TDF8599CTH/N1,118

201310005I Customer Information Notification Issue Date: 17-Oct-2013 Effective Date: 01-Mar-2014 Here’s your personalized quality information concerning products Digi-Key purchased from NXP. For detailed information we invite you to view this notification online Change Category [ ] Wafer Fab process [X] Wafer Fab materials [ ] Wafer Fab location [ ] Assembly Process [ ] Assembly Materials [ ] Assembly Location [ ] Product Marking [ ] Electrical spec./Test coverage [ ] Test Location [ ] Design [ ] Mechanical Specification [ ] Packing/Shipping/Labeling Change to newer generation tool for 200mm wafer backside metallization Information Notification For the wafer backside metallization of our audio amplifier products produced on 200mm wafers a newer generation metal deposition tool will be used, leading to an adapted metal stack on the backside metal. - TiNiAg layer will change to TiNiVAg layer - Ti thickness will be modified from 120nm +/-20nm to 100nm +/-15nm The change does not imply any change to product fit, form and function. Product and process qualification will be finished in Q1/2014 After NXP release the change will be implemented as running change in the production and deliveries. Material from the current flow will be used until material in progress and stocks are fully depleted. The final product identification will not change - type name, 12NC and product marking stay the same. The change will be traceable by the date code per product type. Implementation is planned for Q1/2014 Why do we issue this Information Notification Reason for change is to secure future deliveries - The tools currently used for 200mm wafer backside metallization are reaching their end of life - The production capacity of the current tool is restricted 1 Identification of Affected Products Product identification does not change The change will be traceable by the date code per product type. Impact no impact to the product's functionality anticipated. The change does not imply any change to product fit, form and function. Data Sheet Revision No impact to existing datasheet Disposition of Old Products Existing inventory will be shipped until depleted Contact and Support For all inquiries regarding the ePCN tool application or access issues, please contact NXP "Global Quality Support Team". For all Quality Notification content inquiries, please contact your local NXP Sales Support team. For specific questions on this notice or the products affected please contact our specialist directly: Anja von Borstel Name Commercial Marketing Manager Position anja.vonborstel@nxp.com e-mail address At NXP Semiconductors we are constantly striving to improve our product and processes to ensure they reach the highest possible Quality Standards. Customer Focus, Passion to Win. NXP Quality Management Team. About NXP Semiconductors NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted unaudited revenue of $4.36 billion in 2012. You have received this email because you are a designated contact or subscribed to NXP’s Quallity Notifications. NXP shall not be held liable if this Notification is not correctly distributed within your organization. This message has been automatically distributed. Please do not reply. View Notification Subscription NXP | Privacy Policy | Terms of Use NXP Semiconductors High Tech Campus, 5656 AG Eindhoven, The Netherlands © 2006-2010 NXP Semiconductors. All rights reserved. 2 Support