UJA1163
Mini high-speed CAN system basis chip with Standby mode
Rev. 2 — 17 April 2014
Product data sheet
1. General description
The UJA1163 is a mini high-speed CAN System Basis Chip (SBC) containing an
ISO 11898-2/5 compliant HS-CAN transceiver and an integrated 5 V/100 mA supply for a
microcontroller. The UJA1163 can be operated in a very low-current Standby mode with
bus wake-up capability and supports ISO 11898-6 compliant autonomous CAN biasing.
The UJA1163 implements the standard CAN physical layer as defined in the current
ISO11898 standard (-2 and -5). Pending the release of the updated version of ISO11898
including CAN FD, additional timing parameters defining loop delay symmetry are
included. This implementation enables reliable communication in the CAN FD fast phase
at data rates up to 2 Mbit/s.
2. Features and benefits
2.1 General
ISO 11898-2 and ISO 11898-5 compliant high-speed CAN transceiver
Loop delay symmetry timing enables reliable communication at data rates up to
2 Mbit/s in the CAN FD fast phase
Autonomous bus biasing according to ISO 11898-6
Fully integrated 5 V/100 mA low-drop voltage regulator for 5 V microcontroller
supply (V1)
Bus connections are truly floating when power to pin BAT is off
2.2 Designed for automotive applications
8 kV ElectroStatic Discharge (ESD) protection, according to the Human Body Model
(HBM) on the CAN bus pins
6 kV ESD protection, according to IEC 61000-4-2 on the CAN bus pins and on pin
BAT
CAN bus pins short-circuit proof to 58 V
Battery and CAN bus pins protected against automotive transients according to
ISO 7637-3
Very low quiescent current in Standby mode with full wake-up capability
Leadless HVSON14 package (3.0 mm 4.5 mm) with improved Automated Optical
Inspection (AOI) capability and low thermal resistance
Dark green product (halogen free and Restriction of Hazardous Substances (RoHS)
compliant)
UJA1163
NXP Semiconductors
Mini high-speed CAN system basis chip with Standby mode
2.3 Low-drop voltage regulator for 5 V microcontroller supply (V1)
5 V nominal output; 2 % accuracy
100 mA output current capability
Current limiting above 150 mA
On-resistance of 5 (max)
Support for microcontroller RAM retention down to a battery voltage of 2 V
Undervoltage reset at 90 % of nominal value
Excellent transient response with a 4.7 F ceramic output capacitor
Short-circuit to GND/overload protection on pin V1
2.4 Power Management
Standby mode featuring very low supply current; voltage V1 remains active to maintain
the supply to the microcontroller
Remote wake-up capability via standard CAN wake-up pattern
2.5 System control and diagnostic features
Mode control via pin STBN
Overtemperature shutdown
Bidirectional reset pin
3. Ordering information
Table 1.
Ordering information
Type number
UJA1163TK
UJA1163
Product data sheet
Package
Name
Description
Version
HVSON14
plastic thermal enhanced very thin small outline package; no
leads; 14 terminals; body 3 ´ 4.5 ´ 0.85 mm
SOT1086-2
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Rev. 2 — 17 April 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
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UJA1163
NXP Semiconductors
Mini high-speed CAN system basis chip with Standby mode
4. Block diagram
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(1) To prevent the bus lines being driven to a permanent dominant state, the transceiver will not switch to CAN Active mode if pin
TXD is held LOW (e.g. by a short-circuit to GND)
Fig 6.
CAN transceiver state machine
6.6 CAN transceiver status pin (CTS)
Pin CTS is driven HIGH to indicate to microcontroller that the transceiver is fully enabled
and data can be transmitted and received via the TXD/RXD pins.
Pin CTS is actively driven LOW:
• while the transceiver is starting up (e.g. during a transition from Standby to Normal) or
• if pin TXD is clamped LOW for t > tto(dom)TXD or
• if an undervoltage is detected on V1
UJA1163
Product data sheet
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Rev. 2 — 17 April 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
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UJA1163
NXP Semiconductors
Mini high-speed CAN system basis chip with Standby mode
6.7 CAN fail-safe features
6.7.1 TXD dominant timeout
A TXD dominant time-out timer is started when pin TXD is forced LOW while the
transceiver is in CAN Active Mode. If the LOW state on pin TXD persists for longer than
the TXD dominant time-out time (tto(dom)TXD), the transmitter is disabled, releasing the bus
lines to recessive state. This function prevents a hardware and/or software application
failure from driving the bus lines to a permanent dominant state (blocking all network
communications). The TXD dominant time-out timer is reset when pin TXD goes HIGH.
The TXD dominant time-out time also defines the minimum possible bit rate of 15 kbit/s.
6.7.2 Pull-up on TXD pin
Pin TXD has an internal pull-up towards V1 to ensure a safe defined recessive driver state
in case the pin is left floating.
6.7.3 Pull-down on STBN pin
Pin STBN has an internal pull-down (to GND) to ensure the UJA1163 switches to Standby
mode if STBN is left floating.
6.7.4 Loss of power at pin BAT
A loss of power at pin BAT has no influence on the bus lines or on the microcontroller. No
reverse currents will flow from the bus.
UJA1163
Product data sheet
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Rev. 2 — 17 April 2014
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UJA1163
NXP Semiconductors
Mini high-speed CAN system basis chip with Standby mode
7. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Vx
voltage on pin x
DC value
voltage between pin
CANH and pin CANL
Vtrt
transient voltage
Max
Unit
V
0.2
+6
pins TXD, RXD, STBN, RSTN
0.2
VV1 + 0.2 V
pin BAT
0.2
+40
V
pins CANH and CANL with respect to any other pin
58
+58
V
40
+40
V
150
+100
V
6
+6
kV
8
+8
kV
on pins BAT
4
+4
kV
on any other pin
2
+2
kV
100
+100
V
750
+750
V
500
+500
V
40
+150
C
55
+150
C
[1]
pin V1
V(CANH-CANL)
Min
[2]
on pins
BAT: via reverse polarity diode and capacitor to
ground
CANL, CANH: coupling via 1 nF capacitors
VESD
electrostatic
discharge voltage
IEC 61000-4-2
[3]
on pins CANH and CANL; pin BAT with capacitor
[4]
HBM
on pins CANH, CANL
[5]
[6]
MM
on any pin
[7]
CDM
on corner pins
on any other pin
Tvj
virtual junction
temperature
Tstg
storage temperature
[8]
[1]
When the device is not powered up, IV1 (max) = 25 mA.
[2]
Verified by an external test house to ensure pins can withstand ISO 7637 part 2 automotive transient test pulses 1, 2a, 3a and 3b.
[3]
ESD performance according to IEC 61000-4-2 (150 pF, 330 ) has been verified by an external test house; the result was equal to or
better than 6 kV.
[4]
Human Body Model (HBM): according to AEC-Q100-002 (100 pF, 1.5 k).
[5]
V1 and BAT connected to GND, emulating the application circuit.
[6]
Machine Model (MM): according to AEC-Q100-003 (200 pF, 0.75 H, 10 ).
[7]
Charged Device Model (CDM): according to AEC-Q100-011 (field Induced charge; 4 pF).
[8]
In accordance with IEC 60747-1. An alternative definition of virtual junction temperature is: Tvj = Tamb + P Rth(j-a), where Rth(j-a) is a
fixed value used in the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (P) and ambient
temperature (Tamb).
UJA1163
Product data sheet
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Rev. 2 — 17 April 2014
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UJA1163
NXP Semiconductors
Mini high-speed CAN system basis chip with Standby mode
8. Thermal characteristics
Table 5.
Symbol
Rth(vj-a)
[1]
Thermal characteristics
Parameter
Conditions
[1]
thermal resistance from virtual junction to ambient
Typ
Unit
60
K/W
According to JEDEC JESD51-2, JESD51-5 and JESD51-7 at natural convection on 2s2p board. Board with two inner copper layers
(thickness: 35 m) and thermal via array under the exposed pad connected to the first inner copper layer (thickness: 70 m).
9. Static characteristics
Table 6.
Static characteristics
Tvj = 40 C to +150 C; VBAT = 3 V to 28 V; R(CANH-CANL) = 60 ; all voltages are defined with respect to ground; positive
currents flow into the IC; typical values are given at VBAT = 13 V; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Supply; pin BAT
Vth(det)pon
power-on detection threshold
voltage
VBAT rising
4.2
-
4.55
V
Vth(det)poff
power-off detection threshold
voltage
VBAT falling
2.8
-
3
V
Vuvr(CAN)
CAN undervoltage recovery
voltage
VBAT rising
4.5
-
5
V
Vuvd(CAN)
CAN undervoltage detection
voltage
VBAT falling
4.2
-
4.55
V
IBAT
battery supply current
Standby mode; IV1 = 0 A;
40 C < Tvj < 85 C;
VBAT = 7 V to 18 V
-
60
85
A
Normal mode;
CAN Active mode; CAN
recessive; VTXD = VV1
-
4
7.5
mA
Normal mode;
CAN Active mode; CAN
dominant; VTXD = 0 V
-
46
67
mA
VBAT = 5.5 V to 18 V;
IV1 = 120 mA to 0 mA;
VTXD = VV1
4.9
5
5.1
V
VBAT = 5.65 V to 18 V;
IV1 = 150 mA to 0 mA;
VTXD = VV1
4.9
5
5.1
V
VBAT = 5.65 V to 18 V;
IV1 = 100 mA to 0 mA;
VTXD = 0 V; VCANH = 0 V
4.9
5
5.1
V
VBAT = 2 V to 3 V; IV1 = 2 mA
-
-
100
mV
10
mV
Voltage source: pin V1
VO
Vret(RAM)
output voltage
RAM retention voltage difference
VBAT = 2 V to 3 V;
IV1 = 200 A
R(BAT-V1)
resistance between pin BAT and
pin V1
UJA1163
Product data sheet
VBAT = 4 V to 6 V;
IV1 = 120 mA; Tvj < 150 C
-
-
5
VBAT = 3 V to 4 V; IV1 = 40 mA
-
2.625
-
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Rev. 2 — 17 April 2014
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UJA1163
NXP Semiconductors
Mini high-speed CAN system basis chip with Standby mode
Table 6.
Static characteristics …continued
Tvj = 40 C to +150 C; VBAT = 3 V to 28 V; R(CANH-CANL) = 60 ; all voltages are defined with respect to ground; positive
currents flow into the IC; typical values are given at VBAT = 13 V; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Vuvd
undervoltage detection voltage
Vuvd(nom) = 90 %
4.5
-
4.75
V
Vuvr
undervoltage recovery voltage
4.5
-
4.75
V
IO(sc)
short-circuit output current
300
-
150
mA
Standby mode control input; pin STBN
Vth(sw)
switching threshold voltage
0.25VV1
-
0.75VV1
V
Rpd
pull-down resistance
40
60
80
k
CAN transmit data input; pin TXD
Vth(sw)
switching threshold voltage
0.25VV1
-
0.75VV1
V
Rpu
pull-up resistance
40
60
80
k
CAN transmitter status; pin CTS
IOH
HIGH-level output current
VCTS = VV1 0.4 V;
transmitter on
-
-
4
mA
IOL
LOW-level output current
VCTS = 0.4 V;
transmitter off
4
-
-
mA
CAN receive data output; pin RXD
VOH
HIGH-level output voltage
IOH = 4 mA
VV1 0.4 -
-
V
VOL
LOW-level output voltage
IOL = 4 mA
-
-
0.4
V
Rpu
pull-up resistance
CAN Offline mode
40
60
80
k
2.75
3.5
4.5
V
0.5
1.5
2.25
V
0.9VV1
-
1.1VV1
V
High-speed CAN bus lines; pins CANH and CANL
VO(dom)
dominant output voltage
CAN Active mode;
VV1 = 4.5 V to 5.5 V;
VTXD = 0 V;
pin CANH
pin CANL
VTXsym
transmitter voltage symmetry
VTXsym = VCANH + VCANL;
fTXD = 250 kHz;
CSPLIT = 4.7 nF
[1]
[2]
Vdom(TX)sym
transmitter dominant voltage
symmetry
Vdom(TX)sym =
VV1 VCANH VCANL; VV1 = 5 V
400
-
+400
mV
VO(dif)bus
bus differential output voltage
CAN Active mode (dominant);
VTXD = 0 V;
VV1 = 4.75 V to 5.5 V;
R(CANH-CANL) = 45 to 65
1.5
-
3.0
V
CAN Active mode (recessive);
CAN Offline mode;
VTXD = VV1; Tvj < 150 C;
R(CANH-CANL) = no load
50
-
+50
mV
CAN Active mode; VTXD = VV1
R(CANH-CANL) = no load
2
0.5VV1
3
V
CAN Offline mode;
R(CANH-CANL) = no load
0.1
-
+0.1
V
CAN Offline Bias mode;
R(CANH-CANL) = no load;
VV1 = 0 V
2
2.5
3
V
VO(rec)
recessive output voltage
UJA1163
Product data sheet
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Rev. 2 — 17 April 2014
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UJA1163
NXP Semiconductors
Mini high-speed CAN system basis chip with Standby mode
Table 6.
Static characteristics …continued
Tvj = 40 C to +150 C; VBAT = 3 V to 28 V; R(CANH-CANL) = 60 ; all voltages are defined with respect to ground; positive
currents flow into the IC; typical values are given at VBAT = 13 V; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
IO(dom)
dominant output current
CAN Active mode;
VTXD = 0 V; VV1 = 5 V
pin CANH; VCANH = 0 V
50
-
-
mA
pin CANL; VCANL = 5 V
-
-
52
mA
IO(rec)
recessive output current
VCANL = VCANH = 27 V to
+32 V; VTXD = VV1
3
-
+3
mA
Vth(RX)dif
differential receiver threshold
voltage
CAN Active mode; VCANL =
VCANH = 12 V to +12 V
0.5
0.7
0.9
V
CAN Offline mode; VCANL =
VCANH = 12 V to +12 V
0.4
0.7
1.15
V
CAN Active mode; VCANL =
VCANH = 12 V to +12 V
50
200
400
mV
9
15
28
k
Vhys(RX)dif
differential receiver hysteresis
voltage
Ri(cm)
common-mode input resistance
Ri
input resistance deviation
Ri(dif)
differential input resistance
Ci(cm)
common-mode input capacitance
Ci(dif)
differential input capacitance
ILI
input leakage current
1
-
+1
%
19
30
52
k
[1]
-
-
20
pF
[1]
-
-
10
pF
5
-
+5
A
VCANL = VCANH = 12 V to
+12 V
VBAT = VV1 = 0 V or
VBAT = VV1 = shorted to ground
via 47 k; VCANH = VCANL = 5 V
Temperature protection
Tth(act)otp
overtemperature protection
activation threshold temperature
167
177
187
C
Tth(rel)otp
overtemperature protection
release threshold temperature
127
137
147
C
0
-
0.2VV1
V
Reset output; pin RSTN
VOL
LOW-level output voltage
Rpu
pull-up resistance
40
60
80
k
Vth(sw)
switching threshold voltage
0.25VV1
-
0.75VV1
V
VV1 = 1.0 V to 5.5 V; pull-up
resistor to VV1 900
[1]
Not tested in production; guaranteed by design.
[2]
The test circuit used to measure the bus output voltage symmetry (which includes CSPLIT) is shown in Figure 11.
UJA1163
Product data sheet
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Rev. 2 — 17 April 2014
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UJA1163
NXP Semiconductors
Mini high-speed CAN system basis chip with Standby mode
10. Dynamic characteristics
Table 7.
Dynamic characteristics
Tvj = 40 C to +150 C; VBAT = 3 V to 28 V; R(CANH-CANL) = 60 ; all voltages are defined with respect to ground; positive
currents flow into the IC; typical values are given at VBAT = 13 V; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
from VBAT exceeding the
power-on detection threshold
until VV1 exceeds the 90 %
undervoltage threshold;
CV1 = 4.7 F
-
2.8
4.7
ms
6
-
54
s
-
-
63
s
-
-
255
ns
-
-
350
ns
Voltage source; pin V1
tstartup
start-up time
td(uvd)
undervoltage detection delay time
td(uvd-RSTNL)
delay time from undervoltage
detection to RSTN LOW
undervoltage on V1
CAN transceiver timing; pins CANH, CANL, TXD and RXD
td(TXD-RXD)
delay time from TXD to RXD
RL = 60 ; CL = 100 pF;
50 % VTXD to 50 % VRXD;
CRXD = 15 pF;
fTXD = 250 kHz
RL = 120 ; CL = 200 pF;
50 % VTXD to 50 % VRXD;
CRXD = 15 pF;
fTXD = 250 kHz
[1]
td(TXD-busdom)
delay time from TXD to bus
dominant
-
80
-
ns
td(TXD-busrec)
delay time from TXD to bus
recessive
-
80
-
ns
td(busdom-RXD)
delay time from bus dominant to
RXD
CRXD = 15 pF
-
105
-
ns
td(busrec-RXD)
delay time from bus recessive to
RXD
CRXD = 15 pF
-
120
-
ns
tbit(RXD)
bit time on pin RXD
tbit(TXD) = 500 ns
400
-
550
ns
twake(busdom)
bus dominant wake-up time
first pulse (after first
recessive) for wake-up on
pins CANH and CANL;
CAN Offline mode
0.5
-
3.0
s
second pulse for wake-up on
pins CANH and CANL
0.5
-
3.0
s
first pulse for wake-up on pins
CANH and CANL;
CAN Offline mode
0.5
-
3.0
s
second pulse (after first
dominant) for wake-up on
pins CANH and CANL
0.5
-
3.0
s
twake(busrec)
bus recessive wake-up time
[2]
tto(wake)
wake-up time-out time
between first and second
dominant pulses; CAN Offline
mode
570
-
850
s
tto(dom)TXD
TXD dominant time-out time
CAN Active mode;
VTXD = 0 V
2.7
-
3.3
ms
UJA1163
Product data sheet
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Rev. 2 — 17 April 2014
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UJA1163
NXP Semiconductors
Mini high-speed CAN system basis chip with Standby mode
Table 7.
Dynamic characteristics …continued
Tvj = 40 C to +150 C; VBAT = 3 V to 28 V; R(CANH-CANL) = 60 ; all voltages are defined with respect to ground; positive
currents flow into the IC; typical values are given at VBAT = 13 V; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
tto(silence)
bus silence time-out time
recessive time measurement
started in all CAN modes;
RL = 120
0.95
-
1.17
s
td(busact-bias)
delay time from bus active to bias
-
-
200
s
tstartup(CAN)
CAN start-up time
-
-
220
s
20
-
25
ms
when switching to Active
mode (CTS = HIGH)
Pin RSTN: reset pulse width
tw(rst)
reset pulse width
output pulse width
cold start
warm start
input pulse width
[1]
Guaranteed by design.
[2]
See Figure 8.
1
-
1.5
ms
18
-
-
s
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92 GLI EXV
9
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WG 7;'5;'
Fig 7.
UJA1163
Product data sheet
WG EXVUHF5;'
WG 7;'5;'
DDD
CAN transceiver timing diagram
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Rev. 2 — 17 April 2014
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UJA1163
NXP Semiconductors
Mini high-speed CAN system basis chip with Standby mode
7;'
[WELW 7;'
WELW 7;'
5;'
WELW 5;'
DDD
Fig 8.
UJA1163
Product data sheet
Loop delay symmetry timing diagram
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Rev. 2 — 17 April 2014
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UJA1163
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Mini high-speed CAN system basis chip with Standby mode
11. Application information
11.1 Application diagram
BAT
(1)
22 μF
V1
BAT
3
10
5
RSTN
RSTN
VCC
MICROCONTROLLER
6
UJA1163
GND
14
2
4
13
12
CANH
RT (2)
1
CTS
STBN
RXD
TXD
standard
μC port
RXD
TXD
VSS
CANL
RT (2)
e.g.
4.7 nF
aaa-008446
(1) Actual capacitance value must be a least 1.76 F with 5 V DC offset (recommended capacitor value is 4.7 F)
(2) For bus line end nodes, RT = 60 in order to support the ‘split termination concept’. For sub-nodes, an optional ‘weak’
termination of e.g. RT = 1.3 k can be used, if required by the OEM.
Fig 9.
Typical application using the UJA1163
11.2 Application hints
Further information on the application of the UJA1163 can be found in the NXP application
hints document AH1306 Application Hints - Mini high speed CAN system basis chips
UJA1163 / UJA1164 / UJA1167 / UJA1168.
UJA1163
Product data sheet
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Rev. 2 — 17 April 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
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UJA1163
NXP Semiconductors
Mini high-speed CAN system basis chip with Standby mode
12. Test information
BAT
RXD
CANH
RL
SBC
15 pF
TXD
100 pF
CANL
GND
015aaa369
Fig 10. Timing test circuit for CAN transceiver
10
1
BAT
TXD
CANH
13
30 Ω
f = 250 kHz
CSPLIT
4.7 nF
SBC
4
RXD
CANL
30 Ω
12
GND
2
015aaa444
Fig 11. Test circuit for measuring transceiver driver symmetry
12.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q100 Rev-G - Failure mechanism based stress test qualification for
integrated circuits, and is suitable for use in automotive applications.
UJA1163
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 17 April 2014
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Mini high-speed CAN system basis chip with Standby mode
13. Package outline
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Fig 12. Package outline SOT1086-2 (HVSON14)
UJA1163
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 17 April 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
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Mini high-speed CAN system basis chip with Standby mode
14. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling ensure that the appropriate precautions are taken as
described in JESD625-A or equivalent standards.
15. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
15.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
15.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
15.3 Wave soldering
Key characteristics in wave soldering are:
UJA1163
Product data sheet
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Rev. 2 — 17 April 2014
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NXP Semiconductors
Mini high-speed CAN system basis chip with Standby mode
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
15.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 13) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 8 and 9
Table 8.
SnPb eutectic process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
350
< 2.5
235
220
2.5
220
220
Table 9.
Lead-free process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 13.
UJA1163
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 17 April 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
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NXP Semiconductors
Mini high-speed CAN system basis chip with Standby mode
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 13. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
16. Soldering of HVSON packages
Section 15 contains a brief introduction to the techniques most commonly used to solder
Surface Mounted Devices (SMD). A more detailed discussion on soldering HVSON
leadless package ICs can found in the following application notes:
• AN10365 ‘Surface mount reflow soldering description”
• AN10366 “HVQFN application information”
UJA1163
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 17 April 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
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Mini high-speed CAN system basis chip with Standby mode
17. Revision history
Table 10.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
UJA1163 v.2
20140417
Product data sheet
-
UJA1163 v.1
Modifications:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
UJA1163 v.1
UJA1163
Product data sheet
Section 1: text revised (2nd paragraph added)
Section 2.1: feature added (loop delay symmetry)
Figure 1: amended
Table 2: CTS pin description changed; table note amended
Section 6.1.1.5: text revised (2nd paragraph)
Table 3: row CAN revised
Section 6.2.1: text revised
Section 6.2.2: text revised
Section 6.5: text revised
Section 6.6: text revised
Table 7: conditions revised for symbol tstartup; parameter values changed: td(uvd) and td(uvd-RSTNL) for
pin V1; parameter tbit(RXD) added; additional measurement for parameter td(TXD-RXD); parameter tfltr(rst)
renamed to tw(rst) and value changed
Figure 8: added
Section 11.2: added
Section 12.1: text updated
20131001
Product data sheet
-
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 17 April 2014
-
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18. Legal information
18.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
18.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
18.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
UJA1163
Product data sheet
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 17 April 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
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Mini high-speed CAN system basis chip with Standby mode
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
UJA1163
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 17 April 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
28 of 29
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Mini high-speed CAN system basis chip with Standby mode
20. Contents
1
2
2.1
2.2
2.3
2.4
2.5
3
4
5
5.1
5.2
6
6.1
6.1.1
6.1.1.1
6.1.1.2
6.1.1.3
6.1.1.4
6.1.1.5
6.1.1.6
6.1.2
6.2
6.2.1
6.2.2
6.2.3
6.3
6.4
6.4.1
6.4.2
6.5
6.5.1
6.5.1.1
6.5.1.2
6.5.1.3
6.5.2
6.6
6.7
6.7.1
6.7.2
6.7.3
6.7.4
7
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Designed for automotive applications. . . . . . . . 1
Low-drop voltage regulator for 5 V
microcontroller supply (V1) . . . . . . . . . . . . . . . . 2
Power Management . . . . . . . . . . . . . . . . . . . . . 2
System control and diagnostic features . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 4
System controller . . . . . . . . . . . . . . . . . . . . . . . 4
Operating modes . . . . . . . . . . . . . . . . . . . . . . . 4
Normal mode . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Standby mode. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Reset mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Off mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Overtemp mode . . . . . . . . . . . . . . . . . . . . . . . . 6
Hardware characterization for the UJA1163
operating modes . . . . . . . . . . . . . . . . . . . . . . . . 7
Mode control via pin STBN . . . . . . . . . . . . . . . . 7
System reset. . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Characteristics of pin RSTN . . . . . . . . . . . . . . . 7
Output reset pulse width . . . . . . . . . . . . . . . . . . 7
Reset sources. . . . . . . . . . . . . . . . . . . . . . . . . . 8
Global temperature protection . . . . . . . . . . . . . 8
Power supplies . . . . . . . . . . . . . . . . . . . . . . . . . 8
Battery supply voltage (VBAT) . . . . . . . . . . . . . . 8
Low-drop voltage supply for 5 V
microcontroller (V1) . . . . . . . . . . . . . . . . . . . . . 8
High-speed CAN transceiver . . . . . . . . . . . . . . 8
CAN operating modes . . . . . . . . . . . . . . . . . . . 9
CAN Active mode . . . . . . . . . . . . . . . . . . . . . . . 9
CAN Offline and Offline Bias modes. . . . . . . . . 9
CAN Off mode . . . . . . . . . . . . . . . . . . . . . . . . 10
CAN standard wake-up. . . . . . . . . . . . . . . . . . 10
CAN transceiver status pin (CTS). . . . . . . . . . 11
CAN fail-safe features . . . . . . . . . . . . . . . . . . 12
TXD dominant timeout . . . . . . . . . . . . . . . . . . 12
Pull-up on TXD pin . . . . . . . . . . . . . . . . . . . . . 12
Pull-down on STBN pin . . . . . . . . . . . . . . . . . 12
Loss of power at pin BAT . . . . . . . . . . . . . . . . 12
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 13
8
9
10
11
11.1
11.2
12
12.1
13
14
15
15.1
15.2
15.3
15.4
16
17
18
18.1
18.2
18.3
18.4
19
20
Thermal characteristics . . . . . . . . . . . . . . . . .
Static characteristics . . . . . . . . . . . . . . . . . . .
Dynamic characteristics. . . . . . . . . . . . . . . . .
Application information . . . . . . . . . . . . . . . . .
Application diagram . . . . . . . . . . . . . . . . . . . .
Application hints . . . . . . . . . . . . . . . . . . . . . . .
Test information . . . . . . . . . . . . . . . . . . . . . . .
Quality information . . . . . . . . . . . . . . . . . . . . .
Package outline. . . . . . . . . . . . . . . . . . . . . . . .
Handling information . . . . . . . . . . . . . . . . . . .
Soldering of SMD packages . . . . . . . . . . . . . .
Introduction to soldering. . . . . . . . . . . . . . . . .
Wave and reflow soldering. . . . . . . . . . . . . . .
Wave soldering . . . . . . . . . . . . . . . . . . . . . . .
Reflow soldering . . . . . . . . . . . . . . . . . . . . . .
Soldering of HVSON packages . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . .
Legal information . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information . . . . . . . . . . . . . . . . . . . .
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14
14
17
20
20
20
21
21
22
23
23
23
23
23
24
25
26
27
27
27
27
28
28
29
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2014.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 17 April 2014
Document identifier: UJA1163
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