Document Number: MMA7660FC
Rev 8, 03/2012
Freescale Semiconductor
Data Sheet: Technical Data
An Energy Efficient Solution by Freescale
3-Axis Orientation/Motion
Detection Sensor
MMA7660FC
The MMA7660FC is a ±1.5 g 3-Axis Accelerometer with Digital Output
(I2C). It is a very low power, low profile capacitive MEMS sensor featuring a
low pass filter, compensation for 0g offset and gain errors, and conversion to
6-bit digital values at a user configurable samples per second. The device can
be used for sensor data changes, product orientation, and gesture detection
through an interrupt pin (INT). The device is housed in a small 3mm x 3mm x
0.9mm DFN package.
MMA7660FC: XYZ-AXIS
ACCELEROMETER
±1.5 g
Features
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•
•
•
•
•
•
•
•
•
•
Digital Output (I2C)
3mm x 3mm x 0.9mm DFN Package
Low Power Current Consumption: Off Mode: 0.4 µA,
Standby Mode: 2 µA, Active Mode: 47 µA at 1 ODR
Configurable Samples per Second from 1 to 120 samples a second.
Low Voltage Operation:
– Analog Voltage: 2.4 V - 3.6 V
– Digital Voltage: 1.71 V - 3.6 V
Auto-Wake/Sleep Feature for Low Power Consumption
Tilt Orientation Detection for Portrait/Landscape Capability
Gesture Detection Including Shake Detection and Tap Detection
Robust Design, High Shocks Survivability (10,000 g)
RoHS Compliant
Halogen Free
Environmentally Preferred Product
Low Cost
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•
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10 LEAD
DFN
CASE 2002-03
Top View
1
10
N/C
RESERVED
N/C
2
9
DVDD
AVDD
3
8
DVSS
AVSS
4
7
SDA
INT
5
6
SCL
RESERVED
Typical Applications
•
Bottom View
Mobile Phone/ PMP/PDA: Orientation Detection (Portrait/Landscape),
Image Stability, Text Scroll, Motion Dialing, Tap to Mute
Laptop PC: Anti-Theft
Gaming: Motion Detection, Auto-Wake/Sleep For Low Power
Consumption
Digital Still Camera: Image Stability
Figure 1. Pin Connections
ORDERING INFORMATION
Part Number
Temperature Range
Package
Shipping
MMA7660FCT
–40 to +85°C
DFN-10
Tray
MMA7660FCR1
–40 to +85°C
DFN-10
7” Tape & Reel
© 2009-2012 Freescale Semiconductor, Inc. All rights reserved.
Contents
DEFINITIONS ............................................................................................................................................................................... 5
ELECTRO STATIC DISCHARGE (ESD) ...................................................................................................................................... 7
PRINCIPLE OF OPERATION ...................................................................................................................................................... 9
MODES OF OPERATION .......................................................................................................................................................... 10
CONFIGURABLE SAMPLES PER SECONDS AND INTERRUPT SETTINGS ......................................................................... 11
POWER SAVING FEATURES ................................................................................................................................................... 11
TESTING THE LOGIC CHAIN ................................................................................................................................................... 11
FEATURES ................................................................................................................................................................................ 11
Tap Detection ...................................................................................................................................................................... 13
Shake Detection .................................................................................................................................................................. 13
Auto-Wake/Sleep ................................................................................................................................................................ 13
REGISTER DEFINITIONS ......................................................................................................................................................... 14
SERIAL INTERFACE ................................................................................................................................................................. 22
Serial-Addressing ................................................................................................................................................................ 22
Start and Stop Conditions ................................................................................................................................................... 22
Bit Transfer .......................................................................................................................................................................... 22
Acknowledge ....................................................................................................................................................................... 23
The Slave Address .............................................................................................................................................................. 23
Message Format for Writing MMA7660FC .......................................................................................................................... 23
Message Format for Reading MMA7660FC ........................................................................................................................ 24
APPENDIX A - PACKAGE REQUIREMENTS FOR MMA7660FC ............................................................................................. 25
Minimum Recommended Footprint for Surface Mounted Applications ............................................................................... 25
Soldering And Mounting Guidelines for the DFN Accelerometer Sensor to a PC Board .................................................... 25
Overview of Soldering Considerations ................................................................................................................................ 25
Halogen Content ................................................................................................................................................................. 25
PCB Mounting Recommendations ...................................................................................................................................... 25
APPENDIX B - SENSING DIRECTION ...................................................................................................................................... 27
APPENDIX C - MMA7660FC ACQUISITION CODE TABLE ..................................................................................................... 28
APPENDIX D - I2C AC CHARACTERISTICS ............................................................................................................................ 30
MMA7660FC
Sensors
Freescale Semiconductor
2
List of Tables
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
ESD And Latch-up Protection Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Operating Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Modes Of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Feature Summary Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Orientation Detection Logic of when Interrupt will Occur . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Auto-Wake/Sleep Truth Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
User Register Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
ASE/AWE Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Sleep Counter Timeout Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
I2C AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
MMA7660FC
Sensors
Freescale Semiconductor
3
List of Figures
I2C Connection to MCU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Simplified Accelerometer Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Simplified Transducer Physical Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
State Machine of Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Orientation Detection Logic in 3-Dimensional Space . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2-Wire Serial Interface Timing Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Start and Stop Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Bit Transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Slave Address . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Single Byte Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Multiple Bytes Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Single Byte Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Multiple Bytes Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Package Footprint, PCB Land Pattern, and Stencil Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
PCB Land Pattern Detail . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Product Orientation on Perpendicular Axis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Product Orientations Showing Direction for Each Axis in Composite . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
MMA7660FC
Sensors
Freescale Semiconductor
4
Definitions
Auto-Wake: Sleep Mode (uses AMSR sample rate in SR [0x08] register)
Auto-Sleep: Run Mode (uses AWSR sample rate in SR [0x08] register)
PMP: Portable Media Player
PDA: Personal Digital Assistant
DFN: Dual Flat No Lead
ESD: Electro Static Discharge
ODR: Output Data Rate
MEMS: Microelectromechanical Systems
MMA7660FC
Sensors
Freescale Semiconductor
5
Table 1. Pin Description
Top View
RESERVED
N/C
AVDD
Pin # Pin Name
1
RESERVED
1
10
RESERVED
2
N/C
2
9
DVDD
3
4
8
3
DVSS
AVSS
4
7
SDA
INT
5
6
SCL
Figure 1. Pinout
VDD
Pin
Status
Description
Connect to AVSS
Input
No Internal Connection, leave
unconnected or connect to Ground
Input
AVDD
Device Power
Input
AVSS
Device Ground
Input
Interrupt/Data Ready
Output
5
INT
6
SCL
I C Serial Clock
Input
7
SDA
I2C Serial Data
Open
Drain
2
8
DVSS
Digital I/O Ground
Input
9
DVDD
Digital I/O Power
Input
10
RESERVED
Connect to AVSS
Input
VDD
U13
1
2
3
4
5
GND
RESERVED
RESERVED
N/C
DVDD
AVDD
DVSS
AVSS
SDA
INT
SCL
10
9
8
7
6
GND
MMA7660FC
VDD
R1
4.70 K
R2
4.70 K
SDA
MCU
SCL
INT
NOTE: A 0.1 μF ceramic capacitor can be placed connecting pin 3 (AVDD) to pin 4 (AVSS). In addition, another 0.1 μF
ceramic capacitor can be place connecting pin 9 (DVDD) to pin 8 (DVSS). The capacitors should be placed close
to the pins of the MMA7660FC and is recommended for testing and to adequately decouple the accelerometer
from noise on the power supply.
Figure 2. I2C Connection to MCU
MMA7660FC
Sensors
Freescale Semiconductor, Inc.
6
AVDD
DVDD
INTERNAL
OSC
VSS
CLOCK
GEN
X-axis
Transducer
Y-axis
Transducer
MUX
C-to-V
CONVERTER
AMP
ADC
SDA
I2 C
SCL
Z-axis
Transducer
OFFSET
TRIM
GAIN
TRIM
INT
CONTROL LOGIC
Figure 3. Simplified Accelerometer Functional Block Diagram
Table 2. Maximum Ratings
(Maximum ratings are the limits to which the device can be exposed without causing permanent damage.)
Rating
Symbol
Value
Unit
Maximum Acceleration (all axes, 100 μs)
gmax
10,000
g
Analog Supply Voltage
AVDD
-0.3 to +3.6
V
DVDD_IO
-0.3 to +3.6
V
Ddrop
1.8
m
Tstg
-40 to +125
°C
Digital I/O pins Supply Voltage
Drop Test
Storage Temperature Range
ELECTRO STATIC DISCHARGE (ESD)
WARNING: This device is sensitive to electrostatic discharge.
Although the Freescale accelerometer contains internal 2000 V ESD protection circuitry, extra precaution must be taken by
the user to protect the chip from ESD. A charge of over 2000 V can accumulate on the human body or associated test equipment.
A charge of this magnitude can alter the performance or cause failure of the chip. When handling the accelerometer, proper ESD
precautions should be followed to avoid exposing the device to discharges which may be detrimental to its performance.
Table 3. ESD And Latch-up Protection Characteristics
Rating
Human Body Model
Machine Model
Charge Device Model
Latch-up current at TA = 85°C
Symbol
Value
Unit
HBM
±2000
V
MM
±200
V
CDM
±500
V
±100
mA
MMA7660FC
7
Sensors
Freescale Semiconductor, Inc.
Table 4. Operating Characteristics
Unless otherwise noted: -40°C < TA < 85°C, 2.4 V < AVDD < 3.6 V, 1.71 V < DVDD < 3.6 V, Acceleration = 0g
Typical values are at AVDD = 2.8 V, DVDD = 2.8 V, TA = +25°C
Characteristics
Symbol
Min
Typ
Max
Unit
Standby/Operation Mode
AVDD
2.4
2.8
3.6
V
Enable Bus Modeon Mode
AVDD
Analog Supply Voltage
0
V
Digital I/O Pins Supply Voltage
Standby/Operation Mode
DVDD_IO
1.71
2.8
AVDD
V
Enable Bus Modeon Mode
DVDD_IO
1.71
1.8
3.6
V
Supply Current Drain
Off Mode
IDD
0.4
Power Down Mode
IDD
2
Standby Mode(1)
IDD
Active Mode, ODR = 1
IDD
47
µA
Active Mode, ODR = 2
IDD
49
µA
Active Mode, ODR = 4
IDD
54
µA
Active Mode, ODR = 8
IDD
66
µA
Active Mode, ODR = 16
IDD
89
µA
Active Mode, ODR = 32
IDD
133
µA
Active Mode, ODR = 64
IDD
221
µA
Active Mode(1), ODR = 120
IDD
294
µA
0
Acceleration Range
2
µA
µA
10
±1.5
Operating Temperature Range
µA
g
TA
-40
25
85
°C
VOFF
-3
0
3
counts
0g Output Signal (TA = 25°C, AVDD = 2.8 V)
0g Offset ±1.5g range(1)
0g Offset Temperature Variation
X
Y
Z
-1.3
+1.5
-1.0
mg/°C
mg/°C
mg/°C
Sensitivity(1) (TA = 25°C, AVDD = 2.8 V)
±1.5g range 6-bit
21.33
Acceleration Sensitivity at TAMB
19.62
Acceleration Sensitivity Temperature Variation
Input High Voltage
Input Low Voltage
VIL
Output Low Voltage (IOL = 6 mA + SDA, INT)
VOL
Internal Clock Frequency(1) (TA = 25°C, AVDD = 2.8 V)
count/g
23.04
±0.01
VIH
Input Leakage Current
21.33
%/°C
0.7 x DVDD
0.35 x DVDD
0.5
IIH, IIL
tCLK
count/g
0.025
135
150
I2C Interface Speed
V
µA
165
kHz
400
kHz
1.3
ms
1
ms
Control Timing
Turn on time from AVDD = 0 V to AVDD = 2.5 V(2)
Turn off time from Active to Standby Mode
Turn on time Standby to Active Mode
12 ms + 1/ODR
ms
Timing Clock Source Accuracy (TA = 25°C, DVDD = 1.8 V)
-10
10
%
Timing Clock Source Temperature Variation
-15
15
%
Cross Axis Sensitivity
(3)
Noise(4)
±1
%
±1
count
Notes
1.
2.
3.
4.
These parameters are tested in production at final test.
Assuming VDD power on slope is < 1 ms.
A measure of the devices ability to reject an acceleration applied 90° from the true axis of sensitivity.
Noise is defined as quantiles given to a sample size. These are the occurrences of noise: 94% = ±1 count, 5% = ±2 counts, and 1% = ±3
counts.
MMA7660FC
Sensors
Freescale Semiconductor, Inc.
8
PRINCIPLE OF OPERATION
The Freescale Accelerometer consists of a MEMS capacitive sensing g-cell and a signal conditioning ASIC contained in a
single package. The sensing element is sealed hermetically at the wafer level using a bulk micro machined cap wafer. The
g-cell is a mechanical structure formed from semiconductor materials (polysilicon) using masking and etching processes.
The sensor can be modeled as a movable beam that moves between two mechanically fixed beams (Figure 4). Two gaps are
formed; one being between the movable beam and the first stationary beam and the second between the movable beam and the
second stationary beam.
The ASIC uses switched capacitor techniques to measure the g-cell capacitors and extract the acceleration data from the
difference between the two capacitors. The ASIC also signal conditions and filters (switched capacitor) the signal, providing a
digital output that is proportional to acceleration.
ACCELERATION
Figure 4. Simplified Transducer Physical Model
MMA7660FC
9
Sensors
Freescale Semiconductor, Inc.
MODES OF OPERATION
The sensor has three power modes: Off Mode, Standby Mode, and Active Mode to offer the customer different power
consumption options. The sensor is only capable of running in one of these modes at a time.
The Off Mode offers the lowest power consumption, approximately 0.4 µA and can only be reached by powering down the
analog supply. See Figure 5. In this mode, there is no analog supply and all I2C activity is ignored.
The Standby Mode is ideal for battery operated products. When Standby Mode is active the device outputs are turned off
providing a significant reduction in operating current. When the device is in Standby Mode the current will be reduced to
approximately 3 µA. Standby Mode is entered as soon as both analog and digital power supplies are up. In this mode, the device
can read and write to the registers with I2C, but no new measurements can be taken. The mode of the device is controlled through
the MODE (0x07) control register by accessing the mode bit in the Mode register.
During the Active Mode, continuous measurement on all three axes is enabled. In addition, the user can choose to enable:
Shake Detection, Tap Detection, Orientation Detection, and/or Auto-Wake/Sleep Feature and in this mode the digital analysis for
any of these functions is done. The user can configure the samples per second to any of the following: 1 sample/second,
2 samples/second, 4 samples/second, 8 samples/second, 16 samples/second, 32 samples/second, 64 samples/second, and
120 samples/second, for the Auto-Sleep state. If the user is configuring the Auto-Wake feature, the selectable ranges are:
1 sample/second, 8 samples/second, 16 samples/seconds and 32 samples/second. Depending on the samples per second
selected the power consumption will vary.
Table 5. Modes Of Operation
Measurement and
Power Mode
Power Down
Mode
I²C Bus
DVDD AVDD
DVDD is down, so I2C bus cannot be
used for other devices (MMA7660FC
clamps I2C bus to DVVD pin)
Function
Off
Off
MMA7660FC is powered down in both supplies. I2C activity is
unavailable on bus.
Off
On
MMA7660FC is powered down in digital supply but not analog
supply. I2C activity is unavailable on bus. AVDD power cycling
requires 50 msec.
MMA7660FC will not respond, but I2C
bus can be used for other devices
(MMA7660FC does not load I2C bus)
On
Standby Mode
MMA7660FC will respond to I2C bus
On
On
MMA7660FC is powered up in both supplies, so registers can be
accessed normally to set MMA7660FC to Active Mode when
desired. MMA7660FC's sensor measurement system is idle.
Active Mode
MMA7660FC will respond to I2C bus
On
On
MMA7660FC is able to operate sensor measurement system at
user programmable samples per second and run all of the digital
analysis functions. Tap detection operates in Active Mode and
Auto-Sleep, but not Auto-Wake.
Off Mode
Auto-Sleep
Auto-Wake
Off
MMA7660FC is powered down in analog supply but not digital
supply. I2C activity is ignored.
Figure 5. State Machine of Modes
MMA7660FC
Sensors
Freescale Semiconductor, Inc.
10
CONFIGURABLE SAMPLES PER SECONDS AND INTERRUPT SETTINGS
The device can be configured into 8 different samples per seconds including: 1 sample/second, 2 samples/second,
4 samples/second, 8 samples/second, 16 samples/second, 32 samples/second, 64 samples/second, and 120 samples/second,
The user can specify the samples per second for their particular application, deciding on the trade off between power
consumption and number of samples, this can be configured in the SR (0x08) register. Once the user configurable samples per
second is chosen, the device will update the data for all 3 axes in the register at a resolution of 6-bits/axis.
The user can choose to enable/disable any of the following interrupts in the INTSU (0x06) register: Front/Back Interrupt,
Up/Down/Left/Right Interrupt, Tap Detection Interrupt, GINT (real-time motion tracking), Shake on X-axis, Shake on Y-axis, and
Shake on Z-axis. If the GINT is enabled, real-time motion tracking can be configured to trigger an interrupt after every sensor
data update: 1s (1 sample/second), 500 ms (2 samples/second), 250 ms (4 samples/second), 125 ms (8 samples/second),
62.5 ms (16 samples/second), 31.25 ms (32 samples/second), 15.625 ms (64 samples/second), or 8.36 ms (120 samples/
second). If any of the shake axis interrupts are enabled; excessive agitation, greater than 1.3 g, will trigger an interrupt. If either
the Up/Down/Left/Right Interrupt or the Front/Back Interrupt is enabled, any change in orientation will generate an interrupt. When
the Auto-Wake feature is enabled, and the Auto-Sleep counter elapses an interrupt will occur. When the device is in Auto-Sleep
state, if a shake interrupt, tap interrupt, Delta G, or orientation detection interrupt occur, the device will go out of sleep state and
into wake state.
POWER SAVING FEATURES
The MMA7660FC includes a range of user configurable power saving features. The device’s samples per second can be set
over a wide range from 1 to 120 samples a second; the operating current is directly proportional to samples per second. The
analog supply AVDD can be powered down to put the MMA7660FC into Off Mode, which typically draws 0.4 µA. The Auto-Wake/
Sleep feature can toggle the sampling rate from a higher user selected samples per second to a lower user selected samples
per second, changing based on if motion is detected or not. The user can choose to use any of the above options to configure
the part and make it have the optimal power consumption level for the desired application.
TESTING THE LOGIC CHAIN
MMA7660FC can be put into Test Mode, which disables accelerometer measurements and instead allows the user to write
6-bit values directly to the three axis data registers, thus simulating real time accelerometer measurements. The state machine
will respond to these values according to the enabled features and functions, allowing them to be validated.
NOTE: MMA7660FC does not include an accelerometer self test function, which is typically an electrostatic force applied
to each axis to cause it to deflect.
FEATURES
The Sensor employs both analog and digital filtering to ensure low noise and accurate output when using the part for Shake,
Tap, or Orientation Detection. During Active Mode, the data is filtered and stored for each of the 3 axes at the specified following
measurement intervals: 1s (1 sample/second), 500 ms (2 samples/second), 250 ms (4 samples/second),
125 ms (8 samples/second), 62.5 ms (16 samples/second), 31.25 ms (32 samples/second), 15.625 ms (64 samples/second), or
8.36 ms (120 samples/second) or indicated in AMSR [2:0].
The 6-bit measurement data is stored in the XOUT (0x00), YOUT (0x01), and ZOUT (0x02) registers and is used to update
the Shake, Alert, Tap, PoLa[2:0] (updates Up, Down, Left, and Right position), and BaFro[1:0] (updates Back and Front position)
in the TILT (0x03) register used for orientation detection. The customer can configure the part by enabling a number of userdesired interrupts in the INTSU (0x06) register. Once the interrupts are enabled a change in filtered readings will cause an
interrupt to occur depending on the output.
The filters that are being used by this sensor is the analog filtering, digital noise filtering of measurements used for orientation
detection and updated in the XOUT (0x00), YOUT (0x01), and ZOUT (0x02) registers. The filtering method used is to oversample
each axis by taking 32 readings, and then calculate the average for the output measurement data as a finite impulse response
filter.
Table 6. Feature Summary Table
Feature
Will Generate Interrupt
Orientation Change
When FBINT, PLINT = 1
Shake
When SHINTX, SHINTY, SHINTZ = 1
Tap or Tilt
When PDINT = 1
Auto-Wake/Sleep
When ASINT = 1
X, Y, Z Data Update
When GINT = 1
NOTE: Sensor Measurements are NOT taken in Standby Mode or in Test Mode.
MMA7660FC
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Orientation Detection
Orientation Detection Logic
MMA7660FC gives the customer the capability to do orientation detection for such applications as Portrait/Landscape in
Mobile Phone/PDA/ PMP. The tilt orientation of the device is in 3 dimensions and is identified in its last known static position. This
enables a product to set its display orientation appropriately to either portrait/landscape mode, or to turn off the display if the
product is placed upside down. The sensor provides six different positions including: Left, Right, Up, Down, Back, and Front,
shown in Table 7. In Active Mode the data is processed and updates the orientation positions in the TILT (0x03) register. At each
measurement interval, it computes new values for Left, Right, Up, Down, Back, and Front but it does not automatically update
these bits in the TILT (0x03) register. These values are updated depending on the debounce filter settings (SR Register 0x08)
configured by the customer.
In order to give the customer the ability to configure the debounce filter, specific to there application, they can change the
following bits in the SR (0x08) register, FILT [2:0]. Please see below for a more detailed explanation of how the FILT [2:0] works
in conjunction with updating the TILT (0x03) register:
• If FILT [2:0] = 000, then the new values for Left, Right, Up, Down, Back, and Front are updated in the TILT (0x03) register
(PoLa [2:0] and BaFro [1:0]) after every reading without any further analysis.
• If FILT [2:0] = 001 – 111, then the sensor requires the computed values for Left, Right, Up, Down, Back, and Front to be the
same from 1-7 consecutive readings (depending on the value in FILT [2:0], before updating the values stored in TILT (0x03)
register (PoLa [2:0] and BaFro [1:0]). The debounce counter is reset after a mismatched reading or the TILT (0x03) register
is updated (if the orientation condition is met).
Table 7. Orientation Detection Logic of when Interrupt will Occur
Orientation
Shake
Xg
Yg
|X| > +1.3g
or
Up
|Z| < 0.8g and |X| > |Y| and X < 0
Down
|Z| < 0.8g and |X| > |Y| and X > 0
Zg
|Y| > +1.3g
or
Right
|Z| < 0.8g and |Y| > |X| and Y < 0
Left
|Z| < 0.8g and |Y| > |X| and Y > 0
|Z| > +1.3g
Back
Z < -0.25g
Front
Z > 0.25g
Front
Up
Left
Right
Down
Back
Figure 6. Orientation Detection Logic in 3-Dimensional Space
MMA7660FC
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Freescale Semiconductor, Inc.
12
Tap Detection
The MMA7660FC also includes a Tap Detection feature that can be used for a number of different customer applications such
as button replacement. For example, a single tap can stop a song from playing and a double tap can play a song. This function
detects a fast transition that exceeds a user-defined threshold (PDET (0x09) register) for a set duration (PD (0x0A) register).
Tap Detection Setup
In order to enable Tap detection in the device the user must enable the Tap Interrupt in the INTSU (0x06) register and AMSR
[2:0] = 000 in the SR (0x08) register. In this mode, TILT (0x03) register, XOUT (0x00), YOUT (0x01), and ZOUT (0x02) registers
will update at the 120 samples/second.
The user can configure Tap Detection to be detected on X and/or Y and/or Z axes. The customer can configure this by
changing the XDA, YDA, and/or ZDA bit in the PDET (0x09) register. Detection for enabled axes is decided on an OR basis: If
the PDINT bit is set in the INTSU (0x06) register, the device reports the first axis for which it detects a tap by the Tap bit in the
TILT (0x03) register. When the Tap bit in the TILT (0x03) register is set, tap detection ceases, but the device will continue to
process orientation detection data. Tap detection will resume when the TILT (0x03) register is read.
NOTE: Delta G is available with any AMSR setting, when XDA = YDA = ZDA = 1 (PDET = 1). When the sampling rate
is less than 120 samples/second, the device can not detect tapping, but can detect small tilt angles (30 º angle
change) which can not be detected by orientation detection.
Shake Detection
The shake feature can be used as a button replacement to perform functions such as scrolling through images or web pages
on a Mobile Phone/PMP/PDA. The customer can enable the shake interrupt on any of the 3 axes, by enabling the SHINTX,
SHINTY, and/or SHINTZ in the INTSU (0x06) register.
MMA7660FC detects shake by examining the current 6-bit measurement for each axis in XOUT, YOUT, and ZOUT. The axes
that are tested for shake detection are the ones enabled by SHINTX, SHINTY, and/or SHINTZ. If a selected axis measures
greater that 1.3 or less than -1.3 g, then a shake is detected for that axis and an interrupt occurs. All three axes are checked
independently, but a common Shake bit in the TILT register is set when shake is detected in any one of the selected axes.
Therefore when all three (SHINTX, SHINTY, and/or SHINTZ) are selected the sensor will not know what axis the shake occurred.
When the TILT register is read the Shake bit is cleared during the acknowledge bit of the read access to that register and shake
detection monitoring starts again.
Auto-Wake/Sleep
The MMA7660FC has the Auto-Wake/Sleep feature that can be enabled for power saving. In the Auto-Wake function, the
device is put into a user specified low samples per second (1 sample/second, 8 samples/second, 16 samples/second, or
32 samples/second) in order to minimize power consumption. When the Auto-Wake is enabled and activity is detected such as
a change in orientation, pulse event, Delta G acceleration or a shake event, then the device wakes up. Auto-Wake will
automatically enable Auto-Sleep when the device is in wake mode and can therefore be configured to cause an interrupt on
wake-up, by configuring the part to either wake-up with a change in orientation, shake, or if using the part at 120 samples/second
tap detection. When the device is in Auto-Wake mode, the MODE (0x07) register, bit AWE is high. When the device has detected
a change in orientation, a tap shake, or Delta G (change in acceleration), the device will enter Auto-Sleep mode. In the AutoSleep function, the device is put into any of the following user specified samples per seconds (1 sample/second, 2 samples/
second, 4 samples/second, 8 samples/second, 16 samples/second, 32 samples/second, 64 samples/second, and 120 samples/
second). In the Auto-Sleep mode, if no change in the orientation, shake or tap has occurred and the sleep counter has elapsed,
the device will go into the Auto-Wake mode. When the device is in the Auto-Sleep mode, the MODE (0x07) register, bit ASE is
high. The device can be programmed to continually cycle between Auto-Wake/Sleep.
NOTE: The device can either be powered on in Wake/Sleep state depending on ASE/AWE settings. If the AWE bit is
set, the device is powered on in, in sleep state. If the ASW bit is set, the device is powered on in, in wake state.
Table 8. Auto-Wake/Sleep Truth Table
Trigger Wake-up
Reset Sleep Counter
Trigger Sleep Mode
Orientation Detection Change
Yes
Yes
No
Shake
Yes
Yes
No
Yes
(XDA = YDA = ZDA = 0)
Yes
No
Pulse Detect (120 samples/second)
Yes
Yes
No
Sleep Counter Elapsed
No
No
Yes
Delta G
(set with PD (0x0A) and PDET (0x09))
MMA7660FC
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REGISTER DEFINITIONS
Table 9. User Register Summary
Address
Name
Definition
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
$00
XOUT
6-bit output value X
-
Alert
XOUT[5]
XOUT[4]
XOUT[3]
XOUT[2]
XOUT[1]
XOUT[0]
$01
YOUT
6-bit output value Y
-
Alert
YOUT[5]
YOUT[4]
YOUT[3]
YOUT[2]
YOUT[1]
YOUT[0]
$02
ZOUT
6-bit output value Z
-
Alert
ZOUT[5]
ZOUT[4]
ZOUT[3]
ZOUT[2]
ZOUT[1]
ZOUT[0]
$03
TILT
Tilt Status
Shake
Alert
Tap
PoLa[2]
PoLa[1]
PoLa[0]
BaFro[1]
BaFro[0]
$04
SRST
Sampling Rate Status
0
0
0
0
0
0
AWSRS
AMSRS
$05
SPCNT
Sleep Count
SC[7]
SC[6]
SC[5]
SC[4]
SC[3]
SC[2]
SC[1]
SC[0]
$06
INTSU
Interrupt Setup
SHINTX
SHINTY
SHINTZ
GINT
ASINT
PDINT
PLINT
FBINT
$07
MODE
Mode
IAH
IPP
SCPS
ASE
AWE
TON
-
MODE
$08
SR
Auto-Wake/Sleep and
Portrait/Landscape samples
per seconds and Debounce
Filter
FILT[2]
FILT[1]
FILT[0]
AWSR[1]
AWSR[0]
AMSR[2]
AMSR[1]
AMSR[0]
$09
PDET
Tap Detection
ZDA
YDA
XDA
PDTH[4]
PDTH[3]
PDTH[2]
PDTH[1]
PDTH[0]
$0A
PD
Tap Debounce Count
PD[7]
PD[6]
PD[5]
PD[4]
PD[3]
PD[2]
PD[1]
PD[0]
$0B-$1F
Factory
Reserved
-
-
-
-
-
-
-
-
NOTE: To write to the registers the MODE bit in the MODE (0x07) register must be set to 0, placing the device in Standby Mode.
$00: 6-bits output value X (Read Only when not in Test Mode)
XOUT — X Output
D7
D6
D5
D4
D3
D2
D1
D0
-
Alert
XOUT[5]
XOUT[4]
XOUT[3]
XOUT[2]
XOUT[1]
XOUT[0]
0
0
0
0
0
0
0
0
Signed byte 6-bit 2’s complement data with allowable range of +31 to -32.
XOUT[5] is 0 if the g direction is positive, 1 if the g direction is negative.
If the Alert bit is set, the register was read at the same time as the device was attempting to update the contents. The register
must be read again.
$01: 6-bits output value Y (Read Only when not in Test Mode)
YOUT — Y Output
D7
D6
D5
D4
D3
D2
D1
D0
-
Alert
YOUT[5]
YOUT[4]
YOUT[3]
YOUT[2]
YOUT[1]
YOUT[0]
0
0
0
0
0
0
0
0
Signed byte 6-bit 2’s complement data with allowable range of +31 to -32.
YOUT[5] is 0 if the g direction is positive, 1 if the g direction is negative.
If the Alert bit is set, the register was read at the same time as the device was attempting to update the contents. The register
must be read again.
$02: 6-bits output value Z (Read Only when not in Test Mode)
ZOUT — Z Output
D7
D6
D5
D4
D3
D2
D1
D0
-
Alert
ZOUT[5]
ZXOUT[4]
ZOUT[3]
ZOUT[2]
ZOUT[1]
ZOUT[0]
0
0
0
0
0
0
0
0
Signed byte 6-bit 2’s complement data with allowable range of +31 to -32.
ZOUT[5] is 0 if the g direction is positive, 1 if the g direction is negative.
If the Alert bit is set, the register was read at the same time as the device was attempting to update the contents. The register
must be read again.
MMA7660FC
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14
$03: Tilt Status (Read only)
TILT
D7
D6
D5
D4
D3
D2
D1
D0
Shake
Alert
Tap
PoLa[2]
PoLa[1]
PoLa[0]
BaFro[1]
BaFro[0]
0
0
0
0
0
0
0
0
BaFro[1:0]
Tap
1: Equipment has detected a tap
0: Equipment has not detected a tap
00:Unknown condition of front or back
01: Front: Equipment is lying on its front
10: Back: Equipment is lying on its back
PoLa[2:0]
000: Unknown condition of up or down or left or right
001: Left: Equipment is in landscape mode to the left
010: Right: Equipment is in landscape mode to the right
101: Down: Equipment standing vertically in inverted
orientation
110: Up: Equipment standing vertically in normal orientation
Alert
0: Register data is valid
1: The register was read at the same time as MMA7660FC
was attempting to update the contents. Re-read the register
Shake
0: Equipment is not experiencing shake in one or more of the
axes enabled by SHINTX, SHINTY, and SHINTZ
1: Equipment is experiencing shake in one or more of the
axes enabled by SHINTX, SHINTY, and SHINTZ
Note: When entering active mode from standby mode, if the device is flat (±1g on Z-axis) the value for BaFro will be back (-1g)
or front (+1g) but PoLa will be in unknown condition. if the device is being held in an Up/Down/Right/Left position, the PoLa value
will be updated with current orientation, but BaFro will be in unknown condition.
$04: Sample Rate Status Register (Read only)
SRST
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
0
AWSRS
AMSRS
0
0
0
0
0
0
0
0
AMSRS
0: Samples per second specified in AMSR[2:0] is not active
1: Samples per second specified in AMSR[2:0] is active
AWSRS
0: Samples per second specified in AWSR[1:0] is not active
1: Samples per second specified in AWSR[1:0] is active
$05: Sleep Count Register (Read/Write)
SPCNT
D7
D6
D5
D4
D3
D2
D1
D0
SC[7]
SC[6]
SC[5]
SC[4]
SC[3]
SC[2]
SC[1]
SC[0]
0
0
0
0
0
0
0
0
Writing to the SPCNT (0x05) register resets the internal sleep counter.
SC[7:0]
Sets the 8-bit maximum count value for the 8-bit internal sleep counter in Auto-Sleep. When the 8-bit internal sleep counter
reaches the value set by SC[7:0], MMA7660FC will exit Auto-Sleep and switch to the samples per second specified in AWSR[1:0]
of the SR (0x08) register.
MMA7660FC
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$06: Interrupt Setup Register
INTSU
D7
D6
D5
D4
D3
D2
D1
D0
SHINTX
SHINTY
SHINTZ
GINT
ASINT
PDINT
PLINT
FBINT
0
0
0
0
0
0
0
0
FBINT
0: Front/Back position change does not cause an interrupt
1: Front/Back position change causes an interrupt
PLINT
0: Up/Down/Right/Left position change does not cause an
interrupt
1: Up/Down/Right/Left position change causes an interrupt
PDINT
0: Successful tap detection does not cause an interrupt
1: Successful tap detection causes an interrupt
ASINT
0: Exiting Auto-Sleep does not cause an interrupt
1: Exiting Auto-Sleep causes an interrupt
GINT
0: There is not an automatic interrupt after every
measurement
1: There is an automatic interrupt after every measurement,
when g-cell readings are updated in XOUT, YOUT, ZOUT
registers, regardless of whether the readings have changed
or not. This interrupt does not affect the Auto-Sleep or AutoWake functions.
SHINTX
0: Shake on the X-axis does not cause an interrupt or set the
Shake bit in the TILT register
1: Shake detected on the X-axis causes an interrupt, and sets
the Shake bit in the TILT register
SHINTY
0: Shake on the Y-axis does not cause an interrupt or set the
Shake bit in the TILT register
1: Shake detected on the Y-axis causes an interrupt, and sets
the Shake bit in the TILT register
SHINTZ
0: Shake on the Z-axis does not cause an interrupt or set the
Shake bit in the TILT register
1: Shake detected on the Z-axis causes an interrupt, and sets
the Shake bit in the TILT register.
The active interrupt condition (IRQ = 0 if IAH = 0, IRQ = 1 if IAH = 1) is released during the acknowledge bit of the slave address
transmission of the first subsequent I2C to MMA7660FC after the interrupt was asserted.
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16
$07: Mode Register (Read/Write)
MODE
D7
D6
D5
D4
D3
D2
D1
D0
IAH
IPP
SCPS
ASE
AWE
TON
-
MODE
0
0
0
0
0
0
0
0
NOTE: Writing to the Mode register resets sleep timing, and clears the XOUT, YOUT, ZOUT, TILT registers.Reading to
the Mode register resets sleep timing.
NOTE: The device must be placed in Standby Mode to change the value of the registers.
Table 10. Modes
Mode of Operation
D0 - MODE
D2 - TON
Standby Mode
0
0
Test Mode
0
1
Active Mode
1
0
NOTE: The device can only enter into Test Mode, when the previous mode was Standby Mode. If the device was in
Active mode, set MMA766FC to Standby Mode (MODE = TON = 0), then enter Test Mode (MODE = 0, TON = 1).
MODE
0: Standby mode or Test Mode depending on state of TON
1: Active mode
Existing state of TON bit must be 0, to write MODE = 1. Test
Mode must not be enabled.
MMA7660FC always enters Active Mode using the samples
per second specified in AMSR[2:0] of the SR (0x08) register.
When MMA7660FC enters Active Mode with
[ASE:AWE] = 11, MMA7660FC operates Auto-Sleep
functionality first.
TON
0: Standby Mode or Active Mode depending on state of
MODE
1: Test Mode
Existing state of MODE bit must be 0, to write TON = 1.
Device must be in Standby Mode.
In Test Mode (TON = 1), the data in the XOUT, YOUT and
ZOUT registers is not updated by measurement, but is
instead updated by the user through the I2C interface for test
purposes. Changes to the XOUT, YOUT and ZOUT register
data is processed by MMA7660FC to change orientation
status and generate interrupts just like Active Mode.
Debounce filtering and shake detection are disabled in Test
Mode.
AWE
0: Auto-Wake is disabled
1: Auto-Wake is enabled.
When Auto-Wake functionality is operating, the AWSRS bit is
the SRST register is set and the device uses the samples per
second specified in AWSR[1:0] of the SR (0x08) register.
When MMA7660FC automatically exits Auto-Wake by a
selected interrupt, the device will then switch to the samples
per second specified in AMSR[2:0] of the SR (0x08) register.
If ASE = 1, then Auto-Sleep functionality is now enabled
(Table 11).
ASE
0: Auto-Sleep is disabled
1: Auto-Sleep is enabled
When Auto-Sleep functionality is operating, the AMSRS bit is
the SRST register is set and the device uses the samples per
second specified in AMSR[2:0] of the SR (0x08) register.
When MMA7660FC automatically exits Auto-Sleep because
the Sleep Counter times out, the device will then switch to the
samples per second specified in AWSR[1:0] of the SR
register. If AWE = 1, then Auto-Wake functionality is now
enabled (Table 11).
SCPS
0: The prescaler is divide-by-1. The 8-bit internal Sleep
Counter input clock is the samples per second set by
AMSR[2:0], so the clock range is 120 Hz to 1 Hz depending
on AMSR[2:0] setting. Sleep Counter timeout range is
256 times the prescaled clock (see Table 12).
1: Prescaler is divide-by-16. The 8-bit Sleep Counter input
clock is the samples per second set by AMSR[2:0] divided by
16, so the clock range is 4 Hz to 0.0625 Hz depending on
AMSR[2:0] setting. Sleep Counter timeout range is 256 times
the prescaled clock (see Table 12).
IPP
0: Interrupt output INT is open-drain.
1: Interrupt output INT is push-pull
NOTE: Do NOT connect pull-up resistor from INT to
higher voltage than DVDD.
IAH
0: Interrupt output INT is active low
1: Interrupt output INT is active high
The active interrupt condition (IRQ = 0 if IAH = 0, IRQ = 1 if IAH = 1) is released during the acknowledge bit of the slave address
transmission of the first subsequent I2C to the device after the interrupt was asserted.
MMA7660FC
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Table 11. ASE/AWE Conditions
Condition
Auto-Wake (Sleep Mode)
Auto-Sleep (Run Mode)
AWE = 0, ASE = 0
X
AWE = 1, ASE = 0
X
AWE = 0, ASE = 1
X
X
AWE = 1, ASE = 1
X
X
NOTE: If interrupts are enabled, interrupts will behave normally in all conditions stated in Table 11.
Table 12. Sleep Counter Timeout Ranges
SCPS = 0
SCPS = 1
AMSR
Minimum Range (20)
Maximum Range (28)
Minimum Range (20)
Maximum Range (28)
1 SPS
1s
256 s
16 s
4096 s
2 SPS
0.5 s
128 s
8s
2048 s
4 SPS
0.25 s
34 s
4s
1024 s
8 SPS
0.125 s
32 s
2s
512 s
16 SPS
0.625 s
16 s
1s
256 s
32 SPS
0.03125 s
8s
0.5 s
128 s
64 SPS
0.0156 s
4s
0.25 s
64 s
120 SPS
0.00836 s
2.14 s
0.133 s
34.24 s
$08: Auto-Wake and Active Mode Portrait/Landscape Samples per Seconds Register (Read/Write)
SR — Sample Rate Register
D7
D6
D5
D4
D3
D2
D1
D0
FILT[2]
FILT[1]
FILT[0]
AWSR[1]
AWSR[0]
AMSR[2]
AMSR[1]
AMSR[0]
0
0
0
0
0
0
0
0
MMA7660FC
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18
AMSR[2:0]
NAME
000
AMPD
Tap Detection Mode and 120 Samples/Second Active and Auto-Sleep Mode
Tap Detection Sampling Rate: The device takes readings continually at a rate of nominally 3846 g-cell
measurements a second. It then filters these high speed measurements by maintaining continuous rolling averages of
the current and last g-cell measurements. The averages are updated every 260 µs to track fast moving accelerations.
Tap detection: itself compares the two filtered axis responses (fast and slow) described above for each axis. The
absolute (unsigned) difference between the fast and slow axis responses is compared against the tap detection delta
threshold value PDTH[4:0] in the PDET (0x09) register.
For portrait/landscape detection: The device takes and averages 32 g-cell measurements every 8.36 ms in Active
Mode and Auto-Sleep. The update rate is 120 samples per second. These measurements update the XOUT (0x00),
YOUT (0x01), and ZOUT (0x02) registers also.
DESCRIPTION
001
AM64
64 Samples/Second Active and Auto-Sleep Mode
For portrait/landscape detection: The device takes and averages 32 g-cell measurements every
15.625 ms in Active Mode and Auto-Sleep. The update rate is 64 samples per second. These measurements update
the XOUT (0x00), YOUT (0x01), and ZOUT (0x02) registers also.
010
AM32
32 Samples/Second Active and Auto-Sleep Mode
For portrait/landscape detection: The device takes and averages 32 g-cell measurements every 31.25 ms in Active
Mode and Auto-Sleep. The update rate is 32 samples per second. These measurements update XOUT (0x00), YOUT
(0x01), and ZOUT (0x02) registers also.
011
AM16
16 Samples/Second Active and Auto-Sleep Mode
For portrait/landscape detection: The device takes and averages 32 g-cell measurements every 62.5 ms in Active
Mode and Auto-Sleep. The update rate is 16 samples per second. These measurements update the XOUT (0x00),
YOUT (0x01), and ZOUT (0x02) registers also.
100
AM8
8 Samples/Second Active and Auto-Sleep Mode
For portrait/landscape detection: The device takes and averages 32 g-cell measurements every 125 ms in Active
Mode and Auto-Sleep. The update rate is 8 samples per second. These measurements update the XOUT (0x00),
YOUT (0x01), and ZOUT (0x02) registers also.
101
AM4
4 Samples/Second Active and Auto-Sleep Mode
For portrait/landscape detection: The device takes and averages 32 g-cell measurements every 250 ms in Active
Mode and Auto-Sleep. The update rate is 4 samples per second. These measurements update the XOUT (0x00),
YOUT (0x01), and ZOUT (0x02) registers also.
110
AM2
2 Samples/Second Active and Auto-Sleep Mode
For portrait/landscape detection: The device takes and averages 32 g-cell measurements every 500 ms in Active
Mode and Auto-Sleep. The update rate is 2 samples per second. These measurements update the XOUT (0x00),
YOUT (0x01), and ZOUT (0x02) registers also.
111
AM1
1 Sample/Second Active and Auto-Sleep Mode
For portrait/landscape detection: The device takes and averages 32 g-cell measurements every 1000 ms in Active
Mode and Auto-Sleep. The update rate is 1 sample per second. These measurements update the XOUT (0x00), YOUT
(0x01), and ZOUT (0x02) registers also.
MMA7660FC
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AWSR[1:0]
00
NAME
AW32
01
AW16
10
AW8
11
AW1
FILT[2:0]
000
001
010
011
100
101
110
111
DESCRIPTION
32 Samples/Second Auto-Wake Mode
For portrait/landscape detection: The device takes and averages 32 g-cell measurements every 31.25 ms in
Auto-Wake. The update rate is 32 samples per second. These measurements update the XOUT (0x00), YOUT
(0x01), and ZOUT (0x02) registers also.
16 Samples/Second Auto-Wake Mode
For portrait/landscape detection: The device takes and averages 32 g-cell measurements every 62.5 ms in
Auto-Wake. The update rate is 16 samples per second. These measurements update the XOUT (0x00), YOUT
(0x01), and ZOUT (0x02) registers also.
8 Samples/Second Auto-Wake Mode
For portrait/landscape detection: The device takes and averages 32 g-cell measurements every 125 ms in
Auto-Wake. The update rate is 8 samples per second. These measurements update the XOUT (0x00), YOUT
(0x01), and ZOUT (0x02) registers also.
1 Sample/Second Auto-Wake Mode
For portrait/landscape detection: The device takes and averages 32 g-cell measurements every 1000 ms in
Auto-Wake. The update rate is 1 sample per second. These measurements update the XOUT (0x00), YOUT
(0x01), and ZOUT (0x02) registers also.
DESCRIPTION
Tilt debounce filtering is disabled. The device updates portrait/landscape every reading at the rate set by AMSR[2:0] or
AWSR[1:0]
2 measurement samples at the rate set by AMSR[2:0] or AWSR[1:0] have to match before the device updates portrait/
landscape data in TILT (0x03) register.
3 measurement samples at the rate set by AMSR[2:0] or AWSR[1:0] have to match before the device updates portrait/
landscape data in TILT (0x03) register.
4 measurement samples at the rate set by AMSR[2:0] or AWSR[1:0] have to match before the device updates portrait/
landscape data in TILT (0x03) register.
5 measurement samples at the rate set by AMSR[2:0] or AWSR[1:0] have to match before the device updates portrait/
landscape data in TILT (0x03) register.
6 measurement samples at the rate set by AMSR[2:0] or AWSR[1:0] have to match before the device updates portrait/
landscape data in TILT (0x03) register.
7 measurement samples at the rate set by AMSR[2:0] or AWSR[1:0] have to match before the device updates portrait/
landscape data in TILT (0x03) register.
8 measurement samples at the rate set by AMSR[2:0] or AWSR[1:0] have to match before the device updates portrait/
landscape data in TILT (0x03) register.
MMA7660FC
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Freescale Semiconductor, Inc.
20
$09: Tap/Pulse Detection Register (Read/Write)
PDET
D7
D6
D5
D4
D3
D2
D1
D0
ZDA
YDA
XDA
PDTH[4]
PDTH[3]
PDTH[2]
PDTH[1]
PDTH[0]
0
0
0
0
0
0
0
0
NOTE: If XDA = YDA = ZDA = 0, samples per second is 120 samples/second, and Auto-Wake/Sleep feature is enabled,
the tap interrupt will reset the sleep counter.
PDTH[4:0]
00000
00001
00010
00011
...
11101
11110
11111
DESCRIPTION
Tap detection threshold is ±1 count
Tap detection threshold is ±2 counts
Tap detection threshold is ±3 counts
... and so on up to...
Tap detection threshold is ±29 counts
Tap detection threshold is ±30 counts
Tap detection threshold is ±31 counts
XDA
1: X-axis is disabled for tap detection
0: X-axis is enabled for tap detection
YDA
1: Y-axis is disabled for tap detection
0: Y-axis is enabled for tap detection
ZDA
1: Z-axis is disabled for tap detection
0: Z-axis is enabled for tap detection
$0A: PD: Tap/Pulse Debounce Count Register (Read/Write)
D7
D6
D5
D4
D3
D2
D1
D0
PD[7]
PD[6]
PD[5]
PD[4]
PD[3]
PD[2]
PD[1]
PD[0]
0
0
0
0
0
0
0
0
PD[4:0]
00000000
00000001
00000010
00000011
...
11111101
11111110
11111111
DESCRIPTION
The tap detection debounce filtering requires 2 adjacent tap detection tests to be the same to trigger a tap event and set the
Tap bit in the TILT (0x03) register, and optionally set an interrupt if PDINT is set in the INTSU (0x06) register. Tap detection
response time is nominally 0.52 ms.
Tap detection debounce filtering requires 3 adjacent tap detection tests to be the same to trigger a tap event and set the Tap
bit in the TILT (0x03) register, and optionally set an interrupt if PDINT is set in the INTSU (0x06) register. Tap detection
response time is nominally 0.78 ms.
Tap detection debounce filtering requires 4 adjacent tap detection tests to be the same to trigger a tap event and set the Tap
bit in the TILT (0x03) register, and optionally set an interrupt if PDINT is set in the INTSU (0x06) register. Tap detection
response time is nominally 1.04 ms.
... and so on up to...
Tap detection debounce filtering requires 254 adjacent tap detection tests to be the same to trigger a tap event and set the
Tap bit in the TILT (0x03) register, and optionally set an interrupt if PDINT is set in the INTSU (0x06) register. Tap detection
response time is nominally 66.04 ms.
Tap detection debounce filtering requires 255 adjacent tap detection tests to be the same to trigger a tap event and set the
Tap bit in the TILT (0x03) register, and optionally set an interrupt if PDINT is set in the INTSU (0x06) register. Tap detection
response time is nominally 66.3 ms.
Tap detection debounce filtering requires 256 adjacent tap detection tests to be the same to trigger a tap event and set the
Tap bit in the TILT (0x03) register, and optionally set an interrupt if PDINT is set in the INTSU (0x06) register. Tap detection
response time is nominally 66.56 ms.
MMA7660FC
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SERIAL INTERFACE
Serial-Addressing
MMA7660FC operates as a slave that sends and receives data through an I2C 2-wire interface. The interface uses a Serial
Data Line (SDA) and a Serial Clock Line (SCL) to achieve bi-directional communication between master(s) and slave(s). A
master (typically a microcontroller) initiates all data transfers to and from the device, and generates the SCL clock that
synchronizes the data transfer.
SDA
tSU DAT
tLOW
SCL
tHD DAT
tSU STA
tBUF
tHD STA
tSU STO
tHIGH
tHD STA
tR
tF
ST ART
CONDIT ION
REPEAT ED ST ART
CONDIT ION
ST OP
CONDIT ION
ST ART
CONDIT ION
Figure 7. 2-Wire Serial Interface Timing Details
The device’s SDA line operates as both an input and an open-drain output. A pull-up resistor, typically 4.7 kΩ, is required on
SDA. The device’s SCL line operates only as an input. A pull-up resistor, typically 4.7 kΩ, is required on SCL if there are multiple
masters on the 2-wire interface, or if the master in a single-master system has an open-drain SCL output.
Each transmission consists of a START condition (Figure 7) sent by a master, followed by MMA7660FC's 7-bit slave address
plus R/W bit, a register address byte, one or more data bytes, and finally a STOP condition.
SDA
DATA LINE STABLE
DATA VALID
SCL
CHANGE OF
DATA ALLOWED
Figure 8. Start and Stop Conditions
Start and Stop Conditions
Both SCL and SDA remain high when the interface is not busy. A master signals the beginning of a transmission with a
START (S) condition by transitioning SDA from high to low while SCL is high. When the master has finished communicating with
the slave, it issues a STOP (P) condition by transitioning SDA from low to high while SCL is high. The bus is then free for another
transmission.
Bit Transfer
One data bit is transferred during each clock tap. See Figure 9. The data on SDA must remain stable while SCL is high.
SDA
SCL
S
P
START
CONDITION
STOP
CONDITION
Figure 9. Bit Transfer
MMA7660FC
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Freescale Semiconductor, Inc.
22
Acknowledge
The acknowledge bit is a clocked 9th bit, shown in Figure 10, which the recipient uses to handshake a receipt of each byte of
data. Thus each byte transferred effectively requires 9-bits. The master generates the 9th clock tap, and the recipient pulls down
SDA during the acknowledge clock tap, such that the SDA line is stable low during the high period of the clock tap. When the
master is transmitting to MMA7660FC, it generates the acknowledge bit because it is the recipient. When the device is
transmitting to the master, the master generates the acknowledge bit because the master is the recipient.
START
CONDITION
CLOCK
TAP FOR
CLOCK
PULSE
FOR
ACKNOWLEDGEMENT
SCL
1
2
8
9
SDA
BY TRANSMITTER
SDA
S
BY RECEIVER
Figure 10. Acknowledge
The Slave Address
MMA7660FC has a 7-bit long slave address, shown in Figure 11. The bit following the 7-bit slave address (bit eight) is the
R/W bit, which is low for a write command and high for a read command. The device has a factory set I2C slave address which
is normally 1001100 (0x4C). Contact the factory to request a different I2C slave address, which is available in the range 0001000
to 1110111 (0x08 to 0xEF), by metal mask option.
SDA
1
MSB
0
0
1
1
0
0
R/W
ACK
SCL
Figure 11. Slave Address
The device monitors the bus continuously, waiting for a START condition followed by its slave address. When the device
recognizes its slave address, it acknowledges and is then ready for continued communication.
Message Format for Writing MMA7660FC
A write to MMA7660FC comprises the transmission of the device’s keyscan slave address with the R/W bit set to 0, followed
by at least one byte of information. The first byte of information is the register address of the first internal register that is to be
updated. The Master Write address is 1001 1000 (0x98). If a STOP condition is detected after just the register address is
received, then MMA7660FC takes no action. See Figure 12. MMA7660FC clears its internal register address pointer to register
0x00 when a STOP condition is detected, so a single byte write has no net effect because the register address given in this first
and only byte is replaced by 0x00 at the STOP condition. The internal register address pointer is not, however, cleared on a
repeated start condition. Use a single byte write followed by a repeated start to read back data from a register.
Any bytes received after the register address are data bytes. The first data byte goes into the internal register of the device
selected by the register address. See Figure 12.
Master
Slave
ST
Device Address [6:0]
W
Register Address [6:0]
AK
Data [7:0]
AK
SP
AK
Figure 12. Single Byte Write
MMA7660FC
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Freescale Semiconductor, Inc.
If multiple data bytes are transmitted before a STOP condition is detected, these bytes are generally stored in subsequent
MMA7660FC internal registers because the register address generally auto-increments.
Master
ST
Device Address [6:0]
W
Register Address [6:0]
AK
Slave
Data [7:0]
AK
Data [7:0]
SP
AK
AK
Figure 13. Multiple Bytes Write
Message Format for Reading MMA7660FC
MMA7660FC is read using it’s internally stored register address as address pointer, the same way the stored register address
is used as address pointer for a write. The pointer generally auto-increments after each data byte is read using the same rules
as for a write. Thus, a read is initiated by first configuring the device’s register address by performing a write (Figure 12) followed
by a repeated start. The Master Write address is 1001 1001 (0x99). The master can now read 'n' consecutive bytes from it, with
the first data byte being read from the register addressed by the initialized register address.
Master
ST
Device Address [6:0]
W
Register Address [6:0]
AK
Slave
SR Device Address [6:0]
R
AK
NAK SP
AK
Data [7:0]
Figure 14. Single Byte Read
Master
ST
Device Address [6:0]
Register Address [6:0]
AK
Slave
AK
Master
Slave
W
Data [7:0]
AK
AK
Data [7:0]
SR Device Address [6:0]
R
AK
AK
Data [7:0]
NAK SP
Data [7:0]
Figure 15. Multiple Bytes Read
MMA7660FC
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Freescale Semiconductor, Inc.
24
APPENDIX A – PACKAGE REQUIREMENTS FOR MMA7660FC
Minimum Recommended Footprint for Surface Mounted Applications
Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the
correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the
packages will self-align when subjected to a solder reflow process. It is always recommended to design boards with a solder
mask layer to avoid bridging and shorting between solder pads.
Soldering And Mounting Guidelines for the DFN Accelerometer Sensor to a PC Board
These guidelines are for soldering and mounting the Dual Flat No-Lead (DFN) package inertial sensors to printed circuit
boards (PCBs). The purpose is to minimize the stress on the package after board mounting. The MMA7660 digital output
accelerometer uses the DFN package platform. This section describes suggested methods of soldering these devices to the PC
board for consumer applications. Pages 31, 32, and 33 show the package outline drawing for the package.
Overview of Soldering Considerations
Information provided here is based on experiments executed on DFN devices. They do not represent exact conditions present
at a customer site. Hence, information herein should be used as guidance only and process and design optimizations are
recommended to develop an application specific solution. It should be noted that with the proper PCB footprint and solder stencil
designs the package will self-align during the solder reflow process. The following are the recommended guidelines to follow for
mounting DFN sensors for consumer applications.
Halogen Content
This package is designed to be Halogen Free, exceeding most industry and customer standards. Halogen Free means that
no homogeneous material within the assembly package shall contain chlorine (Cl) in excess of 700 ppm or 0.07% weight/weight
or bromine (Br) in excess of 900 ppm or 0.09% weight/weight.
Note: Halogen Free is only compliant to the MMA7660FC, not to the packaging material.
PCB Mounting Recommendations
1. The PCB land should be designed with Non Solder Mask Defined (NSMD) as shown in Figure 16 and Figure 17.
2. No additional via pattern underneath package.
3. PCB land pad is 0.825 mm x 0.3 mm as shown in Figure 16 and Figure 17.
4. Do not solder down smaller side tabs on either end of the package.
5. The solder mask opening is equal to the size of the PCB land pad plus 0.15 mm.
6. The stencil aperture size is equal to the PCB land pad – minus 0.03 mm total.
7. Stencil thickness should be 75 μm.
8. Do not place any components or vias at a distance less than 2 mm from the package land area. This may cause additional
package stress if it is too close to the package land area.
9. Signal traces connected to pads should be as symmetric as possible. Put dummy traces on NC pads in order to have same
length of exposed trace for all pads. Signal traces with 0.15 mm width and minimum 0.5 mm length for all PCB land pads
near the package are recommended as shown in Figure 16 and Figure 17. Wider trace can be continued after the 0.5 mm
zone.
10. Use a standard pick and place process and equipment. Do not use a hand soldering process.
11. It is recommended to use a no clean solder paste.
12. Do not use a screw down or stacking to fix the PCB into an enclosure because this could bend the PCB putting stress on
the package.
13. The PCB should be rated for the multiple lead-free reflow condition with max 260°C temperature.
14. No copper traces on top layer of PCB under the package. This will cause planarity issues with board mount.
Freescale DFN sensors are compliant with Restrictions on Hazardous Substances (RoHS), having halide free molding
compound (green) and lead-free terminations. These terminations are compatible with tin-lead (Sn-Pb) as well as tin-silvercopper (Sn-Ag-Cu) solder paste soldering processes. Reflow profiles applicable to those processes can be used successfully for
soldering the devices.
MMA7660FC
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Freescale Semiconductor, Inc.
Figure 16. Package Footprint, PCB Land Pattern, and Stencil Design
Figure 17. PCB Land Pattern Detail
MMA7660FC
Sensors
Freescale Semiconductor, Inc.
26
APPENDIX B - SENSING DIRECTION
Top View
Direction of Earth’s Gravity
XOUT @ 0g
YOUT @ 0g
ZOUT @ +1g
XOUT @ -1g
YOUT @ 0g
ZOUT @ 0g
Side View
XOUT @ 0g
YOUT @ -1g
ZOUT @ 0g
XOUT @ 0g
YOUT @ +1g
ZOUT @ 0g
XOUT @ 0g
YOUT @ 0g
ZOUT @ -1g
XOUT @ +1g
YOUT @ 0g
ZOUT @ 0g
Figure 18. Product Orientation on Perpendicular Axis
+Z
-Z
+Y
-Y
-X
+X
-X
+X
+Y
-Y
-Z
+Z
Figure 19. Product Orientations Showing Direction for Each Axis in Composite
MMA7660FC
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Freescale Semiconductor, Inc.
APPENDIX C - MMA7660FC ACQUISITION CODE TABLE
Binary
2's Comp
g value
Angle X or Y
Angle Z
0
0
0
0.000g
0.00°
90.00°
1
1
1
0.047g
2.69°
87.31°
2
10
2
0.094g
5.38°
84.62°
3
11
3
0.141g
8.08°
81.92°
4
100
4
0.188g
10.81°
79.19°
5
101
5
0.234g
13.55°
76.45°
6
110
6
0.281g
16.33°
73.67°
7
111
7
0.328g
19.16°
70.84°
8
1000
8
0.375g
22.02°
67.98°
9
1001
9
0.422g
24.95°
65.05°
10
1010
10
0.469g
27.95°
62.05°
11
1011
11
0.516g
31.04°
58.96°
12
1100
12
0.563g
34.23°
55.77°
13
1101
13
0.609g
37.54°
14
1110
14
0.656g
41.01°
15
1111
15
0.703g
44.68°
16
10000
16
0.750g
48.59°
17
10001
17
0.797g
52.83°
18
10010
18
0.844g
57.54°
19
10011
19
0.891g
62.95°
20
10100
20
0.938g
69.64°
21
10101
21
0.984g
79.86°
22
10110
22
1.031g
23
10111
23
1.078g
24
11000
24
1.125g
25
11001
25
1.172g
26
11010
26
1.219g
27
11011
27
1.266g
28
11100
28
1.313g
Shaken
29
11101
29
1.359g
Shaken
30
11110
30
1.406g
Shaken
31
11111
31
1.453g
Shaken
63
111111
-1
-0.047g
-2.69°
-87.31°
62
111110
-2
-0.094g
-5.38°
-84.62°
61
111101
-3
-0.141g
-8.08°
-81.92°
60
111100
-4
-0.188g
-10.81°
-79.19°
59
111011
-5
-0.234g
-13.55°
-76.45°
58
111010
-6
-0.281g
-16.33°
-73.67°
57
111001
-7
-0.328g
-19.16°
-70.84°
56
111000
-8
-0.375g
-22.02°
-67.98°
55
110111
-9
-0.422g
-24.95°
-65.05°
54
110110
-10
-0.469g
-27.95°
-62.05°
53
110101
-11
-0.516g
-31.04°
-58.96°
52
110100
-12
-0.563g
-34.23°
-55.77°
51
110011
-13
-0.609g
-37.54°
-52.46°
50
110010
-14
-0.656g
-41.01°
-48.99°
Z-axis must be in the range
6-bit result
52.46°
48.99°
45.32°
41.41°
37.17°
32.46°
27.05°
20.36°
10.14°
MMA7660FC
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Freescale Semiconductor, Inc.
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APPENDIX C - MMA7660FC ACQUISITION CODE TABLE, continued
49
110001
-15
-0.703g
-44.68°
-45.32°
48
110000
-16
-0.750g
-48.59°
-41.41°
47
101111
-17
-0.797g
-52.83°
-37.17°
46
101110
-18
-0.844g
-57.54°
-32.46°
45
101101
-19
-0.891g
-62.95°
-27.05°
44
101100
-20
-0.938g
-69.64°
-20.36°
43
101011
-21
-0.984g
-79.86°
-10.14°
42
101010
-22
-1.031g
41
101001
-23
-1.078g
40
101000
-24
-1.125g
39
100111
-25
-1.172g
38
100110
-26
-1.219g
37
100101
-27
-1.266g
36
100100
-28
-1.313g
Shaken
35
100011
-29
-1.359g
Shaken
34
100010
-30
-1.406g
Shaken
33
100001
-31
-1.453g
Shaken
32
100000
-32
-1.500g
Shaken
MMA7660FC
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APPENDIX D - I2C AC CHARACTERISTICS
This section includes information about I2C AC Characteristics.
Table 1. I2C AC Characteristics
(Typical Operating Circuit, VDD = 1.71 V to 2.75 V, TA = TMIN to TMAX, unless otherwise noted. Typical current values are at
VDD = 1.8 V, TA = +25°C.)
Parameter
Symbol
Min
Typ
Max
Units
400
kHz
Serial Clock Frequency(1)
fSCL
Bus Free Time Between a STOP and a START Condition(2)
tBUF
1.3
µs
Hold Time, (Repeated) START Condition(2)
tHD, STA
0.6
µs
Repeated START Condition Setup Time(2)
tSU, STA
0.6
µs
STOP Condition Setup Time(2)
tSU, STO
0.6
µs
Data Hold Time(2)
tHD, DAT
Data Setup Time(2)
tSU, DAT
100
ns
SCL Clock Low Period(2)
tLOW
1.3
µs
SCL Clock High Period(2)
tHIGH
0.7
µs
0.9
µs
Rise Time of Both SDA and SCL Signals, Receiving(2)
tR
20+0.1Cb
300
ns
Fall Time of Both SDA and SCL Signals, Receiving(2)
tF
20+0.1Cb
300
ns
tF.TX
20+0.1Cb
250
ns
Pulse Width of Spike Suppressed(2)
tSP
25
Capacitive Load for Each Bus Line(2)
Cb
Fall Time of SDA Transmitting(2)
ns
400
pF
1. Parameters tested 100% at final test at room temperature; limits at -40°C and +85°C, verified by characterization, not test in production.
2. Limits verified by characterization, not tested in production.
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PACKAGE DIMENSIONS
MMA7660FC
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PACKAGE DIMENSIONS
MMA7660FC
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PACKAGE DIMENSIONS
MMA7660FC
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Table 2. Revision History
Revision
number
Revision
date
9
03/2012
Description of changes
• Changed pin 10 from N/C to RESERVED on page 1, Figure 1, Figure 2 and Table 1: Pin
description.
MMA7660FC
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34
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