TDA8566TH/N2,518

TDA8566 2 × 40 W/2 Ω stereo BTL car radio power amplifier with differential inputs and diagnostic outputs Rev. 06 — 15 October 2007 Product data sheet 1. General description The TDA8566 is an integrated class-B output amplifier which is available in several packages. TDA8566TH is contained in a 20-lead small outline plastic package. The TDA8566TH1 is a 24-lead small outline plastic package which is pin compatible with the I2C-bus controlled amplifier TDA1566TH for one board layout. TDA8566Q is a 17-pin DIL-bent-SIL package. The device contains 2 amplifiers in a Bridge-Tied Load (BTL) configuration. The output power is 2 × 25 W in a 4 Ω load or 2 × 40 W in a 2 Ω load. It has a differential input stage and 2 diagnostic outputs. The device is primarily developed for car radio applications. 2. Features n n n n n n n n n n n n n n n n n n n n Differential inputs Very high Common Mode Rejection Ratio (CMRR) High common mode input signal handling Requires very few external components High output power 4 Ω and 2 Ω load driving capability Low offset voltage at output Fixed gain Diagnostic facility (distortion, short-circuit and temperature pre-warning) Good ripple rejection Mode select switch (operating, mute and standby) Load dump protection Short-circuit proof to ground, to VP and across the load Low power dissipation in any short-circuit condition Thermally protected Reverse polarity safe Protected against electrostatic discharge No switch-on/switch-off plops Low thermal resistance TDA8566TH1 is pin compatible with TDA1566TH TDA8566 NXP Semiconductors 2 × 40 W/2 Ω stereo BTL car radio power amplifier 3. Quick reference data Table 1. Quick reference data VP = 14.4 V; Tamb = 25 °C; fi = 1 kHz; measured in test circuit of Figure 9; unless otherwise specified. Symbol Parameter Conditions Min [1] VP supply voltage IORM repetitive peak output current Iq quiescent current Istb standby current Zi input impedance differential Po output power RL = 4 Ω; THD = 10 % RL = ∞ Ω RL = 2 Ω; THD = 10 % SVRR supply voltage ripple rejection operating αcs channel separation Po = 25 W; Rs = 10 kΩ CMRR common mode rejection Rs = 0 Ω ratio Gv closed loop voltage gain Vn(o) noise output voltage operating; Rs = 0 Ω [2] [3] [4] Typ Max Unit 6 14.4 18 V - - 7.5 A - 115 180 mA - 0.1 10 µA 100 120 150 kΩ 21 25 - W 33 40 - W 50 60 - dB 45 50 - dB 60 75 - dB 25 26 27 dB - 85 120 µV [1] The circuit is DC adjusted at VP = 6 V to 18 V and AC operating at VP = 8.5 V to 18 V. [2] Vripple = Vripple(max) = 2 V (p-p); Rs = 0 Ω. [3] Common mode rejection ratio measured at the output (over RL) with both inputs tied together; Vcommon ≤ 3.5 V (RMS); fi = 100 Hz to 10 kHz; Rs = 0 Ω. [4] Noise measured in a bandwidth of 20 Hz to 20 kHz. 4. Ordering information Table 2. Ordering information Type number Package Name Description Version TDA8566TH HSOP20 plastic, heatsink small outline package; 20 leads; low stand-off height SOT418-3 TDA8566TH1 HSOP24 plastic, heatsink small outline package; 24 leads; low stand-off height SOT566-3 TDA8566Q DBS17P plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm) SOT243-1 TDA8566_6 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 06 — 15 October 2007 2 of 21 TDA8566 NXP Semiconductors 2 × 40 W/2 Ω stereo BTL car radio power amplifier 5. Block diagram VP1 mute switch IN1+ VP2 CM IN1− OUT1+ VA 2.3 kΩ 2.3 kΩ mute switch (9×) CM OUT1− VA 60 kΩ 60 kΩ 2.3 kΩ 2.3 kΩ (9×) n.c. standby switch MODE standby reference voltage VA Vref SGND TDA8566 mute switch CLIP CLIP DIAG DIAG 1× 60 kΩ mute reference voltage 60 kΩ mute switch IN2+ CM IN2− OUT2+ VA 2.3 kΩ 2.3 kΩ mute switch (9×) CM OUT2− VA 2.3 kΩ HEATTAB(1) 2.3 kΩ (9×) PGND2 mgu358 PGND1 (1) Pin HEATTAB is available in TDA8566TH1 only. Fig 1. Block diagram TDA8566_6 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 06 — 15 October 2007 3 of 21 TDA8566 NXP Semiconductors 2 × 40 W/2 Ω stereo BTL car radio power amplifier 6. Pinning information 6.1 Pinning HEATTAB 24 1 MODE 20 1 DIAG VP2 23 2 IN2+ VP2 19 2 IN2+ n.c. 22 3 IN2− OUT2− 18 3 IN2− OUT2− 21 4 n.c. PGND2 17 4 n.c. PGND2 20 5 n.c. 5 n.c. OUT2+ 19 6 n.c. 6 n.c. OUT1− 18 PGND1 14 7 n.c. PGND1 17 OUT1+ 13 8 IN1+ OUT1+ 16 VP1 12 9 IN1− n.c. 15 10 IN1+ VP1 14 11 IN1− OUT2+ 16 OUT1− 15 TDA8566TH CLIP 11 10 SGND TDA8566TH1 DIAG 7 MODE 8 n.c. 9 n.c. 12 SGND CLIP 13 001aag902 001aah015 Fig 2. Pin configuration TDA8566TH Fig 3. Pin configuration TDA8566TH1 IN1+ 1 IN1− 2 SGND 3 CLIP 4 VP1 5 OUT1+ 6 PGND1 7 OUT1− 8 n.c. 9 TDA8566Q OUT2+ 10 PGND2 11 OUT2− 12 VP2 13 MODE 14 DIAG 15 IN2+ 16 IN2− 17 001aah059 Fig 4. Pin configuration TDA8566Q TDA8566_6 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 06 — 15 October 2007 4 of 21 TDA8566 NXP Semiconductors 2 × 40 W/2 Ω stereo BTL car radio power amplifier 6.2 Pin description Table 3. Symbol Pin description TDA8566TH and TDA8566TH1 Pin Description TDA8566TH TDA8566TH1 DIAG 1 1 short-circuit and temperature pre-warning diagnostic output IN2+ 2 2 channel 2 input positive IN2− 3 3 channel 2 input negative n.c. 4 4 not connected n.c. 5 5 not connected n.c. 6 6 not connected n.c. 7 - not connected n.c. - 8 not connected n.c. - 9 not connected IN1+ 8 10 channel 1 input positive IN1− 9 11 channel 1 input negative SGND 10 12 signal ground CLIP 11 13 clip detection output VP1 12 14 supply voltage 1 n.c. - 15 not connected OUT1+ 13 16 channel 1 output positive PGND1 14 17 power ground 1 OUT1− 15 18 channel 1 output negative n.c. - - not connected OUT2+ 16 19 channel 2 output positive PGND2 17 20 power ground 2 OUT2− 18 21 channel 2 output negative n.c. - 22 not connected VP2 19 23 supply voltage 2 MODE 20 7 mode select switch input (standby/mute/operating) HEATTAB - 24 connect to ground, used for test purposes only Table 4. Pin description TDA8566Q Symbol Pin Description IN1+ 1 channel 1 input positive IN1− 2 channel 1 input negative SGND 3 signal ground CLIP 4 clip detection output VP1 5 supply voltage 1 OUT1+ 6 channel 1 output positive PGND1 7 power ground 1 OUT1− 8 channel 1 output negative n.c. 9 not connected TDA8566_6 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 06 — 15 October 2007 5 of 21 TDA8566 NXP Semiconductors 2 × 40 W/2 Ω stereo BTL car radio power amplifier Table 4. Pin description TDA8566Q …continued Symbol Pin Description OUT2+ 10 channel 2 output positive PGND2 11 power ground 2 OUT2− 12 channel 2 output negative VP2 13 supply voltage 2 MODE 14 mode select switch input (standby/mute/operating) DIAG 15 short-circuit and temperature pre-warning diagnostic output IN2+ 16 channel 2 input positive IN2− 17 channel 2 input negative 7. Functional description The TDA8566 contains 2 identical amplifiers and can be used for BTL applications. The gain of each amplifier is fixed at 26 dB. Special features of this device are: • • • • • • Mode select switch Clip detection Short-circuit diagnostic Temperature pre-warning Open-collector diagnostic outputs Differential inputs 7.1 Mode select switch (pin MODE) • Standby: low supply current • Mute: input signal suppressed • Operating: normal on condition Since this pin has a very low input current (< 40 µA), a low-cost supply switch can be applied. To avoid switch-on plops, it is advisable to keep the amplifier in the mute mode for a period of ≥ 150 ms (charging the input capacitors at pins IN1+, IN1−, IN2+ and IN2−). This can be realized by using a microcontroller or by using an external timing circuit as illustrated in Figure 8. 7.2 Clip detection (pin CLIP) When clipping occurs at one or more output stages, the dynamic distortion detector becomes active and pin CLIP goes LOW. This information can be used to drive a sound processor or a DC volume control to attenuate the input signal and so limit the level of distortion. The output level of pin CLIP is independent of the number of channels that are being clipped. The clip detection circuit is disabled in a short-circuit condition, so if a fault condition occurs at the outputs, pin CLIP will remain at a HIGH level. The clip detection waveforms are illustrated in Figure 5. TDA8566_6 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 06 — 15 October 2007 6 of 21 TDA8566 NXP Semiconductors 2 × 40 W/2 Ω stereo BTL car radio power amplifier VO (V) 0 VCLIP (V) 0 t (s) mgu357 Fig 5. Clip detection waveforms 7.3 Short-circuit diagnostic (pin DIAG) When a short-circuit occurs at one or more outputs to ground or to the supply voltage, the output stages are switched off until the short-circuit is removed and the device is switched on again (with a delay of approximately 20 ms after the removal of the short-circuit). During this short-circuit condition, pin DIAG is continuously LOW. When a short-circuit occurs across the load of one or both channels, the output stages are switched off for approximately 20 ms. After that time the load condition is checked during approximately 50 µs to see whether the short-circuit is still present. Due to this duty cycle of 50 µs/20 ms the average current consumption during the short-circuit condition is very low (approximately 40 mA). During this condition, pin DIAG is LOW for 20 ms and HIGH for 50 µs; see Figure 6. The power dissipation in any short-circuit condition is very low. current in output stage t (s) short-circuit over the load VDIAG 20 ms (V) t (s) 50 µs mgu360 Fig 6. Short-circuit diagnostic timing diagram 7.4 Temperature pre-warning (pin DIAG) When the virtual junction temperature (Tvj) reaches 145 °C, pin DIAG will become continuously LOW. 7.5 Open-collector diagnostic outputs Pins DIAG and CLIP are open-collector outputs, therefore more devices can be tied together. Pins DIAG and CLIP can also be tied together. An external pull-up resistor is required. TDA8566_6 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 06 — 15 October 2007 7 of 21 TDA8566 NXP Semiconductors 2 × 40 W/2 Ω stereo BTL car radio power amplifier 7.6 Differential inputs The input stage is a high-impedance fully differential balanced input stage that is also capable of operating in a single-ended mode with one of the inputs capacitively coupled to an audio ground. It should be noted that if a source resistance is added (input voltage dividers) the CMRR degrades to lower values. 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VP supply voltage operating - 18 V non-operating - 30 V load dump protection; during 50 ms; tr ≥ 2.5 ms - 45 V IOSM non-repetitive peak output current - 10 A IORM repetitive peak output current - 7.5 A Tstg storage temperature −55 +150 °C Tvj virtual junction temperature - 150 °C Tamb ambient temperature −40 +85 °C Vpsc short-circuit safe voltage - 18 V Vrp reverse polarity voltage - 6.0 V Ptot total power dissipation - 60 W 9. Thermal characteristics Table 6. Thermal characteristics Thermal characteristics in accordance with IEC 60747-1. Symbol Parameter Conditions Typ Unit Rth(j-c) thermal resistance from junction to case see Figure 7 1.3 K/W Rth(j-a) thermal resistance from junction to ambient in free air 40 K/W output 1 output 2 virtual junction 2.2 K/W 2.2 K/W 0.2 K/W case 001aaa155 Fig 7. Equivalent thermal resistance network TDA8566_6 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 06 — 15 October 2007 8 of 21 TDA8566 NXP Semiconductors 2 × 40 W/2 Ω stereo BTL car radio power amplifier 10. Static characteristics Table 7. Static characteristics VP = 14.4 V; Tamb = 25 °C; measured in test circuit of Figure 9; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Supply VP supply voltage Iq quiescent current [1] RL = ∞ Ω 6 14.4 18 V - 115 180 mA 8.5 - VP V - 15 40 µA - 7.0 - V - - 100 mV 3.3 - 6.4 V - 7.0 - V - - 60 mV - - 60 mV Operating condition VMODE mode select switch level IMODE mode select switch current VO output voltage VOO output offset voltage VMODE = 14.4 V [2] Mute condition VMODE mode select switch level VO output voltage VOO output offset voltage ∆VOO output offset voltage difference [2] with respect to operating condition Standby condition VMODE mode select switch level 0 - 2 V Istb standby current - 0.1 10 µA - - 0.6 V Diagnostic VDIAG diagnostic output voltage during any fault condition [1] The circuit is DC adjusted at VP = 6 V to 18 V and AC operating at VP = 8.5 V to 18 V. [2] At VP = 18 V to 30 V the DC output voltage is ≤ 0.5VP. TDA8566_6 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 06 — 15 October 2007 9 of 21 TDA8566 NXP Semiconductors 2 × 40 W/2 Ω stereo BTL car radio power amplifier 11. Dynamic characteristics Table 8. Dynamic characteristics VP = 14.4 V; Tamb = 25 °C; RL = 2 Ω; fi = 1 kHz; measured in test circuit of Figure 9; unless otherwise specified. Symbol Parameter Po output power THD Conditions total harmonic distortion 25 30 - W 40 - W THD = 30 % 45 55 - W VP = 13.5 V; THD = 0.5 % - 25 - W VP = 13.5 V; THD = 10 % - 35 - W THD = 0.5 %; RL = 4 Ω 16 19 - W THD = 10 %; RL = 4 Ω 21 25 - W THD = 30 %; RL = 4 Ω 28 35 - W VP = 13.5 V; THD = 0.5 %; RL = 4 Ω - 14 - W VP = 13.5 V; THD = 10 %; RL = 4 Ω - 22 - W - 0.1 - % - 8 - % Po = 1 W; RL = 4 Ω - 0.05 - % - 20 to 20000 - Hz - 25 - Hz 20 - - kHz 25 26 27 dB Po = 1 W VCLIP = 0.6 V fro(l) low frequency roll off −1 dB fro(h) high frequency roll off −1 dB Gv closed loop voltage gain SVRR supply voltage ripple rejection input impedance mismatch Vn(o) noise output voltage αcs channel separation |∆Gv| channel unbalance [1] [2] operating [3] 50 60 - dB mute [3] 50 - - dB standby [3] 80 - - dB differential 100 120 150 kΩ single-ended 50 60 75 kΩ - 2 - % operating; Rs = 0 Ω [4] - 85 120 µV operating; Rs = 10 kΩ [4] - 100 - µV mute; independent of Rs [4] Po = 25 W; Rs = 10 kΩ TDA8566_6 Product data sheet Unit 33 THD = 0.5 %; Po = −1 dB with respect to 25 W |∆Zi| Max THD = 0.5 % power bandwidth input impedance Typ THD = 10 % B Zi Min - 60 - µV 45 50 - dB - - 1 dB © NXP B.V. 2007. All rights reserved. Rev. 06 — 15 October 2007 10 of 21 TDA8566 NXP Semiconductors 2 × 40 W/2 Ω stereo BTL car radio power amplifier Table 8. Dynamic characteristics …continued VP = 14.4 V; Tamb = 25 °C; RL = 2 Ω; fi = 1 kHz; measured in test circuit of Figure 9; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Vo(mute) output signal voltage in mute Vin = Vin(max) = 1 V (RMS) - - 2 mV CMRR common mode rejection ratio Rs = 0 Ω [5] 60 75 - dB Rs = 45 kΩ [6] 40 - - dB [1] Dynamic distortion detector active; pin CLIP is LOW. [2] Frequency response externally fixed. [3] Vripple = Vripple(max) = 2 V (p-p); Rs = 0 Ω. [4] Noise measured in a bandwidth of 20 Hz to 20 kHz. [5] Common mode rejection ratio measured at the output (over RL) with both inputs tied together; Vcommon ≤ 3.5 V (RMS); fi = 100 Hz to 10 kHz; Rs = 0 Ω. [6] Common mode rejection ratio measured at the output (over RL) with both inputs tied together; Vcommon ≤ 3.5 V (RMS); fi = 1 kHz; Rs = 45 kΩ. The mismatch of the input coupling capacitors is excluded. 12. Application information 12.1 Diagnostic output Special care must be taken in the PCB layout to separate pin CLIP from pins IN1+, IN1−, IN2+ and IN2− to minimize the crosstalk between the CLIP output and the inputs. 12.2 Mode select switch To avoid switch-on plops, it is advisable to keep the amplifier in the mute mode during ≥ 150 ms (charging of the input capacitors at pins IN1+, IN1−, IN2+ and IN2−). The circuit in Figure 8 slowly ramps-up the voltage at the mode select switch pin when switching on and results in fast muting when switching off. +VP S 10 kΩ + 47 µF 100 Ω mode select switch 100 kΩ mgd102 Fig 8. Mode select switch circuit TDA8566_6 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 06 — 15 October 2007 11 of 21 TDA8566 NXP Semiconductors 2 × 40 W/2 Ω stereo BTL car radio power amplifier 13. Test information + VMODE _ MODE Rs/2 220 nF VP1 VP2 + 2200 µF (16V) 100 nF VP = _ 14.4 V IN1+ OUT1+ 60 kΩ TDA8566 Vin1 Rs/2 220 nF IN1− 60 kΩ OUT1− − SGND 220 nF VP 10 kΩ Vref Rs/2 RL1 VP 10 kΩ CLIP DETECTOR CLIP DIAGNOSTIC INTERFACE DIAG IN2+ OUT2+ 60 kΩ RL2 Vin2 Rs/2 220 nF 60 kΩ OUT2− IN2− PGND1 PGND2 mgu359 Fig 9. Stereo BTL test diagram TDA8566_6 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 06 — 15 October 2007 12 of 21 TDA8566 NXP Semiconductors 2 × 40 W/2 Ω stereo BTL car radio power amplifier 14. Package outline HSOP20: plastic, heatsink small outline package; 20 leads; low stand-off height SOT418-3 E D A x X c E2 y HE v M A D1 D2 10 1 pin 1 index Q A A2 E1 (A3) A4 θ Lp detail X 20 11 Z w M bp e 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT mm A A2 max. 3.5 3.5 3.2 A3 0.35 A4(1) D1 D2 E(2) E1 E2 e HE Lp Q +0.08 0.53 0.32 16.0 13.0 −0.04 0.40 0.23 15.8 12.6 1.1 0.9 11.1 10.9 6.2 5.8 2.9 2.5 1.27 14.5 13.9 1.1 0.8 1.7 1.5 bp c D(2) v w x y 0.25 0.25 0.03 0.07 Z θ 2.5 2.0 8° 0° Notes 1. Limits per individual lead. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 02-02-12 03-07-23 SOT418-3 Fig 10. Package outline SOT418-3 (HSOP20) TDA8566_6 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 06 — 15 October 2007 13 of 21 TDA8566 NXP Semiconductors 2 × 40 W/2 Ω stereo BTL car radio power amplifier HSOP24: plastic, heatsink small outline package; 24 leads; low stand-off height SOT566-3 E D A x X c E2 y HE v M A D1 D2 12 1 pin 1 index Q A A2 E1 (A3) A4 θ Lp detail X 24 13 Z w M bp e 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT mm A A2 max. 3.5 3.5 3.2 A3 0.35 A4(1) D1 D2 E(2) E1 E2 e HE Lp Q +0.08 0.53 0.32 16.0 13.0 −0.04 0.40 0.23 15.8 12.6 1.1 0.9 11.1 10.9 6.2 5.8 2.9 2.5 1 14.5 13.9 1.1 0.8 1.7 1.5 bp c D(2) v w x y 0.25 0.25 0.03 0.07 Z θ 2.7 2.2 8° 0° Notes 1. Limits per individual lead. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 03-02-18 03-07-23 SOT566-3 Fig 11. Package outline SOT566-3 (HSOP24) TDA8566_6 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 06 — 15 October 2007 14 of 21 TDA8566 NXP Semiconductors 2 × 40 W/2 Ω stereo BTL car radio power amplifier DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm) SOT243-1 non-concave Dh x D Eh view B: mounting base side A2 d B j E A L3 L Q c 1 v M 17 e1 Z bp e e2 m w M 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A2 bp c D (1) d Dh E (1) mm 17.0 15.5 4.6 4.4 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 12.2 11.8 e e2 Eh j L L3 m Q v w x Z (1) 5.08 6 3.4 3.1 12.4 11.0 2.4 1.6 4.3 2.1 1.8 0.8 0.4 0.03 2.00 1.45 e1 2.54 1.27 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-17 03-03-12 SOT243-1 Fig 12. Package outline SOT243-1 (DBS17P) TDA8566_6 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 06 — 15 October 2007 15 of 21 TDA8566 NXP Semiconductors 2 × 40 W/2 Ω stereo BTL car radio power amplifier 15. Soldering This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 15.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 15.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: • Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: • • • • • • Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus PbSn soldering 15.3 Wave soldering Key characteristics in wave soldering are: • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities TDA8566_6 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 06 — 15 October 2007 16 of 21 TDA8566 NXP Semiconductors 2 × 40 W/2 Ω stereo BTL car radio power amplifier 15.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 13) than a PbSn process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 9 and 10 Table 9. SnPb eutectic process (from J-STD-020C) Package thickness (mm) Package reflow temperature (°C) Volume (mm3) < 350 ≥ 350 < 2.5 235 220 ≥ 2.5 220 220 Table 10. Lead-free process (from J-STD-020C) Package thickness (mm) Package reflow temperature (°C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 13. TDA8566_6 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 06 — 15 October 2007 17 of 21 TDA8566 NXP Semiconductors 2 × 40 W/2 Ω stereo BTL car radio power amplifier temperature maximum peak temperature = MSL limit, damage level minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 13. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. TDA8566_6 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 06 — 15 October 2007 18 of 21 TDA8566 NXP Semiconductors 2 × 40 W/2 Ω stereo BTL car radio power amplifier 16. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes TDA8566_6 20071015 Product data sheet - TDA8566Q_5 TDA8566TH_2 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • • • • Legal texts have been adapted to the new company name where appropriate. Section 9 “Thermal characteristics”: changed value of Rth(j-c) to 1.3 K/W Figure 7: values updated Included TDA8566TH1 and TDA8566Q in the data sheet TDA8566Q_5 20010221 Product specification - - TDA8566TH_2 20030708 Product specification - - TDA8566_6 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 06 — 15 October 2007 19 of 21 TDA8566 NXP Semiconductors 2 × 40 W/2 Ω stereo BTL car radio power amplifier 17. Legal information 17.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 17.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 17.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 17.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 18. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com TDA8566_6 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 06 — 15 October 2007 20 of 21 TDA8566 NXP Semiconductors 2 × 40 W/2 Ω stereo BTL car radio power amplifier 19. Contents 1 2 3 4 5 6 6.1 6.2 7 7.1 7.2 7.3 7.4 7.5 7.6 8 9 10 11 12 12.1 12.2 13 14 15 15.1 15.2 15.3 15.4 16 17 17.1 17.2 17.3 17.4 18 19 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 Functional description . . . . . . . . . . . . . . . . . . . 6 Mode select switch (pin MODE) . . . . . . . . . . . . 6 Clip detection (pin CLIP). . . . . . . . . . . . . . . . . . 6 Short-circuit diagnostic (pin DIAG) . . . . . . . . . . 7 Temperature pre-warning (pin DIAG) . . . . . . . . 7 Open-collector diagnostic outputs . . . . . . . . . . 7 Differential inputs . . . . . . . . . . . . . . . . . . . . . . . 8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8 Thermal characteristics. . . . . . . . . . . . . . . . . . . 8 Static characteristics. . . . . . . . . . . . . . . . . . . . . 9 Dynamic characteristics . . . . . . . . . . . . . . . . . 10 Application information. . . . . . . . . . . . . . . . . . 11 Diagnostic output . . . . . . . . . . . . . . . . . . . . . . 11 Mode select switch . . . . . . . . . . . . . . . . . . . . . 11 Test information . . . . . . . . . . . . . . . . . . . . . . . . 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Introduction to soldering . . . . . . . . . . . . . . . . . 16 Wave and reflow soldering . . . . . . . . . . . . . . . 16 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 16 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 17 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 19 Legal information. . . . . . . . . . . . . . . . . . . . . . . 20 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Contact information. . . . . . . . . . . . . . . . . . . . . 20 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2007. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 15 October 2007 Document identifier: TDA8566_6