TEA1708T/1J

TEA1708T GreenChip X capacitor discharge IC Rev. 1.1 — 6 April 2020 1 Product data sheet General description The TEA1708 is an automatic discharge IC for X capacitors with a low power consumption (typically 1 mW at 230 V (AC). A 500 V clamping circuit is integrated, protecting the IC during mains surges. In a typical application with only two 200 kΩ resistors, the maximum differential mode mains surge voltage allowed exceeds 6 kV. A metal-oxide varistor is not required to protect the IC. The X-capacitor discharge current is internally limited to 2.3 mA. The discharge delay timer is set externally using a low-voltage capacitor. To reduce EMI while retaining the low standby power, the very low power consumption with a high discharge current enables the use of a high value X-capacitor. 2 Features and benefits • • • • • • • 3 1 mW power consumption at 230 V (AC) Integrated 500 V clamp; no metal oxide varistor required to protect the IC Self-Supplied, no external bias required Discharge current internally limited Adjustable discharge delay Very high differential surge: 6 kV with two 200 kΩ resistors Easier application design, resolving EMI issues while retaining the efficiency level Applications • All AC-connected power supplies with X-capacitors > 100 nF requiring a low load standby power. 4 Ordering information Table 1. Ordering information Type number TEA1708T/1 Package Name Description Version SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 TEA1708T NXP Semiconductors GreenChip X capacitor discharge IC 5 Marking Table 2. Marking codes 6 Type number Marking code TEA1708T/1 TEA1708 Block diagram HV1 500 V 1 µA 1.2 V TMR1 20 V TMR2 500 V HV2 aaa-007783 Figure 1. TEA1708 block diagram TEA1708T Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1.1 — 6 April 2020 © NXP B.V. 2020. All rights reserved. 2 / 12 TEA1708T NXP Semiconductors GreenChip X capacitor discharge IC 7 Pinning information 7.1 Pinning n.c. 1 TMR2 2 n.c. 3 TMR1 4 IC 8 HV1 7 n.c. 6 n.c. 5 HV2 aaa-007784 Figure 2. TEA1708 pinning diagram 7.2 Pin description Table 3. Pin description TEA1708T Product data sheet Symbol Pin Description n.c. 1 not connected TMR2 2 timer pin 2 n.c. 3 not connected TMR1 4 timer pin 1 HV2 5 high-voltage mains connection 2 n.c. 6 not connected n.c. 7 not connected HV1 8 high-voltage mains connection 1 All information provided in this document is subject to legal disclaimers. Rev. 1.1 — 6 April 2020 © NXP B.V. 2020. All rights reserved. 3 / 12 TEA1708T NXP Semiconductors GreenChip X capacitor discharge IC 8 Functional description The TEA1708 incorporates a timer and a zero-crossing mains voltage detector. If a positive or negative voltage exceeding the threshold zero-crossing mains voltage (20 V) is applied between the high-voltage pins, the timer charges the external capacitor on the TMR1 and TMR2 pins. If the voltage between the TMR1 and TMR2 pins reaches 1.2 V, a discharge current is activated. If the voltage applied between the high-voltage pins, is below the threshold zero-crossing mains voltage, the external capacitor is discharged and the discharging stops. The discharge current is internally limited. When an AC mains voltage is applied, the timer capacitor is charged between the mains zero crossings and discharged during the mains zero crossings. When the AC mains is disconnected and a high voltage remains on the X-capacitor, the timer charges the external capacitor above its discharge activation threshold voltage point (1.2 V), switching on the internally limited discharge current of the external X-capacitor. Mains disconnect AC Mains TMR voltage 1.2 V aaa-007788 Figure 3. Functional behavior To protect the IC during mains surges, a high-voltage clamping circuit is integrated. The clamping circuit is activated for positive and negative voltages > 500 V. The high-voltage pins HV1 and HV2 are fully symmetrical. TEA1708T Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1.1 — 6 April 2020 © NXP B.V. 2020. All rights reserved. 4 / 12 TEA1708T NXP Semiconductors GreenChip X capacitor discharge IC 9 Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Voltages VTMR1-TMR2 voltage between pin TMR1 0 μA > Idch(tmr) < 10 μA and pin TMR2 −0.4 +3.5 V VHV1-HV2 voltage between pin HV1 and pin HV2 normal operation, so no mains surge −410 +410 V current on pin HV both HV pins; t < 2 ms, during mains surge −15 +15 mA Ptot total power dissipation Tamb < 75 °C - 0.5 W Tstg storage temperature −55 +150 °C Tj junction temperature −40 +150 °C - 1000 V - 4000 V - 750 V Currents IHV General ESD VESD electrostatic discharge voltage class 1 human body model (HBM); pins HV1 and HV2 [1] human body model(HBM); all other pins charged device model (CDM); all pins [1] [2] [2] Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor. Equivalent to discharging a 200 pF capacitor through a 0.75 μH coil and a 10 Ω resistor. 10 Thermal characteristics Table 5. Thermal characteristics TEA1708T Product data sheet Symbol Parameter Conditions Typ Unit Rth(j-a) thermal resistance from junction to ambient in free air; JEDEC test board 160 K/W Rth(j-c) thermal resistance from junction to case in free air; JEDEC test board 72 K/W All information provided in this document is subject to legal disclaimers. Rev. 1.1 — 6 April 2020 © NXP B.V. 2020. All rights reserved. 5 / 12 TEA1708T NXP Semiconductors GreenChip X capacitor discharge IC 11 Characteristics Table 6. Characteristics Tamb = 25 °C; currents are positive when flowing into the IC; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit High voltage (pins HV1 and HV2) IHV current on pin HV Vclamp clamp voltage Vth(ch) charge threshold voltage both HV pins; VHV1 > 50 V; VHV2 > 50 V VTMR < 1.2 V 2.5 3.5 4.5 μA current limited; VTMR > 1.2 V 1.8 2.3 2.8 mA 475 500 525 V threshold zero-crossing mains voltage 19 21 23 V to discharge the X-capacitor 1.1 1.2 1.3 V −1.20 −0.95 −0.70 μA Timer (pins TMR1 and TMR2) Vth(act)dch discharge activation threshold voltage Idch(tmr) timer discharge current 12 Application information The TEA1708 is typically connected across the X-capacitor. A metal-oxide varistor is not required to protect the IC because the device incorporates a high-voltage clamping circuit. The IC is sufficiently protected for differential mode surge voltages up to 4 kV with only two 200 kΩ resistors (see Figure 4). The discharge delay time is set externally using a low-voltage capacitor connected between the TMR1 and TMR2 pins. Select a value between 10 nF and 22 nF for a mains frequency of 50 Hz or 60 Hz. The minimum value is 10 nF which gives the smallest delay time. Do not use values < 10 nF. They can lead to unwanted discharge of the Xcapacitor. The delay time (td) for discharge can be calculated with Equation 1: (1) If the low-voltage capacitor value is 22 nF the delay time is: When the voltage across the device exceeds the threshold zero-crossing mains voltage, the discharge current is activated. The current is limited to ≊ 2.3 mA. When the current < the current limit, IHV is calculated with Equation 2: (2) TEA1708T Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1.1 — 6 April 2020 © NXP B.V. 2020. All rights reserved. 6 / 12 TEA1708T NXP Semiconductors GreenChip X capacitor discharge IC When the X-capacitor value is 330 nF and R1 = R2 = 200 kΩ, the capacitor is discharged to a voltage < 60 V at a mains of 230 V (AC) in 300 ms. L R2 200 kΩ AC HV2 5 4 TMR1 n.c. 6 3 n.c. 2 TMR2 1 n.c. X capacitor AC/DC application 10 nF n.c. 7 HV1 8 R1 200 kΩ N aaa-007792 Figure 4. TEA1708 application diagram To ensure that the capacitor is discharged to a voltage < 60 V within 2 seconds, use R1 = R2 = 200 kΩ for X-capacitor values < 1.8 μF. Lowering R1 + R2, for faster discharge or when a higher value for the X-capacitor is required, is possible but it decreases the surge protection level. TEA1708T Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1.1 — 6 April 2020 © NXP B.V. 2020. All rights reserved. 7 / 12 TEA1708T NXP Semiconductors GreenChip X capacitor discharge IC 13 Package outline SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 A2 Q A (A 3) A1 pin 1 index θ Lp 1 L 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.20 0.014 0.0075 0.19 0.16 0.15 inches 0.010 0.057 0.069 0.004 0.049 0.05 0.244 0.039 0.028 0.041 0.228 0.016 0.024 0.01 0.01 0.028 0.004 0.012 θ o 8 o 0 Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT96-1 076E03 MS-012 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 Figure 5. Package outline SOT96-1 (SO8) TEA1708T Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1.1 — 6 April 2020 © NXP B.V. 2020. All rights reserved. 8 / 12 TEA1708T NXP Semiconductors GreenChip X capacitor discharge IC 14 Revision history Table 7. Revision history Document ID Release date Data sheet status Change notice Supersedes TEA1708T_1 v.1.1 20200406 Product data sheet - TEA1708T_1 v.1 TEA1708T_1 v.1 20130925 Product data sheet - - TEA1708T Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1.1 — 6 April 2020 © NXP B.V. 2020. All rights reserved. 9 / 12 TEA1708T NXP Semiconductors GreenChip X capacitor discharge IC 15 Legal information 15.1 Data sheet status Document status [1][2] Product status [3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] [2] [3] Please consult the most recently issued document before initiating or completing a design. The term 'short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. notice. This document supersedes and replaces all information supplied prior to the publication hereof. 15.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. 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Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without TEA1708T Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. All information provided in this document is subject to legal disclaimers. Rev. 1.1 — 6 April 2020 © NXP B.V. 2020. All rights reserved. 10 / 12 TEA1708T NXP Semiconductors GreenChip X capacitor discharge IC No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. 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All rights reserved. 11 / 12 TEA1708T NXP Semiconductors GreenChip X capacitor discharge IC Contents 1 2 3 4 5 6 7 7.1 7.2 8 9 10 11 12 13 14 15 General description ............................................ 1 Features and benefits .........................................1 Applications .........................................................1 Ordering information .......................................... 1 Marking .................................................................2 Block diagram ..................................................... 2 Pinning information ............................................ 3 Pinning ............................................................... 3 Pin description ................................................... 3 Functional description ........................................4 Limiting values .................................................... 5 Thermal characteristics ......................................5 Characteristics .................................................... 6 Application information ......................................6 Package outline ...................................................8 Revision history .................................................. 9 Legal information .............................................. 10 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section 'Legal information'. © NXP B.V. 2020. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 6 April 2020 Document identifier: TEA1708T