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SC16C2552BIA44

SC16C2552BIA44

  • 厂商:

    NXP(恩智浦)

  • 封装:

  • 描述:

    SC16C2552BIA44 - 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs - NXP Semicondu...

  • 数据手册
  • 价格&库存
SC16C2552BIA44 数据手册
SC16C2552B 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs Rev. 03 — 12 February 2009 Product data sheet 1. General description The SC16C2552B is a two channel Universal Asynchronous Receiver and Transmitter (UART) used for serial data communications. Its principal function is to convert parallel data into serial data, and vice versa. The UART can handle serial data rates up to 5 Mbit/s. The SC16C2552B is pin compatible with the PC16552 and ST16C2552. The SC16C2552B provides enhanced UART functions with 16-byte FIFOs, modem control interface, DMA mode data transfer and concurrent writes to control registers of both channels. The DMA mode data transfer is controlled by the FIFO trigger levels and the RXRDY and TXRDY signals. On-board status registers provide the user with error indications and operational status. System interrupts and modem control features may be tailored by software to meet specific user requirements. An internal loopback capability allows on-board diagnostics. Independent programmable baud rate generators are provided to select transmit and receive baud rates. The SC16C2552B operates at 5 V, 3.3 V and 2.5 V and the industrial temperature range, and is available in a plastic PLCC44 package. 2. Features I I I I I I I I I I I I I I Industrial temperature range (−40 °C to +85 °C) 5 V, 3.3 V and 2.5 V operation Pin-to-pin compatible to PC16C552, ST16C2552 Up to 5 Mbit/s data rate at 5 V and 3.3 V, and 3 Mbit/s at 2.5 V 5 V tolerant on input only pins1 16-byte transmit FIFO 16-byte receive FIFO with error flags Independent transmit and receive UART control Four selectable receive FIFO interrupt trigger levels; fixed transmit FIFO interrupt trigger level Modem control functions (CTS, RTS, DSR, DTR, RI, CD) DMA operation and DMA monitoring via package I/O pins, TXRDY/RXRDY UART internal register sections A and B may be written to concurrently Multi-function output allows more package functions with fewer I/O pins Programmable character lengths (5, 6, 7, 8), with even, odd, or no parity 1. For data bus pins D7 to D0, see Table 23 “Limiting values”. NXP Semiconductors SC16C2552B 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs 3. Ordering information Table 1. Ordering information Package Name SC16C2552BIA44 PLCC44 Description plastic leaded chip carrier; 44 leads Version SOT187-2 Type number 4. Block diagram SC16C2552B TRANSMIT FIFO REGISTERS DATA BUS AND CONTROL LOGIC TRANSMIT SHIFT REGISTER TXA, TXB D0 to D7 IOR IOW RESET INTERCONNECT BUS LINES AND CONTROL SIGNALS RECEIVE FIFO REGISTERS RECEIVE SHIFT REGISTER RXA, RXB A0 to A2 CS CHSEL REGISTER SELECT LOGIC DTRA, DTRB RTSA, RTSB MFA, MFB MODEM CONTROL LOGIC INTA, INTB TXRDYA, TXRDYB RXRDYA, RXRDYB INTERRUPT CONTROL LOGIC CLOCK AND BAUD RATE GENERATOR CTSA, CTSB RIA, RIB CDA, CDB DSRA, DSRB 002aaa487 XTAL1 XTAL2 Fig 1. Block diagram of SC16C2552B SC16C2552B_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 12 February 2009 2 of 38 NXP Semiconductors SC16C2552B 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs 5. Pinning information 5.1 Pinning TXRDYA 41 DSRA D5 D6 D7 7 8 9 40 CTSA 39 RXA 38 TXA 37 DTRA 36 RTSA 35 MFA 34 INTA 33 VCC 32 TXRDYB 31 RIB 30 CDB 29 DSRB CTSB 28 002aaa488 A0 10 XTAL1 11 GND 12 XTAL2 13 A1 14 A2 15 CHSEL 16 INTB 17 CS 18 MFB 19 IOW 20 RESET 21 GND 22 RTSB 23 IOR 24 RXB 25 TXB 26 DTRB 27 SC16C2552BIA44 Fig 2. Pin configuration for PLCC44 5.2 Pin description Table 2. Symbol A0 A1 A2 CDA CDB CHSEL Pin description Pin 10 14 15 42 30 16 Type I I I I I I Carrier detect A, B (active LOW). These inputs are associated with individual UART channels A through B. A logic 0 on this pin indicates that a carrier has been detected by the modem for that channel. Channel select. UART channel A or B is selected by the logic state of this pin when CS is a logic 0. A logic 0 on CHSEL selects the UART channel B, while a logic 1 selects UART channel A. Bit 0 of AFR register can temporarily override CHSEL function, allowing user to write to both channel registers simultaneously with one write cycle. Clear to Send A, B (active LOW). These inputs are associated with individual UART channels A through B. A logic 0 on the CTSn pin indicates the modem or data set is ready to accept transmit data from the SC16C2552B. Status can be tested by reading MSR[4]. Chip select (active LOW). This function selects channel A or channel B in accordance with the logical state of the CHSEL pin. This allows data to be transferred between the user CPU and the SC16C2552B. Description Register select. A0 to A2 are used during read and write operations to select the UART register to read from or write to. CTSA CTSB CS 40 28 18 I I I SC16C2552B_3 42 CDA 44 VCC 43 RIA D4 D3 D2 6 5 4 3 D1 2 D0 1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 12 February 2009 3 of 38 NXP Semiconductors SC16C2552B 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs Table 2. Symbol D0 D1 D2 D3 D4 D5 D6 D7 DSRA DSRB DTRA DTRB Pin description …continued Pin 2 3 4 5 6 7 8 9 41 29 37 27 Type I/O I/O I/O I/O I/O I/O I/O I/O I I O O Data Set Ready A, B (active LOW). These inputs are associated with individual UART channels A through B. A logic 0 on this pin indicates the modem or data set is powered-on and is ready for data exchange with the UART. Data Terminal Ready A, B (active LOW). These outputs are associated with individual UART channels A through B. A logic 0 on this pin indicates that the SC16C2552B is powered-on and ready. This pin can be controlled via the modem control register. Writing a logic 1 to MCR[0] will set the DTRn output to logic 0, enabling the modem. This pin will be a logic 1 after writing a logic 0 to MCR[0], or after a reset. Signal and power ground. Interrupt A, B (active HIGH). This function is associated with individual channel interrupts. Interrupts are enabled in the Interrupt Enable Register (IER). Interrupt conditions include: receiver errors, available receiver buffer data, transmit buffer empty, or when a modem status flag is detected. Read strobe (active LOW). A logic 0 transition on this pin will load the contents of an internal register defined by address bits A[2:0] onto the SC16C2552B data bus (D[7:0]) for access by external CPU. Write strobe (active LOW). A logic 0 transition on this pin will transfer the contents of the data bus (D[7:0]) from the external CPU to an internal register that is defined by address bits A[2:0]. Multi-function A, B. This function is associated with an individual channel function, A or B. User programmable bits 2:1 of the Alternate Function Register (AFR) selects a signal function or output on these pins. OP2 (interrupt enable), BAUDOUT, and RXRDY are signal functions that may be selected by the AFR. These signal functions are described as follows: OP2. When OP2 is selected, the MFn pin is a logic 0 when MCR[3] is set to a logic 1. A logic 1 is the default signal condition that is available following a master reset or power-up. BAUDOUT. When BAUDOUT function is selected, the 16× baud rate clock output is available at this pin. RXRDY. RXRDY is primarily intended for monitoring DMA mode 1 transfers for the receive data FIFOs. A logic 0 indicates there is receive data to read/unload, i.e., receive ready status with one or more RX characters available in the FIFO/RHR. This pin is a logic 1 when the FIFO/RHR is empty or when the programmed trigger level has not been reached. This signal can also be used for single mode transfers (DMA mode 0). Description Data bus (bidirectional). These pins are the 8-bit, 3-state data bus for transferring information to or from the controlling CPU. GND INTA INTB 12, 22 34 17 I O O IOR 24 I IOW 20 I MFA MFB 35 19 O O RESET 21 I Reset (active HIGH). A logic 1 on this pin will reset the internal registers and all the outputs. The UART transmitter output and the receiver input will be disabled during reset time. See Section 7.11 “SC16C2552B external reset condition” for initialization details. Ring Indicator A, B (active LOW). These inputs are associated with individual UART channels A through B. A logic 0 on this pin indicates the modem has received a ringing signal from the telephone line. A logic 1 transition on this input pin will generate an interrupt if modem status interrupt is enabled. RIA RIB 43 31 I I SC16C2552B_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 12 February 2009 4 of 38 NXP Semiconductors SC16C2552B 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs Table 2. Symbol RTSA RTSB Pin description …continued Pin 36 23 Type O O Description Request to Send A, B (active LOW). These outputs are associated with individual UART channels A through B. A logic 0 on the RTSn pin indicates the transmitter is ready to transmit data. Writing a logic 1 in the modem control register MCR[1] will set this pin to a logic 0, indicating that the transmitter is ready to transmit data. After a reset, this pin will be set to a logic 1. Receive data A, B. These inputs are associated with individual serial channel data to the SC16C2552B receive input circuits A through B. The RXn signal will be a logic 1 during reset, idle (no data). During the local Loopback mode, the RXn input pin is disabled and TXn data is connected to the UART RXn input, internally. Transmit data A, B. These outputs are associated with individual serial transmit channel data from the SC16C2552B. The TXn signal will be a logic 1 during reset, idle (no data), or when the transmitter is disabled. During the local Loopback mode, the TXn output pin is disabled and TXn data is internally connected to the UART RXn input. Transmit Ready A, B (active LOW). These outputs provide the TX FIFO/THR status for individual transmit channels (A, B). TXRDYn is primarily intended for monitoring DMA mode 1 transfers for the transmit data FIFOs. An individual channel’s TXRDYA, TXRDYB buffer ready status is indicated by logic 0, i.e., at least one location is empty and available in the FIFO or THR. This signal can also be used for single mode transfers (DMA mode 0). Power supply input. Crystal or external clock input. Functions as a crystal input or as an external clock input. A crystal can be connected between this pin and XTAL2 to form an internal oscillator circuit. Alternatively, an external clock can be connected to this pin to provide custom data rates. See Section 6.5 “Programmable baud rate generator”. Output of the crystal oscillator or buffered clock. (See also XTAL1.) Crystal oscillator output or buffered clock output. Should be left open if an external clock is connected to XTAL1. RXA RXB 39 25 I I TXA TXB 38 26 O O TXRDYA TXRDYB 1 32 O O VCC XTAL1 33, 44 11 I I XTAL2 13 O SC16C2552B_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 12 February 2009 5 of 38 NXP Semiconductors SC16C2552B 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs 6. Functional description The SC16C2552B provides serial asynchronous receive data synchronization, parallel-to-serial and serial-to-parallel data conversions for both the transmitter and receiver sections. These functions are necessary for converting the serial data stream into parallel data that is required with digital data systems. Synchronization for the serial data stream is accomplished by adding start and stop bits to the transmit data to form a data character. Data integrity is ensured by attaching a parity bit to the data character. The parity bit is checked by the receiver for any transmission bit errors. The SC16C2552B is fabricated with an advanced CMOS process. The SC16C2552B is an upward solution that provides a dual UART capability with 16 bytes of transmit and receive FIFO memory, instead of none in the 16C450. The SC16C2552B is designed to work with high speed modems and shared network environments that require fast data processing time. Increased performance is realized in the SC16C2552B by the transmit and receive FIFOs. This allows the external processor to handle more networking tasks within a given time. In addition, the four selectable receive FIFO trigger interrupt levels are uniquely provided for maximum data throughput performance, especially when operating in a multi-channel environment. The FIFO memory greatly reduces the bandwidth requirement of the external controlling CPU, increases performance, and reduces power consumption. The SC16C2552B is capable of operation up to 1.5 Mbit/s with a 24 MHz crystal. With a crystal or external clock input of 7.3728 MHz, the user can select data rates up to 460.8 kbit/s. The rich feature set of the SC16C2552B is available through internal registers. Selectable receive FIFO trigger levels, selectable TX and RX baud rates, and modem interface controls are all standard features. 6.1 UART A-B functions The UART provides the user with the capability to bidirectionally transfer information between an external CPU, the SC16C2552B package, and an external serial device. A logic 0 on chip select pin CS and a logic 1 on CHSEL allows the user to configure, send data, and/or receive data via UART channel A. A logic 0 on chip select pin CS and a logic 0 on CHSEL allows the user to configure, send data, and/or receive data via UART channel B. Individual channel select functions are shown in Table 3. Table 3. CS = 1 CS = 0 Serial port selection UART select none UART channel selected as follows: CHSEL = 1: UART channel A CHSEL = 0: UART channel B Chip select During a write mode cycle, the setting of AFR[0] to a logic 1 will override the CHSEL selection and allow a simultaneous write to both UART channel sections. This functional capability allows the registers in both UART channels to be modified concurrently, saving individual channel initialization time. Caution should be considered, however, when using this capability. Any in-process serial data transfer may be disrupted by changing an active channel’s mode. SC16C2552B_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 12 February 2009 6 of 38 NXP Semiconductors SC16C2552B 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs 6.2 Internal registers The SC16C2552B provides two sets of internal registers (A and B) consisting of 13 registers each for monitoring and controlling the functions of each channel of the UART. These registers are shown in Table 4. The UART registers function as data holding registers (THR/RHR), interrupt status and control registers (IER/ISR), a FIFO control register (FCR), line status and control registers (LCR/LSR), modem status and control registers (MCR/MSR), programmable data rate (clock) control registers (DLL/DLM), a user accessible scratchpad register (SPR), and an Alternate Function Register (AFR). Table 4. A2 0 0 0 0 1 1 1 1 0 0 0 [1] Internal registers decoding A1 0 0 1 1 0 0 1 1 0 0 1 A0 0 1 0 1 0 1 0 1 0 1 0 Read mode Receive Holding Register Interrupt Enable Register Interrupt Status Register Line Control Register Modem Control Register Line Status Register Modem Status Register Scratchpad Register AFR)[1] LSB of Divisor Latch MSB of Divisor Latch Alternate Function Register LSB of Divisor Latch MSB of Divisor Latch Alternate Function Register Write mode Transmit Holding Register Interrupt Enable Register FIFO Control Register Line Control Register Modem Control Register n/a n/a Scratchpad Register General register set (THR/RHR, IER/ISR, MCR/MSR, FCR, LCR/LSR, SPR) Baud rate register set (DLL/DLM, The baud rate register and AFR register sets are accessible only when CS is a logic 0 and LCR[7] is a logic 1 for the register set (A/B) being accessed. 6.3 FIFO operation The 16 byte transmit and receive data FIFOs are enabled by the FIFO Control Register (FCR) bit 0. The user can set the receive trigger level via FCR[7:6], but not the transmit trigger level. The receiver FIFO section includes a time-out function to ensure data is delivered to the external CPU. A time-out interrupt is generated whenever the Receive Holding Register (RHR) has not been read following the loading of a character, or the receive trigger interrupt is generated when RX FIFO level is equal to the program RX trigger value. 6.4 Time-out interrupts The interrupts are enabled by IER[3:0]. Care must be taken when handling these interrupts. Following a reset, if the transmitter interrupt is enabled, the SC16C2552B will issue an interrupt to indicate that the Transmit Holding Register is empty. The ISR register provides the current singular highest priority interrupt only. A condition can exist where a higher priority interrupt may mask the lower priority interrupt(s). Only after servicing the higher pending interrupt will the lower priority interrupt(s) be reflected in the status register. Servicing the interrupt without investigating further interrupt conditions can result in data errors. SC16C2552B_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 12 February 2009 7 of 38 NXP Semiconductors SC16C2552B 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs When two interrupt conditions have the same priority, it is important to service these interrupts correctly. Receive Data Ready and Receive Time-Out have the same interrupt priority (when enabled by IER[0]). The receiver issues an interrupt after the number of characters have reached the programmed trigger level. In this case, the SC16C2552B FIFO may hold more characters than the programmed trigger level. Following the removal of a data byte, the user should re-check LSR[0] for additional characters. A Receive Time-Out will not occur if the receive FIFO is empty. The time-out counter is reset at the center of each stop bit received or each time the receive holding register (RHR) is read. The actual time-out value is 4 character time. 6.5 Programmable baud rate generator The SC16C2552B supports high speed modem technologies that have increased input data rates by employing data compression schemes. For example, a 33.6 kbit/s modem that employs data compression may require a 115.2 kbit/s input data rate. A 128.0 kbit/s ISDN modem that supports data compression may need an input data rate of 460.8 kbit/s. A baud rate generator is provided for each UART channel, allowing independent TX/RX channel control. The programmable Baud Rate Generator (BRG) is capable of accepting an input clock up to 80 MHz, as required for supporting a 5 Mbit/s data rate. The SC16C2552B can be configured for internal or external clock operation. For internal clock oscillator operation, an industry standard microprocessor crystal is connected externally between the XTAL1 and XTAL2 pins. Alternatively, an external clock can be connected to the XTAL1 pin to clock the internal baud rate generator for standard or custom rates (see Table 5). The generator divides the input 16× clock by any divisor from 1 to (216 − 1). The SC16C2552B divides the basic external clock by 16. The basic 16× clock provides table rates to support standard and custom applications using the same system design. The rate table is configured via the DLL and DLM internal register functions. Customized baud rates can be achieved by selecting the proper divisor values for the MSB and LSB sections of baud rate generator. Programming the baud rate generator registers DLM (MSB) and DLL (LSB) provides a user capability for selecting the desired final baud rate. The example in Table 5 shows the selectable baud rate table available when using a 1.8432 MHz external clock input. XTAL1 XTAL2 X1 1.8432 MHz C1 22 pF C2 33 pF 002aab325 Fig 3. Crystal oscillator connection SC16C2552B_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 12 February 2009 8 of 38 NXP Semiconductors SC16C2552B 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs Baud rate generator programming table using a 1.8432 MHz clock Output 16× clock divisor (decimal) 2304 1536 768 384 192 96 48 24 16 12 6 3 2 1 Output 16× clock divisor (HEX) 900 600 300 180 C0 60 30 18 10 0C 06 03 02 01 DLM program value (HEX) 09 06 03 01 00 00 00 00 00 00 00 00 00 00 DLL program value (HEX) 00 00 00 80 C0 60 30 18 10 0C 06 03 02 01 Table 5. Output baud rate 50 75 150 300 600 1200 2400 4800 7200 9600 19.2 k 38.4 k 57.6 k 115.2 k 6.6 DMA operation The SC16C2552B FIFO trigger level provides additional flexibility to the user for block mode operation. LSR[6:5] provide an indication when the transmitter is empty or has an empty location(s). The user can optionally operate the transmit and receive FIFOs in the DMA mode (FCR[3]). When the transmit and receive FIFOs are enabled and the DMA mode is de-activated (DMA Mode 0), the SC16C2552B activates the interrupt output pin for each data transmit or receive operation. When DMA mode is activated (DMA Mode 1), the user takes the advantage of block mode operation by loading or unloading the FIFO in a block sequence determined by the receive trigger level and the transmit FIFO. In this mode, the SC16C2552B sets the interrupt output pin when characters in the transmit FIFO is below 16, or the characters in the receive FIFOs are above the receive trigger level. 6.7 Loopback mode The internal loopback capability allows on-board diagnostics. In the Loopback mode, the normal modem interface pins are disconnected and reconfigured for loopback internally. MCR[3:0] register bits are used for controlling loopback diagnostic testing. In the Loopback mode, INT enable and MCR[2] in the MCR register (bits 3:2) control the modem RI and CD inputs, respectively. MCR signals DTR (bit 0) and RTS (bit 1) are used to control the modem DSR and CTS inputs, respectively. The transmitter output (TX) and the receiver input (RX) are disconnected from their associated interface pins, and instead are connected together internally (see Figure 4). The CTS, DSR, CD, and RI are disconnected from their normal modem control inputs pins, and instead are connected internally to RTS, DTR, OP2 and OP1. Loopback test data is entered into the transmit holding register via the user data bus interface, D0 to D7. The transmit UART serializes the data and passes the serial data to the receive UART via the internal loopback connection. The receive UART converts the serial data back into parallel data that is then SC16C2552B_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 12 February 2009 9 of 38 NXP Semiconductors SC16C2552B 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs made available at the user data interface D0 to D7. The user optionally compares the received data to the initial transmitted data for verifying error-free operation of the UART TX/RX circuits. In this mode, the receiver and transmitter interrupts are fully operational. The Modem Control Interrupts are also operational. However, the interrupts can only be read using lower four bits of the Modem Status Register (MSR[3:0]) instead of the four Modem Status Register bits 7:4. The interrupts are still controlled by the IER. SC16C2552B TRANSMIT FIFO REGISTERS DATA BUS AND CONTROL LOGIC MCR[4] = 1 TRANSMIT SHIFT REGISTER TXA, TXB D0 to D7 IOR IOW RESET INTERCONNECT BUS LINES AND CONTROL SIGNALS RECEIVE FIFO REGISTERS RECEIVE SHIFT REGISTER RXA, RXB A0 to A2 CS CHSEL REGISTER SELECT LOGIC RTSA, RTSB CTSA, CTSB DTRA, DTRB MODEM CONTROL LOGIC INTA, INTB TXRDYA, TXRDYB RXRDYA, RXRDYB INTERRUPT CONTROL LOGIC CLOCK AND BAUD RATE GENERATOR DSRA, DSRB (OP1A, OP1B) RIA, RIB (OP2A, OP2B) CDA, CDB 002aaa489 XTAL1 XTAL2 Fig 4. Internal Loopback mode diagram SC16C2552B_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 12 February 2009 10 of 38 NXP Semiconductors SC16C2552B 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs 7. Register descriptions Table 6 details the assigned bit functions for the SC16C2552B internal registers. The assigned bit functions are further defined in Section 7.1 through Section 7.11. Table 6. A2 0 0 0 A1 0 0 0 SC16C2552B internal registers A0 0 0 1 Register Default[1] Bit 7 set[2] XX XX 00 bit 7 bit 7 0 bit 6 bit 6 0 bit 5 bit 5 0 bit 4 bit 4 0 bit 3 bit 3 bit 2 bit 2 bit 1 bit 1 transmit holding register interrupt RCVR FIFO reset INT priority bit 0 bit 0 bit 0 receive holding register FIFOs enable INT status word length bit 0 DTR RHR THR IER Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 General register modem receive status line interrupt status interrupt DMA mode select INT priority bit 2 parity enable XMIT FIFO reset INT priority bit 1 0 1 0 FCR 00 RCVR trigger (MSB) FIFOs enabled divisor latch enable 0 RCVR trigger (LSB) FIFOs enabled 0 0 0 1 0 ISR 01 0 0 0 1 1 LCR 00 set break set parity even parity 0 0 stop bits word length bit 1 OP1 RTS 1 0 0 MCR 00 loopback OP2 output control break interrupt CTS bit 4 bit 4 bit 12 bit 4 framing error ∆CD bit 3 bit 3 bit 11 bit 3 1 0 1 LSR 60 FIFO data error CD bit 7 bit 7 bit 15 bit 7 THR and THR TSR empty empty RI bit 6 bit 6 bit 14 bit 6 DSR bit 5 bit 5 bit 13 bit 5 parity error ∆RI bit 2 bit 2 bit 10 bit 2 overrun error ∆DSR bit 1 bit 1 bit 9 bit 1 receive data ready ∆CTS bit 0 bit 0 bit 8 bit 0 1 1 0 0 0 [1] [2] [3] 1 1 0 0 1 0 1 0 1 0 MSR SPR DLL DLM AFR X0 FF XX XX 00 Special register set[3] The value shown represents the register’s initialized hexadecimal value; X = not applicable. The ‘General register set’ registers are accessible only when CS is a logic 0 and LCR[7] is logic 0. The Baud rate register and AFR register sets are accessible only when CS is a logic 0 and LCR[7] is a logic 1. Set A is accessible when CHSEL is a logic 1, and Set B is accessible when CHSEL is a logic 0. SC16C2552B_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 12 February 2009 11 of 38 NXP Semiconductors SC16C2552B 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs 7.1 Transmit Holding Register (THR) and Receive Holding Register (RHR) The serial transmitter section consists of an 8-bit Transmit Hold Register (THR) and Transmit Shift Register (TSR). The status of the THR is provided in the Line Status Register (LSR). Writing to the THR transfers the contents of the data bus (D7 through D0) to the TSR and UART via the THR, providing that the THR is empty. The THR empty flag in the LSR[5] register will be set to a logic 1 when the transmitter is empty or when data is transferred to the TSR. The serial receive section also contains an 8-bit Receive Holding Register (RHR) and a Receive Serial Shift Register (RSR). Receive data is removed from the SC16C2552B and receive FIFO by reading the RHR register. The receive section provides a mechanism to prevent false starts. On the falling edge of a start or false start bit, an internal receiver counter starts counting clocks at the 16× clock rate. After 71⁄2 clocks, the start bit time should be shifted to the center of the start bit. At this time the start bit is sampled, and if it is still a logic 0 it is validated. Evaluating the start bit in this manner prevents the receiver from assembling a false character. Receiver status codes will be posted in the LSR. 7.2 Interrupt Enable Register (IER) The Interrupt Enable Register (IER) masks the interrupts from receiver ready, transmitter empty, line status and modem status registers. These interrupts would normally be seen on the INTA, INTB output pins. Table 7. Bit 7:4 3 Interrupt Enable Register bits description Description not used; initialized to logic 0 Modem Status Interrupt. This interrupt will be issued whenever there is a modem status change as reflected in MSR[3:0]. logic 0 = disable the Modem Status Register interrupt (normal default condition) logic 1 = enable the Modem Status Register interrupt 2 IER[2] Receive Line Status interrupt. This interrupt will be issued whenever a receive data error condition exists as reflected in LSR[4:1]. logic 0 = disable the receiver line status interrupt (normal default condition) logic 1 = enable the receiver line status interrupt 1 IER[1] Transmit Holding Register interrupt. In the 16C450 mode, this interrupt will be issued whenever the THR is empty and is associated with LSR[5]. In the FIFO modes, this interrupt will be issued whenever the FIFO and THR are empty. logic 0 = disable the Transmit Holding Register Empty (TXRDY) interrupt (normal default condition) logic 1 = enable the TXRDY (ISR level 3) interrupt 0 IER[0] Receive Holding Register. In the 16C450 mode, this interrupt will be issued when the RHR has data, or is cleared when the RHR is empty. In the FIFO mode, this interrupt will be issued when the FIFO has reached the programmed trigger level or is cleared when the FIFO drops below the trigger level. logic 0 = disable the receiver ready (ISR level 2, RXRDY) interrupt (normal default condition) logic 1 = enable the RXRDY (ISR level 2) interrupt Symbol IER[7:4] IER[3] SC16C2552B_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 12 February 2009 12 of 38 NXP Semiconductors SC16C2552B 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs 7.2.1 IER versus Transmit/Receive FIFO interrupt mode operation When the receive FIFO (FCR[0] = logic 1) and receive interrupts (IER[0] = logic 1) are enabled, the receive interrupts and register status will reflect the following: • The receive RXRDY interrupt (Level 2 ISR interrupt) is issued to the external CPU when the receive FIFO has reached the programmed trigger level. It will be cleared when the receive FIFO drops below the programmed trigger level. • Receive FIFO status will also be reflected in the user accessible ISR register when the receive FIFO trigger level is reached. Both the ISR register receive status bit and the interrupt will be cleared when the FIFO drops below the trigger level. • The receive data ready bit (LSR[0]) is set as soon as a character is transferred from the shift register (RSR) to the receive FIFO. It is reset when the FIFO is empty. • When the Transmit FIFO and interrupts are enabled, an interrupt is generated when the transmit FIFO is empty due to the unloading of the data by the TSR and UART for transmission via the transmission media. The interrupt is cleared either by reading the ISR register or by loading the THR with new data characters. 7.2.2 IER versus Receive/Transmit FIFO polled mode operation When FCR[0] = logic 1, resetting IER[3:0] enables the SC16C2552B in the FIFO polled mode of operation. In this mode, interrupts are not generated and the user must poll the LSR register for TX and/or RX data status. Since the receiver and transmitter have separate bits in the LSR either or both can be used in the polled mode by selecting respective transmit or receive control bit(s). • • • • • LSR[0] will be a logic 1 as long as there is one byte in the receive FIFO. LSR[4:1] will provide the type of receive errors or a receive break, if encountered. LSR[5] will indicate when the transmit FIFO is empty. LSR[6] will indicate when both the transmit FIFO and transmit shift register are empty. LSR[7] will show if any FIFO data errors occurred. SC16C2552B_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 12 February 2009 13 of 38 NXP Semiconductors SC16C2552B 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs 7.3 FIFO Control Register (FCR) This register is used to enable the FIFOs, clear the FIFOs, set the receive FIFO trigger levels and select the DMA mode. 7.3.1 DMA mode 7.3.1.1 Mode 0 (FCR bit 3 = 0) Set and enable the interrupt for each single transmit or receive operation and is similar to the 16C450 mode. Transmit Ready (TXRDY) will go to a logic 0 whenever an empty transmit space is available in the Transmit Holding Register (THR). Receive Ready (RXRDY) at the MFn pin will go to a logic 0 whenever the Receive Holding Register (RHR) is loaded with a character and AFR[2:1] is set to the RXRDY mode. 7.3.1.2 Mode 1 (FCR bit 3 = 1) Set and enable the interrupt in a block mode operation. The transmit interrupt is set when the transmit FIFO has at least one empty location. TXRDY remains a logic 0 as long as one empty FIFO location is available. The receive interrupt is set when the receive FIFO fills to the programmed trigger level. However, the FIFO continues to fill regardless of the programmed level until the FIFO is full. RXRDY at the MFn pin remains a logic 0 as long as the FIFO fill level is above the programmed trigger level, and AFR[2:1] is set to the RXRDY mode. 7.3.2 FIFO mode Table 8. Bit 7:6 FIFO Control Register bits description Symbol FCR[7:6] Description RCVR trigger. These bits are used to set the trigger level for the receive FIFO interrupt. An interrupt is generated when the number of characters in the FIFO equals the programmed trigger level. However, the FIFO will continue to be loaded until it is full. Refer to Table 9. 5:4 3 FCR[5:4] FCR[3] Not used; initialized to logic 0. DMA mode select. logic 0 = set DMA mode ‘0’ (normal default condition) logic 1 = set DMA mode ‘1’ Transmit operation in mode ‘0’: When the SC16C2552B is in the 16C450 mode (FIFOs disabled; FCR[0] = logic 0) or in the FIFO mode (FIFOs enabled; FCR[0] = logic 1; FCR[3] = logic 0), and when there are no characters in the transmit FIFO or Transmit Holding Register, the TXRDYn pin will be a logic 0. Once active, the TXRDYn pin will go to a logic 1 after the first character is loaded into the Transmit Holding Register. Receive operation in mode ‘0’: When the SC16C2552B is in 16C450 mode, or in the FIFO mode (FCR[0] = logic 1; FCR[3] = logic 0) and there is at least one character in the receive FIFO, the RXRDY signal at the MFn pin will be a logic 0. Once active, the RXRDY signal at the MFn pin will go to a logic 1 when there are no more characters in the receiver. Note that the AFR register must be set to the RXRDY mode prior to any possible reading of the RXRDY signal. SC16C2552B_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 12 February 2009 14 of 38 NXP Semiconductors SC16C2552B 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs FIFO Control Register bits description …continued Symbol Description Transmit operation in mode ‘1’: When the SC16C2552B is in FIFO mode (FCR[0] = logic 1; FCR[3] = logic 1), the TXRDYn pin will be a logic 1 when the transmit FIFO is completely full. It will be a logic 0 if one or more FIFO locations are empty. Receive operation in mode ‘1’: When the SC16C2552B is in FIFO mode (FCR[0] = logic 1; FCR[3] = logic 1) and the trigger level has been reached, or a Receive Time-out has occurred, the RXRDY signal at the MFn pin will go to a logic 0. Once activated, it will go to a logic 1 after there are no more characters in the FIFO. Note that the AFR register must be set to the RXRDY mode prior to any possible reading of the RXRDY signal. Table 8. Bit 3 (continued) 2 FCR[2] XMIT FIFO reset. logic 0 = no FIFO transmit reset (normal default condition) logic 1 = clears the contents of the transmit FIFO and resets the FIFO counter logic (the Transmit Shift Register is not cleared or altered). This bit will return to a logic 0 after clearing the FIFO. 1 FCR[1] RCVR FIFO reset. logic 0 = no FIFO receive reset (normal default condition) logic 1 = clears the contents of the receive FIFO and resets the FIFO counter logic (the Receive Shift Register is not cleared or altered). This bit will return to a logic 0 after clearing the FIFO. 0 FCR[0] FIFOs enabled. logic 0 = disable the transmit and receive FIFO (normal default condition) logic 1 = enable the transmit and receive FIFO. This bit must be a ‘1’ when other FCR bits are written to or they will not be programmed. Table 9. FCR[7] 0 0 1 1 RCVR trigger levels FCR[6] 0 1 0 1 RX FIFO trigger level 01 04 08 14 SC16C2552B_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 12 February 2009 15 of 38 NXP Semiconductors SC16C2552B 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs 7.4 Interrupt Status Register (ISR) The SC16C2552B provides four levels of prioritized interrupts to minimize external software interaction. The Interrupt Status Register (ISR) provides the user with four interrupt status bits. Performing a read cycle on the ISR will provide the user with the highest pending interrupt level to be serviced. No other interrupts are acknowledged until the pending interrupt is serviced. Whenever the interrupt status register is read, the interrupt status is cleared. However, it should be noted that only the current pending interrupt is cleared by the read. A lower level interrupt may be seen after re-reading the interrupt status bits. Table 10 shows the data values (bits 3:0) for the four prioritized interrupt levels and the interrupt sources associated with each of these interrupt levels. Table 10. Priority level 1 2 2 3 4 Table 11. Bit 7:6 Interrupt source ISR[3] 0 0 1 0 0 ISR[2] 1 1 1 0 0 ISR[1] 1 0 0 1 0 ISR[0] 0 0 0 0 0 Source of the interrupt LSR (Receiver Line Status Register) RXRDY (Received Data Ready) RXRDY (Receive Data Time-out) TXRDY (Transmitter Holding Register empty) MSR (Modem Status Register) Interrupt Status Register bits description Description FIFOs enabled. These bits are set to a logic 0 when the FIFOs are not being used in the 16C450 mode. They are set to a logic 1 when the FIFOs are enabled in the SC16C2552B mode. logic 0 or cleared = default condition not used; initialized to a logic 0 INT priority bits. These bits indicate the source for a pending interrupt at interrupt priority levels 1, 2 and 3 (see Table 10). INT status. logic 0 = an interrupt is pending and the ISR contents may be used as a pointer to the appropriate interrupt service routine logic 1 = no interrupt pending (normal default condition) Symbol ISR[7:6] 5:4 3:1 0 ISR[5:4] ISR[3:1] ISR[0] SC16C2552B_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 12 February 2009 16 of 38 NXP Semiconductors SC16C2552B 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs 7.5 Line Control Register (LCR) The Line Control Register is used to specify the asynchronous data communication format. The word length, the number of stop bits and the parity are selected by writing the appropriate bits in this register. Table 12. Bit 7 Line Control Register bits description Symbol LCR[7] Description Divisor latch enable. The internal baud rate counter latch and Enhanced Feature mode enable. logic 0 = divisor latch disabled (normal default condition) logic 1 = divisor latch enabled 6 LCR[6] Set break. When enabled, the Break control bit causes a break condition to be transmitted (the TX output is forced to a logic 0 state). This condition exists until disabled by setting LCR[6] to a logic 0. logic 0 = no TX break condition (normal default condition) logic 1 = forces the transmitter output (TX) to a logic 0 for alerting the remote receiver to a line break condition 5:3 2 LCR[5:3] LCR[2] Programs the parity conditions (see Table 13) Stop bits. The length of stop bit is specified by this bit in conjunction with the programmed word length (see Table 14). logic 0 or cleared = default condition 1:0 LCR[1:0] Word length bits 1, 0. These two bits specify the word length to be transmitted or received (see Table 15). logic 0 or cleared = default condition Table 13. LCR[5] X X 0 0 1 Table 14. LCR[2] 0 1 1 Table 15. LCR[1] 0 0 1 1 LCR[5:3] parity selection LCR[4] X 0 1 0 1 LCR[3] 0 1 1 1 1 Parity selection no parity odd parity even parity forced parity ‘1’ forced parity ‘0’ LCR[2] stop bit length Word length (bits) 5, 6, 7, 8 5 6, 7, 8 LCR[1:0] word length LCR[0] 0 1 0 1 Word length (bits) 5 6 7 8 Stop bit length (bit times) 1 11⁄2 2 SC16C2552B_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 12 February 2009 17 of 38 NXP Semiconductors SC16C2552B 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs 7.6 Modem Control Register (MCR) This register controls the interface with the modem or a peripheral device. Table 16. Bit 7:5 4 Modem Control Register bits description Symbol MCR[7:5] MCR[4] Description reserved; initialized to a logic 0 Loopback. Enable the local Loopback mode (diagnostics). In this mode the transmitter output (TX) and the receiver input (RX), CTS, DSR, CD and RI are disconnected from the SC16C2552B I/O pins. Internally the modem data and control pins are connected into a loopback data configuration (see Figure 4). In this mode, the receiver and transmitter interrupts remain fully operational. The modem control interrupts are also operational, but the interrupts’ sources are switched to the lower four bits of the Modem Control. Interrupts continue to be controlled by the IER register. logic 0 = disable Loopback mode (normal default condition) logic 1 = enable local Loopback mode (diagnostics) 3 MCR[3] OP2. Used to control the modem CD signal in the Loopback mode. logic 0 = sets OP2 to a logic 1 (normal default condition). In the Loopback mode, sets CD internally to a logic 1. logic 1 = sets OP2 to a logic 0. In the Loopback mode, sets CD internally to a logic 0. 2 1 MCR[2] MCR[1] OP1. This bit is used in the Loopback mode only. In the Loopback mode, this bit is used to write the state of the modem RI interface signal. RTS logic 0 = force RTS output to a logic 1 (normal default condition) logic 1 = force RTS output to a logic 0 0 MCR[0] DTR logic 0 = force DTR output to a logic 1 (normal default condition) logic 1 = force DTR output to a logic 0 SC16C2552B_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 12 February 2009 18 of 38 NXP Semiconductors SC16C2552B 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs 7.7 Line Status Register (LSR) This register provides the status of data transfers between the SC16C2552B and the CPU. Table 17. Bit 7 Line Status Register bits description Description FIFO data error. logic 0 = no error (normal default condition) logic 1 = at least one parity error, framing error or break indication is in the current FIFO data. This bit is cleared when RHR register is read. 6 LSR[6] THR and TSR empty. This bit is the Transmit Empty indicator. This bit is set to a logic 1 whenever the Transmit Holding Register and the Transmit Shift Register are both empty. It is reset to logic 0 whenever either the THR or TSR contains a data character. In the FIFO mode, this bit is set to logic 1 whenever the Transmit FIFO and Transmit Shift Register are both empty. THR empty. This bit is the Transmit Holding Register Empty indicator. This bit indicates that the UART is ready to accept a new character for transmission. In addition, this bit causes the UART to issue an interrupt to CPU when the THR interrupt enable is set. The THR bit is set to a logic 1 when a character is transferred from the Transmit Holding Register into the Transmit Shift Register. The bit is reset to a logic 0 concurrently with the loading of the Transmit Holding Register by the CPU. In the FIFO mode, this bit is set when the transmit FIFO is empty; it is cleared when at least 1 byte is written to the transmit FIFO. Break interrupt. logic 0 = no break condition (normal default condition) logic 1 = the receiver received a break signal (RX was a logic 0 for one character frame time). In the FIFO mode, only one break character is loaded into the FIFO. 3 LSR[3] Framing error. logic 0 = no framing error (normal default condition) logic 1 = framing error. The receive character did not have a valid stop bit(s). In the FIFO mode, this error is associated with the character at the top of the FIFO. 2 LSR[2] Parity error. logic 0 = no parity error (normal default condition logic 1 = parity error. The receive character does not have correct parity information and is suspect. In the FIFO mode, this error is associated with the character at the top of the FIFO. 1 LSR[1] Overrun error. logic 0 = no overrun error (normal default condition) logic 1 = overrun error. A data overrun error occurred in the Receive Shift Register. This happens when additional data arrives while the FIFO is full. In this case, the previous data in the shift register is overwritten. Note that under this condition, the data byte in the Receive Shift Register is not transferred into the FIFO, therefore the data in the FIFO is not corrupted by the error. 0 LSR[0] Receive data ready. logic 0 = no data in Receive Holding Register or FIFO (normal default condition) logic 1 = data has been received and is saved in the Receive Holding Register or FIFO Symbol LSR[7] 5 LSR[5] 4 LSR[4] SC16C2552B_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 12 February 2009 19 of 38 NXP Semiconductors SC16C2552B 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs 7.8 Modem Status Register (MSR) This register provides the current state of the control interface signals from the modem or other peripheral device to which the SC16C2552B is connected. Four bits of this register are used to indicate the changed information. These bits are set to a logic 1 whenever a control input from the modem changes state. These bits are set to a logic 0 whenever the CPU reads this register. Table 18. Bit 7 Modem Status Register bits description Description Carrier Detect, CD. During normal operation, this bit is the complement of the CD input. Reading this bit in the Loopback mode produces the state of MCR[3] (OP2A/OP2B). Ring Indicator, RI. During normal operation, this bit is the complement of the RI input. Reading this bit in the Loopback mode produces the state of MCR[2] (OP1A/OP2A). Data Set Ready, DSR. During normal operation, this bit is the complement of the DSR input. During the Loopback mode, this bit is equivalent to MCR[0] (DTR). Clear To Send, CTS. During normal operation, this bit is the complement of the CTS input. During the Loopback mode, this bit is equivalent to MCR[1] (RTS). ∆CD [1] logic 0 = no CD change (normal default condition) logic 1 = the CD input to the SC16C2552B has changed state since the last time it was read. A modem Status Interrupt will be generated. 2 MSR[2] ∆RI [1] logic 0 = no RI change (normal default condition) logic 1 = the RI input to the SC16C2552B has changed from a logic 0 to a logic 1. A modem Status Interrupt will be generated. 1 MSR[1] ∆DSR [1] logic 0 = no DSR change (normal default condition) logic 1 = the DSR input to the SC16C2552B has changed state since the last time it was read. A modem Status Interrupt will be generated. 0 MSR[0] ∆CTS [1] logic 0 = no CTS change (normal default condition) logic 1 = the CTS input to the SC16C2552B has changed state since the last time it was read. A modem Status Interrupt will be generated. [1] Whenever any MSR bit 3:0 is set to logic 1, a Modem Status Interrupt will be generated. Symbol MSR[7] 6 MSR[6] 5 MSR[5] 4 MSR[4] 3 MSR[3] SC16C2552B_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 12 February 2009 20 of 38 NXP Semiconductors SC16C2552B 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs 7.9 Scratchpad Register (SPR) The SC16C2552B provides a temporary data register to store 8 bits of user information. 7.10 Alternate Function Register (AFR) This is a read/write register used to select specific modes of MF operation and to allow both UART register’s sets to be written concurrently. Table 19. Bit 7:3 2:1 Alternate Function Register bit description Description Not used. All are initialized to logic 0. Selects a signal function for output on the MFA, MFB pins. These signal functions are described as: OP2 (interrupt enable), BAUDOUT, or RXRDY. Only one signal function can be selected at a time. See Table 20. When this bit is set, CPU can write concurrently to the same register in both UARTs. This function is intended to reduce the dual UART initialization time. It can be used by CPU when both channels are initialized to the same state. The external CPU can set or clear this bit by accessing either register set. When this bit is set, the Channel Select pin, CHSEL, still selects the channel to be accessed during read operation. Setting or clearing this bit has no effect on read operations. The user should ensure that LCR[7] of both channels are in the same state before executing a concurrent write to the registers at address 0, 1, or 2. logic 0 = no concurrent write (normal default condition) logic 1 = register set A and B are written concurrently with a single external CPU I/O write operation. Table 20. AFR[2] 0 0 1 1 MFA, MFB function selection AFR[1] 0 1 0 1 MF function OP2 BAUDOUT RXRDY reserved Symbol AFR[7:3] AFR[2:1] 0 AFR[0] SC16C2552B_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 12 February 2009 21 of 38 NXP Semiconductors SC16C2552B 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs 7.11 SC16C2552B external reset condition Table 21. Register IER ISR LCR MCR LSR MSR FCR AFR Table 22. Output TXA, TXB OP2A, OP2B RTSA, RTSB DTRA, DTRB INTA, INTB TXRDYA, TXRDYB Reset state for registers Reset state IER[7:0] = 0 ISR[7:1] = 0; ISR[0] = 1 LCR[7:0] = 0 MCR[7:0] = 0 LSR[7] = 0; LSR[6:5] = 1; LSR[4:0] = 0 MSR[7:4] = input signals; MSR[3:0] = 0 FCR[7:0] = 0 AFR[7:0] = 0 Reset state for outputs Reset state HIGH HIGH HIGH HIGH LOW LOW 8. Limiting values Table 23. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCC Vn Tamb Tstg Ptot/pack Parameter supply voltage voltage on any other pin operating temperature storage temperature total power dissipation per package at D7 to D0 pins at input only pins Conditions Min GND − 0.3 GND − 0.3 −40 −65 Max 7 VCC + 0.3 5.3 +85 +150 500 Unit V V V °C °C mW SC16C2552B_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 12 February 2009 22 of 38 NXP Semiconductors SC16C2552B 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs 9. Static characteristics Table 24. Static characteristics Tamb = −40 °C to +85 °C; tolerance of VCC ± 10 %; unless otherwise specified. Symbol VIL(clk) VIH(clk) VIL VIH VOL Parameter clock LOW-level input voltage clock HIGH-level input voltage LOW-level input voltage HIGH-level input voltage LOW-level output voltage except X1 clock except X1 clock on all outputs[1] IOL = 5 mA (data bus) IOL = 4 mA (other outputs) IOL = 2 mA (data bus) IOL = 1.6 mA (other outputs) VOH HIGH-level output voltage IOH = −5 mA (data bus) IOH = −1 mA (other outputs) IOH = −800 µA (data bus) IOH = −400 µA (other outputs) ILIL IL(clk) ICC Ci [1] Conditions VCC = 2.5 V Min −0.3 1.8 −0.3 1.6 1.85 1.85 Max +0.45 VCC +0.65 0.4 0.4 ±10 ±30 3.5 5 VCC = 3.3 V Min −0.3 2.4 −0.3 2.0 2.0 Max +0.6 VCC +0.8 0.4 ±10 ±30 4.5 5 VCC = 5.0 V Min −0.5 3.0 −0.5 2.2 2.4 Max +0.6 VCC +0.8 0.4 ±10 ±30 4.5 5 Unit V V V V V V V V V V V V µA µA mA pF LOW-level input leakage current clock leakage current supply current input capacitance Except XTAL2, VOL = 1 V typical. f = 5 MHz - SC16C2552B_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 12 February 2009 23 of 38 NXP Semiconductors SC16C2552B 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs 10. Dynamic characteristics Table 25. Dynamic characteristics Tamb = −40 °C to +85 °C; tolerance of VCC ± 10 %; unless otherwise specified. Symbol tWH tWL fXTAL1 t6s t6h t7d t7w t7h t9d t12d t12h t13d t13w t13h t15d t16s t16h t17d t18d t19d t20d t21d t22d t23d t24d t25d t26d t27d Parameter pulse width HIGH pulse width LOW frequency on pin XTAL1 address set-up time address hold time IOR delay from chip select IOR strobe width chip select hold time from IOR read cycle delay delay from IOR to data data disable time IOW delay from chip select IOW strobe width chip select hold time from IOW write cycle delay data set-up time data hold time delay from IOW to output delay to set interrupt from Modem input 25 pF load 25 pF load 25 pF load 25 pF load 25 pF load 25 pF load [1][2] Conditions VCC = 2.5 V Min 10 10 0 0 10 77 0 20 10 20 0 25 20 15 [3] VCC = 3.3 V Min 6 6 0 0 10 26 0 20 10 20 0 25 20 5 Max 80 26 15 33 24 24 TRCLK 29 45 VCC = 5.0 V Min 6 6 0 0 10 23 0 20 10 15 0 20 15 5 Max 80 23 15 29 23 23 TRCLK 28 40 Unit ns ns MHz ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns s ns ns Max 48 77 15 100 100 100 TRCLK 100 100 delay to reset interrupt from 25 pF load IOR delay from stop to set interrupt delay from IOR to reset interrupt delay from start to set interrupt delay from IOW to transmit start delay from IOW to reset interrupt delay from stop to set RXRDY delay from IOR to reset RXRDY delay from IOW to set TXRDY [3] [3] - 25 pF load 8TRCLK 24TRCLK 8TRCLK 24TRCLK 8TRCLK 24TRCLK s 100 TRCLK 100 100 45 TRCLK 45 45 40 TRCLK 40 40 ns s ns ns SC16C2552B_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 12 February 2009 24 of 38 NXP Semiconductors SC16C2552B 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs Table 25. Dynamic characteristics …continued Tamb = −40 °C to +85 °C; tolerance of VCC ± 10 %; unless otherwise specified. Symbol t28d tRESET N [1] [2] [3] [4] Parameter delay from start to reset TXRDY RESET pulse width baud rate divisor Conditions [3] VCC = 2.5 V Min 200 1 Max 8TRCLK (216 − 1) VCC = 3.3 V Min 40 1 Max 8TRCLK (216 − 1) VCC = 5.0 V Min 40 1 Max 8TRCLK (216 − 1) Unit s ns [4] Applies to external clock, crystal oscillator max 24 MHz. Maximum frequency = -------------RCLK is an internal signal derived from divisor latch LSB (DLL) and divisor latch MSB (DLM) divisor latches. Reset pulse must happen when these signals are inactive: CS, IOW, IOR. 1 t w ( clk ) 10.1 Timing diagrams t6h valid address A0 to A2 CHSEL t6s t13h CS t13d active t13w t15d IOW active t16s t16h D0 to D7 data 002aaa128 Fig 5. General write timing SC16C2552B_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 12 February 2009 25 of 38 NXP Semiconductors SC16C2552B 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs t6h valid address A0 to A2 CHSEL t6s t7h CS t7d active t7w t9d IOR active t12d t12h D0 to D7 data 002aaa127 Fig 6. General read timing IOW active t17d RTSA, RTSB DTRA, DTRB change of state change of state CDA, CDB CTSA, CTSB DSRA, DSRB t18d change of state t18d change of state INTA, INTB active t19d active active IOR active active t18d active RIA, RIB change of state 002aaa352 Fig 7. Modem input/output timing SC16C2552B_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 12 February 2009 26 of 38 NXP Semiconductors SC16C2552B 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs tWL external clock tWH tw(clk) 002aac357 1 f XTAL1 = -------------t w ( clk ) Fig 8. External clock timing start bit data bits (0 to 7) D0 D1 D2 D3 D4 D5 D6 D7 parity bit stop bit next data start bit RXA, RXB 5 data bits 6 data bits 7 data bits INTA, INTB t20d active t21d active IOR 16 baud rate clock 002aae287 Fig 9. Receive timing SC16C2552B_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 12 February 2009 27 of 38 NXP Semiconductors SC16C2552B 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs start bit data bits (0 to 7) D0 D1 D2 D3 D4 D5 D6 D7 parity bit stop bit next data start bit RXA, RXB t25d RXRDYA, RXRDYB active data ready t26d IOR active 002aae288 Fig 10. Receive ready timing in non-FIFO mode start bit data bits (0 to 7) D0 D1 D2 D3 D4 D5 D6 D7 parity bit stop bit RXA, RXB first byte that reaches the trigger level t25d RXRDYA, RXRDYB active data ready t26d IOR active 002aae289 Fig 11. Receive ready timing in FIFO mode SC16C2552B_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 12 February 2009 28 of 38 NXP Semiconductors SC16C2552B 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs start bit data bits (0 to 7) D0 D1 D2 D3 D4 D5 D6 D7 parity bit stop bit next data start bit TXA, TXB 5 data bits 6 data bits 7 data bits INTA, INTB t22d t23d IOW active active transmitter ready t24d active 16 baud rate clock 002aae290 Fig 12. Transmit timing start bit data bits (0 to 7) D0 D1 D2 D3 D4 D5 D6 D7 parity bit stop bit next data start bit TXA, TXB IOW active D0 to D7 byte #1 t28d t27d TXRDYA, TXRDYB active transmitter ready transmitter not ready 002aae291 Fig 13. Transmit ready timing in non-FIFO mode SC16C2552B_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 12 February 2009 29 of 38 NXP Semiconductors SC16C2552B 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs start bit data bits (0 to 7) D0 D1 D2 D3 D4 D5 D6 D7 parity bit stop bit TXA, TXB 5 data bits 6 data bits 7 data bits IOW active t28d D0 to D7 byte #16 t27d TXRDYA, TXRDYB FIFO full 002aae292 Fig 14. Transmit ready timing in FIFO mode (DMA mode ‘1’) SC16C2552B_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 12 February 2009 30 of 38 NXP Semiconductors SC16C2552B 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs 11. Package outline PLCC44: plastic leaded chip carrier; 44 leads SOT187-2 eD y X A ZE eE 39 29 28 bp 40 b1 wM 44 HE A e A4 A1 (A 3) β k 7 e D HD 17 ZD B vMB vM A 6 18 Lp detail X 1 pin 1 index E 0 5 scale 10 mm DIMENSIONS (mm dimensions are derived from the original inch dimensions) A4 A1 e UNIT A A3 D(1) E(1) eD eE HD bp b1 max. min. mm inches 4.57 4.19 0.51 0.25 0.01 3.05 0.12 0.53 0.33 0.81 0.66 HE k Lp 1.44 1.02 v 0.18 w 0.18 y 0.1 ZD(1) ZE(1) max. max. 2.16 2.16 β 16.66 16.66 16.00 16.00 17.65 17.65 1.22 1.27 16.51 16.51 14.99 14.99 17.40 17.40 1.07 0.63 0.59 0.63 0.59 45 o 0.180 0.02 0.165 0.021 0.032 0.656 0.656 0.05 0.013 0.026 0.650 0.650 0.695 0.695 0.048 0.057 0.007 0.007 0.004 0.085 0.085 0.685 0.685 0.042 0.040 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT187-2 REFERENCES IEC 112E10 JEDEC MS-018 JEITA EDR-7319 EUROPEAN PROJECTION ISSUE DATE 99-12-27 01-11-14 Fig 15. Package outline SOT187-2 (PLCC44) SC16C2552B_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 12 February 2009 31 of 38 NXP Semiconductors SC16C2552B 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs 12. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 12.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 12.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: • Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: • • • • • • Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering 12.3 Wave soldering Key characteristics in wave soldering are: • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities SC16C2552B_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 12 February 2009 32 of 38 NXP Semiconductors SC16C2552B 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs 12.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 16) than a SnPb process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 26 and 27 Table 26. SnPb eutectic process (from J-STD-020C) Package reflow temperature (°C) Volume (mm3) < 350 < 2.5 ≥ 2.5 Table 27. 235 220 Lead-free process (from J-STD-020C) Package reflow temperature (°C) Volume (mm3) < 350 < 1.6 1.6 to 2.5 > 2.5 260 260 250 350 to 2000 260 250 245 > 2000 260 245 245 ≥ 350 220 220 Package thickness (mm) Package thickness (mm) Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 16. SC16C2552B_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 12 February 2009 33 of 38 NXP Semiconductors SC16C2552B 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs temperature maximum peak temperature = MSL limit, damage level minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 16. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 13. Abbreviations Table 28. Acronym CPU DLL DLM DMA FIFO ISDN LSB MSB UART Abbreviations Description Central Processing Unit Divisor Latch LSB Divisor Latch MSB Direct Memory Access First In, First Out Integrated Service Digital Network Least Significant Bit Most Significant Bit Universal Asynchronous Receiver and Transmitter SC16C2552B_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 12 February 2009 34 of 38 NXP Semiconductors SC16C2552B 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs 14. Revision history Table 29. Revision history Release date 20090212 Data sheet status Product data sheet Change notice Supersedes SC16C2552B-02 Document ID SC16C2552B_3 Modifications: • • • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Section 2 “Features”: – added (new) 5th bullet item – added Footnote 1 • • Figure 1: changed signal names from “MFA, MFB” to “MFA, MFB” Section 7.3.1 “DMA mode”: – 1st paragraph, last sentence: changed from “MF register” to “AFR[2:1]” – 2nd paragraph, last sentence: changed from “MF register” to “AFR[2:1]” • Table 18 “Modem Status Register bits description”: – description of bit 7: changed from “(OPA/OPB)” to “(OP2A/OP2B)” – description of bit 6: changed from “(OP1)” to “(OP1A/OP2A)” • Table 23 “Limiting values”: – symbol Vn split to show 2 separate conditions: “at D7 to D0 pins” and “at input only pins” – changed symbol “Ptot(pack)” to “Ptot/pack” • Table 24 “Static characteristics”: – descriptive line below table title changed from “VCC = 2.5 V, 3.3 V or 5.0 V ± 10 %” to “tolerance of VCC ± 10 %” – changed symbol/parameter from “VIL(CK), LOW-level clock input voltage” to “VIL(clk), clock LOW-level input voltage” – changed symbol/parameter from “VIH(CK), HIGH-level clock input voltage” to “VIH(clk), clock HIGH-level input voltage” – changed symbol/parameter from “ICL, clock leakage” to “IL(clk), clock leakage current” – Table note [1]: changed from “Except x2” to “Except XTAL2” • Table 25 “Dynamic characteristics”: – descriptive line below table title changed from “VCC = 2.5 V, 3.3 V or 5.0 V ± 10 %” to “tolerance of VCC ± 10 %” – changed symbol “t1w, t2w” to 2 separate symbols “tWH” and “tWL” – changed symbol/parameter “t3w, clock frequency” to “fXTAL1, frequency on pin XTAL1” – added Table note [2] – symbols t20d, t23d, t25d and t28d: Unit changed from “Rclk” to “s” (second) – symbols t20d, t23d, t25d and t28d: appended “TRCLK” to Min and Max values – added Table note [3] – symbol N: removed “Rclk” from Unit column (N is a number) – added Table note [4] and its reference at tRESET SC16C2552B_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 12 February 2009 35 of 38 NXP Semiconductors SC16C2552B 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs Table 29. Revision history …continued Release date Data sheet status Change notice Supersedes Document ID Modifications: (continued) • Section 10.1 “Timing diagrams”: – Figure 7, Figure 9, Figure 10, Figure 11, Figure 12, Figure 13, Figure 14: appended (channel) “A” and/or “B” to signal names – Figure 8 “External clock timing”: changed symbols “t1w, t2w, t3w” to “tWH, tWL, tw(clk)”, respectively – Figure 8 “External clock timing”: added equation – Figure 10, Figure 11, Figure 13, Figure 14: at the top of these drawings, changed phrase from “DATA BITS (5-8)” to “data bits (0 to 7)” • • SC16C2552B-02 (9397 750 14442) SC16C2552B-01 (9397 750 11966) updated soldering information added Section 13 “Abbreviations” Product data Product data SC16C2552B-01 - 20041213 20040330 SC16C2552B_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 12 February 2009 36 of 38 NXP Semiconductors SC16C2552B 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs 15. Legal information 15.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 15.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 15.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or 15.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 16. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com SC16C2552B_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 12 February 2009 37 of 38 NXP Semiconductors SC16C2552B 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs 17. Contents 1 2 3 4 5 5.1 5.2 6 6.1 6.2 6.3 6.4 6.5 6.6 6.7 7 7.1 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 6 UART A-B functions . . . . . . . . . . . . . . . . . . . . . 6 Internal registers. . . . . . . . . . . . . . . . . . . . . . . . 7 FIFO operation . . . . . . . . . . . . . . . . . . . . . . . . . 7 Time-out interrupts . . . . . . . . . . . . . . . . . . . . . . 7 Programmable baud rate generator . . . . . . . . . 8 DMA operation . . . . . . . . . . . . . . . . . . . . . . . . . 9 Loopback mode . . . . . . . . . . . . . . . . . . . . . . . . 9 Register descriptions . . . . . . . . . . . . . . . . . . . 11 Transmit Holding Register (THR) and Receive Holding Register (RHR) . . . . . . . . . . . . . . . . . 12 7.2 Interrupt Enable Register (IER) . . . . . . . . . . . 12 7.2.1 IER versus Transmit/Receive FIFO interrupt mode operation. . . . . . . . . . . . . . . . . 13 7.2.2 IER versus Receive/Transmit FIFO polled mode operation . . . . . . . . . . . . . . . . . . 13 7.3 FIFO Control Register (FCR) . . . . . . . . . . . . . 14 7.3.1 DMA mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 7.3.1.1 Mode 0 (FCR bit 3 = 0) . . . . . . . . . . . . . . . . . . 14 7.3.1.2 Mode 1 (FCR bit 3 = 1) . . . . . . . . . . . . . . . . . . 14 7.3.2 FIFO mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 7.4 Interrupt Status Register (ISR) . . . . . . . . . . . . 16 7.5 Line Control Register (LCR) . . . . . . . . . . . . . . 17 7.6 Modem Control Register (MCR) . . . . . . . . . . . 18 7.7 Line Status Register (LSR) . . . . . . . . . . . . . . . 19 7.8 Modem Status Register (MSR). . . . . . . . . . . . 20 7.9 Scratchpad Register (SPR) . . . . . . . . . . . . . . 21 7.10 Alternate Function Register (AFR) . . . . . . . . . 21 7.11 SC16C2552B external reset condition . . . . . . 22 8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 22 9 Static characteristics. . . . . . . . . . . . . . . . . . . . 23 10 Dynamic characteristics . . . . . . . . . . . . . . . . . 24 10.1 Timing diagrams . . . . . . . . . . . . . . . . . . . . . . . 25 11 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 31 12 Soldering of SMD packages . . . . . . . . . . . . . . 32 12.1 Introduction to soldering . . . . . . . . . . . . . . . . . 32 12.2 Wave and reflow soldering . . . . . . . . . . . . . . . 32 12.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 32 12.4 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 33 13 14 15 15.1 15.2 15.3 15.4 16 17 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . Legal information . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information . . . . . . . . . . . . . . . . . . . . Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 35 37 37 37 37 37 37 38 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 12 February 2009 Document identifier: SC16C2552B_3
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