TJA1028
LIN transceiver with integrated voltage regulator
Rev. 4 — 25 July 2012
Product data sheet
1. General description
The TJA1028 is a LIN 2.0/2.1/SAE J2602 transceiver with an integrated low-drop voltage
regulator. The voltage regulator can deliver up to 70 mA and is available in 3.3 V and
5.0 V variants. TJA1028 facilitates the development of compact nodes in Local
Interconnect Network (LIN) bus systems. To support robust designs, the TJA1028 offers
strong ElectroStatic Discharge (ESD) performance and can withstand high voltages on the
LIN bus. In order to minimize current consumption, the TJA1028 supports a Sleep mode
in which the LIN transceiver and the voltage regulator are powered down while still having
wake-up capability via the LIN bus.
The TJA1028 comes in an SO8 package, and also in a 3 mm 3 mm HVSON8 package
that reduces the required board space by over 70 %. This feature can prove extremely
valuable when board space is limited.
2. Features and benefits
LIN 2.0/2.1/2.2 compliant
SAE J2602 compliant
Downward compatible with LIN 1.3
Internal LIN slave termination resistor
Voltage regulator offering 5 V or 3.3 V, 70 mA capability
2 % voltage regulator accuracy over specified temperature and supply ranges
Voltage regulator output undervoltage detection with reset output
Voltage regulator is short-circuit proof to ground
Voltage regulator stable with ceramic, tantalum and aluminum electrolyte capacitors
Robust ESD performance; 8 kV according to IEC61000-4-2 for pins LIN and VBAT
Pins LIN and VBAT protected against transients in the automotive environment
(ISO 7637)
Very low LIN bus leakage current of < 2 A when battery not connected
LIN pin short-circuit proof to battery and ground
Transmit data (TXD) dominant time-out function
Thermally protected
Very low ElectroMagnetic Emission (EME)
High ElectroMagnetic Immunity (EMI)
Typical Standby mode current of 45 A
Typical Sleep mode current of 12 A
LIN bus wake-up function
K-line compatible
Available in SO8 and HVSON8 packages
TJA1028
NXP Semiconductors
LIN transceiver with integrated voltage regulator
Leadless HVSON8 package (3.0 mm 3.0 mm) with improved Automated Optical
Inspection (AOI) capability
Dark green product (halogen free and Restriction of Hazardous Substances (RoHS)
compliant)
3. Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
Version
TJA1028T/xxx/xx[1][2]
SO8
plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
TJA1028TK/xxx/xx[1][2]
HVSON8
plastic thermal enhanced very thin small outline package; no leads;
8 terminals; body 3 3 0.85 mm
SOT782-1
[1]
TJA1028T/5V0/xx and TJA1028TK/5V0/xx for the versions with the 5 V regulator; TJA1028T/3V3/xx and TJA1028TK/3V3/xx for the
versions with the 3.3 V regulator.
[2]
TJA1028T/xxx/20 and TJA1028TK/xxx/20 for the normal slope versions that support baud rates up to 20 kBd; TJA1028T/xxx/10 and
TJA1028TK/xxx/10 for the low slope versions that support baud rates up to 10.4 kBd (SAE J2602).
4. Marking
Table 2.
TJA1028
Product data sheet
Marking codes
Type number
Marking
TJA1028T/5V0/10
1028/51
TJA1028T/5V0/20
1028/52
TJA1028T/3V3/10
1028/31
TJA1028T/3V3/20
1028/32
TJA1028TK/5V0/10
28/51
TJA1028TK/5V0/20
28/52
TJA1028TK/3V3/10
28/31
TJA1028TK/3V3/20
28/32
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Rev. 4 — 25 July 2012
© NXP B.V. 2012. All rights reserved.
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TJA1028
NXP Semiconductors
LIN transceiver with integrated voltage regulator
5. Block diagram
VBAT
VBAT
UV
DET
VOLTAGE
REFERENCE
VCC
VCC
UV
DET
VREG
OVERTEMP
DETECTION
EN
VCC
CONTROL
RSTN
VBAT
Rx
LIN
Tx
LIN
GND
TJA1028
Product data sheet
TXD
TIMEOUT
TIMER
VCC
TXD
TJA1028
Fig 1.
RXD
015aaa085
Block diagram
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© NXP B.V. 2012. All rights reserved.
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TJA1028
NXP Semiconductors
LIN transceiver with integrated voltage regulator
6. Pinning information
6.1 Pinning
terminal 1
index area
VBAT
1
8
VCC
EN
2
7
RSTN
GND
3
6
TXD
LIN
4
5
RXD
VBAT
1
EN
2
VCC
7
RSTN
TJA1028TK
TJA1028T
GND
3
6
TXD
LIN
4
5
RXD
015aaa244
Transparent top view
015aaa082
a. TJA1028T/xxx/xx: SO8
Fig 2.
8
b. TJA1028TK/xxx/xx: HVSON8
Pin configuration diagrams
6.2 Pin description
Table 3.
Pin description
Symbol
Pin
Description
VBAT
1
battery supply for the TJA1028
EN
2
enable input
GND
3[1]
ground
LIN
4
LIN bus line
RXD
5
LIN receive data output
TXD
6
LIN transmit data input
RSTN
7
reset output (active LOW)
VCC
8
voltage regulator output
[1]
For enhanced thermal and electrical performance, the exposed center pad of the HVSON8 package should
be soldered to board ground (and not to any other voltage level).
7. Functional description
The TJA1028 combines the functionality of a LIN transceiver and a voltage regulator in a
single chip and offers wake-up by bus activity. The voltage regulator is designed to power
the Electronic Control Unit’s (ECU) microcontroller and its peripherals.
The LIN transceiver is the interface between a LIN master/slave protocol controller and
the physical bus in a LIN network. According to the Open System Interconnect (OSI)
model, these modules make up the LIN physical layer.
TJA1028
Product data sheet
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© NXP B.V. 2012. All rights reserved.
4 of 24
TJA1028
NXP Semiconductors
LIN transceiver with integrated voltage regulator
The TJA1028T/xxx/20 and TJA1028TK/xxx/20 versions are optimized for a transmission
speed of 20 kBd, the maximum specified in the LIN standard. The TJA1028T/xxx/10 and
TJA1028TK/xxx/10 versions are optimized for a transmission speed of 10.4 kBd, as
specified in SAE J2602. All versions achieve optimum ElectroMagnetic Compatibility
(EMC) performance by wave shaping the LIN output.
7.1 LIN 2.x/SAE J2602 compliant
The TJA1028 is fully LIN 2.0, LIN 2.1, LIN 2.2 and SAE J2602 compliant. Since the LIN
physical layer is independent of higher OSI model layers (e.g. the LIN protocol), nodes
containing a LIN 2.2-compliant physical layer can be combined, without restriction, with
LIN physical layer nodes that comply with earlier revisions (i.e. LIN 1.0, LIN 1.1, LIN 1.2,
LIN 1.3, LIN 2.0 and LIN 2.1).
7.2 Operating modes
The TJA1028 supports four operating modes: Normal, Standby, Sleep and Off. The
operating modes, and the transitions between modes, are illustrated in Figure 3.
AII states
VBAT < Vth(det)poff OR
Tvj > Tth(act)otp
remote
wake-up
OFF
LIN = off
RXD = floating
RSTN = LOW
VBAT > Vth(det)pon AND
Tvj < Tth(rel)otp
EN = 1 AND
RSTN = 1
STANDBY
LIN = off
(RXD signals
wake source)
EN = 1 0 AND
TXD = 1 AND
RSTN = 1
NORMAL(1)
LIN = on
EN = 1
0 AND(3)
EN = 1 TXD = 0 AND
RSTN = 1
wake-up(3)
event
SLEEP
LIN = off
RXD = VCC(2)
RSTN = LOW
Voltage regulator - on
Voltage regulator - off
015aaa086
(1) In Normal mode, the LIN transmitter is enabled - but if EN and/or RSTN go LOW, the LIN
transmitter will be disabled. Remote wake-up signalling will be activated.
(2) Until VCC drops below 2 V.
(3) If a wake-up event and a go-to-sleep event occur simultaneously, the device will switch directly to
Standby mode without initiating a reset.
Fig 3.
TJA1028
Product data sheet
State diagram
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TJA1028
NXP Semiconductors
LIN transceiver with integrated voltage regulator
7.2.1 Off mode
The TJA1028 switches to Off mode from all other modes if the battery supply voltage
drops below the power-off detection threshold (Vth(det)poff) or the junction temperature
exceeds the overtemperature protection activation threshold (Tth(act)otp).
The voltage regulator and the LIN physical layer are disabled in Off mode, and pin RSTN
is forced LOW.
7.2.2 Standby mode
Standby mode is a low-power mode that guarantees very low current consumption.
The TJA1028 switches from Off mode to Standby mode as soon as the battery supply
voltage rises above the power-on detection threshold (VBAT > Vth(det)pon), provided the
junction temperature is below the overtemperature protection release threshold
(Tvj < Tth(rel)otp).
The TJA1028 switches to Standby mode from Normal mode during the mode select
window if TXD is HIGH and EN is LOW (see Section 7.2.5), provided RSTN = 1.
A remote wake-up event will trigger a transition to Standby mode from Sleep mode. The
remote wake-up event will be signalled by a continuous LOW level on pin RXD.
In Standby mode, the voltage regulator is on, the LIN physical layer is disabled and
remote wake-up detection is active. The wake-up source is indicated by the level on RXD
(LOW indicates a remote wake-up).
7.2.3 Normal mode
If the EN pin is pulled HIGH while the TJA1028 is in Standby mode (with RSTN = 1) or
Sleep mode, the device will enter Normal mode. The LIN physical layer and the voltage
regulator are enabled in Normal mode.
7.2.3.1
The LIN transceiver in Normal mode
The LIN transceiver is activated when the TJA1028 enters Normal mode.
In Normal mode, the transceiver can transmit and receive data via the LIN bus. The
receiver detects data streams on the LIN pin and transfers them to the microcontroller via
pin RXD. LIN recessive is represented by a HIGH level on RXD, LIN dominant by a LOW
level.
The transmit data streams of the protocol controller at the TXD input are converted by the
transmitter into bus signals with optimized slew rate and wave shaping to minimize EME.
A LOW level at the TXD input is converted to a LIN dominant level while a HIGH level is
converted to a LIN recessive level.
7.2.4 Sleep mode
Sleep mode features extremely low power consumption.
The TJA1028 switches to Sleep mode from Normal mode during the mode select window
if TXD and EN are both LOW (see Section 7.2.5), provided RSTN = 1.
The voltage regulator and the LIN physical layer are disabled in Sleep mode. Pin RSTN is
forced LOW. Remote wake-up detection is active.
TJA1028
Product data sheet
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© NXP B.V. 2012. All rights reserved.
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TJA1028
NXP Semiconductors
LIN transceiver with integrated voltage regulator
7.2.5 Transition from Normal to Sleep or Standby mode
When EN is driven LOW in Normal mode, the TJA1028 disables the transmit path. The
mode select window opens tmsel(min) after EN goes LOW, and remains open until tmsel(max)
after EN goes LOW (see Figure 4).
The TXD pin is sampled in the mode select window. A transition to Standby mode is
triggered if TXD is HIGH, or to Sleep mode if TXD is LOW.
To avoid complicated timing in the application, EN and TXD can be pulled LOW at the
same time without having any effect on the LIN bus. In order to ensure that the remote
wake-up time (twake(dom)LIN) is not reset on a transition to Sleep mode, TXD should be
pulled LOW at least td(EN-TXD) after EN goes LOW. This is guaranteed by design.
The user must ensure the appropriate level is present on pin TXD while the mode select
window is open.
EN
TXD
operating
mode
mode select window
Normal
Normal with TXD
path blocked
Sleep or Standby depending on
TXD level in mode select window
tmsel(min)
tmsel(max)
015aaa087
TXD is sampled during the mode select window. The TJA1028 switches to Standby (TXD HIGH) or
Sleep (TXD LOW) mode after sampling.
Fig 4.
Transition from Normal to Sleep/Standby mode
7.3 Power supplies
7.3.1 Battery (pin VBAT)
The TJA1028 contains a single supply pin, VBAT. An external diode is needed in series to
protect the device against negative voltages. The operating range is from 4.5 V to 28 V.
The TJA1028 can handle voltages up to 40 V (max). If the voltage on pin VBAT falls below
Vth(det)poff, the TJA1028 switches to Off mode, shutting down the internal logic and the
voltage regulator and disabling the LIN transmitter. The TJA1028 exits Off mode as soon
as the voltage rises above Vth(det)pon, provided the junction temperature is below Tth(rel)otp.
7.3.2 Voltage regulator (pin VCC)
The TJA1028 contains a voltage regulator supplied via pin VBAT, which delivers up to
70 mA. It is designed to supply the microcontroller and its periphery via pin VCC.
TJA1028
Product data sheet
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Rev. 4 — 25 July 2012
© NXP B.V. 2012. All rights reserved.
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TJA1028
NXP Semiconductors
LIN transceiver with integrated voltage regulator
7.3.3 Reset (pin RSTN)
The output voltage on pin VCC is monitored continuously and a system reset signal is
generated (pin RSTN goes LOW) if an undervoltage event is detected (VCC < Vuvd for
tdet(uv)(VCC)). Pin RSTN will go HIGH again once the voltage on VCC exceeds the
undervoltage recovery threshold (Vuvr) for trst.
7.4
LIN transceiver
The transceiver is the interface between a LIN master/slave protocol controller and the
physical bus in a LIN network. It is primarily intended for in-vehicle sub-networks using
baud rates from 2.4 kBd up to 20 kBd and is LIN 2.0/LIN 2.1/SAE J2602 compliant.
7.5 Remote wake-up
A remote wake-up is triggered by a falling edge on pin LIN, followed by LIN remaining
LOW for at least twake(dom)LIN, followed by a rising edge on pin LIN (see Figure 5).
LIN recessive
VBAT
VBUSrec
VLIN
VBUSdom
twake(dom)LIN
LIN dominant
ground
Standby/Sleep mode
RXD
Sleep: floating/Standby: HIGH
Standby mode
LOW
015aaa088
Fig 5.
Remote wake-up behavior
The remote wake-up request is communicated to the microcontroller in Standby mode by
a continuous LOW level on pin RXD.
Note that twake(dom)LIN is measured in Sleep and Standby modes, and in Normal mode if
TXD is HIGH.
7.6 Fail-safe features
7.6.1 General fail-safe features
The following general fail-safe features have been implemented:
• An internal pull-up towards VCC on pin TXD guarantees a recessive bus level if the pin
is left floating by a bad solder joint or floating microcontroller port pin.
• The current in the transmitter output stage is limited in order to protect the transmitter
against short circuits to pin VBAT.
• A loss of power (pins VBAT and GND) has no impact on the bus line or on the
microcontroller. There will be no reverse currents from the bus.
• The LIN transmitter is automatically disabled when either EN or RSTN is LOW.
TJA1028
Product data sheet
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TJA1028
NXP Semiconductors
LIN transceiver with integrated voltage regulator
• After a transition to Normal mode, the LIN transmitter is only enabled if a recessive
level is present on pin TXD.
7.6.2 TXD dominant time-out function
A TXD dominant time-out timer circuit prevents the bus line being driven to a permanent
dominant state (blocking all network communications) if TXD is forced permanently LOW
by a hardware or software application failure. The timer is triggered by a negative edge on
the TXD pin. If the pin remains LOW for longer than the TXD dominant time-out time
(tto(dom)TXD), the transmitter is disabled, driving the bus line to a recessive state. The timer
is reset by a positive edge on TXD.
7.6.3 Temperature protection
The temperature of the IC is monitored in Normal, Standby and Off modes. If the
temperature is too high (Tvj > Tth(act)otp), the TJA1028 will switch to Off mode (if in Standby
or Normal modes). The voltage regulator and the LIN transmitter will be switched off and
the RSTN pin driven LOW.
When the temperature falls below the overtemperature protection release threshold
(Tvj < Tth(rel)otp), the TJA1028 switches to Standby mode.
8. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VBAT
battery supply voltage
DC; continuous
0.3
+40
V
Vx
voltage on pin x
DC value
pin VCC
0.3
+7
V
pins TXD, RXD, RSTN and EN
0.3
VCC + 0.3
V
40
+40
V
8
+8
kV
2
+2
kV
8
+8
kV
250
+250
V
750
+750
V
pin LIN with respect to GND
VESD
electrostatic discharge
voltage
[1]
HBM
at pins LIN and VBAT
[2]
at any other pin
IEC 61000-4-2
[3]
at pins LIN and VBAT
[4]
MM
at any pin
[5]
CDM
at corner pins
500
+500
V
[6]
150
+100
V
[7]
40
+150
C
55
+150
C
at any other pin
transient voltage
Vtrt
on pin VBAT via reverse polarity diode/capacitor;
on pin LIN via 1 nF coupling capacitor
Tvj
virtual junction temperature
Tstg
storage temperature
[1]
Human Body Model (HBM): according to AEC-Q100-002 (100 pF, 1.5 k).
[2]
VCC and VBAT connected to GND, emulating application circuit.
TJA1028
Product data sheet
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TJA1028
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LIN transceiver with integrated voltage regulator
[3]
ESD performance of pins LIN and VBAT according to IEC 61000-4-2 (150 pF, 330 ) has been verified by an external test house.
[4]
Machine Model (MM): according to AEC-Q100-003 (200 pF, 0.75 H, 10 ).
[5]
Charged Device Model (CDM): according to AEC-Q100-011 (field induced charge; 4 pF).
[6]
Verified by an external test house to ensure pins can withstand ISO 7637 part 2 automotive transient test pulses 1, 2a, 3a and 3b.
[7]
Junction temperature in accordance with IEC 60747-1. An alternative definition is: Tj = Tamb + P Rth(j-a), where Rth(j-a) is a fixed value.
The rating for Tvj limits the allowable combinations of power dissipation (P) and ambient temperature (Tamb).
9. Thermal characteristics
Table 5.
Symbol
Rth(j-a)
Thermal characteristics
Parameter
Conditions
thermal resistance from junction to ambient
Typ
Unit
SO8; single-layer board
[1]
132
K/W
SO8; four-layer board
[2]
93
K/W
HVSON8; single-layer board
[1]
129
K/W
HVSON8; four-layer board
[3]
67
K/W
[1]
According to JEDEC JESD51-2 and JESD51-3 at natural convection on 1s board.
[2]
According to JEDEC JESD51-2, JESD51-5 and JESD51-7 at natural convection on 2s2p board. Board with two inner copper layers
(thickness: 35 m) and thermal via array under the package connected to the first inner copper layer.
[3]
According to JEDEC JESD51-2, JESD51-5 and JESD51-7 at natural convection on 2s2p board. Board with two inner copper layers
(thickness: 35 m) and thermal via array under the exposed pad connected to the first inner copper layer.
10. Static characteristics
Table 6.
Static characteristics
VBAT = 5.5 V to 28 V; Tvj = 40 C to +150 C; RL(LIN-VBAT) = 500 ; all voltages are defined with respect to ground; positive
currents flow into the IC; typical values are given at VBAT = 12 V; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Standby mode; VLIN = VBAT
-
45
59
A
Sleep mode; VLIN = VBAT
-
12
18
A
Normal mode; bus recessive;
VLIN = VBAT; VRXD = VCC; VRSTN = HIGH
-
850
1800
A
Normal mode; bus dominant;
VBAT = 12 V; VTXD = 0 V; VRSTN = HIGH
-
2.0
4.5
mA
Supply; pin VBAT
IBAT
battery supply current
Vth(det)pon
power-on detection threshold
voltage
-
-
5.25
V
Vth(det)poff
power-off detection threshold
voltage
3
-
4.2
V
Vhys(det)pon
power-on detection hysteresis VBAT = 2 V to 28 V
voltage
50
-
-
mV
VCC(nom) = 5 V; IVCC = 70 mA to 0 mA
4.9
5
5.1
V
VCC(nom) = 3.3 V; VBAT = 4.5 V to 28 V;
3.234
3.3
3.366
V
250
-
70
mA
Supply; pin VCC
VCC
supply voltage
IVCC = 70 mA to 0 mA
IOlim
output current limit
TJA1028
Product data sheet
VCC = 0 V to 5.5 V
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TJA1028
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LIN transceiver with integrated voltage regulator
Table 6.
Static characteristics …continued
VBAT = 5.5 V to 28 V; Tvj = 40 C to +150 C; RL(LIN-VBAT) = 500 ; all voltages are defined with respect to ground; positive
currents flow into the IC; typical values are given at VBAT = 12 V; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Vuvd
undervoltage detection
voltage
VCC(nom) = 5 V
4.5
-
4.75
V
VCC(nom) = 3.3 V
2.97
-
3.135
V
Vuvr
undervoltage recovery
voltage
VCC(nom) = 5 V
4.6
-
4.9
V
3.036
-
3.234
V
-
-
7
-
-
9
1.8
10
-
F
0.3
VCC
-
0.7
VCC
V
R(VBAT-VCC)
VCC(nom) = 3.3 V
resistance between pin VBAT
and pin VCC
VCC(nom) = 5 V; VBAT = 4.5 V to 5.5 V;
IVCC = 70 mA to 5 mA;
regulator in saturation
[1]
[2]
Tvj = 85 C
Tvj = 150 C
Co
equivalent series resistance < 5
output capacitance
[2]
LIN transmit data input; pin TXD
Vth(sw)
switching threshold voltage
VCC = 2.97 V to 5.5 V
Vhys(i)
input hysteresis voltage
VCC = 2.97 V to 5.5 V
Rpu
pull-up resistance
200
-
-
mV
5
12
25
k
LIN receive data output; pin RXD
IOH
HIGH-level output current
Normal mode;
VLIN = VBAT; VRXD = VCC 0.4 V
-
-
0.4
mA
IOL
LOW-level output current
Normal mode;
VLIN = GND; VRXD = 0.4 V
0.4
-
-
mA
Enable input; pin EN
Vth(sw)
switching threshold voltage
0.8
-
2
V
Rpd
pull-down resistance
50
130
400
k
Reset output; pin RSTN
Rpu
pull-up resistance
VRSTN = VCC 0.4 V;
VCC = 2.97 V to 5.5 V
3
-
12
k
IOL
LOW-level output current
VRSTN = 0.4 V; VCC = 2.97 V to 5.5 V;
40 C < Tvj < 195 C
3.2
-
40
mA
VOL
LOW-level output voltage
VCC = 2.5 V to 5.5 V;
40 C < Tvj < 195 C
0
-
0.5
V
VOH
HIGH-level output voltage
40 C < Tvj < 195 C
0.8
VCC
-
VCC +
0.3
V
LIN bus line; pin LIN
IBUS_LIM
current limitation for driver
dominant state
VBAT = VLIN = 18 V; VTXD = 0 V
40
-
100
mA
IBUS_PAS_rec
receiver recessive input
leakage current
VLIN = 18 V; VBAT = 5.5 V; VTXD = VCC
-
-
2
A
IBUS_PAS_dom
receiver dominant input
leakage current including
pull-up resistor
Normal mode;
VTXD = VCC; VLIN = 0 V; VBAT = 12 V
600
-
-
A
IBUS_NO_GND
loss-of-ground bus current
VBAT = 18 V; VLIN = 0 V
750
-
+10
A
IBUS_NO_BAT
loss-of-battery bus current
VBAT = 0 V; VLIN = 18 V
-
-
2
A
TJA1028
Product data sheet
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TJA1028
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LIN transceiver with integrated voltage regulator
Table 6.
Static characteristics …continued
VBAT = 5.5 V to 28 V; Tvj = 40 C to +150 C; RL(LIN-VBAT) = 500 ; all voltages are defined with respect to ground; positive
currents flow into the IC; typical values are given at VBAT = 12 V; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VBUSrec
receiver recessive state
VBAT = 5.5 V to 18 V
0.6
VBAT
-
-
V
VBUSdom
receiver dominant state
VBAT = 5.5 V to 18 V
-
-
0.4
VBAT
V
VBUS_CNT
receiver center voltage
VBAT = 5.5 V to 18 V;
VBUS_CNT = (VBUSdom + VBUSrec) / 2
[3]
0.475 0.5
VBAT
VBAT
0.525
VBAT
V
VHYS
receiver hysteresis voltage
VBAT = 5.5 V to 18 V;
VHYS = VBUSrec VBUSdom
[3]
0.05
VBAT
0.15
VBAT
0.175
VBAT
V
VSerDiode
voltage drop at the serial
diode
in pull-up path with Rslave;
ISerDiode = 0.9 mA
[2]
0.4
-
1.0
V
CLIN
capacitance on pin LIN
with respect to GND
[2]
-
-
30
pF
VO(dom)
dominant output voltage
Normal mode;
VTXD = 0 V; VBAT = 7 V
-
-
1.4
V
Normal mode;
VTXD = 0 V; VBAT = 18 V
-
-
2.0
V
between pin LIN and VBAT;
VLIN = 0 V; VBAT = 12 V
20
30
60
k
Rslave
slave resistance
Temperature protection
Tth(act)otp
overtemperature protection
activation threshold
temperature
165
180
195
C
Tth(rel)otp
overtemperature protection
release threshold
temperature
126
138
150
C
[1]
See Figure 1 and Figure 6.
[2]
Not tested in production; guaranteed by design.
[3]
See Figure 8.
TJA1028
Product data sheet
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12 of 24
TJA1028
NXP Semiconductors
LIN transceiver with integrated voltage regulator
001aan953
7
R(VBAT-VCC)(typ)
(Ω)
6
5
4
3
2
-50
0
50
100
150
Tvj (°C)
Fig 6.
Graph of R(VBAT-VCC)(typ) as a function of junction temperature (Tvj)
11. Dynamic characteristics
Table 7.
Dynamic characteristics
VBAT = 5.5 V to 18 V; Tvj = 40 C to +150 C; RL(LIN-VBAT) = 500 ; all voltages are defined with respect to ground; positive
currents flow into the IC; typical values are given at VBAT = 12 V; unless otherwise specified.[1]
Symbol
Parameter
Conditions
Min
duty cycle 1
Vth(rec)(max) = 0.744VBAT;
Vth(dom)(max) = 0.581VBAT;
tbit = 50 s;
VBAT = 7 V to 18 V
[2][3]
Vth(rec)(max) = 0.76VBAT;
Vth(dom)(max) = 0.593VBAT;
tbit = 50 s;
VBAT = 5.5 V to 7.0 V
[2][3]
Vth(rec)(min) = 0.422VBAT;
Vth(dom)(min) = 0.284VBAT:
tbit = 50 s;
VBAT = 7.6 V to 18 V
[2][4]
Vth(rec)(min) = 0.41VBAT;
Vth(dom)(min) = 0.275VBAT;
tbit = 50 s;
VBAT = 6.1 V to 7.6 V
[2][4]
Vth(rec)(max) = 0.778VBAT;
Vth(dom)(max) = 0.616VBAT;
tbit = 96 s;
VBAT = 7 V to 18 V
[3][4]
Vth(rec)(max) = 0.797VBAT;
Vth(dom)(max) = 0.630VBAT;
tbit = 96 s;
VBAT = 5.5 V to 7 V
[3][4]
Typ
Max
Unit
Duty cycles
1
2
3
TJA1028
Product data sheet
duty cycle 2
duty cycle 3
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 25 July 2012
0.396 -
-
0.396 -
-
-
-
0.581
-
-
0.581
[4][5]
[4][5]
[5][6]
[5][6]
0.417 -
-
0.417 -
-
[5]
[5]
© NXP B.V. 2012. All rights reserved.
13 of 24
TJA1028
NXP Semiconductors
LIN transceiver with integrated voltage regulator
Table 7.
Dynamic characteristics …continued
VBAT = 5.5 V to 18 V; Tvj = 40 C to +150 C; RL(LIN-VBAT) = 500 ; all voltages are defined with respect to ground; positive
currents flow into the IC; typical values are given at VBAT = 12 V; unless otherwise specified.[1]
Symbol
4
Parameter
Conditions
duty cycle 4
Vth(rec)(min) = 0.389VBAT
Vth(dom)(min) = 0.251VBAT
tbit = 96 s
VBAT = 7.6 V to 18 V
[4][5]
Vth(rec)(min) = 0.378VBAT;
Vth(dom)(min) = 0.242VBAT;
tbit = 96 s;
VBAT = 6.1 V to 7.6 V
[4][5]
Min
Typ
Max
-
-
0.590
-
-
0.590
Unit
[6]
[6]
Timing characteristics
trx_pd
receiver propagation delay
rising and falling;
CRXD = 20 pF
-
-
6
s
trx_sym
receiver propagation delay symmetry
CRXD = 20 pF
2
-
+2
s
twake(dom)LIN
LIN dominant wake-up time
Sleep mode
30
80
150
s
VTXD = 0 V
tto(dom)TXD
TXD dominant time-out time
tmsel
mode select time
td(EN-TXD)
delay time from EN to TXD
tdet(uv)(VCC)
undervoltage detection time on pin VCC
[7]
CRSTN = 20 pF
6
-
20
ms
3
-
20
s
0
-
1
s
1
-
15
s
2
-
8
ms
Reset output; pin RSTN
reset time
trst
[1]
All parameters are guaranteed over the virtual junction temperature range by design. Factory testing uses correlated test conditions to
cover the specified temperature and power supply voltage ranges.
[2]
Not applicable to the low slope versions (TJA1028T/xxx/10 and TJA1028TK/xxx/10) of the TJA1028.
[3]
t bus rec min
. Variable tbus(rec)(min) is illustrated in the LIN timing diagram in Figure 8.
1 3 = ------------------------------2 t bit
[4]
Bus load conditions are: CBUS = 1 nF and RBUS = 1 k; CBUS = 6.8 nF and RBUS = 660 ; CBUS = 10 nF and RBUS = 500 .
[5]
For VBAT > 18 V, the LIN transmitter might be suppressed. If TXD is HIGH then the LIN transmitter output is recessive.
[6]
t bus rec max
2 4 = ------------------------------- . Variable tbus(rec)(max) is illustrated in the LIN timing diagram in Figure 8.
2 t bit
[7]
Not tested in production; guaranteed by design.
VBAT
RXD
RLIN
TJA1028
CRXD
TXD
LIN
GND
CLIN
015aaa198
Fig 7.
TJA1028
Product data sheet
Timing test circuit for LIN transceiver
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14 of 24
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NXP Semiconductors
LIN transceiver with integrated voltage regulator
tbit
tbit
tbit
VTXD
tbus(rec)(min)
tbus(dom)(max)
Vth(rec)(max)
Vth(dom)(max)
VBAT
LIN bus
signal
Vth(rec)(min)
Vth(dom)(min)
tbus(dom)(min)
output of receiving
node A
VRXD
output of receiving
node B
VRXD
thresholds of
receiving node A
thresholds of
receiving node B
tbus(rec)(max)
trx_pdf
trx_pdr
trx_pdr
trx_pdf
015aaa199
Fig 8.
LIN transceiver timing diagram
12. Test information
12.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q100 - Failure mechanism based stress test qualification for integrated
circuits, and is suitable for use in automotive applications.
TJA1028
Product data sheet
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Rev. 4 — 25 July 2012
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15 of 24
TJA1028
NXP Semiconductors
LIN transceiver with integrated voltage regulator
13. Package outline
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A
X
c
y
HE
v M A
Z
5
8
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
4
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
inches
0.069
0.010 0.057
0.004 0.049
0.01
0.019 0.0100
0.014 0.0075
0.20
0.19
0.16
0.15
0.05
0.01
0.01
0.004
0.028
0.012
0.244
0.039 0.028
0.041
0.228
0.016 0.024
θ
8o
o
0
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
Fig 9.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT96-1
076E03
MS-012
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
Package outline SOT96-1 (SO8)
TJA1028
Product data sheet
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TJA1028
NXP Semiconductors
LIN transceiver with integrated voltage regulator
HVSON8: plastic thermal enhanced very thin small outline package; no leads;
8 terminals; body 3 x 3 x 0.85 mm
SOT782-1
X
B
D
A
E
A
A1
c
detail X
terminal 1
index area
e1
terminal 1
index area
e
1
4
C
C A B
C
v
w
b
y
y1 C
L
K
Eh
8
5
Dh
0
1
scale
Dimensions
Unit(1)
mm
2 mm
A
A1
b
max 1.00 0.05 0.35
nom 0.85 0.03 0.30
min 0.80 0.00 0.25
c
0.2
D
Dh
E
Eh
e
e1
K
L
3.10 2.45 3.10 1.65
0.35 0.45
3.00 2.40 3.00 1.60 0.65 1.95 0.30 0.40
2.90 2.35 2.90 1.55
0.25 0.35
v
0.1
w
y
0.05 0.05
y1
0.1
Note
1. Plastic or metal protrusions of 0.075 maximum per side are not included.
References
Outline
version
IEC
JEDEC
JEITA
SOT782-1
---
MO-229
---
sot782-1_po
European
projection
Issue date
09-08-25
09-08-28
Fig 10. Package outline SOT782-1 (HVSON8)
TJA1028
Product data sheet
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TJA1028
NXP Semiconductors
LIN transceiver with integrated voltage regulator
14. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling ensure that the appropriate precautions are taken as
described in JESD625-A or equivalent standards.
15. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
15.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
15.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
15.3 Wave soldering
Key characteristics in wave soldering are:
TJA1028
Product data sheet
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TJA1028
NXP Semiconductors
LIN transceiver with integrated voltage regulator
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
15.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 11) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 8 and 9
Table 8.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
350
< 2.5
235
220
2.5
220
220
Table 9.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 11.
TJA1028
Product data sheet
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19 of 24
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NXP Semiconductors
LIN transceiver with integrated voltage regulator
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 11. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
16. Soldering of HVSON packages
Section 15 contains a brief introduction to the techniques most commonly used to solder
Surface Mounted Devices (SMD). A more detailed discussion on soldering HVSON
leadless package ICs can found in the following application notes:
• AN10365 ‘Surface mount reflow soldering description”
• AN10366 “HVQFN application information”
TJA1028
Product data sheet
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Rev. 4 — 25 July 2012
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LIN transceiver with integrated voltage regulator
17. Revision history
Table 10.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
TJA1028 v.4
20120725
Product data sheet
-
TJA1028 v.3
Modifications:
•
•
•
•
•
•
Table 5: text of table note section amended
Table 3: text of table note amended
Section 2, Section 7, Section 7.3.2: text revised
Section 7.1, Section 7.3.3: added
Figure 1, Figure 5: amended
Table 6: parameters values/conditions changed: Vth(det)pon, Vth(det)poff
TJA1028 v.3
20110519
Product data sheet
-
TJA1028 v.2
TJA1028 v.2
20100225
Product data sheet
-
TJA1028 v.1
TJA1028 v.1
20100921
Product data sheet
-
-
TJA1028
Product data sheet
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Rev. 4 — 25 July 2012
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NXP Semiconductors
LIN transceiver with integrated voltage regulator
18. Legal information
18.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
18.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
18.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
TJA1028
Product data sheet
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 25 July 2012
© NXP B.V. 2012. All rights reserved.
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TJA1028
NXP Semiconductors
LIN transceiver with integrated voltage regulator
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
TJA1028
Product data sheet
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TJA1028
NXP Semiconductors
LIN transceiver with integrated voltage regulator
20. Contents
1
2
3
4
5
6
6.1
6.2
7
7.1
7.2
7.2.1
7.2.2
7.2.3
7.2.3.1
7.2.4
7.2.5
7.3
7.3.1
7.3.2
7.3.3
7.4
7.5
7.6
7.6.1
7.6.2
7.6.3
8
9
10
11
12
12.1
13
14
15
15.1
15.2
15.3
15.4
16
17
18
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 4
LIN 2.x/SAE J2602 compliant . . . . . . . . . . . . . . 5
Operating modes . . . . . . . . . . . . . . . . . . . . . . . 5
Off mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Standby mode. . . . . . . . . . . . . . . . . . . . . . . . . . 6
Normal mode . . . . . . . . . . . . . . . . . . . . . . . . . . 6
The LIN transceiver in Normal mode . . . . . . . . 6
Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Transition from Normal to Sleep or
Standby mode. . . . . . . . . . . . . . . . . . . . . . . . . . 7
Power supplies . . . . . . . . . . . . . . . . . . . . . . . . . 7
Battery (pin VBAT) . . . . . . . . . . . . . . . . . . . . . . . 7
Voltage regulator (pin VCC) . . . . . . . . . . . . . . . . 7
Reset (pin RSTN) . . . . . . . . . . . . . . . . . . . . . . . 8
LIN transceiver . . . . . . . . . . . . . . . . . . . . . . . . 8
Remote wake-up . . . . . . . . . . . . . . . . . . . . . . . 8
Fail-safe features . . . . . . . . . . . . . . . . . . . . . . . 8
General fail-safe features . . . . . . . . . . . . . . . . . 8
TXD dominant time-out function . . . . . . . . . . . . 9
Temperature protection. . . . . . . . . . . . . . . . . . . 9
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9
Thermal characteristics . . . . . . . . . . . . . . . . . 10
Static characteristics. . . . . . . . . . . . . . . . . . . . 10
Dynamic characteristics . . . . . . . . . . . . . . . . . 13
Test information . . . . . . . . . . . . . . . . . . . . . . . . 15
Quality information . . . . . . . . . . . . . . . . . . . . . 15
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16
Handling information. . . . . . . . . . . . . . . . . . . . 18
Soldering of SMD packages . . . . . . . . . . . . . . 18
Introduction to soldering . . . . . . . . . . . . . . . . . 18
Wave and reflow soldering . . . . . . . . . . . . . . . 18
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 18
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 19
Soldering of HVSON packages. . . . . . . . . . . . 20
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 21
Legal information. . . . . . . . . . . . . . . . . . . . . . . 22
18.1
18.2
18.3
18.4
19
20
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information . . . . . . . . . . . . . . . . . . . .
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
22
22
22
23
23
24
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 25 July 2012
Document identifier: TJA1028
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