SC18IS602B
I2C-bus to SPI bridge
Rev. 7 — 21 October 2019
Product data sheet
1. General description
The SC18IS602B is designed to serve as an interface between a standard I2C-bus of a
microcontroller and an SPI bus. This allows the microcontroller to communicate directly
with SPI devices through its I2C-bus. The SC18IS602B operates as an I2C-bus
slave-transmitter or slave-receiver and an SPI master. The SC18IS602B controls all the
SPI bus-specific sequences, protocol, and timing. The SC18IS602B has its own internal
oscillator, and it supports four SPI chip select outputs that may be configured as GPIO
when not used.
2. Features and benefits
I2C-bus slave interface operating up to 400 kHz
SPI master operating up to 1.8 Mbit/s
200-byte data buffer
Up to four slave select outputs
Up to four programmable I/O pins
Operating supply voltage: 2.4 V to 3.6 V
Low power mode
Internal oscillator option
Active LOW interrupt output
ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per
JESD22-A115, and 1000 V CDM per JESD22-C101
Latch-up testing is done to JEDEC Standard JESD78 that exceeds 100 mA
Very small 16-pin TSSOP
3. Applications
Converting I2C-bus to SPI
Adding additional SPI bus controllers to an existing system
SC18IS602B
NXP Semiconductors
I2C-bus to SPI bridge
4. Ordering information
Table 1.
Ordering information
Type number
SC18IS602BIPW/S8
Topside
marking
Package
Name
Description
Version
IS602B
TSSOP16
plastic thin shrink small outline package; 16 leads;
body width 4.4 mm
SOT403-1
4.1 Ordering options
Table 2.
Ordering options
Type number
Orderable part number
Package
SC18IS602BIPW/S8
SC18IS602BIPW/S8HP[1]
TSSOP16 REEL 13" Q4/T2
*STANDARD
MARK SMD
[1]
Packing method
Minimum
order
quantity
Temperature
2500
Tamb = 40 C to
+85 C
NXP plans to supply the /S8 device with an expected discontinuation in the 2024-2025 timeframe, but in the meantime, Failure Analysis
for /S8 devices will consist of Automated Test Equipment (ATE) and electrical overstress verification along with package and wire bond
validation only. Detailed device failure analysis will not be available; refer to CIN 201708035I.
5. Block diagram
MOSI
MISO
SPICLK
SS0
SS1 (1)
SS2
SS3
SCL
I2C-BUS
BUFFER
SDA
SPI
CONTROL
REGISTER
SC18IS602B
RESET
INT
INTERRUPT
CONTROL
LOGIC
INTERNAL
OSCILLATOR
002aac443
(1) Unused slave select outputs may be used for GPIO.
Fig 1.
SC18IS602B
Product data sheet
Block diagram of SC18IS602B
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I2C-bus to SPI bridge
6. Pinning information
6.1 Pinning
SS0/GPIO0
1
16 A2
SS1/GPIO1
2
15 A1
RESET
3
14 A0
VSS
4
MISO
5
MOSI
6
11 SPICLK
SDA
7
10 SS2/GPIO2
SCL
8
SC18IS602BIPW/S8
13 SS3/GPIO3
12 VDD
9
INT
002aac441
Fig 2.
Pin configuration for TSSOP16
6.2 Pin description
Table 3.
SC18IS602B
Product data sheet
Pin description
Symbol
Pin
Type
Description
SS0/GPIO0
1
I/O
SPI slave select output 0 (active LOW) or GPIO 0
SS1/GPIO1
2
I/O
SPI slave select output 1 (active LOW) or GPIO 1
RESET
3
I
reset input (active LOW)
VSS
4
-
ground supply
MISO
5
I
Master In, Slave Out
MOSI
6
O
Master Out, Slave In
SDA
7
I/O
I2C-bus data
SCL
8
I
I2C-bus clock
INT
9
O
Interrupt output (active LOW). This pin is an open-drain pin.
SS2/GPIO2
10
I/O
SPI slave select output 2 (active LOW) or GPIO 2
SPICLK
11
O
SPI clock
VDD
12
-
supply voltage
SS3/GPIO3
13
I/O
SPI slave select output 3 (active LOW) or GPIO 3
A0
14
I
address input 0
A1
15
I
address input 1
A2
16
I
address input 2
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I2C-bus to SPI bridge
7. Functional description
The SC18IS602B acts as a bridge between an I2C-bus and an SPI interface. It allows an
I2C-bus master device to communicate with any SPI-enabled device.
7.1 I2C-bus interface
The I2C-bus uses two wires (SDA and SCL) to transfer information between devices
connected to the bus, and it has the following features:
• Bidirectional data transfer between masters and slaves
• Multi-master bus (no central master)
• Arbitration between simultaneously transmitting masters without corruption of serial
data on the bus
• Serial clock synchronization allows devices with different bit rates to communicate via
one serial bus
• Serial clock synchronization can be used as a handshake mechanism to suspend and
resume serial transfer
• The I2C-bus may be used for test and diagnostic purposes
A typical I2C-bus configuration is shown in Figure 3. (Refer to NXP Semiconductors
UM10204, “I2C-bus specification and user manual”, at
www.nxp.com/documents/user_manual/UM10204.pdf.)
VDD
RPU
RPU
SDA
SCL
I2C-bus
SC18IS602B
I2C-BUS
DEVICE
I2C-BUS
DEVICE
002aac445
Fig 3.
I2C-bus configuration
The SC18IS602B device provides a byte-oriented I2C-bus interface that supports data
transfers up to 400 kHz. When the I2C-bus master is reading data from SC18IS602B, the
device will be a slave-transmitter. The SC18IS602B will be a slave-receiver when the
I2C-bus master is sending data. At no time does the SC18IS602B act as an I2C-bus
master, however, it does have the ability to hold the SCL line LOW between bytes to
complete its internal processes.
SC18IS602B
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I2C-bus to SPI bridge
7.1.1 Addressing
R/W
slave address
0
1
0
1
fixed
A2
A1
A0
X
programmable
002aac446
Fig 4.
Slave address
The first seven bits of the first byte sent after a START condition defines the slave address
of the device being accessed on the bus. The eighth bit determines the direction of the
message. A ‘0’ in the least significant position of the first byte means that the master will
write information to a selected slave. A ‘1’ in this position means that the master will read
information from the slave. When an address is sent, each device in a system compares
the first seven bits after the START condition with its address. If they match, the device
considers itself addressed by the master as a slave-receiver or slave-transmitter,
depending on the R/W bit.
A slave address of the SC18IS602B is comprised of a fixed and a programmable part.
The programmable part of the slave address enables the maximum possible number of
such devices to be connected to the I2C-bus. Since the SC18IS602B has three
programmable address bits (defined by the A2, A1, and A0 pins), it is possible to have
eight of these devices on the same bus.
The state of the A2, A1, and A0 pins are latched at reset. Changes made after reset will
not alter the address.
When SC18IS602B is busy after the address byte is transmitted, it will not acknowledge
its address.
7.1.2 Write to data buffer
All communications to or from the SC18IS602B occur through the data buffer. The data
buffer is 200 bytes deep. A message begins with the SC18IS602B address, followed by
the Function ID. Depending upon the Function ID, zero to 200 data bytes can follow.
The SC18IS602B will place the data received into a buffer and continue loading the buffer
until a STOP condition is received. After the STOP condition is detected, further
communications will not be acknowledged until the function designated by the Function ID
has been completed.
S
SLAVE ADDRESS
W
A
FUNCTION ID
A
0 TO 200 BYTES
A
P
002aac447
Fig 5.
Write to data buffer
7.1.3 SPI read and write - Function ID 01h to 0Fh
Data in the buffer will be sent to the SPI port if the Function ID is 01h to 0Fh. The Function
ID contains the Slave Select (SS) to be used for the transmission on the SPI port. There
are four Slave Selects that can be used, with each SS being selected by one of the bits in
SC18IS602B
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I2C-bus to SPI bridge
the Function ID. There is no restriction on the number or combination of Slave Selects that
can be enabled for an SPI message. If more than one SSn pin is enabled at one time, the
user should be aware of possible contention on the data outputs of the SPI slave devices.
Table 4.
Function ID 01h to 0Fh
7
6
5
4
3
2
1
0
0
0
0
0
SS3
SS2
SS1
SS0
The data on the SPI port will contain the same information as the I2C-bus data, but without
the slave address and Function ID. For example, if the message shown in Figure 6 is
transmitted on the I2C-bus, the SPI bus will send the message shown in Figure 7.
write to buffer
S
SLAVE ADDRESS
W
A
FUNCTION
ID
A
DATA 1
A
A
A
DATA n
P
002aac448
Fig 6.
I2C-bus message
SPI data
DATA n
DATA 1
002aac451
Fig 7.
SPI message
The SC18IS602B counts the number of data bytes sent to the I2C-bus port and will
automatically send this same number of bytes to the SPI bus. As the data is transmitted
from the MOSI pin, it is also read from the MISO pin and saved in the data buffer.
Therefore, the old data in the buffer is overwritten. The data in the buffer can then be read
back.
If the data from the SPI bus needs to be returned to the I2C-bus master, the process must
be completed by reading the data buffer. Section 8 gives an example of an SPI read.
7.1.4 Read from buffer
A read from the data buffer requires no Function ID. The slave address with the R/W bit
set to a ‘1’ will cause the SC18IS602B to send the buffer contents to the I2C-bus master.
The buffer contents are not modified during the read process.
S
SLAVE ADDRESS
R
A
DATA 1
A
A
DATA n
NA
P
002aac449
Fig 8.
Read from buffer
A typical write and read from an SPI EEPROM is shown in Section 8.
SC18IS602B
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I2C-bus to SPI bridge
7.1.5 Configure SPI Interface - Function ID F0h
The SPI hardware operating mode, data direction, and frequency can be changed by
sending a ‘Configure SPI Interface’ command to the I2C-bus.
S
SLAVE ADDRESS
W
A
A
F0h
A
DATA
P
002aac450
Fig 9.
Configure SPI Interface
After the SC18IS602B address is transmitted on the bus, the Configure SPI Interface
Function ID (F0h) is sent followed by a byte which will define the SPI communications.
The Clock Phase bit (CPHA) allows the user to set the edges for sampling and changing
data. The Clock Polarity bit (CPOL) allows the user to set the clock polarity. Figure 19 and
Figure 20 show the different settings of Clock Phase bit CPHA.
Table 5.
Configure SPI Interface (F0h) bit allocation
Bit
7
6
5
4
3
2
1
0
Symbol
X
X
ORDER
X
MODE1
MODE0
F1
F0
Reset
X
X
0
X
0
0
0
0
Table 6.
Configure SPI Interface (F0h) bit description
Bit
Symbol
Description
7:6
-
reserved
5
ORDER
When logic 0, the MSB of the data word is transmitted first.
If logic 1, the LSB of the data word is transmitted first.
4
-
reserved
3:2
MODE1:MODE0 Mode selection
00 - SPICLK LOW when idle; data clocked in on leading edge
(CPOL = 0, CPHA = 0)
01 - SPICLK LOW when idle; data clocked in on trailing edge
(CPOL = 0, CPHA = 1)
10 - SPICLK HIGH when idle; data clocked in on trailing edge
(CPOL = 1, CPHA = 0)
11 - SPICLK HIGH when idle; data clocked in on leading edge
(CPOL = 1, CPHA = 1)
1:0
F1:F0
SPI clock rate
00 - 1843 kHz
01 - 461 kHz
10 - 115 kHz
11 - 58 kHz
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I2C-bus to SPI bridge
7.1.6 Clear Interrupt - Function ID F1h
An interrupt is generated by the SC18IS602B after any SPI transmission has been
completed. This interrupt can be cleared (INT pin HIGH) by sending a ‘Clear Interrupt’
command. It is not necessary to clear the interrupt; when polling the device, this function
may be ignored.
S
SLAVE ADDRESS
W
A
F1h
A
P
002aac452
Fig 10. Clear Interrupt
7.1.7 Idle mode - Function ID F2h
A low-power mode may be entered by sending the ‘Idle Mode’ command.
S
SLAVE ADDRESS
W
A
F2h
A
P
002aac453
Fig 11. Idle mode
The Idle mode will be exited when its I2C-bus address is detected.
7.1.8 GPIO Write - Function ID F4h
The state of the pins defined as GPIO may be changed using the Port Write function.
S
SLAVE ADDRESS
W
A
F4h
A
A
DATA
P
002aac454
Fig 12. GPIO Write
The data byte following the F4h command will determine the state of SS3, SS2, SS1, and
SS0, if they are configured as GPIO. The Port Enable function will define if these pins are
used as SPI Slave Selects or if they are GPIO.
Table 7.
SC18IS602B
Product data sheet
GPIO Write (F0h) bit allocation
Bit
7
6
5
4
3
2
1
0
Symbol
X
X
X
X
SS3
SS2
SS1
SS0
Reset
X
X
X
X
0
0
0
0
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I2C-bus to SPI bridge
7.1.9 GPIO Read - Function ID F5h
The state of the pins defined as GPIO may be read into the SC18IS602B data buffer using
the GPIO Read function.
S
SLAVE ADDRESS
W
A
A
F5h
DATA
A
P
002aac455
Fig 13. GPIO Read
Note that this function does not return the value of the GPIO. To receive the GPIO
contents, a one-byte Read Buffer command would be required. The value of the Read
Buffer command will return the following byte.
Table 8.
GPIO Read (F5h) bit allocation
7
6
5
4
3
2
1
0
X
X
X
X
SS3
SS2
SS1
SS0
Data for pins not defined as GPIO are undefined.
A GPIO Read is always performed to update the GPIO data in the buffer. The buffer is
undefined after the GPIO data is read back from the buffer. Therefore, reading data from
the GPIO always requires a two-message sequence (GPIO Read, followed by Read
Buffer).
7.1.10 GPIO Enable - Function ID F6h
At reset, the Slave Select pins (SS0, SS1, SS2 and SS3) are configured to be used as
slave select outputs. If these pins are not required for the SPI functions, they can be used
as GPIO after they are enabled as GPIO. Any combination of pins may be configured to
function as GPIO or Slave Selects.
After the GPIO Enable function is sent, the ports defined as GPIO will be configured as
quasi-bidirectional.
S
SLAVE ADDRESS
W
A
A
F6h
DATA
A
P
002aac456
Fig 14. GPIO Enable
The data byte following the F6h command byte will determine which pins can be used as
GPIO. A logic 1 will enable the pin as a GPIO, while a logic 0 will disable GPIO control.
Table 9.
SC18IS602B
Product data sheet
GPIO Enable (F6h) bit allocation
7
6
5
4
3
2
1
0
X
X
X
X
SS3
SS2
SS1
SS0
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I2C-bus to SPI bridge
7.1.11 GPIO Configuration - Function ID F7h
The pins defined as GPIO may be configured by software to one of four types on a
pin-by-pin basis. These are: quasi-bidirectional, push-pull, open-drain, and input-only.
Two bits select the output type for each port pin.
Table 10.
GPIO Configuration (F7h) bit allocation
7
6
5
4
3
2
1
0
SS3.1
SS3.0
SS2.1
SS2.0
SS1.1
SS1.0
SS0.1
SS0.0
Table 11.
GPIO Configuration (F7h) bit description
Bit
Symbol
7
SS3.1
SS3[1:0] = 00: quasi-bidirectional
6
SS3.0
SS3[1:0] = 01: push-pull
Description
SS3[1:0] = 10: input-only (high-impedance)
SS3[1:0] = 11: open-drain
5
4
SS2.1
SS2[1:0] = 00: quasi-bidirectional
SS2.0
SS2[1:0] = 01: push-pull
SS2[1:0] = 10: input-only (high-impedance)
SS2[1:0] = 11: open-drain
3
SS1.1
SS1[1:0] = 00: quasi-bidirectional
2
SS1.0
SS1[1:0] = 01: push-pull
SS1[1:0] = 10: input-only (high-impedance)
SS1[1:0] = 11: open-drain
1
SS0.1
SS0[1:0] = 00: quasi-bidirectional
0
SS0.0
SS0[1:0] = 01: push-pull
SS0[1:0] = 10: input-only (high-impedance)
SS0[1:0] = 11: open-drain
The SSn pins defined as GPIO, for example SS0.0 and SS0.1, may be configured by
software to one of four types. These are: quasi-bidirectional, push-pull, open-drain, and
input-only. Two configuration bits in GPIO Configuration register for each pin select the
type for each pin. A pin has Schmitt-triggered input that also has a glitch suppression
circuit.
7.1.11.1
Quasi-bidirectional output configuration
Quasi-bidirectional outputs can be used both as an input and output without the need to
reconfigure the pin. This is possible because when the pin outputs a logic HIGH, it is
weakly driven, allowing an external device to pull the pin LOW. When the pin is driven
LOW, it is driven strongly and able to sink a large current. There are three pull-up
transistors in the quasi-bidirectional output that serve different purposes.
One of these pull-ups, called the ‘very weak’ pull-up, is turned on whenever the port latch
for the pin contains a logic 1. This very weak pull-up sources a very small current that will
pull the pin HIGH if it is left floating.
A second pull-up, called the ‘weak’ pull-up, is turned on when the port latch for the pin
contains a logic 1 and the pin itself is also at a logic 1 level. This pull-up provides the
primary source current for a quasi-bidirectional pin that is outputting a 1. If this pin is
SC18IS602B
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I2C-bus to SPI bridge
pulled LOW by an external device, the weak pull-up turns off, and only the very weak
pull-up remains on. In order to pull the pin LOW under these conditions, the external
device has to sink enough current to overpower the weak pull-up and pull the pin below its
input threshold voltage.
The third pull-up is referred to as the ‘strong’ pull-up. This pull-up is used to speed up
LOW-to-HIGH transitions on a quasi-bidirectional pin when the port latch changes from a
logic 0 to a logic 1. When this occurs, the strong pull-up turns on for two CPU clocks
quickly pulling the pin HIGH.
The quasi-bidirectional pin configuration is shown in Figure 15.
Although the SC18IS602B is a 3 V device, most of the pins are 5 V tolerant. If 5 V is
applied to a pin configured in quasi-bidirectional mode, there will be a current flowing from
the pin to VDD causing extra power consumption. Therefore, applying 5 V to pins
configured in quasi-bidirectional mode is discouraged.
A quasi-bidirectional pin has a Schmitt-triggered input that also has a glitch suppression
circuit.
2 SYSTEM
CLOCK
CYCLES
VDD
P
strong
P
very
weak
P
weak
GPIO pin
pin latch data
VSS
input data
glitch rejection
002aac548
Fig 15. Quasi-bidirectional output configuration
7.1.11.2
Open-drain output configuration
The open-drain output configuration turns off all pull-ups and only drives the pull-down
transistor of the pin when the port latch contains a logic 0. To be used as a logic output, a
pin configured in this manner must have an external pull-up, typically a resistor tied to
VDD. The pull-down for this mode is the same as for the quasi-bidirectional mode.
The open-drain pin configuration is shown in Figure 16.
An open-drain pin has a Schmitt-triggered input that also has a glitch suppression circuit.
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I2C-bus to SPI bridge
GPIO pin
pin latch data
VSS
input data
glitch rejection
002aab883
Fig 16. Open-drain output configuration
7.1.11.3
Input-only configuration
The input-only pin configuration is shown in Figure 17. It is a Schmitt-triggered input that
also has a glitch suppression circuit.
input data
GPIO pin
glitch rejection
002aab884
Fig 17. Input-only configuration
7.1.11.4
Push-pull output configuration
The push-pull output configuration has the same pull-down structure as both the
open-drain and the quasi-bidirectional output modes but provides a continuous strong
pull-up when the port latch contains a logic 1. The push-pull mode may be used when
more source current is needed from a pin output.
The push-pull pin configuration is shown in Figure 18.
A push-pull pin has a Schmitt-triggered input that also has a glitch suppression circuit.
VDD
P
strong
GPIO pin
N
pin latch data
VSS
input data
glitch rejection
002aab885
Fig 18. Push-pull output configuration
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I2C-bus to SPI bridge
7.2 SPI interface
The SPI interface can support Mode 0 through Mode 3 of the SPI specification and can
operate up to 1.8 Mbit/s. The SPI interface uses at least four pins: SPICLK, MOSI, MISO,
and Slave Select (SSn).
SSn are the slave select pins. In a typical configuration, an SPI master selects one SPI
device as the current slave.
There are actually four SSn pins (SS0, SS1, SS2 and SS3) to allow the SC18IS602B to
communicate with multiple SPI devices.
The SC18IS602B generates the SPICLK (SPI clock) signal in order to send and receive
data. The SCLK, MOSI, and MISO are typically tied together between two or more SPI
devices. Data flows from the SC18IS602B (master) to slave on the MOSI pin (Pin 6) and
the data flows from slave to SC18IS602B (master) on the MISO pin (Pin 5).
8. I2C-bus to SPI communications example
The following example describes a typical sequence of events required to read the
contents of an SPI-based EEPROM. This example assumes that the SC18IS602B is
configured to respond to address 50h. A START condition is shown as ‘ST’, while a STOP
condition is ‘SP’. The data is presented in hexadecimal format.
1. The first message is used to configure the SPI port for mode and frequency.
ST,50,F0,02,SP
SPI frequency 115 kHz using Mode 0
2. An SPI EEPROM first requires that a Write Enable command be sent before data can
be written.
ST,50,04,06,SP
EEPROM write enable using SS2, assuming the Write Enable is
06h
3. Clear the interrupt. This is not required if using a polling method rather than interrupts.
ST,50,F1,SP
Clear interrupt
4. Write the 8 data bytes. The first byte (Function ID) tells the SC18IS602B which Slave
Select output to use. This example uses SS2 (shown as 04h). The first byte sent to
the EEPROM is normally 02h for the EEPROM write command. The next one or two
bytes represent the subaddress in the EEPROM. In this example, a two-byte
subaddress is used. Bytes 00 and 30 would cause the EEPROM to write to
subaddress 0030h. The next eight bytes are the eight data bytes that will be written to
subaddresses 0030h through 0037h.
ST,50,04,02,00,30,01,02,03,04,05,06,07,08,SP
Write 8 bytes using SS2
5. When an interrupt occurs, do a Clear Interrupt or wait until the SC18IS602B responds
to its I2C-bus address.
ST,50,F1,SP
SC18IS602B
Product data sheet
Clear interrupt
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6. Read the 8 bytes from the EEPROM. Note that we are writing a command, even
though we are going to perform a read from the SPI port. The Function ID is again
04h, indicating that we are going to use SS2. The EEPROM requires that you send a
03h for a read, followed by the subaddress you would like to read. We are going to
read back the same data previously written, so this means that the subaddress should
be 0030h. We would like to read back 8 bytes so we can send eight bytes of FFh to
tell the SC18IS602B to send eight more bytes on MOSI. While it is sending these
eight data bytes, it is also reading the MISO pin and saving the data in the buffer.
ST,50,04,03,00,30,FF,FF,FF,FF,FF,FF,FF,FF,SP
Read 8 bytes using SS2
7. The interrupt can be cleared, if needed.
ST,50,F1,SP
Clear interrupt
8. Read back the data buffer. Note that we will actually need to read back 11 data bytes
since the first three bytes sent on the SPI port were the read code (03h) and the two
subaddress bytes.
ST,50,00,00,00,01,02,03,04,05,06,07,08,SP
Read the data buffer
I2C-bus
You can see that on the
the first four bytes do not contain the data from the
SPI bus. The first byte is the SC18IS602B address, followed by three dummy data
bytes. These dummy data bytes correspond to the three bytes sent to the EEPROM
before it actually places data on the bus (command 03h, subaddress 0030h).
9. Limiting values
Table 12. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).[1][2]
Symbol
Parameter
Conditions
Min
Max
Unit
operating
55
+125
C
65
+150
C
0.5
+5.5
V
-
8
mA
Tamb(bias)
bias ambient temperature
Tstg
storage temperature
Vn
voltage on any other pin
IOH(I/O)
HIGH-level output current per input/output pin
referenced to VSS
IOL(I/O)
LOW-level output current per input/output pin
-
20
mA
II/O(tot)(max)
maximum total I/O current
-
120
mA
Ptot/pack
total power dissipation per package
-
1.5
W
[3]
[1]
This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static
charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum.
[2]
Parameters are valid over the operating temperature range unless otherwise specified. All voltages are with respect to VSS unless
otherwise noted.
[3]
Based on package heat transfer, not device power consumption.
SC18IS602B
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10. Static characteristics
Table 13. Static characteristics
VDD = 2.4 V to 3.6 V; Tamb = 40 C to +85 C (industrial); unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit
IDD(oper)
operating supply current
VDD = 3.6 V; f = 7.3728 MHz
-
5.6
6.7
mA
IDD(idle)
Idle mode supply current
VDD = 3.6 V; f = 7.3728 MHz
-
3.3
3.9
mA
Vth(HL)
HIGH-LOW threshold voltage
Schmitt trigger input
0.22VDD
0.4VDD
-
V
Vth(LH)
LOW-HIGH threshold voltage
Schmitt trigger input
-
0.6VDD
0.7VDD
V
Vhys
hysteresis voltage
-
0.2VDD
-
V
VOL
LOW-level output voltage
IOL = 20 mA
-
0.6
1.0
V
IOL = 10 mA
-
0.3
0.5
V
IOL = 3.2 mA
-
0.2
0.3
V
IOH = 8 mA;
push-pull mode
VDD 1
-
-
V
IOH = 3.2 mA;
push-pull mode
VDD 0.7
VDD 0.4
-
V
IOH = 20 A;
quasi-bidirectional mode
VDD 0.3
VDD 0.2
-
V
[2]
-
-
15
pF
logical 0; VI = 0.4 V
[3]
-
-
80
A
all ports; VI = VIL or VIH
[4]
-
-
10
A
30
-
450
A
10
-
30
k
VOH
all pins
HIGH-level output voltage
Cig
input capacitance at gate
IIL
LOW-level input current
all pins
input leakage current
ILI
ITHL
HIGH-LOW transition current
RRESET_N(int)
internal pull-up resistance on
pin RESET
all ports; logical 1-to-0;
VI = 2.0 V at VDD = 3.6 V
[1]
Typical ratings are not guaranteed. The values listed are at room temperature, 3 V.
[2]
Pin capacitance is characterized but not tested.
[3]
Measured with pins in quasi-bidirectional mode.
[5][6]
[4]
Measured with pins in high-impedance mode.
[5]
Pins in quasi-bidirectional mode with weak pull-up (applies to all pins with pull-ups).
[6]
Pins source a transition current when used in quasi-bidirectional mode and externally driven from logic 1 to logic 0. This current is
highest when VI is approximately 2 V.
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11. Dynamic characteristics
Table 14. Dynamic characteristics
VDD = 2.4 V to 3.6 V; Tamb = 40 C to +85 C (industrial); unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
fosc(RC)
internal RC oscillator
frequency
nominal f = 7.3728 MHz;
trimmed to 1 % at Tamb = 25 C
7.189
-
7.557
MHz
-
-
50
ns
Glitch filter
tgr
glitch rejection time
RESET pin
any pin except RESET
125
-
-
ns
tsa
signal acceptance time
RESET pin
-
-
15
ns
any pin except RESET
50
-
-
ns
SPI master interface
fSPI
SPI operating frequency
1.843 MHz
-
-
1.843
MHz
TSPICYC
SPI cycle time
1.843 MHz
543
-
-
ns
tSPICLKH
SPICLK HIGH time
271
-
-
ns
tSPICLKL
SPICLK LOW time
271
-
-
ns
tSPIDSU
SPI data set-up time
100
-
-
ns
tSPIDH
SPI data hold time
100
-
-
ns
tSPIDV
SPI enable to output data
valid time
-
-
160
ns
tSPIOH
SPI output data hold time
tSPIR
SPI rise time
tSPIF
SPI fall time
0
-
-
ns
SPI outputs (SPICLK, MOSI, MISO)
-
-
100
ns
SPI inputs (SPICLK, MOSI, MISO, SSn)
-
-
2000
ns
SPI outputs (SPICLK, MOSI, MISO)
-
-
100
ns
SPI inputs (SPICLK, MOSI, MISO, SSn)
-
-
2000
ns
TSPICYC
tSPIF
SPICLK
(CPOL = 0)
(output)
tSPIR
tSPICLKH
tSPICLKL
tSPICLKL
tSPICLKH
tSPIF
tSPIR
SPICLK
(CPOL = 1)
(output)
tSPIDSU
MISO
(input)
tSPIDH
MSB/LSB in
tSPIDV
LSB/MSB in
tSPIOH
tSPIDV
tSPIR
tSPIF
MOSI
(output)
master MSB/LSB out
master LSB/MSB out
002aac457
Fig 19. SPI master timing (CPHA = 0)
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TSPICYC
tSPIF
tSPICLKL
SPICLK
(CPOL = 0)
(output)
tSPIR
tSPICLKH
tSPIF
tSPICLKH
tSPIR
tSPICLKL
SPICLK
(CPOL = 1)
(output)
tSPIDSU
MISO
(input)
tSPIDH
MSB/LSB in
tSPIDV
LSB/MSB in
tSPIOH
tSPIDV
tSPIDV
tSPIF
MOSI
(output)
tSPIR
master MSB/LSB out
master LSB/MSB out
002aac458
Fig 20. SPI master timing (CPHA = 1)
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12. Package outline
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
E
D
A
X
c
y
HE
v M A
Z
9
16
Q
(A 3)
A2
A
A1
pin 1 index
θ
Lp
L
1
8
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
1
0.75
0.50
0.4
0.3
0.2
0.13
0.1
0.40
0.06
8o
o
0
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT403-1
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
MO-153
Fig 21. Package outline SOT403-1 (TSSOP16)
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13. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
13.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
13.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
13.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
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13.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 22) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 15 and 16
Table 15.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
350
< 2.5
235
220
2.5
220
220
Table 16.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 22.
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maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 22. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
14. Abbreviations
Table 17.
Acronym
SC18IS602B
Product data sheet
Abbreviations
Description
CDM
Charged Device Model
CPU
Central Processing Unit
EEPROM
Electrically Erasable Programmable Read-Only Memory
ESD
ElectroStatic Discharge
GPIO
General Purpose Input/Output
HBM
Human Body Model
I/O
Input/Output
I2C-bus
Inter-Integrated Circuit bus
LSB
Least Significant Bit
MM
Machine Model
MSB
Most Significant Bit
SPI
Serial Peripheral Interface
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15. Revision history
Table 18.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
SC18IS602B v.7
20191021
Product data sheet
-
SC18IS602_602B_603 v.6
201708035I
SC18IS602_602B_603 v.5.2
201610010I
SC18IS602_602B_603 v.5.1
Modifications:
SC18IS602B v.6
Modifications:
SC18IS602B v.5.2
Modifications:
SC18IS602B v.5.1
Modifications:
•
Removed discontinued versions
20171013
•
•
Added SC18IS602B/S8
Updated Section 4.1 “Ordering options”
20161026
•
Product data sheet
Table 2 “Ordering options”, packing method: Device orientation corrected from Q2/T3 to
Q4/T2; no change to device functionality or product identification
20150211
•
•
Product data sheet
Product data sheet
-
SC18IS602_602B_603 v.5
Table 3 “Pin description”: Added “This pin is an open-drain pin” to INT pin description
Updated Section 4 “Ordering information”
SC18IS602B v.5
20100803
Product data sheet
SC18IS602_602B_603 v.4
20080311
Product data sheet
-
SC18IS602_603 v.3
SC18IS602_603 v.3
20070813
Product data sheet
-
SC18IS602_603 v.2
SC18IS602_603 v.2
20061213
Product data sheet
-
SC18IS602_603 v.1
SC18IS602_603 v.1
20060926
Product data sheet
-
-
SC18IS602B
Product data sheet
SC18IS602_602B_603 v.4
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16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
16.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
SC18IS602B
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
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Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP B.V.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
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18. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
2
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
4
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
4.1
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
5
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
6
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
6.1
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
6.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
7
Functional description . . . . . . . . . . . . . . . . . . . 4
7.1
I2C-bus interface. . . . . . . . . . . . . . . . . . . . . . . . 4
7.1.1
Addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
7.1.2
Write to data buffer . . . . . . . . . . . . . . . . . . . . . . 5
7.1.3
SPI read and write - Function ID 01h to 0Fh . . 5
7.1.4
Read from buffer. . . . . . . . . . . . . . . . . . . . . . . . 6
7.1.5
Configure SPI Interface - Function ID F0h . . . . 7
7.1.6
Clear Interrupt - Function ID F1h . . . . . . . . . . . 8
7.1.7
Idle mode - Function ID F2h . . . . . . . . . . . . . . . 8
7.1.8
GPIO Write - Function ID F4h. . . . . . . . . . . . . . 8
7.1.9
GPIO Read - Function ID F5h . . . . . . . . . . . . . 9
7.1.10
GPIO Enable - Function ID F6h . . . . . . . . . . . . 9
7.1.11
GPIO Configuration - Function ID F7h . . . . . . 10
7.1.11.1 Quasi-bidirectional output configuration . . . . . 10
7.1.11.2 Open-drain output configuration . . . . . . . . . . . 11
7.1.11.3 Input-only configuration . . . . . . . . . . . . . . . . . 12
7.1.11.4 Push-pull output configuration . . . . . . . . . . . . 12
7.2
SPI interface . . . . . . . . . . . . . . . . . . . . . . . . . . 13
8
I2C-bus to SPI communications example . . . 13
9
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 14
10
Static characteristics. . . . . . . . . . . . . . . . . . . . 15
11
Dynamic characteristics . . . . . . . . . . . . . . . . . 16
12
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18
13
Soldering of SMD packages . . . . . . . . . . . . . . 19
13.1
Introduction to soldering . . . . . . . . . . . . . . . . . 19
13.2
Wave and reflow soldering . . . . . . . . . . . . . . . 19
13.3
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 19
13.4
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 20
14
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 21
15
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 22
16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 23
16.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 23
16.2
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
16.3
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
16.4
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 24
17
Contact information. . . . . . . . . . . . . . . . . . . . . 24
18
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2019.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 21 October 2019
Document identifier: SC18IS602B
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