HS200-TP2

HS Thermal Pads Silicone Thermal Interface Material for HS and 89 series Thermal silicone provides engineers an ideal material to improve thermal transfer, and lower operating temperatures between components and heat sinks. These thermal pads deliver considerable benefits over traditionally used materials such as thermal greases. The use of thermal pads simplifies the design and engineering process, while reducing inventory and production costs. The HS series of thermal pads was designed specifically for the ARCOL HS series and Ohmite 89 series resistors. F e at u r e s C h a r a ct e r i st i cs Composition Silicone & Ceramic-filled Color Light blue • Excellent Relative Thermal Index (RTI) • Electrically insulating • High conformability • Low durometer • Naturally tacky • UL, RoHS, and REACH Compliant • Compatible with ARCOL HS and Ohmite 89 Series Thickness 0.5mm Hardness 25 Shore C Cont. Use Temperature -40 to 150°C Breakdown Voltage >5 Kv/mm Flame Rating V-0 Thermal Conductivity 3.0 W/m.k dimensions (mm) 49.1 39.7 14.2 0.9 HS50 Ø 3.2 5.2 21.4 28.0 Ø 4.4 5.25 Ø 4.4 5.25 HS75 37.0 47.5 HS100 37.0 47.5 29.0 48.7 10.4 35.0 65.2 H A D B B C 47.5 97.7 37.0 58.0 HS250 72.5 109.7 57.2 89.0 72.5 HS300 89.7 72.5 127.7 57.2 Standard Part Numbers Compatibility Pad Part Number Ohmite Series ARCOL Series HS50-TP2 HS50-TP2 Product Type HS100-TP2 HS 100 HS200-TP2 HS 200 Material Type 850 HS75-TP2 HS150-TP2 HS250-TP2 HS300-TP2 HS 50 HS 75 HS 150 HS 250 HS 300 rev 7/21-1 1-866-9-OHMITE • Int’l 1-847-258-0300 • Fax 1-847-574-7522 • www.ohmite.com • info@ohmite.com 21 70.0 59.0 104.0 O r d e r i n g i n f o r m at i o n Thermal Pad D HS150 HS200 C HS150 - 300 15.4 E G A F E F G 5.25 20.4 29.0 7.65 10.4 44.5 7.65 10.4 6.75 12.4 35.0 52.0 H 4.4 5.1 5.1 6.6