SSL5237TE/1Y

SSL5237TE Mains dimmable buck-boost LED driver IC 10 Ohm/700 V Rev. 1 — 13 March 2015 Product data sheet 1. General description The SSL5237TE is a highly integrated, high-precision buck-boost controller with an internal MOSFET. It is intended to drive low-cost compact dimmable LED lamps up to 10 W. The SSL5237TE is designed to achieve high power factor, phase-dimmable applications. The SSL5237TE operates in Boundary Conduction Mode (BCM) with constant on-time control. It regulates a constant output current over line and load variations. The wide switching frequency range makes it possible to choose an inductor, which enables the optimization of inductor size, efficiency and EMI. The SSL5237TE can start up and operate in switching mode directly from line using an external resistor without auxiliary supply. To provide a low-cost driver design, an off-the-shelf inductor can be used, which provides flexibility in application design. 2. Features and benefits          Integrated MOSFET (10 /700 V) Supports most available dimming solutions Deep dimming level Flicker-free dimming Low component count ensuring a compact solution and small, single layer Printed-Circuit Board (PCB) footprint Excellent line regulation and load regulation and good LED output current accuracy Efficient BCM operation with:  Minimal recovery losses in freewheel diode  Zero Current Switching (ZCS) and Valley switching for turn-on of switch  Minimum inductance value and size required  High efficiency (up to 88 %)  Ultra low IC current during operation (< 165 A) Auto-recovery protections:  UnderVoltage LockOut (UVLO)  Cycle-by-cycle OverCurrent Protection (OCP)  Internal OverTemperature Protection (OTP)  Output OverVoltage Protection (OVP)  Output Short Protection (OSP) Extended IC lifetime SSL5237TE NXP Semiconductors Mains dimmable buck-boost LED driver IC 10 Ohm/700 V 3. Applications  The SSL5237TE is intended for low-cost, non-isolated dimmable lighting applications that work from single mains voltage. 4. Quick reference data Table 1. Quick reference data Symbol Parameter Conditions VCC supply voltage operating range RDSon on-state resistance II(DRAIN) = 200 mA II(DRAIN) input current on pin DRAIN duty cycle = 25 % VI(DRAIN) input voltage on pin DRAIN [1] Min Typ Max Unit 9.9 - 16 V Tj = 25 C - 11.7 -  Tj = 125 C - 17.8 -  0.8 - +0.8 A 0.4 - +700 V [1] An internal clamp sets the supply voltage. The current into the VCC pin must not exceed the maximum IVCC value (see Table 4). 5. Ordering information Table 2. Ordering information Type number SSL5237TE SSL5237TE Product data sheet Package Name Description Version HSO8 plastic thermal enhanced small outline package; 8 leads; body width 3.9 mm; exposed die pad SOT786-1 All information provided in this document is subject to legal disclaimers. Rev. 1 — 13 March 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 2 of 18 SSL5237TE NXP Semiconductors Mains dimmable buck-boost LED driver IC 10 Ohm/700 V 6. Block diagram  '5$,1  *$7(  9&& 9$//(< '(7(&7,21  '(0293 6833/ Vstartup. 8.8.2 Cycle-by-cycle OverCurrent Protection (OCP) The SSL5237TE contains a built-in peak current detector. It triggers when the voltage at the ISNS pin reaches the peak level VI(max)ISNS. A resistor connected to the ISNS pin senses the current through the inductor IL. The maximum current in inductor IL(max) can be calculated with Equation 3: V I  max ISNS I L  max  = ----------------------------------------------R4 + R bond   swon (3) Where: • Rbond is the ISNS bond wire resistance • swon is the switch-on duty cycle The sense circuit is activated after the LEB time (tleb). It automatically provides protection for maximum LED current during operation. A propagation delay exists between overcurrent detection and the actual source-switch switch-off. Due to this delay, the actual peak current is slightly higher than the OCP level set by the resistor in series with the ISNS pin. 8.8.3 OverTemperature Protection (OTP) When the internal OTP function is triggered at IC junction temperature Tpl(IC), the converter stops switching. The IC resumes switching when the IC temperature drops to below Tpl(IC)rst. 8.8.4 Cycle-by-cycle maximum on-time protection Measuring the inductor current IL using sense resistor Rsense regulates the on-time. The on-time is limited to a fixed value (ton(max)). It protects the system and the IC when the ISNS pin is shorted or the system works at very low mains. 8.8.5 Output OverVoltage Protection (OVP) Measuring the voltage at the DEMOVP pin during the secondary stroke gives an accurate output OVP. The resistive divider connected between the LEDP node and the DEMOVP pin sets the maximum LED voltage. SSL5237TE Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 13 March 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 8 of 18 SSL5237TE NXP Semiconductors Mains dimmable buck-boost LED driver IC 10 Ohm/700 V An internal counter prevents false OVP detection because of noise on the DEMOVP pin. After three continuous cycles with a DEMOVP pin voltage exceeding the OVP level, OVP is triggered. OVP triggers a restart sequence: A discharge current (ICC(dch)) is enabled and discharges VCC to below Vrst(latch). When Vrst(latch) is reached, the system restarts. 8.8.6 Output Short Protection (OSP) The converter operates in Discontinuous Conduction Mode (DCM). A new cycle is only started after the previous cycle has ended. Measuring the voltage on the DEMOVP pin detects the end of the cycle. When the DEMOVP pin voltage drops to below the demagnetization level (Vdet(demag)) and a valley is detected, a new cycle starts. The converter regulates the adjusted output current and the on-time is reduced to a safe value by this feedback. The reduced on-time in combination with a very long demagnetization period prevents the converter from any damage or excessive dissipation. To prevent false demagnetization detection, a blanking time (tsup(xfmr_ring)) is implemented at the start of the secondary stroke. 8.9 Supply management The IC starts up when the voltage at the VCC pin exceeds Vstartup. The IC locks out (stops switching) when the voltage at the VCC pin drops to below Vth(UVLO). The hysteresis between the start and stop levels allows the VCC capacitor to supply the IC during zero-crossings of the mains. The SSL5237TE incorporates an internal VCC clamping circuit. The clamp limits the voltage on the VCC supply pin to the maximum value Vclamp(VCC). If the maximum current of the external resistor minus the current consumption of the IC is lower than the limiting value of IVCC in Table 4, no external Zener diode is required. SSL5237TE Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 13 March 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 9 of 18 SSL5237TE NXP Semiconductors Mains dimmable buck-boost LED driver IC 10 Ohm/700 V 9. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VCC supply voltage current limited [1][2] VGATE gate voltage 0.4 18 V current limited [1][2] 0.4 18 V VI(DRAIN) input voltage on pin DRAIN current limited [1][2] 0.4 +700 V VI(ISNS) input voltage on pin ISNS 0.4 +5 V VIO(COMP) input/output voltage on pin COMP 0.4 +5.3 V 6 +6 V input voltage on pin DIM 0.4 +5 V II(VCC) input current on pin VCC - +8.8 mA II(DRAIN) input current on pin DRAIN RMS current; maximum average current = 100 mA; duty cycle < 25 % - 210 mA duty cycle < 25 % 0.8 +0.8 A input current on pin ISNS duty cycle< 25 % 0.8 +0.8 A Ptot total power dissipation Tamb < 75 C - 0.9 W Tstg storage temperature 55 +150 C Tj junction temperature 40 +160 C Voltages VI(DEMOVP) input voltage on pin DEMOVP VI(DIM) Currents II(ISNS) General ESD VESD SSL5237TE Product data sheet electrostatic discharge voltage class 1 human body model [3] 2000 +2000 V charged device model [4] 500 +500 V [1] The current into the VCC pin must not exceed the maximum IVCC value. [2] An internal clamp sets the supply voltage and current limits. [3] Equivalent to discharge a 100 pF capacitor through a 1.5 k series resistor. [4] Charged device model: equivalent to charging the IC up to 1 kV and the subsequent discharging of each pin down to 0 V over a 1  resistor. All information provided in this document is subject to legal disclaimers. Rev. 1 — 13 March 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 10 of 18 SSL5237TE NXP Semiconductors Mains dimmable buck-boost LED driver IC 10 Ohm/700 V 10. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Typ Unit Rth(j-a) thermal resistance from junction to ambient in free air; HSO8 package; PCB: 2 cm  3 cm; 35 m copper (Cu)/layer; copper for IC: 6.6 cm 117 K/W in free air; HSO8 package; PCB: JEDEC 2s2p 49 K/W 4 K/W j-top thermal characterization top package temperature parameter from junction to measured at the warmest top of package point on top of the case; HSO8 package 11. Characteristics Table 6. Characteristics Tamb = 25 C; VCC = 15 V; all voltages are measured with respect to ground pin (pin 7); currents are positive when flowing into the IC; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Supply (pin VCC) Vstartup start-up voltage 14.45 14.9 15.35 V Vth(UVLO) undervoltage lockout threshold voltage 9.6 9.9 10.2 V VVCC voltage difference on pin VCC 0.17 0.30 0.43 V 15.2 15.8 16.4 V 5.8 6.2 6.6 V 125 145 165 A 120 145 170 A 3.7 - - mA Vclamp(VCC) clamp voltage on pin VCC Vrst(latch) latched reset voltage ICC(oper) operating supply current ICC(startup) start-up supply current ICC(dch) discharge supply current II(VCC) = 2.6 mA switching at 100 kHz VCC = Vrst(latch) [1] Loop compensation (pin COMP) Vton(zero) zero on-time voltage 1.9 2.0 2.1 V Vton(max) maximum on-time voltage 3.8 4.0 4.2 V Vclamp(COMP) clamp voltage on pin COMP 4.3 4.7 5.1 V ton(max) maximum on-time VIO(COMP) = 4 V 12.3 15.5 18.7 s IO(COMP) output current on pin COMP VI(ISNS) = 0 V; VI(DIM) > 2 V 2.4 3.0 3.6 A Idch(COMP) Discharge current on pin COMP VI(DIM) = 0 V 350 550 750 nA 250 180 50 nA Valley detection and overvoltage detection (pin DEMOVP) Iprot(DEMOVP) protection current on pin DEMOVP Vth(ovp) overvoltage protection threshold voltage 1.74 1.81 1.88 V Ncy(ovp) number of overvoltage protection cycles - 3 - - SSL5237TE Product data sheet open current; VI(DEMOVP) = 0 V All information provided in this document is subject to legal disclaimers. Rev. 1 — 13 March 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 11 of 18 SSL5237TE NXP Semiconductors Mains dimmable buck-boost LED driver IC 10 Ohm/700 V Table 6. Characteristics …continued Tamb = 25 C; VCC = 15 V; all voltages are measured with respect to ground pin (pin 7); currents are positive when flowing into the IC; unless otherwise specified. Symbol Parameter Conditions [2] Min Typ Max Unit - 3.8 - V/s (dV/dt)vrec valley recognition voltage change with time Vdet(demag) demagnetization detection voltage 4 18 32 mV tsup(xfmr_ring) transformer ringing suppression time 1.2 1.5 1.8 s Current sensing (pin ISNS) VI(min)ISNS minimum input voltage on pin ISNS 30 50 70 mV VI(max)ISNS maximum input voltage on pin ISNS 1.7 1.8 1.9 V ton(min) minimum on-time [3] 310 410 510 ns td delay time [3] - 100 - ns gm(ISNS) ISNS transconductance VI(ISNS) to IO(COMP) 8.4 9.7 11 A/V Vintregd(max)ISNS maximum internal regulated voltage on pin ISNS VI(DIM) > 2 V 0.298 0.31 0.324 V Dimming control (pin DIM) Vintregd(AV)/Vdim Vclamp(DIM) average internal regulated voltage ratio to dimming voltage 0.65 V < VDIM < 2 V 190 200 210 mV/V 0.25 V < VDIM < 0.6 V 58 70 92 mV/V clamp voltage on pin DIM II(DIM) = 200 A 3.8 4.0 4.2 V on-state resistance II(DRAIN) = 200 mA - 11.7 13  - 17.8 20[4]  30 40 50 s - - 10 A Driver (pin DRAIN) RDSon Tj = 25 C Tj = 125 C toff(max) maximum off-time Ileak(DRAIN) leak current on pin DRAIN VI(DRAIN) = 700 V Temperature protection Tpl(IC) IC protection level temperature 140 150 165 C Tpl(IC)rst reset IC protection level temperature 106 118 130 C [1] The start-up voltage and the clamp voltage are correlated. [2] Guaranteed by design. [3] tleb = ton(min) - td; ton(min) is only effective when OCP is triggered. [4] The value is based on extrapolated data. SSL5237TE Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 13 March 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 12 of 18 SSL5237TE NXP Semiconductors Mains dimmable buck-boost LED driver IC 10 Ohm/700 V 12. Application information 9PDLQV / ) & & 59 8 5 9PDLQV 5 5 5 *$7( 5 ,616 9&& &203    ,&     '5$,1 *1' '(0293 ',0 ' & 5 5 5  & 5 & & 4 /('V & / 5 /('3 DDD Fig 7. SSL5237TE typical application diagram SSL5237TE Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 13 March 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 13 of 18 SSL5237TE NXP Semiconductors Mains dimmable buck-boost LED driver IC 10 Ohm/700 V 13. Package outline +62SODVWLFWKHUPDOHQKDQFHGVPDOORXWOLQHSDFNDJH OHDGVERG\ZLGWKPPH[SRVHGGLHSDG 627 ' $ ( ; F \ H[SRVHGGLHSDG +( Y $ 'K =   4 $ $ $ (K $ SLQLQGH[  /S H ES Z  PP VFDOH 'LPHQVLRQVPPDUHWKHRULJLQDOGLPHQVLRQV 8QLW PP $ $ $ $ ES / GHWDLO;  F ' 'K ( (K PD[          QRP           PLQ          H +( / /S 4 Y Z              1RWH 3ODVWLFRUPHWDOSURWUXVLRQVRIPPPD[LPXPSHUVLGHDUHQRWLQFOXGHG 2XWOLQH YHUVLRQ 5HIHUHQFHV ,(& -('(& -(,7$ \ = ș     ƒ ƒ ƒ VRWBSR (XURSHDQ SURMHFWLRQ ,VVXHGDWH   627 Fig 8. ș Package outline SOT786-3 (HSO8) SSL5237TE Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 13 March 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 14 of 18 SSL5237TE NXP Semiconductors Mains dimmable buck-boost LED driver IC 10 Ohm/700 V 14. Revision history Table 7. Revision history Document ID Release date Data sheet status Change notice Supersedes SSL5237TE v.1 20150313 Product data sheet - - SSL5237TE Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 13 March 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 15 of 18 SSL5237TE NXP Semiconductors Mains dimmable buck-boost LED driver IC 10 Ohm/700 V 15. Legal information 15.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 15.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 15.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. SSL5237TE Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 1 — 13 March 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 16 of 18 SSL5237TE NXP Semiconductors Mains dimmable buck-boost LED driver IC 10 Ohm/700 V Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 15.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. GreenChip — is a trademark of NXP Semiconductors N.V. 16. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com SSL5237TE Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 13 March 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 17 of 18 SSL5237TE NXP Semiconductors Mains dimmable buck-boost LED driver IC 10 Ohm/700 V 17. Contents 1 2 3 4 5 6 7 7.1 7.2 8 8.1 8.2 8.3 8.4 8.5 8.6 8.7 8.8 8.8.1 8.8.2 8.8.3 8.8.4 8.8.5 8.8.6 8.9 9 10 11 12 13 14 15 15.1 15.2 15.3 15.4 16 17 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 4 Converter operation . . . . . . . . . . . . . . . . . . . . . 4 On-time control . . . . . . . . . . . . . . . . . . . . . . . . . 5 Dimming control . . . . . . . . . . . . . . . . . . . . . . . . 5 Valley detection. . . . . . . . . . . . . . . . . . . . . . . . . 6 Start-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Leading-Edge Blanking (LEB) . . . . . . . . . . . . . 7 Magnetization switching . . . . . . . . . . . . . . . . . . 7 Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 UnderVoltage LockOut (UVLO) . . . . . . . . . . . . 8 Cycle-by-cycle OverCurrent Protection (OCP) . 8 OverTemperature Protection (OTP) . . . . . . . . . 8 Cycle-by-cycle maximum on-time protection . . 8 Output OverVoltage Protection (OVP) . . . . . . . 8 Output Short Protection (OSP) . . . . . . . . . . . . . 9 Supply management. . . . . . . . . . . . . . . . . . . . . 9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 10 Thermal characteristics . . . . . . . . . . . . . . . . . 11 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 11 Application information. . . . . . . . . . . . . . . . . . 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Contact information. . . . . . . . . . . . . . . . . . . . . 17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP Semiconductors N.V. 2015. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 13 March 2015 Document identifier: SSL5237TE Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: NXP: SSL5237TE/1Y