XPC8240RZU250E

Freescale Semiconductor, Inc. Advance Information MPC8240RXXPNS Rev. 0, 11/2003 Freescale Semiconductor, Inc... MPC8240 Part Number Specification for the XPC8240RXXnnnx Series Part Numbers Affected: This document describes part-number-specific changes to recommended operating conditions and revised electrical specifications, as applicable, from those described in the general MPC8240 Integrated Processor Hardware Specifications (Order No. MPC8240EC). XPC8240RZU250E XPC8240RVV250E Specifications provided in this document supersede those in the MPC8240 Integrated Processor Hardware Specifications, Revision 1.0 or later, for the part numbers listed in Table A only. Specifications not addressed herein are unchanged. Because this document is frequently updated, refer to http://www.freescale.com or to a local Freescale sales office for the latest version. Note that headings and table numbers in this document are not consecutively numbered. They correspond to the heading or table affected in the general hardware specification. The part numbers addressed in this document are listed in Table A. For more detailed ordering information, see Section 1.9, “Ordering Information.” Table A. Part Number Addressed by This Data Sheet Operating Conditions M Part Number XPC8240RVV250x XPC8240RZU250x CPU Frequency VDD 250 MHz 2.625 ±125 mV TJ (°C) Significant Differences from Hardware Specification 0 to 105 Modified voltage specifications to achieve 250 MHz Note: The X prefix in a Freescale part number designates a “Pilot Production Prototype” as defined by Freescale SOP 3-13. These are part of a limited production volume of prototypes manufactured, tested, and Q.A.-inspected on qualified technology to simulate normal production. These parts have only preliminary reliability and characterization data. Before pilot production prototypes may be shipped, written authorization from the customer must be on file in the applicable sales office acknowledging the qualification status and the fact that product changes may still occur while shipping pilot production prototypes. 1.2 Features This section summarizes changes to the features of the MPC8240 described in the MPC8240 Integrated Processor Hardware Specifications. • Power management For More Information On This Product, Go to: www.freescale.com Freescale Semiconductor, Inc. General Parameters — 2.625-V processor core 1.3 General Parameters This section summarizes changes to the general parameters of the MPC8240 described in the MPC8240 Integrated Processor Hardware Specifications. • Core power supply 2.625 V ±125 mV DC nominal 1.4.1. DC Electrical Characteristics Table 2 provides the recommended operating conditions for the MPC8240 part numbers described herein. Freescale Semiconductor, Inc... Table 2. Recommended Operating Conditions Symbol Recommended Value Unit Notes VDD 2.625 ±5% V 4, 6 Supply voltage for PCI and standard bus standards OVDD 3.3 ±0.3 V 6 Supply voltages for memory bus drivers GVDD 3.3 ±5% V 8 PLL supply voltage—CPU core logic AVDD 2.625 ±5% V 4, 6 PLL supply voltage—peripheral logic AVDD2 2.6255 ±5% V 4, 7 DLL supply voltage LAVDD 2.625 ±5% V 4, 7 LVDD 5.0 ±5% V 9, 10 3.3 ±0.3 V 9, 10 0 to 3.6 or 5.75 V 2, 3 0 to 3.6 V 5 Characteristic Supply voltage PCI reference Input voltage LVDD input-tolerant signals All other inputs 2 Vin MPC8240 Part Number Specification for the XPC8240RXXnnnx Series For More Information On This Product, Go to: www.freescale.com Freescale Semiconductor, Inc. General Parameters Table 2. Recommended Operating Conditions (continued) Characteristic Freescale Semiconductor, Inc... Die-junction temperature Symbol Recommended Value Unit Tj 0 to 105 °C Notes Notes: 1. These are the recommended and tested operating conditions. Proper device operation outside of these conditions is not guaranteed. 2. These signals are designed to withstand LVDD + 0.5 V DC when LVDD is connected to a 3.3- or 5.0-V DC power supply. 3. LVDD input tolerant signals: PCI interface, EPIC control, and OSC_IN signals. 4. See Section 1.9, “Ordering Information,” for details on a modified voltage (VDD) version device. Cautions: 5. Input voltage (Vin) must not be greater than the supply voltage (VDD/AVDD/AVDD2/LAVDD) by more than 2.5 V at all times, including during power-on reset. 6. OVDD must not exceed VDD/AVDD/AVDD2/LAVDD by more than 1.8 V at any time, including during power-on reset. This limit may be exceeded for a maximum of 20 ms during power-on reset and power-down sequences. 7. VDD/AVDD/AVDD2/LAVDD must not exceed OVDD by more than 0.6 V at any time, including during power-on reset. This limit may be exceeded for a maximum of 20 ms during power-on reset and power-down sequences. 8. GVDD must not exceed VDD/AVDD/AVDD2/LAVDD by more than 1.8 V at any time, including during power-on reset. This limit may be exceeded for a maximum of 20 ms during power-on reset and power-down sequences. 9. LVDD must not exceed VDD/AVDD/AVDD2/LAVDD by more than 5.4 V at any time, including during power-on reset. This limit may be exceeded for a maximum of 20 ms during power-on reset and power-down sequences. 10.LVDD must not exceed OVDD by more than 3.6 V at any time, including during power-on reset. This limit may be exceeded for a maximum of 20 ms during power-on reset and power-down sequences. 1.4.1.5 Power Characteristics Table 5 provides power consumption data for the MPC8240. Power consumption on the PLL supply pins (AVDD and AVDD2) and the DLL supply pin (LAVDD) less than 15 mW. This parameter is guaranteed by design and is not tested. Table 5. Preliminary Power Consumption PCI Bus Clock/Memory Bus Clock CPU Clock Frequency (MHz) Mode Unit Notes 33/66/233 33/83/250 33/100/200 33/100/250 66/100/200 66/100/250 Typical 3.4 3.6 3.2 3.7 3.2 3.8 W 1, 5 Maximum—FP 3.8 4.1 3.6 4.2 3.6 4.3 W 1, 2 Maximum—INT 3.4 3.7 3.3 3.8 3.4 3.8 W 1, 3 Doze 2.2 2.4 2.2 2.6 2.2 2.6 W 1, 4, 6 Nap 700 800 900 900 900 900 mW 1, 4, 6 Sleep 500 500 500 500 800 800 mW 1, 4, 6 I/O Power Supplies Mode Typical—OVDD Minimum Maximum Unit Notes 200 600 mW 7, 8 MPC8240 Part Number Specification for the XPC8240RXXnnnx Series For More Information On This Product, Go to: www.freescale.com 3 Freescale Semiconductor, Inc. PLL Configurations Table 5. Preliminary Power Consumption (continued) PCI Bus Clock/Memory Bus Clock CPU Clock Frequency (MHz) Mode 33/66/233 Freescale Semiconductor, Inc... Typical—GVDD 33/83/250 Unit Notes mW 7, 9 33/100/200 33/100/250 66/100/200 66/100/250 300 900 Notes: 1. The values include VDD, AVDD, AVDD2, and LAVDD but do not include I/O supply power; see Section 1.7.2, “Power Supply Sizing,” in the MPC8240 Integrated Processor Hardware Specifications for information on OVDD and GVDD supply power. One DIMM is used for memory loading. 2. Maximum—FP power is measured at VDD = 2.625 V with dynamic power management enabled while running an entirely cache-resident, looping, floating point multiplication instruction. 3. Maximum—INT power is measured at VDD = 2.625 V with dynamic power management enabled while running entirely cache-resident, looping, integer instructions. 4. Power saving mode maximums are measured at VDD = 2.625 V while the device is in doze, nap, or sleep mode. 5. Typical power is measured at VDD = AVDD = 2.625 V, OVDD = 3.3 V where a nominal FP value, a nominal INT value, and a value where there is a continuous flush of cache lines with alternating ones and zeros on 64-bit boundaries to local memory are averaged. 6. Power saving mode data measured with only two PCI_CLKs and two SDRAM_CLKs enabled. 7. The typical minimum I/O power values were results of the MPC8240 performing cache resident integer operations at the slowest frequency combination of 33:66:166 (PCI:Mem:CPU) MHz. 8. The typical maximum OVDD value resulted from the MPC8240 operating at the fastest frequency combination of 66:100:250 (PCI:Mem:CPU) MHz and performing continuous flushes of cache lines with alternating ones and zeros to PCI memory. 9. The typical maximum GVDD value resulted from the MPC8240 operating at the fastest frequency combination of 66:100:250 (PCI:Mem:CPU) MHz and performing continuous flushes of cache lines with alternating ones and zeros on 64-bit boundaries to local memory. 1.5 PLL Configurations The MPC8240 internal PLLs are configured by the PLL_CFG[0:4] signals. For a given PCI_SYNC_IN (PCI bus) frequency, the PLL configuration signals set both the peripheral logic/memory bus PLL (VCO) frequency of operation for the PCI-to-memory frequency multiplying and the MPC603e CPU PLL (VCO) frequency of operation for memory-to-CPU frequency multiplying. The PLL configurations for the MPC8240 is shown in Table 18. Table 18. MPC8240 Microprocessor PLL Configurations 250-MHz Part 8, 9 Ref. No. PLL_ CFG [0:4] 2 0 00000 00110 1 00001 11000 2 00010 00101 3 00011 00101 4 4 CPU 1 PCI Clock Input HID1[0:4] (PCI_SYNC_IN) Range (MHz) 00100 00101 Ratios 3, 4 Peripheral Logic/Mem Bus Clock Range (MHz) CPU Clock Range (MHz) PCI to Mem (Mem VCO) Multiplier Mem to CPU (CPU VCO) Multiplier 25–33 75–100 188–250 3 (6) 2.5 (5) 25–27 75–83 225–250 3 (6) 3 (6) 50–56 100–112 1 (4) 2 (8) Bypass 2 (8) 2 (8) 2 (8) 50–56 5 25–28 5 Bypass 50–56 100–113 MPC8240 Part Number Specification for the XPC8240RXXnnnx Series For More Information On This Product, Go to: www.freescale.com Freescale Semiconductor, Inc. Ordering Information Table 18. MPC8240 Microprocessor PLL Configurations (continued) Freescale Semiconductor, Inc... 250-MHz Part 8, 9 Ref. No. PLL_ CFG [0:4] 2 5 00101 00110 7 00111 11000 CPU 1 PCI Clock Input HID1[0:4] (PCI_SYNC_IN) Range (MHz) 6 8 01000 11000 33 –56 A 01010 00111 C 01100 E 5 Peripheral Logic/Mem Bus Clock Range (MHz) Ratios 3, 4 CPU Clock Range (MHz) PCI to Mem (Mem VCO) Multiplier Mem to CPU (CPU VCO) Multiplier Bypass Bypass 2.5 (5) Bypass Bypass 3 (6) 33–56 100–168 1 (4) 3 (6) 25–27 50–55 225–250 2 (4) 4.5 (9) 00110 25–50 50–100 125–250 2 (4) 2.5 (5) 01110 11000 25–41 50–83 150–250 2 (4) 3 (6) 10 10000 00100 25–33 75–100 150–200 3 (6) 2 (4) 12 10010 00100 33–66 50–100 100–200 1.5 (3) 2 (4) 14 10100 11110 25–35 50–71 175–250 2 (4) 3.5 (7) 16 10110 11010 25–31 50–62 200–250 2 (4) 4 (8) 18 11000 11000 25–33 62–83 186–250 2.5 (5) 3 (6) 1A 11010 11010 50 7–62 50–62 200–250 1 (2) 4 (8) 7–55 50–83 150–250 1.5 (3) 3 (6) 50–100 125–250 1.5 (3) 2.5 (5) Off Off Off Off 1C 11100 11000 33 1D 11101 00110 33 7–66 1E 11110 01111 Not usable 1F 11111 11111 Notes: 1. The processor HID1 values only represent the multiplier of the processor’s PLL (memory-to-processor multiplier); thus, multiple MPC8240 PLL_CFG[0:4] values may have the same processor HID1 value. This implies that system software cannot read the HID1 register and associate it with a unique PLL_CFG[0:4] value. 2. PLL_CFG[0:4] settings not listed (00110, 01001, 01011, 01101, 01111, 10001, 10011, 10101, 10111, 11001, and 11011) are reserved. 3. In PLL bypass mode, the PCI_SYNC_IN input signal clocks the internal processor directly, the peripheral logic PLL is disabled, and the bus mode is set for 1:1 (PCI:Mem) mode operation. This mode is intended for hardware modeling support. The AC timing specifications given in this document do not apply in PLL bypass mode. 4. In clock-off mode, no clocking occurs inside the MPC8240 regardless of the PCI_SYNC_IN input. 5. Limited due to maximum memory VCO = 225 MHz. 6. Limited due to minimum CPU VCO = 200 MHz. 7. Limited due to minimum memory VCO = 100 MHz. 8. For clarity, range values are shown rounded down to the nearest whole number (decimal place accuracy removed). 9. Note that the 250-MHz part is available only in the XPC8240RZUnnnx number series. 1.9 Ordering Information Ordering information for the parts fully covered by this specification document is provided in Section 1.9.1, “Part Numbers Fully Addressed by This Document.” MPC8240 Part Number Specification for the XPC8240RXXnnnx Series For More Information On This Product, Go to: www.freescale.com 5 Freescale Semiconductor, Inc. Document Revision History 1.9.1 Part Numbers Fully Addressed by This Document Table 19 provides the Freescale part numbering nomenclature for the MPC8240. Note that the individual part numbers correspond to the maximum processor core frequency. For available frequencies, contact a local Freescale sales office. Each part number also contains a revision code that refers to the die mask revision number. The revision level can be determined by reading the Revision ID register at address offset 0x08. Freescale Semiconductor, Inc... Table 19. Freescale Part Numbering Nomenclature XPC nnnn x xx nnn x Product Code Part Identifier Process Descriptor Package Processor Frequency Revision Level XPC 8240 R=2.625 V ±125 mV ZU = TBGA 0° to 105°C V V = Lead free TBGA 250 E: 1.3; Revision ID = 0x13 1.9.2 Part Marking Parts are marked as in the example shown in Figure 28. XPC8240R XX250E MMMMMM ATWLYYWWA 8240 Notes: MMMMMM is the 6-digit mask number. ATWLYYWWA is the traceability code. TBGA Figure 28. Freescale Part Marking for TBGA Device Document Revision History Table B provides a revision history for this part number specification. Table B. Document Revision History Revision Number 0 6 Substantive Change(s) Initial release. Note that this document supercedes the MPC8245RZUPNS. MPC8240 Part Number Specification for the XPC8240RXXnnnx Series For More Information On This Product, Go to: www.freescale.com Freescale Semiconductor, Inc. Document Revision History Freescale Semiconductor, Inc... THIS PAGE INTENTIONALLY LEFT BLANK MPC8240 Part Number Specification for the XPC8240RXXnnnx Series For More Information On This Product, Go to: www.freescale.com 7 Freescale Semiconductor, Inc... Freescale Semiconductor, Inc. Home Page: www.freescale.com email: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. 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