UBA2021

UBA2021 630 V driver IC for CFL and TL lamps Rev. 04 — 25 July 2008 Product data sheet 1. General description The UBA2021 is a high voltage IC intended to drive and control Compact Fluorescent Lamps (CFL) or fluorescent TL lamps. It contains a driver circuit for an external half-bridge, an oscillator and a control circuit for starting up, preheating, ignition, lamp burning and protection. 2. Features I I I I I I I I Adjustable preheat and ignition time. Adjustable preheat current. Adjustable lamp power. Lamp power independent from mains voltage variations. Overpower protection. Lamp temperature stress protection at higher mains voltages. Capacitive mode protection. Protection against a drive voltage that is too low for the power MOSFETs. 3. Quick reference data Table 1. Symbol VFS VVS(start) VVS(stop) IVS(standby) fstart tph VRS(ctrl) fB tign fB tno Quick reference data Parameter high side supply voltage oscillator start voltage oscillator stop voltage standby current start frequency preheat time control voltage at pin RS bottom frequency ignition time bottom frequency non-overlap time CCP = 100 nF VVS = 11 V Conditions IFS < 15 µA; t < 0.5 s Min Typ 11.95 10.15 200 108 666 −600 42.9 625 42.9 1.4 Max 630 Unit V V V µA kHz ms mV kHz ms kHz µs High voltage supply Start-up state Preheat mode Frequency sweep to ignition Normal operation NXP Semiconductors UBA2021 630 V driver IC for CFL and TL lamps Quick reference data Parameter total supply current high and low side on resistance high and low side off resistance feed-forward frequency operating range of input current at pin RHV IRHV = 0.75 mA IRHV = 1.0 mA Conditions fB = 43 kHz Min Typ 1 126 75 Max Unit mA Ω Ω Table 1. Symbol Itot RG1(on), RG2(on) RG1(off), RG2(off) Feed-forward fff Ii(RHV) 0 63.6 84.5 kHz kHz 1000 µA 4. Ordering information Table 2. Ordering information Package Name UBA2021T UBA2021P SO14 DIP14 Description plastic small outline package; 14 leads; body width 3.9 mm plastic dual in-line package; 14 leads (300 mil) Version SOT108-1 SOT27-1 Type number 5. Block diagram VS 5 RHV 13 RREF CF 10 12 CI 14 bootstrap charging circuit SB SUPPLY n.c. 4 BAND GAP REFERENCE 8 NON OVERLAP OSCILLATOR LEVEL SHIFTER HIGH SIDE DRIVER 1 2 3 FS G1 S1 CP TIMING LOW SIDE DRIVER 6 G2 RS 9 RS MONITOR CONTROL 7 UBA2021 11 SGND PGND mgs988 Fig 1. Block diagram UBA2021_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 25 July 2008 2 of 16 NXP Semiconductors UBA2021 630 V driver IC for CFL and TL lamps 6. Pinning information 6.1 Pinning FS G1 S1 n.c. VS G2 PGND 1 2 3 4 5 6 7 001aai566 14 CI 13 RHV 12 CF FS G1 S1 n.c. VS G2 PGND 1 2 3 4 5 6 7 001aai567 14 CI 13 RHV 12 CF UBA2021T 11 SGND 10 RREF 9 8 RS CP UBA2021P 11 SGND 10 RREF 9 8 RS CP Fig 2. Pin configuration (SO14) Fig 3. Pin configuration (DIP14) 6.2 Pin description Table 3. Symbol FS G1 S1 n.c. VS G2 PGND CP RS RREF SGND CF RHV CI Pin description Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Description high side floating supply voltage gate high transistor (T1) source high transistor (T1) high-voltage spacer, not to be connected low voltage supply gate low transistor (T2) power ground timing/averaging capacitor current monitoring input reference resistor signal ground oscillator capacitor start-up resistor/feed-forward resistor integrating capacitor 7. Functional description 7.1 Introduction The UBA2021 is an integrated circuit for electronically ballasted compact fluorescent lamps and their derivatives operating with mains voltages up to 240 V (RMS). It provides all the necessary functions for preheat, ignition and on-state operation of the lamp. In addition to the control function, the IC provides level shift and drive functions for the two discrete power MOSFETs, T1 and T2 (see Figure 7). UBA2021_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 25 July 2008 3 of 16 NXP Semiconductors UBA2021 630 V driver IC for CFL and TL lamps 7.2 Initial start-up Initial start-up is achieved by charging capacitor CS9 with the current applied to the RHV-pin. At start-up, MOSFET T2 conducts and T1 does not conduct. This ensures Cboot becomes charged. This start-up state is reached for a supply voltage of VVS(reset). This is the voltage level on the VS-pin at which the circuit will be reset to its initial state and maintained until the low voltage supply (VVS) reaches a value of VVS(start). The circuit is reset to the start-up state. 7.3 Oscillation When the low voltage supply (VVS) has reached the value of VVS(start) the circuit starts oscillating in the preheat state. The internal oscillator is a current-controlled circuit which generates a sawtooth waveform. The frequency of the sawtooth is determined by the capacitor CCF and the current out of the CF-pin, mainly set by RRREF. The sawtooth frequency is twice the frequency of the signal across the load. The IC brings MOSFETs T1 and T2 alternately into conduction with a duty factor of approximately 50 %. Figure 4 represents the timing of the IC. The circuit block 'non-overlap' generates a non-overlap time tno that ensures conduction periods of exclusively T1 or T2. Time tno is dependent on the reference current IRREF. start-up VCF 0 internal clock 0 V(G1-S1) 0 V(G2) 0 time mgs991 tno tno Fig 4. Oscillator timing 7.4 Operation in the preheat mode The circuit starts oscillating at approximately 2.5 × fB (108 kHz). The frequency gradually decreases until a defined value of current Ishunt is reached (see Figure 5). The slope of the decrease in frequency is determined by capacitor CCI. The frequency during preheating is approximately 90 kHz. This frequency is well above the resonant frequency of the load, which means that the lamp is off, the load only consists of L2, C5 and the electrode resistance. The preheat time is determined by capacitor CCP. The circuit can be locked in the preheat state by connecting the CP-pin to ground. During preheating, the circuit monitors the load current by measuring the voltage drop over external resistor Rshunt at the end of conduction of T2 with decision level VRS(ctrl). The frequency is decreased as long as VRS > VRS(ctrl). The frequency is increased for VRS < VRS(ctrl). UBA2021_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 25 July 2008 4 of 16 NXP Semiconductors UBA2021 630 V driver IC for CFL and TL lamps fstart fB preheat state ignition state burn state time mgs992 Fig 5. Operation in the preheat mode 7.5 Ignition state The RS monitoring function changes from VRS(ctrl) regulation to capacitive mode protection at the end of the preheat time. Normally this results in a further frequency decrease down to the bottom frequency fB (approximately 43 kHz). The rate of change of frequency in the ignition state is less than that in the preheat mode. During the downward frequency sweep the circuit sweeps through the resonant frequency of the load. A high voltage then appears across the lamp. This voltage normally ignites the lamp. 7.6 Failure to ignite Excessive current levels may occur if the lamp fails to ignite. The IC does not limit these currents in any way. 7.7 Transition to the burn state Assuming that the lamp has ignited during the downward frequency sweep, the frequency normally decreases to the bottom frequency. The IC can transit to the burn state in two ways: 1. In the event that the bottom frequency is not reached, transition is made after reaching the ignition time tign. 2. As soon as the bottom frequency is reached. The bottom frequency is determined by RRREF and CCF. 7.8 Feed-forward frequency During burn state a feed-forward mechanism ensures that the lamp power will not increase above the maximum allowed value due to an increased mains voltage. In the feed-forward range the UBA2021 driver IC can be configured in such a way that the application is optimized for close to constant lamp power. Above a defined voltage level the oscillation frequency also depends on the supply voltage of the half-bridge (see Figure 6). The current for the current controlled oscillator is derived from the current through RRHV in the feed-forward range. The feed-forward frequency is proportional to the average value of the current through RRHV within the operating range of Ii(RHV), given the lower limit set by fB. For currents beyond the operating range (i.e. between 1.0 mA and 1.6 mA) the feed-forward frequency is clamped. In order to prevent feed-forward of ripple on UBA2021_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 25 July 2008 5 of 16 NXP Semiconductors UBA2021 630 V driver IC for CFL and TL lamps Vin, the ripple is filtered out. The capacitor connected to the CP-pin is used for this purpose. This pin is also used in the preheat state and the ignition state for timing (tph and tign). f (kHz) feed-forward range bottom frequency IRHV (mA) mgs993 Fig 6. Feed-forward frequency 7.9 Capacitive mode protection When the preheat mode is completed, the IC will protect the power circuit against losing the zero voltage switching condition and getting too close to the capacitive mode of operation. This is detected by monitoring voltage VRS at the RS-pin. If the voltage is below VRS(cap) at the time of turn-on of T2, the capacitive mode operation is assumed. Consequently the frequency increases as long as the capacitive mode is detected. The frequency decreases down to the feed-forward frequency if no capacitive mode is detected. Frequency modulation is achieved via the CI-pin. 7.10 IC supply Initially, the IC is supplied from Vin by the current through RRHV. This current charges the supply capacitor CS9 via an internal diode. As soon as VVS exceeds VVS(start), the circuit starts oscillating. After the preheat phase is finished, the pin is connected to an internal resistor Ri(RHV), prior to this the RHV-pin is internally connected to the VS-pin. The voltage level at the RHV-pin thus drops from VVS + Vdiode to IRHV × Ri(RHV). The capacitor CS9 at the VS-pin will now be charged via the snubber capacitor CS7. Excess charge is drained by an internal clamp that turns on at voltage VVS(clamp). 7.11 Minimum gate-source voltage of T1 and T2 The high side driver is supplied via capacitor Cboot. Capacitor Cboot is charged via the bootstrap switch during the on periods of T2. The IC stops oscillating at a voltage level VVS(stop). Given a maximum charge consumption on the load at the G1-pin of 1 nC/V, this safeguards the minimum drive voltages V(G1-S1) for the high side driver, see Table 1. Table 4. < 75 kHz 75 kHz to 85 kHz ≥ 85 kHz Minimum gate-source voltages VOLTAGE 8 V (min) 7 V (min) 6 V (min) FREQUENCY The drive voltage at G2 will exceed the drive voltage of the high side driver. UBA2021_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 25 July 2008 6 of 16 NXP Semiconductors UBA2021 630 V driver IC for CFL and TL lamps 7.12 Frequency and change in frequency At any point in time during oscillation, the circuit will operate between fB and fstart. Any change in frequency will be gradual, no steps in frequency will occur. Changes in frequency caused by a change in voltage at the CI-pin show a rather constant ∆f/∆t over the entire frequency range. The following rates are realized (at a frequency of 85 kHz and with a 100 nF capacitor connected to the PCI-pin): • For any increase in frequency: ∆f/∆t is between 15 kHz/ms and 37.5 kHz/ms. • During preheat and normal operation: ∆f/∆t for a decrease in frequency is between −6 kHz/ms and −15 kHz/ms. • During the ignition phase: ∆f/∆t for a decrease in frequency is between −150 Hz/ms and −375 Hz/ms. 7.13 Ground pins The PGND-pin is the ground reference of the IC with respect to the application. As an exception the SGND-pin provides a local ground reference for the components connected to the CP-pin, CI-pin, RREF-pin and thee CF-pin. For this purpose the PGND-pin and SGND-pin are short circuited internally. External connection of the PGND-pin and the SGND-pin is not preferred. The sum of currents flowing out of the CP-pin, CI-pin, RREF-pin, CF-pin and the SGND-pin must remain zero at all time. 7.14 Charge coupling Due to parasitic capacitive coupling to the high voltage circuitry, all pins are burdened with a repetitive charge injection. Given the typical application in Figure 7, the RREF-pin and the CF-pin are sensitive to this charge injection. For the rating Qcouple a safe functional operation of the IC is guaranteed, independent of the current level. Charge coupling at current levels below 50 mA will not interfere with the accuracy of the VRS(cap) and VRS(ctrl) levels. Charge coupling at current levels below 20 mA will not interfere with the accuracy of any parameter. 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages referenced to ground. Symbol VFS IVS(clamp) VRS SR Parameter high side floating supply voltage clamp current input voltage pin RS transient of 50 ns slew rate at pins S1, G1 and FS (with respect to ground) power dissipation ambient temperature junction temperature Conditions operating t ≤ 0.5 s Min −2.5 −15 −4 Max 570 630 35 +2.5 +2.5 +4 Unit V V mA V V V/ns P Tamb Tj UBA2021_4 −40 −40 500 +150 +150 mW °C °C 7 of 16 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 25 July 2008 NXP Semiconductors UBA2021 630 V driver IC for CFL and TL lamps Table 5. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages referenced to ground. Symbol Tstg Qcouple Ves Parameter storage temperature charge coupling at pins RREF and CF electrostatic handling voltage operating human body model machine model [1] [2] [1] Conditions Min −55 −8 - Max +150 +8 2000 250 Unit °C pC V V [2] HBM: 2000 V, except pins FS, G1, S1 and VS which are 1000 V maximum and G2 which is 800 V maximum. MM: 250 V except for the G1-pin which is 100 V. 9. Thermal characteristics Table 6. Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient S014 DIP14 Rth(j-pin) thermal resistance from junction to PCB S014 DIP14 in free air 50 30 K/W K/W Conditions in free air 100 60 K/W K/W Typ Unit 10. Characteristics Table 7. Characteristics VVS = 11 V; VFS - VS1 = 11 V; Tamb = 25 °C; all voltages referenced to ground; unless otherwise specified. See Figure 8. Symbol IL Start-up state VVS(reset) VVS(start) VVS(stop) VVS(hys) IVS(standby) ∆V(RHV-VS) reset voltage oscillator start voltage oscillator stop voltage supply voltage hysteresis standby supply current at pin VVS = 11 V VS voltage difference between pins RHV and VS IRHV = 1.0 mA [2] [1] Parameter leakage current on high voltage pins Conditions VFS, VG1 and VS1 = 630 V Min - Typ - Max 15 Unit µA High voltage supply T1 off; T2 on 4 11.35 9.55 1.5 150 0.7 0.2 5.5 11.95 10.15 1.8 200 0.8 0.3 6.5 12.55 10,75 2 250 1 0.4 V V V V µA V V VVS(clamp-start) clamp margin VVS(clamp) to VVS(start) UBA2021_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 25 July 2008 8 of 16 NXP Semiconductors UBA2021 630 V driver IC for CFL and TL lamps Table 7. Characteristics …continued VVS = 11 V; VFS - VS1 = 11 V; Tamb = 25 °C; all voltages referenced to ground; unless otherwise specified. See Figure 8. Symbol IVS(clamp) Preheat mode fstart tg ICI(charge) ICI(discharge) tph ICP(charge) ICP(discharge) ∆VCP(pk) VRS(ctrl) ICI(charge) fB tign fB tg tno Itot VRS(cap) VRREF VG1(on) VG1(off) VG2(on) VG2(off) RG1(on) RG1(off) RG2(on) RG2(off) Vdrop Feed-forward Ri(RHV) Ii(RHV) input resistance at pin RHV operating range of input current at pin RHV UBA2021_4 © NXP B.V. 2008. All rights reserved. Parameter clamp current starting frequency conducting time T1 and T2 charge current at pin CI discharge current at pin CI preheat time charge current at pin CP discharge current at pin CP peak voltage difference at pin CP control voltage at pin RS charge current at pin CI bottom frequency ignition time bottom frequency conducting time T1 and T2 non-overlap conductance time total supply current capacitive mode control voltage reference voltage on voltage at pin G1 off voltage at pin G1 on voltage at pin G2 off voltage at pin G2 high side driver on resistance high side driver off resistance Conditions VVS < 17 V VCI = 0 V fstart = 108 kHz VCI = 1.5 V; VRS = −0.3 V VCI = 1.5 V; VRS = −0.9 V VCP = 1 V VCP = 1 V when timing [3] Min 98 38 79 599 −636 0.8 41.21 Typ 14 108 3.2 44 93 666 6 5.95 2.5 −600 1 42.9 625 42.9 10.2 1.4 1 20 2.5 126 75 126 75 1 Max 35 118 50 107 733 −564 1.2 44.59 1.75 1.1 40 2.575 0.3 0.3 152 90 152 90 1.4 Unit mA kHz µs µA µA ms µA µA V mV µA kHz µs kHz µs µs mA mV V V V V V Ω Ω Ω Ω V Frequency sweep to ignition VCI = 1.5 V; f ≈ 85 kHz VCI at clamp level Normal operation fB = 43 kHz 1.05 fB = 43 kHz [4] [5] 0.85 0 2.425 10.5 10.5 - [6] IG1 = 1 mA IG1 = 1 mA IG2 = 1 mA IG2 = 1 mA V(G1 - S1) = 3 V V(G1 - S1) = 3 V [7] 100 60 100 60 0.6 [7] low side driver on resistance VG2 = 3 V low side driver off resistance VG2 = 3 V voltage drop at bootstrap switch IFS = 5 mA [7] [7] [8] 1.54 0 2.2 - 2.86 1000 kΩ µA Product data sheet Rev. 04 — 25 July 2008 9 of 16 NXP Semiconductors UBA2021 630 V driver IC for CFL and TL lamps Table 7. Characteristics …continued VVS = 11 V; VFS - VS1 = 11 V; Tamb = 25 °C; all voltages referenced to ground; unless otherwise specified. See Figure 8. Symbol fff SYMff RR RCP(sw) RAV [1] [2] [3] [4] [5] [6] [7] [8] [9] Parameter feed-forward frequency symmetry ripple rejection CP switch series resistance averaging resistor Conditions IRHV = 0.75 mA IRHV = 1 mA IRHV = 1 mA fVin = 100 Hz ICP = 100 µA ICP = 10 µA [9] Min 60.4 80.3 0.9 0.75 22.4 Typ 63.6 84.5 1 6 1.5 32 Max 66.15 88.2 1.1 2.25 41.6 Unit kHz kHz dB kΩ kΩ The start-up supply current is specified in a temperature (Tvj) range of 0 °C to 125 °C. For Tvj < 0 °C and Tvj >125 °C the start-up supply current is < 350 µA. The clamp margin is defined as the voltage difference between turn-on of the clamp and start of oscillation. The clamp is in the off-state at start of oscillation. Data sampling of VRS(ctrl) is performed at the end of conduction of T2. The total supply current is specified in a temperature (Tvj) range of −20 °C to +125 °C. For Tvj < −20 °C and Tvj >125 °C the total supply current is < 1.5 mA. Data sampling of VRS(cap) is performed at the start of conduction of T2. Within the allowed range of RRREF, defined as 30 kΩ +10 %. Typical values for the on and off resistances at Tvj = 87.5 °C are: RG2(on) and RG1(on) = 164 Ω, RG2(off) and RG1(off) = 100 Ω. The input current at RHV pin may increase to 1600 µA during voltage transient at Vin. Only for currents IRHV beyond approximately 550 µA is the oscillator frequency proportional to IRHV. The symmetry SYMff is calculated from the quotient SYMff = T1tot / T2tot, with T1tot the time between turn-off of G2 and turn-off of G1, and T2tot the time between turn-off of G1 and turn-off of G2. 11. Design information 11.1 Design equations • Bottom frequency: 1 f B = ----------------------------------------------------------------------------------------------------------------------2 × { [ ( C CF + C par ) × ( X 1 × R RREF – R int ) ] + τ } (1) • Feed-forward frequency: 1 f ff = ------------------------------------------------------------------------------------------------------------------------X 2 × V RREF   2 ×  ( C CF + C par ) ×  ----------------------------- – R int + τ   I i ( RHV )    (2) • Where: – X1 = 3.68. – X2 = 22.28. – τ = 0.4 µs. – Rint = 3 kΩ. – Cpar = 4.7 pF • Operating frequency is the maximum of fB, fff or fcm. UBA2021_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 25 July 2008 10 of 16 NXP Semiconductors UBA2021 630 V driver IC for CFL and TL lamps • • • • Where: fB = bottom frequency. fff = feed-forward frequency. fcm = frequency due to capacitive mode detection. C 150nF 16 R 30K Ω CP RREF • Preheat time: t ph = ---------------- × --------------- • Ignition time: t ign = 15 × t ph ----RREF • Non-overlap time: t no = 1.4 µ s × --------------- R 30k Ω 12. Application information L1 Vin RRHV 490 kΩ DS1 DS2 C3 T1 G1 lamp S1 2 RHV CI 13 14 CCI 100 nF R1 3 8 CP CCP 100 nF mains supply L2 C2 C5 CS7 100 nF FS Cboot 1 UBA2021 12 CF CCF 100 pF T2 G2 DS7 6 10 RREF RRREF 30 kΩ VS CS9 DS3 DS4 C4 CS4 Rshunt DS6 5 7 PGND 9 11 RS SGND mgs994 Fig 7. Application diagram UBA2021_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 25 July 2008 11 of 16 NXP Semiconductors UBA2021 630 V driver IC for CFL and TL lamps 13. Package outline DIP14: plastic dual in-line package; 14 leads (300 mil) SOT27-1 D seating plane ME A2 A L A1 c Z e b1 b 14 8 MH wM (e 1) pin 1 index E 1 7 0 5 scale 10 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.02 A2 max. 3.2 0.13 b 1.73 1.13 0.068 0.044 b1 0.53 0.38 0.021 0.015 c 0.36 0.23 0.014 0.009 D (1) 19.50 18.55 0.77 0.73 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.1 e1 7.62 0.3 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 2.2 0.087 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT27-1 REFERENCES IEC 050G04 JEDEC MO-001 JEITA SC-501-14 EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-13 Fig 8. UBA2021_4 DIP14: plastic dual in-line package; © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 25 July 2008 12 of 16 NXP Semiconductors UBA2021 630 V driver IC for CFL and TL lamps SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 D E A X c y HE vMA Z 14 8 Q A2 pin 1 index θ Lp 1 e bp 7 wM L detail X A1 (A 3) A 0 2.5 scale 5 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 8.75 8.55 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.05 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 0.028 0.024 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012 θ inches 0.069 0.010 0.057 0.004 0.049 0.019 0.0100 0.35 0.014 0.0075 0.34 0.244 0.039 0.041 0.228 0.016 8 o 0 o Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT108-1 REFERENCES IEC 076E06 JEDEC MS-012 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 9. UBA2021_4 SO14 plastic small outline package © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 25 July 2008 13 of 16 NXP Semiconductors UBA2021 630 V driver IC for CFL and TL lamps 14. Revision history Table 8. Revision history Release date 20080725 Data sheet status Product data sheet Change notice Supersedes UBA2021_3 Document ID UBA2021_4 Modifications: • • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Product data sheet Product data sheet Product data sheet UBA2021_2 UBA2021_1 - UBA2021_3 UBA2021_2 UBA2021_1 20080802 20010130 20000724 UBA2021_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 25 July 2008 14 of 16 NXP Semiconductors UBA2021 630 V driver IC for CFL and TL lamps 15. Legal information 15.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 15.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 15.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental 15.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 16. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com UBA2021_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 25 July 2008 15 of 16 NXP Semiconductors UBA2021 630 V driver IC for CFL and TL lamps 17. Contents 1 2 3 4 5 6 6.1 6.2 7 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 7.9 7.10 7.11 7.12 7.13 7.14 8 9 10 11 11.1 12 13 14 15 15.1 15.2 15.3 15.4 16 17 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Initial start-up . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Oscillation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Operation in the preheat mode . . . . . . . . . . . . . 4 Ignition state . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Failure to ignite . . . . . . . . . . . . . . . . . . . . . . . . . 5 Transition to the burn state . . . . . . . . . . . . . . . . 5 Feed-forward frequency . . . . . . . . . . . . . . . . . . 5 Capacitive mode protection . . . . . . . . . . . . . . . 6 IC supply. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Minimum gate-source voltage of T1 and T2 . . . 6 Frequency and change in frequency. . . . . . . . . 7 Ground pins . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Charge coupling . . . . . . . . . . . . . . . . . . . . . . . . 7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7 Thermal characteristics. . . . . . . . . . . . . . . . . . . 8 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Design information . . . . . . . . . . . . . . . . . . . . . 10 Design equations . . . . . . . . . . . . . . . . . . . . . . 10 Application information. . . . . . . . . . . . . . . . . . 11 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Contact information. . . . . . . . . . . . . . . . . . . . . 15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 25 July 2008 Document identifier: UBA2021_4