INTEGRATED CIRCUITS
DATA SHEET
TDA6120Q
Video output amplifier
Product specification
Supersedes data of 2000 Apr 19
File under Integrated Circuits, IC02
2000 Dec 13
Philips Semiconductors
Product specification
Video output amplifier
TDA6120Q
FEATURES
• Maximum overall voltage gain over 46 dB
• High large-signal bandwidth of 32 MHz (typ.) at
125 V (p-p)
• High Power Supply Rejection Ratio (PSRR)
• Fast cathode current measurement output for dark
current control loop
• High small-signal bandwidth of 47 MHz (typ.) at
60 V (p-p)
• Differential voltage input.
• Rise/fall time of 12.5 ns for 125 V (p-p)
• High slew rate of 10 V/ns
GENERAL DESCRIPTION
• Low static power dissipation of 2.6 W at 200 V supply
voltage
The TDA6120Q is a single 32 MHz, 125 V (p-p) video
output amplifier contained in a plastic DIL-bent-SIL power
package. The device uses high-voltage DMOS technology
and is intended to drive the cathodes of a CRT in High
Definition TVs (HDTVs) or monitors.
• High maximum output voltage
• Bandwidth independent of voltage gain
ORDERING INFORMATION
TYPE
NUMBER
TDA6120Q
2000 Dec 13
PACKAGE
NAME
DBS13P
DESCRIPTION
plastic DIL-bent-SIL power package; 13 leads (lead length 7.7 mm)
2
VERSION
SOT141-8
Philips Semiconductors
Product specification
Video output amplifier
TDA6120Q
BLOCK DIAGRAM
handbook, full pagewidth
VDD
IIN
10
5
n.c.
9, 11
MIRROR
4× out
CASCODE
in
TDA6120Q
12
1×
VCC
6
13
1×
OUT
0.7 pF
MIRROR
in 1×
out
7
out 1×
out 4×
in
CURRENT
INPUT
+
VIN−
OUTC
2
OUTM
CASCODE
5 mA
J
1
3
4
8
RC−
RC+
VIN+
GND
MGK440
Fig.1 Block diagram.
+12 V
Vref
handbook, full pagewidth
+200 V
CC CD
100 100
nF
nF
CCC
47
µF
Cr
10 nF
CDD
10
µF
Dflash
50 Ω
VIN−
2
VCC
VIN+
4
VDD
GND
6
8
OUTC
10
12
TDA6120Q
1
3
RC−
Ri
442 Ω
VIN
C1
68 pF
5
RC+
7
IIN
9
OUTM
Ria
22 Ω
11
n.c.
n.c.
13
OUT
Rf
Rflash
22 kΩ
220 Ω
CRT
MGK441
Fig.2 Top view.
2000 Dec 13
3
Philips Semiconductors
Product specification
Video output amplifier
TDA6120Q
PINNING
SYMBOL
PIN
RC−
1
DESCRIPTION
handbook, halfpage
RC− 1
inverting input pre-emphasis
network
VIN− 2
VIN−
2
inverting voltage input
RC+ 3
RC+
3
non-inverting input pre-emphasis
network
VIN+ 4
VIN+
4
non-inverting voltage input
IIN
5
feedback current input
VCC
6
low supply voltage (12 V)
OUTM
7
cathode current measurement
output
GND
8
power ground
n.c.
9
not connected
VDD
10
high supply voltage (200 V)
n.c.
11
not connected
OUTC
12
cathode output
OUT
13
feedback output
IIN 5
VCC 6
OUTM 7
TDA6120Q
GND 8
n.c. 9
VDD 10
n.c. 11
OUTC 12
OUT 13
MGK438
Fig.3 Pin configuration.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
VDD
high supply voltage
0
280
V
VCC
low supply voltage
0
20
V
Vi
input voltage (pins 2 and 4)
0
VCC
V
Vi(dif)
differential mode input voltage (pins 2 and 4)
−VCC
+VCC
V
Vi(pe)
pre-emphasis input voltage (pins 1 and 3)
0
VCC
V
Vi(dif)(pe)
differential mode pre-emphasis input voltage (pins 1 and 3)
−VCC
+VCC
V
VIIN
input voltage (pin 5)
0
2VBE
V
VOUTM
measurement output voltage
0
20
V
Vo
output voltage (pins 12 and 13)
0
VDD
V
Tstg
storage temperature
−55
+150
°C
Tj
junction temperature
−20
+150
°C
VESD
voltage peak human body model
−
2000
V
voltage peak machine model
−
300
V
2000 Dec 13
4
Philips Semiconductors
Product specification
Video output amplifier
TDA6120Q
MGK442
20
handbook, halfpage
Ptot
(W)
16
12
(1)
8
4
(2)
0
−20
0
20
40
80
120
160
Tamb (°C)
(1) Infinite heatsink.
(2) No heatsink.
Fig.4 Power derating curve.
THERMAL CHARACTERISTICS
SYMBOL
Rth(j-c)
PARAMETER
thermal resistance from junction to case
QUALITY SPECIFICATION
Quality specification in accordance with “SNW-FQ-611 part D”.
2000 Dec 13
5
VALUE
UNIT
3.0
K/W
Philips Semiconductors
Product specification
Video output amplifier
TDA6120Q
CHARACTERISTICS
Operating range: Tj = −20 to +150 °C; VDD = 180 to 210 V; VCC = 10.8 to 13.2 V; VOUTM = 3 to 16.5 V;
VVIN− = 1.5 to VCC − 6 V; VVIN+ = 1.5 to VCC − 6 V. Test conditions: Tj = 25 °C; VDD = 200 V; VCC = 12 V; VVIN+ = 3 V;
VOUTM = 6 V; CL = 10 pF (CL consists of parasitic and cathode capacitance); Rth(h-a) = 4 K/W; test circuit of Fig.5; unless
otherwise specified.
SYMBOL
PARAMETER
IDD(q)
quiescent high voltage
supply current
ICC(q)
CONDITIONS
TYP.
MAX.
UNIT
9
11
13
mA
quiescent low voltage supply VVIN− = VVIN+
current
35
45
55
mA
Ibias
input bias current
(pins 2 and 4)
VOUTC = 100 V
−
76
−
µA
VOUTC
DC output voltage
(pins 12 and 13)
VVIN− = VVIN+
85
103
120
V
∆VOUTC(T)
DC output voltage
temperature drift
(pins 12 and 13)
VVIN− = VVIN+; temperature
range 30 °C < Tj < 110 °C
−100
−25
+55
mV/K
I(offset)OUTM
offset current of
measurement output
note 1
−30
0
+30
µA
∆IOUTM/∆IOUTC
linearity of current transfer
−50 µA < IOUTC < +50 µA;
note 1
−
1.0
−
Ci
input capacitance
(pins 2 and 4)
VOUTC = VOUTC(max)
−
4
−
pF
IOUTC(max)
maximum dynamic peak
output current (pin 12)
20 V < VOUTC < VDD − 20 V
−
100
−
mA
VOUTC(min)
minimum output voltage
(pin 12)
−
4
10
V
VOUTC(max)
maximum output voltage
(pin 12)
VDD − 10
VDD − 6
−
V
VCC(sw)
VCC switch level at which
pins OUT and OUTC
become HIGH
−
8.8
−
V
Gint
internal gain
1.68
1.87
2.08
Bs
small-signal bandwidth
(pin 12)
VOUTC(AC) = 60 V (p-p);
VOUTC(DC) = 100 V
40
47
−
MHz
Bl
large-signal bandwidth
(pin 12)
VOUTC(AC) = 125 V (p-p);
VOUTC(DC) = 100 V
28
32
−
MHz
tpd
cathode output propagation
time 50% input to 50%
output (pin 12)
VOUTC(AC) = 125 V (p-p);
VOUTC(DC) = 100 V; square
wave; f < 1 MHz;
tf(VIN−) = 10 ns;
tr(VIN−) = 10 ns; see
Figs 6 and 7
10
−
15
ns
2000 Dec 13
VOUTC = 100 V
MIN.
6
Philips Semiconductors
Product specification
Video output amplifier
SYMBOL
PARAMETER
TDA6120Q
CONDITIONS
MIN.
TYP.
MAX.
UNIT
to(r)
cathode output rise time
10% output to 90% output
(pin 12)
VOUTC(AC) = 125 V (p-p);
VOUTC(DC) = 100 V; square
wave; f < 1 MHz;
tf(VIN−) = 10 ns;
tr(VIN−) = 10 ns; see Fig.6
10
12.5
18
ns
to(f)
cathode output fall time 90% VOUTC(AC) = 125 V (p-p);
output to 10% output
VOUTC(DC) = 100 V; square
wave; f < 1 MHz;
(pin 12)
tf(VIN−) = 10 ns;
tr(VIN−) = 10 ns; see Fig.7
10
12.5
15
ns
tst
settling time 50% input to
(99% < output < 101%)
(pin 12)
−
−
350
ns
SRr
slew rate rise between
VVIN− = 2 V (p-p); square
30 V to (VDD − 30 V) (pin 12) wave; f < 1 MHz;
tf(VIN−) = 10 ns;
tr(VIN−) = 10 ns
−
8
−
V/ns
SRf
VVIN− = 2 V (p-p); square
slew rate fall between
(VDD − 30 V) to 30 V (pin 12) wave; f < 1 MHz;
tf(VIN−) = 10 ns;
tr(VIN−) = 10 ns
−
10
−
V/ns
OVr
cathode output voltage
overshoot rise (pin 12)
VOUTC(AC) = 125 V (p-p);
VOUTC(DC) = 100 V; square
wave; f < 1 MHz;
tf(VIN−) = 10 ns;
tr(VIN−) = 10 ns; see
Figs 6 and 7
−
5
−
%
OVf
cathode output voltage
overshoot fall (pin 12)
VOUTC(AC) = 125 V (p-p);
VOUTC(DC) = 100 V; square
wave; f < 1 MHz;
tf(VIN−) = 10 ns;
tr(VIN−) = 10 ns; see
Figs 6 and 7
−
20
−
%
PSRRh
high voltage power supply
rejection ratio
f < 50 kHz; note 2
−
44
−
dB
PSRRl
low voltage power supply
rejection ratio
f < 50 kHz; note 2
−
48
−
dB
VOUTC(AC) = 125 V (p-p);
VOUTC(DC) = 100 V; square
wave f < 1 MHz;
tf(VIN−) = 10 ns;
tr(VIN−) = 10 ns; see
Figs 6 and 7
Notes
1. The operating range of the measurement output OUTM is 3 to 16.5 V. Below 3 V, OUTM acts as a voltage source
with an output resistance such that the maximum current input from OUTM is 1.25 mA.
2. The ratio of the change in supply voltage to the change in input voltage when there is no change in output voltage.
2000 Dec 13
7
Philips Semiconductors
Product specification
Video output amplifier
handbook, full pagewidth
C11
Ra
50 Ω
RCC
+12 V
C10
VIN
TDA6120Q
RDD
47 Ω
CCCC
CCC
CDD
CDDD
47 µF
10 nF
10 nF
10 µF
22 nF
VIN−
Rba 1 kΩ
C1
68 pF
Vref
Rbb 1 kΩ
Ria
22 Ω
C12
22 nF
RC−
6
2
1
Ri
442 Ω
22 kΩ
VDD
10
IIN
5
OUT
13
12
TDA6120Q
RC+
VIN+
OUTC
Rflash
147 Ω
C8
7
3
6.8 pF
OUTM
4
Im
10 µF
VOUT
3.3 pF
C9
136 pF
MGK443
Rf
Overall gain = G int × ----Ri
Fig.5 Test circuit with gain of 40 dB.
2000 Dec 13
R3
2 MΩ
C7
8
GND
C13
+200 V
Rf
VCC
10 µF
47 Ω
8
R2
100 kΩ
Philips Semiconductors
Product specification
Video output amplifier
TDA6120Q
x
Vi
0
t
x
tst
overshoot (in %)
163.75
162.5
150
161.25
Voc
100
50
37.5
t
to(r)
MGK444
tpd
Fig.6 Output (pins 12 and 13; rising edge) as a function of input signal.
2000 Dec 13
9
Philips Semiconductors
Product specification
Video output amplifier
TDA6120Q
x
Vi
0
t
x
tst
162.5
150
Voc
100
overshoot (in %)
38.75
50
37.5
36.25
t
to(r)
MGK445
tpd
Fig.7 Output (pins 12 and 13; falling edge) as a function of input signal.
FLASHOVER PROTECTION
This external network causes an increase in the rise and
fall times and a decrease in the overshoot.
The TDA6120Q needs an external protection diode
combined with a 50 Ω resistor to protect the video amplifier
against CRT flashover discharge.
Pin 10 must be decoupled to pin 8:
• By a capacitor >100 nF with good HF behaviour (e.g.
foil). This capacitor must be placed as close as possible
to pins 10 and 8; definitely within 5 mm.
An external 147 Ω carbon high-voltage resistor in
combination with a 2 kV spark gap between the cathode
and ground will limit the maximum clamp current (for this
resistor value, the CRT has to be connected to the main
printed-circuit board).
2000 Dec 13
• By a capacitor >10 µF on the picture tube base
printed-circuit board (common for 3 output stages).
10
Philips Semiconductors
Product specification
Video output amplifier
TDA6120Q
TEST AND APPLICATION INFORMATION
Where:
CL = load capacitance
Dissipation
Cint = effective internal load capacitance
(approximately 7 pF)
Regarding dissipation, distinction must be made between
static dissipation (independent of frequency) and dynamic
dissipation (proportional to frequency). The static
dissipation of the TDA6120Q is due to supply currents, and
currents in the feedback network and CRT.
f = frequency
VOUTC(p-p) = output voltage (peak-to-peak value)
b = non-blanking duty cycle (0.8).
The static dissipation is given by the following equation:
The IC must be mounted on the picture tube base
printed-circuit board to minimize the load capacitance CL.
P stat = V CC × I CC + V DD × I DD
V OUTC
– V OUTC × ----------------- – V OUTC × I OUTC
Rf
Switch-off
The TDA6120Q is equipped with a switch-off circuit to
guarantee a controlled switch-off behaviour of the output
pins. The switch-off function is activated when the low
supply voltage (VCC) drops below a reference level
(VCC(sw)). Then the voltage at output pins OUT and OUTC
is pulled to the high supply voltage level (VDD),
independant of input pin voltage levels.
Where:
Rf = feedback resistance
IOUTC = DC cathode current.
The dynamic dissipation is given by the following equation:
Pdyn = VDD × (CL + Cint) × f × VOUTC(p-p) × b
2000 Dec 13
11
Philips Semiconductors
Product specification
Video output amplifier
TDA6120Q
INTERNAL PIN CONFIGURATION
handbook, full pagewidth
VIN−
VCC
VDD
6
10
2
ESD
ESD
RC−
12
1
ESD
OUTC
ESD
TDA6120Q
VIN+
4
ESD
RC+
ESD
3
ESD
ESD
IIN
13
OUT
5
ESD
7
OUTM
ESD
8
MGK439
GND
Fig.8 Internal pin diagram.
2000 Dec 13
12
Philips Semiconductors
Product specification
Video output amplifier
TDA6120Q
PACKAGE OUTLINE
DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 7.7 mm)
SOT141-8
non-concave
Dh
x
D
Eh
view B: mounting base side
d
A2
B
j
E
A
L3
L
c
Q
1
v M
13
e1
Z
e
e2
m
w M
bp
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A2
bp
c
D (1)
d
Dh
E (1)
e
e1
e2
Eh
j
L
L3
m
Q
v
w
x
Z (1)
mm
17.0
15.5
4.6
4.4
0.75
0.60
0.48
0.38
24.0
23.6
20.0
19.6
10
12.2
11.8
3.4
1.7
5.08
6
3.4
3.1
8.4
7.0
2.4
1.6
4.3
2.1
1.8
0.6
0.25
0.03
2.00
1.45
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
97-12-16
99-12-17
SOT141-8
2000 Dec 13
EUROPEAN
PROJECTION
13
Philips Semiconductors
Product specification
Video output amplifier
TDA6120Q
The total contact time of successive solder waves must not
exceed 5 seconds.
SOLDERING
Introduction to soldering through-hole mount
packages
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
This text gives a brief insight to wave, dip and manual
soldering. A more in-depth account of soldering ICs can be
found in our “Data Handbook IC26; Integrated Circuit
Packages” (document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 °C, contact may be up to 5 seconds.
Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joints for more than 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods
SOLDERING METHOD
PACKAGE
DIPPING
DBS, DIP, HDIP, SDIP, SIL
WAVE
suitable(1)
suitable
Note
1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
2000 Dec 13
14
Philips Semiconductors
Product specification
Video output amplifier
TDA6120Q
DATA SHEET STATUS
DATA SHEET STATUS
PRODUCT
STATUS
DEFINITIONS (1)
Objective specification
Development
This data sheet contains the design target or goal specifications for
product development. Specification may change in any manner without
notice.
Preliminary specification
Qualification
This data sheet contains preliminary data, and supplementary data will be
published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.
Product specification
Production
This data sheet contains final specifications. Philips Semiconductors
reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
Note
1. Please consult the most recently issued data sheet before initiating or completing a design.
DEFINITIONS
DISCLAIMERS
Short-form specification The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Life support applications These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
Application information Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2000 Dec 13
15
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Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +27 11 471 5401, Fax. +27 11 471 5398
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 5F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2451, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
60/14 MOO 11, Bangna Trad Road KM. 3, Bagna, BANGKOK 10260,
Tel. +66 2 361 7910, Fax. +66 2 398 3447
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 3341 299, Fax.+381 11 3342 553
For all other countries apply to: Philips Semiconductors,
Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN,
The Netherlands, Fax. +31 40 27 24825
Internet: http://www.semiconductors.philips.com
SCA 70
© Philips Electronics N.V. 2000
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
753504/04/pp16
Date of release: 2000
Dec 13
Document order number:
9397 750 07562
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