Freescale Semiconductor
Product Brief
Document Number: MC9S12XEPB
Rev. 9, 4/2015
MC9S12XE Family Product Brief
16-Bit Microcontroller Family with Enhanced System
Integrity Features
Contents
1 Introduction
1
Introduction................................................................1
The new MC9S12XE Family of microcontrollers takes the
innovation of today’s MC9S12XD Family a step further with
the introduction of new features to deliver enhanced system
integrity and greater functionality. These new features include
a Memory Protection Unit (MPU) and Error Correction Code
(ECC) on the Flash memory together with enhanced
EEPROM functionality (EEE), an enhanced XGATE, a
Frequency Modulated Phase Locked Loop (IPLL) and a faster
ATD. The E Family will extend the S12X product range up to
1MB of Flash memory with increased I/O capability in the
208-pin version of the flagship MC9S12XEP100.
2
Application Examples............................................... 2
Targeted at automotive multiplexing and generic auto body
applications, S12XE Family will deliver 32-bit performance
with all the advantages and efficiencies of a 16-bit MCU. It
will retain the low cost, power consumption, EMC and codesize efficiency advantages currently enjoyed by users of
Freescale’s existing 16-bit S12 and S12X MCU families.
There is a high level of compatibility between the S12XE and
S12XD families.
Like members of other S12X families, the S12XE Family will
run 16-bit wide accesses without wait states for all peripherals
and memories.
The S12XE Family features an enhanced version of the
performance-boosting XGATE co-processor which is
programmable in “C” language and runs at twice the bus
frequency of the S12X with an instruction set optimized for
© 2015 Freescale Semiconductor, Inc.
3
2.1
Body Controller Application
Example....................................... .................. 2
2.2
Gateway Application Example.......................3
Features................................ ..................................... 3
3.1
Block Diagram..................... .......................... 3
3.2
Peripheral and Memory Options
S12XE Family................................................4
3.3
Critical Performance
Parameters...................................................... 6
3.4
Chip-Level Features................ .......................6
3.5
Module Features............................................. 7
4
Developer Environment...........................................12
5
Document Revision History.................................... 13
Application Examples
data movement, logic and bit manipulation instructions and which can service any peripheral module on the device. The new
enhanced version has improved interrupt handling capability and is fully compatible with existing XGATE module.
As with the S12XD Family, the S12XE Family features an enhanced MSCAN module which, when used in conjunction with
XGATE, delivers FULL CAN performance with virtually unlimited number of mailboxes and retains backwards
compatibility with the MSCAN module featured on existing S12 products.
The S12XE Family has full 16-bit data paths throughout. The non-multiplexed expanded bus interface available on the 144pin versions allows an easy interface to external memories. In addition to the I/O ports available in each module, up to 25
further I/O ports are available with interrupt capability allowing wake-up from STOP orWAIT mode. The S12XE Family is
available in 208-Pin MAPBGA, 144-pin LQFP (both with optional external bus), 112-pin LQFP or 80-Pin QFP options.
2 Application Examples
The following sections describe target applications of the MC9S12XE.
2.1 Body Controller Application Example
In this example, the MC9S12XE is implementing the features of a typical car body controller application. The module
interfaces with the main CAN buses distributed in the car using the on-chip MSCAN module whereas the LIN bus
communicates with functions local to the body controller. In both cases the communication functions are managed by the
XGATE independently of the CPU. The MC9S12XE provides direct control of power drivers for lights and pumps and
reading of sensors, using the on-chip PWM and ATD modules. Finally, the SPI interface to the RF receiver provides the
interface to the car remote access system.
Figure 1. Body Controller Application Example
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Features
2.2 Gateway Application Example
In this application, the MC9S12XE provides gateway functionality between its on-chip CAN and LIN modules. Much of the
low-level communications functionality is handled by the XGATE, which frees the CPU to manage higher level
communications and other direct connections to the module.
Figure 2. Gateway Application Example
3 Features
Features of the S12XE Family are described in this section.
3.1 Block Diagram
Figure 3 shows a top-level block diagram of the S12XE Family.
MC9S12XE Family Product Brief, Rev. 9, 4/2015
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3
Features
Figure 3. MC9S12XE Block Diagram
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Features
3.2 Peripheral and Memory Options S12XE Family
Table 1. Peripheral and Memory Options of S12XE Family Members
XGA
TE
CAN1
SCI2
SPI3
IIC4
ECT
TIM5
PIT
A/D6
Yes
5
8
3
2
8ch
8ch
8ch
2/32
152
144LQFP
5
8
3
2
8ch
8ch
8ch
2/24
119
112LQFP
5
8
3
1
8ch
8ch
8ch
2/16
91
80QFP
4
2
3
1
8ch
8ch
8ch
1/8
59
9S12XEP
208
768
MAPBGA
5
8
3
2
8ch
8ch
8ch
2/32
152
144LQFP
5
8
3
2
8ch
8ch
8ch
2/24
119
112LQFP
5
8
3
1
8ch
8ch
8ch
2/16
91
80QFP
4
2
3
1
8ch
8ch
8ch
1/8
59
4
6
3
2
8ch
0
4ch
2/24
119
4
6
3
1
8ch
0
4ch
1/16
91
4
2
3
1
8ch
0
4ch
1/8
59
4
6
3
2
8ch
0
4ch
2/24
119
4
6
3
1
8ch
0
4ch
2/16
91
4
2
3
1
8ch
0
4ch
1/8
59
3
4
3
1
8ch
0
4ch
2/24
119
3
4
3
1
8ch
0
4ch
2/16
91
3
2
3
1
8ch
0
4ch
1/8
59
2
2
2
1
8ch
0
2ch
2/16
91
2
2
2
1
8ch
0
2ch
1/8
59
Device
Package
9S12XEP
208
100
MAPBGA
9S12XEQ 144LQFP
512
112LQFP
80QFP
9S12XEQ 144LQFP
384
112LQFP
80QFP
9S12XET 144LQFP
256
112LQFP
80QFP
9S12XEG 112LQFP
128
80QFP
Yes9
I/O7, 8 Flash RAM
1M
64K
768K
48K
512K
32K
384K
24K
256K
16K
128K
12K
EEPRO
M (DFlash)
4K (32K)
2K (32K)
1. CAN Options:
Versions with 5 CAN modules will have CAN0, CAN1, CAN2, CAN3 and CAN4.
Versions with 4 CAN modules will have CAN0, CAN1, CAN2 and CAN4.
Versions with 3 CAN modules will have CAN0, CAN1 and CAN4.
Versions with 2 CAN modules will have CAN0 and CAN4.
Versions with 1 CAN module will have CAN0.
2. SCI Options:
Versions with 8 SCI modules will have SCI0, SCI1, SCI2, SCI3, SCI4, SCI5, SCI6 and SCI7.
Versions with 7 SCI modules will have SCI0, SCI1, SCI2, SCI3, SCI4, SCI5, and SCI6.
Versions with 6 SCI modules will have SCI0, SCI1, SCI2, SCI3, SCI4 and SCI5.
Versions with 5 SCI modules will have SCI0, SCI1, SCI2, SCI3 and SCI4.
Versions with 4 SCI modules will have SCI0, SCI1, SCI2 and SCI4.
Versions with 3 SCI modules will have SCI0, SCI1 and SCI2.
Versions with 2 SCI modules will have SCI0 and SCI1.
Versions with 1 SCI module will have SCI0.
3. SPI Options:
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Features
Versions with 3 SPI modules will have SPI0, SPI1 and SPI2.
Versions with 2 SPI modules will have SPI0 and SPI1.
Versions with 1 SPI modules will have SPI0.
4. IIC Options:
Versions with 2 IIC modules will have IIC0 and IIC1.
Versions with 1 IIC module will have IIC0.
5. TIM available via rerouting on EP100,EP768 devices 80/112/144 pinout options
6. A/D is the number of modules/total number of A/D channels.
7. I/O is the sum of ports capable to act as digital input or output. For details see the “Port Availability by Package Option”
table in the MCS12XE Data Sheet.
8. I/O is the sum of ports capable to act as digital input or output. For details see the “Port Availability by Package Option”
table in the MCS12XE Data Sheet.
9. Can only execute code from RAM
3.3 Critical Performance Parameters
The following describes the critical operating parameters of the MCU.
3.3.1 Operating Conditions
• Wide single supply voltage range 3.3V-5%/+10% to 5.0V+10% at full performance
• Separate supply for internal voltage regulator and I/O allow optimized EMC filtering
• 50MHz maximum CPU bus frequency
• 100MHz maximum XGATE bus frequency
• Ambient temperature range -40°C to 125°C
• Temperature Options:
• -40°C to 85°C
• -40°C to 105°C
• -40°C to 125°C
3.3.2 Package Options
•
•
•
•
208-pin MAPBGA - 17mm x 17mm body size (case no 1159A-01 issueB)
144-pin low-profile quad flat-pack (LQFP) - 20x20mm body size, 0.5mm pitch (case no 918-03)
112-pin low-profile quad flat-pack (LQFP) - 20x20mm, 0.65 pitch (case no 987)
80-pin quad flat-pack (QFP)- 14x14mm body, 0.65mm pitch (case no 841B)
3.4 Chip-Level Features
On-chip modules include the following features:
•
•
•
•
•
Pin compatible family extends existing S12D Family
16-bit CPU12X
Enables higher system integrity at the MCU level (MPU, ECC, Supervisor Mode)
Enhanced SPI allows 8 or 16 bit data size
ECC on flash
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Features
• 1-bit fault correction
• 2-bit fault detection
• Improved EMC performance
• Separate supply for internal voltage regulator and I/O allow optimized EMC filtering
• Enhanced current consumption
• Extended API up to 5 sec
3.5 Module Features
The following sections provide more details of the modules implemented on the MC9S12XE.
3.5.1 16-Bit CPU12X
• 16-bit CPU12X
• Compatible with MC9S12 instruction set with the exception of five fuzzy instructions (MEM, WAV, WAVR, REV,
REVW) which have been removed.
• Enhanced indexed addressing
• Access to large data segments independent of PPAGE
3.5.2 Enhanced Interrupt Module
•
•
•
•
•
Eight levels of nested interrupts
Flexible assignment of interrupt sources to each interrupt level.
External non-maskable high priority interrupt (XIRQ)
Internal, non-maskable high priority memory protection unit interrupt
Up to 24 pins on ports J, H and P configurable as rising or falling edge sensitive
3.5.3 XGATE
•
•
•
•
•
•
•
•
Programmable, high performance I/O coprocessor module with up to 100 MIPS RISC performance
Transfers data to or from all peripherals and RAM without CPU intervention or CPU wait states
Performs logical, shifts, arithmetic, and bit operations on data
Can interrupt the S12X CPU signalling transfer completion
Triggers from any hardware module as well as from the CPU possible
Two interrupt levels to service high priority tasks
Enables Full CAN capability when used in conjunction with MSCAN module
Full LIN master or slave capability when used in conjunction with the integrated LIN SCI modules
3.5.4 Memory Protection Unit (MPU)
• 8 address regions definable per active program task
• Address range granularity as low as 8-bytes
• Protection Attributes
• No write
• No execute
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Features
• Non-maskable interrupt on access violation
3.5.5 System Integrity Support
•
•
•
•
Power-on reset (POR)
Illegal address detection with reset
Low-voltage detection with interrupt or reset
System can run in Supervisor or User state
• using a new bit in the condition code register
• peripheral space can only be accessed in user state if enabled by a descriptor
• Computer Operating Properly (COP) watchdog
• Configurable as window COP for enhanced failure detection
• Can be initialized out of reset using option bits located in Flash
• Clock monitor supervising the correct function of the oscillator
3.5.6 Memory Options
•
•
•
•
128K, 256K, 384K, 512K, 768K and 1M byte Flash
2K, 4K byte Emulated EEPROM
12K, 16K, 24K, 32K, 48K and 64K Byte RAM
Flash General Features
• 64 data bits plus 8 syndrome ECC (Error Correction Code) bits allow single bit failure correction and double
fault detection
• Erase sector size 1024 bytes
• Automated program and erase algorithm
• Security option to prevent unauthorized access
• Sense-amp margin level setting for reads
• Data Flash General Features
• 32 Kbytes of D-Flash memory with 256-byte sectors for user access.
• Dedicated commands to access D-Flash memory over EEE operation
• Single bit fault correction and double fault detection within a word during read operations
• Automated program and erase algorithm with verify and generation of ECC parity bits
• Fast sector erase and word program operation
• Ability to program up to four words in a burst sequence
• Emulated EEPROM General Features
• Automatic EEE file handling using internal Memory Controller
• Automatic transfer of valid EEE data from D-Flash memory to buffer RAM on reset
• Ability to monitor the number of outstanding EEE related buffer RAM words left to be programmed into D-Flash
memory
• Ability to disable EEE operation and allow priority access to the D-Flash memory
• Ability to cancel all pending EEE operations to allow priority access to the D-Flash memory
3.5.7 Oscillator (OSC_LCP)
• Loop Control Pierce oscillator utilizing a 4MHz to 16MHz crystal
• Good noise immunity
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Features
• Full-swing Pierce option utilizing a 2MHz to 40MHz crystal
• Transconductance sized for optimum start-up margin for typical crystals
3.5.8 Clock and Reset Generator (CRG)
• Phase-locked-loop (IPLL) clock frequency multiplier
• Internally filtered. No external components required
• Configurable option to spread spectrum for reduced EMC radiation (frequency modulation)
• Fast wake up from STOP in self clock mode for power saving and immediate program execution
3.5.9 Non-Multiplexed External Bus (208-pin and 144-pin packages
only)
• Non-Multiplexed External Bus (208-pin and 144-pin packages only)
• Each chip select output can be configured to complete transaction on either the time-out of one of the two wait
state generators or the deassertion of EWAIT signal
• Supports glue-less interface to popular asynchronous RAMs and Flash devices
3.5.10 Analog-to-Digital Converter (ATD)
•
•
•
•
•
•
•
•
Up to two independent ATD converters
8/10/12 bit resolution
Multiplexer for 16 analog input channels
3 s, 10-bit single conversion time
Left/right, signed/unsigned result data
External and internal conversion trigger capability
Internal oscillator for conversion in Stop modes
Wake-up from low power modes on analog comparison > or S12X “Service Pack” contains:
• CodeWarrior for OSEK
• Sophisticated project manager
• Build system with optimizing C/C++ compiler
• Graphical, source-level debugger
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Document Revision History
• Fast, cycle-accurate simulator
• Code coverage and profile analysis
• Flash programmer
• Evaluation Kit for MC9S12DT256
• Evaluation board
• BDI interface
• Power supplies and cables
• Metrowerks OSEK Real-Time Operating System (demo)
• Documentation package
Table 2. Tools Suppliers
Name / Tool
IDE/Compiler
Debugger
Simulator
Emulator
BDM Conn.
Software
CodeWarrior
X
X
X
Cosmic Software
X
X
X
IAR Systems
X
X
X
Hardware
P&E Microcomputer
Systems, Inc.
X
iSystem
X
X
X
Nohau
X
X
Lauterbach
X
X
X
X
Drivers
Vector
•
LIN 1.3 Master Driver S12X. LIN 2.0 Master Driver S12X (including XGATE)
• CAN Driver S12X (including XGATE). This includes COM and NM for specific OEM configuration
3Soft
•
I/O (HIS) Drivers + LIN 2.0 Master and Slave Drivers ProOSEK for S12X
Volcano
•
LIN Drivers For S12 available and compatible for S12X
5 Document Revision History
Table 3 shows the revision history of this document.
Table 3. Revision History
Revision
Location(s)
Rev. 2
Substantive Change(s)
Replaced high-level block diagram with detailed block diagram.
Added Table 1.
Added Table 2.
Rev. 3
Replaced future tense with present tense
Corrected corrupted footnote font in Table 1.
Added dataflash column to Table 2.
Changed CPU compatibility text following removal of fuzzy instructions
Table continues on the next page...
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Document Revision History
Table 3. Revision History (continued)
Revision
Location(s)
Substantive Change(s)
Rev. 4
Merged device family option tables
Rev. 5
Added package mechanical information
Rev. 6
Changed D-Flash size for S12XEG128
Rev. 7
Corrected SCI,IIC,PIT counts in derivative table
Rev. 8
Table 1. updated TIM listing, added 80QFP options.
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© 2015 Freescale Semiconductor, Inc.
Document Number MC9S12XEPB
Revision 9, 4/2015