PZU8.2B2L,315

PZUxBL series Single Zener diodes Rev. 01 — 6 May 2008 Product data sheet 1. Product profile 1.1 General description General-purpose Zener diodes in SOD882 leadless ultra small Surface-Mounted Device (SMD) plastic package. 1.2 Features n Non-repetitive peak reverse power dissipation: PZSM ≤ 40 W n Total power dissipation: Ptot ≤ 250 mW n Tolerance series: B: approximately ±5 %; B2: approximately ±2 % n Wide working voltage range: nominal 2.4 V to 36 V (E24 range) n Low reverse current IR range n Small plastic package suitable for surface-mounted design n AEC-Q101 qualified 1.3 Applications n General regulation functions 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter forward voltage VF PZSM non-repetitive peak reverse power dissipation Ptot total power dissipation Conditions IF = 100 mA Tamb ≤ 25 °C Min Typ Max Unit [1] - - 1.1 V [2] - - 40 W [3][4] - - 250 mW [1] Pulse test: tp ≤ 300 µs; δ ≤ 0.02. [2] tp = 100 µs; square wave; Tj = 25 °C prior to surge [3] Reflow soldering is the only recommended soldering method. [4] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. PZUxBL series NXP Semiconductors Single Zener diodes 2. Pinning information Table 2. Pinning Pin Description 1 cathode 2 anode Simplified outline Graphic symbol [1] 1 2 1 2 006aaa152 Transparent top view [1] The marking bar indicates the cathode. 3. Ordering information Table 3. Ordering information Type number PZU2.4BL to PZU36BL[1] Package Name Description Version - leadless ultra small plastic package; 2 terminals; body 1.0 × 0.6 × 0.5 mm SOD882 PZU2.7B2L to PZU24B2L[2] [1] The series consists of 29 types with nominal working voltages from 2.4 V to 36 V. [2] The series consists of 25 types with nominal working voltages from 2.7 V to 24 V. 4. Marking Table 4. Marking codes Type number Marking code Type number Marking code PZU2.4BL H2 PZU2.7B2L HZ PZU2.7BL H3 PZU3.0B2L K1 PZU3.0BL H4 PZU3.3B2L K2 PZU3.3BL H5 PZU3.6B2L K3 PZU3.6BL H6 PZU3.9B2L K4 PZU3.9BL H7 PZU4.3B2L K5 PZU4.3BL H8 PZU4.7B2L K6 PZU4.7BL H9 PZU5.1B2L K7 PZU5.1BL HA PZU5.6B2L K8 PZU5.6BL HB PZU6.2B2L H1 PZU6.2BL HC PZU6.8B2L K9 PZU6.8BL HD PZU7.5B2L KA PZU7.5BL HE PZU8.2B2L KB PZU8.2BL HF PZU9.1B2L KC PZU9.1BL HG PZU10B2L KD PZU10BL HH PZU11B2L KE PZU11BL HK PZU12B2L KF PZUXBL_SER_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 6 May 2008 2 of 13 PZUxBL series NXP Semiconductors Single Zener diodes Table 4. Marking codes …continued Type number Marking code Type number Marking code PZU12BL HL PZU13B2L KG PZU13BL HM PZU14B2L KH PZU15BL HN PZU15B2L KK PZU16BL HP PZU16B2L KL PZU18BL HR PZU18B2L KM PZU20BL HS PZU20B2L KN PZU22BL HT PZU22B2L KP PZU24BL HU PZU24B2L KR PZU27BL HV - - PZU30BL HW - - PZU33BL HX - - PZU36BL HY - - 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions IF forward current Max Unit mA - 200 - see Table 8 and 9 IZSM non-repetitive peak reverse current [1] PZSM non-repetitive peak reverse power dissipation [1] - 40 W Ptot total power dissipation [2][3] - 250 mW [2][4] - 500 mW Tamb ≤ 25 °C Tj junction temperature - 150 °C Tamb ambient temperature −55 +150 °C Tstg storage temperature −65 +150 °C [1] tp = 100 µs; square wave; Tj = 25 °C prior to surge [2] Reflow soldering is the only recommended soldering method. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [4] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. PZUXBL_SER_1 Product data sheet Min © NXP B.V. 2008. All rights reserved. Rev. 01 — 6 May 2008 3 of 13 PZUxBL series NXP Semiconductors Single Zener diodes 6. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Conditions thermal resistance from junction to ambient Rth(j-a) in free air Min Typ Max Unit [1][2] - - 500 K/W [1][3] - - 250 K/W [4] - - 55 K/W thermal resistance from junction to solder point Rth(j-sp) [1] Reflow soldering is the only recommended soldering method. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. [4] Soldering point of cathode tab. 7. Characteristics Table 7. Characteristics Tj = 25 °C unless otherwise specified. Symbol Parameter Min Typ Max Unit IF = 10 mA - - 0.9 V IF = 100 mA - - 1.1 V [1] forward voltage VF [1] Conditions Pulse test: tp ≤ 300 µs; δ ≤ 0.02. Table 8. Characteristics per type; PZU2.4BL to PZU5.6B2L Tj = 25 °C unless otherwise specified. PZUxxx Sel Working voltage Differential resistance Reverse current r (Ω) Temperature coefficient dif VZ (V) IR (µA) SZ (mV/K) Diode Non-repetitive capacitance peak reverse current C (pF)[1] d IZSM (A)[2] IZ = 5 mA IZ = 0.5 mA IZ = 5 mA IZ = 5 mA Min Max Max Max Max VR (V) Typ Max Max 2.4 B 2.3 2.6 1000 100 50 1 −1.6 450 8 2.7 B 2.5 2.9 1000 100 20 1 −2.0 440 8 B2 2.65 2.9 B 2.80 3.20 1000 95 10 1 −2.1 425 8 B2 2.95 3.20 B 3.10 3.50 1000 95 5 1 −2.4 410 8 B2 3.25 3.50 B 3.40 3.80 1000 90 5 1 −2.4 390 8 B2 3.55 3.80 B 3.70 4.10 1000 90 3 1 −2.5 370 8 B2 3.87 4.10 B 4.01 4.48 1000 90 3 1 −2.5 350 8 B2 4.15 4.34 3.0 3.3 3.6 3.9 4.3 PZUXBL_SER_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 6 May 2008 4 of 13 PZUxBL series NXP Semiconductors Single Zener diodes Table 8. Characteristics per type; PZU2.4BL to PZU5.6B2L …continued Tj = 25 °C unless otherwise specified. PZUxxx Sel Working voltage Differential resistance Reverse current r (Ω) Temperature coefficient dif VZ (V) IR (µA) SZ (mV/K) Diode Non-repetitive capacitance peak reverse current C (pF)[1] d IZSM (A)[2] 4.7 5.1 5.6 IZ = 5 mA IZ = 0.5 mA IZ = 5 mA Min Max Max Max Max VR (V) Typ Max Max B 4.42 4.90 800 80 2 1 −1.4 325 8 B2 4.55 4.75 B 4.84 5.37 250 60 2 1.5 0.3 300 5.5 B2 4.98 5.20 B 5.31 5.92 100 40 1 2.5 1.9 275 5.5 B2 5.49 5.73 Temperature coefficient Diode Non-repetitive capacitance peak reverse current C (pF)[1] [1] f = 1 MHz; VR = 0 V [2] tp = 100 µs; square wave; Tj = 25 °C prior to surge IZ = 5 mA Table 9. Characteristics per type; PZU6.2BL to PZU36BL Tj = 25 °C unless otherwise specified. PZUxxx Sel Working voltage Differential resistance Reverse current r (Ω) dif VZ (V) IR (nA) SZ (mV/K) d IZSM (A)[2] IZ = 5 mA IZ = 0.5 mA IZ = 5 mA Min Max Max Max Max VR (V) Typ Max Max 5.86 6.53 80 30 500 3 2.7 250 5.5 60 20 500 3.5 3.4 215 5.5 60 10 500 4 4.0 170 3.5 60 10 500 5 4.6 150 3.5 60 10 500 6 5.5 120 3.5 10 100 7 6.4 110 3.5 10 100 8 7.4 108 3 10 100 9 8.4 105 3 10 100 10 9.4 103 2.5 10 100 11 10.4 101 2 6.2 B B2 6.06 6.33 6.8 B 6.47 7.14 B2 6.65 6.93 7.5 B 7.06 7.84 B2 7.28 7.60 8.2 B 7.76 8.64 B2 8.02 8.36 9.1 B 8.56 9.55 B2 8.85 9.23 10 B 9.45 10.55 60 B2 9.77 10.21 11 B 10.44 11.56 60 B2 10.76 11.22 12 B 11.42 12.60 80 B2 11.74 12.24 13 B 12.47 13.96 80 B2 12.91 13.49 14 B2 13.70 14.30 80 IZ = 5 mA PZUXBL_SER_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 6 May 2008 5 of 13 PZUxBL series NXP Semiconductors Single Zener diodes Table 9. Characteristics per type; PZU6.2BL to PZU36BL …continued Tj = 25 °C unless otherwise specified. PZUxxx Sel Working voltage Differential resistance Reverse current r (Ω) Temperature coefficient dif VZ (V) IR (nA) SZ (mV/K) Diode Non-repetitive capacitance peak reverse current C (pF)[1] d IZSM (A)[2] 15 IZ = 5 mA IZ = 0.5 mA IZ = 5 mA Min Max Max IZ = 5 mA Max Max VR (V) Typ Max Max 15 50 11 11.4 99 2 20 50 12 12.4 97 1.5 20 50 13 14.4 93 1.5 20 50 15 16.4 88 1.5 25 50 17 18.4 84 1.3 30 50 19 20.4 80 1.3 B 13.84 15.52 80 B2 14.34 14.98 B 15.37 17.09 80 B2 15.85 16.51 B 16.94 19.03 80 B2 17.56 18.35 B 18.86 21.08 100 B2 19.52 20.39 B 20.88 23.17 100 B2 21.54 22.47 B 22.93 25.57 120 B2 23.72 24.78 27 B 25.1 28.9 150 40 50 21 23.4 73 1 30 B 28 32 200 40 50 23 26.6 66 1 33 B 31 35 250 40 50 25 29.7 60 0.9 36 B 34 38 300 60 50 27 33.0 59 0.8 16 18 20 22 24 [1] f = 1 MHz; VR = 0 V [2] tp = 100 µs; square wave; Tj = 25 °C prior to surge PZUXBL_SER_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 6 May 2008 6 of 13 PZUxBL series NXP Semiconductors Single Zener diodes 006aab129 103 mbg781 300 PZSM (W) IF (mA) 102 200 10 100 1 10−1 1 0 0.6 10 0.8 1 tp (ms) VF (V) Tj = 25 °C (prior to surge) Fig 1. Tj = 25 °C Non-repetitive peak reverse power dissipation as a function of pulse duration; maximum values Fig 2. mgl273 0 Forward current as a function of forward voltage; typical values mgl274 10 12 SZ (mV/K) 4.3 −1 SZ (mV/K) 11 5 10 9.1 8.2 7.5 6.8 3.9 3.6 −2 6.2 5.6 5.1 0 3.3 4.7 3.0 2.4 2.7 −3 Fig 3. −5 0 20 40 IZ (mA) 60 0 4 8 Tj = 25 °C to 150 °C Tj = 25 °C to 150 °C PZU2.4BL to PZU4.3B2L PZU4.7BL to PZU12B2L Temperature coefficient as a function of working current; typical values Fig 4. PZUXBL_SER_1 Product data sheet 12 16 IZ (mA) 20 Temperature coefficient as a function of working current; typical values © NXP B.V. 2008. All rights reserved. Rev. 01 — 6 May 2008 7 of 13 PZUxBL series NXP Semiconductors Single Zener diodes 006aab246 102 IZ (mA) VZ(nom) (V) = 4.7 IZ (mA) VZ(nom) (V) = 2.4 3.6 3.0 2.7 3.3 10 006aab247 102 4.3 10 5.6 6.8 3.9 6.2 1 1 10−1 10−1 10−2 10−2 10−3 5.1 11 10 12 10−3 0 1 2 3 4 5 0 2 4 6 VZ (V) Fig 5. 9.1 8.2 7.5 Tj = 25 °C Tj = 25 °C PZU2.4BL to PZU4.3B2L PZU4.7BL to PZU12B2L Working current as a function of working voltage; typical values Fig 6. 10 12 14 VZ (V) Working current as a function of working voltage; typical values 006aab248 102 IZ (mA) 8 VZ(nom) (V) = 13 10 1 14 15 16 18 22 20 27 24 33 30 36 10−1 10−2 10−3 10 20 30 40 VZ (V) Tj = 25 °C PZU13BL to PZU36BL Fig 7. Working current as a function of working voltage; typical values PZUXBL_SER_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 6 May 2008 8 of 13 PZUxBL series NXP Semiconductors Single Zener diodes 8. Test information 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. 9. Package outline 0.50 0.46 0.62 0.55 2 0.30 0.22 0.65 0.30 0.22 1 0.55 0.47 cathode marking on top side Dimensions in mm Fig 8. 1.02 0.95 03-04-17 Package outline SOD882 10. Packing information Table 10. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description Packing quantity 10000 PZU2.4BL to PZU36BL SOD882 2 mm pitch, 8 mm tape and reel -315 PZU2.7B2L to PZU24B2L [1] For further information and the availability of packing methods, see Section 13. PZUXBL_SER_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 6 May 2008 9 of 13 PZUxBL series NXP Semiconductors Single Zener diodes 11. Soldering 1.30 R = 0.05 (8×) 0.30 0.60 0.70 0.80 (2×) (2×) (2×) 0.90 solder lands solder paste solder resist R = 0.05 (8×) 0.30 (2×) 0.40 (2×) 0.50 (2×) occupied area mbl872 Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 9. Reflow soldering footprint SOD882 PZUXBL_SER_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 6 May 2008 10 of 13 PZUxBL series NXP Semiconductors Single Zener diodes 12. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes PZUXBL_SER_1 20080506 Product data sheet - - PZUXBL_SER_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 6 May 2008 11 of 13 PZUxBL series NXP Semiconductors Single Zener diodes 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 13.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com PZUXBL_SER_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 6 May 2008 12 of 13 PZUxBL series NXP Semiconductors Single Zener diodes 15. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 8.1 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics. . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9 Quality information . . . . . . . . . . . . . . . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Packing information. . . . . . . . . . . . . . . . . . . . . . 9 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 Legal information. . . . . . . . . . . . . . . . . . . . . . . 12 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Contact information. . . . . . . . . . . . . . . . . . . . . 12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 6 May 2008 Document identifier: PZUXBL_SER_1