TDA8024T/C1,518

TDA8024 Standard smart card interface Rev. 4.0 — 3 June 2016 Product data sheet 1. General description The TDA8024 is a complete and cost-efficient analog interface for asynchronous 3 V or 5 V smart cards. It can be placed between the card and the microcontroller to perform all supply, protection and control functions. Very few external components are required. The TDA8024AT is a direct replacement for the TDA8004AT. More information can be obtained from the NXP internet site (www.nxp.com) and from “Application note AN10141”. CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling electrostatic sensitive devices. Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or equivalent standards. 2. Features and benefits  IC card interface  3 V or 5 V supply for the IC (VDD and GND)  Three specifically protected half-duplex bidirectional buffered I/O lines to card contacts C4, C7 and C8  DC-to-DC converter for VCC generation separately powered from a 5 V  20% supply (VDDP and PGND)  3 V or 5 V  5% regulated card supply voltage (VCC) with appropriate decoupling has the following capabilities:  ICC < 80 mA at VDDP = 4 V to 6.5 V  Handles current spikes of 40 nAs up to 20 MHz  Controls rise and fall times  Filtered overload detection at approximately 120 mA  Thermal and short-circuit protection on all card contacts  Automatic activation and deactivation sequences; initiated by software or by hardware in the event of a short-circuit, card take-off, overheating, VDD or VDDP drop-out  Enhanced ESD protection on card side (>6 kV)  26 MHz integrated crystal oscillator  Clock generation for cards up to 20 MHz (divided by 1, 2, 4 or 8 through CLKDIV1 and CLKDIV2 signals) with synchronous frequency changes  Non-inverted control of RST via pin RSTIN  ISO 7816, GSM11.11 and EMV (payment systems) compatibility TDA8024 NXP Semiconductors Standard smart card interface  Supply supervisor for spike-killing during power-on and power-off and Power-on reset (threshold fixed internally or externally by a resistor bridge); not for TDA8024AT  Built-in debounce on card presence contacts  One multiplexed status signal OFF 3. Applications     IC card readers for banking Electronic payment Identification Pay TV 4. Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit 2.7 - 6.5 V Power supplies VDD supply voltage VDDP DC-to-DC converter supply voltage VCC = 5 V; ICC < 80 mA 4.0 5.0 6.5 V VCC = 5 V; ICC < 20 mA 3.0 - 6.5 V IDD supply current VDD = 3.3 V; fXTAL = 10 MHz card inactive - - 1.2 mA card active; fCLK = fXTAL; CL = 30 pF - - 1.5 mA inactive mode - - 0.1 mA active mode; fCLK = fXTAL; CL = 30 pF; ICC = 0 - - 10 mA card active; ICC < 80 mA DC 4.75 5.0 5.25 V card active; current pulses Ip = 40 nAs 4.65 5.0 5.25 V card active; ICC < 65 mA DC 2.85 3.0 3.15 V card active; current pulses Ip = 40 nAs 2.76 3.0 3.20 V IDDP DC-to-DC converter supply current VDDP = 5 V; fXTAL = 10 MHz Card supply VCC card suppy voltage (including ripple voltage) 5 V card: 3 V card: VCC(ripple)(p-p) ripple voltage on VCC (peak-to-peak value) fripple = 20 kHz to 200 MHz - - 350 mV ICC card supply current VCC = 0 to 5 V - - 80 mA VCC = 0 to 3 V - - 65 mA TDA8024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4.0 — 3 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 2 of 33 TDA8024 NXP Semiconductors Standard smart card interface Table 1. Quick reference data …continued Symbol Parameter Conditions Min Typ Max Unit 50 80 100 s - - 0.56 W 25 - +85 C General tde deactivation time Ptot total power dissipation Tamb ambient temperature continuous operation; Tamb = 25 to +85 C 5. Ordering information Table 2. Ordering information Type number Package Name Description Version TDA8024T/C1 SO28 plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 TDA8024AT/C1 SO28 plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 TDA8024TT/C1 TSSOP28 plastic thin shrink small outline package; 28 leads; body width 4.4 mm, gold wires SOT361-1 TDA8024TT/C1/S1 TSSOP28 plastic thin shrink small outline package; 28 leads; body width 4.4 mm, copper wire SOT361-1 TDA8024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4.0 — 3 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 3 of 33 TDA8024 NXP Semiconductors Standard smart card interface 6. Block diagram 100 nF 100 nF VDD VDDP 6 21 VDD S1 7 S2 5 SUPPLY DC/DC CONVERTER INTERNAL REFERENCE R1 (1) 100 nF Vref PORADJ 18 INTERNAL OSCILLATOR 2.5 MHz VOLTAGE SENSE R2 4 PGND 100 nF 8 VUP EN1 CLKUP POWER_ON ALARM OFF RSTIN CMDVCC 5V/3V EN2 VCC PVCC GENERATOR 23 20 19 CLKDIV2 100 nF 100 nF 14 CGND 3 EN5 SEQUENCER CLKDIV1 17 VCC HORSEQ 1 RST BUFFER EN4 CLOCK BUFFER 2 16 15 10 CLOCK CIRCUITRY 9 RST CLK PRES PRES CLK XTAL1 XTAL2 AUX1UC EN3 24 25 THERMAL PROTECTION OSCILLATOR I/O TRANSCEIVER 13 28 I/O TRANSCEIVER 12 26 I/O TRANSCEIVER 11 27 AUX1 TDA8024 AUX2UC I/OUC AUX2 I/O 22 GND aaa-023220 (1) Optional external resistor bridge. If this bridge is not required pin 18 should be connected to ground; see Section 8.2.2. Pin 18 is not connected in the TDA8024AT. Fig 1. Block diagram TDA8024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4.0 — 3 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 4 of 33 TDA8024 NXP Semiconductors Standard smart card interface 7. Pinning information 7.1 Pinning CLKDIV1 CLKDIV2 5V/3V PGND S2 VDDP S1 VUP PRES 1 2 3 4 5 6 7 8 TDA8024T 9 PRES 10 28 AUX2UC CLKDIV1 1 28 AUX2UC 27 AUX1UC CLKDIV2 2 27 AUX1UC 26 I/OUC 5V/3V 3 26 I/OUC 25 XTAL2 PGND 4 25 XTAL2 24 XTAL1 S2 5 24 XTAL1 23 OFF VDDP 6 23 OFF 22 GND S1 7 VUP 8 20 RSTIN PRES 9 19 CMDVCC PRES 10 21 VDD AUX2 12 AUX1 13 CGND 14 21 VDD 19 CMDVCC 18 PORADJ 17 VCC AUX2 12 17 VCC 16 RST AUX1 13 16 RST 15 CLK CGND 14 15 CLK 001aab431 001aab430 Fig 2. 22 GND 20 RSTIN I/O 11 18 PORADJ I/O 11 TDA8024TT Pin configuration TDA8024T Fig 3. Pin configuration TDA8024TT CLKDIV1 1 28 AUX2UC CLKDIV2 2 27 AUX1UC 5V/3V 3 26 I/OUC PGND 4 25 XTAL2 S2 5 24 XTAL1 VDDP 6 23 OFF S1 7 VUP 8 PRES 9 TDA8024AT 22 GND 21 VDD 20 RSTIN PRES 10 19 CMDVCC I/O 11 18 n.c. AUX2 12 17 VCC AUX1 13 16 RST CGND 14 15 CLK 001aab382 Fig 4. Pin configuration TDA8024AT TDA8024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4.0 — 3 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 5 of 33 TDA8024 NXP Semiconductors Standard smart card interface 7.2 Pin description TDA8024 Product data sheet Table 3. Pin description Symbol Pin Type Description CLKDIV1 1 I CLK frequency selection input 1 CLKDIV2 2 I CLK frequency selection input 2 5V/3V 3 I card supply voltage selection input; VCC = 5 V (HIGH) or VCC = 3 V (LOW) PGND 4 S DC-to-DC converter power supply ground S2 5 I/O VDDP 6 S S1 7 I/O DC-to-DC converter capacitor; connected between pins S1 and S2; C = 100 nF with ESR < 100 m VUP 8 I/O DC-to-DC converter output decoupling capacitor connection; C = 100 nF with ESR < 100 m must be connected between VUP and PGND PRES 9 I card presence contact input (active LOW); if PRES or PRES is active, the card is considered ‘present’ and a built-in debounce feature of 8 ms (typ.) is activated PRES 10 I card presence contact input (active HIGH); if PRES or PRES is active, the card is considered ‘present’ and a built-in debounce feature of 8 ms (typ.) is activated I/O 11 I/O data line to/from card reader contact C7; integrated 11 k pull-up resistor to VCC AUX2 12 I/O data line to/from card reader contact C8; integrated 11 k pull-up resistor to VCC AUX1 13 I/O data line to/from card reader contact C4; integrated 11 k pull-up resistor to VCC CGND 14 S CLK 15 I/O card clock to/from card reader contact C3 RST 16 O card reset output from card reader contact C2 VCC 17 S card supply voltage to card reader contact C1; decoupled to CGND via 2  100 nF or 100 + 220 nF capacitors with ESR < 100 m[1] PORADJ 18 I Power-on reset threshold adjustment input for changing the reset threshold with an external resistor bridge; doubles the width of the POR pulse when used; this pin is not connected for the TDA8024AT CMDVCC 19 I input from the host to start activation sequence (active LOW) RSTIN 20 I card reset input from the host VDD 21 S supply voltage GND 22 S ground OFF 23 O NMOS interrupt output to the host (active LOW); 20 k integrated pull-up resistor to VDD XTAL1 24 I crystal connection or input for external clock DC-to-DC converter capacitor; connected between pins S1 and S2; C = 100 nF with ESR < 100 m DC-to-DC converter power supply voltage card signal ground All information provided in this document is subject to legal disclaimers. Rev. 4.0 — 3 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 6 of 33 TDA8024 NXP Semiconductors Standard smart card interface Table 3. Symbol Pin description …continued Pin Type Description XTAL2 25 O crystal connection (leave open-circuit if external clock source is used) I/OUC 26 I/O host data I/O line; integrated 11 k pull-up resistor to VDD AUX1UC 27 I/O AUX2UC 28 I/O auxiliary data line to/from the host; integrated 11 k pull-up resistor to VDD [1] The noise margin on VCC will be higher with the 220 nF capacitor. 8. Functional description Throughout this document it is assumed that the reader is familiar with ISO7816 terminology. 8.1 Power supply The supply pins for the IC are VDD and GND. VDD should be in the range of 2.7 V to 6.5 V. All signals interfacing with the system controller are referred to VDD, therefore VDD should also supply the system controller. All card reader contacts remain inactive during power-on or power-off. The internal circuits are maintained in the reset state until VDD reaches Vth2 + Vhys2 and for the duration of the internal Power-on reset pulse, tW (see Figure 5). When VDD falls below Vth2, an automatic deactivation of the contacts is performed. A DC-to-DC converter is incorporated to generate the 5 V or 3 V card supply voltage (VCC). The DC-to-DC converter should be supplied separately by VDDP and PGND. Due to the possibility of large transient currents, the two 100 nF capacitors of the DC-to-DC converter should be located as near as possible to the IC and have an ESR less than 100 m. The DC-to-DC converter functions as a voltage doubler or a voltage follower according to the respective values of VCC and VDDP (both have thresholds with a hysteresis of 100 mV). The DC-to-DC converter function changes as follows. • • • • VCC = 5 V and VDDP > 5.8 V; voltage follower VCC = 5 V and VDDP < 5.7 V; voltage doubler VCC = 3 V and VDDP > 4.1 V; voltage follower VCC = 3 V and VDDP < 4.0 V; voltage doubler. Supply voltages VDD and VDDP may be applied to the IC in any sequence. After powering the device, OFF remains LOW until CMDVCC is set HIGH. During power off, OFF falls LOW when VDD is below the falling threshold voltage. TDA8024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4.0 — 3 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 7 of 33 TDA8024 NXP Semiconductors Standard smart card interface 8.2 Voltage supervisor 8.2.1 Without external divider on pin PORADJ (or with TDA8024AT) The voltage supervisor surveys the VDD supply. A defined reset pulse of approximately 8 ms (tW) is used internally to keep the IC inactive during power-on or power-off of the VDD supply (see Figure 5). As long as VDD is less than Vth2 + Vhys2, the IC remains inactive whatever the levels on the command lines. This state also lasts for the duration of tW after VDD has reached a level higher than Vth2 + Vhys2. When VDD falls below Vth2, a deactivation sequence of the contacts is performed. 9WK9K\V 9WK 9'' $/$50 LQWHUQDOVLJQDO WZ WZ SRZHURQ VXSSO\GURSRXW SRZHURII DDD Fig 5. Voltage supervisor 8.2.2 With an external divider on pin PORADJ (not for the TDA8024AT) If an external resistor bridge is connected to pin PORADJ (R1 and R2 in Figure 1), then the following occurs: • The internal threshold voltage Vth2 is overridden by the external voltage and by the hysteresis, therefore: V hys  ext  R1 V th2  ext   rise  =  1 + -------   V bridge + --------------------  2  R2  V hys  ext  R1 V th2  ext   fall  =  1 + -------   V bridge – --------------------  2  R2  where Vbridge = 1.25 V typ. and Vhys(ext) = 60 mV typ. • The reset pulse width tW is doubled to approximately 16 ms. Input PORADJ is biased internally with a pull-down current source of 4 A which is removed when the voltage on pin PORADJ exceeds 1 V. This ensures that after detection of the external bridge by the IC during power-on, the input current on pin PORADJ does not cause inaccuracy of the bridge voltage. The minimum threshold voltage should be higher than 2 V. The maximum threshold voltage may be up to VDD. TDA8024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4.0 — 3 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 8 of 33 TDA8024 NXP Semiconductors Standard smart card interface 8.2.3 Applications examples The voltage supervisor is used as Power-on reset and as supply dropout detection during a card session. Supply dropout detection is to ensure that a proper deactivation sequence is followed before the voltage is too low. For the internal voltage supervisor to function, the system microcontroller should operate down to 2.35 V to ensure a proper deactivation sequence. If this is not possible, external resistor values can be chosen to overcome the problem. 8.2.3.1 Microcontroller requiring a 3.3 V  20 % supply For a microcontroller supplied by 3.3 V with a 5% regulator and with resistors R1, R2 having a 1% tolerance, the minimum supply voltage is 3.135 V. S1 VPORADJ = k  VDD, where k = ------------------- with S1 and S2 the actual values of nominal resistors S1 + S2 R1 and R2. This can be shown as: 0.99  R1 < S1 < 1.01  R1 and 0.99  R2 < S2 < 1.01  R2 Transposed, this becomes R1 0.99 R1 1 1 +  0.98  ------- = 1 +  ----------  -------  --  1.01 R2 k R2 1 1.01 R1 R1 ---  1 +  ----------  ------- = 1 +  1.02  -------  0.99 R2  k R2 If V1 = Vth(ext)(rise)(max) and V2 = Vth(ext)(fall)(min) activation will always be possible if VPORADJ > V1 and deactivation will always be done for VPORADJ < V2. V1 V2 Activation is always possible for V DD  ------- and deactivation is always possible for V DD  ------k k That is V1 = 1.31 V and V2 = 1.19 V and -------   ------------- – 1  0.98 = 1.365 R1 R2 3.135  1.31  100 k - = 42.3 k  and R1 = 57.7 k. Suppose R1 + R2 = 100 k, then R2 = ----------------2.365 Deactivation will be effective at V2  (1 + 1.02  1.365) = 2.847 V in any case. If the microcontroller continues to function down to 2.80 V, the slew rate on VDD should be less than 2 V/ms to ensure that clock CLK is correctly delivered to the card until time t12 (see Figure 9). 8.2.3.2 Microcontroller requiring a 3.3 V  10% supply For a microcontroller supplied by a 3.3 V with a 1% regulator and with resistors R1, R2 having a 0.1% tolerance, the minimum supply voltage is 3.267 V. The same calculations as in Section 8.2.3.1 conclude: TDA8024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4.0 — 3 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 9 of 33 TDA8024 NXP Semiconductors Standard smart card interface R1  3.267 -------  ------------- – 1  0.998 = 1.491  R2  1.310 100 k - = 40.14 k  and R1 = 59.86 k. Therefor R2 = ----------------2.49 Deactivation will be effective at V2  (1 + 1.002  1.491) = 2.967 V in any case. If the microcontroller continues to function down to 2.97 V, the slew rate on VDD should be less than 0.20 V/ms to ensure that clock CLK is correctly delivered to the card until time t12 (see Figure 9). 8.3 Clock circuitry The card clock signal (CLK) is derived from a clock signal input to pin XTAL1 or from a crystal operating at up to 26 MHz connected between pins XTAL1 and XTAL2. The clock frequency can be fXTAL, 1⁄2  fXTAL, 1⁄4  fXTAL or 1⁄8  fXTAL. Frequency selection is made via inputs CLKDIV1 and CLKDIV2 (see Table 4). Table 4. Clock frequency selection[1] CLKDIV1 CLKDIV2 0 0 f XTAL ------------8 0 1 f XTAL ------------4 1 1 f XTAL ------------2 1 0 [1] fCLK f XTAL The status of pins CLKDIV1 and CLKDIV2 must not be changed simultaneously; a delay of 10 ns minimum between changes is needed; the minimum duration of any state of CLK is eight periods of XTAL1. The frequency change is synchronous, which means that during transition no pulse is shorter than 45% of the smallest period, and that the first and last clock pulses about the instant of change have the correct width. When changing the frequency dynamically, the change is effective for only eight periods of XTAL1 after the command. The duty factor of fXTAL depends on the signal present at pin XTAL1. In order to reach a 45% to 55% duty factor on pin CLK, the input signal on pin XTAL1 should have a duty factor of 48% to 52% and transition times of less than 5% of the input signal period. If a crystal is used, the duty factor on pin CLK may be 45% to 55% depending on the circuit layout and on the crystal characteristics and frequency. In other cases, the duty factor on pin CLK is guaranteed between 45% and 55% of the clock period. TDA8024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4.0 — 3 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 10 of 33 TDA8024 NXP Semiconductors Standard smart card interface The crystal oscillator runs as soon as the IC is powered up. If the crystal oscillator is used, or if the clock pulse on pin XTAL1 is permanent, the clock pulse is applied to the card as shown in the activation sequences shown in Figure 7 and 8. If the signal applied to XTAL1 is controlled by the system microcontroller, the clock pulse will be applied to the card when it is sent by the system microcontroller (after completion of the activation sequence). 8.4 I/O transceivers The three data lines I/O, AUX1 and AUX2 are identical. The Idle-state is realized by both I/O and I/OUC lines being pulled HIGH via a 11 k resistor (I/O to VCC and I/OUC to VDD). Pin I/O is referenced to VCC, and pin I/OUC to VDD, thus allowing operation when VCC is not equal to VDD. The first side of the transceiver to receive a falling edge becomes the master. An anti-latch circuit disables the detection of falling edges on the line of the other side, which then becomes a slave. After a time delay td(edge), an N-transistor on the slave side is turned on, thus transmitting the logic 0 present on the master side. When the master side returns to logic 1, a P-transistor on the slave side is turned on during the time delay tpu and then both sides return to their idle states. This active pull-up feature ensures fast LOW-to-HIGH transitions; as shown in Figure 6, it is able to deliver more than 1 mA at an output voltage of up to 0.9VCC into an 80 pF load. At the end of the active pull-up pulse, the output voltage depends only on the internal pull-up resistor and the load current. The current to and from the card I/O lines is limited internally to 15 mA and the maximum frequency on these lines is 1 MHz. TDA8024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4.0 — 3 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 11 of 33 TDA8024 NXP Semiconductors Standard smart card interface aaa-023222 6 Vo (V) 12 Io (mA) (1) 4 8 (2) 2 4 0 0 20 0 60 40 t (ns) (1) Current (2) Voltage Fig 6. I/O, AUX1 and AUX2 output voltage and current as functions of time during a LOW-to-HIGH transition. 8.5 Inactive mode After a Power-on reset, the circuit enters the inactive mode. A minimum number of circuits are active while waiting for the microcontroller to start a session: • All card contacts are inactive (approximately 200  to GND) • Pins I/OUC, AUX1UC and AUX2UC are in the high-impedance state (11 k pull-up resistor to VDD) • • • • Voltage generators are stopped XTAL oscillator is running Voltage supervisor is active The internal oscillator is running at its low frequency 8.6 Activation sequence After power-on and after the internal pulse width delay, the system microcontroller can check the presence of a card using the signals OFF and CMDVCC as shown in Table 5. Table 5. Card presence indication OFF CMDVCC Indication HIGH HIGH card present LOW HIGH card not present If the card is in the reader (this is the case if PRES or PRES is active), the system microcontroller can start a card session by pulling CMDVCC LOW. The following sequence then occurs (see Figure 6): 1. CMDVCC is pulled LOW and the internal oscillator changes to its high frequency (t0). TDA8024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4.0 — 3 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 12 of 33 TDA8024 NXP Semiconductors Standard smart card interface 2. The voltage doubler is started (between t0 and t1). 3. VCC rises from 0 to 5 V (or 3 V) with a controlled slope (t2 = t1 + 1.5  T) where T is 64 times the period of the internal oscillator (approximately 25 s). 4. I/O, AUX1 and AUX2 are enabled (t3 = t1 + 4T) (these were pulled LOW until this moment). 5. CLK is applied to the C3 contact of the card reader (t4). 6. RST is enabled (t5 = t1 + 7T). The clock may be applied to the card using the following sequence: 1. Set RSTIN HIGH. 2. Set CMDVCC LOW. 3. Reset RSTIN LOW between t3 and t5; CLK will start at this moment. 4. RST remains LOW until t5, when RST is enabled to be the copy of RSTIN. 5. After t5, RSTIN has no further affect on CLK; this allows a precise count of CLK pulses before toggling RST. If the applied clock is not needed, then CMDVCC may be set LOW with RSTIN LOW. In this case, CLK will start at t3 (minimum 200 ns after the transition on I/O), and after t5, RSTIN may be set HIGH in order to obtain an Answer To Request (ATR) from the card. Activation should not be performed with RSTIN held permanently HIGH. &0'9&& 983 9&& $75 ,2 &/. 567,1 567 ,28& W W W W W WDFW W Fig 7. TDA8024 Product data sheet DDD Activation sequence using RSTIN and CMDVCC. All information provided in this document is subject to legal disclaimers. Rev. 4.0 — 3 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 13 of 33 TDA8024 NXP Semiconductors Standard smart card interface &0'9&& 983 9&& ,2 $75 &/. QV 567,1 567 ,28& W W W Fig 8. W W WDFW W DDD Activation sequence at t3. 8.7 Active mode When the activation sequence is completed, the TDA8024 will be in its active mode. Data is exchanged between the card and the microcontroller via the I/O lines. The TDA8024 is designed for cards without VPP (the voltage required to program or erase the internal non-volatile memory). 8.8 Deactive sequence When a session is completed, the microcontroller sets the CMDVCC line HIGH. The circuit then executes an automatic deactivation sequence by counting the sequencer back and finishing in the inactive mode (see Figure 9): 1. RST goes LOW (t10). 2. CLK is held LOW (t12 = t10 + 0.5  T) where T is 64 times the period of the internal oscillator (approximately 25 s). 3. I/O, AUX1 and AUX2 are pulled LOW (t13 = t10 + T). 4. VCC starts to fall towards zero (t14 = t10 + 1.5  T). 5. The deactivation sequence is complete at tde, when VCC reaches its inactive state. 6. VUP falls to zero (t15 = t10 + 5T) and all card contacts become low-impedance to GND; I/OUC, AUX1UC and AUX2UC remain at VDD (pulled-up via a 11 k resistor). 7. The internal oscillator returns to its lower frequency. TDA8024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4.0 — 3 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 14 of 33 TDA8024 NXP Semiconductors Standard smart card interface &0'9&& 567 &/. ,2 9&& 983 W W Fig 9. W W WGH W DDD Deactivation sequence. 8.9 VCC generator The VCC generator has a capacity to supply up to 80 mA continuously at 5 V and 65 mA at 3 V. An internal overload detector operates at approximately 120 mA. Current samples to the detector are internally filtered, allowing spurious current pulses up to 200 mA with a duration in the order of s to be drawn by the card without causing deactivation. The average current must stay below the specified maximum current value. For reasons of VCC voltage accuracy, a 100 nF capacitor with an ESR < 100 m should be tied to CGND near to pin VCC, and a 100 nF or 220 nF capacitor (220 nF is the best choice) with the same ESR should be tied to CGND near card reader contact C1. 8.10 Fault detection The following fault conditions are monitored: • • • • Short-circuit or high current on VCC Removal of a card during a transaction VDD dropping DC-to-DC converter operating out of the specified values (VDDP too low or current from VUP too high) • Overheating There are two different cases (see Figure 10): • CMDVCC HIGH outside a card session. Output OFF is LOW if a card is not in the card reader, and HIGH if a card is in the reader. A voltage drop on the VDD supply is detected by the supply supervisor, this generates an internal Power-on reset pulse but does not act upon OFF. No short-circuit or overheating is detected because the card is not powered-up. TDA8024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4.0 — 3 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 15 of 33 TDA8024 NXP Semiconductors Standard smart card interface • CMDVCC LOW within a card session. Output OFF goes LOW when a fault condition is detected. As soon as this occurs, an emergency deactivation is performed automatically (see Figure 11). When the system controller resets CMDVCC to HIGH it may sense the OFF level again after completing the deactivation sequence. This distinguishes between a hardware problem or a card extraction (OFF goes HIGH again if a card is present). Depending on the type of card-present switch within the connector (normally-closed or normally-open) and on the mechanical characteristics of the switch, bouncing may occur on the PRES signals at card insertion or withdrawal. There is a debounce feature in the device with an 8 ms typical duration (see Figure 10). When a card is inserted, output OFF goes HIGH only at the end of the debounce time. When the card is extracted, an automatic deactivation sequence of the card is performed on the first true/false transition on PRES or PRES and output OFF goes LOW. 35(6 2)) &0'9&& GHERXQFH GHERXQFH 9&& GHDFWLYDWLRQFDXVHGE\ FDUGVZLWKGUDZDO GHDFWLYDWLRQFDXVHGE\ VKRUWFLUFXLW DDD See “Application note AN10141” for software decision algorithm on OFF signal. Fig 10. Behavior of OFF, CMDVCC, PRES and VCC. 2)) 35(67 567 &/. ,2 9&& 983 W W W W WGH W DDD Fig 11. Emergency deactivation sequence (card extraction) TDA8024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4.0 — 3 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 16 of 33 TDA8024 NXP Semiconductors Standard smart card interface 9. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VDD Conditions Min Max Unit supply voltage 0.3 +6.5 V VDDP DC-to-DC converter supply voltage 0.3 +6.5 V VI, VO voltage on input and output pins XTAL1, XTAL2, 5V/3V, RSTIN, pins AUX1UC, AUX2UC, I/OUC, CLKDIV1, CLKDIV2, CMDVCC, OFF and PORADJ 0.3 +6.5 V Vcard voltage on card pins pins PRES, PRES, I/O, RST, AUX1, AUX2 and CLK 0.3 +6.5 V Vn voltage on other pins pins VUP, S1 and S2 0.3 +6.5 V Tj(max) maximum junction temperature - 150 C Tstg storage temperature 55 +150 C VESD electrostatic discharge voltage 6 +6 kV 2 +2 kV 200 +200 V card contacts in typical application;[1][2] pins I/O, RST, VCC, AUX1, AUX2, CLK, PRES and PRES all pins;[1] Human Body Model (HBM) Machine Model (MM) [2][3] [4] [1] All card contacts are protected against any short-circuit with any other card contact. [2] Every pin withstands the ESD test according to MIL-STD-883C class 3 for card contacts, class 2 for the remaining. Method 3015 (HBM; 1500  and 100 pF) 3 pulses positive and 3 pulses negative on each pin referenced to ground. [3] In accordance with EIA/JESD22-A114-B, June 2000. [4] In accordance with EIA/JESD22-A115-A, October 1997. 10. Thermal characteristics Table 7. Thermal characteristics Symbol Parameter Conditions Rth(j-a) thermal resistance from junction to ambient in free air TDA8024T TDA8024AT TDA8024TT [1] Typ Unit 70 K/W 70 K/W 100[1] K/W This figure was obtained using the following Printed-Circuit Board (PCB) technology: FR, 4 layers, 0.5 mm thickness, class 5, copper thickness 35 m, Ni/Go plating, ground plane in internal layers. TDA8024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4.0 — 3 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 17 of 33 TDA8024 NXP Semiconductors Standard smart card interface 11. Characteristics Table 8. Characteristics VDD = 3.3 V; VDDP = 5 V; Tamb = 25 C; fXTAL = 10 MHz; all currents flowing into the IC are positive: see Table note 1; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit ambient temperature 25 - +85 C VDD supply voltage 2.7 - 6.5 V VDDP DC-to-DC converter supply voltage VCC = 5 V; ICC < 80 mA 4.0 5.0 6.5 V VCC = 5 V; ICC < 20 mA 3.0 - 6.5 V supply current card inactive - - 1.2 mA card active; fCLK = fXTAL; CL = 30 pF - - 1.5 mA - - 0.1 mA - - 10 mA VCC = 5 V; ICC = 80 mA - - 200 mA VCC = 3 V; ICC = 65 mA - - 100 mA Temperature Tamb Supplies IDD IDDP DC-to-DC converter supply inactive mode current active mode; fCLK = fXTAL; CL = 30 pF; ICC = 0 Vth2 falling threshold voltage on no external resistors at pin VDD PORADJ; VDD level falling 2.35 2.45 2.55 V Vhys2 hysteresis of threshold voltage Vth2 no external resistors at pin PORADJ 50 100 150 mV Pin PORADJ[2] Vth(ext)(rise) external rising threshold voltage on VDD external resistor bridge at pin PORADJ; VDD level rising 1.240 1.28 1.310 V Vth(ext)(fall) external falling threshold voltage on VDD external resistor bridge at pin PORADJ; VDD level falling 1.190 1.22 1.26 V Vhys(ext) hysteresis of threshold voltage Vth(ext) external resistor bridge at pin PORADJ 30 60 90 mV Vhys(ext) hysteresis of threshold voltage Vth(ext) variation with temperature external resistor bridge at pin PORADJ - - 0.25 mV/K tw width of internal Power-on reset pulse no external resistors at pin PORADJ 4 8 12 ms external resistor bridge at pin PORADJ 8 16 24 ms IL(PORADJ) Ptot leakage current on pin PORADJ total power dissipation VPORADJ < 0.5 V 0.1 4 10 A VPORADJ > 1 V 1 - +1 A continuous operation; Tamb = 25 to +85 C - - 0.56 W DC-to-DC converter fCLK clock frequency card active 2.2 - 3.2 MHz Vth(vd-vf) threshold voltage for voltage doubler to change to voltage follower 5 V card 5.2 5.8 6.2 V 3 V card 3.8 4.1 4.4 V TDA8024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4.0 — 3 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 18 of 33 TDA8024 NXP Semiconductors Standard smart card interface Table 8. Characteristics …continued VDD = 3.3 V; VDDP = 5 V; Tamb = 25 C; fXTAL = 10 MHz; all currents flowing into the IC are positive: see Table note 1; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VUP(av) output voltage on pin VUP (average value) VCC = 5 V 5.2 5.7 6.2 V VCC = 3 V; VDDP = 3.3 V 3.5 3.9 4.3 V 80 - 400 nF card inactive; ICC = 0 mA 0.1 0 +0.1 V card inactive; ICC = 1 mA 0.1 0 +0.3 V card active; ICC < 80 mA 4.75 5.0 5.25 V card active; single current pulse, Ip = 100 mA; tp = 2 ms 4.65 5.0 5.25 V card active; current pulses, Ip = 40 nAs 4.65 5.0 5.25 V card active; current pulses, Ip = 40 nAs with ICC < 200 mA; tp < 400 ns 4.65 5.0 5.25 V card inactive; ICC = 0 mA 0.1 0 +0.1 V card inactive; ICC = 1 mA 0.1 0 +0.3 V card active; ICC < 65 mA 2.85 3.0 3.15 V card active; single current pulse, Ip = 100 mA; tp = 2 ms 2.76 3.0 3.20 V card active; current pulses, Ip = 40 nAs 2.76 3.0 3.20 V card active; current pulses, Ip = 40 nAs with ICC < 200 mA; tp < 400 ns 2.76 3.0 3.20 V Card supply voltage (pin VCC)[3] CVCC external capacitance on pin VCC VCC card supply voltage (including ripple voltage) [4] 5 V card 3 V card VCC(ripple)(p-p) ripple voltage on VCC (peak to peak value) fripple = 20 kHz to 200 MHz - - 350 mV ICC VCC = 0 to 5 V - - 80 mA VCC = 0 to 3 V - - 65 mA SR card supply current slew rate VCC short-circuit to GND 100 120 150 mA slew up or down 0.08 0.15 0.22 V/s - - 15 pF Crystal oscillator (pins XTAL1 and XTAL2) CXTAL1, CXTAL2 external capacitance on pins XTAL1 and XTAL2 fXTAL crystal frequency 2 - 26 MHz fXTAL1 frequency applied on pin XTAL1 0 - 26 MHz VIL LOW-level input voltage on pin XTAL1 0.3 - +0.3VDD V TDA8024 Product data sheet depends on type of crystal or resonator used All information provided in this document is subject to legal disclaimers. Rev. 4.0 — 3 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 19 of 33 TDA8024 NXP Semiconductors Standard smart card interface Table 8. Characteristics …continued VDD = 3.3 V; VDDP = 5 V; Tamb = 25 C; fXTAL = 10 MHz; all currents flowing into the IC are positive: see Table note 1; unless otherwise specified. Symbol Parameter VIH HIGH-level input voltage on pin XTAL1 Conditions Min Typ Max Unit 0.7VDD - VDD + 0.3 V Data lines (pins I/O, I/OUC, AUX1, AUX2, AUX1UC and AUX2UC) td(I/O-I/OUC), td(I/OUC-I/O) I/O to I/OUC, I/OUC to I/O falling edge delay - - 200 ns tpu active pull-up pulse width - - 100 ns fI/O(max) maximum frequency on data lines - - 1 MHz Ci input capacitance on data lines - - 10 pF Data lines to card reader (pins I/O, AUX1 and AUX2; with integrated 11 k pull-up resistors to VCC) Vo(inactive) output voltage inactive mode no load Io(inactive) = 1 mA 0 - 0.1 V - - 0.3 V Io(inactive) output current inactive mode; pin grounded - - 1 mA VOL LOW-level output voltage IOL = 1 mA 0 - 0.3 V IOL  15 mA VCC  0.4 - VCC V no DC load 0.9VCC - VCC + 0.1 V 5 V and 3 V cards; IOH < 40 A 0.75VCC - VCC + 0.1 V IOH  10 mA 0 - 0.4 V VOH HIGH-level output voltage VIL LOW-level input voltage 0.3 - 0.8 V VIH HIGH-level input voltage 1.5 - VCC + 0.3 V IIL LOW-level input current VIL = 0 V - - 600 A ILIH HIGH-level input leakage current VIH = VCC - - 10 A tt(DI) data input transition time VIL(max) to VIH(min) - - 1.2 s tt(DO) data output transition time Vo = 0 to VCC; CL  80 pF; 10% to 90% - - 0.1 s Rpu integrated pull-up resistor pull-up resistor to VDD 9 11 13 k Ipu current when pull-up active VOH = 0.9VCC; C = 80 pF 1 - - mA Data lines to microcontroller (pins I/OUC, AUX1UC and AUX2UC; with integrated 11 k pull-up resistors to VDD) VOL LOW-level output voltage IOL = 1 mA 0 - 0.3 V VOH HIGH-level output voltage no DC load 0.9VDD - VDD + 0.1 V 5 V and 3 V cards; IOH < 40 A 0.75VDD - VDD + 0.1 V 0.3 - +0.3VDD V VIL LOW-level input voltage VIH HIGH-level input voltage 0.7VDD - VDD + 0.3 V ILIH HIGH-level input leakage current VIH = VDD - - 10 A IIL LOW-level input current VIL = 0 V - - 600 A tt(DI) data input transition time VIL(max) to VIH(min) - - 1.2 s TDA8024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4.0 — 3 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 20 of 33 TDA8024 NXP Semiconductors Standard smart card interface Table 8. Characteristics …continued VDD = 3.3 V; VDDP = 5 V; Tamb = 25 C; fXTAL = 10 MHz; all currents flowing into the IC are positive: see Table note 1; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit tt(DO) data output transition time Vo = 0 to VDD; CL < 30 pF; 10% to 90% - - 0.1 s Rpu integrated pull-up resistor pull-up resistor to VDD 9 11 13 k Ipu current when pull-up active VOH = 0.9VDD; C = 30 pF 1 - - mA inactive mode 55 140 200 kHz active mode 2.2 2.7 3.2 MHz no load 0 - 0.1 V Io(inactive) = 1 mA 0 - 0.3 V Internal oscillator fOSC(int) frequency of internal oscillator Reset output to card reader (pin RST) Vo(inactive) output voltage inactive mode Io(inactive) output current inactive mode; pin grounded - - 1 mA td(RSTIN-RST) RSTIN to RST delay RST enabled - - 2 s VOL LOW-level output voltage IOL = 200 A 0 - 0.2 V IOL = 20 mA (current limit) VCC  0.4 - VCC V IOH = 200 A 0.9VCC - VCC V IOH = 20 mA (current limit) 0 - 0.4 V VOH HIGH-level output voltage tr rise time CL = 100 pF; VCC = 5 V or 3 V - - 0.1 s tf fall time CL = 100 pF; VCC = 5 V or 3 V - - 0.1 s no load 0 - 0.1 V Io(inactive) = 1 mA 0 - 0.3 V Clock output to card reader (pin CLK) Vo(inactive) output voltage inactive mode Io(inactive) output current CLK inactive; pin grounded 0 - 1 mA VOL LOW-level output voltage IOL = 200 A 0 - 0.3 V IOL = 70 mA (current limit) VCC  0.4 - VCC V VOH HIGH-level output voltage IOH = 200 A 0.9VCC - VCC V IOH = 70 mA (current limit) tr rise time 0 - 0.4 V CL = 30 pF [5] - - 16 ns - - 16 ns 45 - 55 % 0.2 - - V/ns tf fall time CL = 30 pF [5]  duty factor (except for fXTAL) CL = 30 pF [5] SR slew rate slew up or down; CL = 30 pF Control inputs (pins CLKDIV1, CLKDIV2, CMDVCC, RSTIN and 5V/3V)[6] VIL LOW-level input voltage 0.3 - +0.3VDD V VIH HIGH-level input voltage 0.7VDD - VDD + 0.3 V ILIL LOW-level input leakage current 0 < VIL < VDD - - 1 A ILIH HIGH-level input leakage current 0 < VIH < VDD - - 1 A TDA8024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4.0 — 3 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 21 of 33 TDA8024 NXP Semiconductors Standard smart card interface Table 8. Characteristics …continued VDD = 3.3 V; VDDP = 5 V; Tamb = 25 C; fXTAL = 10 MHz; all currents flowing into the IC are positive: see Table note 1; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Card presence inputs (pins PRES and PRES)[7] VIL LOW-level input voltage 0.3 - +0.3VDD V VIH HIGH-level input voltage 0.7VDD - VDD + 0.3 V ILIL LOW-level input leakage current 0 < VIL < VDD - - 5 A ILIH HIGH-level input leakage current 0 < VIH < VDD - - 5 A Interrupt output (pin OFF; NMOS drain with integrated 20 k pull-up resistor to VDD) VOL LOW-level output voltage IOL = 2 mA 0 - 0.3 V VOH HIGH-level output voltage IOH = 15 A 0.75VDD - - V Rpu integrated pull-up resistor 20 k pull-up resistor to VDD 16 20 24 k Protection and limitation ICC(sd) shutdown and limitation current pin VCC - 130 150 mA II/O(lim) limitation current pins I/O, AUX1 and AUX2 15 - +15 mA ICLK(lim) limitation current pin CLK 70 - +70 mA IRST(lim) limitation current pin RST 20 - +20 mA Tsd shut-down temperature - 150 - C Timing tact activation time see Figure 7 50 - 220 s tde deactivation time see Figure 8 50 80 100 s t3 start of the window for sending CLK to the card see Figure 7 50 - 130 s t5 end of the window for sending CLK to the card see Figure 7 140 - 220 s tdebounce debounce time pins PRES and PRES see Figure 10 5 8 11 ms [1] All parameters remain within limits but are tested only statistically for the temperature range. When a parameter is specified as a function of VDD or VCC it means their actual value at the moment of measurement. [2] If no external bridge is used then, to avoid any disturbance, it is recommended to connect pin 18 to ground. Pin 18 is not connected in the TDA8024AT. [3] To meet these specifications, pin VCC should be decoupled to CGND using two ceramic multilayer capacitors of low ESR both with values of 100 nF, or one 100 nF and one 220 nF (see Figure 13). [4] Permitted capacitor values are 100 nF, or 100 nF + 100 nF, or 220 nF, or 220 nF + 100 nF, or 330 nF. [5] Transition time and duty factor definitions are shown in Figure 12;  = -------------- [6] Pin CMDVCC is active LOW; pin RSTIN is active HIGH; for CLKDIV1 and CLKDIV2 functions see Table 1. [7] Pin PRES is active LOW; pin PRES is active HIGH; PRES has an integrated 1.25 A current source to GND (PRES to VDD); the card is considered present if at least one of the inputs PRES or PRES is active. t1 t1 + t2 TDA8024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4.0 — 3 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 22 of 33 TDA8024 NXP Semiconductors Standard smart card interface WU WI   92+ 92+92/    W 92/ W DDD Fig 12. Definition of output and input transition times 12. Application information Performance can be affected by the layout of the application. For example, an additional cross-capacitance of 1 pF between card reader contacts C2 and C3 or C2 and C7 can cause contact C2 to be polluted with high frequency noise from C3 (or C7). In this case, include a 100 pF capacitor between contacts C2 and CGND. Application recommendations: • Ensure there is ample ground area around the TDA8024 and the connector; place the TDA8024 very near to the connector; decouple the VDD and VDDP lines (these lines are best positioned under the connector) • The TDA8024 and the microcontroller must use the same VDD supply. Pins CLKDIV1, CLKDIV2, RSTIN, PRES, PRES, AUX1UC, I/OUC, AUX2UC, 5V/3V, CMDVCC, and OFF are referred to VDD; if pin XTAL1 is to be driven by an external clock, also refer this pin to VDD • Track C3 should be placed as far as possible from the other tracks • The track connecting CGND to C5 should be straight (the two capacitors on C1 should be connected to this ground track) • Avoid ground loops between CGND, PGND and GND • Decouple VDDP and VDD separately; if the two supplies are the same in the application, then they should be connected in star on the main track. With all these layout precautions, noise should be kept to an acceptable level and jitter on C3 should be less than 100 ps. Reference layouts are provided in “Application note 10141”, available on request. TDA8024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4.0 — 3 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 23 of 33 TDA8024 NXP Semiconductors Standard smart card interface &/.',9 Q) —)        6   &/.',9 99 9 3*1' Q) Q) 9 Nȍ  9''3 $8;8& $8;8& ,28& ;7$/ ;7$/ S) 932:(5(' 0,&52&21752//(5 2))   *1' 6   9'' 983 7'$   35(6  567,1  35(6 &0'9&&   325$',2   9&& $8;   567 $8;   &*1' &/.   Q) 9 9 9''  Nȍ Q)  &$5'5($' QRUPDOO\FORVHGW\SH Nȍ Q) & & & & & & & &  . . DDD (1) These capacitors must be of the low ESR-type and be placed near the IC (within 100 mm). (2) TDA8024 and the microcontroller must use the same VDD supply. (3) Make short, straight connections between CGND, C5 and the ground connection to the capacitor. (4) Mount one low ESR-type 100 nF capacitor close to pin VCC. (5) Mount one low ESR-type 100 or 220 nF capacitor close to C1 contact (less than 100 mm from it). (6) The connection to C3 should be routed as far from C2, C7, C4 and C8 and, if possible, surrounded by grounded tracks. (7) Optional resistor bridge for changing the threshold of VDD. If this bridge is not required pin 18 should be connected to ground; see Section 8.2.2. Pin 18 is not connected in the TDA8024AT. Fig 13. Application diagram TDA8024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4.0 — 3 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 24 of 33 TDA8024 NXP Semiconductors Standard smart card interface 13. Package outline 62SODVWLFVPDOORXWOLQHSDFNDJHOHDGVERG\ZLGWKPP 627 ' ( $ ; F \ +( Y 0 $ =   4 $ $ $  $ SLQLQGH[ ș /S /   H ES  GHWDLO; Z 0  PP VFDOH ',0(16,216LQFKGLPHQVLRQVDUHGHULYHGIURPWKHRULJLQDOPPGLPHQVLRQV 81,7 $ PD[ $ $ $ ES F ' ( H +( / /S 4 Y Z \ PP                                       LQFKHV            =       ș R R 1RWH 3ODVWLFRUPHWDOSURWUXVLRQVRIPPLQFKPD[LPXPSHUVLGHDUHQRWLQFOXGHG 5()(5(1&(6 287/,1( 9(56,21 ,(& -('(& 627 ( 06 -(,7$ (8523($1 352-(&7,21 ,668('$7(   Fig 14. Package outline SOT136-1 (SO28) TDA8024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4.0 — 3 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 25 of 33 TDA8024 NXP Semiconductors Standard smart card interface 76623SODVWLFWKLQVKULQNVPDOORXWOLQHSDFNDJHOHDGVERG\ZLGWKPP ' 627 ( $ ; F +( \ Y 0 $ =   4 $ SLQLQGH[ $  $ $ ș /S  /  GHWDLO; Z 0 ES H   PP VFDOH ',0(16,216PPDUHWKHRULJLQDOGLPHQVLRQV 81,7 $ PD[ $ $ $ ES F ' ( H +( / /S 4 Y Z \ = ș PP                            R R 1RWHV 3ODVWLFRUPHWDOSURWUXVLRQVRIPPPD[LPXPSHUVLGHDUHQRWLQFOXGHG 3ODVWLFLQWHUOHDGSURWUXVLRQVRIPPPD[LPXPSHUVLGHDUHQRWLQFOXGHG 287/,1( 9(56,21 627 5()(5(1&(6 ,(& -('(& -(,7$ (8523($1 352-(&7,21 ,668('$7(   02 Fig 15. Package outline SOT361-1 (TSSOP28) TDA8024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4.0 — 3 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 26 of 33 TDA8024 NXP Semiconductors Standard smart card interface 14. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 14.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 14.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: • Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: • • • • • • Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering 14.3 Wave soldering Key characteristics in wave soldering are: • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities TDA8024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4.0 — 3 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 27 of 33 TDA8024 NXP Semiconductors Standard smart card interface 14.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 16) than a SnPb process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 9 and 10 Table 9. SnPb eutectic process (from J-STD-020D) Package thickness (mm) Package reflow temperature (C) Volume (mm3) < 350  350 < 2.5 235 220  2.5 220 220 Table 10. Lead-free process (from J-STD-020D) Package thickness (mm) Package reflow temperature (C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 16. TDA8024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4.0 — 3 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 28 of 33 TDA8024 NXP Semiconductors Standard smart card interface temperature maximum peak temperature = MSL limit, damage level minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 16. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. TDA8024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4.0 — 3 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 29 of 33 TDA8024 NXP Semiconductors Standard smart card interface 15. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes TDA8024 v.4.0 20160603 Product data sheet - TDA8024_3 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • • Legal texts have been adapted to the new company name where appropriate. Section 5 “Ordering information”: updated TDA8024_3 20040712 Product specification - TDA8024_2 TDA8024_2 20030819 Product specification - - TDA8024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4.0 — 3 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 30 of 33 TDA8024 NXP Semiconductors Standard smart card interface 16. Legal information 16.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 16.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. TDA8024 Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 4.0 — 3 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 31 of 33 TDA8024 NXP Semiconductors Standard smart card interface Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com TDA8024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4.0 — 3 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 32 of 33 TDA8024 NXP Semiconductors Standard smart card interface 18. Contents 1 2 3 4 5 6 7 7.1 7.2 8 8.1 8.2 8.2.1 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pinning information . . . . . . . . . . . . . . . . . . . . . . 5 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6 Functional description . . . . . . . . . . . . . . . . . . . 7 Power supply . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Voltage supervisor . . . . . . . . . . . . . . . . . . . . . . 8 Without external divider on pin PORADJ (or with TDA8024AT) . . . . . . . . . . . . . . . . . . . . 8 8.2.2 With an external divider on pin PORADJ (not for the TDA8024AT). . . . . . . . . . . . . . . . . . 8 8.2.3 Applications examples . . . . . . . . . . . . . . . . . . . 9 8.2.3.1 Microcontroller requiring a 3.3 V ± 20 % supply. . . . . . . . . . . . . . . . . . . . 9 8.2.3.2 Microcontroller requiring a 3.3 V ± 10% supply . . . . . . . . . . . . . . . . . . . . 9 8.3 Clock circuitry . . . . . . . . . . . . . . . . . . . . . . . . . 10 8.4 I/O transceivers . . . . . . . . . . . . . . . . . . . . . . . 11 8.5 Inactive mode . . . . . . . . . . . . . . . . . . . . . . . . . 12 8.6 Activation sequence . . . . . . . . . . . . . . . . . . . . 12 8.7 Active mode . . . . . . . . . . . . . . . . . . . . . . . . . . 14 8.8 Deactive sequence . . . . . . . . . . . . . . . . . . . . . 14 8.9 VCC generator . . . . . . . . . . . . . . . . . . . . . . . . . 15 8.10 Fault detection . . . . . . . . . . . . . . . . . . . . . . . . 15 9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 17 10 Thermal characteristics . . . . . . . . . . . . . . . . . 17 11 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 18 12 Application information. . . . . . . . . . . . . . . . . . 23 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 25 14 Soldering of SMD packages . . . . . . . . . . . . . . 27 14.1 Introduction to soldering . . . . . . . . . . . . . . . . . 27 14.2 Wave and reflow soldering . . . . . . . . . . . . . . . 27 14.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 27 14.4 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 28 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 30 16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 31 16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 31 16.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 16.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 16.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 32 17 18 Contact information . . . . . . . . . . . . . . . . . . . . 32 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP Semiconductors N.V. 2016. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 3 June 2016 Document identifier: TDA8024