XC7SH32GW,125

Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS semiconductors with its focus on the automotive, industrial, computing, consumer and wearable application markets In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/, use http://www.nexperia.com Instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use salesaddresses@nexperia.com (email) Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on the version, as shown below: - © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights reserved Should be replaced with: - © Nexperia B.V. (year). All rights reserved. If you have any questions related to the data sheet, please contact our nearest sales office via e-mail or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and understanding, Kind regards, Team Nexperia XC7SH32 2-input OR gate Rev. 01 — 2 September 2009 Product data sheet 1. General description XC7SH32 is a high-speed Si-gate CMOS device. It provides a 2-input OR function. 2. Features n Symmetrical output impedance n High noise immunity n ESD protection: u HBM JESD22-A114E: exceeds 2000 V u MM JESD22-A115-A: exceeds 200 V u CDM JESD22-C101C: exceeds 1000 V n Low power dissipation n Balanced propagation delays n SOT353-1 and SOT753 package options n Specified from −40 °C to +125 °C 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version XC7SH32GW −40 °C to +125 °C TSSOP5 plastic thin shrink small outline package; 5 leads; body width 1.25 mm SOT353-1 XC7SH32GV −40 °C to +125 °C SC-74A plastic surface-mounted package; 5 leads SOT753 XC7SH32 NXP Semiconductors 2-input OR gate 4. Marking Table 2. Marking codes Type number Marking code[1] XC7SH32GW fG XC7SH32GV f32 [1] The pin 1 indicator is located on the lower left corner of the device, below the marking code. 5. Functional diagram 1 B 2 A Y 1 4 ≥1 4 2 mna165 mna164 Fig 1. Logic symbol Fig 2. IEC logic symbol B Y A mna166 Fig 3. Logic diagram 6. Pinning information 6.1 Pinning XC7SH32 B 1 A 2 GND 3 5 VCC 4 Y 001aak115 Fig 4. Pin configuration SOT353-1 (TSSOP5) and SOT753 (SC-74A) XC7SH32_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 2 September 2009 2 of 11 XC7SH32 NXP Semiconductors 2-input OR gate 6.2 Pin description Table 3. Pin description Symbol Pin Description B 1 data input A 2 data input GND 3 ground (0 V) Y 4 data output VCC 5 supply voltage 7. Functional description Table 4. Function table H = HIGH voltage level; L = LOW voltage level Inputs Output A B Y L L L L H H H L H H H H 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VCC Min Max Unit supply voltage −0.5 +7.0 V VI input voltage −0.5 +7.0 V IIK input clamping current VI < −0.5 V −20 - mA IOK output clamping current VO < −0.5 V or VO > VCC + 0.5 V - ±20 mA IO output current −0.5 V < VO < VCC + 0.5 V - ±25 mA ICC supply current - 75 mA IGND ground current −75 - mA Tstg storage temperature −65 +150 °C - 250 mW total power dissipation Ptot Conditions Tamb = −40 °C to +125 °C [1] [2] [1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] For both TSSOP5 and SC-74A packages: above 87.5 °C the value of Ptot derates linearly with 4.0 mW/K. XC7SH32_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 2 September 2009 3 of 11 XC7SH32 NXP Semiconductors 2-input OR gate 9. Recommended operating conditions Table 6. Recommended operating conditions Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ Max Unit 2.0 5.0 5.5 V VCC supply voltage VI input voltage 0 - 5.5 V VO output voltage 0 - VCC V Tamb ambient temperature −40 +25 +125 °C ∆t/∆V input transition rise and fall rate VCC = 3.3 V ± 0.3 V - - 100 ns/V VCC = 5.0 V ± 0.5 V - - 20 ns/V 10. Static characteristics Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol Parameter VIH VIL VOH VOL HIGH-level input voltage LOW-level input voltage 25 °C Conditions −40 °C to +85 °C −40 °C to +125 °C Unit Min Typ Max Min Max Min Max 1.5 - - 1.5 - 1.5 - V VCC = 3.0 V 2.1 - - 2.1 - 2.1 - V VCC = 5.5 V 3.85 - - 3.85 - 3.85 - V VCC = 2.0 V - - 0.5 - 0.5 - 0.5 V VCC = 3.0 V - - 0.9 - 0.9 - 0.9 V VCC = 2.0 V VCC = 5.5 V - - 1.65 - 1.65 - 1.65 V HIGH-level VI = VIH or VIL output voltage IO = −50 µA; VCC = 2.0 V 1.9 2.0 - 1.9 - 1.9 - V IO = −50 µA; VCC = 3.0 V 2.9 3.0 - 2.9 - 2.9 - V IO = −50 µA; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V IO = −4.0 mA; VCC = 3.0 V 2.58 - - 2.48 - 2.40 - V IO = −8.0 mA; VCC = 4.5 V 3.94 - - 3.8 - 3.70 - V LOW-level VI = VIH or VIL output voltage IO = 50 µA; VCC = 2.0 V - 0 0.1 - 0.1 - 0.1 V IO = 50 µA; VCC = 3.0 V - 0 0.1 - 0.1 - 0.1 V IO = 50 µA; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V IO = 4.0 mA; VCC = 3.0 V - - 0.36 - 0.44 - 0.55 V IO = 8.0 mA; VCC = 4.5 V - - 0.36 - 0.44 - 0.55 V - - 0.1 - 1.0 - 2.0 µA supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V - - 1.0 - 10 - 40 µA input capacitance - 1.5 10 - 10 - 10 pF II input leakage current ICC CI VI = 5.5 V or GND; VCC = 0 V to 5.5 V XC7SH32_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 2 September 2009 4 of 11 XC7SH32 NXP Semiconductors 2-input OR gate 11. Dynamic characteristics Table 8. Dynamic characteristics GND = 0 V. For waveform see Figure 5. For test circuit see Figure 6. Symbol Parameter propagation delay tpd 25 °C Conditions A and B to Y VCC = 3.0 V to 3.6 V Max Min Max Min Max - 4.4 7.9 1.0 9.5 1.0 10.0 ns - 6.3 11.4 1.0 13.0 1.0 14.5 ns - 3.2 5.5 1.0 6.5 1.0 7.0 ns - 4.6 7.5 1.0 8.5 1.0 9.5 ns - 16 - - - - - pF [3] CL = 15 pF CL = 50 pF power per buffer; dissipation CL = 50 pF; f = 1 MHz; capacitance VI = GND to VCC Typ [2] CL = 50 pF CPD Min [1] CL = 15 pF VCC = 4.5 V to 5.5 V −40 °C to +85 °C −40 °C to +125 °C Unit [4] [1] tpd is the same as tPLH and tPHL. [2] Typical values are measured at VCC = 3.3 V. [3] Typical values are measured at VCC = 5.0 V. [4] CPD is used to determine the dynamic power dissipation PD (µW). PD = CPD × VCC2 × fi + Σ(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts. XC7SH32_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 2 September 2009 5 of 11 XC7SH32 NXP Semiconductors 2-input OR gate 12. Waveforms VM A, B input tPLH tPHL VM Y output mna167 Measurement points are given in Table 9. Fig 5. The input (A and B) to output (Y) propagation delays Table 9. Measurement points Type number Input XC7SH32 Output VI VM VM GND to VCC 0.5 × VCC 0.5 × VCC VCC PULSE GENERATOR VI VO DUT CL RT mna101 Test data is given in Table 10. Definitions for test circuit: CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to output impedance Zo of the pulse generator. Fig 6. Load circuitry for switching times Table 10. Test data Type XC7SH32 Input Load VI tr, tf CL VCC ≤ 3.0 ns 15 pF, 50 pF XC7SH32_1 Product data sheet Test tPLH, tPHL © NXP B.V. 2009. All rights reserved. Rev. 01 — 2 September 2009 6 of 11 XC7SH32 NXP Semiconductors 2-input OR gate 13. Package outline TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm E D SOT353-1 A X c y HE v M A Z 5 4 A2 A (A3) A1 θ 1 Lp 3 L e w M bp detail X e1 0 1.5 3 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(1) e e1 HE L Lp v w y Z(1) θ mm 1.1 0.1 0 1.0 0.8 0.15 0.30 0.15 0.25 0.08 2.25 1.85 1.35 1.15 0.65 1.3 2.25 2.0 0.425 0.46 0.21 0.3 0.1 0.1 0.60 0.15 7° 0° Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT353-1 REFERENCES IEC JEDEC JEITA MO-203 SC-88A EUROPEAN PROJECTION ISSUE DATE 00-09-01 03-02-19 Fig 7. Package outline SOT353-1 (TSSOP5) XC7SH32_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 2 September 2009 7 of 11 XC7SH32 NXP Semiconductors 2-input OR gate Plastic surface-mounted package; 5 leads SOT753 D E B y A X HE 5 v M A 4 Q A A1 c 1 2 3 Lp detail X bp e w M B 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 bp c D E e HE Lp Q v w y mm 1.1 0.9 0.100 0.013 0.40 0.25 0.26 0.10 3.1 2.7 1.7 1.3 0.95 3.0 2.5 0.6 0.2 0.33 0.23 0.2 0.2 0.1 OUTLINE VERSION REFERENCES IEC JEDEC SOT753 JEITA SC-74A EUROPEAN PROJECTION ISSUE DATE 02-04-16 06-03-16 Fig 8. Package outline SOT753 (SC-74A) XC7SH32_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 2 September 2009 8 of 11 XC7SH32 NXP Semiconductors 2-input OR gate 14. Abbreviations Table 11. Abbreviations Acronym Description CDM Charged Device Model DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 15. Revision history Table 12. Revision history Document ID Release date Data sheet status Change notice Supersedes XC7SH32_1 20090902 Product data sheet - - XC7SH32_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 2 September 2009 9 of 11 XC7SH32 NXP Semiconductors 2-input OR gate 16. Legal information 16.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 16.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com XC7SH32_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 2 September 2009 10 of 11 XC7SH32 NXP Semiconductors 2-input OR gate 18. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 4 Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Contact information. . . . . . . . . . . . . . . . . . . . . 10 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 2 September 2009 Document identifier: XC7SH32_1