HVF Series
Ohmite’s High Voltage Flip Chip Series incorporates
high accuracy screen printing technology to achieve
high voltage capability in a stable flip chip SMD chip
resistor package. The HVF Series offers unmatched
performance in comparison to standard chip resistors. Its unique design provides lower voltage and
temperature coefficients, less noise, tighter tolerances, better stability, higher resistance values, and
higher voltage ratings. HVF is available in convenient
1206 and 2512 footprints.
High Voltage
Flip Chip Film
This product has been
DISCONTINUED
December 2017
F e at u r e s
• High voltage up to 3,000 volts
• Industry standard sizes
• Working temperature range –55°C to 200°C
• Designed for automatic insertion
• Non-magnetic construction
S ER I E S S P E C I F I C AT I O N S
Series
Resistance Range
HVF1206
1K-100M
>100M-10G
>10G-100G
HVF2512
1K-100G
Tol.
Power Rating (mW)
1% std.
300
5%
10%
1% std.
1000
Voltage Rating*
1,500
3,000
*Use Ohm’s Law (V= √P*R) to calculate maximum working voltage.
**Maximum available quantity per reel is 3,500 for 1206 size and 2,000 for 2512 size; call 1-866-9-OHMITE for
details.
ch a r a c t e r is t ics
Resistance Range 1KΩ to 100GΩ
Resistance Tolerance ±1% std.; 5% for HVF1206 100MΩ-10GΩ more; 10% for 10GΩ+
Temperature Coefficient ±100ppm std.
Coating Silicone
Solder Pad Material Silver (PdAg)
Note: HVF Series should not be used with tin-lead based solder compositions. Only silver-based solder compositions are recommended. Care should be taken in the selection of the solder flux contained in the solder paste.
Some pastes are "corrosive" and can damage the coating and also the resistive layer during the soldering process at high temperature. PCBs must be properly cleaned to remove any layers of moisture containing halides
below the resistor.
We recommend Halide Free (or Halogen Free) solder pastes, containing for example ROL0 or similar.
It is advisable for the PCB layout to provide a slot, or air gap, underneath the downward facing resistor element,
thereby increasing insulation resistance and reducing the possibility of capacitive coupling to the PCB. Under no
circumstances should any copper trace be present in the layout directly under the resistive element.
Derating
Voltage coefficient of Resistance
Percent Rated Watts
100
70°
80
60
40
20
0
0
50
100
150
Ambient Temperature, °C
200
Series
Resistance
Range
VCR
(-ppm/V)*
1206
1K ..10MΩ
>10M ..100MΩ
>100M ..1GΩ
>1GΩ .. 5GΩ
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