TEA19161T
Digital controller for high-efficiency resonant power supply
Rev. 1 — 10 March 2016
Product data sheet
1. General description
The TEA19161T is a fully digital controller for high-efficiency resonant power supplies.
Together with the TEA19162T PFC controller and the TEA1995T dual SR controller, a
complete resonant power supply can be built which is easy to design and has a very low
component count. This power supply meets the efficiency regulations of Energy Star, the
Department of Energy (DoE), the Eco-design directive of the European Union, the
European Code of Conduct, and other guidelines. So, any auxiliary low-power supply can
be omitted.
In contrast to traditional resonant topologies, the TEA19161T (LLC) shows a high
efficiency at low loads due to the newly introduced low-power mode. This mode operates
in the power region between continuous switching (also called high-power mode) and
burst mode.
Because the TEA19161T is regulated via the primary capacitor voltage, it has accurate
information about the power delivered to the output. The measured output power defines
the mode of operation (burst mode, low-power mode or high-power mode). A
configuration pin can easily set the transition levels of the operating modes.
The TEA19161T contains a low-voltage die with a fully digital controller for output power
control, start-up, initializations, and protections. These protections include OverCurrent
Protection (OCP), OverVoltage Protection (OVP), Open-Loop Protection (OLP), and
Capacitive Mode Regulation (CMR). It also contains a high-voltage Silicon-On-Insulator
(SOI) controller for high-voltage start-up, integrated drivers, level shifter, protections, and
circuitry assuring zero-voltage switching.
The TEA19161T is designed to cooperate with the TEA19162T Power Factor Control
(PFC) controller. For communications about start-up and protections, the TEA19161T
contains a digital control interface. The digital control enables a fast latch reset
mechanism. It maximizes the overall system efficiency at low output power levels by
setting the TEA19162T to operate in burst mode.
The TEA19161T/TEA19162T/TEA1995T combination gives an easy to design, highly
efficient and reliable power supply, providing 90 W to 500 W, with a minimum of external
components. The system provides a very low no-load input power (< 75 mW; total system
including the TEA19161T/TEA19162T/TEA1995T combination) and high efficiency from
minimum to maximum load. So, any additional low-power supply can be omitted, ensuring
a significant system cost saving and highly simplified power supply design.
TEA19161T
NXP Semiconductors
Digital controller for high-efficiency resonant power supply
2. Features and benefits
2.1 Distinctive features
Complete functionality as a combination with TEA19162T
Integrated high-voltage start-up
Integrated high-voltage Level Shifter (LS)
Extremely fast start-up (< 500 ms at Vmains = 100 V (AC))
Continuously VSUPIC regulation via the SUPHV pin during start-up and protection,
allowing minimum SUPIC capacitor values
Operating frequencies are outside the audible area at all operating modes
Integrated soft start
Power good function
Maximum 500 kHz half-bridge switching frequency
2.2 Green features
Extremely high efficiency from low load to high load
Compliant with Energy using Product directive (EuP) lot 6
Excellent no-load input power (< 75 mW for TEA19161T/TEA19162T/TEA1995T
combination)
Regulated low optocurrent, enabling low no-load power consumption
Very low supply current during non-switching state in burst mode
Transition between different operation modes (high-power/low-power/burst mode)
occur at integrated, externally adjustable power levels
Adaptive non-overlap time
2.3 Protection features
Supply UnderVoltage Protection (UVP)
OverPower Protection (OPP)
Integrated adjustable overpower time-out
Adjustable latch or restart function for OverPower Protection
On-chip OverTemperature Protection (OTP)
Capacitive Mode Regulation (CMR)
Accurate OverVoltage Protection (OVP)
Maximum on-time protection for low-side and high-side driver output
OverCurrent Protection (OCP)
Disable input
3. Applications
TEA19161T
Product data sheet
Desktop and all-in-one PCs
LCD television
Notebook adapter
Printers
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 10 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
2 of 46
TEA19161T
NXP Semiconductors
Digital controller for high-efficiency resonant power supply
4. Ordering information
Table 1.
Ordering information
Type number
TEA19161T
TEA19161T
Product data sheet
Package
Name
Description
Version
SO16
plastic small outline package; 16 leads; body width 3.9 mm; body thickness SOT109-3
1.47 mm
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 10 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
3 of 46
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx
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xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
NXP Semiconductors
TEA19161T
Product data sheet
5. Block diagram
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& 13.8 V;
pin SUPREG
ISUPREG = 50 mA
10.6
11.0
11.4
V
Vreg(acc)SUPREG
regulator voltage accuracy
on pin SUPREG
150
100
50
mV
Ilim(SUPREG)
current limit on pin SUPREG VSUPIC = 19.5 V
44
37
30
mA
TEA19161T
Product data sheet
VSUPIC > 13.8 V;
10 A < ISUPREG < 20 mA
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Rev. 1 — 10 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
36 of 46
TEA19161T
NXP Semiconductors
Digital controller for high-efficiency resonant power supply
Table 9.
Characteristics …continued
Tamb = 25 C; VSUPIC = 19.5 V; all voltages are measured with respect to GND; currents are positive when flowing into the IC;
unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Vuvp(SUPREG)
undervoltage protection
voltage on pin SUPREG
8.6
9.0
9.4
V
-
2.50
-
V
245
210
175
A
Vhs(SNSCAP) Vls(SNSCAP);
Pout = 200 %; VSNSBOOST = 2.5 V
-
1.92
-
V
Vhs(SNSCAP) Vls(SNSCAP);
Pout = 200 %; VSNSBOOST < 2.0 V
2.85
3.00
3.15
V
overpower protection
voltage difference on pin
SNSCAP
Vhs(SNSCAP) Vls(SNSCAP);
Pout = 150 %; VSNSBOOST = 2.5 V
-
1.44
-
V
Vhs(SNSCAP) Vls(SNSCAP);
Pout = 150 %; VSNSBOOST = 2.1 V
-
2.24
-
V
tPD(SNSCAP)
propagation delay on pin
SNSCAP
from crossing
Vls(SNSCAP)/Vhs(SNSCAP) level to
GATELS/GATEHS switch-off
-
150
-
ns
td(opp)
overpower protection delay
time
See Table 5 for related RSNSSET1
40
50
60
ms
See Table 5 for related RSNSSET1
160
170
180
ms
restart delay time
0.8
1.0
1.2
s
Vbias(SNSCUR)
bias voltage on pin
SNSCUR
2.4
2.5
2.6
V
RO(SNSCUR)
output resistance on pin
SNSCUR
-
60
-
k
Vocp
overcurrent protection
voltage
positive level;
VSNSCUR Vbias(SNSCUR)
1.35
1.50
1.65
V
negative level;
VSNSCUR Vbias(SNSCUR)
1.65
1.50
1.35
V
positive level;
VSNSCUR Vbias(SNSCUR)
85
100
115
mV
negative level;
VSNSCUR Vbias(SNSCUR)
115
100
85
mV
detected as 0
-
13
-
mV
detected as 0
-
13
-
mV
SNSCAP pin
VAV(regd)SNSCAP
regulated average voltage
on pin SNSCAP
regulated average of Vhs(SNSCAP)
and Vls(SNSCAP)
Ibias(max)SNSCAP
maximum bias current on
pin SNSCAP
Vth(max)SNSCAP
maximum threshold voltage
difference on pin SNSCAP
Overpower protection
Vopp(SNSCAP)
td(restart)
SNSCUR pin
Vreg(capm)
Vdet(zero)
capacitive mode regulation
voltage
zero detection voltage
SNSBOOST pin
Vstart(SNSBOOST)
start voltage on pin
SNSBOOST
2.2
2.3
2.4
V
Vuvp(SNSBOOST)
undervoltage protection
voltage on pin SNSBOOST
1.5
1.6
1.7
V
Vdet(SNSBOOST)
detection voltage on pin
SNSBOOST
-
1.95
-
V
TEA19161T
Product data sheet
when below power good = LOW
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Rev. 1 — 10 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
37 of 46
TEA19161T
NXP Semiconductors
Digital controller for high-efficiency resonant power supply
Table 9.
Characteristics …continued
Tamb = 25 C; VSUPIC = 19.5 V; all voltages are measured with respect to GND; currents are positive when flowing into the IC;
unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
%
PFC burst mode controller
en(burst)
burst mode enable duty
cycle
enable of PFC burst mode;
duty cycle of LLC burst mode
-
50
-
Ncy(en)burst
burst mode enable number
of cycles
enable of PFC burst mode;
cycles of LLC burst mode
-
8
-
dis(burst)
burst mode disable duty
cycle
disable of PFC burst mode;
duty cycle of LLC burst mode
-
75
-
%
Vpu(SNSBOOST)
pull-up voltage on pin
SNSBOOST
to enter PFC burst mode off-state
-
2.95
-
V
during PFC burst mode off-state
Ioff(burst)
burst mode off-state current
7.1
6.4
5.7
A
Voff(burst)
burst mode off-state voltage during PFC burst mode off-state;
difference
between peak voltage and end of
off-state
-
75
-
mV
Von(burst)max
maximum burst mode
on-state voltage
during PFC burst mode on-state
2.29
2.37
2.45
V
tto(det)on(burst)
burst mode on-state
detection time-out time
during PFC burst mode on-state
3.7
4.0
4.3
ms
PFC protection controller
Rpd(SNSBOOST)
pull-down resistance on pin
SNSBOOST
at protection activation
-
550
-
Ipd(SNSBOOST)
pull-down current on pin
SNSBOOST
during active protection
94
110
127
A
Iprot(SNSBOOST)
protection current on pin
SNSBOOST
-
60
-
nA
Vovp(SNSOUT)
overvoltage protection
voltage on pin SNSOUT
3.36
3.50
3.64
V
Iprot(SNSOUT)
protection current on pin
SNSOUT
for open pin
-
60
-
nA
bias voltage on pin SNSFB
ISNSFB = 85 A
2.2
2.5
2.8
V
Ireg(SNSFB)
regulation current on pin
SNSFB
Istart(burst) = 106 A;
tracks with Istart(burst)
-
85
-
A
Ireg(max)SNSFB
maximum regulation current Istart(burst) = 106 A;
on pin SNSFB
tracks with Istart(burst)
-
310
-
A
Ireg(min)SNSFB
minimum regulation current
on pin SNSFB
Istart(burst) = 106 A;
tracks with Istart(burst)
-
63
-
A
Istart(burst)
burst mode start current
LLC burst mode
123
106
89
A
Istop(burst)
burst mode stop current
LLC burst mode
-
200
-
A
SNSOUT pin
SNSFB pin
Vbias(SNSFB)
Optobias regulator
Burst mode regulator
TEA19161T
Product data sheet
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Rev. 1 — 10 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
38 of 46
TEA19161T
NXP Semiconductors
Digital controller for high-efficiency resonant power supply
Table 9.
Characteristics …continued
Tamb = 25 C; VSUPIC = 19.5 V; all voltages are measured with respect to GND; currents are positive when flowing into the IC;
unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
GATELS and GATEHS pins
Isource(GATEHS)
source current on pin
GATEHS
VGATEHS VHB = 4 V
-
340
-
mA
Isource(GATELS)
source current on pin
GATELS
VGATELS VGND = 4 V
-
340
-
mA
Isink(GATEHS)
sink current on pin GATEHS VGATEHS VHB = 2 V
Isink(GATELS)
-
580
-
mA
VGATEHS VHB = 11 V
-
2
-
A
sink current on pin GATELS VGATELS VGND = 2 V
-
580
-
mA
VGATELS VGND =11 V
-
2
-
A
Vrst(SUPHS)
reset voltage on pin SUPHS
Vrst(hys)SUPHS
hysteresis of reset voltage
on pin SUPHS
ton(min)
minimum on-time
ton(max)
maximum on-time
tsweep
sweep time
> Vrst(SUPHS)
6.4
7
7.6
V
-
0.6
-
V
-
0.83
-
s
14.8
17.4
20.0
s
1
12
14
ms
20
23
26
kHz
RSNSOUT1 = 22 k
170
200
230
Hz
RSNSOUT1 = 15 k
340
400
460
Hz
RSNSOUT1 = 10 k
680
800
920
Hz
RSNSOUT1 = 6.8 k
1360
1600
1840
Hz
frequency; at start-up
Low-power mode regulator
flp(min)
minimum low-power mode
frequency
Burst mode regulator
fburst(max)
maximum burst mode
frequency
Power good characteristics (pin SNSSET)
VOH(SNSSET)
HIGH-level output voltage
on pin SNSSET
ISNSSET = 100 A;
power good = LOW
-
4
-
V
IOH(SNSSET)
HIGH-level output current
on pin SNSSET
VSNSSET = 3 V;
power good = LOW
11
8
5
mA
IOL(SNSSET)
LOW-level output current on VSNSSET = 0.5 V;
pin SNSSET
power good = HIGH
8
11
14
mA
td(H)SNSSET
HIGH-level delay time on
pin SNSSET
See Table 5 for related RSNSSET1
35
45
55
ms
See Table 5 for related RSNSSET1
150
190
230
ms
Settings sensor (SNSOUT, SNSSET, and GATELS pins)
IO(SNSOUT)
output current on pin
SNSOUT
during RSNSOUT1 measurement
-
171
-
A
IO(SNSSET)
output current on pin
SNSSET
during RSNSSET measurement
-
26.8
-
A
VO(GATELS-SUPREG)
output voltage difference
between pin GATELS and
pin SUPREG
during RGATELS measurement
-
1.25
-
V
TEA19161T
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 10 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
39 of 46
TEA19161T
NXP Semiconductors
Digital controller for high-efficiency resonant power supply
Table 9.
Characteristics …continued
Tamb = 25 C; VSUPIC = 19.5 V; all voltages are measured with respect to GND; currents are positive when flowing into the IC;
unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
HB pin
(dV/dt)tno(min)
minimum non-overlap time
rate of change of voltage
-
-
120
V/s
tno(min)
minimum non-overlap time
-
200
-
ns
tno(max)
maximum non-overlap time
-
1.1
-
s
130
140
150
C
Overtemperature protection
Totp
TEA19161T
Product data sheet
overtemperature protection
trip
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 10 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
40 of 46
TEA19161T
NXP Semiconductors
Digital controller for high-efficiency resonant power supply
11. Application information
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TEA19161T
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 10 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
41 of 46
TEA19161T
NXP Semiconductors
Digital controller for high-efficiency resonant power supply
12. Package outline
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Fig 28. Package outline SOT109-3 (SO16)
TEA19161T
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 10 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
42 of 46
TEA19161T
NXP Semiconductors
Digital controller for high-efficiency resonant power supply
13. Revision history
Table 10.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
TEA19161T v.1
20160310
Product data sheet
-
-
TEA19161T
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 10 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
43 of 46
TEA19161T
NXP Semiconductors
Digital controller for high-efficiency resonant power supply
14. Legal information
14.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
14.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
14.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
TEA19161T
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 10 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
44 of 46
TEA19161T
NXP Semiconductors
Digital controller for high-efficiency resonant power supply
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
14.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
GreenChip — is a trademark of NXP B.V.
15. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
TEA19161T
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 10 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
45 of 46
TEA19161T
NXP Semiconductors
Digital controller for high-efficiency resonant power supply
16. Contents
1
2
2.1
2.2
2.3
3
4
5
6
6.1
6.2
7
7.1
7.1.1
7.1.2
7.1.3
7.2
7.3
7.3.1
7.3.2
7.4
7.4.1
7.4.2
7.4.3
7.5
7.6
7.6.1
7.6.2
7.6.3
7.6.4
7.6.5
7.6.6
7.6.7
7.6.8
7.7
7.7.1
7.7.2
7.7.3
7.8
7.9
7.9.1
7.9.2
7.9.3
7.9.4
8
9
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 2
Distinctive features . . . . . . . . . . . . . . . . . . . . . . 2
Green features . . . . . . . . . . . . . . . . . . . . . . . . . 2
Protection features . . . . . . . . . . . . . . . . . . . . . . 2
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
Functional description . . . . . . . . . . . . . . . . . . . 6
Supply voltages . . . . . . . . . . . . . . . . . . . . . . . . 6
Start-up and supply voltage . . . . . . . . . . . . . . . 6
Regulated supply (SUPREG pin) . . . . . . . . . . . 8
High-side driver floating supply (SUPHS pin) . . 8
System start-up. . . . . . . . . . . . . . . . . . . . . . . . . 9
LLC system regulation . . . . . . . . . . . . . . . . . . 10
Output power regulation loop . . . . . . . . . . . . . 12
Output voltage start-up . . . . . . . . . . . . . . . . . . 13
Modes of operation . . . . . . . . . . . . . . . . . . . . . 14
High-power mode . . . . . . . . . . . . . . . . . . . . . . 16
Low-power mode . . . . . . . . . . . . . . . . . . . . . . 17
Burst mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Optobias regulation . . . . . . . . . . . . . . . . . . . . 21
Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Undervoltage protection SUPIC/SUPREG . . . 22
Undervoltage protection SUPHS . . . . . . . . . . 23
Undervoltage protection boost . . . . . . . . . . . . 23
Overvoltage protection . . . . . . . . . . . . . . . . . . 23
Capacitive Mode Regulation (CMR) . . . . . . . . 23
Overcurrent protection . . . . . . . . . . . . . . . . . . 24
Overtemperature protection . . . . . . . . . . . . . . 24
Overpower protection . . . . . . . . . . . . . . . . . . . 25
External settings . . . . . . . . . . . . . . . . . . . . . . . 26
Burst period . . . . . . . . . . . . . . . . . . . . . . . . . . 26
General settings . . . . . . . . . . . . . . . . . . . . . . . 26
Low-power mode/burst mode transition levels 27
Power good function . . . . . . . . . . . . . . . . . . . . 28
PFC/LLC communication protocol . . . . . . . . . 29
Start-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Fast latch reset . . . . . . . . . . . . . . . . . . . . . . . . 32
PFC burst mode . . . . . . . . . . . . . . . . . . . . . . . 33
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 35
Thermal characteristics . . . . . . . . . . . . . . . . . 36
10
11
12
13
14
14.1
14.2
14.3
14.4
15
16
Characteristics . . . . . . . . . . . . . . . . . . . . . . . .
Application information . . . . . . . . . . . . . . . . .
Package outline. . . . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . .
Legal information . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information . . . . . . . . . . . . . . . . . . . .
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
36
41
42
43
44
44
44
44
45
45
46
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2016.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 10 March 2016
Document identifier: TEA19161T