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TEA19161T/2Y

TEA19161T/2Y

  • 厂商:

    NXP(恩智浦)

  • 封装:

    SO-16_9.9X3.9MM

  • 描述:

    TEA19161T/2Y

  • 数据手册
  • 价格&库存
TEA19161T/2Y 数据手册
TEA19161T Digital controller for high-efficiency resonant power supply Rev. 1 — 10 March 2016 Product data sheet 1. General description The TEA19161T is a fully digital controller for high-efficiency resonant power supplies. Together with the TEA19162T PFC controller and the TEA1995T dual SR controller, a complete resonant power supply can be built which is easy to design and has a very low component count. This power supply meets the efficiency regulations of Energy Star, the Department of Energy (DoE), the Eco-design directive of the European Union, the European Code of Conduct, and other guidelines. So, any auxiliary low-power supply can be omitted. In contrast to traditional resonant topologies, the TEA19161T (LLC) shows a high efficiency at low loads due to the newly introduced low-power mode. This mode operates in the power region between continuous switching (also called high-power mode) and burst mode. Because the TEA19161T is regulated via the primary capacitor voltage, it has accurate information about the power delivered to the output. The measured output power defines the mode of operation (burst mode, low-power mode or high-power mode). A configuration pin can easily set the transition levels of the operating modes. The TEA19161T contains a low-voltage die with a fully digital controller for output power control, start-up, initializations, and protections. These protections include OverCurrent Protection (OCP), OverVoltage Protection (OVP), Open-Loop Protection (OLP), and Capacitive Mode Regulation (CMR). It also contains a high-voltage Silicon-On-Insulator (SOI) controller for high-voltage start-up, integrated drivers, level shifter, protections, and circuitry assuring zero-voltage switching. The TEA19161T is designed to cooperate with the TEA19162T Power Factor Control (PFC) controller. For communications about start-up and protections, the TEA19161T contains a digital control interface. The digital control enables a fast latch reset mechanism. It maximizes the overall system efficiency at low output power levels by setting the TEA19162T to operate in burst mode. The TEA19161T/TEA19162T/TEA1995T combination gives an easy to design, highly efficient and reliable power supply, providing 90 W to 500 W, with a minimum of external components. The system provides a very low no-load input power (< 75 mW; total system including the TEA19161T/TEA19162T/TEA1995T combination) and high efficiency from minimum to maximum load. So, any additional low-power supply can be omitted, ensuring a significant system cost saving and highly simplified power supply design. TEA19161T NXP Semiconductors Digital controller for high-efficiency resonant power supply 2. Features and benefits 2.1 Distinctive features          Complete functionality as a combination with TEA19162T Integrated high-voltage start-up Integrated high-voltage Level Shifter (LS) Extremely fast start-up (< 500 ms at Vmains = 100 V (AC)) Continuously VSUPIC regulation via the SUPHV pin during start-up and protection, allowing minimum SUPIC capacitor values Operating frequencies are outside the audible area at all operating modes Integrated soft start Power good function Maximum 500 kHz half-bridge switching frequency 2.2 Green features  Extremely high efficiency from low load to high load  Compliant with Energy using Product directive (EuP) lot 6  Excellent no-load input power (< 75 mW for TEA19161T/TEA19162T/TEA1995T combination)  Regulated low optocurrent, enabling low no-load power consumption  Very low supply current during non-switching state in burst mode  Transition between different operation modes (high-power/low-power/burst mode) occur at integrated, externally adjustable power levels  Adaptive non-overlap time 2.3 Protection features           Supply UnderVoltage Protection (UVP) OverPower Protection (OPP) Integrated adjustable overpower time-out Adjustable latch or restart function for OverPower Protection On-chip OverTemperature Protection (OTP) Capacitive Mode Regulation (CMR) Accurate OverVoltage Protection (OVP) Maximum on-time protection for low-side and high-side driver output OverCurrent Protection (OCP) Disable input 3. Applications     TEA19161T Product data sheet Desktop and all-in-one PCs LCD television Notebook adapter Printers All information provided in this document is subject to legal disclaimers. Rev. 1 — 10 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 2 of 46 TEA19161T NXP Semiconductors Digital controller for high-efficiency resonant power supply 4. Ordering information Table 1. Ordering information Type number TEA19161T TEA19161T Product data sheet Package Name Description Version SO16 plastic small outline package; 16 leads; body width 3.9 mm; body thickness SOT109-3 1.47 mm All information provided in this document is subject to legal disclaimers. Rev. 1 — 10 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 3 of 46 xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx NXP Semiconductors TEA19161T Product data sheet 5. Block diagram 683+9 , 683,& 6835(* 9 6(77,1*6 &21752/ 616287 &21752/ 6833/< VXSLFBFKDUJH LQWHUQDOVXSSOLHV VHWWLQJ , VHWWLQJ 8936835(* 616287 6166(7 893683,& '5,9(56 $' 7($ 62)767$57 3)&&21752/ *DWH+6 /6 *$7(+6 , VHWWLQJ 6835(* 3)&EXUVW 32:(5 &21752/ 616%2267 3)&SURWHFWLRQ VWDUWXS *DWH/6 9KV 616&$3 *$7(/6 9OV 616&$3 9 6:,7&+,1*&21752/ , *DWH+6 *DWH/6 )(('%$&.&21752/ 23(5$7,2102'(  $' 997 9 616)% 3ORZSZU V U T %8567 & 13.8 V; pin SUPREG ISUPREG = 50 mA 10.6 11.0 11.4 V Vreg(acc)SUPREG regulator voltage accuracy on pin SUPREG 150 100 50 mV Ilim(SUPREG) current limit on pin SUPREG VSUPIC = 19.5 V 44 37 30 mA TEA19161T Product data sheet VSUPIC > 13.8 V; 10 A < ISUPREG < 20 mA All information provided in this document is subject to legal disclaimers. Rev. 1 — 10 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 36 of 46 TEA19161T NXP Semiconductors Digital controller for high-efficiency resonant power supply Table 9. Characteristics …continued Tamb = 25 C; VSUPIC = 19.5 V; all voltages are measured with respect to GND; currents are positive when flowing into the IC; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Vuvp(SUPREG) undervoltage protection voltage on pin SUPREG 8.6 9.0 9.4 V - 2.50 - V 245 210 175 A Vhs(SNSCAP)  Vls(SNSCAP); Pout = 200 %; VSNSBOOST = 2.5 V - 1.92 - V Vhs(SNSCAP)  Vls(SNSCAP); Pout = 200 %; VSNSBOOST < 2.0 V 2.85 3.00 3.15 V overpower protection voltage difference on pin SNSCAP Vhs(SNSCAP)  Vls(SNSCAP); Pout = 150 %; VSNSBOOST = 2.5 V - 1.44 - V Vhs(SNSCAP)  Vls(SNSCAP); Pout = 150 %; VSNSBOOST = 2.1 V - 2.24 - V tPD(SNSCAP) propagation delay on pin SNSCAP from crossing Vls(SNSCAP)/Vhs(SNSCAP) level to GATELS/GATEHS switch-off - 150 - ns td(opp) overpower protection delay time See Table 5 for related RSNSSET1 40 50 60 ms See Table 5 for related RSNSSET1 160 170 180 ms restart delay time 0.8 1.0 1.2 s Vbias(SNSCUR) bias voltage on pin SNSCUR 2.4 2.5 2.6 V RO(SNSCUR) output resistance on pin SNSCUR - 60 - k Vocp overcurrent protection voltage positive level; VSNSCUR  Vbias(SNSCUR) 1.35 1.50 1.65 V negative level; VSNSCUR  Vbias(SNSCUR) 1.65 1.50 1.35 V positive level; VSNSCUR  Vbias(SNSCUR) 85 100 115 mV negative level; VSNSCUR  Vbias(SNSCUR) 115 100 85 mV detected as  0 - 13 - mV detected as  0 - 13 - mV SNSCAP pin VAV(regd)SNSCAP regulated average voltage on pin SNSCAP regulated average of Vhs(SNSCAP) and Vls(SNSCAP) Ibias(max)SNSCAP maximum bias current on pin SNSCAP Vth(max)SNSCAP maximum threshold voltage difference on pin SNSCAP Overpower protection Vopp(SNSCAP) td(restart) SNSCUR pin Vreg(capm) Vdet(zero) capacitive mode regulation voltage zero detection voltage SNSBOOST pin Vstart(SNSBOOST) start voltage on pin SNSBOOST 2.2 2.3 2.4 V Vuvp(SNSBOOST) undervoltage protection voltage on pin SNSBOOST 1.5 1.6 1.7 V Vdet(SNSBOOST) detection voltage on pin SNSBOOST - 1.95 - V TEA19161T Product data sheet when below power good = LOW All information provided in this document is subject to legal disclaimers. Rev. 1 — 10 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 37 of 46 TEA19161T NXP Semiconductors Digital controller for high-efficiency resonant power supply Table 9. Characteristics …continued Tamb = 25 C; VSUPIC = 19.5 V; all voltages are measured with respect to GND; currents are positive when flowing into the IC; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit % PFC burst mode controller en(burst) burst mode enable duty cycle enable of PFC burst mode; duty cycle of LLC burst mode - 50 - Ncy(en)burst burst mode enable number of cycles enable of PFC burst mode; cycles of LLC burst mode - 8 - dis(burst) burst mode disable duty cycle disable of PFC burst mode; duty cycle of LLC burst mode - 75 - % Vpu(SNSBOOST) pull-up voltage on pin SNSBOOST to enter PFC burst mode off-state - 2.95 - V during PFC burst mode off-state Ioff(burst) burst mode off-state current 7.1 6.4 5.7 A Voff(burst) burst mode off-state voltage during PFC burst mode off-state; difference between peak voltage and end of off-state - 75 - mV Von(burst)max maximum burst mode on-state voltage during PFC burst mode on-state 2.29 2.37 2.45 V tto(det)on(burst) burst mode on-state detection time-out time during PFC burst mode on-state 3.7 4.0 4.3 ms PFC protection controller Rpd(SNSBOOST) pull-down resistance on pin SNSBOOST at protection activation - 550 -  Ipd(SNSBOOST) pull-down current on pin SNSBOOST during active protection 94 110 127 A Iprot(SNSBOOST) protection current on pin SNSBOOST - 60 - nA Vovp(SNSOUT) overvoltage protection voltage on pin SNSOUT 3.36 3.50 3.64 V Iprot(SNSOUT) protection current on pin SNSOUT for open pin - 60 - nA bias voltage on pin SNSFB ISNSFB = 85 A 2.2 2.5 2.8 V Ireg(SNSFB) regulation current on pin SNSFB Istart(burst) = 106 A; tracks with Istart(burst) - 85 - A Ireg(max)SNSFB maximum regulation current Istart(burst) = 106 A; on pin SNSFB tracks with Istart(burst) - 310 - A Ireg(min)SNSFB minimum regulation current on pin SNSFB Istart(burst) = 106 A; tracks with Istart(burst) - 63 - A Istart(burst) burst mode start current LLC burst mode 123 106 89 A Istop(burst) burst mode stop current LLC burst mode - 200 - A SNSOUT pin SNSFB pin Vbias(SNSFB) Optobias regulator Burst mode regulator TEA19161T Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 10 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 38 of 46 TEA19161T NXP Semiconductors Digital controller for high-efficiency resonant power supply Table 9. Characteristics …continued Tamb = 25 C; VSUPIC = 19.5 V; all voltages are measured with respect to GND; currents are positive when flowing into the IC; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit GATELS and GATEHS pins Isource(GATEHS) source current on pin GATEHS VGATEHS  VHB = 4 V - 340 - mA Isource(GATELS) source current on pin GATELS VGATELS  VGND = 4 V - 340 - mA Isink(GATEHS) sink current on pin GATEHS VGATEHS  VHB = 2 V Isink(GATELS) - 580 - mA VGATEHS  VHB = 11 V - 2 - A sink current on pin GATELS VGATELS  VGND = 2 V - 580 - mA VGATELS  VGND =11 V - 2 - A Vrst(SUPHS) reset voltage on pin SUPHS Vrst(hys)SUPHS hysteresis of reset voltage on pin SUPHS ton(min) minimum on-time ton(max) maximum on-time tsweep sweep time > Vrst(SUPHS) 6.4 7 7.6 V - 0.6 - V - 0.83 - s 14.8 17.4 20.0 s 1 12 14 ms 20 23 26 kHz RSNSOUT1 = 22 k 170 200 230 Hz RSNSOUT1 = 15 k 340 400 460 Hz RSNSOUT1 = 10 k 680 800 920 Hz RSNSOUT1 = 6.8 k 1360 1600 1840 Hz frequency; at start-up Low-power mode regulator flp(min) minimum low-power mode frequency Burst mode regulator fburst(max) maximum burst mode frequency Power good characteristics (pin SNSSET) VOH(SNSSET) HIGH-level output voltage on pin SNSSET ISNSSET = 100 A; power good = LOW - 4 - V IOH(SNSSET) HIGH-level output current on pin SNSSET VSNSSET = 3 V; power good = LOW 11 8 5 mA IOL(SNSSET) LOW-level output current on VSNSSET = 0.5 V; pin SNSSET power good = HIGH 8 11 14 mA td(H)SNSSET HIGH-level delay time on pin SNSSET See Table 5 for related RSNSSET1 35 45 55 ms See Table 5 for related RSNSSET1 150 190 230 ms Settings sensor (SNSOUT, SNSSET, and GATELS pins) IO(SNSOUT) output current on pin SNSOUT during RSNSOUT1 measurement - 171 - A IO(SNSSET) output current on pin SNSSET during RSNSSET measurement - 26.8 - A VO(GATELS-SUPREG) output voltage difference between pin GATELS and pin SUPREG during RGATELS measurement - 1.25 - V TEA19161T Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 10 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 39 of 46 TEA19161T NXP Semiconductors Digital controller for high-efficiency resonant power supply Table 9. Characteristics …continued Tamb = 25 C; VSUPIC = 19.5 V; all voltages are measured with respect to GND; currents are positive when flowing into the IC; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit HB pin (dV/dt)tno(min) minimum non-overlap time rate of change of voltage - - 120 V/s tno(min) minimum non-overlap time - 200 - ns tno(max) maximum non-overlap time - 1.1 - s 130 140 150 C Overtemperature protection Totp TEA19161T Product data sheet overtemperature protection trip All information provided in this document is subject to legal disclaimers. Rev. 1 — 10 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 40 of 46 TEA19161T NXP Semiconductors Digital controller for high-efficiency resonant power supply 11. Application information 9ERRVW '683+6 5683+9 &6835(* &683+6 6835(* 683+9 683+6 *$7(+6 6 ' 9RXW /V +% SRZHUJRRG /P 616%2267 *$7(/6 6 ' 616&$3 7($ 6835(* 616&85 &U 683,& 6166(7 &683,& 616287 *1' 616)% DDD Fig 27. TEA19161T application diagram TEA19161T Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 10 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 41 of 46 TEA19161T NXP Semiconductors Digital controller for high-efficiency resonant power supply 12. Package outline 62SODVWLFVPDOORXWOLQHSDFNDJHOHDGVERG\ZLGWKPPERG\WKLFNQHVVPP ' ( 627 $ ; F \ +( Y 0 $ =   $ $ $   $ SLQLQGH[ ș /S  /  H Z 0 ES   GHWDLO; PP VFDOH ',0(16,216 LQFKGLPHQVLRQVDUHGHULYHGIURPWKHRULJLQDOPPGLPHQVLRQV  81,7 $ PD[ $ $ $ ES F '   (   H +( / /S Y Z \ =   PP                                             LQFKHV         ș R R 1RWH 3ODVWLFRUPHWDOSURWUXVLRQVRIPP LQFK PD[LPXPSHUVLGHDUHQRWLQFOXGHG 5()(5(1&(6 287/,1( 9(56,21 ,(& -('(& 627  06$& -(,7$ (8523($1 352-(&7,21 ,668('$7(   Fig 28. Package outline SOT109-3 (SO16) TEA19161T Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 10 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 42 of 46 TEA19161T NXP Semiconductors Digital controller for high-efficiency resonant power supply 13. Revision history Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes TEA19161T v.1 20160310 Product data sheet - - TEA19161T Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 10 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 43 of 46 TEA19161T NXP Semiconductors Digital controller for high-efficiency resonant power supply 14. Legal information 14.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 14.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 14.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. TEA19161T Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 1 — 10 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 44 of 46 TEA19161T NXP Semiconductors Digital controller for high-efficiency resonant power supply Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 14.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. GreenChip — is a trademark of NXP B.V. 15. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com TEA19161T Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 10 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 45 of 46 TEA19161T NXP Semiconductors Digital controller for high-efficiency resonant power supply 16. Contents 1 2 2.1 2.2 2.3 3 4 5 6 6.1 6.2 7 7.1 7.1.1 7.1.2 7.1.3 7.2 7.3 7.3.1 7.3.2 7.4 7.4.1 7.4.2 7.4.3 7.5 7.6 7.6.1 7.6.2 7.6.3 7.6.4 7.6.5 7.6.6 7.6.7 7.6.8 7.7 7.7.1 7.7.2 7.7.3 7.8 7.9 7.9.1 7.9.2 7.9.3 7.9.4 8 9 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 2 Distinctive features . . . . . . . . . . . . . . . . . . . . . . 2 Green features . . . . . . . . . . . . . . . . . . . . . . . . . 2 Protection features . . . . . . . . . . . . . . . . . . . . . . 2 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pinning information . . . . . . . . . . . . . . . . . . . . . . 5 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 Functional description . . . . . . . . . . . . . . . . . . . 6 Supply voltages . . . . . . . . . . . . . . . . . . . . . . . . 6 Start-up and supply voltage . . . . . . . . . . . . . . . 6 Regulated supply (SUPREG pin) . . . . . . . . . . . 8 High-side driver floating supply (SUPHS pin) . . 8 System start-up. . . . . . . . . . . . . . . . . . . . . . . . . 9 LLC system regulation . . . . . . . . . . . . . . . . . . 10 Output power regulation loop . . . . . . . . . . . . . 12 Output voltage start-up . . . . . . . . . . . . . . . . . . 13 Modes of operation . . . . . . . . . . . . . . . . . . . . . 14 High-power mode . . . . . . . . . . . . . . . . . . . . . . 16 Low-power mode . . . . . . . . . . . . . . . . . . . . . . 17 Burst mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Optobias regulation . . . . . . . . . . . . . . . . . . . . 21 Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Undervoltage protection SUPIC/SUPREG . . . 22 Undervoltage protection SUPHS . . . . . . . . . . 23 Undervoltage protection boost . . . . . . . . . . . . 23 Overvoltage protection . . . . . . . . . . . . . . . . . . 23 Capacitive Mode Regulation (CMR) . . . . . . . . 23 Overcurrent protection . . . . . . . . . . . . . . . . . . 24 Overtemperature protection . . . . . . . . . . . . . . 24 Overpower protection . . . . . . . . . . . . . . . . . . . 25 External settings . . . . . . . . . . . . . . . . . . . . . . . 26 Burst period . . . . . . . . . . . . . . . . . . . . . . . . . . 26 General settings . . . . . . . . . . . . . . . . . . . . . . . 26 Low-power mode/burst mode transition levels 27 Power good function . . . . . . . . . . . . . . . . . . . . 28 PFC/LLC communication protocol . . . . . . . . . 29 Start-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Fast latch reset . . . . . . . . . . . . . . . . . . . . . . . . 32 PFC burst mode . . . . . . . . . . . . . . . . . . . . . . . 33 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 35 Thermal characteristics . . . . . . . . . . . . . . . . . 36 10 11 12 13 14 14.1 14.2 14.3 14.4 15 16 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . Application information . . . . . . . . . . . . . . . . . Package outline. . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . Legal information . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information . . . . . . . . . . . . . . . . . . . . Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 41 42 43 44 44 44 44 45 45 46 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP Semiconductors N.V. 2016. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 10 March 2016 Document identifier: TEA19161T
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