TGH-TP1

Thermal Pads Thermal Interface Material for Heatsinkable devices Ohmite thermal interface materials (TIMs) are designed for use in applications requiring reliable performance, low contact resistance, long life, low maintenance and high thermal conductivity. The flexible graphite materials are die-cut to ensure exact fit and reduce module-to-module variation during assembly. The compressibility of the material improves surface contact, reducing thermal impedance. The material compression can compensate for flatness variations of up to 125μm. The high in-plane thermal conductivity of this material reduces hot spots. Ohmite’s high performance TIMs are designed for long life applications with extreme heat cycles and are made of flexible graphite specifically engineered for demanding power electronics applications. F e at u r e s a pp l i c a t i o n s • Consistent, reliable thermal performance enabling zero maintenance applications • Will not low or pump out under any thermal extremes, thermal cycles, power again and power cycling or part orientation • No degradation in performance from initial install and over the life of the application, reducing PM and improving MTTF • Assembly-ready foil form factor eliminates dispensing and cleaning processes • Easy installation removes the need for Burn-in or re-torque, enabling a single step install • Minimal outgassing prevents fouling of optics in lighting applications Power modules such as IGBT, RF devices used in: • UPS and inverters • Motor drives • Base stations / Telecommunication • Thermo Electric Devices • Power supply modules, rectifiers and chargers • High performance computers and servers • EV / HEV / PHEV modules s p e c i f i c at i o n s Ohmite Part Device type TGH-TP1 SOT-227 Ohmite series All TGHxxx Typical thickness 200um ±20 Min. Clamping Force Operating Temperature 100kPa (15psi) -40° to +400°C (-40° to +752°F) dimensions (mm) Ø4.5 37.5 20 10 30.0 1-866-9-OHMITE • Int’l 1-847-258-0300 • Fax 1-847-574-7522 • www.ohmite.com • info@ohmite.com 21 Thermal Pads Thermal Interface Material for Heatsinkable devices Characteristics At room temperature. Properties listed are typical and cannot be used as accept/reject specifications. Thermal Impedance 0.49 K-cm2/W @ 200 kPa (29 psi); 0.18 K-cm2/W @ 700 kPa (101 psi) Typical Thermal Through-Plane: 7 W/m-K @ 700 kPa Conductivity In-Plane: 800 W/m-K @ 700 kPa In-Plane conductivity at ambient temperature determined using Angstrom’s Method. Thru-thickness conductivity determined using ASTM D5470 Modified Method. Typical Starting 200μm ±20 (0.008” ±0.001) Thickness Coefficient of Thermal Through-Thickness: 27 ppm/°C Expansion In-Plane: -0.4 ppm/°C Electrical Conductivity Through-Thickness: 5 S/cm In-Plane: 19,000 S/cm Flammability Rating UL 94V-0 Compliant Operating -40 to +400°C Temperature Specific Heat 0.80J/g-°C @ 25°C Thermal Impedance vs. Interface Pressure Total Thermal Impedance (K-cm)2/W 1.2 Thermal impedance reduces significantly with pressure, ensuring excellent performance in pressure ranges common for most standard modules and power electronic devices per manufacturer’s application guide. 1.0 0.8 0.6 0.4 0.2 0 15 100 29 200 51 350 Pressure 102 700 116 (psi) 800 (kPa) Thickness Under Compression 0.25 Thickness (mm) Max. Clamping Force 100 kPa (15 PSI) Surface Compensation @ 700 KPA (100 PSI); Up to 0.030 mm roughness; Up to 0.1 mm flatness compensation Material Compression @ 700 KPA (100 PSI); 70% of starting thickness Outgassing Losses