SL2S2102FTB

SL2S2002; SL2S2102 ICODE SLIX Rev. 3.2 — 10 January 2011 198332 Product short data sheet PUBLIC 1. General description The ICODE SLIX IC is a dedicated chip for intelligent label applications such as libraries, product authentication in different industries such as pharmaceutical, medical devices and alcohol, as well as production management in different areas of the industry. This IC is the third generation of a product family of smart label ICs based on the ISO standards ISO/IEC 15693 (Ref. 1) and ISO/IEC 18000-3 (Ref. 4), prolonging a successful story of NXP in the field of vicinity identification systems. The ICODE system offers the possibility of operating labels simultaneously in the field of the reader antenna (anticollision). It is designed for long range applications. 1.1 Contactless energy and data transfer Whenever connected to a very simple and easy-to-produce type of antenna (as a result of the 13.56 MHz carrier frequency) made out of a few windings printed, winded, etched or punched coil, the ICODE SLIX IC can be operated without line of sight up to a distance of 1.5 m (gate width). No battery is needed. When the smart label is positioned in the field of an interrogator antenna, the high speed RF communication interface enables data to be transmitted up to 53 kbit/s. 1.2 Anticollision An intelligent anticollision function enables several tags to operate in the field simultaneously. The anticollision algorithm selects each tag individually and ensures that the execution of a transaction with a selected tag is performed correctly without data corruption resulting from other tags in the field. 1.3 Security and privacy aspects • Unique IDentifier (UID): The UID cannot be altered and guarantees the uniqueness of each label. • Password protected EAS and AFI functionality: The 32-bit EAS/AFI password enables the addressed label to be set in a mode where the EAS status and the AFI value can only be changed if the correct EAS/AFI password is transmitted to the label within the mentioned commands. NXP Semiconductors SL2S2002; SL2S2102 ICODE SLIX 2. Features and benefits 2.1 ICODE SLIX RF interface (ISO/IEC 15693) Contactless transmission of data and supply energy (no battery needed) Operating distance: up to 1.5 m (depending on antenna geometry) Operating frequency: 13.56 MHz (ISM, world-wide licence freely available) Fast data transfer: up to 53 kbit/s High data integrity: 16-bit CRC, framing True anticollision Password protected Electronic Article Surveillance (EAS) Password protected Application Family Identifier (AFI) Data Storage Format IDentifier (DSFID) Additional fast anticollision read Write distance equal to read distance 2.2 EEPROM 1024 bits, organized in 32 blocks of 4 bytes each 50 years data retention Write endurance of 100000 cycles 2.3 Security Unique identifier for each device Lock mechanism for each user memory block (write protection) Lock mechanism for DSFID, AFI, EAS Password (32-bit) protected EAS and AFI functionality 3. Applications Libraries Item level tagging in pharmaceutical supply chains Counterfeit protection for consumer goods Industrial applications Asset and document tracking SL2S2002_SL2S2102_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product short data sheet PUBLIC Rev. 3.2 — 10 January 2011 198332 2 of 13 NXP Semiconductors SL2S2002; SL2S2102 ICODE SLIX 4. Quick reference data Table 1. Quick reference data Typical ratings are not guaranteed. The values listed are at room temperature. Symbol tret Nendu(W) fi Ci Parameter retention time write endurance input frequency input capacitance between LA and LB SL2S2002FUD SL2S2002FTB SL2S2102FUD SL2S2102FTB [1] [2] [1] [2] Conditions Tamb ≤ 55 °C Min 50 100000 13.553 22.3 92 Typ 13.56 23.5 97 Max - Unit year cycle Wafer EEPROM characteristics Interface characteristics 13.567 MHz 24.7 102 pF pF Bandwidth limitation (± 7 kHz) according to ISM band regulations. Measured with an HP4285A LCR meter at 13.56 MHz and 2 V RMS. 5. Ordering information Table 2. Ordering information Package Name SL2S2002FUD SL2S2102FUD SL2S2002FTB wafer wafer XSON3 Description sawn, bumped wafer, 120 μm, on film frame carrier, Ci between LA and LB = 23.5 pF (typical) sawn, bumped wafer, 120 μm, on film frame carrier, Ci between LA and LB = 97 pF (typical) Version Type number plastic extremely thin small outline package; no leads; SOT1122 3 terminals; body 1 x 1.45 x 0.5 mm; Ci between LA and LB = 23.5 pF (typical) plastic extremely thin small outline package; no leads; SOT1122 3 terminals; body 1 x 1.45 x 0.5 mm; Ci between LA and LB = 97 pF (typical) SL2S2102FTB XSON3 SL2S2002_SL2S2102_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product short data sheet PUBLIC Rev. 3.2 — 10 January 2011 198332 3 of 13 NXP Semiconductors SL2S2002; SL2S2102 ICODE SLIX 6. Block diagram ANALOG RF INTERFACE VREG PAD VDD LA RECT DEMOD data in DIGITAL CONTROL EEPROM ANTICOLLISION READ/WRITE CONTROL ANTENNA Cres MOD data out ACCESS CONTROL MEMORY EEPROM INTERFACE CONTROL CLK PAD Clock LB RF INTERFACE CONTROL R/W SEQUENCER CHARGE PUMP 001aam247 Fig 1. Block diagram of ICODE SLIX SL2S2002_SL2S2102_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product short data sheet PUBLIC Rev. 3.2 — 10 January 2011 198332 4 of 13 NXP Semiconductors SL2S2002; SL2S2102 ICODE SLIX 7. Functional description 7.1 Block description The ICODE SLIX IC consists of three major blocks: • Analog RF interface • Digital controller • EEPROM The analog section provides stable supply voltage and demodulates data received from the reader for processing by the digital section. The analog section’s modulation transistor also transmits data back to the reader. The digital section includes the state machines, processes the protocol and handles communication with the EEPROM. The label requires no internal power supply. Its contactless interface generates the power supply and the system clock via the resonant circuitry by inductive coupling to the interrogator. The interface also demodulates data that are transmitted from the interrogator to the ICODE Label, and modulates the electromagnetic field for data transmission from the ICODE Label to the interrogator. Data are stored in a non-volatile memory (EEPROM). 7.2 Memory organization The 1024 bit EEPROM memory is divided into 32 blocks. A block is the smallest access unit. Each block consists of 4 bytes (1 block = 32 bits). Bit 0 in each byte represents the least significant bit (LSB) and bit 7 the most significant bit (MSB), respectively. The memory is divided into 2 parts: • Configuration area Within this part of the memory all required information is stored, such as UID, write protection, access control information, passwords, AFI and EAS. This memory area cannot be directly accessed. • User memory Within the 896 bit memory area the user data are stored. Direct read/write access to this part of the memory is possible depending on the related write protection conditions. SL2S2002_SL2S2102_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product short data sheet PUBLIC Rev. 3.2 — 10 January 2011 198332 5 of 13 NXP Semiconductors SL2S2002; SL2S2102 ICODE SLIX Table 3. Block Memory organization Byte 0 Byte 1 Byte 2 Byte 3 Description Configuration area for internal use 0 1 2 : 25 26 27 : : : : User memory: 28 blocks, 4 bytes each, 112 bytes in total. Blocks 0 to 27 can be addressed with read and write commands only. 7.2.1 Unique identifier The 64-bit unique identifier (UID) is programmed during the production process according to ISO/IEC 15693-3 and cannot be changed afterwards. The 64 bits are numbered according to ISO/IEC 15693-3 starting with LSB 1 and ending with MSB 64. This is in contrast to the general used bit numbering within a byte. The TAG type is a part of the UID (bit 41 to 48, next to the manufacturer code which is “04h” for NXP Semiconductors). The TAG type of the ICODE SLIX IC is “01h”. Bit 37 is set to logic 1 for the ICODE SLIX IC which indicates that this type supports the password protected EAS/AFI feature (not supported by ICODE SLI SL2ICS2001 with bit 37 set to logic 0). Table 4. MSB 64:57 “E0” UID 7 56:49 “04” UID 6 48:41 “01” UID 5 UID 4 UID 3 40:1 IC manufacturer serial number UID 2 UID 1 UID 0 Unique identifier LSB SL2S2002_SL2S2102_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product short data sheet PUBLIC Rev. 3.2 — 10 January 2011 198332 6 of 13 NXP Semiconductors SL2S2002; SL2S2102 ICODE SLIX 8. Limiting values Table 5. Limiting values (Wafer)[1][2] In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Tstg Ptot Tj Ii(max) II VESD [1] Parameter storage temperature total power dissipation junction temperature maximum input current input current electrostatic discharge voltage Conditions Min −55 −40 Max +125 125 +85 ±60 30 ±2 Unit °C mW °C mA mA kV LA to LB; peak LA to LB; RMS Human body model [3] - [4] Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any conditions other than those described in the operating conditions and electrical characteristics sections of this specification is not implied. This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maxima. The voltage between LA and LB is limited by the on-chip voltage limitation circuitry (corresponding to parameter II). For ESD measurement, the IC was mounted in a CDIP8 package. [2] [3] [4] SL2S2002_SL2S2102_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product short data sheet PUBLIC Rev. 3.2 — 10 January 2011 198332 7 of 13 NXP Semiconductors SL2S2002; SL2S2102 ICODE SLIX 9. Abbreviations Table 6. Acronym AFI CRC DSFID EAS EEPROM IC LCR LSB MSB RF UID Abbreviations Description Application Family Identifier Cyclic Redundancy Check Data Storage Format IDentifier Electronic Article Surveillance Electrically Erasable Programmable Read Only Memory Integrated Circuit Inductance, Capacitance, Resistance Least Significant Byte/Bit Most Significant Byte/Bit Radio Frequency Unique IDentifier 10. References [1] [2] [3] [4] ISO Standard — ISO/IEC 15693 - Identification cards - Contactless integrated circuit cards - Vicinity cards. ISO Standard — ISO/IEC 15693-2 -Identification cards - Contactless integrated circuit cards - Vicinity cards - Part 2: Air interface and initialization. ISO Standard — ISO/IEC 15693-3 -Identification cards - Contactless integrated circuit cards - Vicinity cards - Part 3: Anticollision and transmission protocol. ISO Standard — ISO/IEC 18000-3 - Information technology - Radio frequency identification for item management - Part 3: Parameters for air interface communications at 13.56 MHz. ISO Standard — ISO/IEC 7816-6 - Identification cards - Integrated circuit cards Part 6: Interindustry data elements for interchange. General specification for 8” wafer on UV-tape with electronic fail die marking — Delivery type description – BU-ID document number: 1093**1. SL2S2002; SL2S2102 — Product data sheet – BU-ID document number: 1780** [5] [6] [7] 1. ** ... document version number All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. SL2S2002_SL2S2102_SDS Product short data sheet PUBLIC Rev. 3.2 — 10 January 2011 198332 8 of 13 NXP Semiconductors SL2S2002; SL2S2102 ICODE SLIX 11. Revision history Table 7. Revision history Release date Data sheet status Change notice Supersedes SL2S2002_SL2S2102_SDS v.3.1 Product short data sheet Document ID SL2S2002_SL2S2102_SDS v.3.2 20110110 Modifications: • Type numbers SL2S2002FTB and SL2S2102FTB added Product short data sheet - SL2S2002_SL2S2102_SDS v.3.1 20101005 SL2S2002_SL2S2102_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product short data sheet PUBLIC Rev. 3.2 — 10 January 2011 198332 9 of 13 NXP Semiconductors SL2S2002; SL2S2102 ICODE SLIX 12. Legal information 12.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 12.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. © NXP B.V. 2011. All rights reserved. 12.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or SL2S2002_SL2S2102_SDS All information provided in this document is subject to legal disclaimers. Product short data sheet PUBLIC Rev. 3.2 — 10 January 2011 198332 10 of 13 NXP Semiconductors SL2S2002; SL2S2102 ICODE SLIX whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. ICODE and I-CODE — are trademarks of NXP B.V. 13. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com SL2S2002_SL2S2102_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product short data sheet PUBLIC Rev. 3.2 — 10 January 2011 198332 11 of 13 NXP Semiconductors SL2S2002; SL2S2102 ICODE SLIX 14. Tables Table 1. Table 2. Table 3. Table 4. Quick reference data . . . . . . . . . . . . . . . . . . . . .3 Ordering information . . . . . . . . . . . . . . . . . . . . .3 Memory organization . . . . . . . . . . . . . . . . . . . . .6 Unique identifier . . . . . . . . . . . . . . . . . . . . . . . . .6 Table 5. Table 6. Table 7. Limiting values (Wafer)[1][2] . . . . . . . . . . . . . . . . 7 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 15. Figures Fig 1. Block diagram of ICODE SLIX . . . . . . . . . . . . . . . .4 SL2S2002_SL2S2102_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product short data sheet PUBLIC Rev. 3.2 — 10 January 2011 198332 12 of 13 NXP Semiconductors SL2S2002; SL2S2102 ICODE SLIX 16. Contents 1 1.1 1.2 1.3 2 2.1 2.2 2.3 3 4 5 6 7 7.1 7.2 7.2.1 8 9 10 11 12 12.1 12.2 12.3 12.4 13 14 15 16 General description . . . . . . . . . . . . . . . . . . . . . . 1 Contactless energy and data transfer. . . . . . . . 1 Anticollision. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Security and privacy aspects . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 2 ICODE SLIX RF interface (ISO/IEC 15693) . . . 2 EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Security. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Quick reference data . . . . . . . . . . . . . . . . . . . . . 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 Block description . . . . . . . . . . . . . . . . . . . . . . . 5 Memory organization . . . . . . . . . . . . . . . . . . . . 5 Unique identifier . . . . . . . . . . . . . . . . . . . . . . . . 6 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information. . . . . . . . . . . . . . . . . . . . . 11 Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 10 January 2011 198332