TDF8546J/N2,112

Advance Product Change Notification Issue Date: 201506028A 08-Jul-2015 Here’s your personalized quality information concerning products DigiKey purchased from NXP. For detailed information we invite you to view this notification online Management Summary As part of the NXP Business Continuity Management (BCM) program it has been decided to establish Dual Sourcing for TDF8546, TDF8546A & TDF8548A. Change Category [ ] Wafer Fab process [ ] Assembly Process [X] Product Marking [ ] Design [ ] Wafer Fab materials [ ] Assembly Materials [ ] Electrical spec./Test coverage [ ] Mechanical Specification [X] Wafer Fab location [ ] Assembly Location [ ] Test Location [X] Packing/Shipping/Labeling Introduction of a dual source - TDF8546, TDF8546A, TDF8548A Details of this Planned Change As part of the NXP Business Continuity Management (BCM) program it has been decided to establish Dual Sourcing for TDF8546, TDF8546A & TDF8548A. The following changes are applied: 1. The diffusion fab of TDF8546, TDF8546A & TDF8548A will have a 2nd location of wafer fab VIS, Taiwan, in parallel to the current running production in wafer fab ICN8 (Nijmegen, The Netherlands). 2. Two sourcing combinations will be qualified and are planned to be delivered to the market: a. VIS-APK b. ICN8-APK; qualified and released for production. The actual sourcing is finally at NXP's discretion 3. Metal layer thickness of VIS is upgraded to Ti/NiV/Ag=100/300/600 (from ICN8 Ti/NiV/Ag=100/500/100) to use the latest technology with rougher surface which leads to improved metal adhesion and requires improved coverage of the NiV layer. After Die bonding (soldering of die on the heat slug) product are the same again 4. A new 12NC is defined for all dual source types (see new product 12NC overview). 5. The marking on the IC (see Identification of Affected Products section) will change accordingly The mentioned changes will not imply any change in product, fit, form and function (no change in specification!!) Why do we Plan this Change 1. Support continuous customer deliveries in case of major natural disasters / significant business interruptions 2. To meet customers demand and support future growth by increasing flexibility and capacity 3. Align with world-class technology trends Identification of Affected Products Top side marking Marking on the IC will be as follows: 1. 3rd line depending on the waferfab source 2. "r" : Waferfab VIS, Taiwan 3. "T": Waferfab ICN8, The Netherlands Product Availability Sample Information Samples are available from 14-Sep-2015 The engineering samples are marked with a "X" (end of date code line) The CQS samples are marked with a "Y" (end of date code line) R-Gate samples will not have any Y or X. Production Planned first shipment 14-Dec-2015 Impact no impact to the product's functionality anticipated. Data Sheet Revision No impact to existing datasheet Disposition of Old Products Existing inventory will be shipped until depleted Timing and Logistics The Self Qualification Report will be ready on 14-Sep-2015. The Final PCN is planned to be issued on: 14-Sep-2015. Your acknowledgement of this change, conform JEDEC JESD46 D, is expected till 07-Aug-2015. Contact and Support For all inquiries regarding the ePCN tool application or access issues, please contact NXP "Global Quality Support Team". For all Quality Notification content inquiries, please contact your local NXP Sales Support team. For specific questions on this notice or the products affected please contact our specialist directly: Name Anja von Borstel Position Commercial Marketing Manager e-mail address anja.vonborstel@nxp.com At NXP Semiconductors we are constantly striving to improve our product and processes to ensure they reach the highest possible Quality Standards. Customer Focus, Passion to Win. NXP Quality Management Team. About NXP Semiconductors NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. You have received this email because you are a designated contact or subscribed to NXP’s Quallity Notifications. NXP shall not be held liable if this Notification is not correctly distributed within your organization. This message has been automatically distributed. Please do not reply. View Notification NXP | Privacy Policy | Terms of Use NXP Semiconductors High Tech Campus, 5656 AG Eindhoven, The Netherlands © 2006-2010 NXP Semiconductors. All rights reserved. Subscription Support