INTEGRATED CIRCUITS
DATA SHEET
TJA1053
Fault-tolerant CAN transceiver
Product specification
Supersedes data of 1997 Oct 15
File under Integrated Circuits, IC18
2000 Dec 18
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1053
• An unpowered node does not disturb the bus lines.
FEATURES
Optimized for in-car low-speed communication
Support for low-power modes
• Baud rate up to 125 kbaud
• Up to 32 nodes can be connected
• Low current sleep/standby mode with wake-up via the
bus lines
• Supports unshielded bus wires
• Power-on reset flag on the output.
• Low RFI due to built-in slope control function
• Fully integrated receiver filters
GENERAL DESCRIPTION
• Permanent dominant monitoring of TXD.
The TJA1053 is the interface between the CAN protocol
controller and the physical bus. It is primarily intended for
low-speed applications, up to 125 kbaud, in passenger
cars. The device provides differential transmit capability
but will switch in error conditions to a single-wire
transmitter and/or receiver. The TJA1053 is derived from
the PCA82C252 giving the following advantages:
Bus failure management
• Supports one-wire transmission modes with ground
offset voltages up to 1.5 V
• Automatic switching to single-wire mode in the event of
bus failure
• Better equipped for networks with more than 15 nodes
• Automatic reset to differential mode if bus failure is
removed.
• Integrated timer at the TXD input prevents a permanent
dominant state
Protection
• Reduced supply current in VCC standby mode
• Short-circuit proof to battery and ground in 12 V
powered systems
• CANH output driver is disabled in the event of a ‘CANH
short-circuited to battery’ failure mode.
• Thermally protected
• Bus lines protected against transients in an automotive
environment
QUICK REFERENCE DATA
SYMBOL
PARAMETER
VCC
supply voltage
VBAT
battery voltage
IBAT(sleep)
sleep mode current
VCANH,VCANL CANH, CANL input voltage
CONDITIONS
MIN.
TYP.
MIN.
UNIT
4.75
−
5.25
V
no time limit
−0.3
−
+27
V
operating
6.0
−
27
V
load dump
−
−
40
V
VCC = 0 V; VBAT = 12 V
−
65
−
µA
VCC = 0 to 5.5 V; VBAT ≥ 0 V;
no time limit
−10
−
+27
V
VCC = 0 to 5.5 V; VBAT ≥ 0 V;
t < 0.1 ms; load dump
−40
−
+40
V
VDROP(H)
CANH transmitter drop voltage ICANH = 40 mA
−
−
1.4
V
VDROP(L)
CANL transmitter drop voltage ICANL = 40 mA
−
−
1.4
V
tPD
propagation delay
TXD to RXD
−
1
−
µs
tf
bus output fall time
90% to 10%
−
0.5
−
µs
tr
bus output rise time
10% to 90%
−
0.5
−
µs
Tamb
operating ambient temperature
−40
−
+125
°C
2000 Dec 18
2
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1053
ORDERING INFORMATION
PACKAGE
TYPE
NUMBER
NAME
TJA1053T
DESCRIPTION
SO14
VERSION
plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
BLOCK DIAGRAM
BAT
handbook, full pagewidth
14
INH
WAKE
STB
EN
VCC
10
12.5
kΩ
1
7
TEMPERATURE
PROTECTION
WAKE-UP
STANDBY
CONTROL
5
6
9
11
VCC
12
2
TXD
8
DRIVER
RTL
CANH
CANL
RTH
TIMER
TJA1053
NERR
FAILURE DETECTOR
PLUS WAKE UP
PLUS TIME-OUT
4
FILTER
RXD
RECEIVER
3
FILTER
13
MGL181
GND
Fig.1 Block diagram.
2000 Dec 18
3
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1053
PINNING
SYMBOL
PIN
DESCRIPTION
INH
1
inhibit output for switching external
5 V regulator
TXD
2
transmit data input, when LOW bus
data will be dominant, when HIGH
bus data will be recessive
RXD
3
receive data output, when LOW bus
data will be dominant
NERR
4
error output pin, when LOW a bus
error exists
STB
5
not standby digital control input
signal (active LOW)
INH
1
14 BAT
TXD
2
13 GND
RXD
3
12 CANL
NERR
4
TJA1053T 11 CANH
STB
5
10 VCC
EN
6
9
RTL
WAKE
7
8
RTH
EN
6
enable digital control input signal
WAKE
7
not wake input signal, when pulled
down INH becomes active for
wake-up (active LOW)
RTH
8
termination resistor, CANH line will
be high-impedance with certain bus
errors
RTL
9
termination resistor, CANL line will be
high-impedance with certain bus
errors
VCC
10
supply voltage (+5 V)
CANH
11
high voltage bus line, will be HIGH in
dominant state
CANL
12
low voltage bus line, will be LOW in
dominant state
GND
13
ground
BAT
14
battery voltage
2000 Dec 18
handbook, halfpage
MGL182
Fig.2 Pin configuration.
4
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1053
FUNCTIONAL DESCRIPTION
This time is needed to avoid false triggering by external RF
fields. Recovery from these failures is detected
automatically after a certain time-out (filtering) and no
transmission is lost. The CANH driver and the RTH pin are
switched off in the event of failure 3.
The TJA1053 is the interface between the CAN protocol
controller and the physical bus. It is primarily intended for
low speed applications, up to 125 kbaud, in passenger
cars. The device provides differential transmit capability to
the bus and differential receive capability to the CAN
controller.
Failures 4 and 7 initially result in a permanent dominant
level at RXD. After a time-out, the CANL driver and the
RTL pin are switched off. Only a weak pull-up at RTL
remains. Reception continues by switching to the
single-wire mode via CANH. When failures 4 or 7 are
removed, the recessive bus levels are restored. If the
differential voltage remains below the recessive threshold
level for a certain period of time, reception and
transmission switch back to the differential mode.
To reduce RF interference the rise and fall slope are
limited. This allows the use of an unshielded twisted pair or
a parallel pair of wires for the bus. Moreover, it supports
transmission capability on either bus wire if one of the bus
wires is corrupted. The failure detection logic automatically
selects a suitable transmission mode.
In normal operation (no wiring failures) the differential
receiver is output to RXD. The differential receiver inputs
are connected to CANH and CANL through integrated
filters. The filtered input signals are also used for the single
wire receivers. The CANH and CANL receivers have
threshold voltages that ensure a maximum noise margin in
single-wire modes.
If any of the seven wiring failures occur, the output NERR
will be made LOW. On error recovery, NERR will be made
HIGH again.
During all single-wire transmissions, the EMC
performance (both immunity and emission) is worse than
in the differential mode. Integrated receiver filters
suppress any HF noise induced into the bus wires.
The cut-off frequency of these filters is a compromise
between propagation delay and HF suppression. In the
single-wire mode, low frequency noise cannot be
distinguished from the required signal.
A timer has been integrated at the TXD input. This timer
prevents the TJA1053 driving the bus lines to permanent
dominant state.
Failure detector
The failure detector is active in the normal operation mode
and detects the following single bus failures and switches
to an appropriate mode:
Low power modes
The transceiver provides 3 low power modes which can be
entered and exited via pins STB and EN (see Table 1).
1. CANH wire interrupted
The sleep mode is the mode with the lowest power
consumption. The INH pin is switched to high-impedance
for deactivation of external voltage regulators. CANL is
biased to the battery voltage via the RTL output. If the
supply voltage is provided the RXD and NERR will signal
the wake-up interrupt
2. CANL wire interrupted
3. CANH short-circuited to battery
4. CANL short-circuited to ground
5. CANH short-circuited to ground
6. CANL short-circuited to battery
7. CANL mutually shorted to CANH.
The VBAT standby mode will react the same as the sleep
mode with an active INH output.
The differential receiver threshold is set at −2.9 V.
This ensures correct reception in the normal operating
modes and, in the event of failures 1, 2 and 5 with a noise
margin as high as possible. These failures, or recovery
from them, do not destroy ongoing transmissions.
The VCC standby mode is the VBAT standby with RTL
switched to the VCC voltage. In this mode the NERR output
signals the VBAT power-on flag and the RXD output will
show the wake-up interrupt.
Failures 3 and 6 are detected by comparators connected
to CANH and CANL, respectively. If the comparator
threshold is exceeded for a certain period of time, the
reception is switched to the single-wire mode.
2000 Dec 18
5
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1053
The EN and STB pins will internally be set to LOW level, if
the VCC voltage is below a certain threshold level, to
provide fail safe functionality.
Wake-up requests are recognized by the transceiver when
a dominant signal is detected on either bus line or if the
WAKE pin is connected to ground. On a wake-up request
the transceiver will set the INH output which can be used
to activate the external VCC voltage regulator. If VCC is
provided the wake-up request can be read on the NERR or
RXD outputs, on which the external microcontroller can
wake up the transceiver (switch to normal operating mode)
via STB and EN.
Protections
A current limiting circuit protects the transmitter output
stages against short-circuit to positive and negative
battery voltage.
If the junction temperature exceeds a maximum value, the
transmitter output stages are disabled. Because the
transmitter is responsible for the major part of the power
dissipation, this will result in a reduced power dissipation
and hence a lower chip temperature. All other parts of the
IC will remain operating.
To prevent false wake-up due to transients or RF fields,
wake-up voltage threshold levels have to be maintained
for a certain period of time. In the low power modes the
failure detection circuit remains partly active to prevent
increased power consumption should errors 3, 4 and 7
occur.
The CANH and CANL inputs are protected against
electrical transients which may occur in an automotive
environment.
Power on
After power-on VBAT is switched on, the INH pin will
become HIGH and an internal power-on flag will be set.
This flag can be read via the NERR pin (STB = 1, EN = 0)
and will be reset by entering the normal operation mode.
Table 1
Truth table of CAN transceiver
STB EN
MODE
INH
NERR
RXD
RTL
0
VBAT standby(1)
0
0
sleep(2)
floating
0
1
go to sleep command
floating
1
0
VCC standby(3)
HIGH
active LOW VBAT
power-on flag
active LOW wake-up
interrupt
switched to VCC
1
1
normal operation mode
HIGH
active LOW error flag
HIGH = receive;
LOW = dominant
received data
switched to VCC
0
HIGH
active LOW wake-up interrupt signal if VCC is present switched to VBAT
switched to VBAT
switched to VBAT
Notes
1. Wake-up interrupts are released when entering normal operating mode.
2. If go to sleep command was used before (EN may turn LOW as VCC drops, without affecting internal functions
because of fail safe functionality).
3. VBAT power-on flag will be reset when entering normal operation mode.
2000 Dec 18
6
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1053
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VCC
supply voltage
−0.3
+6.0
V
VDD
DC input voltage at pins 2 to 6
−0.3
VCC + 0.3
V
VBUS
DC input voltage at pins 11 and 12
−10
+27
V
VCANH,
VCANL
DC input voltage at pins 11 and 12
VCC = 0 to 5.5 V;
−40
VBAT ≥ 0 V; t < 0.1 ms;
load dump
+40
V
Vtr
transient voltage at pins 11 and 12
see Fig.6
−150
+100
V
VWAKE
DC input voltage on pin 7
−
VBAT + 0.3 V
IWAKE
input current pin 7
−15
−
V1,8,9
DC input voltage on pins 1, 8 and 9
−0.3
VBAT + 0.3 V
VBAT
DC input voltage on pin 14
voltage on pin 14
R8,9
termination resistances pins 8 and 9
Tvj
virtual junction temperature
Tstg
storage temperature
Vesd
electrostatic discharge voltage at any pin
load dump; 500 ms
note 1
mA
−0.3
+27
V
−
40
V
500
16000
Ω
−40
+150
°C
−55
+150
°C
note 2
−2000
+2000
V
note 3
−200
+200
V
Notes
1. Junction temperature in accordance with IEC 60747-1. An alternative definition is: Tvj = Tamb + PD × Rth vj-a.
Where: Rth vj-a is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations
of power dissipation and ambient temperature.
2. Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 kΩ resistor.
3. Machine model: equivalent to discharging a 200 pF capacitor through a 25 Ω resistor.
THERMAL CHARACTERISTICS
SYMBOL
Rth vj-a
PARAMETER
CONDITIONS
thermal resistance from junction to ambient in free air
QUALITY SPECIFICATION
Quality specification in accordance with “SNW-FQ-611-Part-E”.
2000 Dec 18
7
VALUE
UNIT
120
K/W
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1053
CHARACTERISTICS
VCC = 4.75 to 5.25 V; VSTB = VCC; VBAT = 6 to 27 V; Tamb = −40 to +125 °C; all voltages are defined with respect to
ground; positive currents flow into the IC; all parameters are guaranteed over the temperature range by design, but only
100% tested at 25 °C; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supplies
ICC
supply current
recessive; TXD = VCC;
normal operating mode
−
6
10
mA
dominant; TXD = 0 V; no
load; normal operating mode
−
29
35
mA
ICC + IBAT
supply current
VCC standby; VCC = 5 V;
VBAT = 12 V; Tamb < 90 °C
−
200
500
µA
IBAT + ICC
supply current
VBAT standby; VCC = 5 V;
VBAT = 12 V; Tamb < 90 °C
−
70
95
µA
IBAT(sleep)
supply current
sleep mode; VCC = 0 V;
VBAT = 12 V; Tamb < 90 °C
−
65
90
µA
VBAT
battery voltage for setting
power-on flag
low power modes
−
−
1.0
V
tpwon
battery voltage low time for
setting power-on flag
low power modes
1
−
−
s
0.7VCC
−
VCC + 0.3
V
Pins STB, EN and TXD
VIH
HIGH-level input voltage
VIL
LOW-level input voltage
−0.3
−
0.3VCC
V
IIH
HIGH-level input current
(pins STB and EN)
Vi = 4 V
−
9
20
µA
IIL
LOW-level input current
(pins STB and EN)
Vi = 1 V
4
8
−
µA
IIH
HIGH-level input current
(pin TXD)
Vi = 4 V
−25
−80
−200
µA
IIL
LOW-level input current
(pin TXD)
Vi = 1 V
−100
−320
−800
µA
VCC
forced VBAT standby mode
(fail safe)
2.75
−
4.5
V
Pins RXD and NERR
VOH
HIGH-level output voltage
(pin NERR)
Io = −100 µA
VCC − 0.9
−
VCC
V
VOH
HIGH-level output voltage
(pin RXD)
Io = −250 µA
VCC − 0.9
−
VCC
V
VOL
LOW-level output voltage
Io = 1.25 mA
0
−
0.9
V
IIL
LOW-level input current
VWAKE = 0 V; VBAT = 27 V
−70
−40
−10
µA
Vwu(th)
wake-up threshold voltage
VSTB = 0 V
1.7
3.0
4.0
V
Pin WAKE
2000 Dec 18
8
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
SYMBOL
PARAMETER
TJA1053
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Pin INH
VdropH
ILI
HIGH-level voltage drop
leakage current
IINH = −0.18 mA; VBAT < 16 V −
−
0.8
V
IINH = −0.18 mA; VBAT > 16 V −
−
1.0
V
sleep mode; VINH = 0 V
−5.0
−
+5.0
µA
Pins CANH and CANL
Vdrx
differential receiver threshold
voltage
no bus failures
bus failures 1, 2 and 5
−3.25
−
−2.65
V
VoCANHrec
CANH recessive output voltage
TXD = VCC; RRTH < 4 kΩ
−
−
0.2
V
VoCANLrec
CANL recessive output voltage
TXD = VCC; RRTL < 4 kΩ
VCC − 0.2
−
−
V
VoCANHdom CANH dominant output voltage
TXD = 0 V; V6 = VCC;
ICANH = −40 mA
VCC − 1.4
−
−
V
VoCANLdom
CANL dominant output voltage
TXD = 0 V; V6 = VCC;
ICANL = 40 mA
−
−
1.4
V
IoCANH
CANH output current
VCANH = 0 V; TXD = 0 V
−
−75
−100
mA
sleep mode; VCANH = 12 V
−
0
−
µA
IoCANL
CANL output current
VCANL = 14 V; TXD = 0 V
−
90
130
mA
sleep mode; VCANL = 0 V;
VBAT = 12 V
−
0
−
µA
7.3
8.0
V
Vdet(th)H,L
voltage detection threshold for
normal mode
short-circuit to battery voltage on
CANH and CANL
6.5
Vdet(th)H
voltage detection threshold for
standby/sleep mode
short-circuit to battery voltage on
CANH
VBAT − 2.5 −
VBAT − 1
V
VwuL
CANL wake-up voltage threshold
2.4
3.1
3.8
V
VwuH
CANH wake-up voltage
threshold
1.2
1.9
2.7
V
VwuL-VwuH
wake-up voltage threshold
difference
0.2
−
−
V
VCANH
CANH single-ended receiver
threshold
failures 4, 6 and 7
1.5
1.82
2.15
V
VCANL
CANL single-ended receiver
threshold voltage
failure 3
2.8
3.1
3.4
V
2000 Dec 18
9
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
SYMBOL
PARAMETER
TJA1053
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Pins RTH and RTL
−
7
25
Ω
Io < 1 mA; VCC
standby mode
−
15
75
Ω
RTL to VBAT switch series
resistance
VBAT standby or sleep mode
8
12.5
23
kΩ
RRTH
RTH to ground switch-on
resistance
Io < 10 mA;
normal operating mode
−
43
95
Ω
VoRTH
RTH output voltage
Io = 1 mA; low power modes
−
0.7
1.0
V
IRTLpu
RTL pull-up current
normal operating mode,
failures 4, 6 and 7
−
75
−
µA
IRTHpd
RTH pull-down current
normal operating mode,
failure 3
−
75
−
µA
155
165
180
°C
RRTL
RTL to VCC switch-on resistance Io < 10 mA;
normal operating mode
Thermal shutdown
Tjsd
shutdown junction temperature
AC CHARACTERISTICS
VCC = 4.75 to 5.25 V; VSTB = VCC; VBAT = 6 to 27 V; Tamb = −40 to +125 °C; all voltages are defined with respect to
ground; positive currents flow into the IC; all parameters are guaranteed over the temperature range by design, but only
100% tested at 25 °C; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
tt(r-d)
CANL and CANH bus output
transition time
recessive-to-dominant
10% to 90%; C1 = 10 nF;
C2 = 0; R1 = 100 Ω
0.6
0.85
−
µs
tt(d-r)
CANL and CANH bus output
transition time
dominant-to-recessive
10% to 90%; C1 = 1 nF;
C2 = 0; R1 = 100 Ω
0.3
0.4
−
µs
tPD(L)
propagation delay TXD-to-RXD
LOW
C1 = 100 pF; C2 = 0;
R1 = 100 Ω; no failures and
bus failures 1, 2 and 5
−
0.75
1.25
µs
C1 = C2 = 3.3 nF;
R1 = 100 Ω; no failures and
bus failures 1, 2 and 5
−
1
1.5
µs
C1 = 100 pF; C2 = 0;
R1 = 100 Ω;
bus failures 3, 4, 6 and 7
−
0.85
1.3
µs
C1 = C2 = 3.3 nF;
R1 = 100 Ω;
bus failures 3, 4, 6 and 7
−
1.1
1.7
µs
2000 Dec 18
10
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
SYMBOL
tPD(H)
PARAMETER
propagation delay TXD-to-RXD
HIGH
TJA1053
CONDITIONS
MIN.
TYP.
MAX.
UNIT
C1 = 100 pF; C2 = 0;
R1 = 100 Ω; no failures and
bus failures 1, 2 and 5
−
0.95
1.5
µs
C1 = C2 = 3.3 nF;
Rl = 100 Ω; no failures and
bus failures 1 and 2
−
2.2
3.0
µs
C1 = 100 pF; C2 = 0;
R1 = 100 Ω;
bus failures 3, 4, 6 and 7
−
0.85
1.3
µs
C1 = C2 = 3.3 nF;
R1 = 100 Ω;
bus failures 3, 4, 5, 6 and 7
−
1.4
2.1
µs
twu(min)
minimum dominant time for
wake-up on CANL or CANH
low power modes
VBAT = 12 V
8
−
38
µs
t WAKE(min)
minimum WAKE LOW time for
wake-up
low power modes
VBAT = 12 V
8
−
38
µs
tfail
failure 3 detection time
normal mode
10
−
60
µs
failure 6 detection time
normal mode
50
−
400
µs
failure 3 recovery time
normal mode
10
−
60
µs
failure 6 recovery time
normal mode
150
−
750
µs
failures 4 and 7 detection time
normal mode
0.75
−
4.0
ms
failures 4 and 7 recovery time
normal mode
10
−
60
µs
failures 3, 4 and 7 detection time low power modes;
VBAT = 12 V
0.8
−
8.0
ms
failures 3, 4 and 7 recovery time
low power modes;
VBAT = 12 V
−
4
−
ms
tTXD
TXD permanent dominant timer,
disable time
normal mode and failure
modes
0.75
−
4.0
ms
th(min)
minimum hold time to go to sleep
command
5
−
50
µs
∆ec
edge-count difference between
CANH and CANL
for failures 1, 2 and 5 detection normal mode
(NERR becomes LOW)
−
3
−
for failures 1, 2 and 5 recovery normal mode
−
1
−
2000 Dec 18
11
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1053
TEST AND APPLICATION INFORMATION
ndbook, full pagewidth
+5 V
INH
WAKE
TXD
STB
EN
RXD
+12 V
BAT
1
14
10
7
8
2
12
RTH
R1(1)
C2(2)
11
6
9
3
CANH
RTL
R1(1)
4
GND
C1(2)
CANL
TJA1053
5
13
20 pF
VCC
C1(2)
NERR
MGL183
(1) Termination resistors R1 (100 Ω) are not connected to RTH or RTL for testing purposes because the minimum load resistance allowed on the CAN
bus line is 500 Ω per transceiver.
(2) The capacitive bus load of 10 nF is split into three equal capacitors (3.3 nF) to simulate the CAN bus line.
Fig.3 Test circuit for dynamic characteristics.
handbook, full pagewidth
VCC
VTXD
0V
VCANL
5V
3.6 V
1.4 V
VCANH
0V
2.2 V
−2.9 V
Vdiff(1)
−5 V
VRXD
0.7VCC
0.3VCC
tPD(H)
tPD(L)
(1) Vdiff = VCANH − VCANL
Fig.4 Timing diagram for dynamic characteristics.
2000 Dec 18
12
MGL184
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1053
VBAT
handbook, full pagewidth
BATTERY
+5 V
P8xC592/P8xCE598
CAN CONTROLLER
+5 V
WAKE
CTX0
CRXO
TXD
RXD
2
STB
3
NERR
5
4
EN
6
INH
1
7
14
TJA1053
10
CAN TRANSCEIVER
13
8
11
RTH
12
CANH
BAT
VCC
GND
100 nF
9
CANL
RTL
CAN BUS LINE
MGL185
Fig.5 Application of the TJA1053.
handbook, full pagewidth
+5 V
+12 V
INH
WAKE
TXD
STB
EN
RXD
1
10
7
8
2
12
5
RTH
100 Ω
CANL
1 nF
TJA1053
11
6
CANH
1 nF
9
3
13
20 pF
VCC
BAT
14
4
GND
RTL
100 Ω
NERR
MGL186
The waveforms of applied transients shall be in accordance with “ISO7637, part 1”, test pulses 1, 2, 3a and 3b.
Fig.6 Test circuit for automotive transients.
2000 Dec 18
13
GENERATOR
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1053
PACKAGE OUTLINE
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
D
E
A
X
c
y
HE
v M A
Z
8
14
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
7
e
0
detail X
w M
bp
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.010 0.057
0.004 0.049
0.01
0.019 0.0100 0.35
0.014 0.0075 0.34
0.16
0.15
0.050
0.028
0.024
0.01
0.01
0.004
0.028
0.012
inches 0.069
0.244
0.039
0.041
0.228
0.016
θ
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT108-1
076E06
MS-012
2000 Dec 18
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
97-05-22
99-12-27
14
o
8
0o
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1053
SOLDERING
If wave soldering is used the following conditions must be
observed for optimal results:
Introduction to soldering surface mount packages
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
Reflow soldering
The footprint must incorporate solder thieves at the
downstream end.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 220 °C for
thick/large packages, and below 235 °C for small/thin
packages.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Wave soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
To overcome these problems the double-wave soldering
method was specifically developed.
2000 Dec 18
15
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1053
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE
WAVE
BGA, HBGA, LFBGA, SQFP, TFBGA
not suitable
suitable(2)
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS
not
PLCC(3), SO, SOJ
suitable
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
REFLOW(1)
suitable
suitable
suitable
not
recommended(3)(4)
suitable
not
recommended(5)
suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2000 Dec 18
16
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1053
DATA SHEET STATUS
DATA SHEET STATUS
PRODUCT
STATUS
DEFINITIONS (1)
Objective specification
Development
This data sheet contains the design target or goal specifications for
product development. Specification may change in any manner without
notice.
Preliminary specification
Qualification
This data sheet contains preliminary data, and supplementary data will be
published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.
Product specification
Production
This data sheet contains final specifications. Philips Semiconductors
reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
Note
1. Please consult the most recently issued data sheet before initiating or completing a design.
DEFINITIONS
DISCLAIMERS
Short-form specification The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Life support applications These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
Application information Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2000 Dec 18
17
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1053
NOTES
2000 Dec 18
18
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1053
NOTES
2000 Dec 18
19
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SCA 70
© Philips Electronics N.V. 2000
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Printed in The Netherlands
703502/02/pp20
Date of release: 2000
Dec 18
Document order number:
9397 750 07796
