PZU5.1B,115

PZUxB series Single Zener diodes in a SOD323F package Rev. 02 — 15 November 2009 Product data sheet 1. Product profile 1.1 General description General-purpose Zener diodes in a SOD323F (SC-90) very small and flat lead Surface Mounted Device (SMD) plastic package. 1.2 Features „ „ „ „ Total power dissipation: ≤ 310 mW Tolerance series: B: approximately ±5 %; B1, B2, B3: sequential, approximately ±2 % Small plastic package suitable for surface mounted design Wide working voltage range: nominal 2.4 V to 36 V 1.3 Applications „ General regulation functions 1.4 Quick reference data Table 1. Symbol VF Ptot Quick reference data Parameter Conditions Min Typ Max Unit forward voltage IF = 100 mA [1] - - 1.1 V total power dissipation Tamb ≤ 25 °C [2] - - 310 mW [3] - - 550 mW [1] Pulse test: tp ≤ 300 μs; δ ≤ 0.02 [2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1cm2. PZUxB series NXP Semiconductors Single Zener diodes in a SOD323F package 2. Pinning information Table 2. Pinning Pin Description 1 cathode 2 anode Simplified outline Symbol [1] 1 2 2 1 sym068 [1] The marking bar indicates the cathode 3. Ordering information Table 3. Ordering information Type number Package PZU2.4B to PZU36B[1] [1] Name Description Version SC-90 plastic surface mounted package; 2 leads SOD323F The series consists of 97 types with nominal working voltages from 2.4 V to 36 V. 4. Marking Table 4. Marking codes Type number Marking code Type number B B1 B2 B3 PZU2.4 G3 - - - PZU2.7 G4 F3 H1 PZU3.0 G5 F4 PZU3.3 G6 F5 PZU3.6 G7 PZU3.9 B B1 B2 B3 PZU10 GJ FH HF KB - PZU11 GK FJ HG KC H2 - PZU12 GL FK HH KD H3 - PZU13 GM FL HJ KE F6 H4 - PZU14 - - HK - G8 F7 H5 - PZU15 GN FM HL KF PZU4.3 G9 F8 H6 HS PZU16 GP FN HM KG PZU4.7 GA F9 H7 HT PZU18 GQ FP HN KH PZU5.1 GB FA H8 HU PZU20 GR FQ HP KJ PZU5.6 GC FB H9 HV PZU22 GS FR HQ KK PZU6.2 GD FC HA HW PZU24 GT FS HR KL PZU6.8 GE FD HB HX PZU27 GU - - - PZU7.5 GF FE HC HY PZU30 GV - - - PZU8.2 GG FF HD HZ PZU33 GW - - - PZU9.1 GH FG HE KA PZU36 GX - - - PZUXB_SER_2 Product data sheet Marking code © NXP B.V. 2009. All rights reserved. Rev. 02 — 15 November 2009 2 of 12 PZUxB series NXP Semiconductors Single Zener diodes in a SOD323F package 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit IF IZSM forward current - 200 mA non-repetitive peak reverse current - see Table 8 and 9 PZSM non-repetitive peak reverse power dissipation [1] - 40 W Ptot total power dissipation [2] - 310 mW [3] - 550 mW Tamb ≤ 25 °C Tj junction temperature - 150 °C Tamb ambient temperature −65 +150 °C Tstg storage temperature −65 +150 °C [1] tp = 100 μs; square wave; Tj = 25 °C prior to surge [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1cm2. 6. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Rth(j-a) Rth(j-sp) Conditions thermal resistance from junction to ambient in free air thermal resistance from junction to solder point Min Typ Max Unit [1] - - 400 K/W [2] - - 230 K/W [3] - - 55 K/W [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1cm2. [3] Soldering point of cathode tab 7. Characteristics Table 7. Characteristics Tj = 25 °C unless otherwise specified Symbol VF [1] Parameter forward voltage Conditions Min Typ Max Unit IF = 10 mA [1] - - 0.9 V IF = 100 mA [1] - - 1.1 V Pulse test: tp ≤ 300 μs; δ ≤ 0.02 PZUXB_SER_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 15 November 2009 3 of 12 PZUxB series NXP Semiconductors Single Zener diodes in a SOD323F package Table 8. Characteristics per type; PZU2.4B to PZU5.6B3 Tj = 25 °C unless otherwise specified PZU xxx Sel Working voltage VZ (V); IZ = 5 mA Min Max IZ = 0.5 mA IZ = 5 mA Max VR (V) Typ Max Max 2.4 B 2.3 2.6 1000 100 50 1 −1.6 450 8 2.7 B 2.5 2.9 1000 100 20 1 −2.0 440 8 1000 95 10 1 −2.1 425 8 1000 95 5 1 −2.4 410 8 1000 90 5 1 −2.4 390 8 1000 90 3 1 −2.5 370 8 1000 90 3 1 −2.5 350 8 800 80 2 1 −1.4 325 8 250 60 2 1.5 0.3 300 5.5 100 40 1 2.5 1.9 275 5.5 B1 2.5 3.0 3.3 3.6 3.9 4.3 4.7 5.1 5.6 Maximum differential resistance rdif (Ω) Reverse current IR (μA) Temperature Diode coefficient capacitance SZ (mV/K); Cd (pF)[1] IZ = 5 mA 2.75 B2 2.65 2.9 B 2.80 3.20 B1 2.80 3.05 B2 2.95 3.20 B 3.10 3.50 B1 3.10 3.35 B2 3.25 3.50 B 3.40 3.80 B1 3.40 3.65 B2 3.55 3.80 B 3.70 4.10 B1 3.70 3.97 B2 3.87 4.10 B 4.01 4.48 B1 4.01 4.21 B2 4.15 4.34 B3 4.28 4.48 B 4.42 4.90 B1 4.42 4.61 B2 4.55 4.75 B3 4.69 4.90 B 4.84 5.37 B1 4.84 5.04 B2 4.98 5.20 B3 5.14 5.37 B 5.31 5.92 B1 5.31 5.55 B2 5.49 5.73 B3 5.67 5.92 [1] f = 1 MHz; VR = 0 V [2] tp = 100 μs; square wave; Tj = 25 °C prior to surge PZUXB_SER_2 Product data sheet Non-repetitive peak reverse current IZSM (A)[2] © NXP B.V. 2009. All rights reserved. Rev. 02 — 15 November 2009 4 of 12 PZUxB series NXP Semiconductors Single Zener diodes in a SOD323F package Table 9. Characteristics per type; PZU6.2B to PZU36B Tj = 25 °C unless otherwise specified PZU xxx Sel Working voltage VZ (V); IZ = 5 mA Maximum differential resistance rdif (Ω) Reverse current IR (nA) 6.2 B 6.8 7.5 8.2 9.1 10 11 12 13 14 Temperature Diode coefficient capacitance SZ (mV/K); Cd (pF)[1] IZ = 5 mA Non-repetitive peak reverse current IZSM (A)[2] Min Max IZ = 0.5 mA IZ = 5 mA Max VR (V) Typ Max Max 5.86 6.53 80 30 500 3 2.7 250 5.5 B1 5.86 6.12 B2 6.06 6.33 B3 6.26 6.53 B 6.47 7.14 60 20 500 3.5 3.4 215 5.5 B1 6.47 6.73 B2 6.65 6.93 B3 6.86 7.14 B 7.06 7.84 60 10 500 4 4.0 170 3.5 B1 7.06 7.36 B2 7.28 7.60 B3 7.52 7.84 B 7.76 8.64 60 10 500 5 4.6 150 3.5 B1 7.76 8.10 B2 8.02 8.36 B3 8.28 8.64 B 8.56 9.55 60 10 500 6 5.5 120 3.5 B1 8.56 8.93 B2 8.85 9.23 B3 9.15 9.55 B 10.55 60 10 100 7 6.4 110 3.5 60 10 100 8 7.4 108 3 80 10 100 9 8.4 105 3 80 10 100 10 9.4 103 2.5 80 10 100 11 10.4 101 2 9.45 B1 9.45 9.87 B2 9.77 10.21 B3 10.11 10.55 B 10.44 11.56 B1 10.44 10.88 B2 10.76 11.22 B3 11.10 11.56 B 11.42 12.60 B1 11.42 11.90 B2 11.74 12.24 B3 12.08 12.60 B 12.47 13.96 B1 12.47 13.03 B2 12.91 13.49 B3 13.37 13.96 B2 13.70 14.30 PZUXB_SER_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 15 November 2009 5 of 12 PZUxB series NXP Semiconductors Single Zener diodes in a SOD323F package Table 9. Characteristics per type; PZU6.2B to PZU36B …continued Tj = 25 °C unless otherwise specified PZU xxx 15 16 18 20 22 24 27 Sel Working voltage VZ (V); IZ = 5 mA Maximum differential resistance rdif (Ω) Reverse current IR (nA) Min Max IZ = 0.5 mA IZ = 5 mA Max VR (V) Typ Max Max 13.84 15.52 80 15 50 11 11.4 99 2 B1 13.84 14.46 B2 14.34 14.98 B3 14.85 15.52 B 15.37 17.09 80 20 50 12 12.4 97 1.5 B1 15.37 16.01 B2 15.85 16.51 B3 16.35 17.09 B 16.94 19.03 80 20 50 13 14.4 93 1.5 B1 16.94 17.70 B2 17.56 18.35 B3 18.21 19.03 B 18.86 21.08 100 20 50 15 16.4 88 1.5 B1 18.86 19.70 B2 19.52 20.39 B3 20.21 21.08 B 20.88 23.17 100 25 50 17 18.4 84 1.3 B1 20.88 21.77 B2 21.54 22.47 B3 22.23 23.17 B 22.93 25.57 120 30 50 19 20.4 80 1.3 B1 22.93 23.96 B2 23.72 24.78 B3 24.54 25.57 B 28.9 150 40 50 21 23.4 73 1 B 25.1 Temperature Diode coefficient capacitance SZ (mV/K); Cd (pF)[1] IZ = 5 mA Non-repetitive peak reverse current IZSM (A)[2] 30 B 28 32 200 40 50 23 26.6 66 1 33 B 31 35 250 40 50 25 29.7 60 0.9 36 B 34 38 300 60 50 27 33.0 59 0.8 [1] f = 1 MHz; VR = 0 V [2] tp = 100 μs; square wave; Tj = 25 °C prior to surge PZUXB_SER_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 15 November 2009 6 of 12 PZUxB series NXP Semiconductors Single Zener diodes in a SOD323F package mbg781 300 mgl273 0 SZ (mV/K) IF (mA) 4.3 −1 200 3.9 3.6 −2 100 3.3 3.0 2.4 2.7 0 0.6 0.8 −3 1 0 20 40 VF (V) Tj = 25 °C IZ (mA) 60 PZU2.4B to PZU4.3B Tj = 25 °C to 150 °C Fig 1. Forward current as a function of forward voltage; typical values mgl274 10 12 SZ (mV/K) 11 5 10 9.1 8.2 7.5 6.8 Temperature coefficient as a function of working current; typical values 006aaa687 400 Ptot (mW) 300 200 6.2 5.6 5.1 0 4.7 −5 Fig 2. 100 0 0 4 8 12 16 IZ (mA) 20 0 50 100 150 200 Tamb (°C) FR4 PCB, standard footprint PZU4.7B to PZU12B Tj = 25 °C to 150 °C Fig 3. Temperature coefficient as a function of working current; typical values Fig 4. Power derating curve PZUXB_SER_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 15 November 2009 7 of 12 PZUxB series NXP Semiconductors Single Zener diodes in a SOD323F package 8. Package outline 1.35 1.15 0.80 0.65 0.5 0.3 1 2.7 2.3 1.8 1.6 2 0.25 0.10 0.40 0.25 Dimensions in mm Fig 5. 04-09-13 Package outline SOD323F (SC-90) 9. Packing information Table 10. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number PZU2.4B to PZU36B [1] Package SOD323F Description Packing quantity 4 mm pitch, 8 mm tape and reel 3000 10000 -115 -135 For further information and the availability of packing methods, see Section 14. 10. Soldering 3.05 2.80 2.10 1.60 solder lands solder resist 1.65 0.95 0.50 0.60 occupied area solder paste 0.50 (2×) 001aab169 Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 6. Reflow soldering footprint SOD323F (SC-90) PZUXB_SER_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 15 November 2009 8 of 12 PZUxB series NXP Semiconductors Single Zener diodes in a SOD323F package 11. Mounting 43.4 43.4 10 0.6 10 0.6 0.6 40 40 0.6 0.6 0.5 0.5 0.6 Dimensions in mm 006aaa487 Dimensions in mm PCB thickness = 1.6 mm Fig 7. FR4 PCB, standard footprint PZUXB_SER_2 Product data sheet 006aaa488 PCB thickness = 1.6 mm Fig 8. FR4 PCB, mounting pad for cathode 1cm2 © NXP B.V. 2009. All rights reserved. Rev. 02 — 15 November 2009 9 of 12 PZUxB series NXP Semiconductors Single Zener diodes in a SOD323F package 12. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes PZUXB_SER_2 20091115 Product data sheet - PZUXB_SER_1 Modifications: PZUXB_SER_1 • This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. 20060307 Product data sheet PZUXB_SER_2 Product data sheet - - © NXP B.V. 2009. All rights reserved. Rev. 02 — 15 November 2009 10 of 12 PZUxB series NXP Semiconductors Single Zener diodes in a SOD323F package 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. Definition [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 13.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com PZUXB_SER_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 15 November 2009 11 of 12 PZUxB series NXP Semiconductors Single Zener diodes in a SOD323F package 15. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 Packing information . . . . . . . . . . . . . . . . . . . . . 8 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information. . . . . . . . . . . . . . . . . . . . . 11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 15 November 2009 Document identifier: PZUXB_SER_2