S9S08RN16W2VTJ

Freescale Semiconductor Data Sheet: Technical Data Document Number S9S08RN16DS Rev 1, 02/2014 S9S08RN16DS S9S08RN16 Series Data Sheet Supports: S9S08RN16 and S9S08RN8 Key features • 8-Bit S08 central processor unit (CPU) – Up to 20 MHz bus at 2.7 V to 5.5 V across temperature range of -40 °C to 125 °C – Supporting up to 40 interrupt/reset sources – Supporting up to four-level nested interrupt – On-chip memory – Up to 16 KB flash read/program/erase over full operating voltage and temperature – Up to 256 byte EEPROM with ECC; 2-byte erase sector; EEPROM program and erase while executing code from flash – Up to 2048 byte random-access memory (RAM) – Flash and RAM access protection • Development support – Single-wire background debug interface – Breakpoint capability to allow three breakpoints setting during in-circuit debugging – On-chip in-circuit emulator (ICE) debug module containing two comparators and nine trigger modes • Power-saving modes – One low-power stop mode; reduced power wait mode – Peripheral clock enable register can disable clocks to unused modules, reducing currents; allows clocks to remain enabled to specific peripherals in stop3 mode • Clocks – Oscillator (XOSC) - loop-controlled Pierce oscillator; crystal or ceramic resonator – Internal clock source (ICS) - containing a frequency-locked-loop (FLL) controlled by internal or external reference; precision trimming of internal reference allowing 1% deviation across temperature range of 0 °C to 70 °C and -40 °C to 85 °C, 1.5% deviation across temperature range of -40 °C to 105 °C, and 2% deviation across temperature range of -40 °C to 125 °C; up to 20 MHz • System protection – Watchdog with independent clock source – Low-voltage detection with reset or interrupt; selectable trip points – Illegal opcode detection with reset – Illegal address detection with reset Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. © 2014 Freescale Semiconductor, Inc. • Peripherals – ACMP - one analog comparator with both positive and negative inputs; separately selectable interrupt on rising and falling comparator output; filtering – ADC - 12-channel, 12-bit resolution for 48-, 32-pin packages; 10-channel, 10-bit resolution for 20-pin package; 8-channel, 10-bit for 16-pin package; 2.5 µs conversion time; data buffers with optional watermark; automatic compare function; internal bandgap reference channel; operation in stop mode; optional hardware trigger – CRC - programmable cyclic redundancy check module – FTM - two flex timer modulators modules including one 6-channel and one 2-channel ones; 16-bit counter; each channel can be configured for input capture, output compare, edge- or center-aligned PWM mode – IIC - One inter-integrated circuit module; up to 400 kbps; multi-master operation; programmable slave address; supporting broadcast mode and 10-bit addressing – MTIM - One modulo timer with 8-bit prescaler and overflow interrupt – RTC - 16-bit real time counter (RTC) – SCI - two serial communication interface (SCI/UART) modules optional 13-bit break; full duplex non-return to zero (NRZ); LIN extension support – SPI - one 8-bit serial peripheral interface (SPI) modules; full-duplex or single-wire bidirectional; master or slave mode – TSI - supporting up to 16 external electrodes; configurable software or hardware scan trigger; fully support freescale touch sensing software library; capability to wake MCU from stop3 mode • Input/Output – Up to 35 GPIOs including one output-only pin – One 8-bit keyboard interrupt module (KBI) – Two true open-drain output pins – Four, ultra-high current sink pins supporting 20 mA source/sink current • Package options – 48-pin LQFP – 32-pin LQFP – 20-pin TSSOP – 16-pin TSSOP S9S08RN16 Series Data Sheet, Rev1, 02/2014. 2 Freescale Semiconductor, Inc. Table of Contents 1 Ordering parts...........................................................................4 5.2.2 Debug trace timing specifications.........................16 1.1 Determining valid orderable parts......................................4 5.2.3 FTM module timing...............................................17 2 Part identification......................................................................4 2.1 Description.........................................................................4 5.3 Thermal specifications.......................................................18 5.3.1 Thermal characteristics.........................................18 2.2 Format...............................................................................4 6 Peripheral operating requirements and behaviors....................19 2.3 Fields.................................................................................4 6.1 External oscillator (XOSC) and ICS characteristics...........19 2.4 Example............................................................................5 6.2 NVM specifications............................................................21 3 Parameter Classification...........................................................5 6.3 Analog...............................................................................23 4 Ratings......................................................................................5 6.3.1 ADC characteristics...............................................23 4.1 Thermal handling ratings...................................................5 6.3.2 Analog comparator (ACMP) electricals.................25 4.2 Moisture handling ratings..................................................6 4.3 ESD handling ratings.........................................................6 4.4 Voltage and current operating ratings...............................6 5 General.....................................................................................7 5.1 Nonswitching electrical specifications...............................7 6.4 Communication interfaces.................................................26 6.4.1 SPI switching specifications..................................26 6.5 Human-machine interfaces (HMI)......................................29 6.5.1 TSI electrical specifications...................................29 7 Dimensions...............................................................................29 5.1.1 DC characteristics.................................................7 5.1.2 Supply current characteristics...............................14 8 Pinout........................................................................................30 5.1.3 EMC performance.................................................15 8.1 Signal multiplexing and pin assignments...........................30 5.2 Switching specifications.....................................................15 8.2 Device pin assignment......................................................32 5.2.1 Control timing........................................................15 7.1 Obtaining package dimensions.........................................29 9 Revision history.........................................................................34 S9S08RN16 Series Data Sheet, Rev1, 02/2014. Freescale Semiconductor, Inc. 3 Ordering parts 1 Ordering parts 1.1 Determining valid orderable parts Valid orderable part numbers are provided on the web. To determine the orderable part numbers for this device, go to freescale.com and perform a part number search for the following device numbers: RN16 and RN8. 2 Part identification 2.1 Description Part numbers for the chip have fields that identify the specific part. You can use the values of these fields to determine the specific part you have received. 2.2 Format Part numbers for this device have the following format: S 9 S08 RN AA F1 B CC 2.3 Fields This table lists the possible values for each field in the part number (not all combinations are valid): Field Description Values S Qualification status • S = fully qualified, general market flow 9 Memory • 9 = flash based S08 Core • S08 = 8-bit CPU RN Device family • RN AA Approximate flash size in KB • 16 = 16 KB • 8 = 8 KB F1 Fab and mask set identifier • W2 B Temperature range (°C) • M = –40 to 125 CC Package designator • LF = 48-LQFP S9S08RN16 Series Data Sheet, Rev1, 02/2014. 4 Freescale Semiconductor, Inc. Parameter Classification Field Description Values • LC = 32-LQFP • TJ = 20-TSSOP • TG = 16-TSSOP 2.4 Example This is an example part number: S9S08RN16W2MLF 3 Parameter Classification The electrical parameters shown in this supplement are guaranteed by various methods. To give the customer a better understanding, the following classification is used and the parameters are tagged accordingly in the tables where appropriate: Table 1. Parameter Classifications P Those parameters are guaranteed during production testing on each individual device. C Those parameters are achieved by the design characterization by measuring a statistically relevant sample size across process variations. T Those parameters are achieved by design characterization on a small sample size from typical devices under typical conditions unless otherwise noted. All values shown in the typical column are within this category. D Those parameters are derived mainly from simulations. NOTE The classification is shown in the column labeled “C” in the parameter tables where appropriate. 4 Ratings 4.1 Thermal handling ratings Symbol Description Min. Max. Unit Notes TSTG Storage temperature –55 150 °C 1 TSDR Solder temperature, lead-free — 260 °C 2 1. Determined according to JEDEC Standard JESD22-A103, High Temperature Storage Life. S9S08RN16 Series Data Sheet, Rev1, 02/2014. Freescale Semiconductor, Inc. 5 Ratings 2. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices. 4.2 Moisture handling ratings Symbol MSL Description Moisture sensitivity level Min. Max. Unit Notes — 3 — 1 1. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices. 4.3 ESD handling ratings Symbol Description Min. Max. Unit Notes VHBM Electrostatic discharge voltage, human body model -6000 +6000 V 1 VCDM Electrostatic discharge voltage, charged-device model -500 +500 V 2 Latch-up current at ambient temperature of 125°C -100 +100 mA 3 ILAT 1. Determined according to JEDEC Standard JESD22-A114, Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM). 2. Determined according to JEDEC Standard JESD22-C101, Field-Induced Charged-Device Model Test Method for Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components. 3. Determined according to JEDEC Standard JESD78D, IC Latch-up Test. • Test was performed at 125 °C case temperature (Class II). • I/O pins pass +100/-100 mA I-test with Idd current limit at 400mA. • I/O pins pass +20/-100 mA I-test with Idd current limit at 1000mA. • Supply groups pass 1.5 Vccmax. • RESET_B pin was only tested with negative I-test due to product conditioning requirement. 4.4 Voltage and current operating ratings Absolute maximum ratings are stress ratings only, and functional operation at the maxima is not guaranteed. Stress beyond the limits specified in below table may affect device reliability or cause permanent damage to the device. For functional operating conditions, refer to the remaining tables in this document. This device contains circuitry protecting against damage due to high static voltage or electrical fields; however, it is advised that normal precautions be taken to avoid application of any voltages higher than maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate logic voltage level (for instance, either VSS or VDD) or the programmable pullup resistor associated with the pin is enabled. S9S08RN16 Series Data Sheet, Rev1, 02/2014. 6 Freescale Semiconductor, Inc. General Symbol Description Min. VDD Supply voltage –0.3 5.8 V IDD Maximum current into VDD — 120 mA Digital input voltage (except RESET, EXTAL, XTAL, or true open drain pin PTA2 and PTA3) –0.3 VDD + 0.3 V Digital input voltage (true open drain pin PTA2 and PTA3) -0.3 6 V Analog1, –0.3 VDD + 0.3 V –25 25 mA VDD – 0.3 VDD + 0.3 V VDIO VAIO ID VDDA RESET, EXTAL, and XTAL input voltage Instantaneous maximum current single pin limit (applies to all port pins) Analog supply voltage Max. Unit 1. All digital I/O pins, except open-drain pin PTA2 and PTA3, are internally clamped to VSS and VDD. PTA2 and PTA3 is only clamped to VSS. 5 General 5.1 Nonswitching electrical specifications 5.1.1 DC characteristics This section includes information about power supply requirements and I/O pin characteristics. Table 2. DC characteristics Symbol C — — VOH C Min Typical1 Max Unit — 2.7 — 5.5 V 5 V, Iload = -5 mA VDD - 0.8 — — V 3 V, Iload = -2.5 mA VDD - 0.8 — — V High current drive pins, high-drive strength2 5 V, Iload = -20 mA VDD - 0.8 — — V 3 V, Iload = -10 mA VDD - 0.8 — — V Max total IOH for all ports 5V — — -100 mA 3V — — -50 — — 0.8 V — — 0.8 V Descriptions Operating voltage Output high voltage All I/O pins, standarddrive strength C C C IOHT VOL D C Output high current Output low voltage C All I/O pins, standard- 5 V, Iload = 5 drive strength mA 3 V, Iload = 2.5 mA Table continues on the next page... S9S08RN16 Series Data Sheet, Rev1, 02/2014. Freescale Semiconductor, Inc. 7 Nonswitching electrical specifications Table 2. DC characteristics (continued) Symbol C Descriptions C High current drive pins, high-drive strength2 C IOLT VIH D P C VIL P C Min Typical1 Max Unit 5 V, Iload =20 mA — — 0.8 V 3 V, Iload = 10 mA — — 0.8 V mA Output low current Max total IOL for all ports 5V — — 100 3V — — 50 Input high voltage All digital inputs VDD>4.5V 0.70 × VDD — — VDD>2.7V 0.75 × VDD — — Input low voltage All digital inputs VDD>4.5V — — 0.30 × VDD VDD>2.7V — — 0.35 × VDD V V Vhys C Input hysteresis All digital inputs — 0.06 × VDD — — mV |IIn| P Input leakage current All input only pins (per pin) VIN = VDD or VSS — 0.1 1 µA |IOZ| P Hi-Z (offstate) leakage current All input/output (per pin) VIN = VDD or VSS — 0.1 1 µA |IOZTOT| C Total leakage All input only and I/O VIN = VDD or combined for VSS all inputs and Hi-Z pins — — 2 µA RPU P Pullup resistors All digital inputs, when enabled (all I/O pins other than PTA2 and PTA3) — 30.0 — 50.0 kΩ RPU3 P Pullup resistors PTA2 and PTA3 pin — 30.0 — 60.0 kΩ IIC D DC injection current4, 5, 6 Single pin limit VIN < VSS, VIN > VDD -0.2 — 2 mA -5 — 25 Total MCU limit, includes sum of all stressed pins CIn C Input capacitance, all pins — — — 7 pF VRAM C RAM retention voltage — 2.0 — — V 1. Typical values are measured at 25 °C. Characterized, not tested. 2. Only PTB4, PTB5 support ultra high current output. 3. The specified resistor value is the actual value internal to the device. The pullup value may appear higher when measured externally on the pin. 4. All functional non-supply pins, except for PTA2 and PTA3, are internally clamped to VSS and VDD. 5. Input must be current-limited to the value specified. To determine the value of the required current-limiting resistor, calculate resistance values for positive and negative clamp voltages, then use the large one. 6. Power supply must maintain regulation within operating VDD range during instantaneous and operating maximum current conditions. If the positive injection current (VIn > VDD) is higher than IDD, the injection current may flow out of VDD and could result in external power supply going out of regulation. Ensure that external VDD load will shunt current higher than maximum injection current when the MCU is not consuming power, such as no system clock is present, or clock rate is very low (which would reduce overall power consumption). S9S08RN16 Series Data Sheet, Rev1, 02/2014. 8 Freescale Semiconductor, Inc. Nonswitching electrical specifications Table 3. LVD and POR Specification 1. 2. 3. 4. Symbol C Description Min Typ Max Unit VPOR D POR re-arm voltage1, 2 1.5 1.75 2.0 V VLVDH C Falling low-voltage detect threshold - high range (LVDV = 1)3 4.2 4.3 4.4 V VLVW1H C Level 1 falling (LVWV = 00) 4.3 4.4 4.5 V VLVW2H C Level 2 falling (LVWV = 01) 4.5 4.5 4.6 V VLVW3H C Level 3 falling (LVWV = 10) 4.6 4.6 4.7 V VLVW4H C Level 4 falling (LVWV = 11) 4.7 4.7 4.8 V VHYSH C High range low-voltage detect/warning hysteresis — 100 — mV VLVDL C Falling low-voltage detect threshold - low range (LVDV = 0) 2.56 2.61 2.66 V VLVDW1L C Level 1 falling (LVWV = 00) 2.62 2.7 2.78 V VLVDW2L C Level 2 falling (LVWV = 01) 2.72 2.8 2.88 V VLVDW3L C Level 3 falling (LVWV = 10) 2.82 2.9 2.98 V VLVDW4L C Level 4 falling (LVWV = 11) 2.92 3.0 3.08 V VHYSDL C Low range low-voltage detect hysteresis — 40 — mV VHYSWL C Low range low-voltage warning hysteresis — 80 — mV VBG P Buffered bandgap output 4 1.14 1.16 1.18 V Falling lowvoltage warning threshold high range Falling lowvoltage warning threshold low range Maximum is highest voltage that POR is guaranteed. POR ramp time must be longer than 20us/V to get a stable startup. Rising thresholds are falling threshold + hysteresis. Voltage factory trimmed at VDD = 5.0 V, Temp = 125 °C S9S08RN16 Series Data Sheet, Rev1, 02/2014. Freescale Semiconductor, Inc. 9 Nonswitching electrical specifications Typical I OH Vs. V DD -V OH (low drive strength) (V DD = 5 V) 0.6 V DD -V OH (V) 0.5 0.4 125°C 0.3 25°C 0.2 -40° 0.1 0 0 1 2 3 4 5 6 7 I OH (mA) Figure 1. Typical IOH Vs. VDD-VOH (standard drive strength) (VDD = 5 V) Typical I OH Vs. V DD -V OH (low drive strength) (V DD = 3 V) 0.9 0.8 V DD -V OH (V) 0.7 0.6 0.5 125°C 0.4 25°C 0.3 -40°C 0.2 0.1 0 0 1 2 3 4 5 6 7 I OH (mA) Figure 2. Typical IOH Vs. VDD-VOH (standard drive strength) (VDD = 3 V) S9S08RN16 Series Data Sheet, Rev1, 02/2014. 10 Freescale Semiconductor, Inc. Nonswitching electrical specifications Typical I OH Vs. V DD -V OH (high drive strength) (V DD = 5 V) 0.7 V DD -V OH (V) 0.6 0.5 0.4 125°C 0.3 25°C 0.2 -40°C 0.1 0 0 5 10 15 20 25 30 I OH (mA) Figure 3. Typical IOH Vs. VDD-VOH (high drive strength) (VDD = 5 V) Typical I OH Vs. V DD -V OH (high drive strength) (V DD = 3 V) 1.2 V DD -V OH (V) 1 0.8 125°C 0.6 25°C 0.4 -40°C 0.2 0 0 5 10 15 20 25 30 I OH (mA) Figure 4. Typical IOH Vs. VDD-VOH (high drive strength) (VDD = 3 V) S9S08RN16 Series Data Sheet, Rev1, 02/2014. Freescale Semiconductor, Inc. 11 Nonswitching electrical specifications Typical I OL Vs. V OL (low drive strength) (VDD = 5 V) 0.6 0.5 VOL (V) 0.4 125°C 0.3 25°C 0.2 -40° 0.1 0 0 1 2 3 4 5 6 7 I OL (mA) Figure 5. Typical IOL Vs. VOL (standard drive strength) (VDD = 5 V) Typical I OL Vs. V OL (low drive strength) (VDD = 3 V) 0.9 0.8 0.7 VOL (V) 0.6 0.5 125°C 0.4 25°C 0.3 -40°C 0.2 0.1 0 0 1 2 3 4 5 6 7 I OL (mA) Figure 6. Typical IOL Vs. VOL (standard drive strength) (VDD = 3 V) 0.3 12 0.3 S9S08RN16 Series Data Sheet, Rev1, 02/2014. 125°C Freescale Semiconductor, Inc. 125°C Nonswitching electrical specifications Typical I OL Vs. V OL (high drive strength) (VDD = 5 V) 0.6 0.5 VOL (V) 0.4 125°C 0.3 25°C 0.2 -40°C 0.1 0 0 5 10 15 20 25 30 I OL (mA) Figure 7. Typical IOL Vs. VOL (high drive strength) (VDD = 5 V) V OL (V) Typical I OL Vs. V OL (high drive strength) (VDD = 3 V) 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 125°C 25°C -40° 0 5 10 15 20 25 30 I OL (mA) Figure 8. Typical IOL Vs. VOL (high drive strength) (VDD = 3 V) S9S08RN16 Series Data Sheet, Rev1, 02/2014. Freescale Semiconductor, Inc. 13 Nonswitching electrical specifications 5.1.2 Supply current characteristics This section includes information about power supply current in various operating modes. Table 4. Supply current characteristics Num C Parameter Symbol Bus Freq VDD (V) Typical1 Max Unit Temp 1 C Run supply current FEI mode, all modules on; run from flash RIDD 20 MHz 5 7.60 — mA -40 to 125 °C 10 MHz 4.65 — 1 MHz 1.90 — 7.05 — mA -40 to 125 °C mA -40 to 125 °C mA -40 to 125 °C mA -40 to 125 °C µA -40 to 125 °C C 2 C 20 MHz C 10 MHz 4.40 — 1 MHz 1.85 — 5.88 — 10 MHz 3.70 — 1 MHz 1.85 — 5.35 — C C 3 Run supply current FEI mode, all modules off & gated; run from flash RIDD 20 MHz C 10 MHz 3.42 — 1 MHz 1.80 — P Run supply current FBE mode, all modules on; run from RAM RIDD C P C C Run supply current FBE mode, all modules off & gated; run from RAM RIDD 7 C 10.9 14.0 10 MHz 6.10 — 1 MHz 1.69 — 8.18 — 10 MHz 5.14 — 1 MHz 1.44 — 8.50 13.0 5.07 — 1.59 — 6.11 — 10 MHz 4.10 — 1 MHz 1.34 — 5.95 — 10 MHz 3.50 — 1 MHz 1.24 — 5.45 — 10 MHz 3.25 — 1 MHz 1.20 — 20 MHz 5 3 5 1 MHz 20 MHz Wait mode current FEI mode, all modules on 3 10 MHz WIDD C 6 20 MHz 20 MHz C 5 5 C C 4 20 MHz 3 20 MHz 20 MHz S3IDD C Stop3 mode supply current no clocks active (except 1kHz LPO clock)2, 3 C ADC adder to stop3 — 3 5 3 — 5 4.6 — — 3 4.5 — — 5 40 — -40 to 125 °C µA -40 to 125 °C Table continues on the next page... S9S08RN16 Series Data Sheet, Rev1, 02/2014. 14 Freescale Semiconductor, Inc. Switching specifications Table 4. Supply current characteristics (continued) Num C Parameter C ADLPC = 1 Symbol Bus Freq VDD (V) Typical1 Max 3 39 — 5 121 — 3 120 — 5 128 — 3 124 — Unit Temp µA -40 to 125 °C µA -40 to 125 °C ADLSMP = 1 ADCO = 1 MODE = 10B ADICLK = 11B 8 C TSI adder to stop34 C PS = 010B — — NSCN = 0x0F EXTCHRG = 0 REFCHRG = 0 DVOLT = 01B 9 C LVD adder to stop35 — C 1. 2. 3. 4. 5. — Data in Typical column was characterized at 5.0 V, 25 °C or is typical recommended value. RTC adder cause