PTN3700EV/G,118

PTN3700 1.8 V simple mobile interface link bridge IC Rev. 3 — 12 October 2011 Product data sheet 1. General description The PTN3700 is a 1.8 V simple mobile interface link bridge IC which can function both as a transmitter-serializer or a receiver-deserializer for RGB888 video data. When configured as transmitter (using input pin TX/RX), the PTN3700 serializes parallel CMOS video input data into 1, 2 or 3 subLVDS-based high-speed serial data channels. When configured as receiver, the PTN3700 deserializes up to 3 high-speed serial data channels into parallel CMOS video data signals. The parallel interface of the PTN3700 is based on the conventional and widely used 24-bit wide data bus for RGB video data, plus active LOW HS (Horizontal Synchronization) and VS (Vertical Synchronization) signals, and an active HIGH DE (Data Enable) signal. An additional two auxiliary bits A[1:0] are provided to permit signaling of miscellaneous status or mode information across the link to the display. The serial interface link of the PTN3700 is based on the open Simple Mobile Interface Link (SMILi) definition. In order to keep power low while accommodating various display sizes (e.g., up to 24-bit, 60 frames per second XVGA), the number of high-speed serial channels (‘lanes’) is configurable from 1 to 3 depending on the bandwidth needed. The data link speed is determined by the PCLK (Pixel Clock) rate and the number of serial channels selected. In order to maintain a low power profile, the PTN3700 has three power modes, determined by detection of an active input clock and by shutdown pin XSD. In Shutdown mode (XSD = LOW), the PTN3700 is completely inactive and consumes a minimum of current. In Standby mode (XSD = HIGH), the device is ready to switch to Active mode as soon as an active input clock signal is detected, and assume normal link operation. In Transmitter mode, the PTN3700 performs parity calculation on the input data (R[7:0], G[7:0], B[7:0] plus HS, VS and DE data bits) and adds an odd parity bit CP to the serial transmitted data stream. The PTN3700 in Receiver mode also integrates a parity checking function, which checks for odd parity across the decoded input word (R[7:0], G[7:0], B[7:0] plus HS, VS and DE data bits), and indicates whether a parity error has occurred on its CPO out pin (active HIGH). When a parity error occurs, the most recent error-free pixel data will be output instead of the received invalid pixel data. PTN3700 in Receiver mode offers an optional advanced frame mixing feature, which allows 18-bit displays to effectively display 24-bit color resolution by applying a patent-pending pixel data processing algorithm to the 24-bit video input data. One of two serial transmission methods is selectable: pseudo source synchronous transmission based on the pixel clock, or true source synchronous transmission based on the bit clock. The latter uses a patent-pending methodology characterized by zero overhead and operation guaranteed free from false pixel synchronization. PTN3700 NXP Semiconductors 1.8 V simple mobile interface link bridge IC The PTN3700 automatically rotates the order of the essential signals (parallel CMOS and high-speed serial data and clock) depending on whether it is operating as transmitter or as receiver (using pin TX/RX). In addition, two Pinning Select bits (inputs PSEL[1:0]) allow for four additional signal order configurations. This allows for various topologies of printed circuit board or flex foil layout without crossing of traces, and enables the easy introduction of PTN3700 into an existing ‘parallel’ design avoiding board re-layout. The PTN3700 is available in a 56-ball VFBGA package and operates across a temperature range of 40 C to +85 C. 2. Features and benefits  Configurable as either Transmitter or Receiver  One of two serial transmission methods selectable (pixel clock referenced pseudo source synchronous or bit clock referenced true source synchronous)  3 differential subLVDS high-speed serial lanes  One differential pixel clock  Configurable aggregate data bandwidth allowing up to 24-bit color, 60 fps XGA:  1 lane at 30 serialization rate up to 650 Mbit/s  2 lanes at 15 serialization rate up to 1300 Mbit/s  3 lanes at 10 serialization rate up to 1.95 Gbit/s  Parity encoding (transmitter) and detection (receiver) with last valid pixel repetition  Advanced Frame Mixing function (in Receiver mode) for 24-bit color depth using conventional 18-bit displays or specially adapted ‘18-bit plus’ displays  Parallel CMOS I/O based on interface definition of RGB888 plus HS, VS, DE  Very low power profile:  Shutdown mode for minimum idle power (< 3 A typical)  Low-power Standby mode with input clock frequency auto-detect (< 3 A typical)  Low active transmitter power: 18 mW (typ.) for QVGA1 and 40 mW (typ.) for WVGA2  Low active receiver power: 15 mW (typ.) for QVGA and 36 mW (typ.) for WVGA  Slew rate control on receiver parallel CMOS outputs  Operates from a single 1.8 V  150 mV power supply  Configurable mirroring pinout (dependent on Tx or Rx mode and PSEL[1:0] inputs) for optimum single layer flex-foil flow-through in various application scenarios  Available in 56-ball VFBGA package 3. Applications  High-resolution mobile phones  Portable applications with video display capability 1. QVGA: 240  320 pixels at 60 Hz frame rate; 20 % non-active display data overhead; PCLK at 5.5 MHz; one-lane operation at 166 Mbit/s; 24-bit color data. 2. WVGA: 854  480 pixels at 60 Hz frame rate; 20 % non-active display data overhead; PCLK at 29.5 MHz; two-lane operation at 885.4 Mbit/s; 24-bit color data. PTN3700 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 12 October 2011 © NXP B.V. 2011. All rights reserved. 2 of 43 PTN3700 NXP Semiconductors 1.8 V simple mobile interface link bridge IC 4. Ordering information Table 1. Ordering information Type number Solder process Package Name PTN3700EV/G [1] Description Version Pb-free (SnAgCu VFBGA56 plastic very thin fine-pitch ball grid array package; solder ball compound) 56 balls; body 4  4.5  0.65 mm[1] SOT991-1 0.5 mm ball pitch; 1.0 mm maximum package height. 4.1 Ordering options Table 2. Ordering options Type number Topside mark Temperature range PTN3700EV/G 3700 40 C to +85 C 5. Functional diagram VDD VDDA PTN3700 R[7:0] G[7:0] B[7:0] 8 D0+ 8 D0− 8 INPUT REGISTER HS PROTOCOL MAPPING, PARITY ENCODING, SYNC WORD ENCODING D1+ SERIALIZER D1− VS DE A[1:0] D2+ 2 D2− N × PCLK PCLK PLL ÷2 1 × PCLK 1 CLK+ CLK− 0 FSS FSS CONFIGURATION AND POWER MANAGEMENT XSD LS[1:0] PSEL[1:0] 2 2 002aab363 TX/RX = HIGH GND Fig 1. PTN3700 Product data sheet GNDA Functional diagram of PTN3700 in Transmitter mode All information provided in this document is subject to legal disclaimers. Rev. 3 — 12 October 2011 © NXP B.V. 2011. All rights reserved. 3 of 43 PTN3700 NXP Semiconductors 1.8 V simple mobile interface link bridge IC VDD VDDA PTN3700 D0+ 8 8 D0− D1+ DESERIALIZER D1− PROTOCOL PARSING, PARITY DETECTION, ADVANCED FRAME MIXING, SYNC WORD DECODING 8 OUTPUT REGISTER R[7:0] G[7:0] B[7:0] HS VS DE D2+ 2 D2− A[1:0] N × PCLK CLK+ 0 PLL PCLK 1 CLK− DDR → SDR CPO FSS FM FSS F/XS CONFIGURATION AND POWER MANAGEMENT XSD LS[1:0] PSEL[1:0] 2 2 002aab364 TX/RX = LOW GND Fig 2. PTN3700 Product data sheet GNDA Functional diagram of PTN3700 in Receiver mode All information provided in this document is subject to legal disclaimers. Rev. 3 — 12 October 2011 © NXP B.V. 2011. All rights reserved. 4 of 43 PTN3700 NXP Semiconductors 1.8 V simple mobile interface link bridge IC 6. Pinning information 6.1 Pinning ball A1 index area PTN3700EV/G 1 2 3 4 5 6 7 A B C D E F G H 002aac377 Transparent top view Fig 3. Ball configuration for VFBGA56 1 2 3 4 5 6 7 1 2 3 4 5 6 7 A D2+ VDDA DE HS B0 B2 B4 A D2+ VDDA DE HS R7 R5 R3 B D2− GNDA VS PCLK B1 B3 B5 B D2− GNDA VS PCLK R6 R4 R2 C D1+ TX/RX A1 GND VDD B6 B7 C D1+ TX/RX A1 GND VDD R1 R0 D D1− VDD PSEL0 LS0 FM G0 G1 D D1− VDD PSEL0 LS0 FM G7 G6 E CLK+ GND PSEL1 LS1 FSS G2 G3 E CLK+ GND PSEL1 LS1 FSS G5 G4 F CLK− F/XS A0 GND VDD G4 G5 F CLK− F/XS A0 GND VDD G3 G2 G D0+ XSD R6 R4 R2 R0 G6 G D0+ XSD B1 B3 B5 B7 G1 H D0− CPO R7 R5 R3 R1 G7 H D0− CPO B0 B2 B4 B6 002aac378 56-ball, 7  8 grid; transparent top view Fig 4. 56-ball, 7  8 grid; transparent top view VFBGA56 ball mapping - Transmitter mode (TX/RX = HIGH); PSEL[1:0] = 00b 1 2 3 G0 002aac379 4 5 6 7 Fig 5. VFBGA56 ball mapping - Transmitter mode (TX/RX = HIGH); PSEL[1:0] = 01b 1 2 3 4 5 6 7 A D0− VDDA DE HS B0 B2 B4 A D0− VDDA DE HS R7 R5 R3 B D0+ GNDA VS PCLK B1 B3 B5 B D0+ GNDA VS PCLK R6 R4 R2 C CLK− TX/RX A1 GND VDD B6 B7 C CLK− TX/RX A1 GND VDD R1 R0 D CLK+ VDD PSEL0 LS0 FM G0 G1 D CLK+ VDD PSEL0 LS0 FM G7 G6 E D1− GND PSEL1 LS1 FSS G2 G3 E D1− GND PSEL1 LS1 FSS G5 G4 F D1+ F/XS A0 GND VDD G4 G5 F D1+ F/XS A0 GND VDD G3 G2 G1 G D2− XSD R6 R4 R2 R0 G6 G D2− XSD B1 B3 B5 B7 H D2+ CPO R7 R5 R3 R1 G7 H D2+ CPO B0 B2 B4 B6 002aac380 56-ball, 7  8 grid; transparent top view Fig 6. 56-ball, 7  8 grid; transparent top view VFBGA56 ball mapping - Transmitter mode (TX/RX = HIGH); PSEL[1:0] = 10b PTN3700 Product data sheet G0 002aac381 Fig 7. VFBGA56 ball mapping - Transmitter mode (TX/RX = HIGH); PSEL[1:0] = 11b All information provided in this document is subject to legal disclaimers. Rev. 3 — 12 October 2011 © NXP B.V. 2011. All rights reserved. 5 of 43 PTN3700 NXP Semiconductors 1.8 V simple mobile interface link bridge IC A 1 2 3 4 5 6 7 D2+ VDDA R7 R5 R3 R1 G7 A 1 2 3 4 5 6 7 D2+ VDDA B0 B2 B4 B6 G0 B D2− GNDA R6 R4 R2 R0 G6 B D2− GNDA B1 B3 B5 B7 G1 C D1+ TX/RX A1 GND VDD G5 G4 C D1+ TX/RX A1 GND VDD G2 G3 D D1− VDD PSEL0 LS0 FM G3 G2 D D1− VDD PSEL0 LS0 FM G4 G5 E CLK+ GND PSEL1 LS1 FSS G1 G0 E CLK+ GND PSEL1 LS1 FSS G6 G7 F CLK− F/XS A0 GND VDD B7 B6 F CLK− F/XS A0 GND VDD R0 R1 G D0+ XSD VS PCLK B1 B3 B5 G D0+ XSD VS PCLK R6 R4 R2 H D0− CPO DE HS B0 B2 B4 H D0− CPO DE HS R7 R5 R3 002aac382 002aac383 56-ball, 7  8 grid; transparent top view Fig 8. A 56-ball, 7  8 grid; transparent top view VFBGA56 ball mapping - Receiver mode (TX/RX = LOW); PSEL[1:0] = 00b 1 2 3 4 5 6 7 D0− VDDA R7 R5 R3 R1 G7 Fig 9. A VFBGA56 ball mapping - Receiver mode (TX/RX = LOW); PSEL[1:0] = 01b 1 2 3 4 5 6 7 D0− VDDA B0 B2 B4 B6 G0 B D0+ GNDA R6 R4 R2 R0 G6 B D0+ GNDA B1 B3 B5 B7 G1 C CLK− TX/RX A1 GND VDD G5 G4 C CLK− TX/RX A1 GND VDD G2 G3 D CLK+ VDD PSEL0 LS0 FM G3 G2 D CLK+ VDD PSEL0 LS0 FM G4 G5 E D1− GND PSEL1 LS1 FSS G1 G0 E D1− GND PSEL1 LS1 FSS G6 G7 F D1+ F/XS A0 GND VDD B7 B6 F D1+ F/XS A0 GND VDD R0 R1 G D2− XSD VS PCLK B1 B3 B5 G D2− XSD VS PCLK R6 R4 R2 H D2+ CPO DE HS B0 B2 B4 H D2+ CPO DE HS R7 R5 R3 002aac384 002aac385 56-ball, 7  8 grid; transparent top view 56-ball, 7  8 grid; transparent top view Fig 10. VFBGA56 ball mapping - Receiver mode (TX/RX = LOW); PSEL[1:0] = 10b Fig 11. VFBGA56 ball mapping - Receiver mode (TX/RX = LOW); PSEL[1:0] = 11b PTN3700 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 12 October 2011 © NXP B.V. 2011. All rights reserved. 6 of 43 PTN3700 NXP Semiconductors 1.8 V simple mobile interface link bridge IC 6.2 Pin description Table 3. Pin description - Transmitter mode Symbol Pin[1] Type Description R[7:0], G[7:0], B[7:0] CMOS 8-bit wide R, G, B pixel data inputs HS CMOS Horizontal synchronization data input, active LOW VS CMOS Vertical synchronization data input, active LOW DE CMOS Data Enable input, active HIGH A0, A1 CMOS Auxiliary input bits D0+, D0, D1+, D1, D2+, D2 SubLVDS driver Serialized high-speed differential subLVDS data outputs CLK+, CLK SubLVDS driver Serialized high-speed differential subLVDS clock outputs CMOS Pixel clock reference input TX/RX CMOS Transmitter/Receiver configuration input pin. When HIGH, PTN3700 is configured as transmitter. LS0, LS1 CMOS Serialization mode program pins. Select between 1, 2 or 3 lanes. See Table 5. PSEL0, PSEL1 CMOS Pin mirroring select pins. See Table 6 and Table 7 XSD CMOS Shutdown mode input pin, active LOW, puts PTN3700 in lowest-power mode by deactivating all circuitry. When HIGH, PTN3700 is either in Active mode or awaiting clock input (Standby mode) FSS CMOS Fully Source Synchronous select pin. When LOW, PTN3700 uses pseudo source synchronous serial transmission mode with the pixel clock as both the reference frequency and the frame boundary delineation. When HIGH, PTN3700 uses true source synchronous transmission with a serial Double Data Rate (DDR) bit clock for the serial data. Embedded synchronization words are encoded for pixel synchronization. On both Receiver and Transmitter, the settings of the FSS pin should match. Otherwise the link will not function. VDD power power supply voltage VDDA power analog (PLL) power supply voltage GNDA ground analog (PLL) ground GND ground ground CMOS Signals are inactive in Transmitter mode and should be tied down to GND. Parallel data inputs High-speed serial outputs Clock inputs PCLK Configuration inputs Power supply Miscellaneous CPO, FM, F/XS [1] Depends on configuration. PTN3700 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 12 October 2011 © NXP B.V. 2011. All rights reserved. 7 of 43 PTN3700 NXP Semiconductors 1.8 V simple mobile interface link bridge IC Table 4. Pin description - Receiver mode Symbol Pin[1] Type Description R[7:0], G[7:0], B[7:0] CMOS 8-bit wide R, G, B pixel data outputs HS CMOS Horizontal synchronization data output, active LOW VS CMOS Vertical synchronization data output, active LOW DE CMOS Data Enable output, active HIGH A0, A1 CMOS Auxiliary output bits Parallel data outputs High-speed serial inputs D0+, D0, D1+, D1, D2+, D2 SubLVDS Serialized high-speed differential subLVDS data inputs receiver CLK+, CLK SubLVDS Serialized high-speed differential subLVDS clock inputs receiver Clock outputs PCLK CMOS Pixel clock output TX/RX CMOS Transmitter/Receiver configuration input pin. When LOW, PTN3700 is configured as receiver. LS0, LS1 CMOS Serialization mode program pins. Select between 1, 2 or 3 lanes. See Table 5. Configuration inputs PSEL0, PSEL1 CMOS Pin mirroring select pins. See Table 6 and Table 7. XSD CMOS Shutdown mode input pin, active LOW, puts PTN3700 in lowest-power mode by deactivating all circuitry. When HIGH, PTN3700 is either in Active mode or awaiting clock input (Standby mode). F/XS CMOS Program pin for fast (F/XS = HIGH) or slow (F/XS = LOW) parallel output and PCLK slew rate FM CMOS Frame Mixing select pin. When LOW, Frame Mixing is disabled and PTN3700 passes 24-bit video data transparently. When HIGH, Frame Mixing is enabled and PTN3700 applies processing to the 24-bit video data resulting in 18-bit output data words encoded with 24-bit color depth. Frame Mixing is only available in Receiver mode. FSS CMOS Fully Source Synchronous select pin. When LOW, PTN3700 uses pseudo source synchronous serial reception mode with the pixel clock as both the reference frequency and the frame boundary delineation. When HIGH, PTN3700 uses true source synchronous reception with embedded synchronization word decoding, with the bit clock as reference frequency. On both Receiver and Transmitter, the settings of the FSS pin should match. Otherwise the link will not function. CMOS Parity error output, active HIGH. A HIGH level indicates a parity error was detected in the current pixel data Parity output CPO Power supply VDD power supply voltage VDDA analog (PLL) power supply voltage GNDA analog (PLL) ground GND ground [1] Depends on configuration. PTN3700 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 12 October 2011 © NXP B.V. 2011. All rights reserved. 8 of 43 PTN3700 NXP Semiconductors 1.8 V simple mobile interface link bridge IC 7. Functional description 7.1 General A complete simple mobile interface link consists of one PTN3700 configured as transmitter (see Figure 1); two, three or four differential-pair high-speed signaling channels; and one PTN3700 configured as receiver (see Figure 2). Link power and ground are supplied to pins VDD and GND respectively (power and ground should be routed and decoupled to analog supply pin VDDA and ground pin GNDA separately for lowest jitter operation). Configuration of either transmitter or receiver mode is achieved by strapping the CMOS input pin TX/RX HIGH or LOW, respectively. Configured as transmitter, PTN3700 accepts parallel CMOS input data including color pixel data (R[7:0], G[7:0], B[7:0]), three control bits HS (horizontal synchronization), VS (vertical synchronization), DE (data enable), auxiliary bits A[1:0] and pixel clock PCLK. The PTN3700 calculates a parity bit (excluding the auxiliary bits, see Section 7.6) and serializes the data and outputs as a high-speed serial data stream on up to three subLVDS differential outputs (D0+, D0, D1+, D1, D2+, D2) depending on the serialization mode selected by pins LS[1:0] (see Section 7.2). An integrated low-jitter PLL generates internally the bit clock used for serialization of video input data, parity bit and control bits, and outputs along with the serial output data a differential pixel clock on differential subLVDS output pair CLK+ and CLK. Configured as receiver, PTN3700 accepts serial differential data inputs D0+, D0, D1+, D1, D2+, D2 and differential input clock CLK+ and CLK from the signaling channel and deserializes the received data into parallel output data on pins R[7:0], G[7:0], B[7:0], HS, VS, DE and A[1:0] along with the PLL-regenerated pixel clock PCLK. Also, a parity checking function is performed on the incoming R[7:0], G[7:0], B[7:0], HS, VS, DE bits and an error flagged by signaling a HIGH state on CMOS output pin CPO (see Section 7.6). Serialization mode pins LS[1:0] need to be selected according to the expected serialization mode (see Section 7.2) to correctly receive and decode the up to three subLVDS differential serial inputs. To minimize EMI, the parallel outputs can be configured by tying pin F/XS either HIGH or LOW to output fast or slow output slew rates respectively. The PTN3700 is capable of operating in either of two distinct transmission modes: Pseudo Source Synchronous mode (PSS), and Full (or ‘true’) Source Synchronous mode (FSS), selected by CMOS input pin FSS. In PSS mode, the pixel clock PCLK is used both as the transmission frequency reference and its rising edge as the delineation of the start of a pixel. This transmission mode relies on the Receiver PLL to reconstruct the bit clock at the receiving end. In FSS mode, the bit clock is transmitted (in DDR mode) instead of the pixel clock. Rather than achieve frame boundary detection using the pixel clock edge as in PSS mode, in FSS mode the Transmitter encodes ‘synchronization words’ over the link which are detected and used for data to pixel alignment by the Receiver. This methodology guarantees false-synchronization-free transmission with zero protocol overhead. The PTN3700 can be put into very low ‘Shutdown’ power state by tying CMOS input pin XSD LOW. Additionally, the PTN3700 will automatically enter a low-power ‘Standby’ mode when no active input clock is detected on its inputs (see Section 7.5). PTN3700 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 12 October 2011 © NXP B.V. 2011. All rights reserved. 9 of 43 PTN3700 NXP Semiconductors 1.8 V simple mobile interface link bridge IC 7.2 Link programmability The number of high-speed serial channels used is programmed by CMOS input pins LS[1:0]. For a given link consisting of a transmitter and receiver pair of PTN3700’s, the number of channels used must be programmed identically or the link will malfunction. The PTN3700, once programmed, will assume the corresponding serialization ratio as shown in Table 5. When pins LS[1:0] are both HIGH, the PTN3700 is put in a test mode which is used for production testing purposes only and should not be used in application. The 1-lane mode is typically meant for smaller video display formats (e.g., QVGA to HVGA), while the 2-lane mode is typically used for display formats like HVGA and VGA. The 3-lane mode supports larger display formats such as VGA or XGA. Please see Section 12.1 for more information. Table 5. Link programmability LS1 LS0 L L L H H [1] Number of high-speed serial channels Supported PCLK frequency range (MHz) Guaranteed data bandwidth per channel (Mbit/s) Guaranteed aggregate link bandwidth (Mbit/s) 00 1 4.0 to 21.6 120 to 650 650 H 01 2 8.0 to 43.3 120 to 650 1300 L 10 3 20.0 to 65.0 200 to 650 1950 11 reserved[1] reserved reserved reserved H Mode Mode 11 is used for test purposes only. 7.3 Versatile signal mirroring programmability In order to provide flexibility for different signal order and flow requirements in different applications, the PTN3700 can be programmed to mirror its signal order for the parallel and serial I/Os independently using the PSEL[1:0] inputs. The signal order also changes as a function of the TX/RX input by mirroring signals in such a way that the Transmitter and Receiver in a given link can be connected without signal crossings by simply opposing the two instances of PTN3700 and rotating one of them by 180 degrees. The truth table for the versatile signal mirroring scheme is shown in Table 6 and Table 7. The individual ball mappings are given in Figure 4 through Figure 11. PTN3700 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 12 October 2011 © NXP B.V. 2011. All rights reserved. 10 of 43 PTN3700 NXP Semiconductors 1.8 V simple mobile interface link bridge IC Table 6. Versatile signal mirroring programmability - Parallel I/O Ball location[1] TX/RX L H PSEL0 L H (Receive mode) H3 Product data sheet H (Transmit mode) DE R7 B0 G3 VS VS R6 B1 H4 HS HS R5 B2 G4 PCLK PCLK R4 B3 H5 B0 R7 R3 B4 G5 B1 R6 R2 B5 H6 B2 R5 R1 B6 G6 B3 R4 R0 B7 H7 B4 R3 G7 G0 G7 B5 R2 G6 G1 F7 B6 R1 G5 G2 F6 B7 R0 G4 G3 E7 G0 G7 G3 G4 E6 G1 G6 G2 G5 D7 G2 G5 G1 G6 D6 G3 G4 G0 G7 C7 G4 G3 B7 R0 C6 G5 G2 B6 R1 B7 G6 G1 B5 R2 A7 G7 G0 B4 R3 B6 R0 B7 B3 R4 A6 R1 B6 B2 R5 B5 R2 B5 B1 R6 A5 R3 B4 B0 R7 B4 R4 B3 PCLK PCLK A4 R5 B2 HS HS B3 R6 B1 VS VS A3 R7 B0 DE DE [1] PTN3700 DE L For PTN3700EV/G VFBGA56 package option. See also Figure 4 through Figure 11. All information provided in this document is subject to legal disclaimers. Rev. 3 — 12 October 2011 © NXP B.V. 2011. All rights reserved. 11 of 43 PTN3700 NXP Semiconductors 1.8 V simple mobile interface link bridge IC Table 7. Versatile signal mirroring programmability - Serial I/O Ball location[1] PSEL1 L H A1 D2+ D0 B1 D2 D0+ C1 D1+ CLK- D1 D1 CLK+ E1 CLK+ D1 F1 CLK D1+ G1 D0+ D2 H1 D0 D2+ [1] For PTN3700EV/G VFBGA56 package option. See also Figure 4 through Figure 11. 7.4 High-speed data channel protocol options The PTN3700 maps the transmission protocol in accordance with the serialization mode selected by pins LS[1:0]. In Mode 00 (1-channel), all RGB, parity and synchronization bits are serialized onto a single 30-bit sequence. In Mode 01 (2-channel), these bits are mapped onto two simultaneous 15-bit sequences divided across two lanes. In Mode 10 (3-channel), the 30 bits are serialized onto three simultaneous 10-bit sequences. The serial bit mapping is different between pseudo-source-synchronous mode (FSS = LOW) and fully source-synchronous mode (FSS = HIGH). The mapping of the data bits in pseudo-source synchronous mode is shown in Figure 12, Figure 13 and Figure 14. (Note that the CLK in Mode 01 has an asymmetrical duty cycle of 8/15). The serial bit mapping in fully source-synchronous mode is shown in Figure 15, Figure 16 and Figure 17. Note that the fully source synchronous transmission mode is not dependent on the phase of PCLK for receiver synchronization. PTN3700 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 12 October 2011 © NXP B.V. 2011. All rights reserved. 12 of 43 PTN3700 NXP Semiconductors 1.8 V simple mobile interface link bridge IC 7.4.1 Serial protocol bit mapping - pseudo source synchronous mode (FSS = LOW) D0 (differential) R7 R6 R1 R0 G7 G6 G1 G0 B7 B6 B1 B0 VS HS DE A1 A0 CP R7 CLK (differential) 1 / fo(PCLK) or 1 / fi(PCLK) 002aac862 Fig 12. Mode 00 - single serial data channel mode (FSS = LOW) D0 (differential) R7 R6 R5 R4 R3 R2 R1 R0 G7 G6 G5 G4 VS A0 CP R7 R6 D1 (differential) G3 G2 G1 G0 B7 B6 B5 B4 B3 B2 B1 B0 HS DE A1 G3 G2 CLK (differential) 1 / fo(PCLK) or 1 / fi(PCLK) 002aac863 Fig 13. Mode 01 - dual serial data channel mode (FSS = LOW) D0 (differential) R7 R6 R5 R4 R3 R2 R1 R0 VS CP R7 R6 D1 (differential) G7 G6 G5 G4 G3 G2 G1 G0 HS A0 G7 G6 D2 (differential) B7 B6 B5 B4 B3 B2 B1 B0 DE A1 B7 B6 CLK (differential) 1 / fo(PCLK) or 1 / fi(PCLK) 002aac864 Fig 14. Mode 10 - triple serial data channel mode (FSS = LOW) PTN3700 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 12 October 2011 © NXP B.V. 2011. All rights reserved. 13 of 43 PTN3700 NXP Semiconductors 1.8 V simple mobile interface link bridge IC 7.4.2 Serial protocol bit mapping - fully source synchronous mode (FSS = HIGH) D0 (differential) DE HS VS R0 R1 R7 G0 G1 G7 B0 B1 B5 A0 A1 B6 B7 CP DE CLK (differential) 1 / fo(PCLK) or 1 / fi(PCLK) 002aac871 Fig 15. Mode 00 - single serial data channel mode (FSS = HIGH) D0 (differential) DE HS VS R0 R1 R2 R3 R4 R5 R6 R7 G0 G1 G2 G3 DE D1 (differential) G4 G5 G6 G7 B0 B1 B2 B3 B4 B5 A0 A1 B6 B7 CP G4 CLK (differential) 1 / fo(PCLK) or 1 / fi(PCLK) 002aac872 Fig 16. Mode 01 - dual serial data channel mode (FSS = HIGH) D0 (differential) DE HS VS R0 R1 R2 R3 R4 R5 R6 DE D1 (differential) R7 G0 G1 G2 G3 G4 G5 G6 G7 B0 R7 D2 (differential) B1 B2 B3 B4 B5 A0 A1 B6 B7 CP B1 CLK (differential) 1 / fo(PCLK) or 1 / fi(PCLK) 002aac873 Fig 17. Mode 10 - triple serial data channel mode (FSS = HIGH) PTN3700 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 12 October 2011 © NXP B.V. 2011. All rights reserved. 14 of 43 PTN3700 NXP Semiconductors 1.8 V simple mobile interface link bridge IC 7.4.3 PLL, PCLK, CLK and pixel synchronization 7.4.3.1 Pixel synchronization PSS mode: The serial clock CLK provides the word boundaries explicitly for frame synchronization. At the receiver side, a PLL is needed to re-generate the bit clock, translating to a higher receiver power dissipation. FSS mode: The serial clock CLK is truly synchronous with the serial data. Embedded synchronization words are transmitted in the non-active display area for pixel synchronization. The receiver PLL is powered down during this mode, hence the lower power consumption when compared with PSS mode. The special embedded synchronization words are guaranteed by design to never trigger false synchronization. 7.4.3.2 PLL The PLL locks onto the PCLK input during transmit mode or the CLK input during receiver mode. It generates an internal high-speed clock, which is phase-aligned to the input clock. The PLL logic uses the lane select and transmit/receive status to determine the necessary PLL bandwidth settings and PLL divider values automatically. The PLL is able to track spread spectrum clocking to reduce EMI. The spread spectrum clock modulation frequency can be from 30 kHz to 33 kHz. Transmitter: The internally generated clock is always aligned to the input clock PCLK. • PSS mode: Refer to Section 7.4.1. • FSS mode: The output clock CLK is Double Data Rate (DDR) and both clock edges are aligned to the data output. Receiver: • PSS mode: The PLL generates an internal clock at serial bit frequency and locks to the input clock CLK. • FSS mode: The receiver uses Double Data Rate (DDR) input clock CLK, which is aligned to the data already. 7.4.4 HS, VS and DE signal usage in various PTN3700 modes When frame mixing is not used in PSS mode, VS, HS, DE, R[7:0], G[7:0], B[7:0] are treated as arbitrary user data. In this mode, PTN3700 functions as a pure serializer and deserializer, and is unaware of the meaning or polarity of VS, HS, DE, R[7:0], G[7:0], B[7:0]. In FSS mode, PTN3700 makes use of VS, HS and DE to implement pixel synchronization with embedded sync words in the non-active display area. When frame mixing is used, VS, HS, DE and R[7:0], G[7:0], B[7:0] are used to implement NXP-patented frame mixing algorithm. Table 8 summarizes the requirements of VS, HS, DE and RGB in various modes. PTN3700 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 12 October 2011 © NXP B.V. 2011. All rights reserved. 15 of 43 PTN3700 NXP Semiconductors 1.8 V simple mobile interface link bridge IC Table 8. VS, HS, DE, and RGB requirements[1][2] FSS Mode FM VS, HS DE R, G, B A[1:0] LOW PSS HIGH active LOW active HIGH R, G, B X LOW X X X X HIGH FSS HIGH active LOW active HIGH R, G, B X LOW active LOW active HIGH X X [1] ‘X’ signifies that PTN3700 handles this signal transparently, i.e., data is transmitted and received as-is. [2] ‘R, G, B’ signifies that R, G, B video data have to be input according to the exact chosen pin configuration of PTN3700, specifically: a) Bit order reversal is not allowed, even if both the transmit data and receive data are reversed in bit order. For example, the MSB of ‘R’ color from video source must be input as ‘R7’. b) ‘R’ must be used for red color, ‘G’ for green color, and ‘B’ for blue color. 7.4.4.1 PSS mode HS, VS and DE are treated by PTN3700 in the same way as RGB signals in PSS mode; that is, HS, VS, and DE are serialized and transmitted transparently by the PTN3700 transmitter, and transparently received and deserialized by PTN3700 receiver. Data Enable (DE) signal is typically used to signify the active display area from the non-active display area. In the case that advanced frame mixing is not used: • DE signal can be tied HIGH or LOW, for displays not using DE signal. • HS and VS can be active HIGH or active LOW. 7.4.4.2 FSS mode In FSS mode, PTN3700 uses true source synchronous transmission with a serial Double Data Rate (DDR) bit clock for the serial data. FSS mode requires the following operating conditions: • Active LOW HS • Active LOW VS • Active HIGH DE In FSS mode, DE = 1 means active video, and PTN3700 generates embedded sync words when DE = 0. DE, VS and HS must be actively driven according to the typical video screen figure shown in Figure 18. PTN3700 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 12 October 2011 © NXP B.V. 2011. All rights reserved. 16 of 43 PTN3700 NXP Semiconductors 1.8 V simple mobile interface link bridge IC HS = 0 HS = 1 000 010 010 010 001 011 011 011 VS = 0 active video 001 011 111 011 001 011 011 011 VS = 1 002aac803 3 numbers correspond to [DE, HS, VS] Fig 18. Typical video screen 7.5 Power modes The PTN3700 has three different power modes to minimize power consumption of the link as a function of link activity: Shutdown mode, Standby mode, and Active mode. The truth table for the three power modes is shown in Table 9 and Table 10. • Shutdown mode: By driving input pin XSD LOW, the PTN3700 assumes lowest power mode. All internal logic circuits are reset during this mode, and the link is completely inactive. The transmitter high-speed serial output channels are put in high-impedance state, and the receiver high-speed serial input channels are pulled LOW. The receiver CMOS parallel outputs will all be set HIGH with the exception of DE and PCLK which are reset LOW. However, the input buffers for the transmitter remain active, so it is recommended to stop PCLK and RGB data to achieve the lowest Shutdown mode power. • Standby mode: When pin XSD is set HIGH but no input clock is active, the PTN3700 detects inactivity of the clock3 and remains in a low-power Standby mode until an active input clock is detected. The transmitter serial outputs, receiver serial inputs and receiver parallel outputs all behave identically to their respective states in Shutdown mode. • Active mode: When pin XSD is set HIGH and an active input clock is detected, PTN3700 will assume normal link operation. Current consumption depends on the PCLK frequency, number of lanes, FSS/PSS mode, data pattern, etc. Table 9. Power modes - Transmitter mode Inputs 3. Power mode XSD PCLK L X H H Outputs D0+, D0, D1+, D1, D2+, D2 CLK+, CLK Shutdown high-Z high-Z stopped Standby high-Z high-Z running Active active serial data active The PTN3700 clock detection circuit identifies the clock as inactive when the PCLK input signal frequency is less than 500 kHz. PTN3700 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 12 October 2011 © NXP B.V. 2011. All rights reserved. 17 of 43 PTN3700 NXP Semiconductors 1.8 V simple mobile interface link bridge IC Table 10. Inputs Power modes - Receiver mode Data Outputs XSD State of serial data inputs Power D0+, D0, D1+, D1, D2+, D2 mode CLK+, CLK R[7:0], G[7:0], B[7:0], HS, VS DE, PCLK L X or floating resistively pulled H or L Shutdown H L H stopped resistively pulled H or L Standby H L H running normal receiver state Active active data active 7.6 Link error detection and correction In Transmitter mode, PTN3700 calculates an odd parity bit and merges this into the serialized output data stream to allow the receiver to detect whether parity has been violated for its received input data. The parity bit CP is calculated across the 27-bit input data word (R[7:0], G[7:0], B[7:0], HS, VS and DE) for every pixel transmitted, as shown in Table 11. Note that the auxiliary bits A[1:0] are excluded from the parity calculation. Table 11. Parity encoding function table - Transmitter mode Inputs Encoded parity bit XSD PCLK  of inputs = H (R[7:0], G[7:0], B[7:0], HS, VS, DE) CP H running odd L H running even H H stopped X or floating undefined L X or floating X or floating undefined In Receiver mode, the received encoded parity bit CP is compared against the received 27-bit input data word (R[7:0], G[7:0], B[7:0], HS, VS and DE) for every pixel, and an error is flagged by setting parity error output CPO HIGH for the duration of the pixel clock period in which the error was detected. Note that the auxiliary output bits A[1:0] are excluded from the parity detection. In addition, during the pixel clock period in which the error occurs, the last valid pixel word is output to R[7:0], G[7:0], B[7:0], HS, VS and DE instead of the current erroneous pixel data. The last valid pixel word is defined as the data prior to the first parity error detected in any concatenation of parity errors. If a parity error is detected but no valid previous pixel information is available, the receiver will output values R[7:0] = G[7:0] = B[7:0] = HS = VS = HIGH, and DE = LOW. The truth table for receiver parity function is shown in Table 12. Note that the auxiliary bits A[1:0] are not affected by the last valid pixel repetition. PTN3700 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 12 October 2011 © NXP B.V. 2011. All rights reserved. 18 of 43 PTN3700 NXP Semiconductors 1.8 V simple mobile interface link bridge IC Table 12. Parity decoding function table - Receiver mode Inputs Received parity bit Parity output Data outputs XSD Clock  of bits received in frame = H (R[7:0], G[7:0], B[7:0], HS, VS, DE) CP CPO R[7:0], G[7:0], B[7:0], HS, VS, DE[1][2] H running odd L L RGBn, HSn, VSn, DEn H running even L H RGB0, HS0, VS0, DE0 H running odd H H RGB0, HS0, VS0, DE0 H running even H L RGBn, HSn, VSn, DEn H stopped X or floating X L undefined L X or floating X or floating X L undefined [1] YYYn = current valid pixel data is output to the parallel interface. [2] YYY0 = most recent valid pixel data is output to the parallel interface. 7.7 Frame Mixing and Advanced Frame Mixing When PTN3700 is configured as Receiver (TX/RX = LOW), the CMOS input FM selects whether the Frame Mixing function is turned on (FM = HIGH) or off (FM = LOW). (When PTN3700 is configured as Transmitter (TX/RX = HIGH), the Frame Mixing function is not available, and the FM input should not be used.) Advanced Frame Mixing is a proprietary pixel mapping algorithm that features the ability to render full 24-bit color resolution (provided 24-bit source data is input) using an 18-bit or an 18-bit plus display. When Frame Mixing is off, the full 24-bit data path is maintained unaltered for the link (transparent). When Frame Mixing is enabled, the algorithm maps the incoming 24-bit data to the 18-bit output data, aligned to the MSB. This is illustrated in Table 13. The new 18-bit data fields (R[7:2]FM, G[7:2]FM and B[7:2]FM) contain the altered information as calculated by the Frame Mixing algorithm from the original data. One additional ‘Advanced Frame Mixing’ bit is encoded into the next lower significant bit (R1AFM, G1AFM and B1AFM) of the output data. Table 13. Advanced Frame Mixing bit mapping (FM = HIGH) Bit Input data Output data 7 6 5 4 3 2 1 0 R7 R6 R5 R4 R3 R2 R1 R0 G7 G6 G5 G4 G3 G2 G1 G0 B7 B6 B5 B4 B3 B2 B1 B0 R7FM R6FM R5FM R4FM R3FM R2FM R1AFM HIGH G7FM G6FM G5FM G4FM G3FM G2FM G1AFM HIGH B7FM B6FM B5FM B4FM B3FM B3FM B1AFM HIGH When using Frame Mixing with normal 18-bit displays, the 6 MSBs of the parallel video data outputs (R[7:2], G[7:2] and B[7:2]) should be connected to the display driver inputs. When using special ‘18-bit plus’ display drivers (Advanced Frame Mixing capable), additionally the next lower significant bit (R1, G1 and B1) should be connected to the corresponding display driver input. PTN3700 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 12 October 2011 © NXP B.V. 2011. All rights reserved. 19 of 43 PTN3700 NXP Semiconductors 1.8 V simple mobile interface link bridge IC 7.8 Auxiliary signals The two auxiliary bits A[1:0] are user-supplied bits that can be additionally serialized and deserialized by the PTN3700 in transmitter and receiver modes, respectively. These auxiliary bits are transparent to the PTN3700 and can be used to transmit and receive miscellaneous status or mode information across the link to the display. Note that the auxiliary bits A[1:0] are excluded from the parity calculation and detection in the transmitter and receiver modes respectively. Even in the event of parity error being detected in the receiver mode, A[1:0] will still be deserialized as they are detected by the receiver. 8. Limiting values Table 14. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VDD supply voltage Conditions VI input voltage VO output voltage Tstg storage temperature VESD electrostatic discharge voltage Min Max Unit 0.3 +3.0 V receiver 0.3 VDD + 0.5 V driver 0.3 VDD + 0.5 V 65 +150 C HBM [1] - 1500 V MM [2] - 200 V CDM [3] - 1000 V [1] Human Body Model: ANSI/EOS/ESD-S5.1-1994, standard for ESD sensitivity testing, Human Body Model Component level; Electrostatic Discharge Association, Rome, NY, USA. [2] Machine Model: ANSI/EOS/ESD-S5.2.1-1999, standard for ESD sensitivity testing, Machine Model Component level; Electrostatic Discharge Association, Rome, NY, USA. [3] Charged Device Model: ANSI/EOS/ESD-S5.3.1-1999, standard for ESD sensitivity testing, Charged Device Model - Component level; Electrostatic Discharge Association, Rome, NY, USA. 9. Recommended operating conditions Table 15. PTN3700 Product data sheet Recommended operating conditions Symbol Parameter Conditions Min Typ Max Unit VDD supply voltage 1.65 1.8 1.95 V VI input voltage 0 - VDD V IOH HIGH-level output current 0.8  VDD - - 1 mA IOL LOW-level output current 0.2  VDD - - 1 mA Tamb ambient temperature operating in free air 40 - +85 C All information provided in this document is subject to legal disclaimers. Rev. 3 — 12 October 2011 © NXP B.V. 2011. All rights reserved. 20 of 43 PTN3700 NXP Semiconductors 1.8 V simple mobile interface link bridge IC 10. Static characteristics Table 16. Static characteristics Tamb = 40 C to +85 C, unless otherwise specified. Symbol Parameter VDD supply voltage Conditions Min Typ Max Unit 1.65 1.8 1.95 V VIH HIGH-level input voltage II = 10 A 0.7VDD - VDD V VIL LOW-level input voltage II = 10 A 0 - 0.3VDD V VOH HIGH-level output voltage IO = 1 mA 0.8VDD - VDD V VOL LOW-level output voltage IO = 1 mA 0 - 0.2VDD V Ci input capacitance TX mode - 2 4 pF Shutdown mode; Tamb = 40 C to +60 C - 4 10 A Standby mode; Tamb = 40 C to +60 C - 4 10 A PCLK = 6 MHz; Mode 00 - 11 12.6 mA PCLK = 12 MHz; Mode 00 - 15 17.3 mA PCLK = 20 MHz; Mode 00 - 21 23.5 mA PCLK = 8 MHz; Mode 01 - 13 14.8 mA PCLK = 22 MHz; Mode 01 - 19 21.2 mA PCLK = 40 MHz; Mode 01 - 26 29.3 mA PCLK = 20 MHz; Mode 10 - 19 21.1 mA PCLK = 40 MHz; Mode 10 - 26 28.8 mA PCLK = 65 MHz; Mode 10 - 35 36.8 mA Shutdown mode; Tamb = 40 C to +60 C - 4 10 A Standby mode; Tamb = 40 C to +60 C - 4 10 A PCLK = 6 MHz; Mode 00 - 12 13.7 mA PCLK = 12 MHz; Mode 00 - 17 19.2 mA PCLK = 20 MHz; Mode 00 - 24 26.6 mA PCLK = 8 MHz; Mode 01 - 13 14.9 mA PCLK = 22 MHz; Mode 01 - 20 22.3 mA PCLK = 40 MHz; Mode 01 - 28 31.9 mA PCLK = 20 MHz; Mode 10 - 19 21.2 mA PCLK = 40 MHz; Mode 10 - 26 29.1 mA PCLK = 65 MHz; Mode 10 - 35 38.9 mA Transmitter mode, PSS mode (TX/RX = HIGH; FSS = LOW) IDD supply current Active mode [1] Transmitter mode, FSS mode (TX/RX = HIGH; FSS = HIGH) IDD supply current Active mode PTN3700 Product data sheet [1] All information provided in this document is subject to legal disclaimers. Rev. 3 — 12 October 2011 © NXP B.V. 2011. All rights reserved. 21 of 43 PTN3700 NXP Semiconductors 1.8 V simple mobile interface link bridge IC Table 16. Static characteristics …continued Tamb = 40 C to +85 C, unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Shutdown mode; Tamb = 40 C to +60 C - 4 10 A Standby mode; Tamb = 40 C to +60 C - 4 10 A Receiver mode, PSS mode (TX/RX = LOW; FSS = IDD supply current LOW)[2] Active mode [1] PCLK = 6 MHz; Mode 00 - 8 10.7 mA PCLK = 12 MHz; Mode 00 - 14 16.5 mA PCLK = 20 MHz; Mode 00 - 22 25 mA PCLK = 8 MHz; Mode 01 - 8.5 11 mA PCLK = 22 MHz; Mode 01 - 16 19.5 mA PCLK = 40 MHz; Mode 01 - 25 31 mA PCLK = 20 MHz; Mode 10 - 14 17.8 mA PCLK = 40 MHz; Mode 10 - 22.5 28 mA PCLK = 65 MHz; Mode 10 - 34 40 mA Shutdown mode; Tamb = 40 C to +60 C - 4 10 A Standby mode; Tamb = 40 C to +60 C - 4 10 A PCLK = 6 MHz; Mode 00 - 7.5 10.2 mA PCLK = 12 MHz; Mode 00 - 13 15.5 mA PCLK = 20 MHz; Mode 00 - 20.6 23.6 mA PCLK = 8 MHz; Mode 01 - 8.1 10.6 mA PCLK = 22 MHz; Mode 01 - 15.4 18.6 mA PCLK = 40 MHz; Mode 01 - 23.4 29.3 mA PCLK = 20 MHz; Mode 10 - 13.5 17.3 mA PCLK = 40 MHz; Mode 10 - 21.8 26.9 mA PCLK = 65 MHz; Mode 10 - 33 38 mA Receiver mode, FSS mode (TX/RX = LOW; FSS = HIGH)[2] IDD supply current Active mode [1] [1] Worst-case data pattern for power dissipation is used: alternating vertical stripes. The colors of the stripes correspond to the data pattern: RGB[23:0] = 0xAA AAAA (odd stripes) / RGB[23:0] = 0x55 5555 (even stripes). [2] Based on receiver output load (per output) of 16 pF. The loaded outputs are: PCLK, R[7:0], G[7:0], B[7:0], HS, VS and DE. PTN3700 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 12 October 2011 © NXP B.V. 2011. All rights reserved. 22 of 43 PTN3700 NXP Semiconductors 1.8 V simple mobile interface link bridge IC 11. Dynamic characteristics 11.1 Transmitter mode Table 17. Dynamic characteristics for Transmitter mode VDD = 1.65 V to 1.95 V, Tamb = 40 C to +85 C, unless otherwise specified. All CMOS input signals’ rise time and fall time to Transmitter are stipulated to be from 1 ns to 15 ns. Symbol Parameter Conditions Min Typ Max Unit fi(PCLK) input frequency on pin PCLK Mode 00; see Table 5 4.0 - 21.6 MHz Mode 01; see Table 5 8.0 - 43.3 MHz Mode 10; see Table 5 20.0 - 65.0 MHz 33 - 67 % TPCLK 2.0 - - ns 2.0 - - ns - +300 ps i(PCLK) input duty cycle on pin PCLK tsu(D-PCLK) set-up time from data input to PCLK th(D-PCLK) hold time from data input to PCLK tjit(cc) cycle-to-cycle jitter time PCLK 300 BPLL(loop) PLL loop bandwidth 3 dB corner frequency of PLL loop filter response 0.02  fi(PCLK) 0.03  fi(PCLK) 0.05  fi(PCLK) MHz 0.7VDD VS, HS, DE, R[7:0], G[7:0], B[7:0] 0.3VDD tsu(D-PCLK) th(D-PCLK) 0.7VDD PCLK 0.3VDD 002aab367 Fig 19. AC timing diagram - Transmitter mode PTN3700 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 12 October 2011 © NXP B.V. 2011. All rights reserved. 23 of 43 PTN3700 NXP Semiconductors 1.8 V simple mobile interface link bridge IC 11.2 Receiver mode Table 18. Dynamic characteristics for Receiver mode VDD = 1.65 V to 1.95 V, Tamb = 40 C to +85 C, unless otherwise specified. CMOS output load CL = 16 pF. Symbol Parameter Conditions Min Typ Max Unit fo(PCLK) output frequency on pin PCLK Mode 00; see Table 5 4.0 - 21.6 MHz Mode 01; see Table 5 8.0 - 43.3 MHz Mode 10; see Table 5 20.0 - 65.0 MHz Mode 00 or Mode 10; F/XS = 1 45 50 55 % TPCLK Mode 01; F/XS = 1 48 53 59 % TPCLK data output skew time Mode 00; F/XS = 1 0.5 0 1.5 ns Mode 01; F/XS = 1 0.5 0 0.8 ns Mode 10; F/XS = 1 0.5 0 0.8 ns Mode 00; F/XS = 0 3.0 0 2.0 ns Mode 01; F/XS = 0 0.5 0 2.5 ns Mode 10; F/XS = 0 1.4 0 3.0 ns 0.6 0 0.6 ns Mode 00; F/XS = 0 8 - 18 ns Mode 00; F/XS = 1 4 - 10 ns Mode 01; F/XS = 0 4 - 10 ns Mode 01; F/XS = 1 1 - 3 ns Mode 10; F/XS = 0 4 - 10 ns Mode 10; F/XS = 1 1 - 3 ns Mode 00; F/XS = 0 8 - 18 ns Mode 00; F/XS = 1 4 - 10 ns Mode 01; F/XS = 0 4 - 10 ns o(PCLK) tsk(Q) output duty cycle on pin PCLK tjit(r)PCLK PCLK rise jitter time tr rise time tf BPLL(loop) fall time PLL loop bandwidth PTN3700 Product data sheet CMOS signals CMOS signals Mode 01; F/XS = 1 1 - 3 ns Mode 10; F/XS = 0 4 - 10 ns Mode 10; F/XS = 1 1 - 3 ns 3 dB corner frequency of PLL loop filter response 0.09  fo(PCLK) 0.11  fo(PCLK) 0.14  fo(PCLK) MHz All information provided in this document is subject to legal disclaimers. Rev. 3 — 12 October 2011 © NXP B.V. 2011. All rights reserved. 24 of 43 PTN3700 NXP Semiconductors 1.8 V simple mobile interface link bridge IC 0.8VDD VS, HS, DE, R[7:0], G[7:0], B[7:0] 0.2VDD tsk(Q) tjit(r)PCLK 0.8VDD PCLK 0.2VDD 002aab368 Fig 20. AC timing diagram - Receiver mode PTN3700 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 12 October 2011 © NXP B.V. 2011. All rights reserved. 25 of 43 PTN3700 NXP Semiconductors 1.8 V simple mobile interface link bridge IC 11.3 Power-on/power-off sequence 11.3.1 Power-on sequence Table 19. Power-on sequence timing characteristics VDD = 1.65 V to 1.95 V, Tamb = 40 C to +85 C, unless otherwise specified. These values are for transitions of the Shutdown mode to the Standby mode and the Standby mode to the Active mode. Symbol Parameter Conditions Min Typ Max Unit tsu(VDDH-XSDH) set-up time from VDD HIGH to XSD HIGH Transmitter mode 0 - - ms Receiver mode 0 - - ms tsu(XSDH-PCLKV) set-up time from XSD HIGH to PCLK valid Transmitter mode 10 - - s td(PCLKH-DV) delay time from PCLK HIGH to data valid Transmitter mode - - 2 ms td(XSDH-stb) delay time from XSD HIGH to standby Receiver mode - - 10 s td(RXDV-RXQV) delay time from receiver data input valid to receiver data output valid Receiver mode - - 2 ms VDD tsu(VDDH-XSDH) XSD 0.7VDD tsu(XSDH-PCLKV) provided Transmitter mode PCLK stopped td(PCLKH-DV) high-speed signal outputs VDD high-Z valid tsu(VDDH-XSDH) td(XSDH-stb) XSD Standby Power mode Shutdown Receiver mode high-speed signal inputs high-Z valid td(RXDV-RXQV) all data outputs and PCLK defined in the Shutdown or Standby mode valid outputs reflecting high-speed channels 002aab369 Fig 21. Power-on sequence of the link PTN3700 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 12 October 2011 © NXP B.V. 2011. All rights reserved. 26 of 43 PTN3700 NXP Semiconductors 1.8 V simple mobile interface link bridge IC 11.3.2 Power-off sequence Table 20. Power-off sequence timing characteristics VDD = 1.65 V to 1.95 V, Tamb = 40 C to +85 C, unless otherwise specified. These values are for transition of the Active mode to the Standby mode. Symbol Parameter Conditions Min Typ Max Unit td(PCLKL-TXQZ) delay time from PCLK LOW to transmitter data output float Transmitter mode - - 100 s td(RXDZ-RXQinact) receiver data input float to receiver data output inactive delay time Receiver mode - - 5 s th(XSDL-VDDL) supply voltage LOW after XSD LOW hold time Transmitter mode 0 - - ms Receiver mode 0 - - ms provided Transmitter mode PCLK stopped td(PCLKL-TXQZ) Transmitter mode high-speed signal outputs high-impedance valid Transmitter mode XSD 0.3VDD th(XSDL-VDDL) Transmitter mode VDD Receiver mode high-speed signal inputs high-impedance valid td(RXDZ-RXQinact) R[7:0], G[7:0], B[7:0], VS, HS Receiver mode all outputs valid outputs reflecting high-speed channels defined in the Shutdown mode or Standby mode DE, PCLK Receiver mode XSD 0.3VDD th(XSDL-VDDL) Receiver mode VDD 002aab370 Fig 22. Power-off sequence of the link PTN3700 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 12 October 2011 © NXP B.V. 2011. All rights reserved. 27 of 43 PTN3700 NXP Semiconductors 1.8 V simple mobile interface link bridge IC 11.4 High-speed signaling channel Table 21. High-speed signaling channel SubLVDS output characteristics, Transmitter mode VDD = 1.65 V to 1.95 V, Tamb = 40 C to +85 C, unless otherwise specified. See Section 13.1 for testing information. Symbol Parameter Conditions Min Typ Max Unit VO(dif) differential output voltage see Figure 28 100 150 200 mV VO(cm) common-mode output voltage see Figure 28 0.8 0.9 1.0 V VO(cm)ripple(p-p) peak-to-peak ripple common-mode output voltage see Figure 29 75 - +75 mV Ro(dif) differential output resistance between complimentary outputs of any differential pair: CLK+/CLK; D0+/D0; D1+/D1; D2+/D2 80 180 280  tr(dif) differential rise time from 20 % to 80 % of VO(dif); see Figure 30 200 - 500 ps tf(dif) differential fall time from 80 % to 20 % of VO(dif); see Figure 30 200 - 500 ps foper operating frequency - - 325 MHz IO output current - - 4 mA 10 - +10 % output drive current per channel VO(dif)/VO(dif) relative differential output voltage difference between CLK+/CLK and Dn+/Dn, referenced to CLK+/CLK VO(cm) common-mode output voltage difference between CLK+/CLK and Dn+/Dn 0.1 - +0.1 V tr rise time difference tr(CLK+/CLK)  tr(Dn+/Dn) 100 - +100 ps tf fall time difference tf(CLK+/CLK)  tf(Dn+/Dn) 100 - +100 ps ILO output leakage current Shutdown or Standby mode (high-impedance state) 3.0 - +3.0 A tbit(CLKH-Q) bit time from CLK HIGH PSS mode; Mode 00 or Mode 01; to data output see Table 5, Figure 33 PSS mode: Mode 10; see Table 5, Figure 33 tsk(CLK-Q) skew time from clock to data output CLK edge to data output skew time; FSS mode; see Figure 35 [1] V O  dif CLK – V O  dif DATA   %  = ---------------------------------------------------------------  100 % V O  dif CLK [2] Mode 00: UI = PCLK period / 30 [1] [2][3] N  UI N  UI N  UI ps  19 %  UI + 19 %  UI [2][3] N  UI N  UI N  UI ps  16 %  UI + 16 %  UI [2] 16 %  UI 0 +16 %  UI ps Mode 01: UI = PCLK period / 15 Mode 10: UI = PCLK period / 10 [3] N is defined as the bit position, where 0  N  29 (Mode 00), 0  N  14 (Mode 01) or 0  N  9 (Mode 10). PTN3700 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 12 October 2011 © NXP B.V. 2011. All rights reserved. 28 of 43 PTN3700 NXP Semiconductors 1.8 V simple mobile interface link bridge IC Table 22. High-speed signaling channel SubLVDS input characteristics, Receiver mode VDD = 1.65 V to 1.95 V, Tamb = 40 C to +85 C, unless otherwise specified. See Section 13.1 for testing information. Symbol Parameter Conditions Min Typ Max Unit VI(dif) differential input voltage see Figure 31 70 100 450 mV Vth(H)i(dif) differential input HIGH-level threshold voltage see Figure 32 +25 - - mV Vth(L)i(dif) differential input LOW-level threshold voltage see Figure 32 - - 25 mV VI(cm) common-mode input voltage see Figure 31 0.4 - 1.4 V see Figure 29 VI(cm)ripple(p-p) peak-to-peak ripple common-mode input voltage 75 - +75 mV Ri(dif) differential input resistance internal termination resistor; see Figure 31 80 100 120  tr(dif) differential rise time from 20 % to 80 % of VI(dif); see Figure 30 - - 800 ps tf(dif) differential fall time from 80 % to 20 % of VI(dif); see Figure 30 - - 800 ps foper operating frequency - - 325 MHz 10 - +10 % 0.1 - +0.1 V VI(dif)/VI(dif) relative differential input voltage difference VI(cm) common-mode input voltage between CLK+/CLK and difference Dn+/Dn tr rise time difference tr(CLK+/CLK)  tr(Dn+/Dn) 100 - +100 ps tf fall time difference tf(CLK+/CLK)  tf(Dn+/Dn) 100 - +100 ps Rpd pull-down resistance complimentary input (Dn) to GND; input clock inactive; see Figure 31 - 1 50 k ILI input leakage current Shutdown or Standby mode 90 - +90 A between CLK+/CLK and Dn+/Dn, referenced to CLK+/CLK tbit(CLKH-D) bit time from CLK HIGH to data input PSS mode; see Figure 34 tsk(CLK-D) skew time from clock to data input CLK edge to data input skew time; FSS mode; see Figure 35 [2][3] [2] N  UI N  UI N  UI ps  21 %  UI + 21 %  UI 21 % UI 0 +21 % UI ps V I  dif CLK – V I  dif DATA   %  = -----------------------------------------------------------  100 % V I  dif CLK [1] [2] [1] Mode 00: UI = PCLK period / 30 Mode 01: UI = PCLK period / 15 Mode 10: UI = PCLK period / 10 [3] N is defined as the bit position, where 0  N  29 (Mode 00), 0  N  14 (Mode 01) or 0  N  9 (Mode 10). PTN3700 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 12 October 2011 © NXP B.V. 2011. All rights reserved. 29 of 43 PTN3700 NXP Semiconductors 1.8 V simple mobile interface link bridge IC 12. Application information 12.1 Typical lane and PCLK configurations The PTN3700 supports PCLK (pixel clock) frequencies from 4 MHz to 65 MHz over 1, 2 or 3 data lanes. Table 23 shows the typical number of data lanes needed, assuming blanking overhead of 20 %. Note that 20 % overhead is an example value for illustration/calculation purposes only and not a requirement. Table 23. Panel Typical PCLK and number of data lanes Horizontal Vertical Color Other bit bits Frame rate (Hz) Blanking overhead Pixel clock (MHz) Serial aggregate data rate (Mbit/s) 1-lane 2-lane 3-lane QVGA 240 320 18 12 60 20 % 5.5 165.9 WQVGA 400 240 18 12 60 20 % 6.9 207.4 CIF+ 352 416 18 12 60 20 % 10.5 316.3 316.3 HVGA 320 480 24 6 60 20 % 11.1 331.8 331.8 VGA 640 480 24 6 60 20 % 22.1 663.6 663.6 WVGA 854 480 24 6 60 20 % 29.5 885.4 885.4 SVGA 800 600 24 6 60 20 % 34.6 1036.8 XGA 1024 768 24 6 60 20 % 56.6 1698.7 720p 1280 720 24 6 60 15 % 63.6 1909.7 1036.8 12.2 Pin configurations for various topologies of PCB There are two input pins, PSEL1 and PSEL0, on the PTN3700 that allow for pinning order configurations. PSEL1 will change the pinning order of the serial signals, and allow for various topologies of PCB or flex layout without crossing the high-speed differential traces. The example shown in Figure 23 has set PSEL1 = 0 at receiver side, and PSEL1 = 1 at the transmitter to avoid the traces crossing. Figure 24 shows another configuration, which has PSEL1 = 1 at receiver, and PSEL1 = 0 at transmitter. PSEL0 can configure the pinning order of the parallel signals, and enables the easy introduction of the PTN3700 into an existing parallel design avoiding board re-layout. Figure 23 and Figure 24 show two configuration examples. PTN3700 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 12 October 2011 © NXP B.V. 2011. All rights reserved. 30 of 43 PTN3700 NXP Semiconductors 1.8 V simple mobile interface link bridge IC R7 R6 R5 R4 R3 R2 R1 R0 G7 G7 G6 G6 R0 G5 G4 G3 G2 G1 G0 B7 B6 B5 G5 G4 G3 G2 FSS LS1 PSEL1 GND G1 G0 FM LS0 PSEL0 B7 B6 VDD GND B5 B3 B1 PCLK B4 Transmitter mode PSEL1 = 1 PSEL0 = 0 Receiver mode PSEL1 = 0 PSEL0 = 0 ball A1 index B4 R1 B2 R3 R5 R7 R2 R4 R6 XSD D2− VDD GND A0 F/XS D1+ B0 HS CPO D2+ D2+ VDDA R7 R5 D2− GNDA R6 R4 D1+ TX/RX A1 GND VDD R3 R1 G7 R2 R0 G6 VDD G5 G4 R7 R6 R5 R4 R3 R2 R1 R0 G7 D1− D1− PSEL0 LS0 FM G3 G2 CLK+ CLK+ GND PSEL1 LS1 FSS G1 G0 A1 TX/RX CLK− CLK− F/XS A0 GND VDD B7 B6 G6 G5 G4 G3 G2 G1 G0 B7 B6 VS GNDA D0+ D0+ XSD VS PCLK B1 B3 B5 B5 VDDA D0− D0− CPO DE HS B0 B2 B4 B4 DE VDD B3 B2 B1 B0 PCLK HS VS DE B3 B2 B1 B0 PCLK HS VS DE ball A1 index 002aac935 Transparent top view. Fig 23. Pinning configuration example 1 B0 B1 B2 B3 B4 B5 B6 B7 G0 G0 G1 G1 B7 G2 G3 G4 G5 G6 G7 R0 R1 R2 G2 G3 G4 G5 FSS G6 G7 FM R0 R1 VDD R2 R4 R6 R3 Transmitter mode PSEL1 = 0 PSEL0 = 1 Receiver mode PSEL1 = 1 PSEL0 = 1 ball A1 index R3 B6 R5 B4 B2 B0 B5 B3 B1 XSD D0+ VDD GND A0 F/XS CLK− LS1 PSEL1 GND CLK+ CLK+ LS0 PSEL0 VDD D1− D1− GND A1 TX/RX D1+ D1+ F/XS PCLK VS GNDA D2− D2− XSD VDDA D2+ D2+ CPO DE R7 HS DE CPO R4 R5 R6 R7 PCLK HS VS DE D0− D0− VDDA B0 D0+ GNDA B1 B3 CLK− TX/RX A1 GND PSEL0 LS0 GND PSEL1 LS1 A0 GND VS PCLK HS VDD ball A1 index B2 B4 B0 B1 B2 B3 B4 B5 B6 B7 G0 B6 G0 B5 B7 G1 VDD G2 G3 FM G4 G5 FSS G6 G7 VDD R0 R1 G1 G2 G3 G4 G5 G6 G7 R0 R1 R6 R4 R2 R2 R7 R5 R3 R3 R4 R5 R6 R7 PCLK HS VS DE 002aac936 Transparent top view. Fig 24. Pinning configuration example 2 PTN3700 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 12 October 2011 © NXP B.V. 2011. All rights reserved. 31 of 43 PTN3700 NXP Semiconductors 1.8 V simple mobile interface link bridge IC 12.3 Power decoupling configuration The PTN3700 needs 1.8 V VDD and 1.8 V VDDA. Both can share the same voltage regulator, and use a 10  resistor for isolation. The recommended power configuration of the decoupling is shown in Figure 25. It is recommended to install one 0.1 F ceramic capacitor for each VDD pin and one 0.01 F ceramic capacitor for VDDA pin, and the lead length between the IC power pins and decoupling capacitors should be as short as possible. 10 Ω VDD VDDA 0.1 μF 0.1 μF 0.1 μF 0.01 μF 002aac937 Fig 25. Power decoupling configuration 12.4 PCB/Flex layout guideline The high data rate at the serial I/O requires some specific implementations in the PCB and flex layout design. The following practices can be used as guideline: • The differential pair must be routed symmetrically. Keep all four pairs of differential signal traces the same length. The difference in trace length should be less than 20 mils. • Maintain 100  differential impedance. • Do not route signals over any plane split; use only one ground plane underneath the differential signals. • Avoid any discontinuity for signal integrity. Differential pairs should be routed on the same layer and the number of vias on the differential traces should be minimized. Test points should be placed in series and symmetrically. Stubs should not be introduced on the differential pairs. 12.5 Power-on/power-off requirement PTN3700 does not have any external reset pin. Internally, there is Power-On Reset (POR) circuitry to reset the whole IC at power-up. In order to guarantee that POR works properly, the supply voltage VDD must be powered up from ground level, as illustrated in Figure 26. Unexpected behavior. Power-up from a higher than GND level might set PTN3700 to an unstable state without proper POR. VDD GND Expected behavior. Power-up from GND level enables PTN3700 to start up correctly with stable POR. 002aag311 Fig 26. Expected and unexpected power-on behavior PTN3700 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 12 October 2011 © NXP B.V. 2011. All rights reserved. 32 of 43 PTN3700 NXP Semiconductors 1.8 V simple mobile interface link bridge IC It is recommended to have long enough of a power-off time to let VDD discharge completely, reaching to ground level. If the supply voltage VDD cannot be guaranteed to start from ground level, it is recommended to hold the XSD pin at LOW during power-on. VDD GND XSD GND 002aag312 Fig 27. XSD at LOW during power-on 13. Test information 13.1 High-speed signaling channel measurements 49.9 Ω ± 1 % + CLK, D0, D1 or D2 − VO(dif) 49.9 Ω ± 1 % VO(cm) 002aac101 Fig 28. Transmitter termination and definition for measurement of electrical parameters Dn+, CLK+ VI(cm), VO(cm) Dn−, CLK− VI(cm)ripple(p-p), VO(cm)ripple(p-p) 002aac102 Fig 29. Voltage waveforms, common mode ripple measurement (single-ended mode) PTN3700 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 12 October 2011 © NXP B.V. 2011. All rights reserved. 33 of 43 PTN3700 NXP Semiconductors 1.8 V simple mobile interface link bridge IC tf(dif) 20 % tr(dif) VI(dif), VO(dif) 60 % 0V 20 % 002aac103 Fig 30. Voltage waveforms, differential input or output voltage and rise and fall time measurements receiver Ri(dif) VI(dif) VI(cm) Rpd 002aac104 Fig 31. Receiver measurement definition for measurement of electrical parameters differential (Dn+ − Dn−), (CLK+ − CLK−) Vth(H)i(dif) 0V Vth(L)i(dif) 002aac105 Fig 32. Voltage waveforms, input threshold voltage measurements CLK (differential) 0V tbit(CLKH-Q) bit N tbit(CLKH-Q) bit 1 tbit(CLKH-Q) bit 0 D0, D1 or D2 (differential) bit 0 bit 1 bit N 0V 002aac106 Fig 33. Transmitter high-speed serial outputs timing relationships (PSS mode) PTN3700 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 12 October 2011 © NXP B.V. 2011. All rights reserved. 34 of 43 PTN3700 NXP Semiconductors 1.8 V simple mobile interface link bridge IC CLK (differential) 0V tbit(CLKH-D) bit N tbit(CLKH-D) bit 1 tbit(CLKH-D) bit 0 bit 0 D0, D1 or D2 (differential) bit 1 bit N 0V 002aac806 Fig 34. Receiver high-speed serial inputs timing relationships (PSS mode) CLK (differential) 0V D0, D1 or D2 (differential) 0V tsk(CLK-Q), tsk(CLK-D) tsk(CLK-Q), tsk(CLK-D) 002aac807 Fig 35. Transmitter and receiver high-speed serial outputs and inputs timing relationships (FSS mode) PTN3700 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 12 October 2011 © NXP B.V. 2011. All rights reserved. 35 of 43 PTN3700 NXP Semiconductors 1.8 V simple mobile interface link bridge IC 14. Package outline VFBGA56: plastic very thin fine-pitch ball grid array package; 56 balls; body 4 x 4.5 x 0.65 mm B D SOT991-1 A ball A1 index area E A A2 A1 detail X e1 ∅v ∅w b e H G F E D C B A ball A1 index area M M e C C A B C y y1 C e2 1/2 e 1 2 3 4 5 6 7 X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max A1 A2 b D E e e1 e2 v w y y1 mm 1 0.25 0.15 0.75 0.60 0.35 0.25 4.1 3.9 4.6 4.4 0.5 3 3.5 0.15 0.05 0.08 0.1 REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT991-1 --- --- --- EUROPEAN PROJECTION ISSUE DATE 07-02-06 07-02-07 Fig 36. Package outline SOT991-1 (VFBGA56) PTN3700 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 12 October 2011 © NXP B.V. 2011. All rights reserved. 36 of 43 PTN3700 NXP Semiconductors 1.8 V simple mobile interface link bridge IC 15. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 15.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 15.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: • Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: • • • • • • Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering 15.3 Wave soldering Key characteristics in wave soldering are: • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities PTN3700 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 12 October 2011 © NXP B.V. 2011. All rights reserved. 37 of 43 PTN3700 NXP Semiconductors 1.8 V simple mobile interface link bridge IC 15.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 37) than a SnPb process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 24 and 25 Table 24. SnPb eutectic process (from J-STD-020C) Package thickness (mm) Package reflow temperature (C) Volume (mm3) < 350  350 < 2.5 235 220  2.5 220 220 Table 25. Lead-free process (from J-STD-020C) Package thickness (mm) Package reflow temperature (C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 37. PTN3700 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 12 October 2011 © NXP B.V. 2011. All rights reserved. 38 of 43 PTN3700 NXP Semiconductors 1.8 V simple mobile interface link bridge IC maximum peak temperature = MSL limit, damage level temperature minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 37. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 16. Abbreviations Table 26. PTN3700 Product data sheet Abbreviations Acronym Description CIF Common Intermediate Format CMOS Complementary Metal-Oxide Semiconductor DDR Double Data Rate EMI ElectroMagnetic Interference fps frames per second HVGA Half-size Video Graphics Array I/O Input/Output LVDS Low-Voltage Differential Signalling MSB Most Significant Bit PCB Printed-Circuit Board PLL Phase-Locked Loop QVGA Quarter Video Graphics Array RGB Red/Green/Blue SMILi Simple Mobile Interface Link SubLVDS Sub Low-Voltage Differential Signalling SVGA Super Video Graphics Array UI Unit Interval VGA Video Graphics Array WQVGA Wide Quarter Video Graphics Array All information provided in this document is subject to legal disclaimers. Rev. 3 — 12 October 2011 © NXP B.V. 2011. All rights reserved. 39 of 43 PTN3700 NXP Semiconductors 1.8 V simple mobile interface link bridge IC Table 26. Abbreviations …continued Acronym Description WVGA Wide Video Graphics Array XGA eXtended Graphics Array XVGA eXtended Video Graphics Array 17. Revision history Table 27. Revision history Document ID Release date Data sheet status Change notice Supersedes PTN3700 v.3 20111012 Product data sheet - PTN3700 v.2 Modifications: • Table 22 “High-speed signaling channel SubLVDS input characteristics, Receiver mode”: VI(dif) Max value changed from “200 mV” to “450 mV” PTN3700 v.2 20110608 Product data sheet - PTN3700 v.1 PTN3700 v.1 20070814 Product data sheet - - PTN3700 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 12 October 2011 © NXP B.V. 2011. All rights reserved. 40 of 43 PTN3700 NXP Semiconductors 1.8 V simple mobile interface link bridge IC 18. Legal information 18.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 18.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 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NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). 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Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. PTN3700 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 12 October 2011 © NXP B.V. 2011. All rights reserved. 41 of 43 PTN3700 NXP Semiconductors 1.8 V simple mobile interface link bridge IC Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond 18.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 19. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com PTN3700 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 12 October 2011 © NXP B.V. 2011. All rights reserved. 42 of 43 PTN3700 NXP Semiconductors 1.8 V simple mobile interface link bridge IC 20. Contents 1 2 3 4 4.1 5 6 6.1 6.2 7 7.1 7.2 7.3 7.4 7.4.1 7.4.2 7.4.3 7.4.3.1 7.4.3.2 7.4.4 7.4.4.1 7.4.4.2 7.5 7.6 7.7 7.8 8 9 10 11 11.1 11.2 11.3 11.3.1 11.3.2 11.4 12 12.1 12.2 12.3 12.4 12.5 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 2 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 5 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 7 Functional description . . . . . . . . . . . . . . . . . . . 9 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Link programmability . . . . . . . . . . . . . . . . . . . 10 Versatile signal mirroring programmability . . . 10 High-speed data channel protocol options . . . 12 Serial protocol bit mapping - pseudo source synchronous mode (FSS = LOW). . . . . . . . . . 13 Serial protocol bit mapping - fully source synchronous mode (FSS = HIGH) . . . . . . . . . 14 PLL, PCLK, CLK and pixel synchronization . . 15 Pixel synchronization . . . . . . . . . . . . . . . . . . . 15 PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 HS, VS and DE signal usage in various PTN3700 modes. . . . . . . . . . . . . . . . . . . . . . . 15 PSS mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 FSS mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Power modes . . . . . . . . . . . . . . . . . . . . . . . . . 17 Link error detection and correction . . . . . . . . . 18 Frame Mixing and Advanced Frame Mixing . . 19 Auxiliary signals . . . . . . . . . . . . . . . . . . . . . . . 20 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 20 Recommended operating conditions. . . . . . . 20 Static characteristics. . . . . . . . . . . . . . . . . . . . 21 Dynamic characteristics . . . . . . . . . . . . . . . . . 23 Transmitter mode . . . . . . . . . . . . . . . . . . . . . . 23 Receiver mode . . . . . . . . . . . . . . . . . . . . . . . . 24 Power-on/power-off sequence . . . . . . . . . . . . 26 Power-on sequence . . . . . . . . . . . . . . . . . . . . 26 Power-off sequence . . . . . . . . . . . . . . . . . . . . 27 High-speed signaling channel . . . . . . . . . . . . 28 Application information. . . . . . . . . . . . . . . . . . 30 Typical lane and PCLK configurations . . . . . . 30 Pin configurations for various topologies of PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Power decoupling configuration . . . . . . . . . . . 32 PCB/Flex layout guideline . . . . . . . . . . . . . . . 32 Power-on/power-off requirement . . . . . . . . . . 32 13 13.1 14 15 15.1 15.2 15.3 15.4 16 17 18 18.1 18.2 18.3 18.4 19 20 Test information . . . . . . . . . . . . . . . . . . . . . . . High-speed signaling channel measurements . . . . . . . . . . . . . . . . . . . . . . . . Package outline. . . . . . . . . . . . . . . . . . . . . . . . Soldering of SMD packages . . . . . . . . . . . . . . Introduction to soldering. . . . . . . . . . . . . . . . . Wave and reflow soldering. . . . . . . . . . . . . . . Wave soldering . . . . . . . . . . . . . . . . . . . . . . . Reflow soldering . . . . . . . . . . . . . . . . . . . . . . Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . Legal information . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information . . . . . . . . . . . . . . . . . . . . Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 33 36 37 37 37 37 38 39 40 41 41 41 41 42 42 43 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 12 October 2011 Document identifier: PTN3700