UJA1167
Mini high-speed CAN system basis chip with Standby/Sleep
modes & watchdog
Rev. 2 — 18 April 2014
Product data sheet
1. General description
The UJA1167 is a mini high-speed CAN System Basis Chip (SBC) containing an
ISO 11898-2/5 compliant HS-CAN transceiver and an integrated 5 V/100 mA supply for a
microcontroller. It also features a watchdog and a Serial Peripheral Interface (SPI). The
UJA1167 can be operated in very low-current Standby and Sleep modes with bus and
local wake-up capability and supports ISO 11898-6 compliant autonomous CAN biasing.
The microcontroller supply is switched off in Sleep mode. The UJA1167TK version
contains a battery-related high-voltage output (INH) for controlling an external voltage
regulator, while the UJA1167TK/VX is equipped with a 5 V sensor supply (VEXT).
The UJA1167 implements the standard CAN physical layer as defined in the current
ISO11898 standard (-2 and -5). Pending the release of the updated version of ISO11898
including CAN FD, additional timing parameters defining loop delay symmetry are
included. This implementation enables reliable communication in the CAN FD fast phase
at data rates up to 2 Mbit/s.
A number of configuration settings are stored in non-volatile memory, allowing the SBC to
be adapted for use in a specific application. This makes it possible to configure the
power-on behavior of the UJA1167 to meet the requirements of different applications.
2. Features and benefits
2.1 General
ISO 11898-2 and ISO 11898-5 compliant high-speed CAN transceiver
Loop delay symmetry timing enables reliable communication at data rates up to
2 Mbit/s in the CAN FD fast phase
Autonomous bus biasing according to ISO 11898-6
Fully integrated 5 V/100 mA low-drop voltage regulator for 5 V microcontroller
supply (V1)
Bus connections are truly floating when power to pin BAT is off
2.2 Designed for automotive applications
8 kV ElectroStatic Discharge (ESD) protection, according to the Human Body Model
(HBM) on the CAN bus pins
6 kV ESD protection, according to IEC 61000-4-2 on the CAN bus pins, the sensor
supply output VEXT and on pins BAT and WAKE
CAN bus pins short-circuit proof to 58 V
UJA1167
NXP Semiconductors
Mini high-speed CAN system basis chip with Standby/Sleep modes &
watchdog
Battery and CAN bus pins protected against automotive transients according to
ISO 7637-3
Very low quiescent current in Standby and Sleep modes with full wake-up capability
Leadless HVSON14 package (3.0 mm 4.5 mm) with improved Automated Optical
Inspection (AOI) capability and low thermal resistance
Dark green product (halogen free and Restriction of Hazardous Substances (RoHS)
compliant)
2.3 Low-drop voltage regulator for 5 V microcontroller supply (V1)
5 V nominal output; 2 % accuracy
100 mA output current capability
Current limiting above 150 mA
On-resistance of 5 (max)
Support for microcontroller RAM retention down to a battery voltage of 2 V
Undervoltage reset with selectable detection thresholds: 60 %, 70 %, 80 % or 90 % of
output voltage
Excellent transient response with a 4.7 F ceramic output capacitor
Short-circuit to GND/overload protection on pin V1
Turned off in Sleep mode
2.4 Power Management
Standby mode featuring very low supply current; voltage V1 remains active to maintain
the supply to the microcontroller
Sleep mode featuring very low supply current with voltage V1 switched off
Remote wake-up capability via standard CAN wake-up pattern
Local wake-up via the WAKE pin
Wake-up source recognition
Local and/or remote wake-up can be disabled to reduce current consumption
High-voltage output (INH) for controlling an external voltage (UJA1167TK)
2.5 System control and diagnostic features
Mode control via the Serial Peripheral Interface (SPI)
Overtemperature warning and shutdown
Watchdog with independent clock source
Watchdog can be operated in Window, Timeout and Autonomous modes
Optional cyclic wake-up in watchdog Timeout mode
Watchdog automatically re-enabled when wake-up event captured
Watchdog period selectable between 8 ms and 4 s
Supports remote flash programming via the CAN bus
16-, 24- and 32-bit SPI for configuration, control and diagnosis
Bidirectional reset pin with variable power-on reset length to support a variety of
microcontrollers
Configuration of selected functions via non-volatile memory
UJA1167
Product data sheet
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Rev. 2 — 18 April 2014
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UJA1167
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Mini high-speed CAN system basis chip with Standby/Sleep modes &
watchdog
2.6 Sensor supply voltage (pin VEXT of UJA1167TK/VX)
5 V nominal output; 2 % accuracy
30 mA output current capability
Current limiting above 30 mA
Excellent transient response with a 4.7 F ceramic output load capacitor
Protected against short-circuits to GND and to the battery
High ESD robustness of 6 kV according to IEC 61000-4-2
Can handle negative voltages as low as 18 V
3. Ordering information
Table 1.
Ordering information
Type number[1]
UJA1167TK
UJA1167TK/VX
[1]
Package
Name
Description
Version
HVSON14
plastic thermal enhanced very thin small outline package; no
leads; 14 terminals; body 3 4.5 0.85 mm
SOT1086-2
UJA1167TK contains a high-voltage output for controlling an external voltage regulatror; UJA1167TK/VX includes a 5 V/30 mA sensor
supply.
UJA1167
Product data sheet
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3 of 60
UJA1167
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Mini high-speed CAN system basis chip with Standby/Sleep modes &
watchdog
4. Block diagram
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(1) To prevent the bus lines being driven to a permanent dominant state, the transceiver will not switch to CAN Active mode or CAN
Listen-only mode if pin TXD is held LOW (e.g. by a short-circuit to GND)
Fig 5.
CAN transceiver state machine (with FNMC = 0)
6.7.2 CAN standard wake-up
If the CAN transceiver is in Offline mode and CAN wake-up is enabled (CWE = 1), the
UJA1167 will monitor the bus for a wake-up pattern.
A filter at the receiver input prevents unwanted wake-up events occurring due to
automotive transients or EMI. A dominant-recessive-dominant wake-up pattern must be
transmitted on the CAN bus within the wake-up timeout time (tto(wake)) to pass the wake-up
filter and trigger a wake-up event (see Figure 6; note that additional pulses may occur
between the recessive/dominant phases). The recessive and dominant phases must last
at least twake(busrec) and twake(busdom), respectively.
UJA1167
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Mini high-speed CAN system basis chip with Standby/Sleep modes &
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dominant
tdom ≥ twake(busdom)
recessive
dominant
trec ≥ twake(busrec)
tdom ≥ twake(busdom)
twake < tto(wake)
CAN wake-up
015aaa267
Fig 6.
CAN wake-up timing
When a valid CAN wake-up pattern is detected on the bus, wake-up bit CW in the
Transceiver event status register is set (see Table 22) and pin RXD is driven LOW. If the
SBC was in Sleep mode when the wake-up pattern was detected, V1 is enabled to supply
the microcontroller and the SBC switches to Standby mode via Reset mode.
6.7.3 CAN control and Transceiver status registers
Table 14.
Bit
Symbol
Access Value
7:2
reserved
R/W
1:0
CMC
R/W
Table 15.
CAN transceiver operating mode selection (available
when UJA1167 is in Normal mode; MC = 111):
00
Offline mode
01
Active mode (when the SBC is in Normal mode);
V1/CAN undervoltage detection active
10
Active mode (when the SBC is in Normal mode);
V1/CAN undervoltage detection disabled
11
Listen-only mode
Transceiver status register (address 22h)
Symbol
Access Value
Description
7
CTS
R
0
CAN transceiver not in Active mode
1
CAN transceiver in Active mode
6:4
reserved
R
-
3
CBSS
R
0
CAN bus active (communication detected on bus)
1
CAN bus inactive (for longer than tto(silence))
2
reserved
R
-
1
VCS[1]
R
0
the output voltage on V1 is above the 90 % threshold
1
the output voltage on V1 is below the 90 % threshold
0
no TXD dominant timeout event detected
1
CAN transmitter disabled due to a TXD dominant
timeout event
[1]
Product data sheet
Description
-
Bit
0
UJA1167
CAN control register (address 20h)
CFS
R
Only active when CMC = 01.
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Mini high-speed CAN system basis chip with Standby/Sleep modes &
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6.8 CAN fail-safe features
6.8.1 TXD dominant timeout
A TXD dominant time-out timer is started when pin TXD is forced LOW while the
transceiver is in CAN Active Mode. If the LOW state on pin TXD persists for longer than
the TXD dominant time-out time (tto(dom)TXD), the transmitter is disabled, releasing the bus
lines to recessive state. This function prevents a hardware and/or software application
failure from driving the bus lines to a permanent dominant state (blocking all network
communications). The TXD dominant time-out timer is reset when pin TXD goes HIGH.
The TXD dominant time-out time also defines the minimum possible bit rate of 15 kbit/s.
When the TXD dominant time-out time is exceeded, a CAN failure event is captured
(CF = 1; see Table 22), if enabled (CFE = 1; see Table 26). In addition, the status of the
TXD dominant timeout can be read via the CFS bit in the Transceiver status register
(Table 15) and bit CTS is cleared.
6.8.2 Pull-up on TXD pin
Pin TXD has an internal pull-up towards V1 to ensure a safe defined recessive driver state
in case the pin is left floating.
6.8.3 V1 undervoltage event
A CAN failure event is captured (CF = 1), if enabled, when the supply to the CAN
transceiver (V1) falls below 90 % of its nominal value. In addition, status bit VCS is set
to 1.
6.8.4 Loss of power at pin BAT
A loss of power at pin BAT has no influence on the bus lines or on the microcontroller. No
reverse currents will flow from the bus.
6.9 Local wake-up via WAKE pin
Local wake-up is enabled via bits WPRE and WPFE in the WAKE pin event capture
enable register (see Table 27). A wake-up event is triggered by a LOW-to-HIGH (if
WPRE = 1) and/or a HIGH-to-LOW (if WPFE = 1) transition on the WAKE pin. This
arrangement allows for maximum flexibility when designing a local wake-up circuit. In
applications that don’t make use of the local wake-up facility, local wake-up should be
disabled and the WAKE pin connected to GND to ensure optimal EMI performance.
Table 16.
WAKE status register (address 4Bh)
Bit
Symbol
Access
Value
7:2
reserved
R
-
1
WPVS
R
0
reserved
R
Description
WAKE pin status:
0
voltage on WAKE pin below switching threshold (Vth(sw))
1
voltage on WAKE pin above switching threshold (Vth(sw))
-
While the SBC is in Normal mode, the status of the voltage on pin WAKE can always be
read via bit WPVS. Otherwise, WPVS is only valid if local wake-up is enabled (WPRE = 1
and/or WPFE = 1).
UJA1167
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Mini high-speed CAN system basis chip with Standby/Sleep modes &
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6.10 Wake-up and interrupt event diagnosis via pin RXD
Wake-up and interrupt event diagnosis in the UJA1167 is intended to provide the
microcontroller with information on the status of a range of features and functions. This
information is stored in the event status registers (Table 20 to Table 22) and is signaled on
pin RXD, if enabled.
A distinction is made between regular wake-up events and interrupt events (at least one
regular wake-up source must be enabled to allow the UJA1167 to switch to Sleep mode;
see Section 6.1.1.3).
Table 18.
Table 17.
Regular events
Symbol
Event
Power-on Description
CW
CAN wake-up
disabled
WPR
rising edge on WAKE disabled
pin
a rising-edge wake-up was detected on pin WAKE
WPF
falling edge on WAKE disabled
pin
a falling-edge wake-up was detected on pin WAKE
a CAN wake-up event was detected while the
transceiver was in CAN Offline mode.
Diagnostic events
Symbol
Event
Power-on
Description
PO
power-on
always
enabled
the UJA1167 has exited Off mode (after battery power has been
restored/connected)
OTW
overtemperature warning disabled
the IC temperature has exceeded the overtemperature warning
threshold (not in Sleep mode)
SPIF
SPI failure
disabled
SPI clock count error (only 16-, 24- and 32-bit commands are valid),
illegal WMC, NWP or MC code or attempted write access to locked
register (not in Sleep mode)
WDF
watchdog failure
always
enabled
watchdog overflow in Window or Timeout mode or watchdog triggered
too early in Window mode; a system reset is triggered immediately in
response to a watchdog failure in Window mode; when the watchdog
overflows in Timeout mode, a system reset is only performed if a WDF
is already pending (WDF = 1)
VEXTO[1]
VEXT overvoltage
disabled
VEXT overvoltage detected
VEXTU[1]
VEXT undervoltage
disabled
VEXT undervoltage detected
V1U
V1 undervoltage
disabled
voltage on V1 has dropped below the 90 % undervoltage threshold
when V1 is active (event is not captured in Sleep mode because V1 is
off). V1U event capture is independent of the setting of bits V1RTC.
CBS
CAN bus silence
disabled
no activity on CAN bus for tto(silence) (detected only when CBSE = 1
while bus active)
CF
CAN failure
disabled
one of the following CAN failure events detected:
- CAN transceiver deactivated due to a V1 undervoltage
- CAN transceiver deactivated due to a dominant clamped TXD (not
in Sleep mode)
[1]
UJA1167TK/VX only.
PO and WDF interrupts are always captured. Wake-up and interrupt detection can be
enabled/disabled for the remaining events individually via the event capture enable
registers (Table 24 to Table 26).
UJA1167
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Mini high-speed CAN system basis chip with Standby/Sleep modes &
watchdog
If an event occurs while the associated event capture function is enabled, the relevant
event status bit is set. If the transceiver is in CAN Offline mode with V1 active (SBC
Normal or Standby mode), pin RXD is forced LOW to indicate that a wake-up or interrupt
event has been detected. If the UJA1167 is in sleep mode when the event occurs, the
microcontroller supply, V1, is activated and the SBC switches to Standby mode (via Reset
mode).
The microcontroller can monitor events via the event status registers. An extra status
register, the Global event status register (Table 19), is provided to help speed up software
polling routines. By polling the Global event status register, the microcontroller can quickly
determine the type of event captured (system, supply, transceiver or WAKE pin) and then
query the relevant table (Table 20, Table 21, Table 22 or Table 23 respectively).
After the event source has been identified, the status flag should be cleared (set to 0) by
writing 1 to the relevant bit (writing 0 will have no effect). A number of status bits can be
cleared in a single write operation by writing 1 to all relevant bits.
It is strongly recommended to clear only the status bits that were set to 1 when the status
registers were last read. This precaution ensures that events triggered just before the
write access are not lost.
6.10.1 Interrupt/wake-up delay
If interrupt or wake-up events occur very frequently while the transceiver is in CAN Offline
mode, they can have a significant impact on the software processing time (because pin
RXD is repeatedly driven LOW, requiring a response from the microcontroller each time
an interrupt/wake-up is generated). The UJA1167 incorporates an event delay timer to
limit the disturbance to the software.
When one of the event capture status bits is cleared, pin RXD is released (HIGH) and a
timer is started. If further events occur while the timer is running, the relevant status bits
are set. If one or more events are pending when the timer expires after td(event), pin RXD
goes LOW again to alert the microcontroller.
In this way, the microcontroller is interrupted once to process a number of events rather
than several times to process individual events.
If all events are cleared while the timer is running, RXD remains HIGH after the timer
expires, since there are no pending events. The event capture registers can be read at
any time.
The event capture delay timer is stopped immediately when pin RSTN goes low (triggered
by a HIGH-to-LOW transition on the pin). RSTN is driven LOW when the SBC enters
Reset, Sleep, Overtemp and Off modes. A pending event is signaled on pin RXD when
the SBC enters Sleep mode.
6.10.2 Sleep mode protection
The wake-up event capture function is critical when the UJA1167 is in Sleep mode,
because the SBC will only leave Sleep mode in response to a captured wake-up event. To
avoid potential system deadlocks, the SBC distinguishes between regular and diagnostic
events (see Section 6.10). Wake-up events (via the CAN bus or the WAKE pin) are
classified as regular events; diagnostic events signal failure/error conditions or state
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Mini high-speed CAN system basis chip with Standby/Sleep modes &
watchdog
changes. At least one regular wake-up event must be enabled before the UJA1167 can
switch to Sleep mode. Any attempt to enter Sleep mode while all regular wake-up events
are disabled will trigger a system reset.
Another condition that must be satisfied before the UJA1167 can switch to Sleep mode is
that all event status bits must be cleared. If an event is pending when the SBC receives a
Sleep mode command (MC = 001), it will immediately switch to Reset mode. This
condition applies to both regular and diagnostic events.
Sleep mode can be permanently disabled in applications where, for safety reasons, the
supply voltage to the host controller must never be cut off. Sleep mode is permanently
disabled by setting the Sleep control bit (SLPC) in the SBC configuration register (see
Table 8) to 1. This register is located in the non-volatile memory area of the device. When
SLPC = 1, a Sleep mode SPI command (MC = 001) will trigger an SPI failure event
instead of a transition to Sleep mode.
6.10.3 Event status and event capture registers
After an event source has been identified, the status flag should be cleared (set to
0) by writing 1 to the relevant status bit (writing 0 will have no effect).
Table 19.
Symbol
Access
Value
7:4
reserved
R
-
3
WPE
R
0
no pending WAKE pin event
1
WAKE pin event pending at address 0x64
0
no pending transceiver event
1
transceiver event pending at address 0x63
0
no pending supply event
1
supply event pending at address 0x62
0
no pending system event
1
system event pending at address 0x61
2
1
0
TRXE
SUPE
SYSE
Table 20.
R
R
System event status register (address 61h)
Symbol
Access
7:5
reserved
R
-
4
PO
R/W
0
no recent power-on
1
the UJA1167 has left Off mode after power-on
Value
Description
3
reserved
R
-
2
OTW
R/W
0
overtemperature not detected
1
the global chip temperature has exceeded the
overtemperature warning threshold (Tth(warn)otp)
0
no SPI failure detected
1
SPI failure detected
0
no watchdog failure event captured
1
watchdog failure event captured
0
Product data sheet
R
Description
Bit
1
UJA1167
Global event status register (address 60h)
Bit
SPIF
WDF
R/W
R/W
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Table 21.
Bit
Symbol
Access
Value
7:3
reserved
R
-
2
VEXTO[1]
R/W
0
no VEXT overvoltage event captured
1
VEXT overvoltage event captured
0
no VEXT undervoltage event captured
1
VEXT undervoltage event captured
0
no V1 undervoltage event captured
1
V1 undervoltage event captured
1
0
[1]
VEXTU[1]
V1U
R/W
Transceiver event status register (address 63h)
Bit
Symbol
Access
Value
7:5
reserved
R
-
4
CBS
R/W
0
CAN bus active
1
no activity on CAN bus for tto(silence)
3:2
reserved
R
1
CF
R/W
0
CW
Table 23.
Description
-
R/W
0
no CAN failure detected
1
CAN transceiver deactivated due to V1 undervoltage
OR dominant clamped TXD
0
no CAN wake-up event detected
1
CAN wake-up event detected while the transceiver is
in CAN Offline Mode
WAKE pin event capture status register (address 64h)
Bit
Symbol
Access
Value
7:2
reserved
R
-
1
WPR
R/W
0
no rising edge detected on WAKE pin
1
rising edge detected on WAKE pin
0
no falling edge detected on WAKE pin
1
falling edge detected on WAKE pin
0
WPF
Table 24.
R/W
Symbol
Access
Value
7:3
reserved
R
-
2
OTWE
R/W
0
Description
System event capture enable register (address 04h)
Bit
1
Product data sheet
R/W
Description
UJA1167TK/VX only; reserved in the UJA1167TK.
Table 22.
UJA1167
Supply event status register (address 62h)
SPIFE
reserved
overtemperature warning event capture:
0
overtemperature warning disabled
1
overtemperature warning enabled
R/W
R
Description
SPI failure detection:
0
SPI failure detection disabled
1
SPI failure detection enabled
-
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Table 25.
Supply event capture enable register (address 1Ch)
Bit
Symbol
Access
Value
7:3
reserved
R
-
2
VEXTOE[1]
R/W
1
0
[1]
VEXTUE[1]
V1UE
VEXT overvoltage detection:
0
VEXT overvoltage detection disabled
1
VEXT overvoltage detection enabled
R/W
VEXT undervoltage detection:
0
VEXT undervoltage detection disabled
1
VEXT undervoltage detection enabled
R/W
V1 undervoltage detection:
0
V1 undervoltage detection disabled
1
V1 undervoltage detection enabled
UJA1167TK/VX only; reserved in the UJA1167TK.
Table 26.
Transceiver event capture enable register (address 23h)
Bit
Symbol
Access
Value
7:5
reserved
R
-
4
CBSE
R/W
3:2
reserved
R
1
CFE
R/W
0
CWE
Table 27.
Description
CAN bus silence detection:
0
CAN bus silence detection disabled
1
CAN bus silence detection enabled
CAN failure detection
0
CAN failure detection disabled
1
CAN failure detection enabled
R/W
CAN wake-up detection:
0
CAN wake-up detection disabled
1
CAN wake-up detection enabled
WAKE pin event capture enable register (address 4Ch)
Bit
Symbol
Access
Value
7:2
reserved
R
-
1
WPRE
R/W
0
Description
WPFE
Description
rising-edge detection on WAKE pin:
0
rising-edge detection on WAKE pin disabled
1
rising-edge detection on WAKE pin enabled
R/W
falling-edge detection on WAKE pin:
0
falling-edge detection on WAKE pin disabled
1
falling-edge detection on WAKE pin enabled
6.11 Non-volatile SBC configuration
The UJA1167 contains Multiple Time Programmable Non-Volatile (MTPNV) memory cells
that allow some of the default device settings to be reconfigured. The MTPNV memory
address range is from 0x73 to 0x74. An overview of the MTPNV registers is given in
Table 28.
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Table 28.
Overview of MTPNV registers
Address Register Name
Bit:
7
6
5
4
3
2
0x73
Start-up control
(see Table 11)
reserved
RLC
VEXTSUC
reserved
0x74
SBC configuration control
(see Table 8)
reserved
V1RTSUC
FNMC
SDMC
1
0
reserved SLPC
6.11.1 Programming MTPNV cells
The UJA1167 must be in Forced Normal mode and the MTPNV cells must contain the
factory preset values before the non-volatile memory can be reprogrammed. The
UJA1167 will switch to Forced Normal mode after a reset event (e.g. pin RSTN LOW)
when the MTPNV cells contain the factory preset values (since FNMC = 1).
The factory presets may need to be restored before reprogramming can begin (see
Section 6.11.2). When the factory presets have been restored, a system reset is
generated automatically and UJA1167 switches to Forced Normal mode. This ensures
that the programming cycle cannot be interrupted by the watchdog.
Programming of the non-volatile memory registers is performed in two steps. First, the
required values are written to addresses 0x73 and 0x74. In the second step,
reprogramming is confirmed by writing the correct CRC value to the MTPNV CRC control
register (see Section 6.11.1.1). The SBC starts reprogramming the MTPNV cells as soon
as the CRC value has been validated. If the CRC value is not correct, reprogramming is
aborted. On completion, a system reset is generated to indicate that the MTPNV cells
have been reprogrammed successfully. Note that the MTPNV cells cannot be read while
they are being reprogrammed.
After an MTPNV programming cycle has been completed, the non-volatile memory is
protected from being overwritten via a standard SPI write operation.
The MTPNV cells can be reprogrammed a maximum of 200 times (Ncy(W)MTP; see
Table 46). Bit NVMPS in the MTPNV status register (Table 29) indicates whether the
non-volatile cells can be reprogrammed. This register also contains a write counter,
WRCNTS, that is incremented each time the MTPNV cells are reprogrammed (up to a
maximum value of 111111; there is no overflow). Note that this counter is provided for
information purposes only; reprogramming will not be aborted if it reaches its maximum
value. An error correction code status bit, ECCS, indicates whether reprogramming was
successful.
Table 29.
Bit
Symbol
Access
Value
Description
7:2
WRCNTS
R
xxxxxx
write counter: contains the number of times the
MTPNV cells were reprogrammed
1
ECCS
R
0
no error detected during MTPNV cell programming
1
an error was detected during MTPNV cell
programming
0
MTPNV memory cannot be overwritten
1[1]
MTPNV memory is ready to be reprogrammed
0
[1]
UJA1167
Product data sheet
MTPNV status register (address 70h)
NVMPS
R
Factory preset value.
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6.11.1.1
Calculating the CRC value for MTP programming
The cyclic redundancy check value stored in bits CRCC in the MTPNV CRC control
register is calculated using the data written to registers 0x73 and 0x74.
Table 30.
MTPNV CRC control register (address 75h)
Bit
Symbol
Access
Value
Description
7:0
CRCC
R/W
-
CRC control data
The CRC value is calculated using the data representation shown in Figure 7 and the
modulo-2 division with the generator polynomial: X8 + X5 + X3 + X2 + X + 1. The result of
this operation must be bitwise inverted.
7
6
1
0
7
register 0x73
Fig 7.
6
1
register 0x74
0
015aaa382
Data representation for CRC calculation
The following parameters can be used to calculate the CRC value (e.g. via the Autosar
method):
Table 31.
Parameters for CRC coding
Parameter
Value
CRC result width
8 bits
Polynomial
0x2F
Initial value
0xFF
Input data reflected
no
Result data reflected
no
XOR value
0xFF
Alternatively, the following algorithm can be used:
data = 0 // unsigned byte
crc = 0xFF
for i = 0 to 1
data = content_of_address(0x73 + i) EXOR crc
for j = 0 to 7
if data 128
data = data * 2 // shift left by 1
data = data EXOR 0x2F
else
data = data * 2 // shift left by 1
next j
crc = data
next i
crc = crc EXOR 0xFF
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6.11.2 Restoring factory preset values
Factory preset values are restored if the following conditions apply for at least td(MTPNV)
during power-up:
• pin RSTN is held LOW
• CANH is pulled up to VBAT
• CANL is pulled down to GND
After the factory preset values have been restored, the SBC performs a system reset and
enters Forced normal Mode. Since the CAN bus is clamped dominant, pin RXDC is forced
LOW. During the factory preset restore process, this pin is forced HIGH; a falling edge on
this pin caused by bit PO being set after power-on then clearly indicates that the process
has been completed.
Note that the write counter, WRCNTS, in the MTPNV status register is incremented every
time the factory presets are restored.
6.12 Device ID
A byte is reserved at address 0x7E for a UJA1167 identification code.
Table 32.
Identification register (address 7Eh)
Bit
Symbol
Access
Value
Description
7:0
IDS[7:0]
R
D8h
device identification code - UJA1167TK
C8h
device identification code -UJA1167TK/VX
6.13 Lock control register
Sections of the register address area can be write-protected to protect against unintended
modifications. Note that this facility only protects locked bits from being modified via the
SPI and will not prevent the UJA1167 updating status registers etc.
Table 33.
Bit
Symbol
Access Value
7
reserved
R
6
LK6C
R/W
5
4
3
UJA1167
Product data sheet
Lock control register (address 0Ah)
LK5C
LK4C
LK3C
-
Description
cleared for future use
lock control 6: address area 0x68 to 0x6F
0
SPI write-access enabled
1
SPI write-access disabled
R/W
lock control 5: address area 0x50 to 0x5F
0
SPI write-access enabled
1
SPI write-access disabled
R/W
lock control 4: address area 0x40 to 0x4F - WAKE pin control
0
SPI write-access enabled
1
SPI write-access disabled
R/W
lock control 3: address area 0x30 to 0x3F
0
SPI write-access enabled
1
SPI write-access disabled
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Table 33.
Lock control register (address 0Ah)
Bit
Symbol
Access Value
Description
2
LK2C
R/W
lock control 2: address area 0x20 to 0x2F - transceiver control
1
LK1C
0
LK0C
0
SPI write-access enabled
1
SPI write-access disabled
R/W
lock control 1: address area 0x10 to 0x1F - regulator control
0
SPI write-access enabled
1
SPI write-access disabled
R/W
lock control 0: address area 0x06 to 0x09 - general purpose
memory
0
SPI write-access enabled
1
SPI write-access disabled
6.14 General purpose memory
UJA1167 allocates 4 bytes of RAM as general purpose registers for storing user
information. The general purpose registers can be accessed via the SPI at address 0x06
to 0x09 (see Table 34).
6.15 SPI
6.15.1 Introduction
The Serial Peripheral Interface (SPI) provides the communication link with the
microcontroller, supporting multi-slave operations. The SPI is configured for full duplex
data transfer, so status information is returned when new control data is shifted in. The
interface also offers a read-only access option, allowing registers to be read back by the
application without changing the register content.
The SPI uses four interface signals for synchronization and data transfer:
•
•
•
•
SCSN: SPI chip select; active LOW
SCK: SPI clock; default level is LOW due to low-power concept (pull-down)
SDI: SPI data input
SDO: SPI data output; floating when pin SCSN is HIGH
Bit sampling is performed on the falling edge of the clock and data is shifted in/out on the
rising edge, as illustrated in Figure 8.
UJA1167
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SCSN
SCK
01
02
03
04
N–1
N
sampled
SDI
X
SDO
floating
X
MSB
MSB–1
MSB–2
MSB–3
01
LSB
MSB
MSB–1
MSB–2
MSB–3
01
LSB
X
floating
015aaa255
Fig 8.
SPI timing protocol
The SPI data in the UJA1167 is stored in a number of dedicated 8-bit registers. Each
register is assigned a unique 7-bit address. Two bytes must be transmitted to the SBC for
a single register write operation. The first byte contains the 7-bit address along with a
‘read-only’ bit (the LSB). The read-only bit must be 0 to indicate a write operation (if this bit
is 1, a read operation is assumed and any data on the SDI pin is ignored). The second
byte contains the data to be written to the register.
24- and 32-bit read and write operations are also supported. The register address is
automatically incremented, once for a 24-bit operation and twice for a 32-bit operation, as
illustrated in Figure 9.
Register Address Range
0x00
0x01
0x02
0x03
0x04
ID=0x05
addr 0000101
A6
A5
A4
A3
A2
Address Bits
A1
A0
0x05
0x06
data
data
data byte 1
0x07
0x7D
0x7F
data
data byte 2
data byte 3
RO
x
x
x
Read-only Bit
x
x
x
x
x
x
x
x
Data Bits
x
x
x
x
x
x
x
Data Bits
Fig 9.
0x7E
x
x
x
Data Bits
x
x
x
015aaa289
SPI data structure for a write operation (16-, 24- or 32-bit)
UJA1167
Product data sheet
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During an SPI data read or write operation, the contents of the addressed register(s) is
returned via pin SDO.
The UJA1167 tolerates attempts to write to registers that don't exist. If the available
address space is exceeded during a write operation, the data above the valid address
range is ignored (without generating an SPI failure event).
During a write operation, the UJA1167 monitors the number of SPI bits transmitted. If the
number recorded is not 16, 24 or 32, then the write operation is aborted and an SPI failure
event is captured (SPIF = 1).
If more than 32 bits are clocked in on pin SDI during a read operation, the data stream on
SDI is reflected on SDO from bit 33 onwards.
After the UJA1167 exits Reset mode (positive edge on RSTN), an SPI read/write access
must not be attempted for at least tto(SPI). Any earlier access may be ignored (without
generating an SPI failure event).
UJA1167
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6.15.2 Register map
The addressable register space contains 128 registers with addresses from 0x00 to 0x7F.
An overview of the register mapping is provided in Table 34 to Table 42. The functionality
of individual bits is discussed in more detail in relevant sections of the data sheet.
Table 34.
Overview of primary control registers
Address Register Name
Bit:
7
6
0x00
Watchdog control
WMC
0x01
Mode control
reserved
5
4
3
1
0
OTWE
SPIFE
reserved
FNMS
SDMS
WDS
LK3C
LK2C
LK1C
reserved NWP
MC
0x03
Main status
reserved OTWS
0x04
System event enable
reserved
0x05
Watchdog status
reserved
0x06
Memory 0
GPM[7:0]
0x07
Memory 1
GPM[15:8]
0x08
Memory 2
GPM[23:16]
0x09
Memory 3
GPM[31:24]
0x0A
Lock control
reserved LK6C
Table 35.
Overview of V1 and INH/VEXT and transceiver control registers
Address Register Name
2
NMS
LK5C
RSS
LK4C
LK0C
Bit:
7
6
5
4
3
2
1
0x10
V1 and INH/VEXT control
reserved
0x1B
Supply status
reserved
VEXTS
0x1C
Supply event enable
reserved
VEXTOE VEXTUE V1UE
0x20
CAN control
reserved
CMC
0x22
Transceiver status
CTS
0x23
Transceiver event enable
reserved
Table 36.
Overview of WAKE pin control and status registers
Address
Register Name
VEXTC
0
reserved
V1RTC
CBSS
CBSE
V1S
reserved
reserved
VCS
CFS
CFE
CWE
Bit:
7
6
5
4
3
2
1
0
0x4B
WAKE pin status
reserved
WPVS
reserved
0x4C
WAKE pin enable
reserved
WPRE
WPFE
1
0
Table 37.
Overview of event capture registers
Address
Register Name
Bit:
7
6
0x60
Global event status
reserved
0x61
System event status
reserved
0x62
Supply event status
reserved
0x63
Transceiver event status
reserved
0x64
WAKE pin event status
reserved
UJA1167
Product data sheet
5
4
3
2
WPE
TRXE
PO
reserved OTW
VEXTO
CBS
reserved
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Rev. 2 — 18 April 2014
SUPE
SYSE
SPIF
WDF
VEXTU
V1U
CF
CW
WPR
WPF
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Table 38.
Address
Overview of MTPNV status register
Register Name
Bit:
7
0x70
Table 39.
Address
MTPNV status
6
Table 40.
Address
Table 41.
Address
Register Name
Table 42.
Address
Startup control
6
5
reserved
1
0
ECCS
NVMPS
4
RLC
3
2
1
0
VEXTSUC reserved
Overview of SBC configuration control register
Register Name
Bit:
6
5
SBC configuration control reserved
4
V1RTSUC
3
2
1
0
FNMC
SDMC
reserved SLPC
Overview of CRC control register
Register Name
Bit:
MTPNV CRC control
6
5
4
3
2
1
0
5
4
3
2
1
0
CRCC[7:0]
Overview of Identification register
Register Name
Bit:
7
0x7E
2
Bit:
7
0x75
3
Overview of Startup control register
7
0x74
4
WRCNTS
7
0x73
5
Identification
6
IDS[7:0]
6.15.3 Register configuration in UJA1167 operating modes
A number of register bits may change state automatically when the UJA1167 switches
from one operating mode to another. This is particularly evident when the UJA1167
switches to Off mode. These changes are summarized in Table 43. If an SPI transmission
is in progress when the UJA1167 changes state, the transmission is ignored (automatic
state changes have priority).
Table 43.
Register bit settings in UJA1167 operating modes
Symbol
Off (power-on
default)
Standby
Normal
Sleep
Overtemp
Reset
CBS
0
no change
no change
no change
no change
no change
CBSE
0
no change
no change
no change
no change
no change
CBSS
1
actual state
actual state
no change
actual state
actual state
CF
0
no change
no change
no change
no change
no change
CFE
0
no change
no change
no change
no change
no change
CFS
0
actual state
actual state
actual state
actual state
actual state
CMC
00
no change
no change
no change
no change
no change
CRCC
00000000
no change
no change
no change
no change
no change
CTS
0
0
actual state
0
0
0
CW
0
no change
no change
no change
no change
no change
UJA1167
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Table 43.
Register bit settings in UJA1167 operating modes …continued
Symbol
Off (power-on
default)
Standby
Normal
Sleep
Overtemp
Reset
CWE
0
no change
no change
no change
no change
no change
ECCS
actual state
actual state
actual state
actual state
actual state
actual state
FNMC
MTPNV
MTPNV
MTPNV
MTPNV
MTPNV
MTPNV
FNMS
0
actual state
actual state
actual state
actual state
actual state
GPMn
00000000
no change
no change
no change
no change
no change
IDS
1101 1000 (TK)
no change
1100 1000 (TKVX)
no change
no change
no change
no change
LKnC
0
no change
no change
no change
no change
no change
MC
100
100
111
001
don’t care
100
NMS
1
no change
0
no change
no change
no change
NVMPS
actual state
actual state
actual state
actual state
actual state
actual state
NWP
0100
no change
no change
no change
0100
0100
OTW
0
no change
no change
no change
no change
no change
OTWE
0
no change
no change
no change
no change
no change
OTWS
0
actual state
actual state
actual state
actual state
actual state
PO
1
no change
no change
no change
no change
no change
RLC
MTPNV
MTPNV
MTPNV
MTPNV
MTPNV
MTPNV
RSS
00000
no change
no change
no change
10010
reset source
SDMC
MTPNV
MTPNV
MTPNV
MTPNV
MTPNV
MTPNV
SDMS
0
actual state
actual state
actual state
actual state
actual state
SLPC
MTPNV
MTPNV
MTPNV
MTPNV
MTPNV
MTPNV
SPIF
0
no change
no change
no change
no change
no change
SPIFE
0
no change
no change
no change
no change
no change
SUPE
0
no change
no change
no change
no change
no change
SYSE
1
no change
no change
no change
no change
no change
TRXE
0
no change
no change
no change
no change
no change
V1RTC
defined by
V1RTSUC
no change
no change
no change
no change
no change
V1RTSUC
MTPNV
MTPNV
MTPNV
MTPNV
MTPNV
MTPNV
V1S
0
actual state
actual state
actual state
actual state
actual state
V1UE
0
no change
no change
no change
no change
no change
V1U
0
no change
no change
no change
no change
no change
VCS
0
actual state
actual state
actual state
actual state
actual state
VEXTC
defined by
VEXTSUC
no change
no change
no change
no change
no change
VEXTO[1]
0
no change
no change
no change
no change
no change
VEXTOE[1]
0
no change
no change
no change
no change
no change
VEXTS[1]
00
actual state
actual state
actual state
actual state
actual state
VEXTSUC
MTPNV
MTPNV
MTPNV
MTPNV
MTPNV
MTPNV
VEXTU[1]
0
no change
no change
no change
no change
no change
VEXTUE[1]
0
no change
no change
no change
no change
no change
UJA1167
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Table 43.
Register bit settings in UJA1167 operating modes …continued
Symbol
Off (power-on
default)
Standby
Normal
Sleep
Overtemp
Reset
WDF
0
no change
no change
no change
no change
no change
WDS
0
actual state
actual state
actual state
actual state
actual state
WMC
[2]
no change
no change
no change
no change
[2]
WPE
0
no change
no change
no change
no change
no change
WPF
0
no change
no change
no change
no change
no change
WPR
0
no change
no change
no change
no change
no change
WPFE
0
no change
no change
no change
no change
no change
WPRE
0
no change
no change
no change
no change
no change
WPVS
0
no change
no change
no change
no change
no change
WRCNTS
actual state
actual state
actual state
actual state
actual state
actual state
[1]
UJA1167TK/VX only.
[2]
001 if SDMC = 1; otherwise 010.
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7. Limiting values
Table 44. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Vx
voltage on pin x
DC value
voltage between pin
CANH and pin CANL
Vtrt
transient voltage
Max
Unit
V
0.2
+6
pins TXD, RXD, SDI, SDO, SCK, SCSN, RSTN
0.2
VV1 + 0.2 V
pins INH/VEXT/WAKE
18
+40
V
pin BAT
0.2
+40
V
pins CANH and CANL with respect to any other pin
58
+58
V
40
+40
V
150
+100
V
6
+6
kV
8
+8
kV
4
+4
kV
2
+2
kV
100
+100
V
750
+750
V
500
+500
V
40
+150
C
55
+150
C
[1]
pin V1
V(CANH-CANL)
Min
[2]
on pins
CANL, CANH, WAKE, VEXT;
pin BAT via reverse polarity diode and capacitor to
ground
VESD
electrostatic
discharge voltage
IEC 61000-4-2
[3]
on pins CANH and CANL; pin BAT with capacitor;
pin WAKE with 10 nF capacitor and 10 k resistor;
pin VEXT with 2.2 F capacitor
[4]
HBM
on pins CANH, CANL
[5]
on pins BAT, WAKE, VEXT
on any other pin
[6]
MM
on any pin
[7]
CDM
on corner pins
on any other pin
Tvj
virtual junction
temperature
Tstg
storage temperature
[8]
[1]
When the device is not powered up, IV1 (max) = 25 mA.
[2]
Verified by an external test house to ensure pins can withstand ISO 7637 part 2 automotive transient test pulses 1, 2a, 3a and 3b.
[3]
ESD performance according to IEC 61000-4-2 (150 pF, 330 ) has been verified by an external test house; the result was equal to or
better than 6 kV.
[4]
Human Body Model (HBM): according to AEC-Q100-002 (100 pF, 1.5 k).
[5]
V1 and BAT connected to GND, emulating the application circuit.
[6]
Machine Model (MM): according to AEC-Q100-003 (200 pF, 0.75 H, 10 ).
[7]
Charged Device Model (CDM): according to AEC-Q100-011 (field Induced charge; 4 pF).
[8]
In accordance with IEC 60747-1. An alternative definition of virtual junction temperature is: Tvj = Tamb + P Rth(j-a), where Rth(j-a) is a
fixed value used in the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (P) and ambient
temperature (Tamb).
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8. Thermal characteristics
Table 45.
Symbol
Rth(vj-a)
[1]
Thermal characteristics
Parameter
Conditions
[1]
thermal resistance from virtual junction to ambient HVSON14
Typ
Unit
60
K/W
According to JEDEC JESD51-2, JESD51-5 and JESD51-7 at natural convection on 2s2p board. Board with two inner copper layers
(thickness: 35 m) and thermal via array under the exposed pad connected to the first inner copper layer (thickness: 70 m).
9. Static characteristics
Table 46. Static characteristics
Tvj = 40 C to +150 C; VBAT = 3 V to 28 V; R(CANH-CANL) = 60 ; all voltages are defined with respect to ground; positive
currents flow into the IC; typical values are given at VBAT = 13 V; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Supply; pin BAT
Vth(det)pon
power-on detection threshold
voltage
VBAT rising
4.2
-
4.55
V
Vth(det)poff
power-off detection threshold
voltage
VBAT falling
2.8
-
3
V
Vuvr(CAN)
CAN undervoltage recovery
voltage
VBAT rising
4.5
-
5
V
Vuvd(CAN)
CAN undervoltage detection
voltage
VBAT falling
4.2
-
4.55
V
IBAT
battery supply current
Sleep mode; MC = 001;
40 C < Tvj < 85 C; CAN
Offline mode; CWE = 1;
VBAT = 7 V to 18 V
-
41
59
A
Standby mode; MC = 100;
CWE = 1; CAN Offline mode;
IV1 = 0 A; VBAT = 7 V to 18 V;
40 C < Tvj < 85 C
-
60
85
A
additional current in CAN
Offline Bias mode;
40 C < Tvj < 85 C
-
46
63
A
2
3
A
additional current from WAKE
input; WPRE = WPFE = 1;
40 C < Tvj < 85 C
UJA1167
Product data sheet
Normal mode; MC = 111;
CAN Active mode; CAN
recessive; VTXD = VV1
-
4
7.5
mA
Normal mode; MC = 111;
CAN Active mode; CAN
dominant; VTXD = 0 V
-
46
67
mA
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Rev. 2 — 18 April 2014
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41 of 60
UJA1167
NXP Semiconductors
Mini high-speed CAN system basis chip with Standby/Sleep modes &
watchdog
Table 46. Static characteristics …continued
Tvj = 40 C to +150 C; VBAT = 3 V to 28 V; R(CANH-CANL) = 60 ; all voltages are defined with respect to ground; positive
currents flow into the IC; typical values are given at VBAT = 13 V; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VBAT = 5.5 V to 18 V;
IV1 = 120 mA to 0 mA;
VTXD = VV1
4.9
5
5.1
V
VBAT = 5.65 V to 18 V;
IV1 = 150 mA to 0 mA;
VTXD = VV1
4.9
5
5.1
V
VBAT = 5.65 V to 18 V;
IV1 = 100 mA to 0 mA;
VTXD = 0 V; VCANH = 0 V
4.9
5
5.1
V
-
-
100
mV
10
mV
-
5
Voltage source: pin V1
VO
Vret(RAM)
output voltage
RAM retention voltage difference
between VBAT and VV1
VBAT = 2 V to 3 V;
IV1 = 2 mA
VBAT = 2 V to 3 V;
IV1 = 200 A
[1]
R(BAT-V1)
resistance between pin BAT and
pin V1
VBAT = 4 V to 6 V;
IV1 = 120 mA
VBAT = 3 V to 4 V; IV1 = 40 mA
-
2.625
-
Vuvd
undervoltage detection voltage
Vuvd(nom) = 90 %
4.5
-
4.75
V
Vuvd(nom) = 80 %
4
-
4.25
V
Vuvd(nom) = 70 %
3.5
3.75
V
Vuvd(nom) = 60 %
-
3
-
3.25
V
Vuvr
undervoltage recovery voltage
4.5
-
4.75
V
IO(sc)
short-circuit output current
300
-
150
mA
4.9
5
5.1
V
Voltage source: VEXT (UJA1167TK/VX only)
VO
output voltage
VBAT = 6.5 V to 18 V;
IVEXT = 30 mA to 0 mA
Vuvd
undervoltage detection voltage
4.5
-
4.75
V
Vovd
overvoltage detection voltage
6.5
-
7
V
IO(sc)
short-circuit output current
125
-
30
mA
Voltage source: INH (UJA1167TK)
VO
output voltage
IINH = 180 A
VBAT
0.8
-
VBAT
V
Rpd
pull-down resistance
Sleep mode
3
4
5
M
Serial peripheral interface inputs; pins SDI, SCK and SCSN
Vth(sw)
switching threshold voltage
0.25VV1
-
0.75VV1
V
Rpd(SCK)
pull-down resistance on pin SCK
40
60
80
k
Rpu(SCSN)
pull-up resistance on pin SCSN
40
60
80
k
ILI(SDI)
input leakage current on pin SDI
5
-
+5
A
Serial peripheral interface data output; pin SDO
VOH
HIGH-level output voltage
IOH = 4 mA
VV1 0.4 -
-
V
VOL
LOW-level output voltage
IOL = 4 mA
-
0.4
V
UJA1167
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 18 April 2014
-
© NXP Semiconductors N.V. 2014. All rights reserved.
42 of 60
UJA1167
NXP Semiconductors
Mini high-speed CAN system basis chip with Standby/Sleep modes &
watchdog
Table 46. Static characteristics …continued
Tvj = 40 C to +150 C; VBAT = 3 V to 28 V; R(CANH-CANL) = 60 ; all voltages are defined with respect to ground; positive
currents flow into the IC; typical values are given at VBAT = 13 V; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
ILO(off)
off-state output leakage current
VSCSN = VV1; VO = 0 V to VV1
5
-
+5
A
CAN transmit data input; pin TXD
Vth(sw)
switching threshold voltage
0.25VV1
-
0.75VV1
V
Rpu
pull-up resistance
40
60
80
k
CAN receive data output; pin RXD
VOH
HIGH-level output voltage
IOH = 4 mA
VV1 0.4 -
-
V
VOL
LOW-level output voltage
IOL = 4 mA
-
-
0.4
V
Rpu
pull-up resistance
CAN Offline mode
40
60
80
k
Local wake input; pin WAKE
Vth(sw)r
rising switching threshold voltage
2.8
-
4.1
V
Vth(sw)f
falling switching threshold voltage
2.4
-
3.75
V
Vhys(i)
input hysteresis voltage
250
-
800
mV
Ii
input current
-
-
1.5
A
pin CANH
2.75
3.5
4.5
V
pin CANL
0.5
1.5
2.25
V
400
-
+400
mV
0.9VV1
-
1.1VV1
V
CAN Active mode (dominant);
VTXD = 0 V;
VV1 = 4.75 V to 5.5 V;
R(CANH-CANL) = 45 to 65
1.5
-
3.0
V
CAN Active mode (recessive);
CAN Listen-only mode;
CAN Offline mode; VTXD = VV1;
R(CANH-CANL) = no load
50
-
+50
mV
CAN Active mode; VTXD = VV1
R(CANH-CANL) = no load
2
0.5VV1
3
V
CAN Offline mode;
R(CANH-CANL) = no load
0.1
-
+0.1
V
CAN Offline Bias/Listen-only
modes; R(CANH-CANL) = no load;
VV1 = 0 V
2
2.5
3
V
pin CANH; VCANH = 0 V
50
-
-
mA
pin CANL; VCANL = 5 V
-
-
52
mA
3
-
+3
mA
Tvj = 40 C to +85 C
High-speed CAN bus lines; pins CANH and CANL
VO(dom)
dominant output voltage
CAN Active mode; VTXD = 0 V
Vdom(TX)sym
transmitter dominant voltage
symmetry
Vdom(TX)sym =
VV1 VCANH VCANL; VV1 = 5 V
VTXsym
transmitter voltage symmetry
VTXsym = VCANH + VCANL;
fTXD = 250 kHz;
CSPLIT = 4.7 nF
VO(dif)bus
VO(rec)
IO(dom)
IO(rec)
bus differential output voltage
recessive output voltage
dominant output current
recessive output current
UJA1167
Product data sheet
[1]
[2]
CAN Active mode;
VTXD = 0 V; VV1 = 5 V
VCANL = VCANH = 27 V to
+32 V; VTXD = VV1
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Rev. 2 — 18 April 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
43 of 60
UJA1167
NXP Semiconductors
Mini high-speed CAN system basis chip with Standby/Sleep modes &
watchdog
Table 46. Static characteristics …continued
Tvj = 40 C to +150 C; VBAT = 3 V to 28 V; R(CANH-CANL) = 60 ; all voltages are defined with respect to ground; positive
currents flow into the IC; typical values are given at VBAT = 13 V; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Vth(RX)dif
differential receiver threshold
voltage
CAN Active/Listen-only modes;
VCANL = VCANH = 12 V to
+12 V
0.5
0.7
0.9
V
CAN Offline mode;
VCANL = VCANH = 12 V to
+12 V
0.4
0.7
1.15
V
CAN Active/Listen-only modes;
VCANL = VCANH = 12 V to
+12 V
50
200
400
mV
Vhys(RX)dif
differential receiver hysteresis
voltage
Ri(cm)
common-mode input resistance
9
15
28
k
Ri
input resistance deviation
1
-
+1
%
Ri(dif)
differential input resistance
19
30
52
k
Ci(cm)
common-mode input capacitance
[1]
-
-
20
pF
Ci(dif)
differential input capacitance
[1]
-
-
10
pF
ILI
input leakage current
5
-
+5
A
VCANL = VCANH = 12 V to
+12 V
VBAT = VV1 = 0 V or
VBAT = VV1 = shorted to ground
via 47 k; VCANH = VCANL = 5 V
Temperature protection
Tth(act)otp
overtemperature protection
activation threshold temperature
167
177
187
C
Tth(rel)otp
overtemperature protection
release threshold temperature
127
137
147
C
Tth(warn)otp
overtemperature protection
warning threshold temperature
127
137
147
C
0
-
0.2VV1
V
Reset output; pin RSTN
VOL
LOW-level output voltage
VV1 = 1.0 V to 5.5 V; pull-up
resistor to VV1 900
Rpu
pull-up resistance
40
60
80
k
Vth(sw)
switching threshold voltage
0.25VV1
-
0.75VV1
V
-
-
200
-
MTP non-volatile memory
Ncy(W)MTP
number of MTP write cycles
[1]
Not tested in production; guaranteed by design.
[2]
The test circuit used to measure the bus output voltage symmetry (which includes CSPLIT) is shown in Figure 16.
UJA1167
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 18 April 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
44 of 60
UJA1167
NXP Semiconductors
Mini high-speed CAN system basis chip with Standby/Sleep modes &
watchdog
10. Dynamic characteristics
Table 47. Dynamic characteristics
Tvj = 40 C to +150 C; VBAT = 3 V to 28 V; R(CANH-CANL) = 60 ; all voltages are defined with respect to ground; positive
currents flow into the IC; typical values are given at VBAT = 13 V; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
from VBAT exceeding the
power-on detection threshold
until VV1 exceeds the 90 %
undervoltage threshold;
CV1 = 4.7 F
-
2.8
4.7
ms
6
-
54
s
Voltage source; pin V1
tstartup
start-up time
td(uvd)
undervoltage detection delay time
td(uvd-RSTNL)
delay time from undervoltage
detection to RSTN LOW
undervoltage on V1
-
-
63
s
td(buswake-VOH)
delay time from bus wake-up to
HIGH-level output voltage
HIGH = 0.8VO(V1);
IV1 100 mA
-
-
5
ms
Voltage source; pin VEXT
td(uvd)
undervoltage detection delay time
6
-
39
s
td(ovd)
overvoltage detection delay time
6
-
39
s
Serial peripheral interface timing; pins SCSN, SCK, SDI and SDO
tcy(clk)
clock cycle time
250
-
-
ns
tSPILEAD
SPI enable lead time
50
-
-
ns
tSPILAG
SPI enable lag time
50
-
-
ns
tclk(H)
clock HIGH time
125
-
-
ns
tclk(L)
clock LOW time
125
-
-
ns
tsu(D)
data input set-up time
50
-
-
ns
th(D)
data input hold time
50
-
-
ns
tv(Q)
data output valid time
pin SDO; CL = 20 pF
-
-
50
ns
tWH(S)
chip select pulse width HIGH
pin SCSN
250
-
-
ns
tto(SPI)
SPI time-out time
after leaving Reset mode
-
-
40
s
-
-
255
ns
-
-
350
ns
CAN transceiver timing; pins CANH, CANL, TXD and RXD
td(TXD-RXD)
delay time from TXD to RXD
RL = 60 ; CL = 100 pF;
50 % VTXD to 50 % VRXD;
CRXD = 15 pF;
fTXD = 250 kHz
RL = 120 ; CL = 200 pF;
50 % VTXD to 50 % VRXD;
CRXD = 15 pF;
fTXD = 250 kHz
[1]
td(TXD-busdom)
delay time from TXD to bus
dominant
-
80
-
ns
td(TXD-busrec)
delay time from TXD to bus
recessive
-
80
-
ns
td(busdom-RXD)
delay time from bus dominant to
RXD
-
105
-
ns
UJA1167
Product data sheet
CRXD = 15 pF
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 18 April 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
45 of 60
UJA1167
NXP Semiconductors
Mini high-speed CAN system basis chip with Standby/Sleep modes &
watchdog
Table 47. Dynamic characteristics …continued
Tvj = 40 C to +150 C; VBAT = 3 V to 28 V; R(CANH-CANL) = 60 ; all voltages are defined with respect to ground; positive
currents flow into the IC; typical values are given at VBAT = 13 V; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
td(busrec-RXD)
delay time from bus recessive to
RXD
CRXD = 15 pF
-
120
-
ns
tbit(RXD)
bit time on pin RXD
tbit(TXD) = 500 ns
400
-
550
ns
twake(busdom)
bus dominant wake-up time
first pulse (after first
recessive) for wake-up on
pins CANH and CANL;
CAN Offline mode
0.5
-
3.0
s
second pulse for wake-up on
pins CANH and CANL
0.5
-
3.0
s
first pulse for wake-up on pins
CANH and CANL;
CAN Offline mode
0.5
-
3.0
s
second pulse (after first
dominant) for wake-up on
pins CANH and CANL
0.5
-
3.0
s
twake(busrec)
bus recessive wake-up time
[2]
tto(wake)
wake-up time-out time
between first and second
dominant pulses; CAN Offline
mode
570
-
1200
s
tto(dom)TXD
TXD dominant time-out time
CAN Active mode;
VTXD = 0 V
2.7
-
3.3
ms
tto(silence)
bus silence time-out time
recessive time measurement
started in all CAN modes;
RL = 120
0.95
-
1.17
s
td(busact-bias)
delay time from bus active to bias
-
-
200
s
tstartup(CAN)
CAN start-up time
-
-
220
s
when switching to Active
mode (CTS = 1)
Pin RXD: event capture timing (valid in CAN Offline mode only)
td(event)
event capture delay time
CAN Offline mode
0.9
-
1.1
ms
tblank
blanking time
when switching from Offline to
Active/Listen-only mode
-
-
25
s
ttrig(wd)1
watchdog trigger time 1
Normal mode; watchdog
Window mode only
[3]
0.45 NWP[4]
0.55 ms
NWP[4]
ttrig(wd)2
watchdog trigger time 2
Normal/Standby mode
[5]
0.9
NWP[4]
1.11 ms
NWP[4]
RLC = 00
20
-
25
ms
RLC = 01
10
-
12.5
ms
RLC = 10
3.6
-
5
ms
RLC = 11
1
-
1.5
ms
18
-
-
s
Watchdog
Pin RSTN: reset pulse width
tw(rst)
reset pulse width
output pulse width
input pulse width
UJA1167
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 18 April 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
46 of 60
UJA1167
NXP Semiconductors
Mini high-speed CAN system basis chip with Standby/Sleep modes &
watchdog
Table 47. Dynamic characteristics …continued
Tvj = 40 C to +150 C; VBAT = 3 V to 28 V; R(CANH-CANL) = 60 ; all voltages are defined with respect to ground; positive
currents flow into the IC; typical values are given at VBAT = 13 V; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
50
-
-
s
0.9
-
1.1
ms
Pin WAKE
twake
wake-up time
MTP non-volatile memory
td(MTPNV)
MTPNV delay time
before factory presets are
restored
[1]
Guaranteed by design.
[2]
See Figure 11.
[3]
A system reset will be performed if the watchdog is in Window mode and is triggered less than ttrig(wd)1 after the start of the watchdog
period (or in the first half of the watchdog period).
[4]
The nominal watchdog period is programmed via the NWP control bits.
[5]
The watchdog will be reset if it is in window mode and is triggered at least ttrig(wd)1, but not more than ttrig(wd)2, after the start of the
watchdog period (or in the second half of the watchdog period). A system reset will be performed if the watchdog is triggered more than
ttrig(wd)2 after the start of the watchdog period (watchdog overflows).
+,*+
7;'
/2:
&$1+
&$1/
GRPLQDQW
9
92GLIEXV
9
UHFHVVLYH
+,*+
5;'
/2:
WG7;'EXVGRP
WG7;'EXVUHF
WGEXVGRP5;'
WG7;'5;'
WGEXVUHF5;'
WG7;'5;'
DDD
Fig 10. CAN transceiver timing diagram
UJA1167
Product data sheet
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Rev. 2 — 18 April 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
47 of 60
UJA1167
NXP Semiconductors
Mini high-speed CAN system basis chip with Standby/Sleep modes &
watchdog
7;'
[WELW7;'
WELW7;'
5;'
WELW5;'
DDD
Fig 11. Loop delay symmetry timing diagram
6&61
W63,/($'
W63,/$*
WF\FON
WFON+
WFON/
WVX'
WK'
W:+6
6&.
6',
06%
;
/6%
;
WY4
IORDWLQJ
6'2
IORDWLQJ
;
06%
/6%
DDD
Fig 12. SPI timing diagram
UJA1167
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 18 April 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
48 of 60
UJA1167
NXP Semiconductors
Mini high-speed CAN system basis chip with Standby/Sleep modes &
watchdog
11. Application information
11.1 Application diagram
HJRIIERDUGVHQVRUVXSSO\
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(1) Actual capacitance value must be a least 1.76 F with 5 V DC offset (recommended capacitor value is 4.7 F)
(2) For bus line end nodes, RT = 60 in order to support the ‘split termination concept’. For sub-nodes, an optional ‘weak’
termination of e.g. RT = 1.3 k can be used, if required by the OEM.
Fig 13. Typical application using the UJA1167TK/VX
UJA1167
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 18 April 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
49 of 60
UJA1167
NXP Semiconductors
Mini high-speed CAN system basis chip with Standby/Sleep modes &
watchdog
HJ,1+DVFRQWUROVLJQDOIRUYROWDJHUHJXODWRU
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(1) Actual capacitance value must be a least 1.76 F with 5 V DC offset (recommended capacitor value is 4.7 F)
(2) For bus line end nodes, RT = 60 in order to support the ‘split termination concept’. For sub-nodes, an optional ‘weak’
termination of e.g. RT = 1.3 k can be used, if required by the OEM.
Fig 14. Typical application using the UJA1167TK
11.2 Application hints
Further information on the application of the UJA1167 can be found in the NXP application
hints document AH1306 Application Hints - Mini high speed CAN system basis chips
UJA1163 / UJA1164 / UJA1167 / UJA1168.
UJA1167
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 18 April 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
50 of 60
UJA1167
NXP Semiconductors
Mini high-speed CAN system basis chip with Standby/Sleep modes &
watchdog
12. Test information
BAT
RXD
CANH
RL
SBC
15 pF
TXD
100 pF
CANL
GND
015aaa369
Fig 15. Timing test circuit for CAN transceiver
10
1
BAT
TXD
CANH
13
30 Ω
f = 250 kHz
CSPLIT
4.7 nF
SBC
4
RXD
CANL
30 Ω
12
GND
2
015aaa444
Fig 16. Test circuit for measuring transceiver driver symmetry
12.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q100 Rev-G - Failure mechanism based stress test qualification for
integrated circuits, and is suitable for use in automotive applications.
UJA1167
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 18 April 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
51 of 60
UJA1167
NXP Semiconductors
Mini high-speed CAN system basis chip with Standby/Sleep modes &
watchdog
13. Package outline
+9621SODVWLFWKHUPDOHQKDQFHGYHU\WKLQVPDOORXWOLQHSDFNDJHQROHDGV
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Fig 17. Package outline SOT1086-2 (HVSON14)
UJA1167
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 18 April 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
52 of 60
UJA1167
NXP Semiconductors
Mini high-speed CAN system basis chip with Standby/Sleep modes &
watchdog
14. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling ensure that the appropriate precautions are taken as
described in JESD625-A or equivalent standards.
15. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
15.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
15.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
15.3 Wave soldering
Key characteristics in wave soldering are:
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Mini high-speed CAN system basis chip with Standby/Sleep modes &
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• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
15.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 18) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 48 and 49
Table 48.
SnPb eutectic process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
350
< 2.5
235
220
2.5
220
220
Table 49.
Lead-free process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 18.
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54 of 60
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Mini high-speed CAN system basis chip with Standby/Sleep modes &
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maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 18. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
16. Soldering of HVSON packages
Section 15 contains a brief introduction to the techniques most commonly used to solder
Surface Mounted Devices (SMD). A more detailed discussion on soldering HVSON
leadless package ICs can be found in the following application notes:
• AN10365 ‘Surface mount reflow soldering description”
• AN10366 “HVQFN application information”
UJA1167
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Rev. 2 — 18 April 2014
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55 of 60
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Mini high-speed CAN system basis chip with Standby/Sleep modes &
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17. Revision history
Table 50.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
UJA1167 v.2
20140418
Product data sheet
-
UJA1167 v.1
Modifications:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
UJA1167 v.1
UJA1167
Product data sheet
Section 1: text revised (2nd paragraph added)
Section 2.1: feature added (loop delay symmetry)
Table 2: table note amended
Section 6.1.1.4: last paragraph added
Section 6.1.1.6: text revised (3rd paragraph)
Section 6.1.1.7: text revised (4th paragraph)
Table 3: row CAN revised
Section 6.2.2: text revised
Section 6.3.1: text revised
Section 6.3.2: text revised
Section 6.7: text and state diagram revised
Table 14: description for bits CMC revised
Table 15: description for bit CTS revised
Section 6.10.3: note added at beginning of section
Section 6.15.1: text revised (4rd last paragraph); last paragraph added
Table 47: symbols and parameters revised for pins V1 and VEXT; parameters tto(SPI) and tbit(RXD)
added; additional measurement for parameter td(TXD-RXD); parameter tfltr(rst) renamed to tw(rst) and
value changed; parameter values changed: twake for pin WAKE
Figure 11: added
Section 11.2: added
Section 12.1: text updated
20130805
Product data sheet
-
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Rev. 2 — 18 April 2014
-
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18. Legal information
18.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
18.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
18.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
UJA1167
Product data sheet
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 18 April 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
57 of 60
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Mini high-speed CAN system basis chip with Standby/Sleep modes &
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No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
UJA1167
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Rev. 2 — 18 April 2014
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58 of 60
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20. Contents
1
2
2.1
2.2
2.3
2.4
2.5
2.6
3
4
5
5.1
5.2
6
6.1
6.1.1
6.1.1.1
6.1.1.2
6.1.1.3
6.1.1.4
6.1.1.5
6.1.1.6
6.1.1.7
6.1.1.8
6.1.2
6.2
6.2.1
6.2.2
6.2.3
6.2.4
6.3
6.3.1
6.3.2
6.3.3
6.4
6.5
6.5.1
6.5.2
6.6
6.7
6.7.1
6.7.1.1
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Designed for automotive applications. . . . . . . . 1
Low-drop voltage regulator for 5 V
microcontroller supply (V1) . . . . . . . . . . . . . . . . 2
Power Management . . . . . . . . . . . . . . . . . . . . . 2
System control and diagnostic features . . . . . . 2
Sensor supply voltage (pin VEXT of
UJA1167TK/VX) . . . . . . . . . . . . . . . . . . . . . . . . 3
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
Functional description . . . . . . . . . . . . . . . . . . . 6
System controller . . . . . . . . . . . . . . . . . . . . . . . 6
Operating modes . . . . . . . . . . . . . . . . . . . . . . . 6
Normal mode . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Standby mode. . . . . . . . . . . . . . . . . . . . . . . . . . 6
Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Reset mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Off mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Overtemp mode . . . . . . . . . . . . . . . . . . . . . . . . 9
Forced Normal mode . . . . . . . . . . . . . . . . . . . . 9
Hardware characterization for the UJA1167
operating modes . . . . . . . . . . . . . . . . . . . . . . . 10
System control registers . . . . . . . . . . . . . . . . . 10
Watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Software Development mode . . . . . . . . . . . . . 14
Watchdog behavior in Window mode . . . . . . . 14
Watchdog behavior in Timeout mode . . . . . . . 14
Watchdog behavior in Autonomous mode . . . 15
System reset. . . . . . . . . . . . . . . . . . . . . . . . . . 15
Characteristics of pin RSTN . . . . . . . . . . . . . . 15
Selecting the output reset pulse width . . . . . . 16
Reset sources. . . . . . . . . . . . . . . . . . . . . . . . . 16
Global temperature protection . . . . . . . . . . . . 17
Power supplies . . . . . . . . . . . . . . . . . . . . . . . . 17
Battery supply voltage (VBAT) . . . . . . . . . . . . . 17
Low-drop voltage supply for 5 V
microcontroller (V1) . . . . . . . . . . . . . . . . . . . . 17
High voltage output (UJA1167TK) and
external sensor supply (UJA1167TK/VX) . . . . 18
High-speed CAN transceiver . . . . . . . . . . . . . 19
CAN operating modes . . . . . . . . . . . . . . . . . . 19
CAN Active mode . . . . . . . . . . . . . . . . . . . . . . 19
6.7.1.2
6.7.1.3
6.7.1.4
6.7.2
6.7.3
6.8
6.8.1
6.8.2
6.8.3
6.8.4
6.9
6.10
CAN Listen-only mode . . . . . . . . . . . . . . . . . .
CAN Offline and Offline Bias modes . . . . . . .
CAN Off mode . . . . . . . . . . . . . . . . . . . . . . . .
CAN standard wake-up . . . . . . . . . . . . . . . . .
CAN control and Transceiver status registers
CAN fail-safe features . . . . . . . . . . . . . . . . . .
TXD dominant timeout . . . . . . . . . . . . . . . . . .
Pull-up on TXD pin. . . . . . . . . . . . . . . . . . . . .
V1 undervoltage event . . . . . . . . . . . . . . . . . .
Loss of power at pin BAT . . . . . . . . . . . . . . . .
Local wake-up via WAKE pin . . . . . . . . . . . . .
Wake-up and interrupt event diagnosis
via pin RXD . . . . . . . . . . . . . . . . . . . . . . . . . .
6.10.1
Interrupt/wake-up delay . . . . . . . . . . . . . . . . .
6.10.2
Sleep mode protection . . . . . . . . . . . . . . . . . .
6.10.3
Event status and event capture registers. . . .
6.11
Non-volatile SBC configuration . . . . . . . . . . .
6.11.1
Programming MTPNV cells . . . . . . . . . . . . . .
6.11.1.1 Calculating the CRC value for MTP
programming . . . . . . . . . . . . . . . . . . . . . . . . .
6.11.2
Restoring factory preset values . . . . . . . . . . .
6.12
Device ID . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.13
Lock control register. . . . . . . . . . . . . . . . . . . .
6.14
General purpose memory . . . . . . . . . . . . . . .
6.15
SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.15.1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . .
6.15.2
Register map . . . . . . . . . . . . . . . . . . . . . . . . .
6.15.3
Register configuration in UJA1167
operating modes . . . . . . . . . . . . . . . . . . . . . .
7
Limiting values . . . . . . . . . . . . . . . . . . . . . . . .
8
Thermal characteristics . . . . . . . . . . . . . . . . .
9
Static characteristics . . . . . . . . . . . . . . . . . . .
10
Dynamic characteristics. . . . . . . . . . . . . . . . .
11
Application information . . . . . . . . . . . . . . . . .
11.1
Application diagram . . . . . . . . . . . . . . . . . . . .
11.2
Application hints . . . . . . . . . . . . . . . . . . . . . . .
12
Test information . . . . . . . . . . . . . . . . . . . . . . .
12.1
Quality information . . . . . . . . . . . . . . . . . . . . .
13
Package outline. . . . . . . . . . . . . . . . . . . . . . . .
14
Handling information . . . . . . . . . . . . . . . . . . .
15
Soldering of SMD packages . . . . . . . . . . . . . .
15.1
Introduction to soldering. . . . . . . . . . . . . . . . .
15.2
Wave and reflow soldering. . . . . . . . . . . . . . .
15.3
Wave soldering . . . . . . . . . . . . . . . . . . . . . . .
15.4
Reflow soldering . . . . . . . . . . . . . . . . . . . . . .
16
Soldering of HVSON packages . . . . . . . . . . .
20
20
21
22
23
24
24
24
24
24
24
25
26
26
27
29
30
31
32
32
32
33
33
33
36
37
40
41
41
45
49
49
50
51
51
52
53
53
53
53
53
54
55
continued >>
UJA1167
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 18 April 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
59 of 60
UJA1167
NXP Semiconductors
Mini high-speed CAN system basis chip with Standby/Sleep modes &
watchdog
17
18
18.1
18.2
18.3
18.4
19
20
Revision history . . . . . . . . . . . . . . . . . . . . . . . .
Legal information. . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information. . . . . . . . . . . . . . . . . . . . .
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
56
57
57
57
57
58
58
59
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2014.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 18 April 2014
Document identifier: UJA1167
Mouser Electronics
Authorized Distributor
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