TEA1552T/N1,518

TEA1552 HV start-up flyback controller for DCM or QR mode; 125 kHz fosc(h); standby output signal Rev. 3.1 — 21 June 2012 Product data sheet 1. General description The GreenChipII is the second generation of green Switched Mode Power Supply (SMPS) control ICs operating directly from the rectified universal mains. A high level of integration leads to a cost effective power supply with a very low number of external components. The special built-in green functions allow the efficiency to be optimum at all power levels. This holds for quasi-resonant operation at high power levels, as well as fixed frequency operation with valley switching at medium power levels. At low power (standby) levels, the system operates at reduced frequency and with valley detection. The proprietary high voltage BCD800 process makes direct start-up possible from the rectified mains voltage in an effective and green way. A second low voltage BICMOS IC is used for accurate, high speed protection functions and control. Highly efficient, reliable supplies can easily be designed using the GreenChipII control IC. 2. Features and benefits  Distinctive features:  Universal mains supply operation (70 V AC to 276 V AC)  High level of integration, giving a very low external component count.  Green features:  Valley or zero voltage switching for minimum switching losses  Efficient quasi-resonant operation at high power levels  Frequency reduction at low power standby for improved system efficiency ( 100 V 1.0 1.2 1.4 mA with auxiliary supply; VDRAIN > 100 V - 100 300 μA Start-up current source (pin DRAIN) IDRAIN supply current from pin DRAIN BVDSS breakdown voltage 650 - - V M-level mains-dependent operation-enabling level 60 - 100 V Supply voltage management (pin VCC) VCC(start) start-up voltage on VCC 10.3 11 11.7 V VCC(UVLO) undervoltage lock-out on VCC 8.1 8.7 9.3 V VCC(hys) hysteresis voltage on VCC VCC(start) − VCC(UVLO) 2.0 2.3 2.6 V ICC(h) pin VCC charging current (high) VDRAIN > 100 V; VCC < 3V −1.2 −1 −0.8 mA ICC(l) pin VCC charging current (low) VDRAIN > 100 V; 3 V < VCC < VCC(UVLO) −1.2 −0.75 −0.45 mA ICC(restart) pin VCC restart current VDRAIN > 100 V; VCC(UVLO) < VCC < VCC(start) −650 −550 −450 μA ICC(oper) supply current under normal operation no load on pin DRIVER 1.1 1.3 1.5 mA 50 100 150 mV −50[1] - −10 nA −0.5 −0.25 −0.05 V 0.5 0.7 0.9 V 1.1 1.5 1.9 μs - tleb - ns Demagnetization management (pin DEM) Vth(DEM) demagnetization comparator threshold voltage on pin DEM Iprot(DEM) protection current on pin DEM Vclamp(DEM)(neg) negative clamp voltage on pin DEM IDEM = −150 μA Vclamp(DEM)(pos) positive clamp voltage on pin DEM tsuppr suppression of transformer ringing at start of secondary stroke VDEM = 50 mV IDEM = 250 μA Pulse width modulator ton(min) minimum on-time ton(max) maximum on-time latched 40 50 60 μs fosc(l) oscillator low fixed frequency VCTRL > 1.5 V 20 25 30 kHz fosc(h) oscillator high fixed frequency VCTRL < 1 V 100 125 150 kHz - VCO[1] − mV - VCO[1] − 25 − mV Oscillator Vvco(start) peak voltage on pin Isense, where frequency reduction starts Vvco(max) peak voltage on pin Isense, where the frequency is equal to fosc(l) TEA1552 Product data sheet see Figure 5 and Figure 6 All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 21 June 2012 © NXP B.V. 2012. All rights reserved. 14 of 26 TEA1552 NXP Semiconductors HV start-up flyback controller for DCM or QR mode Table 5. Characteristics …continued Tamb = 25 °C; VCC = 15 V; all voltages are measured with respect to ground; currents are positive when flowing into the IC; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Duty cycle control (pin CTRL) VCTRL(min) minimum voltage on pin CTRL for maximum duty cycle - 1.0 - V VCTRL(max) maximum voltage on pin CTRL for minimum duty cycle - 1.5 - V 4.75 5.0 5.25 V −1.0 - - mA 2.37 2.5 2.63 V 5 V output (pin VCC(5V)) VCC(5V) output voltage IO = 1 mA ICC(5V) current capability of pin VCC(5V) LOCK input (pin LOCK) VLOCK LOCK trip level VCC(reset) voltage level on pin VCC which resets the latch VLOCK < 2.3 V - 4.5 - V RELLOCK,5V relation to 5 V output (pin VCC(5V)) VLOCK = 0.5 × VCC(5V) −4 - +4 % −85 - +85 V/μs - 150[1] - ns Valley switch (pin DRAIN) ΔV/Δtvalley tvalley-swon valley recognition voltage change delay from valley recognition to switch-on Overcurrent and short winding protection (pin Isense) Vsense(max) maximum source voltage OCP ΔV/Δt = 0.1 V/μs 0.48 0.52 0.56 V tPD propagation delay from detecting Vsense(max) to switch-off ΔV/Δt = 0.5 V/μs − 140 185 ns Vswp short winding protection voltage 0.83 0.88 0.96 V tleb blanking time for current and short winding protection 300 370 440 ns ISS soft start current Vsense < 0.5 V 45 60 75 μA set by resistor RDEM; see Section 7.9 54 60 66 μA set by resistor RDEM; see Section 7.12 − −24 − μA − −100 − μA Overvoltage protection (pin DEM) IOVP(DEM) OVP level on pin DEM Overpower protection (pin DEM) IOPP(DEM) OPP current on pin DEM to start OPP correction IOPP50%(DEM) OPP current on pin DEM, where maximum source voltage is limited to 0.3 V Standby output (pin STDBY) VSTDBY standby output voltage 4.75 5.0 5.25 V Isource source current capability VSTDBY = 1 V 20 22 24 μA Isink sink current capability VSTDBY = 1.2 V 2 - TEA1552 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 21 June 2012 mA © NXP B.V. 2012. All rights reserved. 15 of 26 TEA1552 NXP Semiconductors HV start-up flyback controller for DCM or QR mode Table 5. Characteristics …continued Tamb = 25 °C; VCC = 15 V; all voltages are measured with respect to ground; currents are positive when flowing into the IC; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Driver (pin Driver) Isource source current capability of driver VCC = 9.5 V; VDRIVER = 2 V - −170 −88 mA Isink sink current capability of driver VCC = 9.5 V; VDRIVER = 2 V - 300 - mA VCC = 9.5 V; VDRIVER = 9.5 V 400 700 - mA VCC > 12 V - 11.5 12 V 130 140 150 °C - 8 - °C Vo(driver)(max) maximum output voltage of driver Temperature protection Tprot(max) maximum temperature protection level Tprot(hys) hysteresis for the temperature protection level [1] [1] Guaranteed by design. TEA1552 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 21 June 2012 © NXP B.V. 2012. All rights reserved. 16 of 26 TEA1552 NXP Semiconductors HV start-up flyback controller for DCM or QR mode 11. Application information VCOadj Isense STDBY DRIVER HVS HVS DRAIN 1 14 DEM 2 13 CTRL 3 12 LOCK VCC(5V) 11 4 5 6 7 TEA1552T 10 GND 9 n.c. VCC 8 mbl498 Fig 10. Basic application A converter with the TEA1552 consists of an input filter, a transformer with a third winding (auxiliary), and an output stage with a feedback circuit. Capacitor CVCC (at pin VCC) buffers the supply voltage of the IC, which is powered via the high voltage rectified mains during start-up and via the auxiliary winding during operation. A sense resistor converts the primary current into a voltage at pin Isense. The value of this sense resistor defines the maximum primary peak current. TEA1552 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 21 June 2012 © NXP B.V. 2012. All rights reserved. 17 of 26 TEA1552 NXP Semiconductors HV start-up flyback controller for DCM or QR mode Vmains Vi PFC VCC CVCC n.c. GND VCC(5V) -t LOCK CTRL 8 7 9 6 10 5 TEA1552T 11 4 12 3 13 2 14 1 CCTRL DEM RCTRL Np DRAIN Do Vo Ns Co HVS power MOSFET HVS DRIVER STDBY Isense CSS Rs2 VCOadj RSS Rsense RDEM Naux Rreg1 Rreg2 mbl504 Pin LOCK is used in this example for an additional external overtemperature protection. If pin LOCK is not used, it must be tied to ground. Fig 11. Configuration with controlled PFC. TEA1552 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 21 June 2012 © NXP B.V. 2012. All rights reserved. 18 of 26 TEA1552 NXP Semiconductors HV start-up flyback controller for DCM or QR mode Vi VD (power MOSFET) Vo VCC Vgate M-level VmC start-up sequence normal operation overvoltage protection normal operation output short-circuit mbl505 Fig 12. Typical waveforms. TEA1552 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 21 June 2012 © NXP B.V. 2012. All rights reserved. 19 of 26 TEA1552 NXP Semiconductors HV start-up flyback controller for DCM or QR mode 12. Package outline SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 D E A X c y HE v M A Z 8 14 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 7 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.75 8.55 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.35 0.014 0.0075 0.34 0.16 0.15 0.010 0.057 inches 0.069 0.004 0.049 0.05 0.244 0.039 0.041 0.228 0.016 0.028 0.024 0.01 0.01 0.028 0.004 0.012 θ 8o o 0 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT108-1 076E06 MS-012 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 13. Package outline SOT108-1 (SO14) TEA1552 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 21 June 2012 © NXP B.V. 2012. All rights reserved. 20 of 26 TEA1552 NXP Semiconductors HV start-up flyback controller for DCM or QR mode 13. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 13.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 13.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: • Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: • • • • • • Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering 13.3 Wave soldering Key characteristics in wave soldering are: • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities TEA1552 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 21 June 2012 © NXP B.V. 2012. All rights reserved. 21 of 26 TEA1552 NXP Semiconductors HV start-up flyback controller for DCM or QR mode 13.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 14) than a SnPb process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 6 and 7 Table 6. SnPb eutectic process (from J-STD-020C) Package thickness (mm) Package reflow temperature (°C) Volume (mm3) < 350 ≥ 350 < 2.5 235 220 ≥ 2.5 220 220 Table 7. Lead-free process (from J-STD-020C) Package thickness (mm) Package reflow temperature (°C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 14. TEA1552 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 21 June 2012 © NXP B.V. 2012. All rights reserved. 22 of 26 TEA1552 NXP Semiconductors HV start-up flyback controller for DCM or QR mode maximum peak temperature = MSL limit, damage level temperature minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 14. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 14. Abbreviations Table 8. Abbreviations Acronym Description BiCMOS Bipolar Complementary Metal-Oxide Semiconductor DMOS Diffusion Metal-Oxide Semiconductor ESR Equivalent Series Resistance EZ-HV SOI Easy High Voltage Silicon-On-Insulator FET Field-Effect Transistor PWM Pulse Width Modulation SMPS Switched Mode Power Supply SOPS Self-Oscillating Power Supply 15. Revision history Table 9. Revision history Document ID Release date Data sheet status Change notice Supersedes TEA1552 v.3.1 20120621 Product data sheet - TEA1552 v.3 Modifications: • • Data sheet title changed. Table 1 “Ordering information” on page 2 updated. TEA1552 v.3 20120418 Product data sheet - TEA1552 v.2 TEA1552 v.2 20020827 Product specification - TEA1552 v.1 TEA1552 v.1 20020703 Product specification - - TEA1552 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 21 June 2012 © NXP B.V. 2012. All rights reserved. 23 of 26 TEA1552 NXP Semiconductors HV start-up flyback controller for DCM or QR mode 16. Legal information 16.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 16.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. TEA1552 Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 21 June 2012 © NXP B.V. 2012. All rights reserved. 24 of 26 TEA1552 NXP Semiconductors HV start-up flyback controller for DCM or QR mode Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. GreenChip — is a trademark of NXP B.V. 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com TEA1552 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 21 June 2012 © NXP B.V. 2012. All rights reserved. 25 of 26 TEA1552 NXP Semiconductors HV start-up flyback controller for DCM or QR mode 18. Contents 1 2 3 3.1 4 5 6 6.1 6.2 7 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 7.9 7.10 7.11 7.12 7.13 7.14 7.15 7.16 7.17 7.18 7.19 8 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 16 16.1 16.2 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Typical application . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 4 Start-up, mains enabling operation level and undervoltage lock-out (see Figure 11 and 12) . 5 Supply management. . . . . . . . . . . . . . . . . . . . . 5 Current mode control . . . . . . . . . . . . . . . . . . . . 5 Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 VCO adjustment . . . . . . . . . . . . . . . . . . . . . . . . 6 Cycle skipping . . . . . . . . . . . . . . . . . . . . . . . . . 7 Standby output . . . . . . . . . . . . . . . . . . . . . . . . . 7 Demagnetization. . . . . . . . . . . . . . . . . . . . . . . . 8 OverVoltage Protection (OVP) . . . . . . . . . . . . . 8 Valley switching (see Figure 7) . . . . . . . . . . . . . 8 OverCurrent Protection (OCP) . . . . . . . . . . . . . 9 OverPower Protection (OPP) . . . . . . . . . . . . . 10 Minimum and maximum ‘on-time’ . . . . . . . . . . 10 Short winding protection . . . . . . . . . . . . . . . . . 10 Lock input . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Overtemperature Protection (OTP). . . . . . . . . 11 Soft start-up . . . . . . . . . . . . . . . . . . . . . . . . . . 11 5 V output . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 13 Thermal characteristics . . . . . . . . . . . . . . . . . 13 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 14 Application information. . . . . . . . . . . . . . . . . . 17 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 20 Soldering of SMD packages . . . . . . . . . . . . . . 21 Introduction to soldering . . . . . . . . . . . . . . . . . 21 Wave and reflow soldering . . . . . . . . . . . . . . . 21 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 21 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 22 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 23 Legal information. . . . . . . . . . . . . . . . . . . . . . . 24 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 24 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 16.3 16.4 17 18 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information . . . . . . . . . . . . . . . . . . . . Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 25 25 26 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2012. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 21 June 2012 Document identifier: TEA1552