TFF1013HN/N1,135

TFF1013HN Integrated mixer oscillator PLL for satellite LNB Rev. 1 — 11 September 2013 Product data sheet 1. General description The TFF1013HN is an integrated downconverter for use in Low Noise Block (LNB) convertors in a 10.7 GHz to 12.75 GHz Ku band satellite receiver system. 2. Features and benefits  Low current consumption integrated pre-amplifier, mixer, buffer amplifier and PLL synthesizer  Flat gain over frequency  Single 5 V supply pin  Low cost 25 MHz crystal  Crystal controlled LO frequency generation  Switched LO frequency (9.75 GHz and 10.6 GHz)  Low phase noise  Low spurious  Low external component count  Alignment-free concept  ESD protection on all pins 3. Applications  Ku band LNB converters for digital satellite reception (DVB-S / DVB-S2) 4. Quick reference data Table 1. Quick reference data VCC = 5 V; Tamb = 25 C; fLO = 9.75 GHz or 10.6 GHz; fxtal = 25 MHz; Z0 = 50  unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VCC supply voltage RF input and IF output AC coupled [1] 4.5 5 5.5 V ICC supply current RF input and IF output AC coupled [1] - 52 - mA NFSSB single sideband noise figure - 9 - dB fi(RF) RF input frequency GHz Gconv conversion gain low band 10.7 - 11.7 high band 11.7 - 12.75 GHz measured at low band fIF = 1450 MHz and high band fIF = 1625 MHz - - 33 dB TFF1013HN NXP Semiconductors Integrated mixer oscillator PLL for satellite LNB Table 1. Quick reference data …continued VCC = 5 V; Tamb = 25 C; fLO = 9.75 GHz or 10.6 GHz; fxtal = 25 MHz; Z0 = 50  unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit s11 input reflection coefficient fi(RF) = 10.7 GHz to 12.7 GHz - 10 - dB s22 output reflection coefficient fo(IF) = 950 MHz to 2150 MHz; Z0 = 75  - 10 - dB - 17 dBm IP3o [1] [2] output third-order intercept point worst case value of the two measurements is specified [2] - DC values. measurement 1: f1 = 1733 MHz; f2 = 1773 MHz; Pi = 46 dBm per carrier; IP3o measured at 1813 MHz measurement 2: f1 = 1893 MHz; f2 = 1853 MHz; Pi = 46 dBm per carrier; IP3o measured at 1813 MHz 5. Ordering information Table 2. Ordering information Type number TFF1013HN TFF1013HN Product data sheet Package Name Description Version DHVQFN16 plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;16 terminals; body 2.5  3.5  0.85 mm SOT763-1 All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2013 © NXP B.V. 2013. All rights reserved. 2 of 13 TFF1013HN NXP Semiconductors Integrated mixer oscillator PLL for satellite LNB 6. Block diagram RF_GND1 n.c. RF RF_GND2 RF_GND3 VCC GND1 n.c. VREG LF XO1 XO2 2 3 14 IF 4 15 IF_GND 13 5 GND2 1 16 internal supplies and bias ON-CHIP REGULATOR 6 7 9 8 12 11 PFD CHARGE PUMP DIVIDER 10 aaa-000007 HB Fig 1. TFF1013HN block diagram 7. Functional diagram VCC RF XO1 I PLL XO2 9.75 GHz/10.6 GHz HB Fig 2. TFF1013HN Product data sheet aaa-00000 Functional diagram All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2013 © NXP B.V. 2013. All rights reserved. 3 of 13 TFF1013HN NXP Semiconductors Integrated mixer oscillator PLL for satellite LNB 8. Pinning information 1 terminal 1 index area 16 VCC RF_GND3 8.1 Pinning RF_GND1 2 15 IF_GND n.c. 3 14 IF 6 11 XO2 n.c. 7 10 HB 9 12 XO1 GND1 VREG 13 GND2 5 8 4 LF RF RF_GND2 aaa-000009 Transparent top view Fig 3. Pin configuration 8.2 Pin description Table 3. Pin description Symbol Pin Description GND 0 ground (exposed die pad) RF_GND3 1 RF ground. Connect this pin to the exposed die pad landing. RF_GND1 2 RF ground. Connect this pin to the exposed die pad landing and the RF input CPW line. n.c. 3 not connected. Connect to RF on PCB. [1] RF 4 RF input. RF_GND2 5 RF ground. Connect this pin to the exposed die pad landing and the RF input CPW line. GND1 6 Ground. Connect this pin to the exposed die pad landing and the RF input CPW line. n.c. 7 not connected. Use this pin to route the ground layer on top of the PCB to the exposed die pad. LF 8 Loop filter PLL. Connect loop filter between this pin and VREG (pin 9). VREG 9 Regulated output voltage for PLL loop filter. Connect loop filter to this pin. Decouple against die pad via pin 7. HB 10 High band / low band selection. Connect this pin to the tone detector or to a logic signal. XO2 11 Crystal connection 2. Connect crystal between this pin and XO1 (pin 12). XO1 12 Crystal connection 1. Connect crystal between this pin and XO2 (pin 11). GND2 13 Ground. Connect this pin to the exposed die pad landing. IF 14 IF output IF_GND 15 IF output ground. Connect this pin to the exposed die pad landing and the output transmission line ground. VCC 16 Supply voltage [1] The distance between the outer edges of pin 2 and 3 is 740 m. This gives an optimum transition from a 1.1 mm wide, Z0 = 50  line on RO4223 Printed-Circuit Board (PCB) material of 0.5 mm height to the TFF1013HN. TFF1013HN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2013 © NXP B.V. 2013. All rights reserved. 4 of 13 TFF1013HN NXP Semiconductors Integrated mixer oscillator PLL for satellite LNB 9. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VCC Conditions Min Max Unit supply voltage 0.5 +6 V VI(HB) input voltage on pin HB 0.5 +6 V Tstg storage temperature 40 +125 C 10. Recommended operating conditions Table 5. Operating conditions Symbol Parameter VCC Conditions Min Typ Max Unit supply voltage 4.5 5 5.5 V VI(HB) input voltage on pin HB 0 - 5.5 V Tamb ambient temperature 40 +25 +85 C Z0 characteristic impedance - 50 -  fi(RF) RF input frequency low band 10.7 - 11.7 GHz high band 11.7 - 12.75 GHz - 9.75 - GHz - 10.6 - GHz low band 0.95 - 1.95 GHz high band 1.1 - 2.15 GHz LO frequency fLO low band high band fo(IF) IF output frequency [1] CL(xtal) crystal load capacitance - 10 - pF ESR equivalent series resistance - - 40  fxtal crystal frequency - 25 - MHz [1] For a 10.678 GHz LO frequency, select high band and use a crystal with frequency 10.678 GHz / 424 = 25.183962 MHz. 11. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Rth(j-c) thermal resistance from junction to case TFF1013HN Product data sheet Conditions All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2013 Typ Unit 35 K/W © NXP B.V. 2013. All rights reserved. 5 of 13 TFF1013HN NXP Semiconductors Integrated mixer oscillator PLL for satellite LNB 12. Characteristics Table 7. Characteristics VCC = 5 V; Tamb = 25 C; fLO = 9.75 GHz or 10.6 GHz; fxtal = 25 MHz; Z0 = 50  unless otherwise specified. Symbol Parameter Conditions ICC supply current RF input and IF output AC coupled n(itg) integrated phase noise density NFSSB Min Typ Max Unit [1] - 52 - mA integration offset frequency = 10 kHz to 13 MHz; loop bandwidth = crossover bandwidth - 1.5 - RMS single sideband noise figure measured at low band fIF = 1450 MHz and high band fIF = 1625 MHz - 9 - dB Gconv conversion gain measured at low band fIF = 1450 MHz and high band fIF = 1625 MHz - 33 - dB Gconv conversion gain variation over whole IF band - 2.0 - dB in every 36 MHz band - 0.5 - dB s11 input reflection coefficient fi(RF) = 10.7 GHz to 12.7 GHz - 10 - dB s22 output reflection coefficient fo(IF) = 950 MHz to 2150 MHz; Z0 = 75  - 10 - dB - 17 - dBm IP3o output third-order intercept point PL(1dB) output power at 1 dB gain compression - 6 - dBm VIL(HB) LOW-level input voltage on pin HB - - 0.8 V VIH(HB) HIGH-level input voltage on pin HB 2.0 - - V Rpd(HB) pull-down resistance on pin HB 80 110 140 [1] [2] worst case value of the two measurements is specified [2] k DC values measurement 1: f1 = 1733 MHz; f2 = 1773 MHz; Pi = 46 dBm per carrier; IP3o measured at 1813 MHz measurement 2: f1 = 1893 MHz; f2 = 1853 MHz; Pi = 46 dBm per carrier; IP3o measured at 1813 MHz TFF1013HN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2013 © NXP B.V. 2013. All rights reserved. 6 of 13 TFF1013HN NXP Semiconductors Integrated mixer oscillator PLL for satellite LNB 13. Application information 9 S+(07ELDV 97GHWHFWRU '9 '+ *9 ' * *+ /% '+ 5)B*1' QF + 5) 5)B*1' 9 *1' * ' QF 9&&               ,)B*1' ,) ,) S) *1' ;2 ;2 0+] FU\VWDO +%  95(* /)  *9 9a9 +% 5)B*1' *+ 9/,1($5 5(*8/$725 '9 S) Q) DDD Fig 4. Application diagram of TFF1013HN Table 8. List of netnames See Figure 4. TFF1013HN Product data sheet Netname Description GH Gate voltage of 1st stage LNA. Horizontal polarization DH Drain voltage of 1st stage LNA. Horizontal polarization GV Gate voltage of 1st stage LNA. Vertical polarization DV Drain voltage of 1st stage LNA. Vertical polarization G2 Gate voltage of 2nd stage LNA D2 Drain voltage of 2nd stage LNA HB High band oscillator supply control LB Low band oscillator supply control All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2013 © NXP B.V. 2013. All rights reserved. 7 of 13 TFF1013HN NXP Semiconductors Integrated mixer oscillator PLL for satellite LNB SUPPLY AND BAND/POLARIZATION SWITCHING horizontal polarization 5V REGULATOR VCC HB 1st STAGE LNA image reject filter vertical polarization RF gain mixer lF gain 2nd STAGE LNA 1st STAGE LNA PLL 9.75 GHz/10.6 GHz aaa-000011 Fig 5. TFF1013HN Product data sheet LNB system block diagram with TFF1013HN All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2013 © NXP B.V. 2013. All rights reserved. 8 of 13 TFF1013HN NXP Semiconductors Integrated mixer oscillator PLL for satellite LNB 14. Package outline DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT763-1 16 terminals; body 2.5 x 3.5 x 0.85 mm A B D A A1 E c detail X terminal 1 index area terminal 1 index area C e1 e 2 7 y y1 C v M C A B w M C b L 1 8 Eh e 16 9 15 10 Dh X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max. A1 b c D (1) Dh E (1) Eh e e1 L v w y y1 mm 1 0.05 0.00 0.30 0.18 0.2 3.6 3.4 2.15 1.85 2.6 2.4 1.15 0.85 0.5 2.5 0.5 0.3 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. Fig 6. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT763-1 --- MO-241 --- EUROPEAN PROJECTION ISSUE DATE 02-10-17 03-01-27 Package outline SOT763-1 TFF1013HN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2013 © NXP B.V. 2013. All rights reserved. 9 of 13 TFF1013HN NXP Semiconductors Integrated mixer oscillator PLL for satellite LNB 15. Abbreviations Table 9. Abbreviations Acronym Description CPW CoPlanar Waveguide DVB-S Digital Video Broadcasting by Satellite DVB-S2 Digital Video Broadcasting - Satellite - Second generation IF Intermediate Frequency Ku band K-under band LO Local Oscillator PFD Phase Frequency Detector pHEMT Pseudomorphic High Electron Mobility Transistor PLL Phase-Locked Loop VCO Voltage-Controlled Oscillator V/T Voltage / Tone XO Crystal Oscillator 16. Revision history Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes TFF1013HN v.1 20130911 Product data sheet - - TFF1013HN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2013 © NXP B.V. 2013. All rights reserved. 10 of 13 TFF1013HN NXP Semiconductors Integrated mixer oscillator PLL for satellite LNB 17. Legal information 17.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 17.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 17.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. TFF1013HN Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2013 © NXP B.V. 2013. All rights reserved. 11 of 13 TFF1013HN NXP Semiconductors Integrated mixer oscillator PLL for satellite LNB Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 17.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 18. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com TFF1013HN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 11 September 2013 © NXP B.V. 2013. All rights reserved. 12 of 13 TFF1013HN NXP Semiconductors Integrated mixer oscillator PLL for satellite LNB 19. Contents 1 2 3 4 5 6 7 8 8.1 8.2 9 10 11 12 13 14 15 16 17 17.1 17.2 17.3 17.4 18 19 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 Recommended operating conditions. . . . . . . . 5 Thermal characteristics . . . . . . . . . . . . . . . . . . 5 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Application information. . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Contact information. . . . . . . . . . . . . . . . . . . . . 12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2013. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 11 September 2013 Document identifier: TFF1013HN