TEA18363T/2J

TEA18363T GreenChip SMPS control IC Rev. 2 — 12 December 2013 Product data sheet 1. General description The TEA18363T is a controller IC for low-cost Switched Mode Power Supplies (SMPS). It is intended for flyback topologies. The built-in green functions provide high efficiency at all power levels. At high power levels the flyback operates in Quasi-Resonant (QR) mode. At lower power levels, the controller switches to Frequency Reduction (FR) or Discontinuous Conduction Mode (DCM) and limits the peak current to approximately 25 % of the maximum peak current. Valley switching is used in all operating modes. At low power levels, when the flyback switching frequency drops below 25 kHz, the flyback converter switches to burst mode. A special burst mode has been integrated which reduces the opto current to a minimum level, ensuring high efficiency at low power and excellent no load power performance. As the switching frequency in this mode has a minimum value of 25 kHz while the burst frequency is below 800 Hz, the frequencies are outside the audible range. During the non-switching phase of the burst mode, the internal IC supply current is minimized for further efficiency optimization. The TEA18363T includes an accurate OverPower Protection (OPP). The OPP enables the controller to operate in overpower situations for a limited amount of time. If the output is shorted, the system switches to low-power mode where the output power is limited to a lower level. The TEA18363T is manufactured in a high-voltage Silicon-On-Insulator (SOI) process. The SOI process combines the advantages of a low-voltage process (accuracy, high-speed protection, functions, and control), while maintaining the high-voltage capabilities (high-voltage start-up, low standby power, and an integrated X-capacitor discharge function). The TEA18363T enables low-cost, highly efficient and reliable supplies for power requirements up to 75 W to be designed with a minimum number of external components. All values mentioned in this data sheet are typical values, unless otherwise specified. TEA18363T NXP Semiconductors GreenChip SMPS control IC 2. Features and benefits 2.1 General features         SMPS controller IC for low-cost applications Large supply voltage range (up to 30 V) Integrated high-voltage start-up Continuous VCC regulation during start-up and protection via the HV pin, allowing a minimum VCC capacitor value Reduced opto current in burst mode enabling low no load power consumption Operating frequencies in all operating modes are outside the audible area Integrated X-capacitor discharge; NXP Semiconductors patented (Patent reference: 81512184EP01 (Patent pending)) Adjustable soft start 2.2 Green features     Low supply current during normal operation (0.6 mA without load) Low supply current during non-switching state in burst mode (0.2 mA) Valley switching for minimum switching losses Frequency reduction with fixed minimum peak current to maintain high efficiency at low output power levels 2.3 Protection features        Mains voltage independent OverPower Protection (OPP) OverTemperature Protection (OTP) Integrated overpower time-out Integrated restart timer for system fault conditions Continuous mode protection using demagnetization detection Accurate OverVoltage Protection (OVP) Driver maximum on-time protection 3. Applications  Applications requiring efficient and cost-effective power supply solutions up to 75 W 4. Ordering information Table 1. Ordering information Type number TEA18363T/1 TEA18363T Product data sheet Package Name Description Version SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 December 2013 © NXP B.V. 2013. All rights reserved. 2 of 27 xxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx x xxxxxxxxxxxxxx xxxxxxxxxx xxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx xxxxxxxxxxxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxx x x '5,9(5 23OLPLW 9 9 IODX[ +9 P9 %/$1. ODX[ 9$//(< '(7(&7 +9MIHW —$ 6WDUW23&QWU 'HPDJ ,VHQVH VRIWVWDUW ,6(16( 2&3 YDOOH\ ,SHDN 9LQ0HDVXUH ;FDS'LVFKDUJH 9&&&KDUJH ',*,7$/ &21752/ %URZQ2XW NXP Semiconductors *DWH Q$ 5. Block diagram TEA18363T Product data sheet $8; 9&&FKDUJHGYLD +9FXUUHQWVRXUFH P$ $ 9&&'LVFKDUJH 9FF!9FFVWRS $' &219(56,21 *DWH 7RQ!—V 9FF!9FFVWDUW ,SURWHFW RQ 9FWUO RQ 7RQ0D[ Rev. 2 — 12 December 2013 All information provided in this document is subject to legal disclaimers. 9SURWHFW!9 9FWUO!9 9RXW5HJXODWHG 9&& 9 9 &&5HVHW ,VRIWVWDUW RQ 6WDUW23&QWU 23OLPLW 9 9 &&6WRS 2&3 3URWHFWLRQ %URZQ2XW 9 9 &&/RZ 9DOOH\ 'HPDJ 9 9 &&6WDUW 9FF9FFUHVHW ,VHQVH!9 U T VDIHUHVWDUWSURWHFWLRQPRGH 9&&UHJXODWHGWR9FFVWDUW ,YFF —$ 1RUPDOPRGH ,YFF —$ JDWH SURWHFWLRQ V QURIJDWHSXOVHV! 1RUPDOPRGH 9FWUO!9 6WDQGE\PRGH ,YFF —$ 6WDQGE\PRGH %XUVW2Q 9FF'LVFKDUJH /DWFKHGSURWHFWLRQPRGH 9&&UHJXODWHGWR9FFVWDUW ,YFF —$ PV  9FF9FFUHVHW 7(03(5$785( 3527(&7,21 273 9RXW5HJXODWHG PV 26&,//$725 $1' 7,0,1*6,*1$/6 *DWH '(/$ Vbrownin yes maximum on-time no safe restart 800 ms yes OTP internal no latch yes OVP via the AUX pin 4 driver pulses latch yes overpower compensation no via AUX; cycle-by-cycle - overpower time-out 40 ms or 200 ms safe restart 800 ms yes overpower + UVLO no safe restart 800 ms yes overcurrent protection blanking time cycle-by-cycle no UVLO no Wait until VCC > Vstartup yes When the system stops switching, the VCC pin is not supplied via the auxiliary winding anymore. Depending on the protection triggered, the VCC is regulated to Vstartup via the HV pin (see Table 3). Releasing the latched protections or shortening the safe restart timer can be achieved by removing or shorting the mains voltage. This is called a fast latch reset. It is mainly used to shorten the test time in production (See Section 7.6.7). 7.6.1 OverPower Protection (OPP) The overpower function is used to realize a maximum output power which is nearly constant over the full input mains. The overpower compensation circuit measures the input voltage via the AUX pin and outputs two reference voltages (see Figure 1). If the measured voltage at the ISENSE pin exceeds the highest reference voltage (Vopc(ISENSE)) the DRIVER output is pulled low. If the measured ISENSE voltage exceeds the lower reference voltage (Vopp(ISENSE)), the OverPower counter starts. Both reference voltages depend on the measured input voltage. In this way the system allows 150 % overpower over the rated power on a cycle-by-cycle base. 100 % overpower triggers the overpower counter of 200 ms. Figure 9 shows the overpower protection curves. TEA18363T Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 December 2013 © NXP B.V. 2013. All rights reserved. 10 of 27 TEA18363T NXP Semiconductors GreenChip SMPS control IC P9  923&,6(16(    9233,6(16(   ,$8; P$ DDD Fig 9. Overpower protection curves During system start-up, the maximum overpower is limited to 100 % and the maximum time-out period is lowered to 40 ms. Once the output voltage is within its regulation level (voltage on the CTRL pin is below 5 V), the maximum overpower is switched to 150 % and the maximum time-out period returns to 200 ms limiting the output power to a minimum at a shorted output. Lowering the maximum output power and shortening the overpower timer ensure that the input power of the system is limited to < 5 W at a shorted output. Due to the limited output power, the output voltage drops if the load requires more than 150 %. As a result, the VCC voltage drops as well and UVLO can be triggered. To retain the same response in an overpower situation (whether UVLO is triggered or not) the system enters the protection mode (latch or safe restart) when overpower + UVLO is detected. The system entering the protection mode does not depend on the value of the OP counter. 7.6.2 OverVoltage Protection (OVP) An accurate output OVP is implemented by measuring the voltage at the AUX pin during the secondary stroke. As the auxiliary winding voltage is a well-defined replica of the output voltage, the OVP level can be adjusted by the external resistor divider ratio RAUX2 / (RAUX1 + RAUX2). An internal counter of four gate pulses prevents false OVP detection which can occur during ESD or lightning events. 7.6.3 OverTemperature Protection (OTP) Integrated OTP ensures that the IC stops switching if the junction temperature exceeds the thermal temperature shutdown limit. OTP is a latched protection. 7.6.4 Maximum on-time The controller limits the on-time of the external MOSFET to 55 s. When the on-time is longer, the IC stops switching and enters safe restart mode. TEA18363T Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 December 2013 © NXP B.V. 2013. All rights reserved. 11 of 27 TEA18363T NXP Semiconductors GreenChip SMPS control IC 7.6.5 Safe restart If a protection is triggered and the system enters the safe restart mode, the system restarts after 800 ms. Because the system is not switching, the VCC pin is supplied from the mains via the HV pin. After the 800 ms, the control IC measures the mains voltage. if the mains voltage exceeds the brownin level, the control IC activates the internal voltage sources connected to the CTRL pin. Once the voltage on the CTRL pin reaches a minimum level, the soft start capacitor on the ISENSE pin is charged and the system starts switching again. The VCC is continuously regulated to the Vstartup level until the output voltage is within the regulation level again. 7.6.6 Latched protection If a protection is triggered and the system enters the latched protection mode, the VCC is continuously regulated to the Vstartup level via the HV current source. As long as the AC voltage remains, the system does not switch. Removing the mains for a short time is the only possibility to restart the system. 7.6.7 Fast latch reset Fast latch reset is a simple and fast method to reset the system when it is in latched protection mode or safe restart mode. This function is used during production testing. When the latched protection mode or safe restart mode is triggered, the voltage on pin VCC is fast discharged by an internal current source (ICC(dch)); see Figure 10). The fast discharge avoids an additional waiting period if the VCC voltage is high. When shorting the mains, the waiting period is only the time of the discharge from Vstartup to Vrst. TEA18363T Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 December 2013 © NXP B.V. 2013. All rights reserved. 12 of 27 TEA18363T NXP Semiconductors GreenChip SMPS control IC 9PDLQV '5,9(5 SURWHFWLRQ IDVWGLVFKDUJHWR9VWDUWXS 9&& 9VWDUWXS 9WK89/2 9UVW 9&&JRRG P$ ,& FRQVXPSWLRQ —$ —$ ODWFKVDIH UHVWDUWUHVHW DDD Fig 10. Fast latch reset Using a 10 F VCC capacitor, the fast latch reset time is below 0.6 s. If the mains is not shorted but removed, a discharged of the X-cap can cause an additional waiting time. 7.7 Burst mode operation (CTRL pin) The controller enters the burst mode when a low output power causes the voltage on the CTRL pin to drop below 0.5 V. During normal operation, the primary opto current can be calculated with Equation 1:  7 V – V IO  CTRL   I opto = -------------------------------------------12 k (1) This implies that without any additional measure, the maximum primary opto current in burst mode is: 7 V – 0 V I opto = ---------------------------- = 583 A 12 k (2) Depending on the optocoupler used , the secondary opto current is even higher. To achieve minimum no load input power, the internal voltage (7 V) is regulated to a value that causes the primary opto current value to be 100 A when the system is in burst mode. The secondary opto current is then automatically also within this lower range. If the IC detects that the opto current is lower than 80 A, the internal voltage is increased faster to achieve a small output voltage undershoot at a positive load step. Once the system enters normal operation mode, the internal voltage is slowly increased to 7 V again. TEA18363T Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 December 2013 © NXP B.V. 2013. All rights reserved. 13 of 27 TEA18363T NXP Semiconductors GreenChip SMPS control IC To avoid audible noise, a special digital burst mode is implemented. The minimum switching frequency in this mode is 25 kHz. The burst mode repetition rate has a target frequency of 800 Hz (1250 s; see Figure 11). The amount of pulses at each burst period is defined by the requested output power. At higher output power, the amount of switching pulses increases. At low load, it decreases. The digital circuit defines the amount of burst cycles so that the burst frequency is below the audible range (800 Hz) and the switching frequency exceeds the audible range (25 kHz). Any audible noise is avoided. The minimum amount of switching cycles is set to 3 to ensure good efficiency at very low loads. To regulate the output power at a very low load, the system increases the burst period (< 800 Hz). The increased burst period is still outside the audible range. To further improve the no load input power and efficiency at low loads, the current consumption of the IC is lowered to 235 A during the non-switching period in the burst mode. 3 —V IVZ•N+] —V IVZ•N+] —V IVZ•N+] !—V IVZ•N+] W DDD Fig 11. Burst mode operation To achieve a good transient response in burst mode, the system starts switching immediately at an increased output load, allowing a shorter burst period. Eventually, it regulates to the required burst period by increasing the amount of driver pulses (see Figure 12). TEA18363T Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 December 2013 © NXP B.V. 2013. All rights reserved. 14 of 27 TEA18363T NXP Semiconductors GreenChip SMPS control IC OORDG &75/ 9FODPS&75/ '5,9(5 —V —V —V —V DDD Fig 12. Transient response in burst mode Due to the discrete number of switching cycles, the new calculated number of pulses must be 0.5 higher or lower than the existing number before one switching cycle is added or taken away. For the IC to increase or decrease the amount of switching cycles, a certain deviation from the target burst repetition frequency (800 Hz) is required because of the internal algorithm. This deviation becomes smaller when the amount of switching cycles increases. Figure 13 shows the upper and lower limits of the burst repetition frequency as a function of the number of pulses. DDD  I +]              1SXOVHV (1) Lower limit (2) Upper limit Fig 13. Upper and lower limits of burst frequency When the amount of driver pulses within one burst period exceeds 40, the system switches to normal mode again. During the burst period, the voltage on the CTRL pin is clamped to the minimum Vclamp(CTRL). The current out of the CTRL pin is measured. If the current exceeds Istop(CTRL), the burst period is terminated regardless of digital control. This feature ensures a small overshoot at the output voltage when the load in burst mode suddenly reduces. At the end of each burst period, the CTRL pin is pulled to the ground level for 12.5 s, unless the current flowing from pin CTRL < 87 A, which usually occurs at a positive load step. TEA18363T Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 December 2013 © NXP B.V. 2013. All rights reserved. 15 of 27 TEA18363T NXP Semiconductors GreenChip SMPS control IC 7.8 Soft start-up (ISENSE pin) To prevent audible noise during start-up or a restart condition, a soft start feature is implemented. Before the converter starts, the soft start capacitor CSS on the ISENSE pin is charged. When the converter starts switching, the primary peak current slowly increases as the soft start capacitor discharges through the soft start resistor RSS (see Figure 3). The soft start time constant is set by the external soft start capacitor and the parallel resistor values. 7.9 Driver (DRIVER pin) The driver circuit to the gate of the power MOSFET has a current sourcing capability of 300 mA and a current sink capability of 750 mA. These capabilities allow a fast turn-on and turn-off of the power MOSFET for efficient operation. The maximum driver output is limited to 10.5 V. The DRIVER output pin can be connected to the gate of a MOSFET directly or via a resistor. TEA18363T Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 December 2013 © NXP B.V. 2013. All rights reserved. 16 of 27 TEA18363T NXP Semiconductors GreenChip SMPS control IC 8. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit 0.4 +700 V continuous 0.4 +30 V t < 100 ms Voltages VIO(HV) input/output voltage on pin HV VCC supply voltage - +35 V VIO(CTRL) input/output voltage on pin CTRL 0.4 +12 V VI(ISENSE) input voltage on pin ISENSE 0.4 +12 V VIO(AUX) input/output voltage on pin AUX 5 +5 V VO(DRIVER) output voltage on pin DRIVER 0.4 +12 V IIO(AUX) input/output current on pin AUX 1.5 +1 mA IIO(HV) input/output current on pin HV 1 +5 mA IIO(CTRL) input/output current on pin CTRL 3 0 mA IO(DRIVER) output current on pin DRIVER  < 10 % 0.4 +1 A Ptot total power dissipation Tamb < 75 C - 0.82 W Tstg storage temperature 55 +150 C Tj junction temperature 40 +150 C 1000 +1000 V 2000 +2000 V 500 +500 V current limited Currents General ESD VESD electrostatic discharge voltage class 1 human body model [1] pin HV all other pins charged device model TEA18363T Product data sheet [2] [1] Equivalent to discharge a 100 pF capacitor through a 1.5 k series resistor. [2] Equivalent to discharge a 200 pF capacitor through a 0.75 H coil and 10 . All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 December 2013 © NXP B.V. 2013. All rights reserved. 17 of 27 TEA18363T NXP Semiconductors GreenChip SMPS control IC 9. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Typ Unit Rth(j-a) thermal resistance from junction to ambient in free air; JEDEC test board 91 K/W Rth(j-c) thermal resistance from junction to case in free air; JEDEC test board 37.8 K/W 10. Characteristics Table 6. Characteristics Tamb = 25 C; VCC = 20 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into the IC; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit start-up current on pin HV VHV > 10 V 0.8 1.1 1.4 mA VCC > Vstartup; HV not sampling - - 1 A clamp voltage IHV < 2 mA - - 680 V 13.4 14.9 16.4 V 9.9 11 12.1 V 9 9.9 10.8 V Start-up current source (HV pin) Istartup(HV) Vclamp Supply voltage management (VCC pin) Vstartup start-up voltage Vrestart restart voltage Vth(UVLO) undervoltage lockout threshold voltage Vrst reset voltage ICC(startup) start-up supply current burst mode 7.75 8.65 9.55 V VHV = 0 V - 40 - A VHV > 10 V 1.35 1.05 0.75 mA ICC(oper) operating supply current driver unloaded; excluding opto current 500 600 700 A ICC(burst) burst mode supply current non-switching; excluding opto current 200 235 270 A ICC(prot) protection supply current 185 220 255 A ICC(dch) discharge supply current latched protection; VCC > Vstartup 0.9 1.25 1.6 mA Mains detect (HV pin) tp(HV) pulse duration on pin HV measuring mains voltage 18 20 22 s fmeas(HV) measurement frequency measuring mains on pin HV voltage 0.9 1.0 1.1 kHz td(norm)HV normal mode delay time on pin HV 5 6 7 ms td(burst)HV burst mode delay time on measuring mains pin HV voltage 87 97 107 ms Ibo(HV) brownout current on pin HV 552 587 622 A TEA18363T Product data sheet measuring mains voltage All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 December 2013 © NXP B.V. 2013. All rights reserved. 18 of 27 TEA18363T NXP Semiconductors GreenChip SMPS control IC Table 6. Characteristics …continued Tamb = 25 C; VCC = 20 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into the IC; unless otherwise specified. Symbol Parameter Ibi(HV) Conditions Min Typ Max Unit brownin current on pin HV 623 663 703 A Ibo(hys)HV hysteresis of brownout current on pin HV - 76 - A IIH(HV) HIGH-level input current on pin HV 1186 1262 1338 A IIL(HV) LOW-level input current on pin HV 1118 1190 1262 A IHL(hys)HV HIGH to LOW hysteresis current on pin HV - 72 - A Iclamp(HV) clamp current on pin HV - - 1.7 mA Vmeas(HV) measurement voltage on brownin/brownout pin HV - 2.6 - V td(dch) discharge delay time - 28 - ms td(det)bo brownout detection delay time - 30 - ms minimum flyback peak current 2.3 2.5 2.7 V maximum flyback current 4.9 5.25 5.6 V 10 12 14 k VCTRL = 1.5 V 0.58 0.48 0.38 mA VCTRL = 3.5 V 0.385 0.315 0.245 mA 4.7 5 5.3 V during measurement time X capacitor discharge; pin HV Peak current control (pin CTRL) VIO(CTRL) input/output voltage on pin CTRL Rint(CTRL) internal resistance on pin CTRL IIO(CTRL) input/output current on pin CTRL Vstartup(CTRL) normal mode start-up voltage on pin CTRL Burst mode (pin CTRL) Vth(burst) burst mode threshold voltage 0.42 0.5 0.58 V Tburst burst mode period - 1250 - s fsw(min) minimum switching frequency burst mode 23 25 27 kHz IREGD(CTRL) regulated current on pin CTRL burst mode 115 100 85 A Vclamp(CTRL) clamp voltage on pin CTRL burst mode; system switching 0.44 0.5 0.56 V Istop(CTRL) stop current on pin CTRL burst mode; system switching; including regulated output current 820 750 680 A TEA18363T Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 December 2013 © NXP B.V. 2013. All rights reserved. 19 of 27 TEA18363T NXP Semiconductors GreenChip SMPS control IC Table 6. Characteristics …continued Tamb = 25 C; VCC = 20 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into the IC; unless otherwise specified. Symbol Parameter Conditions tpd(CTRL) pull-down time on pin CTRL Idet(CTRL) detection current on pin CTRL Min Typ Max Unit 10 12.5 15 s positive load step 65 80 95 A disable pulling down the CTRL pin 77 87 97 A Oscillator fsw(max) maximum switching frequency 125 132.5 140 kHz fsw(min) minimum switching frequency 23 25 27 kHz Vstart(red)f frequency reduction start pin CTRL voltage 2.3 2.5 2.7 V V/t = 0 V/s; IAUX = 0 A; VCTRL = 5.5 V 700 765 830 mV frequency reduction mode; V/t = 0 mV/s; IAUX = 0 A; 190 207 225 mV Current sense (pin ISENSE) Vsense(max) maximum sense voltage VCTRL = 1.0 V tPD(sense) sense propagation delay from the ISENSE pin reaching Vsense(max) to driver off; VISENSE pulse-stepping 100 mV around Vsense(max) - 120 - ns tleb leading edge blanking time 275 325 375 ns 85 75 65 A - Vsense(max) - V 12 - - k Soft start (pin ISENSE) Istart(soft) soft start current Vstart(soft) soft start voltage Rstart(soft) soft start resistance enable voltage Demagnetization and valley control (pin AUX) Vdet(demag) demagnetization detection voltage 20 35 50 mV Iprot(AUX) protection current on pin AUX - 200 - nA tblank(det)demag demagnetization detection blanking time 1.8 2.2 2.6 s (V/t)vrec valley recognition positive V/t voltage change with time negative V/t td(vrec-swon) valley recognition to switch-on delay time Vclamp(AUX) clamp voltage on pin AUX TEA18363T Product data sheet IAUX = 1 mA 0.25 0.37 0.49 V/s 2.35 1.9 1.45 V/s - 120 - ns 4.4 4.8 5.2 V All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 December 2013 © NXP B.V. 2013. All rights reserved. 20 of 27 TEA18363T NXP Semiconductors GreenChip SMPS control IC Table 6. Characteristics …continued Tamb = 25 C; VCC = 20 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into the IC; unless otherwise specified. Symbol Parameter tsup(xfmr_ring) transformer ringing suppression time Conditions Min Typ Max Unit 1.9 2.3 2.7 s 45 55 65 s Maximum on-time (pin DRIVER) ton(max) maximum on-time Driver (pin DRIVER) Isource(DRIVER) source current on pin DRIVER VDRIVER = 2 V - 0.3 0.25 A Isink(DRIVER) sink current on pin DRIVER VDRIVER = 2 V 0.25 0.3 - A VDRIVER = 10 V 0.6 0.75 - A VO(DRIVER)max maximum output voltage on pin DRIVER 9 10.5 12 V Overpower compensation (pin ISENSE and pin AUX) Vclamp(AUX) clamp voltage on pin AUX primary stroke; IAUX = 0.3 mA 0.8 0.7 0.6 V td(clamp)AUX clamp delay time on pin AUX after rising edge of pin DRIVER 580 665 750 ns after falling edge of pin DRIVER 1.8 2.2 2.6 s 700 765 830 mV 400 450 500 mV IAUX = 0.3 mA 450 500 550 mV IAUX = 1.46 mA 265 295 325 mV start-up mode; VCTRL > 5 V 36 40 44 ms normal mode 180 200 220 ms 720 800 820 ms 2.88 3 3.12 V 1.9 2.3 2.7 s 130 140 150 °C Vopc(ISENSE) Vopp(ISENSE) td(opp) td(restart) overpower IAUX = 0.3 mA compensation voltage on I AUX = 1.46 mA pin ISENSE overpower protection voltage on pin ISENSE overpower protection delay time counter trigger level restart delay time Overvoltage protection (pin AUX) Vovp(AUX) overvoltage protection voltage on pin AUX tdet(ovp) overvoltage protection detection time in the secondary stroke Temperature protection Tpl(IC) TEA18363T Product data sheet IC protection level temperature All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 December 2013 © NXP B.V. 2013. All rights reserved. 21 of 27 TEA18363T NXP Semiconductors GreenChip SMPS control IC 11. Application information A power supply with TEA18363T is a flyback converter operating in QR mode or DCM (See Figure 3). Capacitor CVCC buffers the IC supply voltage. The IC supply voltage is powered from the mains via D1, D2, RHV during start-up. It is powered via the auxiliary winding during normal operation. RHV defines the current into the HV pin for brownout detection and mains detection. Sense resistor Rsense converts the current through MOSFET S1 into a voltage on pin ISENSE. The value of Rsense defines the maximum primary peak current through MOSFET S1. Resistor RSS and capacitor CSS define the soft start time. Resistor RDRIVER is required to limit the current spikes to pin DRIVER because of parasitic inductance of the current sense resistor Rsense. RDRIVER also dampens possible oscillation of MOSFET S1. Adding a bead on the gate pin of MOSFET S1 can be required to prevent local oscillations of the MOSFET. The resistor RAUX2 determines the compensation for input voltage variation. The ratio of RAUX1 and RAUX2 determines the overvoltage protection at the AUX pin. TEA18363T Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 December 2013 © NXP B.V. 2013. All rights reserved. 22 of 27 TEA18363T NXP Semiconductors GreenChip SMPS control IC 12. Package outline 62SODVWLFVPDOORXWOLQHSDFNDJHOHDGVERG\ZLGWKPP 627 ' ( $ ; F \ +( Y 0 $ =   4 $ $ $  $ SLQLQGH[ ș /S  /  H GHWDLO; Z 0 ES   PP VFDOH ',0(16,216LQFKGLPHQVLRQVDUHGHULYHGIURPWKHRULJLQDOPPGLPHQVLRQV 81,7 $ PD[ $ $ $ ES F ' ( H +( / /S 4 Y Z \ = PP                                             LQFKHV           ș R R 1RWHV 3ODVWLFRUPHWDOSURWUXVLRQVRIPPLQFKPD[LPXPSHUVLGHDUHQRWLQFOXGHG 3ODVWLFRUPHWDOSURWUXVLRQVRIPPLQFKPD[LPXPSHUVLGHDUHQRWLQFOXGHG 5()(5(1&(6 287/,1( 9(56,21 ,(& -('(& 627 ( 06 -(,7$ (8523($1 352-(&7,21 ,668('$7(   Fig 14. Package outline SOT96-1 (SO8) TEA18363T Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 December 2013 © NXP B.V. 2013. All rights reserved. 23 of 27 TEA18363T NXP Semiconductors GreenChip SMPS control IC 13. Revision history Table 7. Revision history Document ID Release date Data sheet status Change notice Supersedes TEA18363T v.2 20131212 Product data sheet - TEA18363T v.1 Modifications: TEA18363T v.1 TEA18363T Product data sheet • • The data sheet status has changed from preliminary to product. Table 1 “Ordering information” has been updated. 20131204 Preliminary data sheet - All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 December 2013 - © NXP B.V. 2013. All rights reserved. 24 of 27 TEA18363T NXP Semiconductors GreenChip SMPS control IC 14. Legal information 14.1 Data sheet status Document status[1][2] Product status[3] Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. Definition [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 14.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 14.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. TEA18363T Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 December 2013 © NXP B.V. 2013. All rights reserved. 25 of 27 TEA18363T NXP Semiconductors GreenChip SMPS control IC Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 14.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. GreenChip — is a trademark of NXP B.V. 15. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com TEA18363T Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 December 2013 © NXP B.V. 2013. All rights reserved. 26 of 27 TEA18363T NXP Semiconductors GreenChip SMPS control IC 16. Contents 1 2 2.1 2.2 2.3 3 4 5 6 6.1 6.2 7 7.1 7.1.1 7.2 7.3 7.4 7.5 7.6 7.6.1 7.6.2 7.6.3 7.6.4 7.6.5 7.6.6 7.6.7 7.7 7.8 7.9 8 9 10 11 12 13 14 14.1 14.2 14.3 14.4 15 16 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 2 General features . . . . . . . . . . . . . . . . . . . . . . . . 2 Green features . . . . . . . . . . . . . . . . . . . . . . . . . 2 Protection features . . . . . . . . . . . . . . . . . . . . . . 2 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 General control . . . . . . . . . . . . . . . . . . . . . . . . . 5 Start-up and UnderVoltage LockOut (UVLO) . . 5 Modes of operation . . . . . . . . . . . . . . . . . . . . . . 6 Supply management. . . . . . . . . . . . . . . . . . . . . 7 Mains voltage measuring . . . . . . . . . . . . . . . . . 8 Auxiliary winding . . . . . . . . . . . . . . . . . . . . . . . . 9 Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 OverPower Protection (OPP) . . . . . . . . . . . . . 10 OverVoltage Protection (OVP) . . . . . . . . . . . . 11 OverTemperature Protection (OTP) . . . . . . . . 11 Maximum on-time . . . . . . . . . . . . . . . . . . . . . . 11 Safe restart . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Latched protection . . . . . . . . . . . . . . . . . . . . . 12 Fast latch reset . . . . . . . . . . . . . . . . . . . . . . . . 12 Burst mode operation (CTRL pin). . . . . . . . . . 13 Soft start-up (ISENSE pin) . . . . . . . . . . . . . . . 16 Driver (DRIVER pin) . . . . . . . . . . . . . . . . . . . . 16 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 17 Thermal characteristics . . . . . . . . . . . . . . . . . 18 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 18 Application information. . . . . . . . . . . . . . . . . . 22 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 23 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 24 Legal information. . . . . . . . . . . . . . . . . . . . . . . 25 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 25 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Contact information. . . . . . . . . . . . . . . . . . . . . 26 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2013. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 12 December 2013 Document identifier: TEA18363T