SSL2108 series
GreenChip drivers for LED lighting
Rev. 4 — 8 May 2012
Product data sheet
1. General description
The SSL2108 series is a range of high-voltage Integrated Circuits (ICs) for driving LED
lamps in general lighting applications.
The main benefits of the product family are:
•
•
•
•
Small Printed-Circuit Board (PCB) footprint, and compact solution
High efficiency (up to 95 %)
Ease of integration
Low electronic Bill Of Material (BOM)
The product family is made of ICs with a range of internal HV switches for easy power
scaling.
The ICs work as boundary conduction mode converters, typically in buck configuration.
The IC range has been designed to start up directly from the HV supply by an internal
high-voltage current source. Thereafter, the dV/dt supply is used with capacitive coupling
from the drain, or any other auxiliary supply. This functionality provides full flexibility in the
application design. The IC consumes 1.3 mA of supply current with an internal clamp
limiting the supply voltage.
The ICs provide accurate output current control with LED current accuracy within 5 %.
The ICs can be operated using Pulse-Width Modulation (PWM) dimming and has many
protection features including easy LED temperature feedback.
Remark: This data sheet covers the both the T and AT versions of the SSL21081,
SSL21082, SSL21083 and SSL21084. Unless the version is explicitly stated, SSL2108XT
refers to all T versions.
2. Features and benefits
LED driver IC family driving strings of LEDs from a rectified mains supply
High-efficiency switch mode buck driver product family:
Drivers with integrated 300 V (DC) (SSL21081 and SSL21082) or 600 V (DC)
(SSL21083 and SSL21084) power switches
Controller with power-efficient boundary conduction mode of operation with:
No reverse recovery losses in freewheel diode
Zero Current Switching (ZCS) for turn-on of switch
Zero voltage or valley switching for turn-on of switch
Minimal required inductance value and size
SSL2108 series
NXP Semiconductors
GreenChip drivers for LED lighting
Direct PWM dimming possible
Fast transient response through cycle-by-cycle current control:
Negligible AC mains ripple at LED current and minimal total capacitor value
No over or undershoots in the LED current
No binning on LED forward voltage required
Internal Protections:
UnderVoltage LockOut (UVLO)
Leading-Edge Blanking (LEB)
OverCurrent Protection (OCP)
Short-Winding Protection (SWP) SSL2108XT only
Internal OverTemperature Protection (OTP)
Brownout protection
Output Short Protection (OSP)
Low component count (see Figure 4) LED driver solution:
No Schottky diode required due to ZCS
No dim switch and high-side driver required for PWM dimming
Easy external temperature protection with a single NTC resistor
Option for soft-start function
Compatible with wall switches with built-in indication light during standby1
IC lifetime easily matches or surpasses LED lamp lifetime
3. Applications
SSL2108 series products are intended for compact LED lighting applications with
accurate fixed current output for single mains input voltages. Mains input voltages include
100 V (AC), 120 V (AC) and 230 V (AC). The output signal can be modulated using a
PWM signal.
1.
The Hotaru switch is a well known wall switch with built-in light
SSL2108_SER
Product data sheet
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© NXP B.V. 2012. All rights reserved.
2 of 23
SSL2108 series
NXP Semiconductors
GreenChip drivers for LED lighting
4. Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
Conditions
[1]
Min
Typ
Max
Unit
8
-
14
V
VCC
supply voltage
operating range
RDSon
drain-source on-state
resistance
SSL21083T/AT;
SSL21084T/AT;
Tj = 25 C
4
5
6
SSL21083T/AT;
SSL21084T/AT;
Tj = 125 C
6
7.5
9
SSL21081T/AT;
SSL21082T/AT;
Tj = 25 C
2.05
2.3
2.55
SSL21081T/AT;
SSL21082T/AT;
Tj = 125 C
3.05
3.45
3.85
-
-
200
kHz
SSL21083T/AT;
SSL21084T/AT
1
-
1
A
SSL21081T/AT;
SSL21082T/AT
2
-
2
A
SSL21083T/AT;
SSL21084T/AT
0.4
-
600
V
SSL21081T/AT;
SSL21082T/AT
0.4
-
300
V
fconv
conversion frequency
IDRAIN
current on pin DRAIN
voltage on pin DRAIN
VDRAIN
[1]
The maximum operating voltage at VCC can exceed 14 V when determined by the IC using the DVDT
supply.
5. Ordering information
Table 2.
Ordering information
Type number
SSL21081T
Package
Name
Description
Version
SO8
plastic small package outline body; 8 leads; body width
3.9 mm
SOT96-1
SO12
plastic small package outline body; 12 leads; body width SOT1196-1
3.9 mm
SSL21083T
SSL21081AT
SSL21083AT
SSL21082T
SSL21084T
SSL21082AT
SSL21084AT
SSL2108_SER
Product data sheet
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SSL2108 series
NXP Semiconductors
GreenChip drivers for LED lighting
5.1 Ordering options
Remark: All voltages are in V (AC) unless otherwise specified.
Table 3.
Ordering options
SSL2108 series
variants
Input voltage
Internal MOSFET Package
characteristics
Brownout
protection
selectable
SSL21081T
100 V; 120 V
300 V (DC); 2
SO8
no
SO12
yes
SO8
no
SO12
yes
SSL21081AT
SSL21082T
SSL21082AT
SSL21083T
100 V; 120 V;
230 V
SSL21083AT
600 V (DC); 5
SSL21084T
SSL21084AT
[1]
The SO12 package variants have more so called fused leads than the SO8 variants and can be used when
higher output power is required.
6. Block diagram
HV
VCC
1 (1)
3 (4)
JFET
SUPPLY:
INTERNAL
REGULATOR
AND
BANDGAP
dV/dT
SUPPLY
5 (9)
VALLEY
DETECTION
8 (12)
DVDT
DRAIN
LOGIC
TOFFMAX
(8)
NTC
4 (5)
NTC
FUNCTION
THERMAL
SHUTDOWN
TONMAX
TONMAX
LOGIC
CONTROL
AND
PROTECTION
BLANK
2 (3)
SOURCE
POR
1.5 V
GND
6, 7
(2, 6, 7, 10, 11)
0.5 V < >0.25 V
001aan694
Fig 1.
SSL2108_SER
Product data sheet
SSL2108 series block diagram
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4 of 23
SSL2108 series
NXP Semiconductors
GreenChip drivers for LED lighting
7. Pinning information
7.1 Pinning
HV
1
8
DRAIN
SOURCE
2
7
GND
VCC
3
6
GND
NTC
4
5
DVDT
SSL2108X
HV
1
12 DRAIN
GND
2
11 GND
SOURCE
3
VCC
4
9
DVDT
NTC
5
8
TONMAX
GND
6
7
GND
001aan702
SSL2108X
10 GND
001aan703
Fig 2.
Pin configuration for SSL2108
series (SO8)
Fig 3.
Pin configuration for SSL2108
series (SO12)
7.2 Pin description
SSL2108_SER
Product data sheet
Table 4.
Pin description
Symbol
Pin (SO8)
Pin (SO12)
Description
HV
1
1
high-voltage supply pin
SOURCE
2
3
low-side internal switch
VCC
3
4
supply voltage
NTC
4
5
LED temperature protection input
GND
6,7
2,6,7,10,11
ground
DVDT
5
9
AC supply pin
TONMAX
-
8
brownout protection timer input
DRAIN
8
12
high-side internal switch
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5 of 23
SSL2108 series
NXP Semiconductors
GreenChip drivers for LED lighting
8. Functional description
8.1 Converter operation
The converter in the SSL2108 series is a Boundary Conduction Mode (BCM), peak
current controlled system. For the basic application diagram see Figure 4, for the
waveforms see Figure 5. This converter type operates at the boundary between
continuous and discontinuous mode. Energy is stored in inductor L each period that the
switch is on. The inductor current IL is zero when the internal MOSFET switch is switched
on. Thereafter, the amplitude of the current build-up in L is proportional to VIN VOUT and
the time that the internal MOSFET switch is on. When the internal MOSFET switch is
switched off, the current continues to flow through the freewheel diode and the output
capacitor. The current then falls at a rate proportional to the value of VOUT. The LED
current ILED is almost equal to half the peak switch current. A new cycle is started, as soon
as the inductor current IL is zero.
Rinrush
Vsec
LEDs
L
DVDT
HV
VCC
DRAIN
8
5
1
SSL2108X
3
6, 7
GND
4
NTC
NTC
2
SOURCE
Rsense
001aan693
Fig 4.
Basic application diagram SSL2108 series (SO8 variant)
8.2 Conversion frequency
The conversion frequency must be limited to below 200 kHz. Therefore, select an
inductance value so that the conversion frequency is always within limits, given the supply
voltage, LED voltage and component spread.
8.3 Valley detection
A new cycle is started when the primary switch is switched on (see Figure 5). Following
time t1, when the peak current is detected on the SOURCE pin, the switch is turned off
and the secondary stroke starts (3). When the secondary stroke is complete and the coil
current at t3 equals zero, the drain voltage starts to oscillate around the VIN VOUT level.
The amplitude equals VOUT. A special feature, called valley detection is an integrated part
of the SSL2108 series circuitry. Dedicated built-in circuitry connected to the DRAIN pin,
senses when the voltage on the drain of the switch has reached its lowest value. The next
cycle is then started and as a result the capacitive switching losses are reduced.
SSL2108_SER
Product data sheet
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SSL2108 series
NXP Semiconductors
GreenChip drivers for LED lighting
A valley is detected and accepted if both the frequency of the oscillations and the voltage
swing are within the range specified (fring and ∆Vvrec(min)) for detection. If a valid valley is
not detected, the secondary stroke is continued until the maximum off-time (toff(high)) is
reached, then the next cycle is started.
VGATE
internal MOSFET switch
VOUT
VD
VIN
valley
0
demagnetization
magnetization
IL
0
2
1
t0
t1
3
t2
4
t3
t00
T
001aan699
Fig 5.
Buck waveforms and valley detection
8.4 Protective features
The IC has the following protective features:
•
•
•
•
•
•
•
•
UnderVoltage LockOut (UVLO)
Leading-Edge Blanking (LEB)
OverCurrent Protection (OCP)
Internal OverTemperature Protection (OTP)
Brownout protection
Short-Winding Protection (SWP) SSL2108XT only
Output Short Protection (OSP)
LED overtemperature control and protection
The SWP and the OSP are latched protections. These protections cause the IC to halt
until a reset (a result of power cycling) is executed. When VCC drops lower than VCC(rst),
the IC resets the latch protection mode. The internal OTP and LED over temperature
protections are safe-restart protections. The IC halts, causing VCC to fall lower than
VCC(stop), and instigates start-up. Switching starts only when no fault condition exists.
SSL2108_SER
Product data sheet
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Rev. 4 — 8 May 2012
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7 of 23
SSL2108 series
NXP Semiconductors
GreenChip drivers for LED lighting
8.4.1 UnderVoltage LockOut (UVLO)
When the voltage on the VCC pin drops lower than VCC(stop), the IC stops switching. An
attempt is then made to restart by supplying VCC from the HV pin voltage.
8.4.2 Leading-Edge Blanking (LEB)
To prevent false detection of the short-winding or overcurrent, a blanking time following
switch-on is implemented. When the internal MOSFET switch turns on there can be a
short current spike due to capacitive discharge of voltage over the drain and source.
During the LEB time (tleb), the spike is disregarded.
8.4.3 OverCurrent Protection (OCP)
The SSL2108 series contains a highly accurate peak current detector. It triggers when the
voltage at the SOURCE pin reaches the peak-level Vth(ocp)SOURCE. The current through
the switch is sensed using a resistor connected to the SOURCE pin. The sense circuit is
activated following LEB time tleb. As the LED current is half the peak current (by design), it
automatically provides protection for maximum LED current during operation. There is a
propagation delay between overcurrent detection and the actual closure of the switch
td(ocp-swoff). Due to the delay, the actual peak current is slightly higher than the OCP level
set by the resistor in series to the SOURCE pin.
8.4.4 OverTemperature Protection (OTP)
When the internal OTP function is triggered at a certain IC temperature (Tth(act)otp), the
converter stops operating. The safe-restart protection is triggered and the IC restarts
again with switching resuming when the IC temperature drops lower than Tth(rel)otp.
8.4.5 Brownout protection
Brownout protection is designed to limit the lamp power when the input voltage drops
close to the output voltage level. Since the input power has to remain constant, the input
current would otherwise increase to a level that is too large for the input circuitry. For the
SSL2108 series, there is a maximum limit on the on-time of the switch ton(high). The rate of
current rise in the coil during the on-phase is proportional to the difference between input
voltage and output voltage. Therefore, the peak current cannot be reached before ton(high)
and as a result the average output current to the LEDs is reduced.
Using the SO12 package, the ton(high) can be lowered by connecting a capacitor to the
TONMAX pin. The external capacitor is charged during the primary stroke with ITONMAX. If
VTONMAX level is reached before the ton(high) time, the switch is turned off and the
secondary stroke starts. When no capacitor is connected to the pin, VTONMAX is reached
quickly, shorter than the minimum limit of one microsecond. In this case, or in case the
TONMAX pin is grounded, the internal time constant, ton(high) determines the maximum
on-time.
8.4.6 Short-Winding Protection (SWP) SSL2108XT only
SWP activates if there is a steep rising current through the MOSFET and thus through the
external resistor connected to the SOURCE pin. This current can occur when there is a
short from the freewheel diode. Additionally, it occurs due to a small/shorted inductor
between the input voltage and the DRAIN pin. If the voltage on the SOURCE pin is greater
than 1.5 V, latched protection is triggered following LEB time tleb. In addition, if VCC drops
lower than VCC(rst) the IC resets the latched protection mode.
SSL2108_SER
Product data sheet
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8 of 23
SSL2108 series
NXP Semiconductors
GreenChip drivers for LED lighting
8.4.7 Output Short Protection (OSP)
During the second stroke (switch-of time), if a valley is not detected within the off-time limit
(toff(high)), then typically the output voltage is less than the minimum limit allowed in the
application. This condition can occur either during starting up or due to a short. A timer is
started when toff(high) is detected, and is stopped only if a valid valley-detection occurs in
one of the subsequent cycles. If no valley is detected for tdet(sc), it is concluded that a real
short-circuit exists and not start-up. The IC enters latched protection. If VCC drops lower
than VCC(rst), the IC resets the latched protection mode. During PWM dimming, the OSP
timer is paused during the off-cycle of the PWM signal.
8.5 VCC supply
The SSL2108 series can be supplied using three methods:
• Under normal operation, the voltage swing on the DVDT pin is rectified within the IC
providing current towards the VCC pin
• At start-up, there is an internal current source connected to the HV pin. The current
source provides internal power until either the dV/dt supply or an external current on
the VCC pin provides the supply
• An external voltage source can be connected to the VCC pin
The IC starts up when the voltage at the VCC pin is higher than VCC(startup). The IC locks
out (stops switching) when the voltage at the VCC pin is lower than VCC(stop). The
hysteresis between the start and stop levels allows the IC to be supplied by a buffer
capacitor until the dV/dt supply is settled. The SSL2108 series has an internal VCC clamp,
which is an internal active Zener (or shunt regulator). This internal active Zener limits the
voltage on the supply VCC pin to the maximum value of VCC. If the maximum current of
the dV/dt supply minus the current consumption of the IC (determined by the load on the
gate drivers), is lower than the maximum value of IDD no external Zener diode is needed in
the dV/dt supply circuit.
8.6 DVDT supply
The DVDT pin is connected to an internal single-sided rectification stage. When an
alternating voltage with sufficient amplitude is supplied to the pin, the IC can be powered
without any other external power connection. This solution provides an effective method
to prevent the additional high-power losses, which would result if a regulator were used for
continuously powering the IC. Unlike an auxiliary supply, additional inductor windings are
not needed.
8.7 VCC regulator
During supply dips, the input voltage can drop too low to supply the required IC current
through the DVDT pin. Under these conditions, if the VCC voltage drops lower than
VCC(swon)reg level, another regulator with a current capability of up to Isup(high)HV is started.
The job of the regulator is to fill in the required supply current, which the DVDT supply
does not deliver, thus preventing the IC going into UVLO. When the VCC voltage is higher
than VCC(swon)reg level, the regulator is turned off.
SSL2108_SER
Product data sheet
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SSL2108 series
NXP Semiconductors
GreenChip drivers for LED lighting
8.8 NTC functionality and PWM dimming
The NTC pin can be used as a control method for LED thermal protection. Alternatively,
the pin can be used as an input to disable/enable light output using a digital signal (PWM
dimming). The pin has an internal current source that generates the current of Ioffset(NTC).
An NTC resistor to monitor the LED temperature can be directly connected to the NTC
pin. Depending on the resistance value and the corresponding voltage on the NTC pin,
the converter reacts as shown in Figure 6.
Peak current
Fig 6.
1
2
3
4
Vth(high)NTC
Vth(ocp)SOURCE = 250 mV
Vth(low)NTC
Ipk / 2
Vact(tmr)NTC
Vth(ocp)SOURCE = 500 mV
Vdeact(tmr)NTC
Ipk
5
VNTC
001aan700
NTC control curve
When the voltage on the NTC pin is higher than Vth(high)NTC see Figure 6 (4), the converter
delivers nominal output current. When the voltage is lower than this level, the peak current
is gradually reduced until Vth(low)NTC is reached, see Figure 6 (3). The peak current is now
half the peak current of nominal operation. When Vact(tmr)NTC is passed, see Figure 6 (2) a
timer starts to run to distinguish between the following situations:
• If the low-level Vdeact(tmr)NTC is not reached within time tto(deact)NTC, Figure 6 (1) LED
overtemperature is detected. The IC stops switching and attempts to restart from the
HV pin voltage. Restart takes place when the voltage on NTC pin is higher than
Vth(high)NTC, see Figure 6 (4). It is assumed that the reduction in peak current did not
result in a lower NTC temperature and LED OTP is activated.
• If the low-level Vdeact(tmr)NTC is reached within the time tto(deact)NTC, Figure 6 (1) it is
assumed that the pin is pulled down externally. The restart function is not triggered.
Instead, the output current is reduced to zero. PWM dimming can be implemented this
way. The output current rises again when the voltage is higher than Vdeact(tmr)NTC.
8.8.1 Soft-start function
The NTC pin can be used to make a soft start function. During switch-on, the level on the
NTC pin is low. By connecting a capacitor (in parallel with the NTC resistor), a time
constant can be defined. The time constant causes the level on the NTC pin to increase
slowly. When passing level Vth(low)NTC Figure 6 (3), the convertor starts with half of the
maximum current. The output current slowly increases to maximum when Vth(high)NTC
Figure 6 (4) is reached.
SSL2108_SER
Product data sheet
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SSL2108 series
NXP Semiconductors
GreenChip drivers for LED lighting
8.9 Heat sink
For SSL2108 series applications, the copper of the PCB acts as the heat sink. The
SSL2108 series (SO12) uses thermal leads (pins 2, 6, 10 and 11) for enhanced heat
transfer from die to the PCB copper heat sink. The thermal lead connection can drastically
reduce thermal resistance.
Equation 1 shows the relation between the maximum allowable power dissipation P and
the thermal resistance from junction to ambient.
R th j – a = T j max – T amb P
(1)
Where:
Rth(j-a) = thermal resistance from junction to ambient
Tj(max) = maximum junction temperature
Tamb = ambient temperature
P = power dissipation
SSL2108_SER
Product data sheet
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SSL2108 series
NXP Semiconductors
GreenChip drivers for LED lighting
9. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
on pin DRAIN
5
+5
V/ns
-
200
kHz
SO8 package
-
0.6
W
SO12 package
-
1
W
General
SR
slew rate
fconv
conversion frequency
Ptot
total power dissipation
Tamb
ambient temperature
40
+125
C
Tj
junction temperature
40
+150
C
Tstg
storage temperature
55
+150
C
Voltages
VCC
supply voltage
continuous
0.4
+14
V
VDRAIN
voltage on pin DRAIN
600 V (DC) version
0.4
+600
V
300 V (DC) version
0.4
+300
V
[1]
VHV
voltage on pin HV
current limited
0.4
+600
V
VSOURCE
voltage on pin SOURCE
current limited
0.4
+5.2
V
VNTC
voltage on pin NTC
current limited
0.4
+5.2
V
VTONMAX
voltage on pin TONMAX
current limited
0.4
+5.2
V
IDD
supply current
at pin VCC
-
20
mA
IDRAIN
current on pin DRAIN
600 V (DC) version
1
+1
A
300 V (DC) version
2
+2
A
600 V (DC) version
1
+1
A
Currents
[1]
ISOURCE
current on pin SOURCE
300 V (DC) version
2
+2
A
IDVDT
current on pin DVDT
duration 20 s
maximum
-
1.3
A
VESD
electrostatic discharge
voltage
human body model;
(for all pins except
DRAIN and HV)
2
+2
KV
1
+1
KV
500
+500
V
[2]
human body model
for DRAIN and HV
charged device
SSL2108_SER
Product data sheet
[3]
[1]
An internal clamp sets the supply voltage and current limits.
[2]
Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.
[3]
Charged device model: equivalent to charging the IC up to 1 kV and the subsequent discharging of each
pin down to 0 V over a 1 resistor.
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SSL2108 series
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GreenChip drivers for LED lighting
10. Thermal characteristics
Table 6.
Thermal characteristics
Symbol Parameter
Rth(j-a)
j-top
thermal resistance from junction to ambient
thermal resistance from junction to top
Conditions
Typ
Unit
in free air; SO8 package, PCB: 2 cm 3 cm,
2-layer, 35 m Cu per layer
142
K/W
in free air; SO12 package; PCB: 2 cm 3 cm,
2-layer, 35 m Cu per layer
121
K/W
in free air; SO8 package; PCB: JEDEC 2s2p
72
K/W
in free air; SO12 package; PCB: JEDEC 2s2p
53
K/W
top package temperature measured at the
warmest point on top of the case; SO8 package
3.4
K/W
top package temperature measured at the
warmest point on top of the case; SO12
package
4.7
K/W
11. Characteristics
Table 7.
Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
leakage current on pin DRAIN
VDRAIN = 600 V (DC)
-
-
10
A
VDRAIN = 300 V (DC)
-
-
10
A
VHV = 600 V (DC)
-
-
30
A
VHV = 300 V (DC)
-
-
30
A
8
-
14
V
High-voltage
Ileak(DRAIN)
Ileak(HV)
leakage current on pin HV
Supply
VCC
supply voltage
operating range
[1]
VCC(startup)
start-up supply voltage
11
12
13
V
VCC(stop)
stop supply voltage
8
9
10
V
VCC(hys)
hysteresis of supply voltage
2
-
-
V
VCC(rst)
reset supply voltage
4.5
5
5.5
V
VCC(swon)reg
regulator switch-on supply
voltage
insufficient dV/dt supply
8.75
9.25
9.75
V
VCC(swoff)reg
regulator switch-off supply
voltage
insufficient dV/dt supply
9.5
10
10.5
V
VCC(reg)hys
regulator supply voltage
hysteresis
VCC(swoff)reg VCC(swon)reg
0.3
-
-
V
VCC(swon)reg VCC(stop)
0.3
-
-
V
VCC(regswon-stop) supply voltage difference
between regulator switch-on and
stop
between VCC(startup) and VCC(stop)
Consumption
Istb(HV)
standby current on pin HV
during start-up or in protection;
VHV = 100 V
300
350
400
A
ICC
supply current
normal operation
-
1.3
-
mA
SSL2108_SER
Product data sheet
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SSL2108 series
NXP Semiconductors
GreenChip drivers for LED lighting
Table 7.
Characteristics …continued
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
high supply current on pin HV
Standby: VHV = 40 V;
VCC < VCC(stop)
1
1.3
1.6
mA
Regulator On: VHV = 40 V;
VCC < VCC(swon)reg after start-up
2
2.3
2.6
mA
Capability
Isup(high)HV
Current and SWP
Vth(ocp)SOURCE
overcurrent protection threshold
voltage on pin SOURCE
V/t = 0.1 V/s
480
500
520
mV
V/t = 0.1 V/s; VNTC = 0.325 V
230
250
270
mV
td(ocp-swoff)
delay time from overcurrent
protection to switch-off
V/t = 0.1 V/s
-
75
100
ns
tleb
leading edge blanking time
overcurrent protection
260
300
340
ns
short-winding protection
210
250
290
ns
tleb
leading edge blanking time
difference
between tleb for overcurrent
protection and short-winding
protection
30
50
-
ns
Vth(swp)SOURCE
short-winding protection
threshold voltage on pin
SOURCE
SSL2108XT only
1.4
1.5
1.6
V
30
20
10
V/s
200
550
1000
kHz
15
20
25
V
-
100
-
ns
Valley detection
(V/t)vrec
valley recognition voltage change on pin DRAIN
with time
fring
ringing frequency
Vvrec(min)
minimum valley recognition
voltage difference
td(vrec-swon)
valley recognition to switch-on
delay time
[2]
voltage drop on pin DRAIN
Brownout detection
Vth(TONMAX)
threshold voltage on pin
TONMAX
3.75
4
4.25
V
Ioffset(TONMAX)
offset current on pin TONMAX
37
43
48
A
ton(high)
high on-time
12.5
15
17.5
s
breakdown voltage on pin DRAIN 600 V (DC) version; Tj > 0 C
600
-
-
V
300 V (DC) version; Tj > 0 C
300
-
-
V
600 V (DC) version; Tj = 25 C
4
5
6
MOSFET output stage
VBR(DRAIN)
RDSon
drain-source on-state resistance
600 V (DC) version; Tj = 125 C
6
7.5
9
300 V (DC) version; Tj = 25 C
2.05
2.3
2.55
3.05
3.45
3.85
-
1.2
-
V/ns
-
1.5
-
V/ns
300 V (DC) version; Tj = 125 C
dV/dt)f(DRAIN)
fall rate of change of voltage on
pin DRAIN
300 V (DC) version;
CDRAIN = 150 pF, RSOURCE = 2.2
600 V (DC) version;
CDRAIN = 75 pF; RSOURCE = 1.2
SSL2108_SER
Product data sheet
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Rev. 4 — 8 May 2012
[2]
© NXP B.V. 2012. All rights reserved.
14 of 23
SSL2108 series
NXP Semiconductors
GreenChip drivers for LED lighting
Table 7.
Characteristics …continued
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
0.5
0.53
V
NTC functionality
Vth(high)NTC
high threshold voltage on pin
NTC
0.47
Vth(low)NTC
low threshold voltage on pin NTC
0.325 0.35
0.375 V
Vact(tmr)NTC
timer activation voltage on pin
NTC
0.26
0.29
0.325 V
Vdeact(tmr)NTC
timer deactivation voltage on pin
NTC
0.17
0.2
0.23
V
tto(deact)NTC
deactivation time-out time on pin
NTC
33
46
59
s
Ioffset(NTC)
offset current on pin NTC
-
47
-
A
tdet(sc)
short-circuit detection time
16
20
24
ms
toff(high)
high off-time
30
36
42
s
OSP
Temperature protections
Tth(act)otp
overtemperature protection
activation threshold temperature
160
170
180
C
Tth(rel)otp
overtemperature protection
release threshold temperature
90
100
110
C
[1]
The maximum operating voltage at VCC can exceed 14 V when determined by the IC using the DVDT supply.
[2]
This parameter is not tested during production, by design it is guaranteed.
SSL2108_SER
Product data sheet
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SSL2108 series
NXP Semiconductors
GreenChip drivers for LED lighting
12. SSL2108 series buck configuration
L1
fuse
LED+
L1
10 Ω
to
mains
D1
C1
RGND
C2
C3
LED1...n
D2
D3
N
LEDL2
IC1
HV
R1
1
SOURCE
2 SSL21081 7
VCC
DRAIN
GND
C4
GND
3 SSL21083 6
NTC
C5
8
4
5
DVDT
RT1
NTC
C6
RGND
001aan696
Fig 7.
Buck configuration for SSL21081/SSL21083
L1
fuse
LED+
L1
10 Ω
to
mains
D1
C1
RGND
C2
C3
LED1...n
D3
D2
N
LEDL2
IC1
HV
GND
R1
SOURCE
VCC
NTC
C5
C6
RT1
NTC
GND
1
12
2
11
3 SSL21082 10
DRAIN
GND
GND
C4
DVDT
4 SSL21084 9
5
8
6
7
TONMAX
GND
C7
RGND
001aan697
Fig 8.
Buck configuration for SSL21082/SSL21084
Further application information can be found in the SSL2108 series application note.
SSL2108_SER
Product data sheet
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SSL2108 series
NXP Semiconductors
GreenChip drivers for LED lighting
13. Package outline
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A
X
c
y
HE
v M A
Z
5
8
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
4
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
inches
0.069
0.010 0.057
0.004 0.049
0.01
0.019 0.0100
0.014 0.0075
0.20
0.19
0.16
0.15
0.05
0.01
0.01
0.004
0.028
0.012
0.244
0.039 0.028
0.041
0.228
0.016 0.024
θ
8o
o
0
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
Fig 9.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT96-1
076E03
MS-012
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
Package outline SOT96-1 (SOT8)
SSL2108_SER
Product data sheet
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SSL2108 series
NXP Semiconductors
GreenChip drivers for LED lighting
SO12: plastic small outline package; 12 leads; body width 3.9 mm
SOT1196-1
D
E
A
X
c
HE
y
v
A
Z
12
7
A2
A
A3
A1
pin 1 index
θ
Lp
1
L
6
e1
e2
w
detail X
bp
0
1
2
Dimensions
D(1)
E(1)
max 1.75 0.25 1.45
0.49 0.25 8.75
nom
0.18 1.35 0.25 0.43 0.22 8.65
min
0.10 1.25
0.36 0.10 8.55
4.0
3.9
3.8
Unit
mm
3
4
5 mm
scale
A
A1
A2
A3
bp
c
e1
e2
2.54 1.27
HE
L
Lp
6.2
6.0
5.8
1.05
1.0
0.7
0.4
Q
v
w
0.70
0.65 0.25 0.25
0.60
y
Z(2)
θ
0.1
0.7
0.5
0.3
8°
4°
0°
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
References
Outline
version
IEC
JEDEC
JEITA
SOT1196-1
---
MS-012 Compliant
---
sot1196-1_po
European
projection
Issue date
11-02-15
11-02-16
Fig 10. Package outline SOT1196-1 (SOT12)
SSL2108_SER
Product data sheet
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Rev. 4 — 8 May 2012
© NXP B.V. 2012. All rights reserved.
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SSL2108 series
NXP Semiconductors
GreenChip drivers for LED lighting
14. Abbreviations
Table 8.
Abbreviations
Acronym
Description
BCM
Boundary Conduction Mode
BOM
Bill Of Materials
LED
Light Emitting Diode
LEB
Leading-Edge Blanking
MOSFET
Metal-Oxide Semiconductor Field-Effect Transistor
OCP
OverCurrent Protection
OSP
Output Short Protection
OTP
OverTemperature Protection
PCB
Printed-Circuit Board
PWM
Pulse-Width Modulation
SWP
Short-Winding Protection
UVLO
UnderVoltage LockOut
ZCS
Zero Current Switching
15. References
[1]
SSL2108_SER
Product data sheet
AN11040 — Drivers for LED lighting - application note
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 8 May 2012
© NXP B.V. 2012. All rights reserved.
19 of 23
SSL2108 series
NXP Semiconductors
GreenChip drivers for LED lighting
16. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
Change notice Supersedes
SSL2108_SER v.4
20120508
Product data sheet
-
Modifications:
•
•
SSL21081T_2T_3T_4T v.3.1
SSL21081AT, SSL21082AT, SSL21083AT and SSL21084AT added.
Minor text changes throughout the data sheet.
SSL21081T_2T_3T_4T v.3.1 20120222
Product data sheet
-
SSL21081T_2T_3T_4T v.3
SSL21081T_2T_3T_4T v.3
Product data sheet
-
SSL21081T_2T_3T_4T v.2
20120214
SSL21081T_2T_3T_4T v.2
20111206
Preliminary data sheet
-
SSL2108X v.1
SSL2108X v.1
20110909
Preliminary data sheet
-
-
SSL2108_SER
Product data sheet
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SSL2108 series
NXP Semiconductors
GreenChip drivers for LED lighting
17. Legal information
17.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
17.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
17.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
SSL2108_SER
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 8 May 2012
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SSL2108 series
NXP Semiconductors
GreenChip drivers for LED lighting
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
17.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
GreenChip — is a trademark of NXP B.V.
18. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
SSL2108_SER
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22 of 23
SSL2108 series
NXP Semiconductors
GreenChip drivers for LED lighting
19. Contents
1
2
3
4
5
5.1
6
7
7.1
7.2
8
8.1
8.2
8.3
8.4
8.4.1
8.4.2
8.4.3
8.4.4
8.4.5
8.4.6
8.4.7
8.5
8.6
8.7
8.8
8.8.1
8.9
9
10
11
12
13
14
15
16
17
17.1
17.2
17.3
17.4
18
19
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Quick reference data . . . . . . . . . . . . . . . . . . . . . 3
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 4
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
Functional description . . . . . . . . . . . . . . . . . . . 6
Converter operation . . . . . . . . . . . . . . . . . . . . . 6
Conversion frequency. . . . . . . . . . . . . . . . . . . . 6
Valley detection. . . . . . . . . . . . . . . . . . . . . . . . . 6
Protective features . . . . . . . . . . . . . . . . . . . . . . 7
UnderVoltage LockOut (UVLO) . . . . . . . . . . . . 8
Leading-Edge Blanking (LEB) . . . . . . . . . . . . . 8
OverCurrent Protection (OCP) . . . . . . . . . . . . . 8
OverTemperature Protection (OTP) . . . . . . . . . 8
Brownout protection . . . . . . . . . . . . . . . . . . . . . 8
Short-Winding Protection (SWP) SSL2108XT
only . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Output Short Protection (OSP) . . . . . . . . . . . . . 9
VCC supply. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
DVDT supply . . . . . . . . . . . . . . . . . . . . . . . . . . 9
VCC regulator . . . . . . . . . . . . . . . . . . . . . . . . . . 9
NTC functionality and PWM dimming . . . . . . . 10
Soft-start function . . . . . . . . . . . . . . . . . . . . . . 10
Heat sink. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 12
Thermal characteristics . . . . . . . . . . . . . . . . . 13
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 13
SSL2108 series buck configuration . . . . . . . . 16
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 17
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 19
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 20
Legal information. . . . . . . . . . . . . . . . . . . . . . . 21
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 21
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Contact information. . . . . . . . . . . . . . . . . . . . . 22
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 8 May 2012
Document identifier: SSL2108_SER