SL2S2002_SL2S2102
ICODE SLIX
Rev. 3.4 — 10 August 2017
178034
1
Product data sheet
COMPANY PUBLIC
General description
The ICODE SLIX IC is a dedicated chip for intelligent label applications such as libraries,
product authentication in different industries such as pharmaceutical, medical devices
and alcohol, as well as production management in different areas of the industry. This IC
is the third generation of a product family of smart label ICs based on the ISO standards
ISO/IEC 15693 (Ref. 1) and ISO/IEC 18000-3 (Ref. 4), prolonging a successful story of
NXP in the field of vicinity identification systems.
The ICODE system offers the possibility of operating labels simultaneously in the field of
the reader antenna (anticollision). It is designed for long range applications.
1.1 Contactless energy and data transfer
Whenever connected to a very simple and easy-to-produce type of antenna (as a result
of the 13.56 MHz carrier frequency) made out of a few windings printed, winded, etched
or punched coil, the ICODE SLIX IC can be operated without line of sight up to a distance
of 1.5 m (gate width). No battery is needed. When the smart label is positioned in the
field of an interrogator antenna, the high speed RF communication interface enables data
to be transmitted up to 53 kbit/s.
1.2 Anticollision
An intelligent anticollision function enables several tags to operate in the field
simultaneously. The anticollision algorithm selects each tag individually and ensures
that the execution of a transaction with a selected tag is performed correctly without data
corruption resulting from other tags in the field.
1.3 Security and privacy aspects
• Unique IDentifier (UID):
The UID cannot be altered and guarantees the uniqueness of each label.
• Password protected EAS and AFI functionality:
The 32-bit EAS/AFI password enables the addressed label to be set in a mode where
the EAS status and the AFI value can only be changed if the correct EAS/AFI password
is transmitted to the label within the mentioned commands.
NXP Semiconductors
SL2S2002_SL2S2102
ICODE SLIX
2
Features and benefits
2.1 ICODE SLIX RF interface (ISO/IEC 15693)
•
•
•
•
•
•
•
•
•
•
•
Contactless transmission of data and supply energy (no battery needed)
Operating distance: up to 1.5 m (depending on antenna geometry)
Operating frequency: 13.56 MHz (ISM, world-wide licence freely available)
Fast data transfer: up to 53 kbit/s
High data integrity: 16-bit CRC, framing
True anticollision
Password protected Electronic Article Surveillance (EAS)
Password protected Application Family Identifier (AFI)
Data Storage Format Identifier (DSFID)
Additional fast anticollision read
Write distance equal to read distance
2.2 EEPROM
• 1024 bits, organized in 32 blocks of 4 bytes each
• 50 years data retention
• Write endurance of 100000 cycles
2.3 Security
•
•
•
•
SL2S2002_SL2S2102
Product data sheet
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Unique identifier for each device
Lock mechanism for each user memory block (write protection)
Lock mechanism for DSFID, AFI, EAS
Password (32-bit) protected EAS and AFI functionality
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NXP Semiconductors
SL2S2002_SL2S2102
ICODE SLIX
3
Applications
•
•
•
•
•
SL2S2002_SL2S2102
Product data sheet
COMPANY PUBLIC
Libraries
Item level tagging in pharmaceutical supply chains
Counterfeit protection for consumer goods
Industrial applications
Asset and document tracking
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ICODE SLIX
4
Ordering information
Table 1. Ordering information
Type number
SL2S2002_SL2S2102
Product data sheet
COMPANY PUBLIC
Package
Version
Name
Description
SL2S2002FUD
wafer
sawn, bumped wafer, 120 μm, on film frame carrier,
Ci between LA and LB = 23.5 pF (typical)
-
SL2S2102FUD
wafer
sawn, bumped wafer, 120 μm, on film frame carrier,
Ci between LA and LB = 97 pF (typical)
-
SL2S2002FTB
XSON3 plastic extremely thin small outline package; no leads; SOT1122
3 terminals; body 1 x 1.45 x 0.5 mm;
Ci between LA and LB = 23.5 pF (typical)
SL2S2102FTB
XSON3 plastic extremely thin small outline package; no leads; SOT1122
3 terminals; body 1 x 1.45 x 0.5 mm;
Ci between LA and LB = 97 pF (typical)
SL2S2002FA8
MOA8
plastic lead less module carrier package;
35 mm wide tape;
Ci between LA and LB = 23.5 pF (typical)
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SL2S2002_SL2S2102
NXP Semiconductors
ICODE SLIX
5
Block diagram
ANALOG
RF INTERFACE
DIGITAL CONTROL
EEPROM
VREG
PAD
VDD
ANTICOLLISION
LA
RECT
DEMOD
READ/WRITE
CONTROL
data
in
ANTENNA
Cres
MEMORY
ACCESS CONTROL
MOD
data
out
EEPROM INTERFACE
CONTROL
R/W
CLK
PAD
Clock
LB
RF INTERFACE
CONTROL
SEQUENCER
CHARGE PUMP
001aam247
Figure 1. Block diagram of ICODE SLIX
SL2S2002_SL2S2102
Product data sheet
COMPANY PUBLIC
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NXP Semiconductors
ICODE SLIX
6
Pinning information
SL2S2002
SL2S2102
LA
2
1
3
LB
n.c.
001aan361
Transparent top view
Figure 2. Pin configuration for SOT1122
Table 2. Pin description SOT1122
Pin
Symbol
Description
1
LB
antenna RF input
2
LA
antenna RF input
3
n.c.
not connected
LA
top view
LB
aaa-006273
Figure 3. Pin configuration for SOT500-4 (MOA8)
Table 3. Pin description SOT500-4 (MOA8)
SL2S2002_SL2S2102
Product data sheet
COMPANY PUBLIC
Pin
Symbol
Description
LA
LA
antenna RF input
LB
LB
antenna RF input
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SL2S2002_SL2S2102
NXP Semiconductors
ICODE SLIX
7
Wafer layout
LA
LB
GND
TEST
not to scale
001aam246
Figure 4. Wafer SL2S2002FUDlayout and pin configuration for the bare die
SL2S2002_SL2S2102
Product data sheet
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SL2S2002_SL2S2102
NXP Semiconductors
ICODE SLIX
LA
LB
GND
TEST
not to scale
001aam546
Figure 5. Wafer SL2S2102FUD layout and pin configuration for the bare die
7.1 Bonding pad description
Table 4. Bonding pad description
SL2S2002_SL2S2102
Product data sheet
COMPANY PUBLIC
Symbol
Description
LA
antenna RF input
LB
antenna RF input
GND
ground
TEST
test input
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ICODE SLIX
8
Mechanical specification
8.1 Wafer specification
See Ref. 6 "General specification for 8" wafer on UV-tape with electronic fail die
marking".
Table 5. Wafer specification
Wafer
Designation
each wafer is enscribed with batch number and wafer number
Diameter
200 mm (8 inches)
Thickness
120 μm ± 15 μm
Process
CMOS 0.14 μm
Batch size
25 wafers
Dies per wafer
SL2S2002FUD
110050
SL2S2102FUD
88225
Wafer backside
Material
Si
Treatment
ground and stress release
Roughness
Ra minimum = 0.5 μm
Rt maximum = 5 μm
Chip dimensions
Die size without scribe
2
SL2S2002FUD
520 μm × 484 μm = 251680 μm
SL2S2102FUD
520 μm × 607 μm = 315640 μm
2
Scribe line width
X-dimension
15 μm (scribe line width measured between nitride edges)
Y-dimension
15 μm (scribe line width measured between nitride edges)
Number of pads
4
Pad location
non-diagonal/placed in chip corners
Distance pad to pad LA to LB
400 μm
Distance pad to pad LB to TEST
SL2S2002FUD
360 μm
SL2S2102FUD
517 μm
Passivation on front
SL2S2002_SL2S2102
Product data sheet
COMPANY PUBLIC
Type
sandwich structure
Material
PE-nitride (on top)
Thickness
1.75 μm total thickness of passivation
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NXP Semiconductors
ICODE SLIX
Au bump
Material
>99.9 % pure Au
Hardness
35 HV to 80 HV 0.005
Shear strength
>70 MPa
Height
18 μm
Height uniformity
within a die
±2 μm
within a wafer
±3 μm
wafer to wafer
±4 μm
Bump flatness
±1.5 μm
Bump size
LA, LB
60 μm × 60 μm
TEST, GND
60 μm × 60 μm
variation
±5 μm
Under bump metallization
sputtered TiW
8.1.1 Fail die identification
No inkdots are applied to the wafer.
Electronic wafer mapping (SECS II format) covers the electrical test results and
additionally the results of mechanical/visual inspection.
See Ref. 6 "General specification for 8" wafer on UV-tape with electronic fail die
marking".
8.1.2 Map file distribution
See Ref. 6 "General specification for 8" wafer on UV-tape with electronic fail die
marking".
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Product data sheet
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ICODE SLIX
9
Functional description
9.1 Block description
The ICODE SLIX IC consists of three major blocks:
• Analog RF interface
• Digital controller
• EEPROM
The analog section provides stable supply voltage and demodulates data received
from the reader for processing by the digital section. The analog section’s modulation
transistor also transmits data back to the reader.
The digital section includes the state machines, processes the protocol and handles
communication with the EEPROM.
The label requires no internal power supply. Its contactless interface generates the
power supply and the system clock via the resonant circuitry by inductive coupling to
the interrogator. The interface also demodulates data that are transmitted from the
interrogator to the ICODE Label, and modulates the electromagnetic field for data
transmission from the ICODE Label to the interrogator.
Data are stored in a non-volatile memory (EEPROM).
9.2 Memory organization
The 1024 bit EEPROM memory is divided into 32 blocks. A block is the smallest access
unit. Each block consists of 4 bytes (1 block = 32 bits). Bit 0 in each byte represents the
least significant bit (LSB) and bit 7 the most significant bit (MSB), respectively.
The memory is divided into 2 parts:
• Configuration area
Within this part of the memory all required information is stored, such as UID, write
protection, access control information, passwords, AFI and EAS. This memory area
cannot be directly accessed.
• User memory
Within the 896 bit memory area the user data are stored. Direct read/write access to
this part of the memory is possible depending on the related write protection conditions.
Table 6. Memory organization
Block
Byte 0
Byte 1
Byte 2
Byte 3
Description
Configuration area for
internal use
0
User memory:
28 blocks,
4 bytes each,
112 bytes in total.
1
2
:
:
:
:
:
25
26
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Product data sheet
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ICODE SLIX
Block
Byte 0
Byte 1
Byte 2
Byte 3
Description
27
Blocks 0 to 27 can be addressed with read and write commands only.
9.2.1 Unique identifier
The 64-bit unique identifier (UID) is programmed during the production process according
to ISO/IEC 15693-3 and cannot be changed afterwards.
The 64 bits are numbered according to ISO/IEC 15693-3 starting with LSB 1 and ending
with MSB 64. This is in contrast to the general used bit numbering within a byte.
The TAG type is a part of the UID (bit 41 to 48, next to the manufacturer code which is
"04h" for NXP Semiconductors).
The TAG type of the ICODE SLIX IC is "01h".
Bit 37 is set to logic 1 for the ICODE SLIX IC which indicates that this type supports the
password protected EAS/AFI feature (not supported by ICODE SLI SL2ICS2001 with bit
37 set to logic 0).
Table 7. Unique identifier
MSB
LSB
64:57
56:49
48:41
40:1
"E0"
"04"
"01"
IC manufacturer serial number
UID 7
UID 6
UID 5
UID 4
UID 3
UID 2
UID 1
UID 0
9.2.2 Configuration of delivered ICs
ICODE SLIX ICs are delivered with the following configuration by NXP Semiconductors:
•
•
•
•
•
•
•
•
Unique identifier is unique and read only
Write access conditions allow change to user blocks, AFI, DSFID, EAS and passwords
Status of EAS mode is not defined
AFI is supported and not defined
All EAS/AFI password bytes are 00h
EAS and AFI password protection is disabled
DSFID is supported and not defined
User data memory is not defined
Remark: Because the EAS mode is undefined at delivery, the EAS mode shall be set
(enabled or disabled) according to your application requirements during the test or
initialization phase.
Remark: If EAS and/or AFI password protection is not required in the targeted
application, it is recommended a random EAS/AFI password is written during the label
initialization.
SL2S2002_SL2S2102
Product data sheet
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ICODE SLIX
9.3 Communication principle
For detailed description of the protocol and timing please refer to ISO/IEC 15693-2
(modulation, bit-coding, framing, Ref. 2) and ISO/IEC 15693-3 (anticollision, timing,
protocol, Ref. 3).
9.4 Supported commands
9.4.1 Mandatory commands
9.4.1.1 INVENTORY
As defined in ISO/IEC 15693-3.
9.4.1.2 STAY QUIET
As defined in ISO/IEC 15693-3.
9.4.2 Optional commands
9.4.2.1 READ SINGLE BLOCK
As defined in ISO/IEC 15693-3.
Option 0 (Option flag not set) is supported.
Option 1 (Option flag set) is supported.
9.4.2.2 WRITE SINGLE BLOCK
As defined in ISO/IEC 15693-3.
Option 0 (Option flag not set) is supported.
Option 1 (Option flag set) is supported.
9.4.2.3 LOCK BLOCK
As defined in ISO/IEC 15693-3.
Option 0 (Option flag not set) is supported.
Option 1 (Option flag set) is supported.
9.4.2.4 READ MULTIPLE BLOCKS
As defined in ISO/IEC 15693-3.
Option 0 (Option flag not set) is supported.
Option 1 (Option flag set) is supported.
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ICODE SLIX
Remark: If the sum of the first block number and the number of blocks exceeds the
total available number of user blocks, the number of transmitted blocks is less than the
requested number of blocks, which means that the last returned block is the highest
available user block, followed by the 16-bit CRC and the EOF.
9.4.2.5 SELECT
As defined in ISO/IEC 15693-3.
9.4.2.6 RESET TO READY
As defined in ISO/IEC 15693-3.
9.4.2.7 WRITE AFI
As defined in ISO/IEC 15693-3.
Option 0 (Option flag not set) is supported.
Option 1 (Option flag set) is supported.
Remark: This command maybe password protected, refer to Section 9.4.3.11
"PASSWORD PROTECT EAS/AFI".
9.4.2.8 LOCK AFI
As defined in ISO/IEC 15693-3.
Option 0 (Option flag not set) is supported.
Option 1 (Option flag set) is supported.
Remark: This command maybe password protected, refer to Section 9.4.3.11
"PASSWORD PROTECT EAS/AFI".
9.4.2.9 WRITE DSFID
As defined in ISO/IEC 15693-3.
Option 0 (Option flag not set) is supported.
Option 1 (Option flag set) is supported.
9.4.2.10 LOCK DSFID
As defined in ISO/IEC 15693-3.
Option 0 (Option flag not set) is supported.
Option 1 (Option flag set) is supported.
9.4.2.11 GET SYSTEM INFORMATION
As defined in ISO/IEC 15693-3.
The TAG type of the ICODE SLIX is "01h".
SL2S2002_SL2S2102
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ICODE SLIX
9.4.2.12 GET MULTIPLE BLOCK SECURITY STATUS
As defined in ISO/IEC 15693-3.
Remark: If the sum of the first block number and the number of blocks exceeds the total
available number of user blocks the number of transmitted security status bytes is less
than the requested number, which means that the last returned status byte is the one
corresponding to the highest available user block, followed by the 16-bit CRC and the
EOF.
9.4.3 Custom commands
The manufacturer code of NXP Semiconductors is defined in ISO/IEC 7816-6A1 (Ref. 5).
It has the value "04h".
For the structure of custom commands please refer to ISO/IEC 15693-3.
If not explicitly specified differently all address modes are supported.
9.4.3.1 GET RANDOM NUMBER
Command code = B2h
The GET RANDOM NUMBER command is required to receive a random number from
the label IC. The passwords that will be transmitted with the SET PASSWORD command
have to be calculated with the password and the random number (see Section 9.4.3.2
"SET PASSWORD").
The different passwords are addressed with the password identifier.
Table 8. Request format
SOF
Flags
GET
RANDOM
NUMBER
IC Mfg
code
UID
CRC16
EOF
-
8 bits
8 bits
8 bits
64 bits
optional
16 bits
-
Table 9. Response format when Error_flag set
SOF
Flags
Error code
CRC16
EOF
-
8 bits
8 bits
16 bits
-
Table 10. Response format when Error_flag NOT set
SOF
Flags
Random
number
CRC16
EOF
-
8 bits
16 bits
16 bits
-
9.4.3.2 SET PASSWORD
Command code = B3h
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ICODE SLIX
The SET PASSWORD command enables the EAS/AFI password to be transmitted to the
label to access EAS and/or AFI (if the EAS and/or AFI password is enabled). The SET
PASSWORD command has to be executed just once for the related password if the label
is powered.
Remark: The SET PASSWORD command can only be executed in Addressed or
Selected mode.
The XOR password has to be calculated with the password and two times the received
random number from the last GET RANDOM NUMBER command:
XOR_Password[31:0] = Password[31:0] XOR {Random_Number[15:0],
Random_Number[15:0]}.
The EAS/AFI password is addressed with the password identifier.
Table 11. Request format
SOF Flags SET
PASSWORD
IC Mfg
code
UID
-
8 bits
64 bits 8 bits
optional
8 bits
8 bits
Password XOR
CRC16 EOF
identifier password
32 bits
16 bits
-
Table 12. Password Identifier
Password identifier
Password
10h
EAS/AFI
Table 13. Response format when Error_flag set
SOF
Flags
Error code
CRC16
EOF
-
8 bits
8 bits
16 bits
-
Table 14. Response format when Error_flag NOT set
SOF
Flags
CRC16
EOF
-
8 bits
16 bits
-
Remark: If the IC receives an invalid password, it will not execute any following
command until a Power-On Reset (POR) (RF reset) is executed.
9.4.3.3 WRITE PASSWORD
Command code = B4h
The WRITE PASSWORD command enables a new password to be written into the
related memory if the related old password has already been transmitted with a SET
PASSWORD command and the addressed password is not locked (see Section 9.4.3.4
"LOCK PASSWORD").
Remark: The WRITE PASSWORD command can only be executed in addressed
or selected mode. The new password takes effect immediately which means that the
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ICODE SLIX
new password has to be transmitted with the SET PASSWORD command to access
protected blocks.
The EAS/AFI password is addressed with the password identifier.
The timing of the command is write alike.
Option 0 (Option flag not set) is supported.
Option 1 (Option flag set) is supported.
Table 15. Request format
SOF Flags WRITE
IC Mfg
PASSWORD code
UID
Password Password CRC16 EOF
identifier
-
64 bits
optional
8 bits
8 bits
8 bits
8 bits
32 bits
16 bits
-
Table 16. Password identifier
Password identifier
Password
10h
EAS/AFI
Table 17. Response format when Error_flag set
SOF
Flags
Error code
CRC16
EOF
-
8 bits
8 bits
16 bits
-
Table 18. Response format when Error_flag NOT set
SOF
Flags
CRC16
EOF
-
8 bits
16 bits
-
9.4.3.4 LOCK PASSWORD
Command code = B5h
The LOCK PASSWORD command enables the addressed password to be locked if the
related password has already been transmitted with a SET PASSWORD command. A
locked password cannot be changed.
The EAS/AFI password is addressed with the password identifier.
The timing of the command is write alike.
Option 0 (Option flag not set) is supported.
Option 1 (Option flag set) is supported.
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ICODE SLIX
Table 19. Request format
SOF
Flags
LOCK
IC Mfg
PASSWORD code
UID
Password CRC16
identifier
EOF
-
8 bits
8 bits
64 bits
optional
8 bits
-
8 bits
16 bits
Table 20. Password identifier
Password identifier
Password
10h
EAS/AFI
Table 21. Response format when Error_flag set
SOF
Flags
Error code
CRC16
EOF
-
8 bits
8 bits
16 bits
-
Table 22. Response format when Error_flag NOT set
SOF
Flags
CRC16
EOF
-
8 bits
16 bits
-
9.4.3.5 INVENTORY READ
Command code = A0h
When receiving the INVENTORY READ request, the ICODE SLIX IC performs the same
as the anticollision sequence, with the difference that instead of the UID and the DSFID,
the requested memory content is re-transmitted from the ICODE SLIX IC.
If an error is detected, the ICODE SLIX IC remains silent.
If the Option flag is set to logic 0, n blocks of data are re-transmitted. If the Option flag
is set to 1, n blocks of data and the part of the UID which is not part of the mask are retransmitted.
The request contains:
•
•
•
•
•
•
•
•
•
SL2S2002_SL2S2102
Product data sheet
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Flags
INVENTORY READ command code
IC manufacturer code
AFI (if AFI flag set)
Mask length
Mask value (if mask length > 0)
First block number to be read
Number of blocks to be read
CRC 16
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ICODE SLIX
Table 23. Request format
SOF
Flags
INVENTORY IC Mfg
READ
code
AFI
Mask Mask
length value
First
block
number
Number
of blocks
CRC16
EOF
-
8 bits
8 bits
8 bits
optional
8 bits
8 bits
8 bits
16 bits
-
8 bits
0 to 64
bits
The Inventory_flag must be set to logic 1.
The meaning of flags 5 to 8 is in accordance with table 5 in ISO/IEC 15693-3.
The number of blocks in the request is one less than the number of blocks that the
ICODE SLIX IC returns in its response.
If the Option flag in the request is set to logic 0 the response contains:
Table 24. Response format: Option flag logic 0
SOF
Flags
Data
CRC16
EOF
-
8 bits
Block length
16 bits
-
Repeated as needed
The ICODE SLIX IC reads the requested block(s) and sends back their value in the
response. The mechanism and timing of the INVENTORY READ command performs the
same as the INVENTORY command which is described in clause 8 of ISO/IEC 15693-3.
If the Option flag in the request is set to logic 1, the response contains:
Table 25. Response format: Option flag logic 1
SOF
Flags
Rest of UID which is not
part of the mask and slot
number
Data
CRC16
EOF
-
8 bits
0 to 64 bit
Block length
16 bits
-
Multiple of 8 bits
Repeated as needed
The ICODE SLIX IC reads the requested block(s) and sends back their value in the
response. Additionally the bytes of the UID, which are not parts of the mask and the
slot number in case of 16 slots, are returned. Instead of padding with zeros up to the
next byte boundary, the corresponding bits of the UID are returned. The mechanism
and timing of the INVENTORY READ command perform the same as the INVENTORY
command which is described in clause 8 of ISO/IEC 15693-3.
Remark: The number of bits of the re-transmitted UID can be calculated as follows:
• 16 slots: 60 bits (bit 64 to bit 4) - mask length rounded up to the next byte boundary
• 1 slot: 64 bits - mask length rounded up to the next byte boundary
Remark: If the sum of first block number and number of blocks exceeds the total
available number of user blocks, the number of transmitted blocks is less than the
requested number of blocks, which means that the last returned block is the highest
available user block, followed by the 16-bit CRC and the EOF.
Example: mask length = 30 bits
Returned: bit 64 to bit 4 (30 bits) = 30 gives 4 bytes
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ICODE SLIX
Table 26. Example: mask length = 30
Byte 0 Byte 1 Byte 2 Byte 3 Byte 4 Byte 5 Byte 6 Byte 7 UID
mask value including
padding with zeros
transmitted by
interrogator
returned value
transmitted by
ICODE SLIX IC
9.4.3.6 FAST INVENTORY READ
Command code = A1h
When receiving the FAST INVENTORY READ command the ICODE SLIX IC behaves
the same as the INVENTORY READ command with the following exceptions:
The data rate in the direction ICODE SLIX IC to the interrogator is twice that defined in
ISO/IEC 15693-3 depending on the Datarate_flag 53 kbit (high data rate) or 13 kbit (low
data rate).
The data rate from the interrogator to the ICODE SLIX IC and the time between the rising
edge of the EOF from the interrogator to the ICODE SLIX IC remain unchanged (stay the
same as defined in ISO/IEC 15693-3).
In the ICODE SLIX IC to the interrogator direction, only the single subcarrier mode is
supported.
9.4.3.7 SET EAS
Command code = A2h
The SET EAS command enables the EAS mode if the EAS mode is not locked. If the
EAS mode is password protected the EAS password has to be first transmitted with the
SET PASSWORD command.
The timing of the command is write alike.
Option 0 (Option flag not set) is supported.
Option 1 (Option flag set) is supported.
Table 27. Request format
SOF
Flags
SET EAS
IC Mfg code UID
CRC16
EOF
-
8 bits
8 bits
8 bits
16 bits
-
64 bits
optional
Table 28. Response format when Error_flag set
SOF
Flags
Error code
CRC16
EOF
-
8 bits
8 bits
16 bits
-
Table 29. Response format when Error_flag NOT set
SL2S2002_SL2S2102
Product data sheet
COMPANY PUBLIC
SOF
Flags
CRC16
EOF
-
8 bits
16 bits
-
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ICODE SLIX
9.4.3.8 RESET EAS
Command code = A3h
The RESET EAS command disables the EAS mode if the EAS mode is not locked. If the
EAS mode is password protected the EAS password has to be first transmitted with the
SET PASSWORD command.
The timing of the command is write alike.
Option 0 (Option flag not set) is supported.
Option 1 (Option flag set) is supported.
Table 30. Request format
SOF
Flags
RESET EAS
IC Mfg code
UID
CRC16
EOF
-
8 bits
8 bits
8 bits
64 bits
optional
16 bits
-
Table 31. Response format when Error_flag set
SOF
Flags
Error code
CRC16
EOF
-
8 bits
8 bits
16 bits
-
Table 32. Response format when Error_flag NOT set
SOF
Flags
CRC16
EOF
-
8 bits
16 bits
-
9.4.3.9 LOCK EAS
Command code = A4h
The LOCK EAS command locks the current state of the EAS mode and the EAS ID. If the
EAS mode is password protected the EAS password has to be first transmitted with the
SET PASSWORD command.
The timing of the command is write alike.
Option 0 (Option flag not set) is supported.
Option 1 (Option flag set) is supported.
Table 33. Request format
SL2S2002_SL2S2102
Product data sheet
COMPANY PUBLIC
SOF
Flags
LOCK
EAS
IC Mfg code
UID
CRC16
EOF
-
8 bits
8 bits
8 bits
64 bits
optional
16 bits
-
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ICODE SLIX
Table 34. Response format when Error_flag set
SOF
Flags
Error code
CRC16
EOF
-
8 bits
8 bits
16 bits
-
Table 35. Response format when Error_flag NOT set
SOF
Flags
CRC16
EOF
-
8 bits
16 bits
-
9.4.3.10 EAS ALARM
Command code = A5h
If the EAS mode is enabled, the EAS sequence is returned from the ICODE SLIX IC.
Table 36. Request format
SOF
Flags
EAS
ALARM
IC Mfg code
UID
CRC16
EOF
-
8 bits
8 bits
8 bits
64 bits
optional
16 bits
-
If an error is detected the ICODE SLIX IC remains silent.
Table 37. Response format
SOF
Flags
EAS sequence CRC16
EOF
-
8 bits
256 bits
-
16 bits
EAS sequence (starting with the LSB, which is transmitted first; read from left to right):
11110100
00010111
01000001
10001111
11001101
10001101
01011011
00111001
01000110
00000001
01011001
10001011
00001110
00011100
01100001
01001000
10101011
01001011
11110110
10100101
11100101
10000001
11110101
01001110
00001001
10010010
11010001
11101100
11111110
01101110
00001101
11110111
If the EAS mode is disabled the ICODE SLIX IC remains silent.
9.4.3.11 PASSWORD PROTECT EAS/AFI
Command code = A6h
The PASSWORD PROTECT EAS/AFI command enables the password protection for
EAS and/or AFI if the EAS/AFI password is first transmitted with the SET PASSWORD
command.
Option flag set to logic 0: EAS will be password protected.
Option flag set to logic 1: AFI will be password protected.
Both password protections (AFI and EAS) can be enabled separately.
Remark: Independent of the Option flag, this write-alike command will be executed like a
write command with Option flag 0 (Option flag not set).
Once the EAS/AFI password protection is enabled, it is not possible to change back to
unprotected EAS and/or AFI.
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ICODE SLIX
The timing of the command is write alike (as write command with Option flag 0).
Table 38. Request format
SOF
Flags
PASSWORD
PROTECT EAS/
AFI
IC Mfg code UID
CRC16
EOF
-
8 bits
8 bits
8 bits
16 bits
-
64 bits optional
Table 39. Response format when Error_flag set
SOF
Flags
Error code
CRC16
EOF
-
8 bits
8 bits
16 bits
-
Table 40. Response format when Error_flag NOT set
SOF
Flags
CRC16
EOF
-
8 bits
16 bits
-
9.5 Error handling
9.5.1 Transmission errors
According to ISO/IEC 15693 the label IC will not respond if a transmission error (CRC,
bit coding, bit count, wrong framing) is detected and will silently wait for the next correct
received command.
9.5.2 Not supported commands or options
If the received command or option is not supported, the behavior of the label IC depends
on the addressing mechanism.
9.5.2.1 Non Addressed Mode
The label IC remains silent.
9.5.2.2 Addressed or Selected Mode
The addressed or selected label IC responds with the error code "0Fh" (error with no
information given or error code is not supported).
If the Inventory flag or the Protocol Extension flag is set, the label IC will not respond if
the command or option is not supported.
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ICODE SLIX
9.5.3 Parameter out of range
9.5.3.1 Read commands
If the sum of the first block number and the number of blocks exceeds the total available
number of user blocks, the number of transmitted blocks is less than the requested
number of blocks, which means that the last returned block is the highest available user
block, followed by the 16-bit CRC and the EOF.
9.5.3.2 Write and lock commands
If the address of a block to be written does not exist or a block to be written is locked, the
behaviour of the label IC depends on the addressing mechanism.
Non Addressed Mode
• The label IC remains silent and aborts the command without writing anything.
Addressed or Selected Mode
• The addressed or selected label IC responds with the error code "0Fh"(error with no
information given or error code is not supported).
9.6 Data integrity
Following mechanisms are implemented in the contactless communication link between
interrogator and label to ensure very reliable data transmission:
•
•
•
•
16-bit CRC per block
Bit count checking
Bit coding to distinguish between logic 1, logic 0, and no information
Channel monitoring (protocol sequence and bit stream analysis)
9.7 RF interface
The definition of the RF interface is according to the standard ISO/IEC 15693-2 and ISO/
IEC 15693-3.
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ICODE SLIX
10 Limiting values
[1][2]
Table 41. Limiting values (Wafer)
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Tstg
Conditions
Min
Max
Unit
storage temperature
-55
+125
°C
Ptot
total power dissipation
-
125
mW
Tj
junction temperature
-40
+85
°C
-
±60
mA
-
30
mA
-
±2
kV
Ii(max)
maximum input current
LA to LB; peak
II
input current
LA to LB; RMS
VESD
[1]
[2]
[3]
[4]
electrostatic discharge voltage
Human body model
[3]
[4]
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any conditions other than those described in the operating conditions and electrical characteristics sections of this
specification is not implied.
This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge.
Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maxima.
The voltage between LA and LB is limited by the on-chip voltage limitation circuitry (corresponding to parameter II).
For ESD measurement, the IC was mounted in a CDIP8 package.
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ICODE SLIX
11 Characteristics
11.1 Memory characteristics
Table 42. EEPROM characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
tret
retention time
Tamb ≤ 55 °C
50
-
-
year
Nendu(W)
write endurance
100000
-
-
cycle
11.2 Interface characteristics
Table 43. Interface characteristics
Typical ratings are not guaranteed. The values listed are at room temperature.
Symbol
Parameter
Conditions
fi
input frequency
Vi(RMS)min
minimum RMS input voltage
Pi(min)
Ci
[1]
[2]
[3]
minimum input power
input capacitance
Min
Typ
Max
Unit
13.553
13.56
13.567
MHz
1.5
-
1.7
V
-
40
-
μW
SL2S2002FUD
SL2S2002FTB
SL2S2002FA8
22.3
23.5
24.7
pF
SL2S2102FUD
SL2S2102FTB
92
97
102
pF
[1]
operating read/write
operating
[2]
between LA and LB
[3]
Bandwidth limitation (± 7 kHz) according to ISM band regulations.
Including losses in the resonant capacitor and rectifier.
Measured with an HP4285A LCR meter at 13.56 MHz and 2 V RMS.
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ICODE SLIX
12 Marking
12.1 Marking SOT1122
Table 44. Marking SOT1122
SL2S2002_SL2S2102
Product data sheet
COMPANY PUBLIC
Type number
Marking code
SL2S2002FTB
20
SL2S2102FTB
21
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ICODE SLIX
13 Package outline
XSON3: plastic extremely thin small outline package; no leads; 3 terminals; body 1 x 1.45 x 0.5 mm
b
SOT1122
b1
1
4×
(2)
L1
3
L
e
2
e1
e1
4×
A
(2)
A1
D
type code
E
terminal 1
index area
pin 1 indication
0
1
scale
Dimensions
Unit
mm
2 mm
A(1)
max 0.50
nom
min
A1
b
b1
D
E
0.04
0.45
0.40
0.37
0.55
0.50
0.47
1.50
1.45
1.40
1.05
1.00
0.95
e
e1
L
0.35
0.55 0.425 0.30
0.27
L1
0.30
0.25
0.22
Notes
1. Dimension A is including plating thickness.
2. Can be visible in some manufacturing processes.
Outline
version
sot1122_po
References
IEC
SOT1122
JEDEC
JEITA
European
projection
Issue date
09-10-09
MO-252
Figure 6. Package outline SOT1122
SL2S2002_SL2S2102
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ICODE SLIX
PLLMC: plastic leadless module carrier package; 35 mm wide tape
SOT500-4
X
D
A
0
10
scale
Dimensions
Unit
mm
detail X
20 mm
A(1)
D
max 0.26 35.05
nom
35.00
min
34.95
For unspecified dimensions see PLLMC-drawing given in the subpackage code.
Note
1. Total package thickness, exclusive punching burr.
sot500-4_po
References
Outline
version
IEC
JEDEC
JEITA
SOT500-4
---
---
---
European
projection
Issue date
11-02-18
Figure 7. Package outline SOT500-4
For more details on the contactless MOA8 module see Ref. 7.
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ICODE SLIX
14 Bare die outline
(1)
LA
LB
(5)
Y
(6)
(4)
X
(7)
GND
TEST
(8)
(2)
(3)
not to scale!
001aam108
(1) X-scribe line width: 15 μm
(2) Y-scribe line width: 15 μm
(3) Chip step, X-length: 535 μm
(4) Chip step, Y-length: 499 μm
(5) Bump to bump distance X (LA - LB): 400 μm
(6) Bump to bump distance Y (LB - TEST): 360 μm
(7) Distance bump to nitride edge X: 75 μm
(8) Distance bump to nitride edge Y: 45 μm
Bump size X × Y: 60 μm × 60 μm
Figure 8. Wafer SL2S2002FUDbare die layout
SL2S2002_SL2S2102
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ICODE SLIX
(1)
LA
LB
(5)
(6)
Y
(4)
X
(7)
GND
TEST
(8)
(2)
(3)
not to scale!
001aam545
(1) X-scribe line width: 15 μm
(2) Y-scribe line width: 15 μm
(3) Chip step, X-length: 535 μm
(4) Chip step, Y-length: 622 μm
(5) Bump to bump distance X (LA - LB): 400 μm
(6) Bump to bump distance Y (LB - TEST): 517 μm
(7) Distance bump to nitride edge X: 75 μm
(8) Distance bump to nitride edge Y: 45 μm
Bump size X × Y: 60 μm × 60 μm
Figure 9. Wafer SL2S2102FUD bare die layout
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ICODE SLIX
15 Abbreviations
Table 45. Abbreviations
SL2S2002_SL2S2102
Product data sheet
COMPANY PUBLIC
Acronym
Description
AFI
Application Family Identifier
CRC
Cyclic Redundancy Check
DSFID
Data Storage Format Identifier
EAS
Electronic Article Surveillance
EEPROM
Electrically Erasable Programmable Read Only Memory
EOF
End Of Frame
IC
Integrated Circuit
LCR
Inductance, Capacitance, Resistance
LSB
Least Significant Byte/Bit
MSB
Most Significant Byte/Bit
RF
Radio Frequency
SOF
Start Of Frame
UID
Unique IDentifier
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ICODE SLIX
16 References
[1]
ISO Standard
ISO/IEC 15693 - Identification cards - Contactless integrated circuit cards - Vicinity cards.
[2]
ISO Standard
ISO/IEC 15693-2 -Identification cards - Contactless integrated circuit cards - Vicinity
cards - Part 2: Air interface and initialization.
[3]
ISO Standard
ISO/IEC 15693-3 -Identification cards - Contactless integrated circuit cards - Vicinity
cards - Part 3: Anticollision and transmission protocol.
[4]
ISO Standard
ISO/IEC 18000-3 - Information technology - Radio frequency identification for item
management - Part 3: Parameters for air interface communications at 13.56 MHz.
[5]
ISO Standard
ISO/IEC 7816-6 - Identification cards - Integrated circuit cards - Part 6: Interindustry data
elements for interchange.
[6]
General specification for 8" wafer on UV-tape with electronic fail die marking
1
Delivery type description – BL-ID document number: 1093** .
[7]
Contactless smart card module specification MOA8
Delivery Type Description, BU-ID Document number 1636**1.
1 ** ... document version number
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ICODE SLIX
17 Revision history
Table 46. Revision history
Document ID
Release date Data sheet status
Change
notice
Supersedes
SL2S2002_SL2S2102 v3.4
20170810
-
SL2S2002_SL2S2102 v3.3
Modifications:
• Addition of SL2S2002FA8 with SOT500-4 (MOA8) package
SL2S2002_SL2S2102 v3.3
20120823
Modifications:
• Security level changed into "COMPANY PUBLIC"
SL2S2002_SL2S2102 v3.2
20110110
Modifications:
• Type numbers SL2S2002FTB and SL2S2102FTB added
• Section 6 "Pinning information", Section 12 "Marking" and Section 13 "Package outline"
added
SL2S2002_SL2S2102 v3.1
20100908
Modifications:
• Added type number SL2S2102
• Document layout updated
• Table 43: symbols and parameter descriptions updated
SL2S2002 v3.0
20100527
Product data sheet
-
178020
178020
20100430
Preliminary data sheet
-
178010
178010
20100205
Objective data sheet
-
-
SL2S2002_SL2S2102
Product data sheet
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Product data sheet
Product data sheet
Product data sheet
Product data sheet
-
-
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Rev. 3.4 — 10 August 2017
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ICODE SLIX
18 Legal information
18.1 Data sheet status
Document status
[1][2]
Product status
[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple
devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
18.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences
of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is
intended for quick reference only and should not be relied upon to contain
detailed and full information. For detailed and full information see the
relevant full data sheet, which is available on request via the local NXP
Semiconductors sales office. In case of any inconsistency or conflict with the
short data sheet, the full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product
is deemed to offer functions and qualities beyond those described in the
Product data sheet.
18.3 Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not
give any representations or warranties, expressed or implied, as to the
accuracy or completeness of such information and shall have no liability
for the consequences of use of such information. NXP Semiconductors
takes no responsibility for the content in this document if provided by an
information source outside of NXP Semiconductors. In no event shall NXP
Semiconductors be liable for any indirect, incidental, punitive, special or
consequential damages (including - without limitation - lost profits, lost
savings, business interruption, costs related to the removal or replacement
of any products or rework charges) whether or not such damages are based
on tort (including negligence), warranty, breach of contract or any other
legal theory. Notwithstanding any damages that customer might incur for
any reason whatsoever, NXP Semiconductors’ aggregate and cumulative
liability towards customer for the products described herein shall be limited
in accordance with the Terms and conditions of commercial sale of NXP
Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
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Product data sheet
COMPANY PUBLIC
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes
no representation or warranty that such applications will be suitable
for the specified use without further testing or modification. Customers
are responsible for the design and operation of their applications and
products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications
and products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with
their applications and products. NXP Semiconductors does not accept any
liability related to any default, damage, costs or problem which is based
on any weakness or default in the customer’s applications or products, or
the application or use by customer’s third party customer(s). Customer is
responsible for doing all necessary testing for the customer’s applications
and products using NXP Semiconductors products in order to avoid a
default of the applications and the products or of the application or use by
customer’s third party customer(s). NXP does not accept any liability in this
respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or
the grant, conveyance or implication of any license under any copyrights,
patents or other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 3.4 — 10 August 2017
178034
© NXP B.V. 2017. All rights reserved.
35 / 39
SL2S2002_SL2S2102
NXP Semiconductors
ICODE SLIX
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor
tested in accordance with automotive testing or application requirements.
NXP Semiconductors accepts no liability for inclusion and/or use of nonautomotive qualified products in automotive equipment or applications. In
the event that customer uses the product for design-in and use in automotive
applications to automotive specifications and standards, customer (a) shall
use the product without NXP Semiconductors’ warranty of the product for
such automotive applications, use and specifications, and (b) whenever
SL2S2002_SL2S2102
Product data sheet
COMPANY PUBLIC
customer uses the product for automotive applications beyond NXP
Semiconductors’ specifications such use shall be solely at customer’s own
risk, and (c) customer fully indemnifies NXP Semiconductors for any liability,
damages or failed product claims resulting from customer design and use
of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
18.4 Trademarks
Notice: All referenced brands, product names, service names and
trademarks are the property of their respective owners.
ICODE and I-CODE — are trademarks of NXP B.V.
All information provided in this document is subject to legal disclaimers.
Rev. 3.4 — 10 August 2017
178034
© NXP B.V. 2017. All rights reserved.
36 / 39
SL2S2002_SL2S2102
NXP Semiconductors
ICODE SLIX
Tables
Tab. 1.
Tab. 2.
Tab. 3.
Tab. 4.
Tab. 5.
Tab. 6.
Tab. 7.
Tab. 8.
Tab. 9.
Tab. 10.
Tab. 11.
Tab. 12.
Tab. 13.
Tab. 14.
Tab. 15.
Tab. 16.
Tab. 17.
Tab. 18.
Tab. 19.
Tab. 20.
Tab. 21.
Tab. 22.
Tab. 23.
Tab. 24.
Tab. 25.
Tab. 26.
Tab. 27.
Tab. 28.
Tab. 29.
Tab. 30.
Ordering information ..........................................4
Pin description SOT1122 .................................. 6
Pin description SOT500-4 (MOA8) ....................6
Bonding pad description ....................................8
Wafer specification ............................................ 9
Memory organization .......................................11
Unique identifier .............................................. 12
Request format ................................................15
Response format when Error_flag set ............. 15
Response format when Error_flag NOT set .....15
Request format ................................................16
Password Identifier ..........................................16
Response format when Error_flag set ............. 16
Response format when Error_flag NOT set .....16
Request format ................................................17
Password identifier .......................................... 17
Response format when Error_flag set ............. 17
Response format when Error_flag NOT set .....17
Request format ................................................18
Password identifier .......................................... 18
Response format when Error_flag set ............. 18
Response format when Error_flag NOT set .....18
Request format ................................................19
Response format: Option flag logic 0 .............. 19
Response format: Option flag logic 1 .............. 19
Example: mask length = 30 ............................ 20
Request format ................................................20
Response format when Error_flag set ............. 20
Response format when Error_flag NOT set .....20
Request format ................................................21
SL2S2002_SL2S2102
Product data sheet
COMPANY PUBLIC
Tab. 31.
Tab. 32.
Tab. 33.
Tab. 34.
Tab. 35.
Tab. 36.
Tab. 37.
Tab. 38.
Tab. 39.
Tab. 40.
Tab. 41.
Tab. 42.
Tab. 43.
Tab. 44.
Tab. 45.
Tab. 46.
Response format when Error_flag set ............. 21
Response format when Error_flag NOT set .....21
Request format ................................................21
Response format when Error_flag set ............. 22
Response format when Error_flag NOT set .....22
Request format ................................................22
Response format ............................................. 22
Request format ................................................23
Response format when Error_flag set ............. 23
Response format when Error_flag NOT set .....23
Limiting values (Wafer)Stresses above
those listed under Absolute Maximum
Ratings may cause permanent damage to
the device. This is a stress rating only and
functional operation of the device at these
or any conditions other than those described
in the operating conditions and electrical
characteristics sections of this specification
is not implied.This product includes circuitry
specifically designed for the protection of its
internal devices from the damaging effects
of excessive static charge. Nonetheless, it
is suggested that conventional precautions
be taken to avoid applying greater than the
rated maxima. ................................................. 25
EEPROM characteristics .................................26
Interface characteristics .................................. 26
Marking SOT1122 ........................................... 27
Abbreviations ...................................................32
Revision history ...............................................34
All information provided in this document is subject to legal disclaimers.
Rev. 3.4 — 10 August 2017
178034
© NXP B.V. 2017. All rights reserved.
37 / 39
SL2S2002_SL2S2102
NXP Semiconductors
ICODE SLIX
Figures
Fig. 1.
Fig. 2.
Fig. 3.
Fig. 4.
Block diagram of ICODE SLIX .......................... 5
Pin configuration for SOT1122 ..........................6
Pin configuration for SOT500-4 (MOA8) ........... 6
Wafer SL2S2002FUDlayout and pin
configuration for the bare die ............................ 7
SL2S2002_SL2S2102
Product data sheet
COMPANY PUBLIC
Fig. 5.
Fig. 6.
Fig. 7.
Fig. 8.
Fig. 9.
Wafer SL2S2102FUD layout and pin
configuration for the bare die ............................ 8
Package outline SOT1122 .............................. 28
Package outline SOT500-4 ............................. 29
Wafer SL2S2002FUDbare die layout .............. 30
Wafer SL2S2102FUD bare die layout ............. 31
All information provided in this document is subject to legal disclaimers.
Rev. 3.4 — 10 August 2017
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38 / 39
NXP Semiconductors
SL2S2002_SL2S2102
ICODE SLIX
Contents
1
General description ............................................ 1
1.1
Contactless energy and data transfer ................1
1.2
Anticollision ........................................................ 1
1.3
Security and privacy aspects .............................1
2
Features and benefits .........................................2
2.1
ICODE SLIX RF interface (ISO/IEC 15693) .......2
2.2
EEPROM ........................................................... 2
2.3
Security .............................................................. 2
3
Applications .........................................................3
4
Ordering information .......................................... 4
5
Block diagram ..................................................... 5
6
Pinning information ............................................ 6
7
Wafer layout ........................................................ 7
7.1
Bonding pad description .................................... 8
8
Mechanical specification ....................................9
8.1
Wafer specification ............................................ 9
8.1.1
Fail die identification ........................................ 10
8.1.2
Map file distribution ......................................... 10
9
Functional description ......................................11
9.1
Block description ............................................. 11
9.2
Memory organization ....................................... 11
9.2.1
Unique identifier ...............................................12
9.2.2
Configuration of delivered ICs ......................... 12
9.3
Communication principle ................................. 13
9.4
Supported commands ......................................13
9.4.1
Mandatory commands ..................................... 13
9.4.1.1
INVENTORY .................................................... 13
9.4.1.2
STAY QUIET ................................................... 13
9.4.2
Optional commands .........................................13
9.4.2.1
READ SINGLE BLOCK ................................... 13
9.4.2.2
WRITE SINGLE BLOCK ..................................13
9.4.2.3
LOCK BLOCK ..................................................13
9.4.2.4
READ MULTIPLE BLOCKS .............................13
9.4.2.5
SELECT ........................................................... 14
9.4.2.6
RESET TO READY ......................................... 14
9.4.2.7
WRITE AFI ...................................................... 14
9.4.2.8
LOCK AFI ........................................................ 14
9.4.2.9
WRITE DSFID ................................................. 14
9.4.2.10 LOCK DSFID ................................................... 14
9.4.2.11 GET SYSTEM INFORMATION ....................... 14
9.4.2.12 GET MULTIPLE BLOCK SECURITY
STATUS ...........................................................15
9.4.3
Custom commands ..........................................15
9.4.3.1
GET RANDOM NUMBER ................................15
9.4.3.2
SET PASSWORD ............................................15
9.4.3.3
WRITE PASSWORD ....................................... 16
9.4.3.4
LOCK PASSWORD ......................................... 17
9.4.3.5
INVENTORY READ .........................................18
9.4.3.6
FAST INVENTORY READ ...............................20
9.4.3.7
SET EAS ......................................................... 20
9.4.3.8
RESET EAS .................................................... 21
9.4.3.9
LOCK EAS .......................................................21
9.4.3.10 EAS ALARM .................................................... 22
9.4.3.11 PASSWORD PROTECT EAS/AFI ................... 22
9.5
Error handling .................................................. 23
9.5.1
Transmission errors ......................................... 23
9.5.2
Not supported commands or options ...............23
9.5.2.1
Non Addressed Mode ......................................23
9.5.2.2
Addressed or Selected Mode .......................... 23
9.5.3
Parameter out of range ................................... 24
9.5.3.1
Read commands ............................................. 24
9.5.3.2
Write and lock commands ............................... 24
9.6
Data integrity ................................................... 24
9.7
RF interface ..................................................... 24
10
Limiting values .................................................. 25
11
Characteristics .................................................. 26
11.1
Memory characteristics ....................................26
11.2
Interface characteristics ...................................26
12
Marking ...............................................................27
12.1
Marking SOT1122 ............................................27
13
Package outline .................................................28
14
Bare die outline .................................................30
15
Abbreviations .................................................... 32
16
References ......................................................... 33
17
Revision history ................................................ 34
18
Legal information .............................................. 35
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section 'Legal information'.
© NXP B.V. 2017.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 10 August 2017
Document identifier: SL2S2002_SL2S2102
Document number: 178034
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