SA676DK/01,118

SA676 Low-voltage mixer FM IF system Rev. 3 — 19 July 2012 Product data sheet 1. General description The SA676 is a low-voltage monolithic FM IF system incorporating a mixer/oscillator, two limiting intermediate frequency amplifiers, quadrature detector, logarithmic Received Signal Strength Indicator (RSSI), voltage regulator and audio and RSSI op amps. The SA676 is available in a 20-pin SSOP (Shrink Small Outline Package). The SA676 was designed for cordless telephone applications in which efficient and economic integrated solutions are required and yet high performance is desirable. Although the product is not targeted to meet the stringent specifications of high performance cellular equipment, it will exceed the needs for analog cordless phones. The minimal amount of external components and absence of any external adjustments makes for a very economical solution. 2. Features and benefits              Low power consumption: 3.5 mA typical at 3 V Mixer input to > 100 MHz Mixer conversion power gain of 17 dB at 45 MHz XTAL oscillator effective to 100 MHz (LC oscillator or external oscillator can be used at higher frequencies) 102 dB of IF amplifier/limiter gain 2 MHz IF amp/limiter small signal bandwidth Temperature compensated logarithmic Received Signal Strength Indicator (RSSI) with a 70 dB dynamic range Low external component count; suitable for crystal/ceramic/LC filters Audio output internal op amp RSSI output internal op amp Internal op amps with rail-to-rail outputs ESD protection exceeds 2000 V HBM per JESD22-A114 and 1000 V CDM per JESD22-C101 Latch-up testing is done to JEDEC Standard JESD78 Class II, Level B 3. Applications  Cordless telephones SA676 NXP Semiconductors Low-voltage mixer FM IF system 4. Ordering information Table 1. Ordering information Tamb = 40 C to +85 C Type number SA676DK/01 Topside mark Package Name Description Version SA676DK SSOP20 plastic shrink small outline package; 20 leads; body width 4.4 mm SOT266-1 20 19 18 17 16 15 14 IF amp mixer 13 12 LIMITER_OUT LIMITER_DECOUPL LIMITER_DECOUPL LIMITER_IN GND IF_AMP_OUT IF_AMP_DECOUPL IF_AMP_IN IF_AMP_DECOUPL MIXER_OUT 5. Block diagram 11 limiter RSSI OSC quad 6 7 8 9 AUDIO_FEEDBACK AUDIO_OUT RSSI_FEEDBACK 10 QUADRATURE_IN 5 VCC audio RSSI_OUT RF_IN_DECOUPL B 4 OSC_IN 2 E 3 OSC_OUT 1 RF_IN VREG 002aag116 Fig 1. SA676 Product data sheet Block diagram All information provided in this document is subject to legal disclaimers. Rev. 3 — 19 July 2012 © NXP B.V. 2012. All rights reserved. 2 of 22 SA676 NXP Semiconductors Low-voltage mixer FM IF system 6. Pinning information 6.1 Pinning RF_IN 1 20 MIXER_OUT RF_IN_DECOUPL 2 19 IF_AMP_DECOUPL OSC_OUT 3 18 IF_AMP_IN OSC_IN 4 17 IF_AMP_DECOUPL RSSI_OUT 5 VCC 6 AUDIO_FEEDBACK 7 14 LIMITER_IN AUDIO_OUT 8 13 LIMITER_DECOUPL RSSI_FEEDBACK 9 12 LIMITER_DECOUPL SA676DK/01 QUADRATURE_IN 10 16 IF_AMP_OUT 15 GND 11 LIMITER_OUT 002aag115 Fig 2. Pin configuration for SSOP20 6.2 Pin description Table 2. Pin description Symbol SA676 Product data sheet Pin Description RF_IN 1 RF input RF_IN_DECOUPL 2 RF input decoupling pin OSC_OUT 3 oscillator output OSC_IN 4 oscillator input RSSI_OUT 5 RSSI output VCC 6 positive supply voltage AUDIO_FEEDBACK 7 audio amplifier negative feedback terminal AUDIO_OUT 8 audio amplifier output RSSI_FEEDBACK 9 RSSI amplifier negative feedback terminal QUADRATURE_IN 10 quadrature detector input terminal LIMITER_OUT 11 limiter amplifier output LIMITER_DECOUPL 12 limiter amplifier decoupling pin LIMITER_DECOUPL 13 limiter amplifier decoupling pin LIMITER_IN 14 limiter amplifier input GND 15 ground; negative supply IF_AMP_OUT 16 IF amplifier output IF_AMP_DECOUPL 17 IF amplifier decoupling pin IF_AMP_IN 18 IF amplifier input IF_AMP_DECOUPL 19 IF amplifier decoupling pin MIXER_OUT 20 mixer output All information provided in this document is subject to legal disclaimers. Rev. 3 — 19 July 2012 © NXP B.V. 2012. All rights reserved. 3 of 22 SA676 NXP Semiconductors Low-voltage mixer FM IF system 7. Functional description The SA676 is an IF signal processing system suitable for second IF systems with input frequency as high as 100 MHz. The bandwidth of the IF amplifier and limiter is at least 2 MHz with 90 dB of gain. The gain/bandwidth distribution is optimized for 455 kHz, 1.5 k source applications. The overall system is well-suited to battery operation as well as high performance and high quality products of all types. The input stage is a Gilbert cell mixer with oscillator. Typical mixer characteristics include a noise figure of 7.0 dB, conversion gain of 17 dB, and input third-order intercept of 10 dBm. The oscillator will operate in excess of 100 MHz in L/C tank configurations. Hartley or Colpitts circuits can be used up to 100 MHz for crystal configurations. The output impedance of the mixer is a 1.5 k resistor permitting direct connection to a 455 kHz ceramic filter. The input resistance of the limiting IF amplifiers is also 1.5 k. With most 455 kHz ceramic filters and many crystal filters, no impedance matching network is necessary. The IF amplifier has 44 dB of gain and 5.5 MHz bandwidth. The IF limiter has 58 dB of gain and 4.5 MHz bandwidth. To achieve optimum linearity of the log signal strength indicator, there must be a 12 dBV insertion loss between the first and second IF stages. If the IF filter or interstage network does not cause 12 dBV insertion loss, a fixed or variable resistor or an L pad for simultaneous loss and impedance matching can be added between the first IF output (IF_AMP_OUT) and the interstage network. The overall gain will then be 90 dB with 2 MHz bandwidth. The signal from the second limiting amplifier goes to a Gilbert cell quadrature detector. One port of the Gilbert cell is internally driven by the IF. The other output of the IF is AC-coupled to a tuned quadrature network. This signal, which now has a 90 phase relationship to the internal signal, drives the other port of the multiplier cell. The demodulated output of the quadrature drives an internal op amp. This op amp can be configured as a unity gain buffer, or for simultaneous gain, filtering, and second-order temperature compensation if needed. It can drive an AC load as low as 10 k with a rail-to-rail output. A log signal strength indicator completes the circuitry. The output range is greater than 70 dB and is temperature compensated. This signal drives an internal op amp. The op amp is capable of rail-to-rail output. It can be used for gain, filtering, or second-order temperature compensation of the RSSI, if needed. Remark: dBV = 20log VO/VI. SA676 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 19 July 2012 © NXP B.V. 2012. All rights reserved. 4 of 22 SA676 NXP Semiconductors Low-voltage mixer FM IF system 8. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions VCC supply voltage Tstg storage temperature Tamb ambient temperature operating Min Max Unit - 7 V 65 +150 C 40 +85 C 9. Thermal characteristics Table 4. Thermal characteristics Symbol Parameter Conditions Max Unit Zth(j-a) transient thermal impedance from junction to ambient SA676DK/01 (SSOP20) 117 K/W 10. Static characteristics Table 5. Static characteristics VCC = 3 V; Tamb = 25 C; unless specified otherwise. SA676 Product data sheet Symbol Parameter VCC ICC Conditions Min Typ Max Unit supply voltage 2.7 - 7.0 V supply current - 3.5 5.0 mA All information provided in this document is subject to legal disclaimers. Rev. 3 — 19 July 2012 © NXP B.V. 2012. All rights reserved. 5 of 22 SA676 NXP Semiconductors Low-voltage mixer FM IF system 11. Dynamic characteristics Table 6. Dynamic characteristics Tamb = 25 C; VCC = 3 V; unless specified otherwise. RF frequency = 45 MHz + 14.5 dBV RF input step-up. IF frequency = 455 kHz; R17 = 2.4 k and R18 = 3.3 k. RF level = 45 dBm; FM modulation = 1 kHz with 5 kHz peak deviation. Audio output with de-emphasis filter and C-message weighted filter. Test circuit Figure 9. The parameters listed below are tested using automatic test equipment to assure consistent electrical characteristics. The limits do not represent the ultimate performance limits of the device. Use of an optimized RF layout will improve many of the listed parameters. Symbol Parameter Conditions Min Typ Max Unit Mixer/oscillator section (external LO = 220 mV RMS value) fi input frequency - 100 - MHz fosc oscillator frequency - 100 - MHz NF noise figure at 45 MHz - 7.0 - dB IP3I input third-order intercept point 50  source; f1 = 45.0 MHz; f2 = 45.06 MHz; input RF level = 52 dBm - 10 - dBm Gp(conv) conversion power gain matched 14.5 dBV step-up 10 17 - dB 50  source - 2.5 - dB Ri(RF) RF input resistance Ci(RF) RF input capacitance Ro(mix) mixer output resistance single-ended input - 8 - k - 3.0 4.0 pF MIXER_OUT pin 1.25 1.5 - k IF section Gamp(IF) IF amplifier gain 50  source - 44 - dB Glim limiter gain 50  source - 58 - dB AM AM rejection 30 % AM 1 kHz - 50 - dB Vo(aud) audio output voltage gain of two 60 120 - mV SINAD signal-to-noise-and-distortion ratio IF level 110 dBm - 17 - dB THD total harmonic distortion - 55 - dB S/N signal-to-noise ratio - 60 - dB Vo(RSSI) no modulation for noise RSSI output voltage IF; R9 = 2 k [1] IF level = 110 dBm - 0.5 0.9 V IF level = 50 dBm - 1.7 2.2 V - 70 - dB 1.3 1.5 - k RSSI(range) RSSI range Zi(IF) IF input impedance IF_AMP_IN pin Zo(IF) IF output impedance IF_AMP_OUT pin - 0.3 - k Zi(lim) limiter input impedance LIMITER_IN pin 1.3 1.5 - k Zo(lim) limiter output impedance LIMITER_OUT pin - 0.3 - k Vo(RMS) RMS output voltage LIMITER_OUT pin - 130 - mV system; RF level = 114 dBm - 12 - dB RF/IF section (internal LO) SINAD [1] signal-to-noise-and-distortion ratio The generator source impedance is 50 , but the SA676 input impedance at IF_AMP_IN (pin 18) is 1500 . As a result, IF level refers to the actual signal that enters the SA676 input (IF_AMP_IN, pin 18), which is about 21 dB less than the ‘available power’ at the generator. SA676 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 19 July 2012 © NXP B.V. 2012. All rights reserved. 6 of 22 SA676 NXP Semiconductors Low-voltage mixer FM IF system 12. Performance curves 002aag198 6 ICC (mA) VCC = 7.0 V 5 5.0 V 4 3.0 V 3 2 −55 Fig 3. 2.7 V −15 −35 5 25 65 45 85 125 105 Tamb (°C) Supply current versus ambient temperature 002aag199 18.0 VCC = 2.7 V 3.0 V 7.0 V Gp(conv) (dB) 17.5 17.0 16.5 16.0 −40 Fig 4. SA676 Product data sheet −20 0 20 40 60 Tamb (°C) 80 90 Conversion power gain versus ambient temperature All information provided in this document is subject to legal disclaimers. Rev. 3 — 19 July 2012 © NXP B.V. 2012. All rights reserved. 7 of 22 SA676 NXP Semiconductors Low-voltage mixer FM IF system 002aaf414 20 IF output power (dBm) 0 −20 −40 (1) (2) −60 −80 −66 −46 −26 −6 14 34 RF(3) input level (dBm) RF = 45 MHz; IF = 455 kHz. (1) Fund product. (2) Third order product. (3) 50  input. Fig 5. Mixer third order intercept and compression 002aaf416 5 relative level (dB) −5 audio −15 −25 AM rejection −35 −45 THD+N −55 −65 −125 noise −105 −85 −65 −45 −25 RF level (dBm) VCC = 3 V; RF = 45 MHz; deviation = 5 kHz; Vo(aud)RMS = 117.6 mV. Fig 6. SA676 Product data sheet Relative level of audio, AM rejection, THD+N and noise (Tamb = +25 C) All information provided in this document is subject to legal disclaimers. Rev. 3 — 19 July 2012 © NXP B.V. 2012. All rights reserved. 8 of 22 SA676 NXP Semiconductors Low-voltage mixer FM IF system 002aag200 2.1 Vo(RSSI) (V) 1.8 Tamb = +85 °C +27 °C −40 °C 1.5 1.2 0.9 0.6 0.3 −125 −105 −85 −65 −45 RF level (dBm) VCC = 3 V Fig 7. RSSI output voltage versus RF level 002aag201 300 VCC = 7.0 V Vo(aud) (mV) 200 5.0 V 3.0 V 2.7 V 100 0 −55 Fig 8. SA676 Product data sheet −35 −15 5 25 45 65 85 125 105 Tamb (°C) Audio output voltage versus ambient temperature All information provided in this document is subject to legal disclaimers. Rev. 3 — 19 July 2012 © NXP B.V. 2012. All rights reserved. 9 of 22 SA676 NXP Semiconductors Low-voltage mixer FM IF system 13. Application information C26 R18 3.3 kΩ C15 R17 2.4 kΩ FL1 FL2 C23 20 19 C21 18 C18 C17 17 16 15 14 IF amp mixer 13 12 11 limiter RSSI OSC quad VREG audio 1 2 3 4 5 C1 6 45 MHz input C10 R10 10 kΩ 9 10 10 kΩ L1 C7 C5 8 R11 C8 C2 7 C9 C27 2.2 μF L2 C12 R19 11 kΩ IFT1 C6 C19 390 pF X1 RSSI_OUT VCC AUDIO_OUT C14 002aag117 The layout is very critical in the performance of the receiver. We highly recommend our demo board layout. All of the inductors, the quad tank, and their shield must be grounded. A 10 F to 15 F or higher value tantalum capacitor on the supply line is essential. A low frequency ESR screening test on this capacitor will ensure consistent good sensitivity in production. A 0.1 F bypass capacitor on the supply pin, and grounded near the 44.545 MHz oscillator improves sensitivity by 2 dB to 3 dB. Fig 9. SA676 Product data sheet SA676 45 MHz application circuit (SA676DK demo board) All information provided in this document is subject to legal disclaimers. Rev. 3 — 19 July 2012 © NXP B.V. 2012. All rights reserved. 10 of 22 SA676 NXP Semiconductors Low-voltage mixer FM IF system Table 7. Component Description C1 51 pF NPO ceramic C2 220 pF NPO ceramic C5, C9, C14, C17, C18, C21, C23, C26 100 nF  10 % monolithic ceramic C6 5 pF to 30 pF trim cap C7 1 nF ceramic C8, C15 10.0 pF NPO ceramic C10 10 F tantalum (minimum)[1] C12 2.2 F  10 % tantalum C19 390 pF  10 % monolithic ceramic 2.2 F tantalum C27 FL1, IFT1 SA676 Product data sheet SA676DK demo board component list FL2[2] ceramic filter Murata CFUKF455KB4X-R0 330 H Toko 303LN-1130 L1 330 nH Coilcraft UNI-10/142--04J08S L2 0.8 H nominal Toko 292CNS-T1038Z X1 44.545 MHz crystal ICM4712701 R5[3] not used in application board R10 8.2 k  5 % 1⁄4 W carbon composition R11 10 k  5 % 1⁄4 W carbon composition R17 2.4 k  5 % 1⁄4 W carbon composition R18 3.3 k  5 % 1⁄4 W carbon composition R19 11 k  5 % 1⁄4 W carbon composition [1] This value can be reduced when a battery is the power source. [2] This is a 30 kHz bandwidth 455 kHz ceramic filter. All the characterization and testing are done with this wideband filter. A more narrowband 15 kHz bandwidth 455 kHz ceramic filter that may be used as an alternative selection is Murata CFUKG455KE4A-R0. [3] R5 can be used to bias the oscillator transistor at a higher current for operation above 45 MHz. Recommended value is 22 k, but should not be below 10 k. All information provided in this document is subject to legal disclaimers. Rev. 3 — 19 July 2012 © NXP B.V. 2012. All rights reserved. 11 of 22 SA676 NXP Semiconductors Low-voltage mixer FM IF system SA6x6DK RF IN 45 MHz SA58640DK IF = 455 kHz L1 FIL1 C6 C1 C2 C21 TOKO C23 455 kHz C5 L2 C7 U1 C8 R17 R11 R18 C26 44.545 MHz X1 R10 C15 C17 C18 R19 RSSI C10 FIL2 C9 VCC AUDIO C14 C19 C27 455 kHz C12 GND 820 Ω AUDIO_DC FT1 4.7 nF 001aal912 Fig 10. SA6x6DK/SA58640DK top view with components SA676 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 19 July 2012 © NXP B.V. 2012. All rights reserved. 12 of 22 SA676 NXP Semiconductors Low-voltage mixer FM IF system 001aal892 Fig 11. SA6x6DK/SA58640DK bottom view (viewed from top) SA676 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 19 July 2012 © NXP B.V. 2012. All rights reserved. 13 of 22 SA676 NXP Semiconductors Low-voltage mixer FM IF system 14. Test information RF GENERATOR(1) 45 MHz SA676 DEMOBOARD(2) RSSI AUDIO VCC (+3 V) DE-EMPHASIS FILTER DC VOLTMETER C-MESSAGE(3) SCOPE HP339A DISTORTION ANALYZER(4) 002aag118 (1) Set RF generator at 45.000 MHz; use a 1 kHz modulation frequency and a 6 kHz deviation if using 16 kHz filters, or 8 kHz if using 30 kHz filters. (2) The smallest RSSI voltage (i.e., when no RF input is present and the input is terminated) is a measure of the quality of the layout and design. If the lowest RSSI voltage is 500 mV or higher, it means the receiver is in regenerative mode. In that case, the receiver sensitivity will be worse than expected. (3) The C-message and de-emphasis filter combination has a peak gain of 10 dB for accurate measurements. Without the gain, the measurements may be affected by the noise of the scope and HP339A analyzer. The de-emphasis filter has a fixed 6 dB/octave slope between 300 Hz and 3 kHz. (4) The measured typical sensitivity for 12 dB SINAD should be 0.45 V or 114 dBm at the RF input. Fig 12. SA676 application circuit test setup SA676 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 19 July 2012 © NXP B.V. 2012. All rights reserved. 14 of 22 SA676 NXP Semiconductors Low-voltage mixer FM IF system 15. Package outline SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm D SOT266-1 E A X c y HE v M A Z 11 20 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 10 detail X w M bp e 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) θ mm 1.5 0.15 0 1.4 1.2 0.25 0.32 0.20 0.20 0.13 6.6 6.4 4.5 4.3 0.65 6.6 6.2 1 0.75 0.45 0.65 0.45 0.2 0.13 0.1 0.48 0.18 10 o o 0 Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION SOT266-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 MO-152 Fig 13. Package outline SOT266-1 (SSOP20) SA676 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 19 July 2012 © NXP B.V. 2012. All rights reserved. 15 of 22 SA676 NXP Semiconductors Low-voltage mixer FM IF system 16. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 16.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 16.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: • Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: • • • • • • Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering 16.3 Wave soldering Key characteristics in wave soldering are: • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities SA676 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 19 July 2012 © NXP B.V. 2012. All rights reserved. 16 of 22 SA676 NXP Semiconductors Low-voltage mixer FM IF system 16.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 14) than a SnPb process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 8 and 9 Table 8. SnPb eutectic process (from J-STD-020C) Package thickness (mm) Package reflow temperature (C) Volume (mm3) < 350  350 < 2.5 235 220  2.5 220 220 Table 9. Lead-free process (from J-STD-020C) Package thickness (mm) Package reflow temperature (C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 14. SA676 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 19 July 2012 © NXP B.V. 2012. All rights reserved. 17 of 22 SA676 NXP Semiconductors Low-voltage mixer FM IF system maximum peak temperature = MSL limit, damage level temperature minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 14. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 17. Abbreviations Table 10. SA676 Product data sheet Abbreviations Acronym Description AM Amplitude Modulation CDM Charged-Device Model ESD ElectroStatic Discharge ESR Equivalent Series Resistance FM Frequency Modulation HBM Human Body Model IF Intermediate Frequency LC inductor-capacitor filter LO Local Oscillator RF Radio Frequency RMS Root Mean Squared RSSI Received Signal Strength Indicator All information provided in this document is subject to legal disclaimers. Rev. 3 — 19 July 2012 © NXP B.V. 2012. All rights reserved. 18 of 22 SA676 NXP Semiconductors Low-voltage mixer FM IF system 18. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes SA676 v.3 20120719 Product data sheet - SA676 v.2 Modifications: • Section 2 “Features and benefits”: – 13th bullet item re-written – added (new) 14th bullet item SA676 v.2 20110412 Product data sheet - SA676 v.1 SA676 v.1 19931215 Product specification ECN 853-1726 11659 - SA676 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 19 July 2012 © NXP B.V. 2012. All rights reserved. 19 of 22 SA676 NXP Semiconductors Low-voltage mixer FM IF system 19. Legal information 19.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 19.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 19.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. SA676 Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 3 — 19 July 2012 © NXP B.V. 2012. All rights reserved. 20 of 22 SA676 NXP Semiconductors Low-voltage mixer FM IF system Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 19.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 20. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com SA676 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 19 July 2012 © NXP B.V. 2012. All rights reserved. 21 of 22 SA676 NXP Semiconductors Low-voltage mixer FM IF system 21. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 19 19.1 19.2 19.3 19.4 20 21 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 Thermal characteristics . . . . . . . . . . . . . . . . . . 5 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 Performance curves . . . . . . . . . . . . . . . . . . . . . 7 Application information. . . . . . . . . . . . . . . . . . 10 Test information . . . . . . . . . . . . . . . . . . . . . . . . 14 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15 Soldering of SMD packages . . . . . . . . . . . . . . 16 Introduction to soldering . . . . . . . . . . . . . . . . . 16 Wave and reflow soldering . . . . . . . . . . . . . . . 16 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 16 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 17 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 19 Legal information. . . . . . . . . . . . . . . . . . . . . . . 20 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Contact information. . . . . . . . . . . . . . . . . . . . . 21 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2012. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 19 July 2012 Document identifier: SA676