Freescale Semiconductor
Data Sheet: Technical Data
Document Number S9S08RN16DS
Rev 1, 02/2014
S9S08RN16DS
S9S08RN16 Series Data
Sheet
Supports: S9S08RN16 and S9S08RN8
Key features
• 8-Bit S08 central processor unit (CPU)
– Up to 20 MHz bus at 2.7 V to 5.5 V across
temperature range of -40 °C to 125 °C
– Supporting up to 40 interrupt/reset sources
– Supporting up to four-level nested interrupt
– On-chip memory
– Up to 16 KB flash read/program/erase over full
operating voltage and temperature
– Up to 256 byte EEPROM with ECC; 2-byte
erase sector; EEPROM program and erase
while executing code from flash
– Up to 2048 byte random-access memory (RAM)
– Flash and RAM access protection
• Development support
– Single-wire background debug interface
– Breakpoint capability to allow three breakpoints
setting during in-circuit debugging
– On-chip in-circuit emulator (ICE) debug module
containing two comparators and nine trigger
modes
• Power-saving modes
– One low-power stop mode; reduced power wait
mode
– Peripheral clock enable register can disable
clocks to unused modules, reducing currents;
allows clocks to remain enabled to specific
peripherals in stop3 mode
• Clocks
– Oscillator (XOSC) - loop-controlled Pierce
oscillator; crystal or ceramic resonator
– Internal clock source (ICS) - containing a
frequency-locked-loop (FLL) controlled by
internal or external reference; precision
trimming of internal reference allowing 1%
deviation across temperature range of 0 °C to
70 °C and -40 °C to 85 °C, 1.5% deviation
across temperature range of -40 °C to 105 °C,
and 2% deviation across temperature range of
-40 °C to 125 °C; up to 20 MHz
• System protection
– Watchdog with independent clock source
– Low-voltage detection with reset or interrupt;
selectable trip points
– Illegal opcode detection with reset
– Illegal address detection with reset
Freescale reserves the right to change the detail specifications as may be
required to permit improvements in the design of its products.
© 2014 Freescale Semiconductor, Inc.
• Peripherals
– ACMP - one analog comparator with both positive and negative inputs; separately selectable interrupt on
rising and falling comparator output; filtering
– ADC - 12-channel, 12-bit resolution for 48-, 32-pin packages; 10-channel, 10-bit resolution for 20-pin
package; 8-channel, 10-bit for 16-pin package; 2.5 µs conversion time; data buffers with optional watermark;
automatic compare function; internal bandgap reference channel; operation in stop mode; optional hardware
trigger
– CRC - programmable cyclic redundancy check module
– FTM - two flex timer modulators modules including one 6-channel and one 2-channel ones; 16-bit counter;
each channel can be configured for input capture, output compare, edge- or center-aligned PWM mode
– IIC - One inter-integrated circuit module; up to 400 kbps; multi-master operation; programmable slave
address; supporting broadcast mode and 10-bit addressing
– MTIM - One modulo timer with 8-bit prescaler and overflow interrupt
– RTC - 16-bit real time counter (RTC)
– SCI - two serial communication interface (SCI/UART) modules optional 13-bit break; full duplex non-return to
zero (NRZ); LIN extension support
– SPI - one 8-bit serial peripheral interface (SPI) modules; full-duplex or single-wire bidirectional; master or
slave mode
– TSI - supporting up to 16 external electrodes; configurable software or hardware scan trigger; fully support
freescale touch sensing software library; capability to wake MCU from stop3 mode
• Input/Output
– Up to 35 GPIOs including one output-only pin
– One 8-bit keyboard interrupt module (KBI)
– Two true open-drain output pins
– Four, ultra-high current sink pins supporting 20 mA source/sink current
• Package options
– 48-pin LQFP
– 32-pin LQFP
– 20-pin TSSOP
– 16-pin TSSOP
S9S08RN16 Series Data Sheet, Rev1, 02/2014.
2
Freescale Semiconductor, Inc.
Table of Contents
1 Ordering parts...........................................................................4
5.2.2
Debug trace timing specifications.........................16
1.1 Determining valid orderable parts......................................4
5.2.3
FTM module timing...............................................17
2 Part identification......................................................................4
2.1 Description.........................................................................4
5.3 Thermal specifications.......................................................18
5.3.1
Thermal characteristics.........................................18
2.2 Format...............................................................................4
6 Peripheral operating requirements and behaviors....................19
2.3 Fields.................................................................................4
6.1 External oscillator (XOSC) and ICS characteristics...........19
2.4 Example............................................................................5
6.2 NVM specifications............................................................21
3 Parameter Classification...........................................................5
6.3 Analog...............................................................................23
4 Ratings......................................................................................5
6.3.1
ADC characteristics...............................................23
4.1 Thermal handling ratings...................................................5
6.3.2
Analog comparator (ACMP) electricals.................25
4.2 Moisture handling ratings..................................................6
4.3 ESD handling ratings.........................................................6
4.4 Voltage and current operating ratings...............................6
5 General.....................................................................................7
5.1 Nonswitching electrical specifications...............................7
6.4 Communication interfaces.................................................26
6.4.1
SPI switching specifications..................................26
6.5 Human-machine interfaces (HMI)......................................29
6.5.1
TSI electrical specifications...................................29
7 Dimensions...............................................................................29
5.1.1
DC characteristics.................................................7
5.1.2
Supply current characteristics...............................14
8 Pinout........................................................................................30
5.1.3
EMC performance.................................................15
8.1 Signal multiplexing and pin assignments...........................30
5.2 Switching specifications.....................................................15
8.2 Device pin assignment......................................................32
5.2.1
Control timing........................................................15
7.1 Obtaining package dimensions.........................................29
9 Revision history.........................................................................34
S9S08RN16 Series Data Sheet, Rev1, 02/2014.
Freescale Semiconductor, Inc.
3
Ordering parts
1 Ordering parts
1.1 Determining valid orderable parts
Valid orderable part numbers are provided on the web. To determine the orderable part
numbers for this device, go to freescale.com and perform a part number search for the
following device numbers: RN16 and RN8.
2 Part identification
2.1 Description
Part numbers for the chip have fields that identify the specific part. You can use the
values of these fields to determine the specific part you have received.
2.2 Format
Part numbers for this device have the following format:
S 9 S08 RN AA F1 B CC
2.3 Fields
This table lists the possible values for each field in the part number (not all combinations
are valid):
Field
Description
Values
S
Qualification status
• S = fully qualified, general market flow
9
Memory
• 9 = flash based
S08
Core
• S08 = 8-bit CPU
RN
Device family
• RN
AA
Approximate flash size in KB
• 16 = 16 KB
• 8 = 8 KB
F1
Fab and mask set identifier
• W2
B
Temperature range (°C)
• M = –40 to 125
CC
Package designator
• LF = 48-LQFP
S9S08RN16 Series Data Sheet, Rev1, 02/2014.
4
Freescale Semiconductor, Inc.
Parameter Classification
Field
Description
Values
• LC = 32-LQFP
• TJ = 20-TSSOP
• TG = 16-TSSOP
2.4 Example
This is an example part number:
S9S08RN16W2MLF
3 Parameter Classification
The electrical parameters shown in this supplement are guaranteed by various methods.
To give the customer a better understanding, the following classification is used and the
parameters are tagged accordingly in the tables where appropriate:
Table 1. Parameter Classifications
P
Those parameters are guaranteed during production testing on each individual device.
C
Those parameters are achieved by the design characterization by measuring a statistically relevant sample size
across process variations.
T
Those parameters are achieved by design characterization on a small sample size from typical devices under
typical conditions unless otherwise noted. All values shown in the typical column are within this category.
D
Those parameters are derived mainly from simulations.
NOTE
The classification is shown in the column labeled “C” in the
parameter tables where appropriate.
4 Ratings
4.1 Thermal handling ratings
Symbol
Description
Min.
Max.
Unit
Notes
TSTG
Storage temperature
–55
150
°C
1
TSDR
Solder temperature, lead-free
—
260
°C
2
1. Determined according to JEDEC Standard JESD22-A103, High Temperature Storage Life.
S9S08RN16 Series Data Sheet, Rev1, 02/2014.
Freescale Semiconductor, Inc.
5
Ratings
2. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
4.2 Moisture handling ratings
Symbol
MSL
Description
Moisture sensitivity level
Min.
Max.
Unit
Notes
—
3
—
1
1. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
4.3 ESD handling ratings
Symbol
Description
Min.
Max.
Unit
Notes
VHBM
Electrostatic discharge voltage, human body model
-6000
+6000
V
1
VCDM
Electrostatic discharge voltage, charged-device model
-500
+500
V
2
Latch-up current at ambient temperature of 125°C
-100
+100
mA
3
ILAT
1. Determined according to JEDEC Standard JESD22-A114, Electrostatic Discharge (ESD) Sensitivity Testing Human Body
Model (HBM).
2. Determined according to JEDEC Standard JESD22-C101, Field-Induced Charged-Device Model Test Method for
Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components.
3. Determined according to JEDEC Standard JESD78D, IC Latch-up Test.
• Test was performed at 125 °C case temperature (Class II).
• I/O pins pass +100/-100 mA I-test with Idd current limit at 400mA.
• I/O pins pass +20/-100 mA I-test with Idd current limit at 1000mA.
• Supply groups pass 1.5 Vccmax.
• RESET_B pin was only tested with negative I-test due to product conditioning requirement.
4.4 Voltage and current operating ratings
Absolute maximum ratings are stress ratings only, and functional operation at the
maxima is not guaranteed. Stress beyond the limits specified in below table may affect
device reliability or cause permanent damage to the device. For functional operating
conditions, refer to the remaining tables in this document.
This device contains circuitry protecting against damage due to high static voltage or
electrical fields; however, it is advised that normal precautions be taken to avoid
application of any voltages higher than maximum-rated voltages to this high-impedance
circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate
logic voltage level (for instance, either VSS or VDD) or the programmable pullup resistor
associated with the pin is enabled.
S9S08RN16 Series Data Sheet, Rev1, 02/2014.
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Freescale Semiconductor, Inc.
General
Symbol
Description
Min.
VDD
Supply voltage
–0.3
5.8
V
IDD
Maximum current into VDD
—
120
mA
Digital input voltage (except RESET, EXTAL, XTAL, or true
open drain pin PTA2 and PTA3)
–0.3
VDD + 0.3
V
Digital input voltage (true open drain pin PTA2 and PTA3)
-0.3
6
V
Analog1,
–0.3
VDD + 0.3
V
–25
25
mA
VDD – 0.3
VDD + 0.3
V
VDIO
VAIO
ID
VDDA
RESET, EXTAL, and XTAL input voltage
Instantaneous maximum current single pin limit (applies to all
port pins)
Analog supply voltage
Max.
Unit
1. All digital I/O pins, except open-drain pin PTA2 and PTA3, are internally clamped to VSS and VDD. PTA2 and PTA3 is only
clamped to VSS.
5 General
5.1 Nonswitching electrical specifications
5.1.1 DC characteristics
This section includes information about power supply requirements and I/O pin
characteristics.
Table 2. DC characteristics
Symbol
C
—
—
VOH
C
Min
Typical1
Max
Unit
—
2.7
—
5.5
V
5 V, Iload =
-5 mA
VDD - 0.8
—
—
V
3 V, Iload =
-2.5 mA
VDD - 0.8
—
—
V
High current drive
pins, high-drive
strength2
5 V, Iload =
-20 mA
VDD - 0.8
—
—
V
3 V, Iload =
-10 mA
VDD - 0.8
—
—
V
Max total IOH for all
ports
5V
—
—
-100
mA
3V
—
—
-50
—
—
0.8
V
—
—
0.8
V
Descriptions
Operating voltage
Output high
voltage
All I/O pins, standarddrive strength
C
C
C
IOHT
VOL
D
C
Output high
current
Output low
voltage
C
All I/O pins, standard- 5 V, Iload = 5
drive strength
mA
3 V, Iload =
2.5 mA
Table continues on the next page...
S9S08RN16 Series Data Sheet, Rev1, 02/2014.
Freescale Semiconductor, Inc.
7
Nonswitching electrical specifications
Table 2. DC characteristics (continued)
Symbol
C
Descriptions
C
High current drive
pins, high-drive
strength2
C
IOLT
VIH
D
P
C
VIL
P
C
Min
Typical1
Max
Unit
5 V, Iload
=20 mA
—
—
0.8
V
3 V, Iload =
10 mA
—
—
0.8
V
mA
Output low
current
Max total IOL for all
ports
5V
—
—
100
3V
—
—
50
Input high
voltage
All digital inputs
VDD>4.5V
0.70 × VDD
—
—
VDD>2.7V
0.75 × VDD
—
—
Input low
voltage
All digital inputs
VDD>4.5V
—
—
0.30 × VDD
VDD>2.7V
—
—
0.35 × VDD
V
V
Vhys
C
Input
hysteresis
All digital inputs
—
0.06 × VDD
—
—
mV
|IIn|
P
Input leakage
current
All input only pins
(per pin)
VIN = VDD or
VSS
—
0.1
1
µA
|IOZ|
P
Hi-Z (offstate) leakage
current
All input/output (per
pin)
VIN = VDD or
VSS
—
0.1
1
µA
|IOZTOT|
C
Total leakage All input only and I/O VIN = VDD or
combined for
VSS
all inputs and
Hi-Z pins
—
—
2
µA
RPU
P
Pullup
resistors
All digital inputs,
when enabled (all I/O
pins other than PTA2
and PTA3)
—
30.0
—
50.0
kΩ
RPU3
P
Pullup
resistors
PTA2 and PTA3 pin
—
30.0
—
60.0
kΩ
IIC
D
DC injection
current4, 5, 6
Single pin limit
VIN < VSS,
VIN > VDD
-0.2
—
2
mA
-5
—
25
Total MCU limit,
includes sum of all
stressed pins
CIn
C
Input capacitance, all pins
—
—
—
7
pF
VRAM
C
RAM retention voltage
—
2.0
—
—
V
1. Typical values are measured at 25 °C. Characterized, not tested.
2. Only PTB4, PTB5 support ultra high current output.
3. The specified resistor value is the actual value internal to the device. The pullup value may appear higher when measured
externally on the pin.
4. All functional non-supply pins, except for PTA2 and PTA3, are internally clamped to VSS and VDD.
5. Input must be current-limited to the value specified. To determine the value of the required current-limiting resistor,
calculate resistance values for positive and negative clamp voltages, then use the large one.
6. Power supply must maintain regulation within operating VDD range during instantaneous and operating maximum current
conditions. If the positive injection current (VIn > VDD) is higher than IDD, the injection current may flow out of VDD and could
result in external power supply going out of regulation. Ensure that external VDD load will shunt current higher than
maximum injection current when the MCU is not consuming power, such as no system clock is present, or clock rate is
very low (which would reduce overall power consumption).
S9S08RN16 Series Data Sheet, Rev1, 02/2014.
8
Freescale Semiconductor, Inc.
Nonswitching electrical specifications
Table 3. LVD and POR Specification
1.
2.
3.
4.
Symbol
C
Description
Min
Typ
Max
Unit
VPOR
D
POR re-arm voltage1, 2
1.5
1.75
2.0
V
VLVDH
C
Falling low-voltage detect
threshold - high range (LVDV
= 1)3
4.2
4.3
4.4
V
VLVW1H
C
Level 1 falling
(LVWV = 00)
4.3
4.4
4.5
V
VLVW2H
C
Level 2 falling
(LVWV = 01)
4.5
4.5
4.6
V
VLVW3H
C
Level 3 falling
(LVWV = 10)
4.6
4.6
4.7
V
VLVW4H
C
Level 4 falling
(LVWV = 11)
4.7
4.7
4.8
V
VHYSH
C
High range low-voltage
detect/warning hysteresis
—
100
—
mV
VLVDL
C
Falling low-voltage detect
threshold - low range (LVDV =
0)
2.56
2.61
2.66
V
VLVDW1L
C
Level 1 falling
(LVWV = 00)
2.62
2.7
2.78
V
VLVDW2L
C
Level 2 falling
(LVWV = 01)
2.72
2.8
2.88
V
VLVDW3L
C
Level 3 falling
(LVWV = 10)
2.82
2.9
2.98
V
VLVDW4L
C
Level 4 falling
(LVWV = 11)
2.92
3.0
3.08
V
VHYSDL
C
Low range low-voltage detect
hysteresis
—
40
—
mV
VHYSWL
C
Low range low-voltage
warning hysteresis
—
80
—
mV
VBG
P
Buffered bandgap output 4
1.14
1.16
1.18
V
Falling lowvoltage
warning
threshold high range
Falling lowvoltage
warning
threshold low range
Maximum is highest voltage that POR is guaranteed.
POR ramp time must be longer than 20us/V to get a stable startup.
Rising thresholds are falling threshold + hysteresis.
Voltage factory trimmed at VDD = 5.0 V, Temp = 125 °C
S9S08RN16 Series Data Sheet, Rev1, 02/2014.
Freescale Semiconductor, Inc.
9
Nonswitching electrical specifications
Typical I OH Vs. V DD -V OH (low drive strength) (V DD = 5 V)
0.6
V DD -V OH (V)
0.5
0.4
125°C
0.3
25°C
0.2
-40°
0.1
0
0
1
2
3
4
5
6
7
I OH (mA)
Figure 1. Typical IOH Vs. VDD-VOH (standard drive strength) (VDD = 5 V)
Typical I OH Vs. V DD -V OH (low drive strength) (V DD = 3 V)
0.9
0.8
V DD -V OH (V)
0.7
0.6
0.5
125°C
0.4
25°C
0.3
-40°C
0.2
0.1
0
0
1
2
3
4
5
6
7
I OH (mA)
Figure 2. Typical IOH Vs. VDD-VOH (standard drive strength) (VDD = 3 V)
S9S08RN16 Series Data Sheet, Rev1, 02/2014.
10
Freescale Semiconductor, Inc.
Nonswitching electrical specifications
Typical I OH Vs. V DD -V OH (high drive strength) (V DD = 5 V)
0.7
V DD -V OH (V)
0.6
0.5
0.4
125°C
0.3
25°C
0.2
-40°C
0.1
0
0
5
10
15
20
25
30
I OH (mA)
Figure 3. Typical IOH Vs. VDD-VOH (high drive strength) (VDD = 5 V)
Typical I OH Vs. V DD -V OH (high drive strength) (V DD = 3 V)
1.2
V DD -V OH (V)
1
0.8
125°C
0.6
25°C
0.4
-40°C
0.2
0
0
5
10
15
20
25
30
I OH (mA)
Figure 4. Typical IOH Vs. VDD-VOH (high drive strength) (VDD = 3 V)
S9S08RN16 Series Data Sheet, Rev1, 02/2014.
Freescale Semiconductor, Inc.
11
Nonswitching electrical specifications
Typical I OL Vs. V OL (low drive strength) (VDD = 5 V)
0.6
0.5
VOL (V)
0.4
125°C
0.3
25°C
0.2
-40°
0.1
0
0
1
2
3
4
5
6
7
I OL (mA)
Figure 5. Typical IOL Vs. VOL (standard drive strength) (VDD = 5 V)
Typical I OL Vs. V OL (low drive strength) (VDD = 3 V)
0.9
0.8
0.7
VOL (V)
0.6
0.5
125°C
0.4
25°C
0.3
-40°C
0.2
0.1
0
0
1
2
3
4
5
6
7
I OL (mA)
Figure 6. Typical IOL Vs. VOL (standard drive strength) (VDD = 3 V)
0.3
12
0.3
S9S08RN16 Series Data Sheet, Rev1, 02/2014.
125°C
Freescale Semiconductor,
Inc.
125°C
Nonswitching electrical specifications
Typical I OL Vs. V OL (high drive strength) (VDD = 5 V)
0.6
0.5
VOL (V)
0.4
125°C
0.3
25°C
0.2
-40°C
0.1
0
0
5
10
15
20
25
30
I OL (mA)
Figure 7. Typical IOL Vs. VOL (high drive strength) (VDD = 5 V)
V OL (V)
Typical I OL Vs. V OL (high drive strength) (VDD = 3 V)
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
125°C
25°C
-40°
0
5
10
15
20
25
30
I OL (mA)
Figure 8. Typical IOL Vs. VOL (high drive strength) (VDD = 3 V)
S9S08RN16 Series Data Sheet, Rev1, 02/2014.
Freescale Semiconductor, Inc.
13
Nonswitching electrical specifications
5.1.2 Supply current characteristics
This section includes information about power supply current in various operating modes.
Table 4. Supply current characteristics
Num
C
Parameter
Symbol
Bus Freq
VDD (V)
Typical1
Max
Unit
Temp
1
C
Run supply current FEI
mode, all modules on; run
from flash
RIDD
20 MHz
5
7.60
—
mA
-40 to 125 °C
10 MHz
4.65
—
1 MHz
1.90
—
7.05
—
mA
-40 to 125 °C
mA
-40 to 125 °C
mA
-40 to 125 °C
mA
-40 to 125 °C
µA
-40 to 125 °C
C
2
C
20 MHz
C
10 MHz
4.40
—
1 MHz
1.85
—
5.88
—
10 MHz
3.70
—
1 MHz
1.85
—
5.35
—
C
C
3
Run supply current FEI
mode, all modules off &
gated; run from flash
RIDD
20 MHz
C
10 MHz
3.42
—
1 MHz
1.80
—
P
Run supply current FBE
mode, all modules on; run
from RAM
RIDD
C
P
C
C
Run supply current FBE
mode, all modules off &
gated; run from RAM
RIDD
7
C
10.9
14.0
10 MHz
6.10
—
1 MHz
1.69
—
8.18
—
10 MHz
5.14
—
1 MHz
1.44
—
8.50
13.0
5.07
—
1.59
—
6.11
—
10 MHz
4.10
—
1 MHz
1.34
—
5.95
—
10 MHz
3.50
—
1 MHz
1.24
—
5.45
—
10 MHz
3.25
—
1 MHz
1.20
—
20 MHz
5
3
5
1 MHz
20 MHz
Wait mode current FEI
mode, all modules on
3
10 MHz
WIDD
C
6
20 MHz
20 MHz
C
5
5
C
C
4
20 MHz
3
20 MHz
20 MHz
S3IDD
C
Stop3 mode supply
current no clocks active
(except 1kHz LPO
clock)2, 3
C
ADC adder to stop3
—
3
5
3
—
5
4.6
—
—
3
4.5
—
—
5
40
—
-40 to 125 °C
µA
-40 to 125 °C
Table continues on the next page...
S9S08RN16 Series Data Sheet, Rev1, 02/2014.
14
Freescale Semiconductor, Inc.
Switching specifications
Table 4. Supply current characteristics (continued)
Num
C
Parameter
C
ADLPC = 1
Symbol
Bus Freq
VDD (V)
Typical1
Max
3
39
—
5
121
—
3
120
—
5
128
—
3
124
—
Unit
Temp
µA
-40 to 125 °C
µA
-40 to 125 °C
ADLSMP = 1
ADCO = 1
MODE = 10B
ADICLK = 11B
8
C
TSI adder to stop34
C
PS = 010B
—
—
NSCN = 0x0F
EXTCHRG = 0
REFCHRG = 0
DVOLT = 01B
9
C
LVD adder to stop35
—
C
1.
2.
3.
4.
5.
—
Data in Typical column was characterized at 5.0 V, 25 °C or is typical recommended value.
RTC adder cause