TEA1993TS
GreenChip synchronous rectifier controller
Rev. 1.1 — 14 September 2016
1
Product data sheet
General description
The TEA1993TS is a member of a new generation of Synchronous Rectifier (SR)
controller ICs for switched mode power supplies. It includes an adaptive gate drive for
maximum efficiency at any load.
The TEA1993TS is a dedicated controller IC for synchronous rectification on the
secondary side of flyback converters. It incorporates the sensing stage and driver stage
for driving the SR MOSFET, which is rectifying the output of the secondary transformer
winding.
The TEA1993TS can generate its own supply voltage for battery charging applications
with low output voltage or for applications with high-side rectification.
The TEA1993TS is fabricated in a Silicon-On-Insulator (SOI) process.
2
Features and benefits
2.1 Efficiency features
• Adaptive gate drive for maximum efficiency at any load
• Typical supply current in no-load operation below 200 μA
2.2 Application features
•
•
•
•
•
•
•
Operates in a wide output voltage range down to 0 V
Drain sense pin capable of handling input voltages up to 120 V
Self-supplying for operation with low output voltage
Self-supplying for high-side rectification without the use of an auxiliary winding
Operates with standard and logic level SR MOSFETs
Supports USB BC, USB PD, and quick charge applications
TSOP6 package
2.3 Control features
• Adaptive gate drive for fast turn-off at the end of conduction
• UnderVoltage LockOut (UVLO) with active gate pull-down
TEA1993TS
NXP Semiconductors
GreenChip synchronous rectifier controller
3
Applications
The TEA1993TS is intended for flyback power supplies. In such applications, it can drive
the external synchronous rectifier MOSFET, which replaces the diode for the rectification
of the voltage on the secondary winding of the transformer.
It can be used in all power supplies needing high efficiency, like:
• Chargers
• Adapters
• Flyback power supplies with very low and/or variable output voltage
4
Ordering information
Table 1. Ordering information
Type number
TEA1993TS/1
5
Package
Name
Description
Version
TSOP6
plastic surface-mounted package; 6 leads
SOT457
Marking
Table 2. Marking codes
TEA1993TS
Product data sheet
Type number
Marking code
TEA1993TS/1
TEA1993
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GreenChip synchronous rectifier controller
6
Block diagram
CAP
XV
V AND I
REFERENCE
Ich(CAP)
UNDER
VOLTAGE
LOCKOUT
DRIVER
SUPPLY
4 V - 12 V
TEA1993
ENERGY
SAVE
CONTROL
LOGIC
enable
BLANKING
on regulation
off regulation
DRAIN
-37 mV
SOURCE
GATE
SWITCH-OFF
-
-30 mV
-
+300 mV
-
GND
aaa-021170
Figure 1. TEA1993TS block diagram
TEA1993TS
Product data sheet
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GreenChip synchronous rectifier controller
7
Pinning information
7.1 Pinning
CAP
1
GND
2
XV
3
IC
6
DRAIN
5
SOURCE
4
GATE
aaa-021171
Figure 2. TEA1993TS pin configuration (SOT457)
7.2 Pin description
Table 3. Pin description
TEA1993TS
Product data sheet
Symbol
Pin
Description
CAP
1
capacitor input for internal supply voltage
GND
2
ground
XV
3
external supply input
GATE
4
gate driver output for SR MOSFET
SOURCE
5
source sense input of SR MOSFET
DRAIN
6
drain sense input of SR MOSFET
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TEA1993TS
NXP Semiconductors
GreenChip synchronous rectifier controller
8
Functional description
8.1 Introduction
The TEA1993TS is a controller IC for Synchronous Rectification (SR) in flyback
applications. It can drive the external synchronous rectifier MOSFET for the rectification
of the voltage on the secondary winding of the transformer. Figure 3 shows a typical
configuration.
SR low side
VCC
HV
GND
CTRL
PROTECT
8
2
6
3
PRIMARY
CONTROLLER
7
4
5
1
DRIVER
S1
SECONDARY OPTO
CONTROLLER
ISENSE
AUX
VCC
XV
GND
DRAIN
GATE TEA1993
CAP
SOURCE
GND
aaa-021177
Figure 3. TEA1993TS configuration with low-side rectification
8.2 Start-up and UnderVoltage LockOut (UVLO; CAP and XV pins)
The capacitor on the CAP pin supplies the TEA1993TS. It is charged via the DRAIN
pin when the XV voltage is < 4.7 V. The charge current (Ich(CAP)) charges the capacitor
to 4 V. When this voltage is reached, it stops charging. If the external voltage exceeds
4.7 V, the XV pin increases the capacitor voltage via an integrated diode. The increase of
the capacitor voltage gives a higher gate driver voltage (VG(max)).
When the voltage on the CAP pin exceeds Vstart(CAP) (3.7 V typical), the IC leaves the
UVLO state and activates the synchronous rectifier circuitry. When the voltage drops
to below 3.6 V (typical), the UVLO state is reentered and the SR MOSFET gate driver
output is actively kept low.
8.3 Drain sense (DRAIN pin)
The drain sense pin is an input pin capable of handling input voltages up to 120 V. At
a positive drain sense voltage, the gate driver is in off-mode with the gate driver pulled
down (pin GATE). At a negative drain sense voltage, the IC enables the Synchronous
Rectification (SR) by sensing the drain source differential voltage.
TEA1993TS
Product data sheet
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TEA1993TS
NXP Semiconductors
GreenChip synchronous rectifier controller
8.4 Synchronous rectification (DRAIN and SOURCE pins)
The IC senses the voltage difference between the drain sense (DRAIN pin) and the
source sense (SOURCE pin) connections. This drain source differential voltage of the SR
MOSFET is used to drive the gate of the SR MOSFET.
In the regulation phase, the IC regulates the difference between the drain and the source
sense inputs to an absolute level of 37 mV. When the absolute difference exceeds 37 mV
(Vreg(drv)), the gate driver output increases the gate voltage of the external SR MOSFET
until the 37 mV level is reached. The SR MOSFET does not switch off at low current. To
avoid that the device switches off because of ringing, a minimum on-time of 1.5 μs (ttact(sr)
(min)) is integrated.
When the absolute difference is < 30 mV, the gate driver output decreases the gate
voltage of the external SR MOSFET. The voltage waveform on the SR MOSFET gate
follows the waveform of the current through the SR MOSFET. When the current through
the SR MOSFET reaches zero, the SR MOSFET is quickly switched off.
After SR MOSFET switch-off, the drain voltage increases. When the drain voltage
exceeds 300 mV, a low ohmic gate pull-down of 7 Ω keeps the gate of the SR MOSFET
switched off.
8.5 Gate driver (GATE pin)
The gate driver circuit charges the gate of the external SR MOSFET during the rising part
of the current. The driver circuit discharges the gate during the falling part of the current.
The gate driver has a source capability of typically 0.50 A and a sink capability of typically
0.65 A, allowing fast turn-on and fast turn-off of the external SR MOSFET.
The maximum output voltage of the driver is limited to 12 V. This high output voltage
drives all MOSFET brands to the minimum on-state resistance. In applications where the
IC is supplied with 5 V, the maximum output voltage of the driver is 4.2 V and logic level
SR MOSFETs can be used (see Figure 3).
The IC is self-supplying in applications with high-side rectification or in battery charging
applications with an output voltage below 4.7 V. When the XV pin is connected to ground
for driving standard SR MOSFETs, the driver is regulated to 9 V. When the XV pin is
connected to the converter output for driving logic-level SR MOSFETs, the driver is
regulated to 4 V if the output voltage is below 4.7 V.
TEA1993TS
Product data sheet
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GreenChip synchronous rectifier controller
VCAP
VG(MAX)
VCAP
12 V
VG(MAX)
10 V
9V
4V
0
1V
5V
12 V
XV
aaa-021190
Figure 4. Maximum gate voltage VG(max)
During start-up conditions (VCAP < Vstart(CAP)) and UVLO, the driver output voltage is
actively pulled low.
8.6 Source sense (SOURCE pin)
The IC is equipped with an additional source sense pin (SOURCE). This pin is used
for measuring the drain-to-source voltage of the external SR MOSFET. The source
sense input must be connected as close as possible to the SOURCE pin of the external
SR MOSFET. It minimizes errors, caused by voltage differences on PCB tracks due to
parasitic inductance in combination with large dI/dt values.
TEA1993TS
Product data sheet
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GreenChip synchronous rectifier controller
9
Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are measured
with respect to ground (pin 2); positive currents flow into the chip. Voltage ratings are valid provided
other ratings are not violated; current ratings are valid provided the other ratings are not violated.
Symbol
Parameter
Conditions
Min
Max
Unit
Voltages
VXV
voltage on pin XV
−0.4
+38
V
Vsense(DRAIN)
sense voltage on pin DRAIN
−0.8
+120
V
Vsense(SOURCE)
sense voltage on pin
SOURCE
−0.4
+0.4
V
Currents
IXV
current on pin XV
peak current
-
0.5
A
Ptot
total power dissipation
Tamb = 90 °C
-
300
mW
Tstg
storage temperature
−55
+150
°C
Tj
junction temperature
−40
+150
°C
-
2000
V
-
500
V
General
ElectroStatic Discharge (ESD)
VESD
electrostatic discharge
voltage
class 2
human body
model
charged device
model
[1]
[1]
Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor.
10 Thermal characteristics
Table 5. Thermal characteristics
TEA1993TS
Product data sheet
Symbol
Parameter
Rth(j-a)
Rth(j-c)
Conditions
Typ
Unit
thermal resistance from junction to JEDEC test board
ambient
200
K/W
thermal resistance from junction to JEDEC test board
case
115
K/W
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GreenChip synchronous rectifier controller
11 Characteristics
Table 6. Characteristics
−25 °C < Tj < +125 °C; Vxv = 12 V; CCAP = 1 μF; CGATE = 10 nF (capacitor between the GATE and the GND pins); all
voltages are measured with respect to ground (pin 2); currents are positive when flowing into the IC; unless otherwise
specified. Limits are production tested at 25 °C. Statistical characterization in the temperature operating range ensure these
limits.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Supply voltage management (XV and CAP pins)
Vstart(CAP)
start voltage on pin CAP
VXV = 0 V
3.55
3.70
3.90
V
Vstop(CAP)
stop voltage on pin CAP
VXV = 0 V
3.45
3.60
3.80
V
Ich(CAP)
charge current on pin CAP
VXV = 0 V; VCAP = 7 V;
VDRAIN = 12 V;
Tj = 25 °C
−95
−70
−50
mA
VXV = 2 V;
VCAP = 3.65 V;
VDRAIN = 12 V;
Tj = 25 °C
−95
−70
−50
mA
VXV = 0 V; VDRAIN = 12 V
8.70
9.20
9.60
V
VXV = 2 V; VDRAIN = 12 V
3.80
4.00
4.15
V
VXV = 5 V
4.15
4.30
4.75
V
VXV = 12 V
11.0
11.3
11.7
V
power save operation;
VXV = 5 V
90
160
250
μA
normal operation;
without gate charge;
VXV = 5 V; Tj = 25 °C
1.35
1.60
1.85
mA
VI(CAP)
II(XV)
input voltage on pin CAP
input current on pin XV
Synchronous rectification sense input (DRAIN and SOURCE pins)
Vreg(drv)
driver regulation voltage
VSOURCE = 0 V;
Tj = 25 °C
−40
−37
−35
mV
Vswoff
switch-off voltage
VSOURCE = 0 V;
Tj = 25 °C
200
300
400
mV
td(act)(drv)
driver activation delay time
VSOURCE = 0 V;
normal operation;
time for step on VDRAIN
(2 V to −0.5 V) to
rising of VGATE at 10 %
of end value
-
65
-
ns
VSOURCE = 0 V;
normal operation;
time for step on VDRAIN
(−0.5 V to 2 V)
to falling of VGATE
at 10 % begin value
-
40
-
ns
1.20
1.50
1.80
μs
td(deact)(drv) driver deactivation delay time
tact(sr)(min)
minimum synchronous rectification VXV = VCAP = 5 V;
active time
Tj = 25 °C
Gate driver (GATE pin)
TEA1993TS
Product data sheet
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GreenChip synchronous rectifier controller
Symbol
Parameter
Conditions
Isource
source current
peak curent
Isink
sink current
Min
Typ
Max
Unit
VXV = 5 V;
Vds = −0.5 V;
Vg = 0 V
-
−0.13
-
A
VXV = 12 V;
Vds = −0.5 V;
Vg = 0 V
-
−0.50
-
A
VXV = 5 V; Vds = 0 V;
Vg = 4 V
-
150
-
mA
VXV = 12 V;
Vds = 0 V; Vg = 10 V
-
210
-
mA
VXV = 5 V; Vds = 4 V;
Vg = 4 V
-
0.35
-
A
VXV = 12 V;
Vds = 4 V; Vg = 4 V
-
0.65
-
A
regulation current
peak current
Rpd(G)
gate pull-down resistance
VDRAIN = 4 V;
IGATE = 30 mA;
VXV = 12 V; Tj = 25 °C
6.00
6.80
7.60
Ω
VG(max)
maximum gate voltage
VXV = 0 V
7.80
8.90
9.60
V
VXV = 2 V
3.75
3.95
4.15
V
VXV = 5 V
4.00
4.20
4.40
V
VXV = VCAP = 5 V
4.90
4.95
5.00
V
VXV = 12 V
9.40
9.80
10.70
V
VXV = 18 V to 38 V
11.80
12.30
12.70
V
TEA1993TS
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GreenChip synchronous rectifier controller
11.1 Temperature curves
11.1.1 Charge current (CAP pin)
Ich(CAP)
(mA)
aaa-022432
0
-20
-40
(1)
-60
-80
(2)
-100
-50
-25
0
25
50
75
100
125
T (°C)
150
(1) Ich(CAP) at VCAP = 7 V; VXV = 0 V
(2) Ich(CAP) at VCAP = 3.65 V; VXV = 2 V
Figure 5. Ich(CAP) as a function of temperature
11.1.2 Operating current (XV pin)
aaa-022437
2000
II(XV)
(µA)
(2)
1600
1200
800
400
(1)
0
-50
-25
0
25
50
75
100
125
T (°C)
150
(1) II(XV)) - power save operation
(2) II(XV) - normal operation
Figure 6. II(XV) as a function of temperature
TEA1993TS
Product data sheet
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GreenChip synchronous rectifier controller
11.1.3 Driver regulation voltage
-50
0
-25
0
25
50
75
100
T (°C)
125
150
Vreg(drv)
(mV)
-10
-20
-30
-40
-50
aaa-022449
Figure 7. Vreg(drv) as a function of temperature
11.1.4 Gate pull-down resistance
aaa-022462
10
Rpd(G)
(Ω)
8
6
4
2
0
-50
-25
0
25
50
75
100
125
T (°C)
150
Figure 8. Rpd(G) as a function of temperature
TEA1993TS
Product data sheet
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GreenChip synchronous rectifier controller
11.1.5 Switch-off voltage
aaa-022464
400
Vswoff
(mV)
300
200
100
0
-50
-25
0
25
50
75
100
125
T (°C)
150
Figure 9. Vswoff as a function of temperature
11.1.6 Minimum synchronous rectification active time
aaa-022465
2.5
tact(sr)(min)
(µs)
2
1.5
1
0.5
0
-50
-25
0
25
50
75
100
125
T (°C)
150
Figure 10. tact(sr)min as a function of temperature
TEA1993TS
Product data sheet
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GreenChip synchronous rectifier controller
12 Application information
A flyback switched mode power supply with the TEA1993TS consists of a primary
side controller with a primary switch, a transformer, and an output stage. To obtain
low conduction loss rectification, an SR MOSFET is used in the output stage. The SR
MOSFET can be placed low-side (see Figure 3) or can be placed high-side
(see Figure 11). In the high-side application, the TEA1993TS is self-supplying. The
capacitor on the CAP pin supplies the TEA1993TS. When the drain voltage is positive, it
is charged via the DRAIN pin.
The gate drive voltage for the synchronous rectifier switch is derived from the voltage
difference between the corresponding drain sense and source sense pins.
Special attention must be paid to the connection of the drain sense and source sense
pins. The voltages measured on these pins are used for the gate drive voltage. Wrong
measurement results in a less efficient gate drive because a gate voltage that is either
too low or too high. The connections to these pins must not interfere with the power
wiring.
The power wiring conducts currents with high dI/dt values. It can easily cause
measurement errors resulting from induced voltages due to parasitic inductances. The
separate source sense pins make it possible to sense the source voltage of the external
MOSFETs directly. So, the current carrying power ground tracks are not required.
SR high side
XV
DRAIN
GATE TEA1993
CAP
SOURCE
GND
XV
SECONDARY OPTO
CONTROLLER
HV
GND
CTRL
PROTECT
8
2
6
7
3
PRIMARY
CONTROLLER
4
5
1
DRIVER
S1
GND
ISENSE
AUX
VCC
aaa-021216
Figure 11. TEA1993TS configuration with high-side rectification
TEA1993TS
Product data sheet
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TEA1993TS
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GreenChip synchronous rectifier controller
13 Package outline
Table 7.
Plastic surface-mounted package (TSOP6); 6 leads
D
SOT457
B
E
y
A
HE
6
5
X
v M A
4
Q
pin 1
index
A
A1
1
2
c
3
Lp
e
bp
w M B
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
bp
c
D
E
e
HE
Lp
Q
v
w
y
mm
1.1
0.9
0.1
0.013
0.40
0.25
0.26
0.10
3.1
2.7
1.7
1.3
0.95
3.0
2.5
0.6
0.2
0.33
0.23
0.2
0.2
0.1
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
SOT457
JEITA
SC-74
EUROPEAN
PROJECTION
ISSUE DATE
05-11-07
06-03-16
Figure 12. Package outline SOT457 (TSOP6)
TEA1993TS
Product data sheet
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GreenChip synchronous rectifier controller
14 Revision history
Table 8. Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
TEA1993TS v.1.1
20160914
Product data sheet
-
TEA1993TS v.1.0
Modifications
• Section 4 has been updated.
• Section 5 has been added.
TEA1993TS v.1.0
20160531
-
-
TEA1993TS
Product data sheet
Product data sheet
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TEA1993TS
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GreenChip synchronous rectifier controller
15 Legal information
15.1 Data sheet status
Document status
[1][2]
[3]
Product status
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple
devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences
of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is
intended for quick reference only and should not be relied upon to contain
detailed and full information. For detailed and full information see the
relevant full data sheet, which is available on request via the local NXP
Semiconductors sales office. In case of any inconsistency or conflict with the
short data sheet, the full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product
is deemed to offer functions and qualities beyond those described in the
Product data sheet.
15.3 Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not
give any representations or warranties, expressed or implied, as to the
accuracy or completeness of such information and shall have no liability
for the consequences of use of such information. NXP Semiconductors
takes no responsibility for the content in this document if provided by an
information source outside of NXP Semiconductors. In no event shall NXP
Semiconductors be liable for any indirect, incidental, punitive, special or
consequential damages (including - without limitation - lost profits, lost
savings, business interruption, costs related to the removal or replacement
of any products or rework charges) whether or not such damages are based
on tort (including negligence), warranty, breach of contract or any other
legal theory. Notwithstanding any damages that customer might incur for
any reason whatsoever, NXP Semiconductors’ aggregate and cumulative
liability towards customer for the products described herein shall be limited
in accordance with the Terms and conditions of commercial sale of NXP
Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
TEA1993TS
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes
no representation or warranty that such applications will be suitable
for the specified use without further testing or modification. Customers
are responsible for the design and operation of their applications and
products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications
and products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with
their applications and products. NXP Semiconductors does not accept any
liability related to any default, damage, costs or problem which is based
on any weakness or default in the customer’s applications or products, or
the application or use by customer’s third party customer(s). Customer is
responsible for doing all necessary testing for the customer’s applications
and products using NXP Semiconductors products in order to avoid a
default of the applications and the products or of the application or use by
customer’s third party customer(s). NXP does not accept any liability in this
respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or
the grant, conveyance or implication of any license under any copyrights,
patents or other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 1.1 — 14 September 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
17 / 20
TEA1993TS
NXP Semiconductors
GreenChip synchronous rectifier controller
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor
tested in accordance with automotive testing or application requirements.
NXP Semiconductors accepts no liability for inclusion and/or use of nonautomotive qualified products in automotive equipment or applications. In
the event that customer uses the product for design-in and use in automotive
applications to automotive specifications and standards, customer (a) shall
use the product without NXP Semiconductors’ warranty of the product for
such automotive applications, use and specifications, and (b) whenever
TEA1993TS
Product data sheet
customer uses the product for automotive applications beyond NXP
Semiconductors’ specifications such use shall be solely at customer’s own
risk, and (c) customer fully indemnifies NXP Semiconductors for any liability,
damages or failed product claims resulting from customer design and use
of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
15.4 Trademarks
Notice: All referenced brands, product names, service names and
trademarks are the property of their respective owners.
GreenChip — is a trademark of NXP Semiconductors N.V.
All information provided in this document is subject to legal disclaimers.
Rev. 1.1 — 14 September 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
18 / 20
TEA1993TS
NXP Semiconductors
GreenChip synchronous rectifier controller
Tables
Tab. 1.
Tab. 2.
Tab. 3.
Tab. 4.
Ordering information ..........................................2
Marking codes ...................................................2
Pin description ...................................................4
Limiting values .................................................. 8
Tab. 5.
Tab. 6.
Tab. 7.
Tab. 8.
Thermal characteristics ..................................... 8
Characteristics ...................................................9
.......................................................................... 15
Revision history ...............................................16
Fig. 7.
Fig. 8.
Fig. 9.
Fig. 10.
Fig. 11.
Vreg(drv) as a function of temperature ............12
Rpd(G) as a function of temperature ...............12
Vswoff as a function of temperature ................13
tact(sr)min as a function of temperature ..........13
TEA1993TS configuration with high-side
rectification ...................................................... 14
Package outline SOT457 (TSOP6) ................. 15
Figures
Fig. 1.
Fig. 2.
Fig. 3.
Fig. 4.
Fig. 5.
Fig. 6.
TEA1993TS block diagram ............................... 3
TEA1993TS pin configuration (SOT457) ...........4
TEA1993TS configuration with low-side
rectification ........................................................ 5
Maximum gate voltage VG(max) .......................7
Ich(CAP) as a function of temperature ............ 11
II(XV) as a function of temperature ................. 11
TEA1993TS
Product data sheet
Fig. 12.
All information provided in this document is subject to legal disclaimers.
Rev. 1.1 — 14 September 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
19 / 20
TEA1993TS
NXP Semiconductors
GreenChip synchronous rectifier controller
Contents
1
2
2.1
2.2
2.3
3
4
5
6
7
7.1
7.2
8
8.1
8.2
8.3
8.4
8.5
8.6
9
10
11
11.1
11.1.1
11.1.2
11.1.3
11.1.4
11.1.5
11.1.6
12
13
14
15
General description ............................................ 1
Features and benefits .........................................1
Efficiency features ............................................. 1
Application features ........................................... 1
Control features ................................................. 1
Applications .........................................................2
Ordering information .......................................... 2
Marking .................................................................2
Block diagram ..................................................... 3
Pinning information ............................................ 4
Pinning ............................................................... 4
Pin description ................................................... 4
Functional description ........................................5
Introduction ........................................................ 5
Start-up and UnderVoltage LockOut (UVLO;
CAP and XV pins) ............................................. 5
Drain sense (DRAIN pin) ...................................5
Synchronous rectification (DRAIN and
SOURCE pins) .................................................. 6
Gate driver (GATE pin) ......................................6
Source sense (SOURCE pin) ............................ 7
Limiting values .................................................... 8
Thermal characteristics ......................................8
Characteristics .................................................... 9
Temperature curves .........................................11
Charge current (CAP pin) ................................11
Operating current (XV pin) .............................. 11
Driver regulation voltage ..................................12
Gate pull-down resistance ............................... 12
Switch-off voltage ............................................ 13
Minimum synchronous rectification active
time .................................................................. 13
Application information .................................... 14
Package outline .................................................15
Revision history ................................................ 16
Legal information .............................................. 17
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section 'Legal information'.
© NXP Semiconductors N.V. 2016.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 14 September 2016
Document identifier: TEA1993TS