TEA1716T
Resonant power supply control IC with PFC
Rev. 3 — 30 November 2012
Product data sheet
1. General description
The TEA1716T integrates a Power Factor Corrector (PFC) controller and a controller for a
Half-Bridge resonant Converter (HBC) in a multi-chip IC. It provides the drive function for
the discrete MOSFET in an up-converter and for the two discrete power MOSFETs in a
resonant half-bridge configuration.
Efficient PFC operation is achieved by implementing functions for Quasi-Resonant (QR)
operation at high-power levels and QR operation with valley skipping at lower power
levels. OverCurrent Protection (OCP), OverVoltage Protection (OVP) and
demagnetization sensing ensure safe operation under all conditions.
The HBC module is a high-voltage controller for a zero-voltage switching LLC resonant
converter. It contains a high-voltage level shift circuit and several protection circuits
including OCP, open-loop protection, capacitive mode protection and a general purpose
latched protection input.
The high-voltage chip is fabricated using a proprietary high-voltage Bipolar-CMOS-DMOS
power logic process enabling efficient direct start-up from the rectified universal mains
voltage. The low-voltage Silicon-On-Insulator (SOI) chip is used for accurate, high-speed
protection functions and control.
TEA1716T controlled PFC circuit and resonant converter are very flexible. It can be used
for a broad range of applications over a wide mains voltage range. Combining PFC and
HBC controllers in a single IC makes the TEA1716T ideal for controlling power supplies in
LCD and plasma televisions.
Using the TEA1716T highly efficient and reliable power supplies providing from 90 W to
500 W can be designed easily using the TEA1716T, with a minimum of external
components.
The integrated Burst mode and power management functionality of TEA1716T enable
resonant applications that meet the Energy Using Product Directive (EuP) lot 6
(< 0.5 W in Standby mode).
Remark: Unless otherwise stated, all values are typical.
TEA1716T
NXP Semiconductors
Resonant power supply control IC with PFC
2. Features and benefits
2.1 General features
Integrated PFC and HBC controllers
Universal mains supply operation from 70 V to 276 V (AC)
High level of integration resulting in a low external component count and a cost
effective design
Integrated Burst mode sensing
Compliant with Energy Using Product Directive (EuP) lot 6
Enable input to enable only the PFC or both the PFC and HBC controllers
On-chip high-voltage start-up source
Stand-alone operation or IC supplied from external DC source
2.2 PFC controller features
Boundary mode operation with on-time control
Valley/zero-voltage switching for minimum switching losses
Frequency limiting to reduce switching losses
Accurate boost voltage regulation
Burst mode switching with soft-start and soft stop
2.3 HBC controller features
Integrated high-voltage level shifter
Adjustable minimum and maximum frequency
Maximum 500 kHz half-bridge switching frequency
Adaptive non-overlap time
Burst mode switching
2.4 Protection features
Safe restart mode for system fault conditions
General latched protection input for output overvoltage protection or external
temperature protection
Protection timer for time-out and restart
Overtemperature protection
Soft (re)start for both controllers
Undervoltage protection for mains (brownout), boost, IC supply and output voltage
Overcurrent regulation and protection for both controllers
Accurate overvoltage protection for the boost voltage
Capacitive mode protection for the HBC controller
TEA1716T
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 November 2012
© NXP B.V. 2012. All rights reserved.
2 of 47
TEA1716T
NXP Semiconductors
Resonant power supply control IC with PFC
3. Applications
LCD television
Plasma television
Notebook adapter
Desktop and all-in-one PCs
4. Ordering information
Table 1.
Ordering information
Type number
TEA1716T/2
TEA1716T
Product data sheet
Package
Name
Description
Version
SO24
plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
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TEA1716T
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Resonant power supply control IC with PFC
5. Block diagram
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6833/ Vdemag(SNSAUXPFC) and valley detection is
started. The MOSFET remains off.
To ensure that switching continues under all circumstances, the MOSFET is forced to
switch on if the magnetizing of the transformer (VSNSAUXPFC < Vdemag(SNSAUXPFC)) is not
detected within tto(mag) (50 s) after the GATEPFC pin goes LOW.
connect a 5 k series resistor to this pin to protect the internal circuitry, against for
example lightning. Place the resistor close to the IC on the PCB to prevent incorrect
switching due to external disturbances.
7.7.4 PFC valley sensing (SNSAUXPFC pin)
If the voltage at the MOSFET drain is at its minimum (valley switching), the PFC MOSFET
is switched on for the next stroke. This action reduces switching losses and EMI
(see Figure 9).
TEA1716T
Product data sheet
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© NXP B.V. 2012. All rights reserved.
18 of 47
TEA1716T
NXP Semiconductors
Resonant power supply control IC with PFC
on
GATEPFC
off
Vboost
VRect
Dr(PFC)
0
VRect/N
Aux(PFC)
0
Vdemag(SNSAUXPFC)
(Vboost - VRect)/N
lTPFC
0
demagnetized
Demagnetization
magnetized
Valley
(= top for detection)
t
014aaa856
Fig 9.
Demagnetization and valley detection
The valley sensing block connected to the SNSAUXPFC pin detects the valleys. This
block measures the PFC transformer auxiliary winding voltage, which is a reduced and
inverted copy of the MOSFET drain voltage. When a valley of the drain voltage (= top at
SNSAUXPFC voltage) is detected, the MOSFET is switched on.
If a top is not detected on the SNSAUXPFC pin (= a valley at the drain) within tto(vrec)
(4 s) after demagnetization is detected, the MOSFET is forced to switch on.
7.7.5 PFC frequency and off-time limiting
The switching frequency is limited to fmax(PFC) for transformer optimization and to minimize
switching losses. If the frequency for quasi-resonant operation exceeds fmax(PFC), the
system switches to DCM. The PFC MOSFET is switched on when the drain-source
voltage is at a minimum (valley switching).
The minimum off-time is limited at toff(PFC)min to ensure correct control of the PFC
MOSFET under all circumstances.
7.7.6 PFC soft-start and soft-stop (SNSCURPFC pin)
The PFC controller features a soft-start function. The function slowly increases the
primary peak current during start-up. The soft-stop function slowly decreases the
transformer peak current before operations are halted. These functions prevent
transformer rattle at start-up or during burst mode operation.
TEA1716T
Product data sheet
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Rev. 3 — 30 November 2012
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Resonant power supply control IC with PFC
Connecting a resistor Rss(PFC) and capacitor Css(PFC) between the SNSCURPFC pin and
the current sense resistor Rcur(PFC) achieves this. During start-up, an internal current
source, Ich(ss)(PFC), charges the capacitor to VSNSCURPFC = Ich(ss)(PFC) Rss(PFC).
The voltage is limited to the maximum PFC soft-start clamp voltage, Vclamp(ss)PFC. The
additional voltage across the charged capacitor reduces the peak current. After start-up,
the internal current source is switched-off, capacitor Css(PFC) discharges across Rss(PFC)
and the peak current increases.
The start level and the time constant of the rising primary current can be adjusted
externally by changing the values of Rss(PFC) and Css(PFC).
V ocr PFC – I ch ss PFC R ss PFC
I Cur PFC pk = --------------------------------------------------------------------------------------------R cur PFC
= R ss PFC C ss PFC
Switching on the internal current source Ich(ss)(PFC) starts a soft-stop. Ich(ss)(PFC) charges
Css(PFC). The increasing capacitor voltage decreases the peak current. The charge current
flows when the voltage on the SNSCURPFC pin is less than the maximum PFC soft-start
voltage (0.5 V). If VSNSCURPFC exceeds the maximum PFC soft-start voltage, the soft-start
current source starts limiting the charge current. To determine accurately if the capacitor is
charged, the voltage is only measured during the PFC power switch off-time. The PFC
operation is stopped when VSNSCURPFC > Vstop(ss)(PFC).
In the Burst stop state with the PFC not operating, the SNSCURPFC pin is kept at the
maximum PFC soft-start voltage, enabling an immediate start of the soft-start sequence
when the PFC must operate after the Burst stop state.
7.7.7 PFC overcurrent regulation, OCR-PFC (SNSCURPFC pin)
The maximum peak current is limited cycle-by-cycle by sensing the voltage across an
external sense resistor (Rcur(PFC)) connected to the source of the external MOSFET. The
voltage is measured via the SNSCURPFC pin and is limited to Vocr(PFC).
A voltage peak appears on VSNSCURPFC when the PFC MOSFET is switched on due to the
discharging of the drain capacitance. The leading-edge blanking time (tleb(PFC)) ensures
that the overcurrent sensing block does not react to this transitory peak.
7.7.8 PFC mains undervoltage protection/brownout protection, UVP-mains
(SNSMAINS pin)
The voltage on the SNSMAINS pin is continuously sensed to prevent the PFC trying to
operate at very low mains input voltages. PFC switching stops when
VSNSMAINS < Vuvp(SNSMAINS). Mains undervoltage protection is also called brownout
protection.
VSNSMAINS is clamped to a minimum value of Vpu(SNSMAINS) for fast restart as soon as the
mains input voltage recovers after a mains-dropout. The PFC starts or restarts when
VSNSMAINS exceeds the start level Vstart(SNSMAINS).
TEA1716T
Product data sheet
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Resonant power supply control IC with PFC
7.7.9 PFC boost overvoltage protection, OVP-boost (SNSBOOST pin)
An overvoltage protection circuit has been built in to prevent boost overvoltage during load
steps and mains transients. Switching of the power factor correction circuit is inhibited
when the voltage on the SNSBOOST pin > Vovp(SNSBOOST).
PFC switching resumes when VSNSBOOST < Vovp(SNSBOOST) again.
Overvoltage protection is also triggered when an open circuit at the resistor connected
between the SNSBOOST pin and ground.
7.7.10 PFC short circuit/open-loop protection, SCP/OLP-PFC (SNSBOOST pin)
The PFC circuit does not start switching until the voltage on the SNSBOOST pin exceeds
Vscp(SNSBOOST). This acts as short circuit protection for the boost voltage (SCP-boost).
The SNSBOOST pin draws a small input current Iprot(SNSBOOST). If this pin gets
disconnected, the residual current pulls down VSNSBOOST, triggering short circuit
protection (SCP-boost). This combination creates an open-loop protection (OLP-PFC).
7.8 HBC controller
The HBC controller converts the 400 V boost voltage from the PFC into one or more
regulated DC output voltages and drives two external MOSFETs in a half-bridge
configuration connected to a transformer. The transformer forms the resonant circuit in
combination with the resonant capacitor and the load at the output. The transformer has a
leakage inductance and a magnetizing inductance. The regulation is realized using
frequency control.
7.8.1 HBC high-side and low-side driver (GATEHS and GATELS pins)
Both drivers have an identical driving capability. The output of each driver is connected to
the equivalent gate of an external high-voltage power MOSFET.
The low-side driver is referenced to the PGND pin and is supplied from the SUPREG pin.
The high-side driver is floating. The reference for the high-side driver is the HB pin,
connected to the midpoint of the external half-bridge. The high-side driver is supplied from
the SUPHS pin which is connected to the external bootstrap capacitor CSUPHS. When the
low-side MOSFET is on, the bootstrap capacitor is charged from the SUPREG pin using
the external diode DSUPHS.
7.8.2 HBC boost undervoltage protection, UVP-boost (SNSBOOST pin)
The voltage on the SNSBOOST pin is sensed continuously to prevent the HBC controller
trying to operate at very low boost input voltages. When VSNSBOOST < Vuvp(SNSBOOST),
HBC switching stops the next time the GATELS pin goes HIGH. HBC switching resumes
when VSNSBOOST > Vstart(SNSBOOST).
TEA1716T
Product data sheet
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Rev. 3 — 30 November 2012
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TEA1716T
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Resonant power supply control IC with PFC
7.8.3 HBC switch control
HBC switch control determines when the MOSFETs switch on and off. It uses the output
from several other blocks.
• A divider is used for alternate switching of the high and low-side MOSFETs for each
oscillator cycle. The oscillator frequency is twice the half-bridge frequency.
• The controlled oscillator determines the switch-off point.
• Adaptive non-overlap time sensing determines the switch-on point. This function is
the adaptive non-overlap time.
• Several protection circuits and the state of the SSHBC/EN input specify if the
resonant converter is allowed to start switching.
• At start-up pin GATELS is HIGH. Node HB is pulled to ground and the bootstrap
capacitor CSUPHS is charged.
• During the burst off-time, both GATELS and GATEHS are LOW. The disabled
MOSFETs prevent the discharge of the resonant tank.
Figure 10 provides an overview of typical switching behavior.
GATEHS
GATELS
Vboost
HB
0
ITr(HBC) 0
CFMIN
t
014aaa857
Fig 10. Switching behavior of the HBC
7.8.4 HBC Adaptive Non-Overlap (ANO) time function (HB pin)
7.8.4.1
Inductive mode (normal operation)
The high efficiency characteristic of a resonant converter is the result of Zero-Voltage
Switching (ZVS) of the power MOSFETs. ZVS is also called soft switching. To allow soft
switching, a small non-overlap time is required between the high-side on-times and
low-side MOSFETs. During this non-overlap time, the primary resonant current charges or
discharges the half-bridge capacitance between ground and the boost voltage.
TEA1716T
Product data sheet
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Resonant power supply control IC with PFC
After the charge or discharge cycles, the body diode of the MOSFET starts conducting.
Because the voltage across the MOSFET is zero, there are no switching losses when the
MOSFET is switched on. This operating mode is called inductive mode. In inductive mode
the switching frequency is above the resonance frequency and the resonant tank has an
inductive impedance.
The HB transition time depends on resonant current amplitude when switching starts.
There is a complex relationship between this amplitude, the frequency, the boost voltage
and the output voltage. Ideally, the IC switches on the MOSFET when the HB transition is
complete. If it waits any longer, the HP voltage can swing back, especially at high output
loads. The advanced adaptive non-overlap time makes it unnecessary to choose a fixed
dead time (which is always a compromise). This saves on external components.
Adaptive non-overlap time sensing measures the HB slope after one MOSFET has been
switched off. Normally, the HB slope starts immediately (the voltage starts rising or falling).
Once the transition at the HB node is complete, the slope ends (the voltage stops
rising/falling). This slope end is detected by the ANO time sensor and the other MOSFET
is switched on. In this way, the non-overlap time is automatically optimized even when the
HB transition cannot be fully completed, which minimizes losses.
Figure 11 illustrates the operation of the adaptive non-overlap time function in Inductive
mode.
GATEHS
GATELS
Vboost
HB
0
fast HB slope
slow HB slope
t
incomplete HB slope
014aaa858
Fig 11. Adaptive non-overlap time function (normal inductive operation)
The non-overlap time depends on the HB slope but it has upper and lower limits.
An integrated minimum non-overlap time (tno(min)) prevents cross conduction occurring
under any circumstances.
The maximum non-overlap time is limited to the oscillator charge time. If the HB slope is
longer than the oscillator charge time (1⁄4 of HB switching period), the MOSFET is forced
to switch on. In this case, the MOSFET is not soft switching. This limitation ensures that,
the MOSFET on-time is at least 1⁄4 of the HB switching period.
TEA1716T
Product data sheet
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Resonant power supply control IC with PFC
7.8.4.2
Capacitive mode
The statements in Section 7.8.4.1 are true for normal operation with a switching frequency
higher than the resonance frequency. When an error condition occurs (for example output
short, load pulse too high) the switching frequency is lower than the resonance frequency.
The resonant tank then has a capacitive impedance. In Capacitive mode, the HB slope
does not start after the MOSFET switches off. Switching on the other MOSFET is not
recommended in this situation. The absence of soft switching increases dissipation in the
MOSFETs. In Capacitive mode, the body diode in the switched off MOSFET can start
conducting. Switching on the other MOSFET at this instant can result in the immediate
destruction of the MOSFETs.
The advanced adaptive non-overlap time of the TEA1716T always waits until the slope at
the half-bridge node starts. It guarantees safe switching of the MOSFETs in all
circumstances. Figure 12 shows the adaptive non-overlap time function operation in
Capacitive mode.
In Capacitive mode, half the resonance period can elapse before the resonant current
changes back to the correct polarity and starts charging the half-bridge node. The
oscillator is slowed down until the half-bridge slope starts to allow this relatively long
waiting time. See Section 7.8.5 for more details on the oscillator.
GATEHS
0
GATELS
0
Vboost
no HB slope
HB
0
wrong polarity
ITr(HBC) 0
CFMIN
t
0
delayed
oscillator
014aaa939
delayed switch-on
during capacitive mode
Fig 12. Adaptive non-overlap time function (capacitive operation)
The MOSFET is forced to switch on when the half-bridge slope fails to start and the
oscillator voltage reaches Vu(CFMIN).
The switching frequency is increased to eliminate the problems associated with
Capacitive mode operation (see Section 7.8.11).
TEA1716T
Product data sheet
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Resonant power supply control IC with PFC
7.8.5 HBC slope controlled oscillator (pin CFMIN)
The slope-controlled oscillator determines the half-bridge switching frequency. The
oscillator generates a triangular waveform between Vu(CFMIN) and Vl(CFMIN) at the external
capacitor Cfmin.
Figure 13 shows how the frequency is determined.
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Fig 13. Determination of oscillator current
Two external components determine the frequency range:
• Capacitor Cfmin connected between the CFMIN pin and ground sets the minimum
frequency in combination with an internally trimmed current source Iosc(min)
• Internal resistor Rfmax sets the frequency range and thus the maximum frequency.
Resistor Rfmax has a fixed value (18 k typical)
The oscillator frequency depends on the charge and discharge currents of Cfmin. The
charge and discharge current contains a fixed component, Iosc(min), which determines the
minimum frequency. In addition, it contains a variable component that is 4.9 times greater
than the current flowing through resistor Rfmax:
• The voltage across resistor Rfmax is Vfmin(RFMAX) (0 V) at the minimum frequency
• The voltage across resistor Rfmax is Vfmax(fb)(RFMAX) (1.5 V at the maximum feedback
frequency
• The voltage across resistor Rfmax is Vfmax(ss)(RFMAX) (2.5 V) at the maximum soft-start
frequency
The maximum frequency of the oscillator is internally limited. The HB frequency is limited
to flimit(HB) (minimum 500 kHz).
The half-bridge slope controls the oscillator. The oscillator charge current is initially set to
a low value Iosc(red) (30 A). When the start of the half-bridge slope is detected, the charge
current is increased to its normal value. This feature is used in combination with the
adaptive non-overlap time function as described in Section 7.8.4.2 and Figure 12.
TEA1716T
Product data sheet
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Resonant power supply control IC with PFC
The length of time the oscillator current is low is negligible under normal operating
conditions because the half-bridge slope normally starts directly after the MOSFET is
switched off.
7.8.6 HBC feedback input (SNSFB pin)
In a typical power supply application, the output voltage is compared and amplified on the
secondary side. The error amplifier output is transferred to the primary side using an
optocoupler. The optocoupler can be connected directly to the SNSFB pin. The current
setting of the optocoupler can be selected using the external pull-up resistor.
The SNSFB pin is a voltage input. At an SNSFB voltage of Vfmin(SNSFB) (6.4 V) the
frequency is at a minimum. The maximum frequency is reached at Vfmax(SNSFB) (4.1 V).
The maximum frequency that can be reached using the SNSFB pin is lower (70 %) than
the maximum frequency that can be reached using the SSHBC/EN pin.
7.8.7 HBC open-loop protection, OLP-HBC (SNSFB pin)
Under normal operating conditions, the optocoupler current is between Ifmin(SNSFB) and
Ifmax(SNSFB) and pulls down the voltage at the SNSFB pin. Due to an error in the feedback
loop, the current can be less than Ifmin(SNSFB) with the HBC controller delivering maximum
output power.
The HBC controller features Open-Loop Protection (OLP), which monitors the SNSFB
voltage. When VSNSFB exceeds Volp(SNSFB), the protection timer is started. The Restart
state is activated if the OLP condition is still present after the protection time has elapsed.
7.8.8 HBC soft-start (pin SSHBC/EN)
The relationship between switching frequency and output current is not constant. It
depends strongly on the output voltage and the boost voltage. This relationship can be
complex. The TEA1716T contains a soft-start function to ensure that the resonant
converter starts or restarts with safe currents. This soft-start function forces a start at such
a high frequency that the currents are acceptable under all conditions. The soft-start then
slowly decreases the frequency. Normally, output voltage regulation takes over frequency
control before soft-start reaches its minimum frequency. Limiting the output current during
start-up also limits the rate at which the output voltage rises and prevents an overshoot.
Soft-start utilizes the voltage on the SSHBC/EN pin. The external capacitor Css(HBC) sets
the timing of the soft-start. The SSHBC/EN pin is also used as an enable input. Soft-start
voltage levels are above the enable voltage thresholds.
7.8.8.1
Soft-start voltage levels
Figure 13 shows the relationship between the soft-start voltage on pin SSHBC/EN and the
oscillator current.
At initial start-up, VSSHBC/EN < Vfmax(SSHBC) (3.2 V), which corresponds with the maximum
frequency. During start-up, CSSHBC is charged, VSSHBC/EN rises and the frequency
decreases. The contribution of the soft-start function is zero when
VSSHBC/EN > Vfmin(SSHBC) (8.0 V).
VSSHBC/EN is clamped at a maximum of Vclamp(SSHBC) (8.4 V) (frequency is at a minimum)
and at a minimum ( 3 V). Below Vfmax(SSHBC) (maximum frequency), the discharge
current is reduced to a maximum frequency soft-start current of 5 A. The voltage is
clamped at a minimum of Vpu(EN) (3 V). Both clamp levels are just outside the operating
TEA1716T
Product data sheet
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Resonant power supply control IC with PFC
area between Vfmax(SSHBC) and Vfmin(SSHBC). The margins avoid frequency disturbance
during normal output voltage regulation, but ensure that overcurrent regulation can
respond quickly.
7.8.8.2
Soft-start charge and discharge
At initial start-up, the soft-start capacitor Css(HBC) is charged to obtain a decreasing
frequency sweep from the maximum to the operating frequency. The soft-start
functionality is used to soft-start the resonant converter and for regulation purposes (such
as overcurrent regulation). Css(HBC) can therefore be charged or discharged. A continuous
alternation between charging and discharging occurs during overcurrent regulation. In this
way VSSHBC/EN can be regulated, overruling the signal from the feedback input.
The charge and discharge current can have a high value, Iss(hf)(SSHBC) (160 A), resulting
in fast charging and discharging. Or it can have a low value, Iss(lf)(SSHBC) (40 A), resulting
in a slow charging and discharging. This two-speed soft-start sweep allows a combination
of a short start-up time for the resonant converter and stable regulation loops (such as
overcurrent regulation).
The fast charge and discharge is used for the upper frequency range where
VSSHBC/EN < Vss(hf-lf)(SSHBC) (5.6 V). In the upper frequency range, the currents in the
converter do not react strongly to frequency variations.
The slow charge and discharge is used for the lower frequency range where
VSSHBC/EN > Vss(hf-lf)(SSHBC) (5.6 V). In the lower frequency range, the currents in the
converter react strongly to frequency variations.
Section 7.8.10.2 describes how the two-speed soft-start function is used for overcurrent
regulation.
The soft-start capacitor is not charged or discharged during non-operation time in Burst
mode. The soft-start voltage does not change during this time.
7.8.8.3
Soft-start reset
Some protection functions, such as overcurrent protection, require fast correction of the
operating frequency set point, but do not require switching to stop. See Section 7.9 for
details on which protection functions use this step to the maximum frequency. The
TEA1716T has a special fast soft-start reset feature for the HBC controller that forces an
immediate step to maximum frequency. Soft-start reset is also used when the HBC
controller is enabled using the SSHBC/EN pin or after a restart to ensure a safe start at
maximum frequency. Soft-start reset is not used when the operation was stopped in Burst
mode.
When a protection function is activated, the oscillator control input is disconnected from
the soft-start capacitor, Css(HBC), which is connected between the SSHBC/EN pin and
ground. The switching frequency is immediately set to a maximum. Setting the switching
frequency to a maximum restores safe switching operation in most cases. At the same
time, the capacitor is discharged to the maximum frequency level, Vfmax(SSHBC). Once
VSSHBC/EN has reached this level, the oscillator control input is connected to the pin again
and the normal soft-start sweep follows. Figure 14 shows the soft-start reset and the
two-speed frequency sweep downwards.
TEA1716T
Product data sheet
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TEA1716T
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Resonant power supply control IC with PFC
Protection
on
off
Vfmin(SSHBC)
VSSHBC/EN
Vss(hf-lf)(SSHBC)
Vfmax(SSHBC)
0
fmax
fHB
fmin
0
regulation
fmax
forced
t
fast
sweep
slow sweep
regulation
014aaa864
Fig 14. Soft-start reset and two-speed soft-start
7.8.9 HBC high-frequency protection, HFP-HBC
Normally the converter does not operate continuously at maximum frequency because it
sweeps down to much lower values. Certain error conditions, such as a disconnected
transformer, can cause the converter to operate continuously at maximum frequency. If
zero-voltage switching conditions are no longer present, the MOSFETs can overheat. The
TEA1716T features High-Frequency Protection (HFP) for the HBC controller to protect it
from being damaged in such circumstances.
HFP senses the voltage across the internal resistor Rfmax. This voltage indicates the
current frequency. When the frequency is higher than 75 % of the soft-start frequency
range, the protection timer is started. The 75 % level corresponds to an Rfmax voltage of
Vhfp(RFMAX) (4.31 V).
7.8.10 HBC overcurrent regulation and protection, OCR and OCP
(SNSCURHBC pin)
The HBC controller is protected against overcurrent in two ways:
• OverCurrent Regulation (OCR) which increases the frequency slowly; the protection
timer is also started.
• OverCurrent Protection (OCP) which steps to maximum frequency.
A boost voltage compensation function is used to reduce the variation in the output
current protection level.
7.8.10.1
Boost voltage compensation
The primary current, also known as the resonant current, is sensed using the
SNSCURHBC pin. It senses the momentary voltage across an external current sense
resistor Rcur(HBC). The use of the momentary current signal allows for fast overcurrent
protection and simplifies the stabilizing of overcurrent regulation. The OCR and OCP
comparators compare VSNSCURHBC with the maximum positive and negative values.
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The primary current is higher when the boost voltage is low for the same output power.
Boost compensation is included to reduce the dependency of the protected output current
level on the boost voltage. The boost compensation sources and sinks a current from the
SNSCURHBC pin. This current creates a voltage drop across the series resistor Rcurcmp.
The amplitude of the current is linearly dependent on the boost voltage. At nominal boost
voltage, the current is zero and the voltage VCur(HBC) across the current sense resistor is
also present on the SNSCURHBC pin. At the UVP-boost start level Vuvp(SNSBOOST), the
current is at a maximum. The current sink or source direction depends on the active gate
signal. The voltage drop created across Rcurcmp reduces the amplitude at the pin. This
reduction in amplitude results in a higher effective current protection level. The Rcurcmp
value sets the amount of compensation. Figure 15 shows how the boost compensation
works for an artificial current signal. The sinking compensation current only flows when
VSNSCURHBC is positive because of the circuit implementation.
Vreg
Vboost
Vuvp
t
GATEHS
t
GATELS
t
sink
ISNSCURHBC
sink current only with positive VSNSCURHBC
0
t
source
VCur(HBC) = Rcur(HBC) × ICur(HBC)
Iocp(high)
Iocr(high)
Iocp(nom)
Iocr(nom)
ICur(HBC)
0
-Iocr(nom)
-Iocp(nom)
-Iocr(high)
-Iocp(high)
t
VSNSCURHBC
Vocp(HBC)
Vocr(HBC)
VSNSCURHBC
0
-Vocr(HBC)
-Vocp(HBC)
t
nominal Vboost
no compensation
nominal OCR
nominal Vboost
no compensation
nominal OCP
low Vboost
strong compensation
high OCR
low Vboost
strong compensation
high OCP
014aaa865
Fig 15. Boost voltage compensation
7.8.10.2
OverCurrent Regulation (OCR-HBC)
The lowest comparator levels at the SNSCURHBC pin Vocr(HBC) (0.5 V and +0.5 V),
relate to the overcurrent regulation voltage. There are comparators for both the positive
and negative polarities. The positive comparator is active during the high-side on-time and
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the following high-side to low-side non-overlap time. The negative comparator is active
during the remaining time. If either level is exceeded, the frequency is slowly increased.
Discharging the soft-start capacitor achieves this.
Each time the OCR level is exceeded, the event is latched until the next stroke and the
soft-start discharge current is enabled. When both the positive and negative OCR levels
are exceeded, the soft-start discharge current flows continuously.
Overcurrent regulation is very effective at limiting the output current during start-up. A
smaller soft-start capacitor is used to achieve a faster start-up. Using a smaller capacitor
can result in an output current that is too high at times. However, the OCR function slows
down the frequency sweep when required to keep the output current within the specified
limits. Figure 16 shows the operation of the OCR during output voltage start-up.
Iocr
ICur(HBC)
0
t
-Iocr
Iss(hf)(SSHBC)
ISSHBC/EN Iss(If)(SSHBC)
-Iss(If)(SSHBC)
t
-Iss(hf)(SSHBC)
Vfmin(SSHBC)
VSSHBC/EN
Vss(hf-lf)(SSHBC)
Vfmax(SSHBC)
0
t
0
t
Vreg
VO
Fast soft start sweep (charge and discharge)
Slow soft start sweep (charge and discharge)
014aaa866
Fig 16. Overcurrent regulation during start-up
The protection timer is also started. The Restart state is activated when the OCR-HBC
condition is still present after the protection time has elapsed.
7.8.10.3
OverCurrent Protection (OCP-HBC)
Under normal operating conditions, OCR is able to ensure the current remains below the
specified maximum values. However, in the event of certain error conditions occur,
however, it is not fast enough to limit the current. OCP is implemented to protect against
those error conditions. The OCP level Vocp(HBC) (1.75 V and +1.75 V), is higher than the
OCR level Vocr(HBC).
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When the OCP level is reached, the frequency immediately jumps to the maximum value
using the soft-start reset, then a normal sweep down.
7.8.11 HBC capacitive mode regulation, CMR (HB pin)
The MOSFETs in the half-bridge drive the resonant circuit. Depending on the output load,
the output voltage and the switching frequency this resonant circuit can have an inductive
or a capacitive impedance. Inductive impedance is preferred because it facilitates efficient
zero-voltage switching.
Harmful switching in Capacitive mode is avoided using the adaptive non-overlap time
function (see Section 7.8.4.2). An extra action is performed which results in Capacitive
Mode Regulation (CMR). CMR causes the half-bridge circuit to return to Inductive mode
from Capacitive mode.
Capacitive mode is detected when the HB slope does not start within tto(cmr) after the
MOSFETs have switched off. Detection of Capacitive mode increases the switching
frequency. This increase is caused by discharging the soft-start capacitor with a relatively
high current Icmr(hf)(SSHBC) fimmediately after tto(cmr) expires until the half-bridge slope
starts. The frequency increase regulates the HBC to the border between capacitive and
inductive mode.
7.9 Protection functions overview
Table 4.
Overview protections
Protected Symbol
part
Protection
Affected
Action
Description
IC
UVP-SUPIC
Undervoltage protection SUPIC
IC
disable
Section 7.2.1
IC
UVP-SUPREG
Undervoltage protection SUPREG IC
disable
Section 7.2.2
IC
UVP-supplies
Undervoltage protection supplies
IC
disable and reset
Section 7.3
IC
SCP-SUPIC
Short circuit protection SUPIC
IC
low HV start-up current
Section 7.2.4
IC
OVP-output
Overvoltage protection output
IC
shut-down
Section 7.5.4
IC
FSP-output
Failed start protection output
IC
restart after protection time Section 7.5.5
IC
OTP
Overtemperature protection
IC
disable
Section 7.5.6
PFC
OCR-PFC
Overcurrent regulation PFC
PFC
switch off cycle-by-cycle
Section 7.7.7
PFC
UVP-mains
Undervoltage protection mains
PFC
suspend switching
Section 7.7.8
PFC
OVP-boost
Overvoltage protection boost
PFC
suspend switching
Section 7.7.9
PFC
SCP-boost
Short circuit protection boost
IC
restart
Section 7.7.10
PFC
OLP-PFC
Open-loop protection PFC
IC
restart
Section 7.7.10
HBC
UVP-boost
Undervoltage protection boost
HBC
disable
Section 7.8.2
HBC
OLP-HBC
Open-loop protection HBC
IC
restart after protection time Section 7.8.7
HBC
HFP-HBC
High-frequency protection HBC
IC
restart after protection time Section 7.8.9
HBC
OCR-HBC
Overcurrent regulation HBC
HBC
IC
increase frequency
Section 7.8.10.2
restart after protection time
HBC
OCP-HBC
Overcurrent protection HBC
HBC
step to maximum
frequency
Section 7.8.10.3
HBC
CMR
Capacitive mode regulation
HBC
increase frequency
Section 7.8.11
HBC
ANO
Adaptive non-overlap
HBC
prevent hazardous
switching
Section 7.8.4
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8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).; All voltages are measured with respect to theSGND
pin; Currents are positive when flowing into the IC; The voltage ratings are valid provided other ratings are not violated;
Current ratings are valid provided the maximum power rating is not violated.
Symbol
Parameter
Conditions
Min
Max
Unit
VSUPHV
voltage on pin SUPHV
continuous
0.4
+630
V
VSUPHS
voltage on pin SUPHS
DC
0.4
+570
V
Voltages
t < 0.5 s
0.4
+630
V
referenced to the HB pin
0.4
+14
V
VSUPIC
voltage on pin SUPIC
0.4
+38
V
VSNSAUXPFC
voltage on pin SNSAUXPFC
25
+25
V
VSUPREG
voltage on pin SUPREG
0.4
+12
V
VSNSOUT
voltage on pin SNSOUT
0.4
+12
V
VRCPROT
voltage on pin RCPROT
0.4
+12
V
VSNSFB
voltage on pin SNSFB
0.4
+12
V
VSSHBC/EN
voltage on pin SSHBC/EN
0.4
+12
V
VSNSBURST
voltage on pin SNSBURST
0.4
+12
V
voltage on pin GATEHS
[1]
0.4
VSUPHS + 0.4
V
voltage on pin GATELS
[1]
0.4
VSUPREG + 0.4
V
VGATEPFC
voltage on pin GATEPFC
[1]
0.4
VSUPREG + 0.4
V
VSNSCURHBC
voltage on pin SNSCURHBC
5
+5
V
VSNSBOOST
voltage on pin SNSBOOST
0.4
+12
V
VSNSMAINS
voltage on pin SNSMAINS
0.4
+12
V
VSNSCURPFC
voltage on pin SNSCURPFC
0.4
+5
V
VCOMPPFC
voltage on pin COMPPFC
0.4
+5
V
VCFMIN
voltage on pin CFMIN
0.4
+5
V
VPGND
voltage on pin PGND
1
+1
V
0.8
+2
A
1
+10
mA
VGATEHS
VGATELS
current limited
Currents
IGATEPFC
current into pin GATEPFC
ISNSCURPFC
current into pin SNSCURPFC
duty cycle < 10 %
General
Tamb < 75 C
Ptot
total power dissipation
-
0.8
W
Tstg
storage temperature
55
+150
C
Tj
junction temperature
40
+150
C
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Table 5.
Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).; All voltages are measured with respect to theSGND
pin; Currents are positive when flowing into the IC; The voltage ratings are valid provided other ratings are not violated;
Current ratings are valid provided the maximum power rating is not violated.
Symbol
Parameter
Conditions
electrostatic discharge voltage
Human body model
Min
Max
Unit
ESD
VESD
Pin 12 (SUPHV)
[2]
-
1500
V
Pin 13,14,15 (HS driver)
[2]
-
1000
V
other pins
[2]
-
2000
V
[3]
-
200
V
-
500
V
Machine model
All pins
Charged device model
All pins
[1]
Exceeding this rating for short peak currents (t < 10 s) is allowed.
[2]
Equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.
[3]
Equivalent to discharging a 200 pF capacitor through a 0.75 H coil and a 10 resistor.
9. Thermal characteristics
Table 6.
Thermal characteristics
Symbol
Parameter
Conditions
Typ
Unit
Rth(j-a)
thermal resistance from junction to ambient
in free air; JEDEC single
layer test board
90
K/W
10. Characteristics
Table 7.
Characteristics
Tamb = 25 C; VSUPIC = 20 V; VSUPHV > 40 V; all voltages are measured with respect to SGND; currents are positive when
flowing into the IC; unless otherwise specified
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
High-voltage start-up source (pin SUPHV)
Idism(SUPHV)
disable mode current on
pin SUPHV
Disabled IC state
-
140
-
A
Ired(SUPHV)
reduced current on pin
SUPHV
VSUPIC < Vscp(SUPIC)
-
1.2
-
mA
Inom(SUPHV)
nominal current on pin
SUPHV
VSUPIC < Vstart(hvd)(SUPIC)
4.3
5.1
-
mA
Itko(SUPHV)
takeover current on pin
SUPHV
VSUPIC > Vstart(hvd)(SUPIC)
-
7
-
A
Vdet(SUPHV)
detection voltage on pin
SUPHV
-
-
25
V
Vrst(SUPHV)
reset voltage on pin
SUPHV
-
7
-
V
TEA1716T
Product data sheet
VSUPIC < Vrst(SUPIC)
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Table 7.
Characteristics …continued
Tamb = 25 C; VSUPIC = 20 V; VSUPHV > 40 V; all voltages are measured with respect to SGND; currents are positive when
flowing into the IC; unless otherwise specified
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Low-voltage IC supply (pin SUPIC)
Vstart(hvd)(SUPIC)
start voltage with high
voltage detected
VSUPHV > Vdet(SUPHV)
19
20
21
V
Vstart(nohvd)(SUPIC)
start voltage with no high
voltage detected
VSUPHV < Vdet(SUPHV) or open
14.1
15
15.9
V
Vstart(hys)(SUPIC)
hysteresis of start voltage
on pin SUPIC
-
0.3
-
V
Vuvp(SUPIC)
undervoltage protection
voltage on pin SUPIC
12.3
13
13.7
V
Vrst(SUPIC)
reset voltage on pin
SUPIC
-
7
-
V
Vscp(SUPIC)
short-circuit protection
voltage on pin SUPIC
0.55
0.65
0.75
V
Ich(red)(SUPIC)
reduced charge current
on pin SUPIC
-
0.95
-
mA
Ich(nom)(SUPIC)
nominal charge current on
pin SUPIC
-
4.8
4.0
mA
Idism(SUPIC)
current on pin SUPIC in
disabled mode
Disabled IC state
-
0.22
0.29
mA
Iprotm(SUPIC)
current on pin SUPIC in
protection mode
SUPIC charge, SUPREG charge;
Restart or Shutdown state
-
0.4
-
mA
Ioper(SUPIC)
current on pin SUPIC in
operating mode
Operational supply state; Driver pins
open.
-
3.2
3.7
mA
Iburstm(SUPIC)
burst mode current on pin Burst stop state
SUPIC
-
0.6
0.75
mA
[1]
11.0
11.3
11.6
V
VSUPHV < Vrst(SUPHV)
VSUPIC < Vscp(SUPIC)
Regulated supply (pin SUPREG)
ISUPREG = 1 mA to 40 mA
Vreg(SUPREG)
regulation voltage on pin
SUPREG
Vstart(SUPREG)
start voltage on pin
SUPREG
[1]
-
10.7
-
V
Vuvp(SUPREG)
undervoltage protection
voltage on pin SUPREG
[1]
-
10
10.4
V
Ich(SUPREG)max
maximum charge current
on pin SUPREG
VSUPREG > Vuvp(SUPREG)
40
100
-
mA
Ich(red)(SUPREG)
reduced charge current
on pin SUPREG
VSUPREG < Vuvp(SUPREG); T = 25 C.
-
5.5
-
mA
T = 140 C
-
-
2.5
mA
Enable input (pin SSHBC/EN)
Ven(PFC)(EN)
PFC enable voltage on
pin EN
PFC only
[2]
0.8
1.2
1.4
V
Ven(IC)(EN)
IC enable voltage on pin
EN
PFC + HBC
[2]
1.8
2.2
2.4
V
Ipu(EN)
pull-up current on pin EN
VSSHBC/EN = 2.5 V
Vpu(EN)
pull-up voltage on pin EN
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42
-
A
-
3.0
-
V
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Table 7.
Characteristics …continued
Tamb = 25 C; VSUPIC = 20 V; VSUPHV > 40 V; all voltages are measured with respect to SGND; currents are positive when
flowing into the IC; unless otherwise specified
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
-
0.8
-
V
Fast shut-down reset (pin SNSMAINS)
Vrst(SNSMAINS)
[2]
reset voltage on pin
SNSMAINS
Protection and restart timer (pin RCPROT)
Vu(RCPROT)
upper voltage on pin
RCPROT
3.8
4.0
4.2
V
Vl(RCPROT)
lower voltage on pin
RCPROT
0.4
0.5
0.6
V
Ich(fast)(RCPROT)
fast-charge current on pin
RCPROT
-
2.2
-
mA
Ich(slow)(RCPROT)
slow-charge current on
pin RCPROT
120
100
80
A
Output voltage protection sensing, OVP/FSP output (pin SNSOUT)
Vovp(SNSOUT)
overvoltage protection
voltage on pin SNSOUT
[2]
3.40
3.50
3.60
V
Vfsp(SNSOUT)
failed start protection
voltage on pin SNSOUT
[2]
2.35
2.5
2.65
V
Ipu(SNSOUT)
pull-up current on pin
SNSOUT
-
75
-
nA
130
150
160
C
Overtemperature protection
Totp
[2]
overtemperature
protection trip
Burst mode activation (pin SNSBURST)
Vburst(SNSBURST)
burst mode voltage on pin Burst stop state activation
SNSBURST
3.42
3.5
3.58
V
Vburst(hys)SNSBURST
burst mode hysteresis
voltage on pin
SNSBURST
-
23
-
mV
Iburst(hys)SNSBURST
burst mode hysteresis
current on pin
SNSBURST
VSNSBURST < Vburst(SNSBURST)
2.5
3
3.5
A
Rpd(SNSOUT)
pull-down resistance on
pin SNSOUT
Burst stop state
-
400
-
PFC driver (pin GATEPFC)
Isource(GATEPFC)
source current on pin
GATEPFC
VGATEPFC = 2 V
-
0.6
Isink(GATEPFC)
sink current on pin
GATEPFC
VGATEPFC = 2 V
-
0.6
-
A
VGATEPFC = 10 V
-
1.4
-
A
A
PFC on-timer (pin COMPPFC)
Vton(COMPPFC)zero
zero on-time voltage on
pin COMPPFC
-
3.5
-
V
Vton(COMPPFC)max
maximum on-time voltage
on pin COMPPFC
-
1.25
-
V
fmax(PFC)
PFC maximum frequency
100
125
150
kHz
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Resonant power supply control IC with PFC
Table 7.
Characteristics …continued
Tamb = 25 C; VSUPIC = 20 V; VSUPHV > 40 V; all voltages are measured with respect to SGND; currents are positive when
flowing into the IC; unless otherwise specified
Symbol
Parameter
Conditions
toff(PFC)min
minimum PFC off-time
Min
Typ
Max
Unit
-
1.4
-
s
PFC error amplifier (pins SNSBOOST and COMPPFC)
Vreg(SNSBOOST)
regulation voltage on pin
SNSBOOST
ICOMPPFC = 0
2.475 2.500
2.525 V
gm
transconductance
VSNSBOOST to ICOMPPFC;
|VSNSBOOST Vreg(SNSBOOST)| < 40 mV
-
80
-
A/V
Isink(COMPPFC)
sink current on pin
COMPPFC
VSNSBOOST = 2.0 V
-
90
-
A
Isource(COMPPFC)
source current on pin
COMPPFC
VSNSBOOST = 3.3 V
-
90
-
A
Voffset(gm)high
high-transconductance
offset voltage
pin SNSBOOST; ICOMPPFC = 40 A
-
100
-
mV
-
100
-
mV
-
4
-
V
high mains; VSNSMAINS = 3.3 V
3.5
4.7
5.9
s
low mains; VSNSMAINS = 0.97 V
29
44
59
s
4.0
-
-
V
Vclamp(COMPPFC)
ICOMPPFC = +40 A
[3]
clamp voltage on pin
COMPPFC
PFC mains compensation (pin SNSMAINS)
ton(max)
Vmvc(SNSMAINS)max
maximum on-time
maximum mains voltage
compensation voltage on
pin SNSMAINS
PFC demagnetization sensing (pin SNSAUXPFC)
Vdemag(SNSAUXPFC)
demagnetization voltage
on pin SNSAUXPFC
150
100
50
mV
tto(mag)
magnetization time-out
time
40
50
60
s
Iprot(SNSAUXPFC)
protection current on pin
SNSAUXPFC
75
33
-
nA
-
-
1.7
V/s
VSNSAUXPFC = 50 mV
PFC valley sensing (pin SNSAUXPFC)
(dV/dt)vrec(min)
minimum valley
recognition rate of voltage
change
tslope(vrec)min
minimum valley
recognition slope time
VSNSAUXPFC = 1 V (p-p)
[4]
-
-
300
ns
demagnetization to V/t = 0
[5]
-
-
50
ns
td(val-dem)max
maximum
valley-to-demagnetization
delay time
-
200
-
ns
tto(vrec)
valley recognition time-out
time
3
4
6
s
-
60
-
A
0.44
0.50
0.56
V
PFC soft-start (pin SNSCURPFC)
Ich(ss)(PFC)
PFC soft-start charge
current
Vclamp(ss)(PFC)
PFC soft-start clamp
voltage
TEA1716T
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Table 7.
Characteristics …continued
Tamb = 25 C; VSUPIC = 20 V; VSUPHV > 40 V; all voltages are measured with respect to SGND; currents are positive when
flowing into the IC; unless otherwise specified
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
-
0.45
-
V
12
-
-
k
dV/dt = 50 mV/s
0.49
0.52
0.55
V
dV/dt = 200 mV/s
[1]
Vstop(ss)(PFC)
PFC soft-start stop
voltage
Rss(PFC)
PFC soft-start resistor
PFC overcurrent sensing (pin SNSCURPFC)
Vocr(PFC)
PFC overcurrent
regulation voltage
0.51
0.54
0.57
V
tleb(PFC)
PFC leading edge
blanking time
250
310
370
ns
Iprot(SNSCURPFC)
protection current on pin
SNSCURPFC
50
33
-
nA
PFC mains voltage sensing and clamp (pin SNSMAINS)
Vstart(SNSMAINS)
start voltage on pin
SNSMAINS
[1]
1.11
1.15
1.19
V
Vuvp(SNSMAINS)
undervoltage protection
voltage on pin SNSMAINS
[1]
0.84
0.89
0.94
V
Vpu(SNSMAINS)
pull-up voltage on pin
SNSMAINS
[1]
-
1.05
-
V
Ipu(SNSMAINS)
maximum clamp current
UVP-mains active
-
42
35
A
Iprot(SNSMAINS)
Protection current on pin
SNSMAINS
VSNSMAINS > Vuvp(SNSMAINS)
-
33
100
nA
UVP-mains active
PFC boost voltage protection sensing, SCP/UVP/OVP boost (pin SNSBOOST)
Vscp(SNSBOOST)
short circuit protection
voltage on pin
SNSBOOST
0.35
0.40
0.45
V
Vstart(SNSBOOST)
start voltage on pin
SNSBOOST
-
2.30
2.40
V
Vuvp(SNSBOOST)
undervoltage protection
voltage on pin
SNSBOOST
1.50
1.60
-
V
Vovp(SNSBOOST)
overvoltage protection
voltage on pin
SNSBOOST
2.59
2.63
2.67
V
Iprot(SNSBOOST)
protection current on pin
SNSBOOST
-
45
100
nA
VSNSBOOST = 2.4 V
HBC high-side and low-side driver (pin GATEHS and GATELS)
Isource(GATEHS)
source current on pin
GATEHS
VGATEHS VHB = 4 V
-
310
-
mA
Isource(GATELS)
source current on pin
GATELS
VGATELS VPGND = 4 V
-
310
-
mA
Isink(GATEHS)
sink current on pin
GATEHS
VGATEHS VHB = 2 V;
-
560
-
mA
VGATEHS VHB = 11 V
-
1.9
-
A
sink current on pin
GATELS
VGATELS VPGND = 2 V
-
560
-
mA
VGATELS VPGND = 11 V
-
1.9
-
A
Isink(GATELS)
TEA1716T
Product data sheet
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37 of 47
TEA1716T
NXP Semiconductors
Resonant power supply control IC with PFC
Table 7.
Characteristics …continued
Tamb = 25 C; VSUPIC = 20 V; VSUPHV > 40 V; all voltages are measured with respect to SGND; currents are positive when
flowing into the IC; unless otherwise specified
Symbol
Parameter
Conditions
Vrst(SUPHS)
reset voltage on pin
SUPHS
Iq(SUPHS)
quiescent current on pin
SUPHS
VSUPHS VHB = 11 V
Min
Typ
Max
Unit
-
4.5
-
V
-
37
-
A
HBC adaptive non-overlap time (pin HB)
(dV/dt)ano(min)
minimum adaptive
non-overlap time rate of
voltage change
-
-
120
V/s
tno(min)
minimum non-overlap
time
-
-
160
ns
40
45
50
kHz
138
153
168
A
2.50
2.72
2.93
-
HBC current controlled oscillator (pin CFMIN)
fmin(HB)
minimum frequency on
pin HB
Cfmin = 390 pF;
VSSHBC/EN > Vfmin(SSHBC)
VSNSFB > Vfmin(SNSFB)
Iosc(min)
minimum oscillator current charge and discharge
Iosc(burst)/Imin
burst oscillator current to
minimum current ratio
Iosc(fbck)/Imin
feedback oscillator current VSNSFB < Vfmax(SNSFB);
to minimum current ratio
Imin = Iosc(min) = 153 A; maximum
oscillator feedback current
3.53
3.92
4.31
-
Iosc(ss)/Imin
soft-start oscillator current VSSHBC/EN < Vfmax(SSHBC);
to minimum current ratio
Imin = Iosc(min) = 153 A; maximum
oscillator soft-start current
4.54
5.65
6.77
-
Iosc(red)
reduced oscillator current
Slowed-down oscillator
-
30
-
A
flimit(HB)
limit frequency on pin HB
Cfmin = 20 pF
500
670
-
kHz
Vu(CFMIN)
upper voltage on pin
CFMIN
2.85
3.0
3.15
V
Vl(CFMIN)
lower voltage on pin
CFMIN
0.9
1.0
1.1
V
7.7
8.2
8.5
V
6.1
6.4
6.9
V
3.9
4.1
4.3
V
-
3.2
-
V
7.7
8.0
8.3
V
-
8.4
-
V
VSNSFB = 5 V; Imin = Iosc(min) = 153 A
HBC feedback input (pin SNSFB)
Volp(SNSFB)
open-loop protection
voltage on pin SNSFB
Vfmin(SNSFB)
minimum frequency
voltage on pin SNSFB
Vfmax(SNSFB)
maximum frequency
voltage on pin SNSFB
[2]
VSSHBC/EN > Vfmin(SSHBC)
HBC soft-start (pin SSHBC/EN)
Vfmax(SSHBC)
maximum frequency
voltage on pin SSHBC
Vfmin(SSHBC)
minimum frequency
voltage on pin SSHBC
Vclamp(SSHBC)
clamp voltage on pin
SSHBC
TEA1716T
Product data sheet
VSNSFB > Vfmin(SNSFB)
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38 of 47
TEA1716T
NXP Semiconductors
Resonant power supply control IC with PFC
Table 7.
Characteristics …continued
Tamb = 25 C; VSUPIC = 20 V; VSUPHV > 40 V; all voltages are measured with respect to SGND; currents are positive when
flowing into the IC; unless otherwise specified
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
-
5.6
-
V
charge current
-
160
-
A
discharge current
-
+160
-
A
charge current
-
40
-
A
discharge current
-
+40
-
A
[2]
Vss(hf-lf)(SSHBC)
high-low frequency
soft-start voltage on pin
SSHBC
Iss(hf)(SSHBC)
high-frequency soft start
current on pin SSHBC
VSSHBC < Vss(lf-hf)(SSHBC)
low-frequency soft start
current on pin SSHBC
VSSHBC > Vss(lf-hf)(SSHBC)
Iss(lf)(SSHBC)
Icmr(hf)(SSHBC)
high frequency CMR
current on pin SSHBC
VSSHBC < Vss(lf-hf)(SSHBC) discharge
only
-
1800
-
A
Icmr(lf)(SSHBC)
low frequency CMR
current on pin SSHBC
VSSHBC > Vss(lf-hf)(SSHBC) discharge
only
-
440
-
A
3.89
4.31
4.73
HBC high frequency sensing, HFP-HBC (pin CFMIN)
Iosc(hfp)/Imin
high-frequency protection
oscillator current to
minimum current ratio
Imin = Iosc(min) = 153 A
HBC overcurrent sensing, OCR/OCP-HBC (pin SNSCURHBC)
Vocr(HBC)
Vocp(HBC)
Ibstc(SNSCURHBC)max
HBC overcurrent
regulation voltage
HBC overcurrent
protection voltage
maximum boost
compensation current on
pin SNSCURHBC
positive level; HS on + HS-LS
non-overlap time
+0.45 +0.50 +0.55 V
negative level; LS on + LS-HS
non-overlap time
0.55 0.50
positive level; HS on + HS-LS
non-overlap time
+1.6
+1.75 +1.9
V
negative level; LS on + LS-HS
non-overlap time
1.9
1.75
1.6
V
0.45 V
VSNSBOOST = 1.8 V
source current; VSNSCURHBC = 0.5 V
-
175
-
A
sink current; VSNSCURHBC = 0.5 V
-
175
-
A
-
690
-
ns
HBC Capacitive Mode Protection (CMP) (pin HB)
tto(cmr)
[1]
time-out capacitive mode
regulation
The marked levels on this pin are correlated. The voltage difference between the levels has much less spread than the absolute value of
the levels themselves.
[2]
Switching level has some hysteresis. The hysteresis falls within the limits.
[3]
For a typical application with a compensation network on the COMPPFC pin, like the example in Figure 17.
[4]
Minimum required voltage change time for valley recognition on the SNSAUXPFC pin.
[5]
Minimum time required between demagnetization detection and V/t = 0 on the SNSAUXPFC pin.
TEA1716T
Product data sheet
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39 of 47
TEA1716T
NXP Semiconductors
Resonant power supply control IC with PFC
11. Application information
5HFW
%RRVW
7U 3)&
&683,&
$X[ 3)&
0DLQV
'683+6
&ERRVW
&UHFW
&6835(*
683+9 683,&
&683+6
6835(*
683+6
*$7(+6
616%2267
616$8;3)&
'U 3)&
616&853)&
&XU 3)&
5FXU 3)&
&+%
&XU +%&
616&85+%&
5FXUFPS
*$7(3)&
3RZHU)DFWRU
&RQWUROOHU
7U +%&
&5HV
*$7(/6
6160$,16
5VV 3)&
+%
+%
5HVRQDQW
+DOI%ULGJH 616287
&RQWUROOHU
2XWSXW
5FXU +%&
&VV 3)&
6835(*
616)%
&2033)&
616%8567
5SURW
&)0,1
5&3527
,&
&SURW
66+%&(1
3*1'
6*1'
&IPLQ
&VV +%&
'LVDEOH
DDD
Fig 17. TEA1716T application diagram
TEA1716T
Product data sheet
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Rev. 3 — 30 November 2012
© NXP B.V. 2012. All rights reserved.
40 of 47
TEA1716T
NXP Semiconductors
Resonant power supply control IC with PFC
12. Package outline
SO24: plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
D
E
A
X
c
HE
y
v M A
Z
13
24
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
12
e
detail X
w M
bp
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
mm
2.65
0.3
0.1
2.45
2.25
0.25
0.49
0.36
0.32
0.23
15.6
15.2
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25
0.25
0.1
0.01
0.019 0.013
0.014 0.009
0.61
0.60
0.30
0.29
0.05
0.419
0.043
0.055
0.394
0.016
inches
0.1
0.012 0.096
0.004 0.089
0.043
0.039
0.01
0.01
Z
(1)
0.9
0.4
0.035
0.004
0.016
θ
8o
o
0
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT137-1
075E05
MS-013
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 18. Package outline SOT137 (SO24)
TEA1716T
Product data sheet
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Rev. 3 — 30 November 2012
© NXP B.V. 2012. All rights reserved.
41 of 47
TEA1716T
NXP Semiconductors
Resonant power supply control IC with PFC
13. Abbreviations
Table 8.
TEA1716T
Product data sheet
Abbreviations
Acronym
Description
ANO
Adaptive Non-Overlap
CMOS
Complementary Metal-Oxide-Semiconductor'
CMR
Capacitive Mode Regulation
DMOS
Double-diffused Metal-Oxide-Semiconductor
EMI
ElectroMagnetic Interference
FSP
Failed Start Protection
HBC
Half-Bridge Converter or Controller. Resonant converter which generates the
regulated output voltage.
HFP
High-Frequency Protection
HV
High-voltage
OCP
OverCurrent Protection
OCR
OverCurrent Regulation
OLP
Open-Loop Protection
OTP
OverTemperature Protection
OVP
OverVoltage Protection
PFC
Power Factor Converter or Controller. Converter which performs the power factor
correction.
UVP
UnderVoltage Protection
SCP
Short-Circuit Protection
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© NXP B.V. 2012. All rights reserved.
42 of 47
TEA1716T
NXP Semiconductors
Resonant power supply control IC with PFC
14. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
TEA1716T v.3
20121130
Product data sheet
-
TEA1716T v.2
Modifications:
•
Text and drawings updated throughout entire data sheet.
TEA1716T v.2
20120821
Product data sheet
-
TEA1716T v.1
TEA1716T v.1
20120127
Objective data sheet
-
-
TEA1716T
Product data sheet
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Rev. 3 — 30 November 2012
© NXP B.V. 2012. All rights reserved.
43 of 47
TEA1716T
NXP Semiconductors
Resonant power supply control IC with PFC
15. Legal information
15.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
15.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
TEA1716T
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 November 2012
© NXP B.V. 2012. All rights reserved.
44 of 47
TEA1716T
NXP Semiconductors
Resonant power supply control IC with PFC
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
TEA1716T
Product data sheet
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Rev. 3 — 30 November 2012
© NXP B.V. 2012. All rights reserved.
45 of 47
TEA1716T
NXP Semiconductors
Resonant power supply control IC with PFC
17. Contents
1
2
2.1
2.2
2.3
2.4
3
4
5
6
6.1
6.2
7
7.1
7.2
7.2.1
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 2
General features . . . . . . . . . . . . . . . . . . . . . . . . 2
PFC controller features. . . . . . . . . . . . . . . . . . . 2
HBC controller features . . . . . . . . . . . . . . . . . . 2
Protection features . . . . . . . . . . . . . . . . . . . . . . 2
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
Functional description . . . . . . . . . . . . . . . . . . . 6
Overview of IC modules . . . . . . . . . . . . . . . . . . 6
Power supply . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Low-voltage supply input
(SUPIC pin) . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
7.2.2
Regulated supply
(SUPREG pin) . . . . . . . . . . . . . . . . . . . . . . . . . 8
7.2.3
High-side driver floating supply
(SUPHS pin) . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
7.2.4
High-voltage supply input
(SUPHV pin) . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
7.3
Flow diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 9
7.4
Enable input
(SSHBC/EN pin) . . . . . . . . . . . . . . . . . . . . . . . 11
7.5
IC protection . . . . . . . . . . . . . . . . . . . . . . . . . . 12
7.5.1
IC restart and shutdown . . . . . . . . . . . . . . . . . 12
7.5.2
Protection and restart timer . . . . . . . . . . . . . . 13
7.5.2.1
Protection timer . . . . . . . . . . . . . . . . . . . . . . . 13
7.5.2.2
Restart timer . . . . . . . . . . . . . . . . . . . . . . . . . . 13
7.5.3
Fast shutdown reset
(SNSMAINS pin). . . . . . . . . . . . . . . . . . . . . . . 14
7.5.4
Output overvoltage protection
(SNSOUT pin) . . . . . . . . . . . . . . . . . . . . . . . . 14
7.5.5
Output failed start protection, FSP-output
(SNSOUT pin) . . . . . . . . . . . . . . . . . . . . . . . . 14
7.5.6
OverTemperature Protection
(OTP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
7.6
Burst mode operation
(SNSBURST pin) . . . . . . . . . . . . . . . . . . . . . . 15
7.7
PFC controller. . . . . . . . . . . . . . . . . . . . . . . . . 15
7.7.1
PFC gate driver
(GATEPFC pin). . . . . . . . . . . . . . . . . . . . . . . . 16
7.7.2
PFC on-time control . . . . . . . . . . . . . . . . . . . . 16
7.7.2.1
PFC error amplifier
(COMPPFC and SNSBOOST pins) . . . . . . . . 16
7.7.2.2
7.7.3
7.7.4
7.7.5
7.7.6
7.7.7
7.7.8
7.7.9
7.7.10
7.8
7.8.1
7.8.2
7.8.3
7.8.4
7.8.4.1
7.8.4.2
7.8.5
7.8.6
7.8.7
7.8.8
7.8.8.1
7.8.8.2
7.8.8.3
7.8.9
7.8.10
7.8.10.1
7.8.10.2
7.8.10.3
7.8.11
7.9
PFC mains compensation
(SNSMAINS pin) . . . . . . . . . . . . . . . . . . . . . . 17
PFC demagnetization sensing
(SNSAUXPFC pin). . . . . . . . . . . . . . . . . . . . . 18
PFC valley sensing
(SNSAUXPFC pin). . . . . . . . . . . . . . . . . . . . . 18
PFC frequency and off-time limiting . . . . . . . . 19
PFC soft-start and soft-stop
(SNSCURPFC pin) . . . . . . . . . . . . . . . . . . . . 19
PFC overcurrent regulation,
OCR-PFC (SNSCURPFC pin) . . . . . . . . . . . . 20
PFC mains undervoltage protection/brownout
protection, UVP-mains
(SNSMAINS pin) . . . . . . . . . . . . . . . . . . . . . . 20
PFC boost overvoltage protection,
OVP-boost (SNSBOOST pin) . . . . . . . . . . . . 21
PFC short circuit/open-loop protection,
SCP/OLP-PFC (SNSBOOST pin) . . . . . . . . . 21
HBC controller . . . . . . . . . . . . . . . . . . . . . . . . 21
HBC high-side and low-side driver
(GATEHS and GATELS pins). . . . . . . . . . . . . 21
HBC boost undervoltage protection,
UVP-boost (SNSBOOST pin) . . . . . . . . . . . . 21
HBC switch control. . . . . . . . . . . . . . . . . . . . . 22
HBC Adaptive Non-Overlap
(ANO) time function (HB pin) . . . . . . . . . . . . . 22
Inductive mode (normal operation) . . . . . . . . 22
Capacitive mode . . . . . . . . . . . . . . . . . . . . . . 24
HBC slope controlled oscillator
(pin CFMIN) . . . . . . . . . . . . . . . . . . . . . . . . . . 25
HBC feedback input (SNSFB pin) . . . . . . . . . 26
HBC open-loop protection, OLP-HBC
(SNSFB pin). . . . . . . . . . . . . . . . . . . . . . . . . . 26
HBC soft-start (pin SSHBC/EN) . . . . . . . . . . . 26
Soft-start voltage levels . . . . . . . . . . . . . . . . . 26
Soft-start charge and discharge . . . . . . . . . . . 27
Soft-start reset . . . . . . . . . . . . . . . . . . . . . . . . 27
HBC high-frequency protection, HFP-HBC . . 28
HBC overcurrent regulation and protection, OCR
and OCP (SNSCURHBC pin) . . . . . . . . . . . . 28
Boost voltage compensation . . . . . . . . . . . . . 28
OverCurrent Regulation
(OCR-HBC) . . . . . . . . . . . . . . . . . . . . . . . . . . 29
OverCurrent Protection
(OCP-HBC) . . . . . . . . . . . . . . . . . . . . . . . . . . 30
HBC capacitive mode regulation,
CMR (HB pin). . . . . . . . . . . . . . . . . . . . . . . . . 31
Protection functions overview . . . . . . . . . . . . 31
continued >>
TEA1716T
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 November 2012
© NXP B.V. 2012. All rights reserved.
46 of 47
TEA1716T
NXP Semiconductors
Resonant power supply control IC with PFC
8
9
10
11
12
13
14
15
15.1
15.2
15.3
15.4
16
17
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . .
Thermal characteristics . . . . . . . . . . . . . . . . .
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . .
Application information. . . . . . . . . . . . . . . . . .
Package outline . . . . . . . . . . . . . . . . . . . . . . . .
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . . .
Legal information. . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information. . . . . . . . . . . . . . . . . . . . .
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
32
33
33
40
41
42
43
44
44
44
44
45
45
46
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 30 November 2012
Document identifier: TEA1716T
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