RB751CS40

RB751 series Schottky barrier single diodes Rev. 01 — 21 May 2007 Product data sheet 1. Product profile 1.1 General description Planar Schottky barrier single diodes with an integrated guard ring for stress protection, encapsulated in small Surface-Mounted Device (SMD) plastic packages. Table 1. Product overview Package NXP RB751CS40 RB751S40 RB751V40 SOD882 SOD523 SOD323 JEITA SC-79 SC-76 Package configuration leadless ultra small ultra small very small Type number 1.2 Features I Low forward voltage I Low capacitance 1.3 Applications I I I I Ultra high-speed switching Voltage clamping Line termination Reverse polarity protection 1.4 Quick reference data Table 2. Symbol IF VRRM VF [1] Quick reference data Parameter forward current repetitive peak reverse voltage forward voltage IF = 1 mA [1] Conditions Min - Typ - Max 120 40 370 Unit mA V mV Pulse test: tp ≤ 300 µs; δ ≤ 0.02. NXP Semiconductors RB751 series Schottky barrier single diodes 2. Pinning information Table 3. Pin SOD882 1 2 cathode anode [1] Pinning Description Simplified outline Symbol 1 1 2 2 sym001 Transparent top view SOD323; SOD523 1 2 cathode anode [1] 1 1 001aab540 2 sym001 2 [1] The marking bar indicates the cathode. 3. Ordering information Table 4. Ordering information Package Name RB751CS40 RB751S40 RB751V40 SC-79 SC-76 Description leadless ultra small plastic package; 2 terminals; body 1.0 × 0.6 × 0.5 mm plastic surface-mounted package; 2 leads plastic surface-mounted package; 2 leads Version SOD882 SOD523 SOD323 Type number 4. Marking Table 5. Marking codes Marking code F6 G4 W8 Type number RB751CS40 RB751S40 RB751V40 RB751_SER_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 21 May 2007 2 of 10 NXP Semiconductors RB751 series Schottky barrier single diodes 5. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VRRM VR IF IFSM Ptot Parameter repetitive peak reverse voltage reverse voltage forward current non-repetitive peak forward current total power dissipation RB751CS40 RB751S40 RB751V40 Tj Tamb Tstg [1] [2] Conditions Min - Max 40 40 120 200 Unit V V mA mA square wave; tp < 10 ms Tamb ≤ 25 °C [1] [2] [2] - −65 −65 250 280 280 150 +150 +150 mW mW mW °C °C °C junction temperature ambient temperature storage temperature Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. Reflow soldering is the only recommended soldering method. 6. Thermal characteristics Table 7. Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient RB751CS40 RB751S40 RB751V40 [1] [2] Conditions in free air [1] Min Typ Max Unit [2] [2] - - 500 450 450 K/W K/W K/W Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Reflow soldering is the only recommended soldering method. 7. Characteristics Table 8. Characteristics Tamb = 25 °C unless otherwise specified. Symbol VF IR Cd [1] Parameter forward voltage reverse current diode capacitance Conditions IF = 1 mA VR = 30 V VR = 1 V; f = 1 MHz [1] Min - Typ 2 Max 370 0.5 - Unit mV µA pF Pulse test: tp ≤ 300 µs; δ ≤ 0.02. RB751_SER_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 21 May 2007 3 of 10 NXP Semiconductors RB751 series Schottky barrier single diodes 102 IF (mA) mlc361 103 IR (µA) (1) mlc362 102 10 10 (1) (2) (3) (4) (2) 1 1 10−1 10−1 (3) 10−2 0 0.2 0.4 0.6 0.8 VF (V) 1 10−2 0 10 20 30 VR (V) 40 (1) Tamb = 125 °C (2) Tamb = 85 °C (3) Tamb = 25 °C (4) Tamb = −40 °C (1) Tamb = 125 °C (2) Tamb = 85 °C (3) Tamb = 25 °C Fig 1. Forward current as a function of forward voltage; typical values Fig 2. Reverse current as a function of reverse voltage; typical values mlc363 5 Cd (pF) 4 3 2 1 0 0 10 20 30 VR (V) 40 f = 1 MHz; Tamb = 25 °C Fig 3. Diode capacitance as a function of reverse voltage; typical values RB751_SER_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 21 May 2007 4 of 10 NXP Semiconductors RB751 series Schottky barrier single diodes 8. Package outline 0.85 0.75 1 0.65 0.58 0.62 0.55 2 0.50 0.46 0.30 0.22 0.65 0.30 0.22 0.55 0.47 Dimensions in mm 1.02 0.95 1.65 1.25 1.55 1.15 1 2 cathode marking on top side 03-04-17 Dimensions in mm 0.34 0.26 0.17 0.11 02-12-13 Fig 4. Package outline SOD882 1.35 1.15 1 Fig 5. Package outline SOD523 (SC-79) 1.1 0.8 0.45 0.15 2.7 2.3 1.8 1.6 2 0.40 0.25 Dimensions in mm 0.25 0.10 03-12-17 Fig 6. Package outline SOD323 (SC-76) 9. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number RB751CS40 RB751S40 RB751V40 [1] Package SOD882 SOD523 SOD323 Description 2 mm pitch, 8 mm tape and reel 2 mm pitch, 8 mm tape and reel 4 mm pitch, 8 mm tape and reel 4 mm pitch, 8 mm tape and reel Packing quantity 3000 -115 -115 8000 -315 10000 -315 -135 -135 For further information and the availability of packing methods, see Section 13. RB751_SER_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 21 May 2007 5 of 10 NXP Semiconductors RB751 series Schottky barrier single diodes 10. Soldering 1.30 R = 0.05 (8×) 0.30 R = 0.05 (8×) 0.90 0.60 0.70 0.80 (2×) (2×) (2×) solder lands solder paste solder resist occupied area 0.30 (2×) 0.40 (2×) 0.50 (2×) mbl872 Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 7. Reflow soldering footprint SOD882 2.15 1.20 0.50 0.60 solder lands solder paste solder resist occupied area 1.80 1.90 0.30 0.40 mgs343 Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 8. Reflow soldering footprint SOD523 (SC-79) RB751_SER_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 21 May 2007 6 of 10 NXP Semiconductors RB751 series Schottky barrier single diodes 3.05 2.80 2.10 1.60 solder lands solder resist 1.65 0.95 0.50 0.60 occupied area solder paste 0.50 (2×) msa433 Dimensions in mm Fig 9. Reflow soldering footprint SOD323 (SC-76) 5.00 4.40 1.40 solder lands solder resist occupied area 2.75 1.20 msa415 preferred transport direction during soldering Dimensions in mm Fig 10. Wave soldering footprint SOD323 (SC-76) RB751_SER_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 21 May 2007 7 of 10 NXP Semiconductors RB751 series Schottky barrier single diodes 11. Revision history Table 10. Revision history Release date 20070521 Data sheet status Product data sheet Change notice Supersedes Document ID RB751_SER_1 RB751_SER_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 21 May 2007 8 of 10 NXP Semiconductors RB751 series Schottky barrier single diodes 12. Legal information 12.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 12.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 12.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 13. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com RB751_SER_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 21 May 2007 9 of 10 NXP Semiconductors RB751 series Schottky barrier single diodes 14. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5 Packing information. . . . . . . . . . . . . . . . . . . . . . 5 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Contact information. . . . . . . . . . . . . . . . . . . . . . 9 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2007. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 21 May 2007 Document identifier: RB751_SER_1