symbol Parameter Conditions Min Typ Max Unit VIH high-level input voltage VPVDD_M_IN = 1.8 V 0.65 × VPVDD_IN - - V VIL low-level input voltage VPVDD_M_IN = 1.8 V - - 0.35 × VPVDD_IN V VIH high-level input voltage VPVDD_M_IN = 3.3 V 2 - - V VIL low-level input voltage VPVDD_M_IN = 3.3 V - - 0.8 V IIH high-level input current - - 1 μA IIL low-level input current -1 - - μA PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 77 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller Symbol Parameter CL load capacitance Conditions Min Typ Max Unit - 5 - pF Min Typ Max Unit 0.2 - 1.65 V 13.1.5 Clock static characteristics Table 55. Static characteristics of XTAL pin (XTAL1, XTAL2) Tamb = -40 °C to +85°C Symbol [1] Parameter Conditions [2] Input clock characteristics on XTAL1 when using PLL Vi(p-p) peak-to-peak input voltage XTAL pin characteristics XTAL PLL input IIH high-level input current Vi = VDD - - 1 μA IIL low-level input current Vi = 0 V -1 - - μA Vi input voltage - - VDD V VAL input voltage amplitude 200 - - mV Cin input capacitance - 2 - pF all power modes Pin characteristics for 27.12 MHz crystal oscillator Cin input capacitance pin XTAL1 - 2 - pF Cin input capacitance pin XTAL2 - 2 - pF [1] [2] Parameters are valid over operating temperature range unless otherwise specified. Typical ratings are not guaranteed. The values listed are at room temperature (25 °C) with nominal supply voltages. 13.1.6 Static characteristics - power supply Table 56. Static characteristics for power supply Data are given for Tamb = -40 °C to +85 °C; unless otherwise specified Symbol Parameter Conditions Min Typ Max Unit IDDP(VBUSP) power supply current on pin VBUSP external supply current for contact interface, in operating mode - - 200 mA pin supply: PVDD_LDO VO(LDO) LDO output voltage VDDP(VBUS) >= 4.0 V, IPVDDOUT VI(LDO) > 3.3 V 2.8 3 3.25 V DC output voltage (target: 3.0 V) 3.3 V > VI(LDO) > 2.7 V - VI(LDO) 0.3 - V DC output voltage (target: 3.3 V) 5.5 V > VI(LDO) > 3.6 V 3.1 3.3 3.55 V DC output voltage (target: 3.3 V) 3.6 V > VI(LDO) > 2.7 V - VI(LDO) 0.3 - V DC output voltage (target: 3.6 V) 5.5 V > VI(LDO) > 3.9 V 3.4 3.6 3.95 V DC output voltage (target: 3.6 V) 3.9 V > VI(LDO) > 2.7 V - VI(LDO) 0.3 - V DC output voltage (target: 4.5 V) 5.5 V > VI(LDO) > 5.0 V 4.3 4.5 4.9 V DC output voltage (target: 4.75 V) 5.5 V > VI(LDO) > 5.0 V 4.55 4.75 5.2 V IO(LDO) LDO output current VI(LDO) = 5.5 V - - 225 mA IO(LDO) LDO peak output current VI(LDO) = 5.5 V - - 275 mA NFC interface: RF transmitter (on pin TVDD_IN) IDD(TVDD) maximum continuous TVDD supply current - - 250 mA IDD(TVDD) maximum peak TVDD supply current - - 275 mA 396 570 1000 nF class A; ICC < 60 mA 4.75 5 5.25 V class B; ICC < 50 mA 2.85 3 3.15 V class C; ICC < 30 mA 1.71 1.8 1.89 V class A; current pulses of 40 nA with ICC < 200 mA, tw < 400 ns 4.6 - 5.4 V class B; current pulses of 40 nA with ICC < 200 mA, tw < 400 ns 2.76 - 3.24 V class C; current pulses of 12 nA with ICC < 200 mA, tw < 400 ns 1.66 - 1.94 V Contact Interface: smart card power supply (pin VCC) Cdec decoupling capacitance connected on pin VCC (220 nF + 220 nF 10 %) VCC supply voltage Vripple(p-p) peak-to-peak ripple voltage from 20 kHz to 200 MHz - - 350 mV SR slew rate on pin VCC 5 V, class A cards 0.02 - 0.025 V/μs 3 V, class B cards 0.012 - 0.015 V/μs 1.8 V, class C cards 0.0072 - 0.009 V/μs PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 79 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller Symbol Parameter Conditions Min Typ Max Unit ICC supply current class A - - 60 mA class B - - 55 mA class C - - 35 mA Pin VCC shorted to ground - - 110 mA VDDP(VBUSP) = 5 V, VCC = 5 V; ICC < 60 mA DC - - 9 V VDDP(VBUSP) = 5 V, VCC = 3 V; ICC < 55 mA DC - - 5 V VDDP(VBUSP) = 5 V, VCC = 1.8 V; ICC < 35 mA DC - - 5 V VDDP(VBUSP) = 3.3 V, VCC = 5 V; ICC < 60 mA DC - - 9 V VDDP(VBUSP) = 3.3 V, VCC = 3 V; ICC < 55 mA DC - - 9 V VDDP(VBUSP) = 3.3 V, VCC = 1.8 V; ICC < 35 mA DC - - 3.3 V Class A; VDDP(VBUSP) = 3 V to 5 V, ICC < 60 mA 5.35 - 5.9 V Class B; ICC < 55 mA 3.53 - 5.5 V Class C, VDDP(VBUSP) = 2.7 V to 5.5 V, ICC < 35 mA DC 2.4 - 5.5 V Contact interface: DC-to-DC converter VSAP VUP SAP (DC-to-DC converter) - high-level output voltage VUP - high-level output voltage CSAPSAM DC-to-DC converter capacitance connected between SAP and SAM with VDDP(VBUSP) = 3 V 300 470 600 nF CVUP DC-to-DC converter capacitance connected on pin VUP 1.5 2.7 4.7 µF 3.775 3.9 4.2 V Min Typ Max Unit set to 2.3 V 2.15 2.3 2.45 V set to 2.7 V 2.6 2.75 2.95 V set to 4.0 V 3.6 3.8 3.9 V set to 2.3 V 100 150 200 mV set to 2.7 V 100 150 200 mV Voltage detector for the DC-to-DC converter Vdet detection voltage on pin VBUSP for doubler selection, follower/doubler for class B card Table 57. Static characteristics for voltage monitors Tamb = -40 °C to +85 °C Symbol Parameter Conditions V(th)HL negative-going threshold voltage VBUS monitor Vhys hysteresis voltage PN7462_FAM Product data sheet COMPANY PUBLIC VBUS monitor All information provided in this document is subject to legal disclaimers. 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All rights reserved. 80 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller Symbol V(th)HL Vhys Parameter negative-going threshold voltage hysteresis voltage Conditions Min Typ Max Unit set to 4.0 V 40 80 100 mV set to 2.7 V 2.45 2.56 2.65 V set to 3.0 V 2.68 2.825 2.95 V set to 3.9 V 3.7 3.9 4.1 V set to 2.7 V 12 25 35 mV set to 3.0 V 14 30 40 mV set to 3.9 V 20 35 55 mV Conditions Min Typ Max Unit active mode; VDDP(VBUS) = 5.5 V, external PVDD, external TVDD, all IP clocks disabled code while(1){} executed from flash; - 6.5 - mA active mode; VDDP(VBUS) = 5.5 V, external PVDD, external TVDD, all IP clocks enabled code while(1){} executed from flash; - 8.5 - mA suspend mode; VDDP(VBUS) = 5.5 V, external PVDD, T = 25 °C - 120 250 μA VBUS = 5.5 V, T = 25 °C, internal PVDD LDO, including D+ and Dpull-up - 360 440 µA standby mode; VDDP(VBUS) = 3.3 V; external PVDD supply; Tamb = 25 °C - 18 - μA standby mode; VDDP(VBUS) = 5.5 V; Vinternal PVDD supply; Tamb = 25 °C - 55 - μA hard power down; VDDP(VBUS) = 5.5 V; RST_N = 0 V; Tamb = 25 °C - 12 18 μA VBUSP monitor VBUSP monitor 13.1.7 Static characteristics for power modes Table 58. Static characteristics for power modes Tamb = -40 °C to +85 °C; unless otherwise specified Symbol Parameter IDDP(VBUS) power supply current on pin VBUS PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 81 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller 13.1.8 Static characteristics for contact interface Table 59. Static characteristics for contact interface Tamb = -40 °C to +80 °C Symbol Parameter Conditions Min Typ Max Unit inactive mode, no load 0 - 0.1 V inactive mode, II/O = 1 mA 0 - 0.3 V pin IO Configured as output IOL = 1 mA (class A,B), 500 μA (class C) 0 - 0.15 × VCC V pin IO configure as output, IOL < 15 mA 0 - 0.4 V pin IO configure as output, IOH < -200 µA, VCC = 5 V, 3 V and 1.8 V; active pull-up 0.9 × VCC - VCC V pin IO configure as output, IOH < -20 μA; VCC = 1.8 V 0.8 × VCC - VCC V pin IO configure as output, IOH < 15 mA 0 - 0.4 V pin IO configure as input 0 - 0.2 × VCC V 0.6 × VCC - VCC V Data lines (pins IO, AUX1, AUX2) Vo VOL VOH output voltage on pin IO low-level output voltage high-level output voltage VIL low-level input voltage VIH high-level input voltage Vhys hysteresis voltage on pin IO 20 75 120 mV IIL low-level input current on pin IO; VIL = 0 V - - 750 μA ILH high-level leakage current on pin IO; VIH = VCC - - 10 μA Rpu pull-up resistance connected to VCC 7 10 13 kΩ inactive mode; no load 0 - 0.1 V inactive mode; Io = 1 mA 0 - 0.3 V IOL = 200 µA, VCC = 5 V and VCC = 3V 0 - 0.3 V IOL = 200 µA, VCC = 1.8 V 0 - 0.1 × VCC V IOH = -200 μA 0.9 × VCC - VCC V inactive mode; no load 0 - 0.1 V inactive mode; Io = 1 mA 0 - 0.3 V - minimum (0.1 × VCC ; 0.3) V Reset output to the card Vo VOL VOH output voltage low-level output voltage high-level output voltage Clock output to the card Vo output voltage VOL low-level output voltage IOL = 200 μA 0 VOH high-level output voltage IOH = -200 μA 0.9 × VCC - VCC V -0.3 0.3 × VPVDD_IN V Card presence input VIL low-level input voltage PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 - © NXP B.V. 2020. All rights reserved. 82 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller Symbol Parameter VIH Conditions Min Typ Max Unit high-level input voltage 0.7 × VPVDD_IN - VPVDD_IN + 0.3 V Vhys hysteresis voltage 0.03 × VPVDD_IN - - V ILL low-level leakage current - - 1 μA ILH high-level leakage current VIH = VPVDD_IN - - 5 μA Conditions Min Typ Max Unit between ANT1 and ANT2; low impedance - 10 17 Ω VIL = 0 13.1.9 Static characteristics NFC interface Table 60. Static characteristics for NFC interface Data are given for Tamb = -40 °C to +85 °C; unless otherwise specified Symbol Parameter pins ANT1 and ANT2 Z impedance pins RXN and RXP Vi(dyn) dynamic input voltage on pins RXN and RXP - - VDD - 0.05 V Cin input pin capacitance on pins RXN and RXP - 12 - pF Z impedance between pins RX to VMID; reader, card emulation and P2P modes 0 - 15 kΩ Vdet detection voltage card emulation and target modes; configuration for 19 mV threshold - - 30 mV(p-p) pins TX1 and TX2 VOH high-level output voltage pins TX1 and TX2; TVDD_IN = 3.1 V and IOH = 30 mA VTVDD_IN - 150 - - mV VOL low-level output voltage pins TX1 and TX2; TVDD_IN = 3.1; ITX = 30 mA - - 200 mV ROL low-level output resistance VTX = VTVDD - 100 mV; CWGsN = 01h - - 80 Ω VTX = VTVDD - 100 mV; CWGsN = 0Fh - - 10 Ω VTX = VTVDD - 100 mV - - 10 Ω ROH high-level output resistance 13.2 Dynamic characteristics Table 61. Dynamic characteristics for IRQ output pin Data are given for Tamb = -40 °C to +85 °C; unless otherwise specified Symbol Parameter Conditions Min Typ Max Unit tf fall time high speed; CL = 12 pF; VPVDD_IN = 3.3 V 1 - 3.5 ns PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 83 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller Symbol tf tr tr Parameter fall time rise time rise time Conditions Min Typ Max Unit high speed; CL = 12 pF; VPVDD_IN = 1.8 V 1 - 3.5 ns slow speed; CL = 12 pF; VPVDD_IN = 3.3 V 3 - 10 ns slow speed; CL = 12 pF; VPVDD_IN = 1.8 V 2 - 10 ns high speed: CL = 12 pF; VPVDD_IN = 3.3 V 1 - 3.5 ns high speed: CL = 12 pF; VPVDD_IN = 1.8 V 1 - 3.5 ns slow speed: CL = 12 pF; VPVDD_IN = 3.3 V 3 - 10 ns slow speed: CL = 12 pF; VPVDD_IN = 1.8 V 2 - 10 ns 13.2.1 Flash memory dynamic characteristics Table 62. Dynamic characteristics for flash memory Symbol Parameter Conditions Min Typ Max Unit tprog programming time 1 page (64 bytes); slow clock - - 2.5 ms NEndu endurance 200 500 - Kcycle tret retention time - 20 - year 13.2.2 EEPROM dynamic characteristics Table 63. Dynamic characteristics for EEPROM Symbol Parameter Conditions Min Typ Max Unit tprog programming time 1 page (64 bytes) - 2.8 - ms NEndu endurance 300 500 - Kcycle tret retention time - 20 - year 13.2.3 GPIO dynamic characteristics 80 % 80 % 50 % 50 % 20 % tf 20 % gnde tr aaa-021151 Figure 46. Output timing measurement condition for GPIO PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 84 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller Table 64. Dynamic characteristics for GPIO1 to GPIO21 Tamb = -40 °C to +85 °C Symbol Parameter Conditions Min Max Unit tr rise time CL = 12 pF; PVDD = 1.8 V; slow speed 2.0 10.0 ns CL = 12 pF; PVDD = 1.8 V; fast speed 1.0 3.5 ns CL = 12 pF; PVDD = 3.3 V; slow speed 3.0 10.0 ns CL = 12 pF; PVDD = 3.3 V; fast speed 1.0 3.5 ns CL = 12 pF; PVDD = 1.8 V; slow speed 2.0 10.0 ns CL = 12 pF; PVDD = 1.8 V; fast speed 1.0 3.5 ns CL = 12 pF; PVDD = 3.3 V; slow speed 3.0 10.0 ns CL = 12 pF; PVDD = 3.3 V; fast speed 1.0 3.5 ns tf fall time 2 13.2.4 Dynamic characteristics for I C master tDA tDA tHD;DAT SDA tSU;STA tHD;STA tHIGH tSU;DAT tLOW SCL aaa-021152 ² Figure 47. I C-bus pins clock timing 2 Table 65. Timing specification for fast mode plus I C Tamb = -40 °C to +85 °C Symbol Parameter Conditions Min Max Unit fSCL SCL clock frequency fast mode plus; Cb < 100 pF 0 1 MHz tSU;STA set-up time for a (repeated) START condition fast mode plus; Cb < 100 pF 260 - ns tHD;STA hold time (repeated) START condition fast mode plus; Cb < 100 pF 260 - ns tLOW low period of the SCL clock fast mode plus; Cb < 100 pF 500 - ns tHIGH high period of the SCL clock fast mode plus; Cb < 100 pF 260 - ns tSU;DAT data set-up time fast mode plus; Cb < 100 pF 50 - ns PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 85 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller Symbol Parameter Conditions Min Max Unit tHD;DAT data hold time fast mode plus; Cb < 100 pF 0 - ns tr(SDA) SDA rise time fast mode plus; Cb < 100 pF - 120 ns tf(SDA) SDA fall time fast mode plus; Cb < 100 pF - 120 ns Vhys hysteresis of Schmitt trigger inputs fast mode plus; Cb < 100 pF 0.1 × VPVDD_M_IN - V 2 Table 66. Timing specification for fast mode I C Tamb = -40 °C to +85 °C Symbol Parameter Conditions Min Max Unit fSCL SCL clock frequency fast mode; Cb < 400 pF 0 400 kHz tSU;STA set-up time for a (repeated) START condition fast mode; Cb < 400 pF 600 - ns tHD;STA hold time (repeated) START condition fast mode; Cb < 400 pF 600 - ns tLOW low period of the SCL clock fast mode; Cb < 400 pF 1.3 - μs tHIGH high period of the SCL clock fast mode; Cb < 400 pF 600 - ns tSU;DAT data set-up time fast mode; Cb < 400 pF 100 - ns tHD;DAT data hold time fast mode; Cb < 400 pF 0 900 ns tr(SDA) SDA rise time fast mode plus; Cb < 100 pF 30 250 ns tf(SDA) SDA fall time fast mode plus; Cb < 100 pF 30 250 ns Vhys hysteresis of Schmitt trigger inputs fast mode; Cb < 400 pF 0.1 × VPVDD_IN - V PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 86 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller 13.2.5 Dynamic characteristics for SPI Tcy(clk) SCK (CPOL = 0) SCK (CPOL = 1) tv(Q) th(Q) DATA VALID MOSI DATA VALID tDS DATA VALID MISO DATA VALID tv(Q) MOSI DATA VALID th(Q) DATA VALID tDS MISO DATA VALID CPHA = 1 tDH tDH CPHA = 0 DATA VALID 002aae829 Figure 48. SPI master timing Table 67. Dynamic characteristics and Timing specification for SPI master interface Symbol Parameter Conditions Min Max Unit fSCK SCK frequency controlled by the host 0 6.78 MHz tDS data set-up time 25 - ns tDH data hold time 25 - ns tv(Q) data output valid time - 25 ns th(Q) data output hold time - 25 ns CL = 12 pF; high speed; VPVDD_IN = 3.3 V 1 3.5 ns CL = 12 pF; slow speed; VPVDD_IN = 3.3 V 3 10 ns CL = 12 pF; high speed; VPVDD_IN = 3.3 V 1 3.5 ns CL = 12 pF; slow speed; VPVDD_IN = 3.3 V 3 10 ns CL = 12 pF; high speed; VPVDD_IN = 1.8 V 1 3.5 ns CL = 12 pF; slow speed; VPVDD_IN = 1.8 V 2 10 ns CL = 12 pF; high speed; VPVDD_IN = 1.8 V 1 3.5 ns Dynamic characteristics for SPI_SCLK, SPIM_NSS, SPIM_MOSI tf tr tf tr fall time rise time fall time rise time PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 87 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller Symbol Parameter Conditions Min Max Unit CL = 12 pF; slow speed; VPVDD_IN = 1.8 V 2 10 ns 13.2.6 Dynamic characteristics of host interface tDA tDA tHD;DAT SDA tSU;STA tHD;STA tHIGH tSU;DAT tLOW SCL aaa-021153 2 Figure 49. I C-bus pins clock timing Table 68. Timing specification for I2C high speed Tamb = -40 °C to +85 °C Symbol Parameter Conditions Min Max Unit fscl clock frequency high speed; Cb < 100 pF 0 3.4 MHz tSU;STA set-up time for a (repeated) START condition high speed; Cb < 100 pF 160 - ns tHD;STA hold time (repeated) START high speed; Cb < 100 pF condition 160 - ns tLOW low period of the SCL clock 160 - ns tHIGH high period of the SCL clock high speed; Cb < 100 pF 60 - ns tSU;DAT data set-up time high speed; Cb < 100 pF 10 - ns tHD;DAT data hold time high speed; Cb < 100 pF 0 - μs tr(SDA) SDA rise time high speed; Cb < 100 pF 10 80 ns tf(SDA) SDA fall time high speed; Cb < 100 pF 10 80 ns Vhys hysteresis of Schmitt trigger inputs high speed; Cb < 100 pF 0.1 × VPVDD_IN - V high speed; Cb < 100 pF 2 2 2 Table 69. Dynamic characteristics for the I C slave interface: ATX_B used as I C_SDA, ATX_A used as I C_SCL Symbol Parameter Conditions Min Typ Max Unit tf fall time CL = 100 pF, Rpull-up = 2 K, standard and fast mode 30 - 250 ns CL = 100 pF, Rpull-up = 1 K, high speed 10 - 80 ns CL = 100 pF, Rpull-up = 2 K, standard and fast mode 30 - 250 ns tr rise time PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 88 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller Symbol Parameter Conditions Min Typ Max Unit CL = 100 pF, Rpull-up = 1 K, high speed 10 - 100 ns Tcy(clk) SCK (CPOL = 0) SCK (CPOL = 1) tDS MOSI DATA VALID tDH DATA VALID tv(Q) MISO th(Q) DATA VALID tDS MOSI DATA VALID tDH DATA VALID tv(Q) MISO DATA VALID CPHA = 1 DATA VALID th(Q) CPHA = 0 DATA VALID 002aae830 Figure 50. SPI slave timings Table 70. Dynamic characteristics for SPI slave interface Symbol Parameter Conditions Min Max Unit fSCK SCK frequency controlled by the host 0 7 MHz tDS data set-up time 25 - ns tDH data hold time 25 - ns tv(Q) data output valid time - 25 ns th(Q) data output hold time - 25 ns Table 71. Dynamic characteristics for SPI slave interface: ATX_C as SPI_MISO Symbol Parameter Conditions Min Typ Max Unit tf fall time CL = 12 pF; high speed; VPVDD_IN = 3.3 V 1 - 3.5 ns CL = 12 pF; slow speed; VPVDD_IN = 3.3 V 3 - 10 ns PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 89 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller Symbol Parameter Conditions Min Typ Max Unit tr rise time CL = 12 pF; high speed; VPVDD_IN = 3.3 V 1 - 3.5 ns CL = 12 pF; slow speed; VPVDD_IN = 3.3 V 3 - 10 ns CL = 12 pF; high speed; VPVDD_IN = 1.8 V 1 - 3.5 ns CL = 12 pF; slow speed; VPVDD_IN = 1.8 V 2 - 10 ns CL = 12 pF; high speed; VPVDD_IN = 1.8 V 1 - 3.5 ns CL = 12 pF; slow speed; VPVDD_IN = 1.8 V 2 - 10 ns Min Typ Max Unit tf fall time tr rise time Table 72. Dynamic characteristics for HSUART ATX_ as HSU_TX, ATX_ as HSU_RTS [1] Symbol Parameter Conditions tf fall time high speed; VPVDD_IN = 3.3 V 1 - 3.5 ns slow speed; VPVDD_IN = 3.3 V 3 - 10 ns high speed; VPVDD_IN = 3.3 V 1 - 3.5 ns slow speed; VPVDD_IN = 3.3 V 3 - 10 ns high speed; VPVDD_IN = 1.8 V 1 - 3.5 ns slow speed; VPVDD_IN = 1.8 V 2 - 10 ns high speed; VPVDD_IN = 1.8 V 1 - 3.5 ns slow speed; VPVDD_IN = 1.8 V 2 - 10 ns tr rise time tf fall time tr [1] rise time CL=12 pF maximum. Table 73. Dynamic characteristics for USB interface CL = 50 pF; Rpu = 1.5 kΩ on D+ to VBUS Symbol Parameter Conditions Min Typ Max Unit tr rise time 10 % to 90 % 4 - 20 ns tf fall time 10 % to 90 % 4 - 20 ns tFRFM differential rise and fall time matching tr / t f - - 109 % VCRS output signal crossover voltage 1.3 - 2 V tFEOPT source SE0 interval of EOP 160 - 175 ns tFDEOP source jitter for differential transition T = 25 °C; see Figure 51 to SE0 transition -2 - +5 ns tJR1 receiver jitter to next transition T = 25 °C -18.5 - +18.5 ns tJR2 receiver jitter for paired transitions 10 % to 90 %; T = 25 °C -9 - +9 ns PN7462_FAM Product data sheet COMPANY PUBLIC T = 25 °C; see Figure 51 All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 90 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller Symbol Parameter Conditions Min Typ Max Unit tFEOPR receiver SE0 interval of EOP must accept as EOP; see Figure 51 82 - - ns TPERIOD crossover point extended crossover point differential data lines differential data to SE0/EOP skew n × TPERIOD + tFDEOP source EOP width: tFEOPT receiver EOP width: tEOPR1, tEOPR2 002aab561 Figure 51. USB interface differential data-to-EOP transition skew and EOP width 13.2.7 Clock dynamic characteristics Table 74. Dynamic characteristics for internal oscillators Tamb = -40 °C to +85 °C Symbol [1] Parameter [2] Conditions Min Typ Max Unit VDDP(VBUS) = 3.3 V 300 365 400 kHz VDDP(VBUS) = 3.3 V 18 20 22 MHz low frequency oscillator fosc(int) internal oscillator frequency high frequency oscillator fosc(int) [1] [2] internal oscillator frequency Parameters are valid over operating temperature range unless otherwise specified. Typical ratings are not guaranteed. The values listed are at room temperature (25 °C) with nominal supply voltages. Table 75. Dynamic characteristics for PLL Tamb = -40 °C to +85°C [1] [2] Symbol Parameter Conditions Min Typ Max Unit Δf frequency deviation deviation added to CLK_ XTAL1 frequency on transmitter frequency generated using PLL -50 - 50 ppm Typ Max Unit [1] [2] Parameters are valid over operating temperature range unless otherwise specified. Typical ratings are not guaranteed. The values listed are at room temperature (25 °C) with nominal supply voltages. 13.2.8 Dynamic characteristics for power supply Table 76. Dynamic characteristics for power supply Symbol Parameter Conditions Min DC-to-DC internal oscillator PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 91 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller Symbol Parameter Conditions Min Typ Max Unit fosc(int) internal oscillator frequency DC-to-DC converter - 3.39 - MHz rise and fall - - 2.75 V/μs rise and fall - - 2.75 V/μs rise and fall - - 2.75 V/μs Min Typ Max Unit 10 - - μs external PVDD supply; supply is stable at reset - - 320 µs internal PVDD_LDO supply; supply is stable at reset - - 2.2 ms Main supply (pin VBUS) SR slew rate RF interface LDO supply (pin VUP_TX) SR slew rate Supply contact interface (pin VBUSP) SR slew rate 13.2.9 Dynamic characteristics for boot and reset Table 77. Dynamic characteristics for boot and reset Symbol Parameter twL(RST_N) RST_N Low pulse width time tboot boot time Conditions 13.2.10 Dynamics characteristics for power mode Table 78. Power modes - wake-up timings Symbol twake [1] Parameter wake-up time Conditions Min Typ Max Unit standby mode [1] - - 500 μs suspend mode [1] - - 150 μs Wake-up timings are measured from the wake-up event to the point in which the user application code reads the first instruction. 13.2.11 Dynamic characteristics for contact interface Table 79. Dynamic characteristics for contact interface Symbol Parameter Conditions Min Typ Max Unit Data lines (pins IO, AUX1, AUX2) fdata data rate on data lines - - 1.5 Mbps tr(i) input rise time from VIL maximum to VIH minimum - - 1.2 μs tf(i) input fall time from VIL maximum to VIH minimum - - 1.2 μs tr(o) output rise time CL < = 80 pF; 10 % to 90 % from 0 to VCC - - 0.1 μs tf(o) output fall time CL < = 80 pF; 10 % to 90 % from 0 to VCC - - 0.1 μs tw(pu) pull-up pulse width - 295 - ns Reset output to the card PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 92 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller Symbol Parameter Conditions Min Typ Max Unit tr rise time CL = 100 pF - - 0.1 μs tf fall time CL = 100 pF - - 0.1 μs Clock output to the card (CLK) tr rise time tr rise time tf fall time CL = 30 pF; fCLK = 10 MHz [1] - - 8 ns CL = 30 pF; fCLK = 5 MHz [1] - - 16 ns CL = 30 pF; fCLK = 10 MHz [1] - - 8 ns [1] - - 16 ns 0 - 13.56 MHz 45 - 55 % tf fall time CL = 30 pF; fCLK = 5 MHz fCLK frequency on pin CLK operational [1] δ duty cycle CL = 30 pF SR slew rate rise and fall; CL = 30 pF; VCC = +5 V 0.2 - - V/ns rise and fall; CL = 30 pF; VCC = +3 V 0.12 - - V/ns rise and fall; CL = 30 pF; VCC = +1.8 V 0.072 - - V/ns debounce time on pin PRESN - 6 - ms tact activation time see figure below; T = 25 °C 11 - 22 ms tdeact deactivation time see figure below; T = 25 °C 60 100 250 μs PRESN tdeb Timings [1] The transition time and duty factor definitions are shown in Figure below. tr tf 90% 90% VOH (VOH + VOL) /2 10% 10% t1 VOL t2 fce666 Figure 52. Definition of output and input transition times PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 93 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller 14 Marking 14.1 Marking HVQFN64 Table 80. Marking codes Type number Line Marking code PN7462AUHN Line A 7462AU-00 PN7362AUHN 7362AU-00 PN7360AUHN 7360AU-00 PN7412AUHN 7412AU-00 Common Line B Diffusion Batch ID, Assembly Sequence ID Line C Characters: Diffusion and assembly location, date code, product version (indicated by mask version), product life cycle status. This line includes the following elements at 8 positions: 1. Diffusion center code: Z 2. Assembly center code: S 3. RHF-2006 indicator: D "Dark Green" 4. Year code (Y) 1 5. Year code (Y) 2 6. Week code (W) 1 7. Week code (W) 2 8. HW version Line D Empty Line E Empty 14.1.1 Package marking drawing Terminal 1 index area A B C D E 0 5 aaa-021255 Figure 53. Marking in HVQFN64 PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 94 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller 14.2 Marking VFBGA64 Table 81. Marking codes Type number Line Marking code PN7462AUEV Line A 7462x x: means version number PN7362AUEV 7362x x: means version number PN7360AUEV 7360x x: means version number Common Line B DBID+ASID Diffusion batch, 2 digits + Assembly batch, 2digits Line C ZSDyywwX Manufacturing code including: • Diffusion center code, 1 digit (Z for SSMC) • Assembly center code, 1 digit (S for ATKH) • RoHS compliancy indicator, 1 digit (D: Dark Green; fully compliant RoHS and no halogen and antimony) • Manufacturing year and week, digits: – YY: production year – WW: production week code • Product life cycle status code, 1 digit: – X: means not qualified product – nothing means released product 14.2.1 Package marking drawing terminal 1 index area A:5 B:5 M497 C:8 0 5 aaa-028642 Figure 54. Marking in VFBGA64 PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 95 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller 15 Package outline HVQFN64 HVQFN64: plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm D B SOT804-4 A terminal 1 index area E A A1 c detail X e1 e L1 L 1/2 e v w b 17 32 16 C C A B C y1 C y 33 Et e Es Eh e2 1/2 e 1 terminal 1 index area 48 64 Ds Dh Dt L2 0 2.5 A A1 b c max 1.00 0.05 0.30 nom 0.85 0.02 0.21 0.2 min 0.80 0.00 0.18 mm 5 mm scale Dimensions Unit X 49 D(1) 9.1 9.0 8.9 Dh Ds Dt 5.25 0.19 0.50 5.10 0.14 0.45 4.95 0.09 0.40 E(1) 9.1 9.0 8.9 Eh Es Et e 5.25 0.19 0.50 5.10 0.14 0.45 0.5 4.95 0.09 0.40 e1 e2 7.5 7.5 L L1 L2 0.5 0.4 0.25 0.25 0.3 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. References Outline version IEC JEDEC JEITA SOT804-4 --- --- --- v 0.1 w y 0.05 0.05 y1 0.1 sot804-4_po European projection Issue date 10-05-26 10-05-27 Figure 55. Package outline HVQFN64 PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 96 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller Footprint information for reflow soldering of HVQFN64 package SOT804-4 Hx Gx D P 0.105 0.125 C Ø 0.3 drilled vias (41x) SPx SPy Hy Gy SPy tot SLy By Ay 0.065 0.065 0.065 SPx tot 0.065 SLx X Bx 0.29 Ax 0.24 Recommended stencil thickness: 0.1 mm solder land solder land plus solder paste solder paste deposit solder resist opening detail X occupied area 0.85 0.9 Dimensions in mm P 0.50 Ax Ay 10.00 10.00 Issue date Bx By SLx SLy SPx SPy 8.20 8.20 5.10 5.10 0.70 0.70 SPx tot SPy tot 3.50 3.50 C D Gx Gy 0.90 0.29 9.25 9.25 15-12-15 15-12-22 Hx Hy 10.25 10.25 sot804-4_fr Figure 56. Footprint information for reflow soldering of HVQFN64 PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 97 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller 16 Package outline VFBGA64 Figure 57. Package outline VFBGA64 PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 98 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller 17 Handling information CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling electrostatic sensitive devices. Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or equivalent standards. PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 99 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller 18 Packing information 18.1 Packing information HVQFN64 Moisture Sensitivity Level (MSL) evaluation has been performed according to JEDEC J-STD-020C. MSL for this package is level 3 which means 260 °C Pb-free convection reflow maximum temperature peak. Dry packing is required with following floor conditions: 168 hours out of bag floor life at maximum ambient temperature 30 °C/60 % RH. For information on packing, refer to the PIP relating to this product at http:// www.nxp.com. 18.2 Packing information VFBGA64 Moisture Sensitivity Level (MSL) evaluation has been performed according to JEDEC J-STD-020C. MSL for this package is level 3 which means 260 °C Pb-free convection reflow maximum temperature peak. Dry packing is required with following floor conditions: 168 hours out of bag floor life at maximum ambient temperature 30°C/60 % RH. For information on packing, refer to the PIP relating to this product at http:// www.nxp.com. PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 100 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller 19 Abbreviations Table 82. Abbreviations Acronym Description ADC Analog to Digital Convertor ALM Active Load Modulation ASK Amplitude Shift Keying BPSK Binary Phase Shift Keying CLIF Contactless Interface CRC Cyclic Redundancy Check DPC Dynamic Power Control EEPROM Electrically Erasable Programmable Read-Only Memory GPIO General-Purpose Input Output 2 PN7462_FAM Product data sheet COMPANY PUBLIC I C Inter-Interchanged Circuit IC Integrated Circuit IAP In-Application Programming ISP In-System Programming LDO Low DropOut LPCD Low-Power Card Detection MSL Moisture Sensitivity Level NFC Near Field Communication NRZ Non-Return to Zero NVIC Nested Vectored Interrupt Controller P2P Peer-to-Peer PLL Phase-Locked Loop PLM Passive Load Modulation SPI Serial Peripheral Interface SWD Serial Wire Debug UART Universal Asynchronous Receiver Transmitter USB Universal Serial Bus All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 101 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller 20 Revision history Table 83. Revision history Document ID Release date Data sheet status Change notice Supersedes PN7462_FAM v. 4.6 20200710 Product data sheet - PN7462_FAM v. 4.5 Modifications: • Added note about power supply requirements for the usage of the USB interface in Table 2 "Quick reference data". PN7462_FAM v. 4.5 20200414 Modifications: • Section 8.15.1: Notes added • Figure 35, Figure 36 and Figure 45: updated • Table 23: PVDD_IN removed PN7462_FAM v. 4.4 20190611 Modifications: • Clarified chapter about system tick timer. • Added information about peak current at Transmitter LDO and RF Transmitter. • Added thermal characteristics for Ψj-top. PN7462_FAM v. 4.3 20190124 Modifications: • • • • • PN7462_FAM v. 4.2 20180910 Modifications: • Marking code of HVQFN64 package in Section 14.1 corrected PN7462_FAM v. 4.1 20180628 Modifications: • New type PN7412AUHN added • Combined data sheets PN7462_FAM and PN7462_FAM incl PN7412 PN7462_FAM v. 4.0 20180201 Modifications: • Combined data sheets PN736X and PN7462. • Added description about VFBGA64 package versions. PN736X v. 3.3 20170907 Modifications: • Removed chapter 8.9 "I/O auxiliary - ISO/IEC 7816 UART" which is not available on the product. • Updated Pin description, removed pin fuinctionality INT_AUX , CLK_AUX and IO_AUX • Updated Section 9.5 "Unconnected I/O's", removed description of AUX interface INT_AUX, IO_AUX, CLK_AUX which is not available on the product PN736X v. 3.2 20161213 Modifications: • Product name title and Descriptive title updated • Editorial changes PN746X_736X v.3.1 20160405 Modifications: • Descriptive title updated • Section 1 "General description": updated PN7462_FAM Product data sheet COMPANY PUBLIC Product data sheet Product data sheet Product data sheet - PN7462_FAM v. 4.4 - PN7462_FAM v. 4.3 - PN7462_FAM v. 4.2 Corrected AMR values for: VBUS, VBUSP, VUP_TX and USB_VBUS Added Slew Rates for: VBUS, VUP_TX and VBUSP Added OVP to USB supply example Added diagrams for Power-up sequences Corrected drawing Figure 39, showing the use case where TX_LDO is not used Product data sheet Product data sheet Product data sheet Product data sheet Product data sheet Product data sheet - - - PN7462_FAM v. 4.0 and PN7462_FAM incl PN7412 v.3.0 PN7462 v. 3.2 and PN736X v. 3.3 PN736X v.3.2 - PN746X_736X v.3.1 - PN746X_736X v.3.0 All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 PN7462_FAM v. 4.1 © NXP B.V. 2020. All rights reserved. 102 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller Document ID Release date Data sheet status Change notice Supersedes PN746X_736X v.3.0 20160330 Product data sheet - - PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 103 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller 21 Legal information 21.1 Data sheet status Document status [1][2] Product status [3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] [2] [3] Please consult the most recently issued document before initiating or completing a design. The term 'short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. notice. This document supersedes and replaces all information supplied prior to the publication hereof. 21.2 Definitions Draft — A draft status on a document indicates that the content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included in a draft version of a document and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 21.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without PN7462_FAM Product data sheet COMPANY PUBLIC Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 104 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of nonautomotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. Security — While NXP Semiconductors has implemented advanced security features, all products may be subject to unidentified vulnerabilities. Customers are responsible for the design and operation of their applications and products to reduce the effect of these vulnerabilities on customer’s applications and products, and NXP Semiconductors accepts no liability for any vulnerability that is discovered. Customers should implement appropriate design and operating safeguards to minimize the risks associated with their applications and products. 21.4 Licenses Purchase of NXP ICs with ISO/IEC 14443 type B functionality This NXP Semiconductors IC is ISO/IEC 14443 Type B software enabled and is licensed under Innovatron’s Contactless Card patents license for ISO/IEC 14443 B. RATP/Innovatron Technology The license includes the right to use the IC in systems and/or end-user equipment. Purchase of NXP ICs with NFC technology Purchase of an NXP Semiconductors IC that complies with one of the Near Field Communication (NFC) standards ISO/IEC 18092 and ISO/ IEC 21481 does not convey an implied license under any patent right infringed by implementation of any of those standards. Purchase of NXP Semiconductors IC does not include a license to any NXP patent (or other IP right) covering combinations of those products with other products, whether hardware or software. 21.5 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 2 I C-bus — logo is a trademark of NXP B.V. MIFARE — is a trademark of NXP B.V. ICODE and I-CODE — are trademarks of NXP B.V. MIFARE Classic — is a trademark of NXP B.V. NXP — wordmark and logo are trademarks of NXP B.V. AMBA, Arm, Arm7, Arm7TDMI, Arm9, Arm11, Artisan, big.LITTLE, Cordio, CoreLink, CoreSight, Cortex, DesignStart, DynamIQ, Jazelle, Keil, Mali, Mbed, Mbed Enabled, NEON, POP, RealView, SecurCore, Socrates, Thumb, TrustZone, ULINK, ULINK2, ULINK-ME, ULINK-PLUS, ULINKpro, µVision, Versatile — are trademarks or registered trademarks of Arm Limited (or its subsidiaries) in the US and/or elsewhere. The related technology may be protected by any or all of patents, copyrights, designs and trade secrets. All rights reserved. FeliCa — is a trademark of Sony Corporation. PN7462_FAM Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 105 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller Tables Tab. 1. Tab. 2. Tab. 3. Tab. 4. Tab. 5. Tab. 6. Tab. 7. Tab. 8. Tab. 9. Tab. 10. Tab. 11. Tab. 12. Tab. 13. Tab. 14. Tab. 15. Tab. 16. Tab. 17. Tab. 18. Tab. 19. Tab. 20. Tab. 21. Tab. 22. Tab. 23. Tab. 24. Tab. 25. Tab. 26. Tab. 27. Tab. 28. Tab. 29. Tab. 30. Tab. 31. Tab. 32. Tab. 33. Tab. 34. Tab. 35. Tab. 36. Tab. 37. Tab. 38. Tab. 39. Tab. 40. Tab. 41. Tab. 42. Tab. 43. Comparison of the PN7462 family members ..... 1 Quick reference data .........................................7 Ordering information ..........................................8 Pin description .................................................14 Pin description .................................................17 Interrupt sources ............................................. 25 Pin description for host interface .....................29 HSUART baudrates .........................................29 I2C interface addressing ................................. 30 SPI configuration ............................................. 31 Communication overview for ISO/IEC 14443 type A and read/write mode for MIFARE Classic ............................................................. 37 Communication overview for ISO/IEC 14443 B reader/writer .................................................38 Communication overview for FeliCa reader/ writer ................................................................39 Communication overview for ISO/IEC 15693 reader to label ................................................. 39 Communication overview for ISO/IEC 15693 label to reader ................................................. 40 Communication overview for active communication mode ...................................... 41 Communication overview for passive communication mode ...................................... 42 ISO/IEC14443 A card operation mode ............ 42 Framing and coding overview ......................... 42 Timer characteristics ....................................... 46 Crystal requirements ....................................... 48 SCLDO and DC-to-DC converter modes .........53 Power-up sequence ........................................ 56 Threshold configuration for voltage monitor .... 58 Reset sources ................................................. 60 Power supply connection ................................ 62 Limiting values ................................................ 68 Limiting values for GPIO1 to GPIO12 ............. 68 Limiting values for I2C master pins (i2cm_ sda, i2cm_scl) ................................................. 68 Limiting values for SPI master pins ( spim_ nss, spim_miso, spim_mosi and spi_clk) ........ 68 Limiting values for host interfaces atx_a, atx_b, atx_c, atx_d in all configurations (USB, HSUART, SPI and I2C) ........................ 68 Limiting values for crystal oscillator .................69 Limiting values for power supply ..................... 69 Limiting values for contact interface ................ 69 Protection and limitations for contact interface ...........................................................69 Limiting values for RF interface .......................70 Limiting values for USB interface .................... 70 Operating conditions ....................................... 71 Thermal characteristics ................................... 72 Static characteristics for RST_N input pin ....... 73 Static characteristics for IRQ output pin .......... 73 Static characteristics for DWL_REQ ................73 Static characteristics for GPIO1 to GPIO21 .....74 PN7462_FAM Product data sheet COMPANY PUBLIC Tab. 44. Tab. 45. Tab. 46. Tab. 47. Tab. 48. Tab. 49. Tab. 50. Tab. 51. Tab. 52. Tab. 53. Tab. 54. Tab. 55. Tab. 56. Tab. 57. Tab. 58. Tab. 59. Tab. 60. Tab. 61. Tab. 62. Tab. 63. Tab. 64. Tab. 65. Tab. 66. Tab. 67. Tab. 68. Tab. 69. Tab. 70. Tab. 71. Tab. 72. Tab. 73. Tab. 74. Tab. 75. Tab. 76. Tab. 77. Tab. 78. Tab. 79. Tab. 80. Tab. 81. Tab. 82. Tab. 83. Static characteristics for I2CM_SDA, I2CM_ SCL - S ........................................................... 75 Static characteristics for SPIM_MOSI ............. 75 Static characteristics for SPIM_NSS ............... 75 Static characteristics for SPIM_MISO ............. 75 Static characteristics for SPI_SCLK ................ 76 Static characteristics for ATX_ used as SPI_ NSS, ATX_ used as I2CADR0, ATX_ used as SPI_SCK, ATX_ used as SPI_MOSI .......... 76 Static characteristics of ATX_ used as I2CSDA, ATX_ used as I2CSCL ..................... 76 Static characteristics of ATX_ used as SPIMISO ..........................................................76 USB characteristics ......................................... 77 Static characteristics of HSU_TX and HSU RTS pin ........................................................... 77 Static characteristics of HSU_RX, HSU_ CTS ................................................................. 77 Static characteristics of XTAL pin (XTAL1, XTAL2) ............................................................ 78 Static characteristics for power supply ............ 78 Static characteristics for voltage monitors ....... 80 Static characteristics for power modes ............81 Static characteristics for contact interface ....... 82 Static characteristics for NFC interface ........... 83 Dynamic characteristics for IRQ output pin ..... 83 Dynamic characteristics for flash memory ....... 84 Dynamic characteristics for EEPROM .............84 Dynamic characteristics for GPIO1 to GPIO21 ............................................................85 Timing specification for fast mode plus I2C ..... 85 Timing specification for fast mode I2C ............ 86 Dynamic characteristics and Timing specification for SPI master interface .............. 87 Timing specification for I2C high speed ...........88 Dynamic characteristics for the I2C slave interface: ATX_B used as I2C_SDA, ATX_A used as I2C_SCL ............................................88 Dynamic characteristics for SPI slave interface ...........................................................89 Dynamic characteristics for SPI slave interface: ATX_C as SPI_MISO ...................... 89 Dynamic characteristics for HSUART ATX_ as HSU_TX, ATX_ as HSU_RTS ...................90 Dynamic characteristics for USB interface ...... 90 Dynamic characteristics for internal oscillators .........................................................91 Dynamic characteristics for PLL ......................91 Dynamic characteristics for power supply ....... 91 Dynamic characteristics for boot and reset ......92 Power modes - wake-up timings ..................... 92 Dynamic characteristics for contact interface ...92 Marking codes .................................................94 Marking codes .................................................95 Abbreviations .................................................101 Revision history ............................................. 102 All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 106 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller Figures Fig. 1. Fig. 2. Fig. 3. Fig. 4. Fig. 5. Fig. 6. Fig. 7. Fig. 8. Fig. 9. Fig. 10. Fig. 11. Fig. 12. Fig. 13. Fig. 14. Fig. 15. Fig. 16. Fig. 17. Fig. 18. Fig. 19. Fig. 20. Fig. 21. Fig. 22. Fig. 23. Fig. 24. Fig. 25. Fig. 26. Fig. 27. Fig. 28. Fig. 29. Fig. 30. Block diagram ................................................... 9 Block diagram ................................................. 10 Block diagram ................................................. 11 Block diagram ................................................. 12 Pin configuration PN736X ............................... 13 Pin configuration PN7462 ............................... 13 Pin configuration PN7412 ............................... 13 Pin configuration VFBGA64 (bottom view) ...... 17 Flash memory mapping ...................................20 EEPROM memory mapping ............................ 21 SRAM memory mapping ................................. 21 PN7462 family memory map ...........................23 APB memory map PN736X .............................24 APB memory map PN7462 ............................. 24 APB memory map PN7412 ............................. 25 VDDP(VBUS), supported contact cards classes, and card deactivation ........................ 33 Contact interface - activation sequence .......... 34 Deactivation sequence for contact interface .... 35 Read/write mode for ISO/IEC 14443 type A and read/write mode for MIFARE Classic ....... 37 Data coding and framing according to ISO/ IEC 14443 A card response ............................37 ISO/IEC 14443 B read/write mode communication diagram .................................. 38 FeliCa read/write communication diagram ...... 38 Multiple reception cycles - data format ............ 39 ISO/IEC 15693 read/write mode communication diagram .................................. 39 Data coding according to ISO/IEC 15693 standard mode reader to label ........................ 40 Active communication mode ........................... 41 Passive communication mode .........................41 PN7462 family output driver ............................43 Receiver block diagram ...................................44 Communication in card emulation of NFC passive target ..................................................45 PN7462_FAM Product data sheet COMPANY PUBLIC Fig. 31. Fig. 32. Fig. 33. Fig. 34. Fig. 35. Fig. 36. Fig. 37. Fig. 38. Fig. 39. Fig. 40. Fig. 41. Fig. 42. Fig. 43. Fig. 44. Fig. 45. Fig. 46. Fig. 47. Fig. 48. Fig. 49. Fig. 50. Fig. 51. Fig. 52. Fig. 53. Fig. 54. Fig. 55. Fig. 56. Fig. 57. Clocks and IP overview ...................................48 Crystal oscillator connection ............................48 PN7462 LDOs and power pins overview .........51 PN736X LDOs and power pins overview ........ 54 TX_LDO used ................................................. 56 TX_LDO not used ........................................... 56 Powering up the microcontroller ......................63 Powering up the contactless interface using a single power supply ..................................... 64 Powering up the contactless interface using an external RF transmitter supply ................... 64 Powering up the contact interface ................... 65 Contact interface power supply connection when contact interface is not used ..................65 USB interface on a bus-powered device ......... 66 Connecting the contact interface .....................66 Connection of contact interface when not used .................................................................67 RF interface - example of connection to an antenna ............................................................67 Output timing measurement condition for GPIO ................................................................84 I²C-bus pins clock timing .................................85 SPI master timing ............................................87 I2C-bus pins clock timing ................................ 88 SPI slave timings ............................................ 89 USB interface differential data-to-EOP transition skew and EOP width ....................... 91 Definition of output and input transition times ...93 Marking in HVQFN64 ...................................... 94 Marking in VFBGA64 ...................................... 95 Package outline HVQFN64 ............................. 96 Footprint information for reflow soldering of HVQFN64 ........................................................ 97 Package outline VFBGA64 ............................. 98 All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 107 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller Contents 1 2 2.1 2.2 2.3 2.4 3 4 5 6 6.1 6.2 6.3 6.4 7 7.1 7.2 7.3 7.4 8 8.1 8.2 8.2.1 8.2.1.1 8.2.2 8.2.2.1 8.2.3 8.2.3.1 8.2.4 8.2.5 8.3 8.3.1 8.3.2 8.4 8.4.1 8.4.2 8.4.3 8.5 8.6 8.7 8.7.1 8.7.1.1 8.7.2 8.7.2.1 8.8 8.8.1 8.8.2 8.8.2.1 8.8.3 8.8.3.1 8.8.4 8.8.4.1 8.9 8.9.1 8.9.2 General description ............................................ 1 Features and benefits .........................................3 Integrated contact interface frontend ................. 3 Integrated ISO/IEC 7816-3&4 UART interface ............................................................. 3 Integrated contactless interface frontend ...........3 Cortex-M0 microcontroller ................................. 4 Applications .........................................................6 Quick reference data .......................................... 7 Ordering information .......................................... 8 Block diagram ..................................................... 9 Block diagram PN7462 HVQFN64 .................... 9 Block diagram PN7462 VFBGA64 ...................10 Block diagram PN7412 HVQFN64 .................. 11 Block diagram PN736X ................................... 12 Pinning information .......................................... 13 Pinning HVQFN64 ........................................... 13 Pin description HVQFN64 ............................... 14 Pinning VFBGA64 ............................................17 Pin description VFBGA64 ................................ 17 Functional description ......................................20 Arm Cortex-M0 microcontroller ........................20 Memories ......................................................... 20 On-chip flash programming memory ............... 20 Memory mapping ............................................. 20 EEPROM ......................................................... 21 Memory mapping ............................................. 21 SRAM ...............................................................21 Memory mapping ............................................. 21 ROM .................................................................22 Memory map ....................................................22 Nested Vectored Interrupt Controller (NVIC) ....25 NVIC features .................................................. 25 Interrupt sources ..............................................25 GPIOs .............................................................. 27 GPIO features ..................................................27 GPIO configuration .......................................... 27 GPIO interrupts ................................................27 CRC engine 16/32 bits .................................... 27 Random Number Generator (RNG) ................. 28 Master interfaces ............................................. 28 I2C master interface ........................................ 28 I2C features ..................................................... 28 SPI interface .................................................... 28 SPI features .....................................................28 Host interfaces .................................................29 High-speed UART ............................................29 I2C host interface controller .............................30 I2C host interface features .............................. 30 SPI host/Slave interface .................................. 30 SPI host interface features .............................. 30 USB interface .................................................. 31 Full speed USB device controller .................... 31 Contact interface ............................................. 31 Contact interface features and benefits ........... 32 Voltage supervisor ........................................... 32 PN7462_FAM Product data sheet COMPANY PUBLIC 8.9.3 8.9.4 8.9.5 8.9.6 8.9.7 8.9.8 8.10 8.10.1 8.10.1.1 8.10.1.2 8.10.1.3 8.10.1.4 8.10.1.5 8.10.1.6 8.10.2 8.10.2.1 8.10.2.2 8.10.3 8.10.4 8.10.5 8.10.5.1 8.10.5.2 8.11 8.11.1 8.11.2 8.12 8.13 8.14 8.14.1 8.14.2 8.14.3 8.14.4 8.14.5 8.15 8.15.1 8.15.2 8.15.2.1 8.15.2.2 8.15.2.3 8.15.2.4 8.15.2.5 8.15.2.6 8.15.3 8.15.3.1 8.15.3.2 8.15.3.3 8.15.4 8.15.5 8.15.5.1 8.15.5.2 8.15.5.3 8.15.5.4 8.15.5.5 8.15.6 Clock circuitry .................................................. 33 I/O circuitry ...................................................... 33 VCC regulator ..................................................34 Activation sequence .........................................34 Deactivation sequence .................................... 35 I/O auxiliary - connecting TDA slot extender .... 35 Contactless interface - 13.56 MHz ...................36 RF functionality ................................................ 36 Communication mode for ISO/IEC 14443 type A and for MIFARE Classic .......................36 ISO/IEC14443 B functionality .......................... 38 FeliCa functionality .......................................... 38 ISO/IEC 15693 functionality .............................39 ISO/IEC18000-3 mode 3 functionality ..............40 NFCIP-1 modes ............................................... 40 NFC interface .................................................. 43 Transmitter (TX) .............................................. 43 Receiver (RX) .................................................. 44 Low-Power Card Detection (LPCD) ................. 45 Active Load Modulation (ALM) ........................ 45 Dynamic Power Control (DPC) ........................ 46 RF output control .............................................46 Adaptive Waveform Control (AWC) ................. 46 Timers .............................................................. 46 Features of timer 0 and timer 1 ....................... 46 Features of timer 2 and timer 3 ....................... 47 System tick timer ............................................. 47 Watchdog timer ............................................... 47 Clocks .............................................................. 47 Crystal oscillator (27.12 MHz) ......................... 48 USB PLL ..........................................................49 High Frequency Oscillator (HFO) .................... 49 Low Frequency Oscillator (LFO) ......................49 Clock configuration and clock gating ............... 49 Power management .........................................50 Power supply sources ..................................... 50 PN7462 Power Management Unit (PMU) ........ 50 Main LDO ........................................................ 51 PVDD_LDO ......................................................52 Contact interface - SCLDO LDO ..................... 52 Contact interface DC-to-DC converter ............. 52 VCC LDO .........................................................53 TXLDO ............................................................. 53 PN736X Power Management Unit (PMU) ........53 Main LDO ........................................................ 54 PVDD_LDO ......................................................54 TXLDO ............................................................. 55 Power-up sequence .........................................56 Power modes ...................................................56 Active mode .....................................................57 Standby mode ................................................. 57 Suspend mode ................................................ 57 Wake-up from standby mode and suspend mode ................................................................ 58 Hard Power-Down (HPD) mode ...................... 58 Voltage monitoring ...........................................58 All information provided in this document is subject to legal disclaimers. Rev. 4.6 — 10 July 2020 406346 © NXP B.V. 2020. All rights reserved. 108 / 109 PN7462 family NXP Semiconductors NFC Cortex-M0 microcontroller 8.15.6.1 VBUS monitor ..................................................59 8.15.6.2 VBUSP monitor ............................................... 59 8.15.6.3 PVDD LDO supply monitor ..............................59 8.15.7 Temperature sensor ........................................ 59 8.16 System control .................................................59 8.16.1 Reset ................................................................60 8.16.2 Brown-Out Detection (BOD) ............................ 60 8.16.3 APB interface and AHB-Lite ............................ 60 8.16.4 External interrupts ............................................60 8.17 SWD debug interface ...................................... 60 8.17.1 SWD interface features ................................... 61 9 Application design-in information ................... 62 9.1 Power supply connection .................................62 9.1.1 Powering up the microcontroller ...................... 63 9.1.2 Powering up the contactless interface ............. 63 9.1.3 Powering up the contact interface ................... 65 9.2 Connecting the USB interface ......................... 66 9.3 Connecting the contact interface ..................... 66 9.4 Connecting the RF interface ............................67 9.5 Unconnected I/Os ............................................ 67 10 Limiting values .................................................. 68 11 Recommended operating conditions .............. 71 12 Thermal characteristics ....................................72 13 Characteristics .................................................. 73 13.1 Static characteristics ........................................73 13.1.1 GPIO static characteristics .............................. 74 13.1.2 Static characteristics for I2C master ................ 75 13.1.3 Static characteristics for SPI master ................75 13.1.4 Static characteristics for host interface ............ 76 13.1.5 Clock static characteristics .............................. 78 13.1.6 Static characteristics - power supply ............... 78 13.1.7 Static characteristics for power modes ............ 81 13.1.8 Static characteristics for contact interface ........82 13.1.9 Static characteristics NFC interface .................83 13.2 Dynamic characteristics ...................................83 13.2.1 Flash memory dynamic characteristics ............84 13.2.2 EEPROM dynamic characteristics ................... 84 13.2.3 GPIO dynamic characteristics ......................... 84 13.2.4 Dynamic characteristics for I2C master ........... 85 13.2.5 Dynamic characteristics for SPI .......................87 13.2.6 Dynamic characteristics of host interface ........ 88 13.2.7 Clock dynamic characteristics ......................... 91 13.2.8 Dynamic characteristics for power supply ........91 13.2.9 Dynamic characteristics for boot and reset ...... 92 13.2.10 Dynamics characteristics for power mode ....... 92 13.2.11 Dynamic characteristics for contact interface ... 92 14 Marking ...............................................................94 14.1 Marking HVQFN64 .......................................... 94 14.1.1 Package marking drawing ............................... 94 14.2 Marking VFBGA64 ...........................................95 14.2.1 Package marking drawing ............................... 95 15 Package outline HVQFN64 ............................... 96 16 Package outline VFBGA64 ............................... 98 17 Handling information ........................................ 99 18 Packing information ........................................100 18.1 Packing information HVQFN64 ......................100 18.2 19 20 21 Packing information VFBGA64 ...................... 100 Abbreviations .................................................. 101 Revision history .............................................. 102 Legal information ............................................ 104 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section 'Legal information'. © NXP B.V. 2020. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 10 July 2020 Document identifier: PN7462_FAM Document number: 406346