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HVF2512T5007FE

HVF2512T5007FE

  • 厂商:

    OHMITE(欧米特)

  • 封装:

    2512

  • 描述:

    电阻器 5GΩ ±1% 1W ±100ppm/℃ 2512

  • 数据手册
  • 价格&库存
HVF2512T5007FE 数据手册
HVF Series Ohmite’s High Voltage Flip Chip Series incorporates high accuracy screen printing technology to achieve high voltage capability in a stable flip chip SMD chip resistor package. The HVF Series offers unmatched performance in comparison to standard chip resistors. Its unique design provides lower voltage and temperature coefficients, less noise, tighter tolerances, better stability, higher resistance values, and higher voltage ratings. HVF is available in convenient 1206 and 2512 footprints. High Voltage Flip Chip Film This product has been DISCONTINUED December 2017 F e at u r e s • High voltage up to 3,000 volts • Industry standard sizes • Working temperature range –55°C to 200°C • Designed for automatic insertion • Non-magnetic construction S ER I E S S P E C I F I C AT I O N S Series Resistance Range HVF1206 1K-100M >100M-10G >10G-100G HVF2512 1K-100G Tol. Power Rating (mW) 1% std. 300 5% 10% 1% std. 1000 Voltage Rating* 1,500 3,000 *Use Ohm’s Law (V= √P*R) to calculate maximum working voltage. **Maximum available quantity per reel is 3,500 for 1206 size and 2,000 for 2512 size; call 1-866-9-OHMITE for details. ch a r a c t e r is t ics Resistance Range 1KΩ to 100GΩ Resistance Tolerance ±1% std.; 5% for HVF1206 100MΩ-10GΩ more; 10% for 10GΩ+ Temperature Coefficient ±100ppm std. Coating Silicone Solder Pad Material Silver (PdAg) Note: HVF Series should not be used with tin-lead based solder compositions. Only silver-based solder compositions are recommended. Care should be taken in the selection of the solder flux contained in the solder paste. Some pastes are "corrosive" and can damage the coating and also the resistive layer during the soldering process at high temperature. PCBs must be properly cleaned to remove any layers of moisture containing halides below the resistor. We recommend Halide Free (or Halogen Free) solder pastes, containing for example ROL0 or similar. It is advisable for the PCB layout to provide a slot, or air gap, underneath the downward facing resistor element, thereby increasing insulation resistance and reducing the possibility of capacitive coupling to the PCB. Under no circumstances should any copper trace be present in the layout directly under the resistive element. Derating Voltage coefficient of Resistance Percent Rated Watts 100 70° 80 60 40 20 0 0 50 100 150 Ambient Temperature, °C 200 Series Resistance Range VCR (-ppm/V)* 1206 1K ..10MΩ >10M ..100MΩ >100M ..1GΩ >1GΩ .. 5GΩ
HVF2512T5007FE 价格&库存

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