WLAN3002CZ

WLAN3002C SO N8 WLAN LNA + switch HX 2 Rev. 6 — 19 July 2019 1 Product data sheet General description The WLAN3002C is a fully integrated MMIC Low-Noise Amplifier with RX-TX SP2T switch for WLAN applications in the 4.9 GHz to 5.925 GHz ISM band. Manufactured using high performance QUBiC eighth generation SiGe:C technology of NXP. The WLAN3002C combines best-in-class noise figure, linearity, efficiency, low insertion loss CMOS switches with the process stability and ruggedness that are the hallmarks of SiGe:C technology. The WLAN3002C has a 1.5 mm x 1.5 mm footprint HX2SON8 package and a thickness of 300 µm. 2 Features and benefits • • • • • • • • • • • • • • 3 Covers full ISM high band 4900 MHz to 5925 MHz Noise figure = 2.4 dB Gain 13.5 dB High input 1 dB compression point Pi(1dB) of 0 dBm High in band IP3i of 6 dBm Supply voltage 2.7 V to 5.25 V Bypass mode current consumption of 3.5 µA Optimized performance at low supply current of 10.0 mA Integrated concurrent 2.4 GHz notch filter 4 modes of operation (high gain receive, bypass receive, transmit, and isolation modes) Integrated matching for input and output Requires only supply decoupling capacitors ESD protection on all pins (HBM > 2 kV) Small 8-pin leadless package 1.5 mm x 1.5 mm x 0.30 mm; 0.4 mm pitch Applications • • • • • IEEE 802.11a/n/ac WiFi, WLAN Smartphones, tablets, netbooks, and other portable computing devices Access points, routers, gateways Wireless video General-purpose ISM applications WLAN3002C NXP Semiconductors WLAN LNA + switch 4 Quick reference data Table 1. Quick reference data f = 5400 MHz; VCC = 3.6 V; Tamb = 25 °C; VIH = 3.3 V; VIL = 0 V; ZS = ZL = 50 Ω; Pi = -30 dBm unless otherwise specified. All measurements done on application board, see Figure 3 with tracks and SMA connectors de-embedded. Symbol Parameter Conditions Min Typ Max Unit - 10.0 13.0 mA [1] RF performances at ANT-RX path in high gain receive mode. ICC supply current high-gain receive mode [1] Gtr transducer power gain 11.5 13.5 16 dB NF noise figure - 2.4 - dB Pi(1dB) input power at 1 dB gain compression - 0 - dBm RLin input return loss - 11 - dB RLout output return loss - 15 - dB - 3.5 12 µA -9 -7 -5 dB - 0.7 - dB - 11 - dB in-band RF performance at ANT-RX path in bypass receive-mode ICC supply current Gtr transducer power gain bypass receive mode RF performance at ANT-TX path in transmit mode ɑins ISL 5 [1] [1] insertion loss RF performance at TX-ANT path in isolation mode [1] [1] isolation [1] 4.8 GHz to 5.0 GHz See Table 5 Ordering information Table 2. Ordering information Type number Orderable part number Package Name WLAN3002C WLAN3002CZ HX2SON8 6 Description Version plastic, thermal enhanced super thin small outline package; no leads; 8 terminals; body 1.5 x 1.5 x 0.30 mm SOT1260-1 Marking Table 3. Marking code Type number Marking code WLAN3002C 2C YWW: Year & Week code WLAN3002C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 6 — 19 July 2019 © NXP B.V. 2019. All rights reserved. 2 / 15 WLAN3002C NXP Semiconductors WLAN LNA + switch 7 Functional diagram TX C0 ANT C1 VCC RX aaa-022553 Figure 1.  Functional diagram WLAN3002C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 6 — 19 July 2019 © NXP B.V. 2019. All rights reserved. 3 / 15 WLAN3002C NXP Semiconductors WLAN LNA + switch 8 Pinning information 8.1 Pinning terminal 1 index area WLAN3002C VCC 1 8 RX ANT 2 7 GND C0 3 6 C1 n.c. 4 5 TX aaa-029944 Transparent top view Figure 2. Pin configuration 8.2 Pin description Table 4. Pin description WLAN3002C Product data sheet Symbol Pin Description Vcc 1 supply voltage ANT 2 antenna input / output C0 3 C0 control pin, internal pull-down NC 4 not connected to internal circuit; connect to PCB ground TX 5 transmit input C1 6 C1 control pin, internal pull-down GND 7 ground RX 8 receive output GND exposed die pad ground All information provided in this document is subject to legal disclaimers. Rev. 6 — 19 July 2019 © NXP B.V. 2019. All rights reserved. 4 / 15 WLAN3002C NXP Semiconductors WLAN LNA + switch 9 Functional description Table 5. Control signal truth table Control signal setting Mode of operation Mode name VC0 VC1 SP2T switch (pin 3) (pin 6) ANT-RX ANT-TX HIGH HIGH ON OFF OFF bypass receive mode HIGH LOW ON OFF ON high-gain receive mode LOW HIGH OFF ON OFF transmit mode LOW LOW OFF OFF OFF isolation mode LNA 10 Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). See section18.3 "Disclaimers", paragraph "limiting values". Symbol Parameter VCC supply voltage VI(C0) input voltage on pin C0 VI(C1) input voltage on pin C1 Vi(ANT) input voltage on pin ANT Vi(TX) Conditions Min Max Unit -0.3 6 V -0.3 4 V -0.3 4 V DC -0.3 +0.3 V input voltage on pin TX DC -0.2 +0.2 V Vi(RX) input voltage on pin RX DC; Vi(RX) < V CC + 1.5 V -0.3 +3.6 V Pi(ANT) input power-on pin ANT continuous wave; high-gain receive mode - 7 dBm continuous wave; bypass receive mode - 19 dBm continuous wave; isolation mode - 19 dBm continuous wave; transmit mode - 33 dBm -65 +150 °C Human Body Model (HBM) according to ANSI/ESDA/JEDEC standard JS-001 - ±2000 V Charged Device Model (CDM) according to ANSI/ESDA/JEDEC standard JS-002 - ±500 V Vi(C0) < V CC + 0.5 V Pi(TX) input power-on pin TX Tstg storage temperature VESD electrostatic discharge voltage WLAN3002C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 6 — 19 July 2019 © NXP B.V. 2019. All rights reserved. 5 / 15 WLAN3002C NXP Semiconductors WLAN LNA + switch 11 Recommended operating conditions Table 7. Recommended operating conditions Symbol Parameter f frequency VCC supply voltage VIH HIGH-level input voltage VIL LOW-level input voltage Tamb ambient temperature [1] Conditions [1] air temperature Min Typ Max Unit 4900 - 5925 MHz 2.7 3.6 5.25 V 1.62 - VCC -0.2 V V 0 - +0.4 V -40 - +85 °C Input voltage VIH pins C0, C1. Input voltage must not exceed 3.6 V. 12 Thermal characteristics Table 8. Thermal characteristics Symbol Parameter Rth(j-a) thermal resistance from junction to ambient WLAN3002C Product data sheet Conditions All information provided in this document is subject to legal disclaimers. Rev. 6 — 19 July 2019 Typ Unit 250 K/W © NXP B.V. 2019. All rights reserved. 6 / 15 WLAN3002C NXP Semiconductors WLAN LNA + switch 13 Characteristics Table 9. DC characteristics VCC = 3.6 V; Tamb = 25 °C; VIH = 3.3 V; VIL = 0 V; ZS = ZL = 50 Ω; Pi = -30 dBm unless otherwise specified. All measurements done on application board, see Figure 3 with tracks and SMA connectors de-embedded. Symbol Parameter ICC Conditions supply current Min Typ Max Unit high-gain receive mode [1] - 10.0 13.0 mA bypass receive mode [1] - 3.5 12 µA transmit mode [1] - 150 300 µA isolation mode [1] - 3.5 12 µA Ictrl(C0) control current on pin C0 - 10 15 µA Ictrl(C1) control current on pin C1 - 4 10 µA [1] See Table 5 Table 10. Transient characteristics VCC = 3.6 V; Tamb = 25 °C; VIH = 3.3 V; VIL = 0 V; ZS = ZL = 50 Ω; Pi = -30 dBm unless otherwise specified. All measurements done on application board, see Figure 3with tracks and SMA connectors de-embedded. Symbol Parameter ton toff [1] Conditions Min Typ Max Unit turn-on time [1] - - 500 ns turn-off time [1] - - 400 ns From within 10 % of the initial gain to within 10 % of the final gain. Table 11. RF characteristics f = 5400 MHz; VCC = 3.6 V; Tamb = 25 °C; VIH = 3.3 V; VIL = 0 V; ZS = ZL = 50 Ω; Pi = -30 dBm unless otherwise specified. All measurements done on application board, see Figure 3 with tracks and SMA connectors de-embedded. Symbol Parameter Conditions RF performance at ANT-RX path in high-gain receive mode Min Typ Max Unit 11.5 13.5 16 dB - - 0.5 dB - 2.4 - dB [1] Gtr transducer power gain Gp(flat) power gain flatness NF noise figure Pi(1dB) input power at 1 dB gain compression in-band - 0 - dBm IP3i input third-order intercept point 20 MHz tone spacing; Pi = -20 dBm per tone - 6 - dBm RLin input return loss - 11 - dB RLout output return loss - 15 - dB WLAN3002C Product data sheet peak-to-peak over any 80 MHz band All information provided in this document is subject to legal disclaimers. Rev. 6 — 19 July 2019 © NXP B.V. 2019. All rights reserved. 7 / 15 WLAN3002C NXP Semiconductors WLAN LNA + switch Symbol Parameter Conditions RF performance at ANT-RX path in bypass receive-mode. Min Typ Max Unit -9 -7 -5 dB [1] Gtr transducer power gain Gp(flat) power gain flatness peak-to-peak over any 80 MHz band - - 0.5 dB Pi(1dB) input power at 1 dB gain compression in-band - 17 - dBm IP3i input third-order intercept point 20 MHz tone spacing; Pi = -3 dBm per tone - 29 - dBm RLin input return loss - 12 - dB RLout output return loss - 20 - dB - 0.7 - dB [1] RF performance at ANT-TX path in transmit mode. αins insertion loss Gp(flat) power gain flatness peak-to-peak over any 80 MHz band - - 0.2 dB ISL isolation measured between pin RX and pin TX - 30 - dB Pi(1dB) input power at 1 dB gain compression in-band - 32 - dBm RLin input return loss - 17 - dB RLout output return loss - 17 - dB - 11 - dB RF performance at TX-ANT path in isolation mode. ISL [1] isolation [1] 4.8 GHz to 5.0 GHz See Table 5 WLAN3002C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 6 — 19 July 2019 © NXP B.V. 2019. All rights reserved. 8 / 15 WLAN3002C NXP Semiconductors WLAN LNA + switch 14 Application information 5 GHz transmit VCC Ca Cb TX C0 VCC ANT C1 RX 5 GHz receive aaa-030876 Figure 3.  Application information Table 12. List of components Component Name Value Quantity capacitor Ca 100 nF 1 capacitor Cb 6.8 pF 1 WLAN3002C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 6 — 19 July 2019 © NXP B.V. 2019. All rights reserved. 9 / 15 WLAN3002C NXP Semiconductors WLAN LNA + switch 15 Package outline HX2SON8: plastic, thermal enhanced super thin small outline package; no leads; 8 terminals; body 1.5 x 1.5 x 0.3 mm SOT1260-1 X B D A A E A1 seating plane terminal 1 index area detail X e1 e v w b C A B C C y1 C 1/2 e L1 1 4 y L terminal 1 index area Eh k 8 5 Dh 0 1 Dimensions: (mm are the original dimensions) Unit mm A A1 b D(1) max 0.33 0.05 0.25 1.55 nom 0.30 0.02 0.20 1.50 min 0.28 0.00 0.15 1.45 Dh 2 mm scale E(1) 1.40 1.55 1.30 1.50 1.15 1.45 Eh e e1 0.70 0.60 0.45 0.4 1.2 k L L1 v w y y1 0.35 0.10 0.20 0.25 0.05 0.07 0.05 0.05 0.05 0.15 0.15 0.00 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. Outline version SOT1260-1 References IEC JEDEC JEITA sot1260-1_po European projection Issue date 14-06-11 16-01-13 MO-255 Figure 4.  Package outline SOT1260-1(HX2SON8) WLAN3002C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 6 — 19 July 2019 © NXP B.V. 2019. All rights reserved. 10 / 15 WLAN3002C NXP Semiconductors WLAN LNA + switch 16 Handling information 16.1 Electrostatic discharge (ESD) CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling electrostatic sensitive devices. Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or equivalent standards. 16.2 Moisture sensitivity Table 13. Moisture sensitivity level Test methodology Class JESD-22-A113 1 17 Abbreviations Table 14. Abbreviations WLAN3002C Product data sheet Acronym Description CMOS complementary metal-oxide semiconductor CW continuous wave ESD electrostatic discharge HBM human body model ISM industrial, scientific, and medical LAN local area network LNA low-noise amplifier MMIC monolithic microwave-integrated circuit SiGe:C silicon germanium carbon SMA Sub-Miniature version A SP2T single pole 2 throw WLAN wireless local area network All information provided in this document is subject to legal disclaimers. Rev. 6 — 19 July 2019 © NXP B.V. 2019. All rights reserved. 11 / 15 WLAN3002C NXP Semiconductors WLAN LNA + switch 18 Revision history Table 15. Revision history Document ID Release date Data sheet status Change notice Supersedes WLAN3002C v.6 190719 Product data sheet - WLAN3002C v.5 modification status changed from Company confidential to Public WLAN3002C v.5 20190115 modification • Changed data sheet status from Preliminary to Product WLAN3002C v.4 20181210 modification • Changed data sheet from Objective to Preliminary • Added Orderable part number to Ordering information WLAN3002C v.3 20180725 modification update on ICC RX bypass, and isolation mode WLAN3002C v.2.1 20180704 modification Minor updates WLAN3002C v.2 20180626 modification WLAN3002C v.1 WLAN3002C Product data sheet Product data sheet Preliminary data sheet Objective data sheet - WLAN3002C v.4 WLAN3002C v.3 - WLAN3002C v.2.1 Objective data sheet - WLAN3002C v.2 Objective data sheet - WLAN3002C v.1 - - decoupling capacitor update few parameters updates 03232018 Objective data sheet All information provided in this document is subject to legal disclaimers. Rev. 6 — 19 July 2019 © NXP B.V. 2019. All rights reserved. 12 / 15 WLAN3002C NXP Semiconductors WLAN LNA + switch 19 Legal information 19.1 Data sheet status Document status [1][2] Product status [3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] [2] [3] Please consult the most recently issued document before initiating or completing a design. The term 'short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. notice. This document supersedes and replaces all information supplied prior to the publication hereof. 19.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 19.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without WLAN3002C Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. All information provided in this document is subject to legal disclaimers. Rev. 6 — 19 July 2019 © NXP B.V. 2019. All rights reserved. 13 / 15 WLAN3002C NXP Semiconductors WLAN LNA + switch No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of nonautomotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive WLAN3002C Product data sheet applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 19.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. All information provided in this document is subject to legal disclaimers. Rev. 6 — 19 July 2019 © NXP B.V. 2019. All rights reserved. 14 / 15 WLAN3002C NXP Semiconductors WLAN LNA + switch Contents 1 2 3 4 5 6 7 8 8.1 8.2 9 10 11 12 13 14 15 16 16.1 16.2 17 18 19 General description ............................................ 1 Features and benefits .........................................1 Applications .........................................................1 Quick reference data .......................................... 2 Ordering information .......................................... 2 Marking .................................................................2 Functional diagram ............................................. 3 Pinning information ............................................ 4 Pinning ............................................................... 4 Pin description ................................................... 4 Functional description ........................................5 Limiting values .................................................... 5 Recommended operating conditions ................ 6 Thermal characteristics ......................................6 Characteristics .................................................... 7 Application information ......................................9 Package outline .................................................10 Handling information ........................................ 11 Electrostatic discharge (ESD) ..........................11 Moisture sensitivity .......................................... 11 Abbreviations .................................................... 11 Revision history ................................................ 12 Legal information .............................................. 13 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section 'Legal information'. © NXP B.V. 2019. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 19 July 2019 Document identifier: WLAN3002C