ML9206

E2C0042-19-62 ¡ Semiconductor ¡ Semiconductor ML9206-xx GENERAL DESCRIPTION This version: ML9206-xx Jun. 1999 5 ¥ 7 Dot Character ¥ 16-Digit Display Controller/Driver with Character RAM The ML9206-xx is a dot matrix vacuum fluorescent display tube controller driver IC which displays characters, numerics and symbols. Dot matrix vacuum fluorescent display tube drive signals are generated by serial data sent from a micro-controller. A display system is easily realized by internal ROM and RAM for character display. The ML9206-xx has low power consumption since it is made by CMOS process technology. -01 is available as a general-purpose code. Custom codes are provided on customer's request. FEATURES • Logic power supply and vacuum fluorescent display tube drive power supply (VDD) : 3.3 V± 10% or 5.0 V± 10% • Fluorescent display tube drive power supply (VFL) : –20 to –60 V • VFD driver output current (VFD driver output can be connected directly to the fluorescent display tube. No pull-down resistor is required.) - Segment driver (SEG1 to SEG35) : –6 mA (VFL=–60V) - Segment driver (AD1 and AD2) : –15 mA (VFL=–60V) - Grid driver (COM1 to COM16) : –30 mA (VFL=–60V) • General output port output current - Output driver (P1 and P2) : ± 1 mA (VDD=3.3V± 10%) ± 2 mA (VDD=5.0V± 10%) • Content of display - CGROM 5¥7 dots : 248 types (character data) - CGRAM 5¥7 dots : 8 types (character data) - ADRAM 16 (display digit) ¥2 bits (symbol data) - DCRAM 16 (display digit) ¥8 bits (register for character data display) - General output port 2 bits (static operation) • Display control function - Display digit : 1 to 16 digits - Display duty (brightness adjustment) : 256 stages - All lights ON/OFF • 3 interfaces with microcontroller : DA, CS, CP (4 interfaces when RESET is added) • 1-byte instruction execution (excluding data write and display duty set mode to RAM) • Built-in oscillation circuit (external R and C) • Package options: 64-pin plastic QFP (QFP64-P-1414-0.80-BK) (Product name : ML9206-xxGS-BK) 64-pin plastic SSOP (SSOP64-P-525-0.80-K) (Product name : ML9206-xxGS-K) xx indicates the code number. 1/32 ¡ Semiconductor ML9206-xx BLOCK DIAGRAM VDD GND VFL DCRAM 16w¥8b CGROM 248w¥35b Segment Driver RESET DA CP CS 8bit Shift Register CGRAM 8w¥35b SEG35 AD1 AD Driver AD2 SEG1 ADRAM 16w¥2b Address Selector Command Decoder Control Circuit Write Address Counter Read Address Counter P1 Port Driver P2 Digit Control Duty Control COM1 Grid Driver COM16 Timing Generator 1 OSC0 OSC1 Oscillator Timing Generator 2 2/32 ¡ Semiconductor ML9206-xx INPUT AND OUTPUT CONFIGURATION Schematic Diagrams of Logic Portion Input and Output Circuits Input Pin VDD VDD INPUT GND GND Output Pin VDD VDD OUTPUT GND GND Schematic Diagram of Driver Output Circuit VDD VDD OUTPUT VFL VFL 3/32 ¡ Semiconductor PIN CONFIGURATION (TOP VIEW) 52 RESET SEG10 SEG11 SEG12 SEG13 SEG14 10 SEG15 11 SEG16 12 SEG17 13 SEG18 14 SEG19 15 SEG20 16 
64 SEG4 63 SEG3 62 SEG2 61 SEG1 SEG5 SEG6 SEG7 SEG8 SEG9 1 2 3 4 5 6 7 8 9 ML9206-xx 51 OSC1 50 OSC0 49 GND 48 VFL 47 COM16 46 COM15 45 COM14 44 COM13 43 COM12 42 COM11 41 COM10 40 COM9 39 COM8 38 COM7 37 COM6 36 COM5 35 COM4 34 COM3 33 COM2 60 AD1 59 AD2 56 VDD 55 DA SEG30 26 SEG21 17 SEG22 18 SEG23 19 SEG24 20 SEG25 21 SEG26 22 SEG27 23 SEG28 24 SEG29 25 SEG31 27 SEG32 28 53 CS 54 CP 58 P2 57 P1 SEG33 29 SEG34 30 SEG35 31 NC: No connection 64-Pin Plastic QFP COM1 32 4/32 ¡ Semiconductor     P1 P2 1 2 3 4 5 6 7 8 9 AD2 AD1 SEG1 SEG2 SEG3 SEG4 SEG5 SEG6 SEG7 SEG8 SEG9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 SEG10 SEG11 SEG12 SEG13 SEG14 SEG15 SEG16 SEG17 SEG18 SEG19 SEG20 SEG21 SEG22 SEG23 SEG24 SEG25 SEG26 SEG27 SEG28 64-Pin Plastic SSOP ML9206-xx 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 VDD DA CP CS RESET OSC1 OSC0 GND VFL COM16 COM15 COM14 COM13 COM12 COM11 COM10 COM9 COM8 COM7 COM6 COM5 COM4 COM3 COM2 COM1 SEG35 SEG34 SEG33 SEG32 SEG31 SEG30 SEG29 5/32 ¡ Semiconductor ML9206-xx PIN DESCRIPTION Pin QFP SSOP Symbol Type Connects to Fluorescent tube anode electrode Fluorescent tube grid electrode Fluorescent tube anode electrode LED drive control pins Power supply Microcontroller Microcontroller Microcontroller Description Fluorescent display tube anode electrode drive output. Directly connected to fluorescent display tube and a pull-down resistor is not necessary. IOH>–6 mA Fluorescent display tube grid electrode drive output. Directly connected to fluorescent display tube and a pull-down resistor is not necessary. IOH>–30 mA Fluorescent display tube anode electrode drive output. Directly connected to fluorescent display tube and a pull-down resistor is not necessary. IOH>–15 mA General port output. Output of these pins in static operation, so these pins can drive the LED. VDD-GND are power supplies for internal logic. VDD-VFL are power supplies for driving fluorescent tubes. Apply VFL after VDD is applied. Serial data input (positive logic). Input from LSB. Shift clock input. Serial data is shifted on the rising edge of CP. Chip select input. Serial data transfer is disabled when CS pin is "H" level. Reset input. "Low" initializes all the functions. Initial status is as follows. address "00"H • Address of each RAM Content is undefined • Data of each RAM 16 digits • Display digit 0/256 • brightness adjusment OFF mode • All lights ON or OFF "Low" level • All outputs RESET C2 R2 (Circuit when R and C are connected externally) See Application Circuit. 1 to 31, 5 to 39 SEG1 to 35 61 to 64 O 32 to 47 40 to 55 COM1 to 16 O 59, 60 3, 4 AD1, AD2 O 57, 58 56 49 48 55 54 53 1, 2 64 57 56 63 62 61 P1, P2 VDD GND VFL DA CP CS O — I I I 52 60 RESET I Microcontroller or C2, R2 50 58 OSC0 I C1, R1 External RC pin for RC oscillation. Connect R and C externally. The RC time constant depends on the VDD voltage used. Set the target oscillation frequency to 2 MHz. OSC0 R1 OSC1 C1 (RC oscillation circuit) See Application Circuit. 51 59 OSC1 O 6/32 ¡ Semiconductor ML9206-xx ABSOLUTE MAXIMUM RATINGS Parameter Supply Voltage (1) Supply Voltage (2) Input Voltage Power Dissipation Storage Temperature Symbol VDD VFL VIN PD TSTG IO1 Output Current IO2 IO3 IO4 Condition — — — Ta≥25°C — COM1 to COM16 AD1, AD2 SEG1 to SEG35 P1, P2 QFP SSOP Rating –0.3 to +6.5 –80 to VDD+0.3 –0.3 to VDD+0.3 541 590 –55 to +150 –40 to 0.0 –20 to 0.0 –10 to 0.0 –4.0 to +4.0 mA Unit V V V mW °C RECOMMENDED OPERATING CONDITIONS-1 When the power supply voltage is 5V (typ.) Parameter Supply Voltage (1) Supply Voltage (2) High Level Input Voltage Low Level Input Voltage CP Frequency Oscillation Frequency Frame Frequency Operating Temperature Symbol VDD VFL VIH VIL fC fOSC fFR Top Condition — — All input pins excluding OSC0 pin — R1=3.3kW, C1=47pF DIGIT=1 to 16, R1=3.3kW, C1=47pF Min. 4.5 –60 — — 1.5 183 –40 Typ. 5.0 — — — — 2.0 244 — Max. 5.5 –20 — 0.3VDD 2.0 2.5 305 +85 Unit V V V V MHz MHz Hz °C All input pins excluding OSC0 pin 0.7VDD — 7/32 ¡ Semiconductor ML9206-xx RECOMMENDED OPERATING CONDITIONS-2 When the power supply voltage is 3.3V (typ.) Parameter Supply Voltage (1) Supply Voltage (2) High Level Input Voltage Low Level Input Voltage CP Frequency Oscillation Frequency Frame Frequency Operating Temperature Symbol VDD VFL VIH VIL fC fOSC fFR Top Condition — — All input pins excluding OSC0 pin — R1=3.3kW, C1=39pF DIGIT=1 to 16, R1=3.3kW, C1=39pF Min. 3.0 –60 — — 1.5 183 –40 Typ. 3.3 — — — — 2.0 244 — Max. 3.6 –20 — 0.2VDD 2.0 2.5 305 +85 Unit V V V V MHz MHz Hz °C All input pins excluding OSC0 pin 0.8VDD — ELECTRICAL CHARACTERISTICS DC Characteristics-1 (VDD=5.0V±10%, VFL=–60V, Ta=–40 to +85°C, unless otherwise specified) Parameter High Level Input Voltage Low Level Input Voltage High Level Input Current Low Level Input Current Symbol VIH VIL IIH IIL VOH1 High Level Output Voltage VOH2 VOH3 VOH4 Low Level Output Voltage VOL2 IDD1 Supply Current IDD2 VDD VOL1 Applied pin CS, CP, DA, RESET CS, CP, DA, RESET CS, CP, DA, RESET CS, CP, DA, RESET COM1 to 16 AD1, AD2 SEG1 to 35 P1, P2 COM1 to 16 AD1, AD2 SEG1 to 35 P1, P2 IOL1=2mA Duty=240/256 fOSC= 2MHz, no load Digit=1 to 16 All output lights ON Duty=128/256 Digit=1 to 9 All output lights OFF — 3 mA — 4 mA — 1.0 V — — VFL+1.0 V Condition — — VIH=VDD VIL=0.0V IOH1=–30mA IOH2=–15mA IOH3=–6mA IOH4=–2mA Min. 0.7VDD — –1.0 –1.0 VDD–1.5 VDD–1.5 VDD–1.5 VDD–1.0 Max. — 0.3VDD +1.0 +1.0 — — — — Unit V V µA µA V V V V 8/32 ¡ Semiconductor DC Characteristics-2 Parameter High Level Input Voltage Low Level Input Voltage High Level Input Current Low Level Input Current Symbol VIH VIL IIH IIL VOH1 High Level Output Voltage VOH2 VOH3 VOH4 Low Level Output Voltage VOL2 IDD1 Supply Current IDD2 VDD VOL1 ML9206-xx (VDD=3.3V±10%, VFL=–60V, Ta=–40 to +85°C, unless otherwise specified) Applied pin CS, CP, DA, RESET CS, CP, DA, RESET CS, CP, DA, RESET CS, CP, DA, RESET COM1 to 16 AD1, AD2 SEG1 to 35 P1, P2 COM1 to 16 AD1, AD2 SEG1 to 35 P1, P2 IOL1=1mA Duty=240/256 fOSC= 2MHz, no load Digit=1 to 16 All output lights ON Duty=128/256 Digit=1 to 9 All output lights OFF — 2 mA — 3 mA — 1.0 V — — VFL+1.0 V Condition — — VIH=VDD VIL=0.0V IOH1=–30mA IOH2=–15mA IOH3=–6mA IOH4=–1mA Min. 0.8VDD — –1.0 –1.0 VDD–1.5 VDD–1.5 VDD–1.5 VDD–1.0 Max. — 0.2VDD +1.0 +1.0 — — — — Unit V V µA µA V V V V 9/32 ¡ Semiconductor AC Characteristics-1 ML9206-xx (VDD=5.0V±10%, VFL=–60V, Ta=–40 to +85°C, unless otherwise specified) Parameter CP Frequency CP Pulse Width DA Setup Time DA Hold Time CS Setup Time CS Hold Time CS Wait Time Data Processing Time RESET Pulse Width RESET Time DA Wait Time All Output Slew Rate VDD Rise Time VDD Off Time Symbol fC tCW tDS tDH tCSS tCSH tCSW tDOFF tWRES Condition — — — — — R1=3.3kW, C1=47pF — R1=3.3kW, C1=47pF When RESET signal is input from microcontroller etc. externally When RESET signal is input from microcontroller etc. externally R2=1.0kW, C2=0.1mF tRSOFF tR tF tPRZ tPOF Cl=100pF — tR=20% to 80% tF=80% to 20% Min. — 250 250 250 250 16 250 8 250 250 — 250 — — — 5.0 Max. 2.0 — — — — — — — — — 200 — 2.0 2.0 100 — Unit MHz ns ns ns ns ms ns ms ns ns ms ns ms ms ms ms tRSON When mounted in the unit When mounted in the unit, VDD=0.0V AC Characteristics-2 (VDD=3.3V±10%, VFL=–60V, Ta=–40 to +85°C, unless otherwise specified) Parameter CP Frequency CP Pulse Width DA Setup Time DA Hold Time CS Setup Time CS Hold Time CS Wait Time Data Processing Time RESET Pulse Width RESET Time DA Wait Time All Output Slew Rate VDD Rise Time VDD Off Time Symbol fC tCW tDS tDH tCSS tCSH tCSW tDOFF tWRES Condition — — — — — R1=3.3kW, C1=39pF — R1=3.3kW, C1=39pF When RESET signal is input from microcontroller etc. externally When RESET signal is input from microcontroller etc. externally R2=1.0kW, C2=0.1mF tRSOFF tR tF tPRZ tPOF Cl=100pF — tR=20% to 80% tF=80% to 20% Min. — 250 250 250 250 16 250 8 250 250 — 250 — — — 5.0 Max. 2.0 — — — — — — — — — 200 — 2.0 2.0 100 — Unit MHz ns ns ns ns ms ns ms ns ns ms ns ms ms ms ms tRSON When mounted in the unit When mounted in the unit, VDD=0.0V 10/32 ¡ Semiconductor ML9206-xx TIMING DIAGRAM Symbol VIH VIL VDD=3.3V±10% 0.8 VDD 0.2 VDD VDD=5.0V±10% 0.7 VDD 0.3 VDD • Data Timing tCSS CS fC CP tDS DA VALID VALID tDOFF tDH VALID VALID VIH VIL tCW tCW tCSH VIH VIL tCSW VIH VIL • Reset Timing 0.8 VDD 0.0 V VIH 0.5 VDD VIL VIH VIL VDD RESET tPRZ tRSON tRSOFF tPOF When input externally tWRES When external R and C are connected tRSOFF DA • Output Timing = All outputs tR tF 0.8 VDD 0.2 VFL 11/32 ¡ Semiconductor ML9206-xx • Digit Output Timing (for 16-digit display, at a duty of 240/256) T=2/ fOSC Frame cycle t1=4096T (t1=4.096 ms when fosc=2.0 MHz) Display timing t2=240T (t2=240 ms when fosc=2.0 MHz) Blank timing t3=16T (t3=16 ms when fosc=2.0 MHz) COM1 COM2 COM3 COM4 COM5 COM6 COM7 COM8 COM9 COM10 COM11 COM12 COM13 COM14 COM15 COM16 AD1, 2 SEG1-35 VDD VFL VDD VFL 12/32 ¡ Semiconductor ML9206-xx FUNCTIONAL DESCRIPTION Commands List LSB Command 1 DCRAM data write 1st byte B1 X1 B2 X2 B3 X3 B4 1 B5 0 B6 0 MSB LSB 2nd byte B1 C1 B2 C2 B3 C3 B4 C4 B5 C5 B6 C6 MSB B0 X0 B7 0 B0 C0 C0 C1 B7 C7 C5 C10 C15 C20 C25 C30 C6 C11 C16 C21 C26 C31 C7 C12 C17 C22 C27 C32 C8 C13 C18 C23 C28 C33 C9 C14 C19 C24 C29 C34 C1 D1 : : : : : : : : * D2 * D3 * D4 * D5 * D6 2 CGRAM data write X0 X1 X2 * 0 1 0 0 C2 C3 C4 * * * * * * D7 2nd byte 3rd byte 4th byte 5th byte 6th byte 3 ADRAM data write 5 Display duty set 6 Number of digits set 7 All lights ON/OFF Test mode X0 * K0 L X1 P2 * K1 H X2 * * K2 X3 * * * 1 0 1 0 1 1 0 0 1 1 0 1 1 1 1 0 0 0 0 0 C0 D0 4 General output port set P1 * * * Xn Cn Pn Dn Kn H L When data is written to RAM (DCRAM, CGRAM, ADRAM) continuously, addresses are internally incremented automatically. Therefore it is not necessary to specify the 1st byte to write RAM data for the 2nd and later bytes. Note: The test mode is used for inspection before shipment. It is not a user function. Don't care Address specification for each RAM Character code specification for each RAM General output port status specification Display duty specification Number of digits specification All lights ON instruction All lights OFF instruction 13/32 ¡ Semiconductor Positional Relationship Between SEGn and ADn (one digit) ML9206-xx C0 AD1 C1 AD2 C0 SEG1 ADRAM written data. Corresponds to 2nd byte C3 SEG4 C1 SEG2 C2 SEG3 C4 SEG5 C5 SEG6 C6 SEG7 C7 SEG8 C8 SEG9 C9 SEG10 C10 SEG11 C11 SEG12 C12 SEG13 C13 SEG14 C14 SEG15 C15 SEG16 C16 SEG17 C17 SEG18 C18 SEG19 C19 SEG20 C20 SEG21 C21 SEG22 C22 SEG23 C23 SEG24 C24 SEG25 C25 SEG26 C26 SEG27 C27 SEG28 C28 SEG29 C29 SEG30 C30 SEG31 C31 SEG32 C32 SEG33 C33 SEG34 C34 SEG35 CGRAM written data. Corresponds to 2nd byte CGRAM written data. Corresponds to 3rd byte CGRAM written data. Corresponds to 4th byte CGRAM written data. Corresponds to 6th byte CGRAM written data. Corresponds to 5th byte 14/32 ¡ Semiconductor Data Transfer Method and Command Write Method Display control command and data are written by an 8-bit serial transfer. Write timing is shown in the figure below. ML9206-xx Setting the CS pin to "Low" level enables a data transfer. Data is 8 bits and is sequentially input into the DA pin from LSB (LSB first). As shown in the figure below, data is read by the shift register at the rising edge of the shift clock, which is input into the CP pin. If 8-bit data is input, internal load signals are automatically generated and data is written to each register and RAM. Therefore it is not necessary to input load signals from the outside. Setting the CS pin to "High" disables data transfer. Data input from the point when the CS pin changes from "High" to "Low" is recognized in 8-bit units. CS CP tDOFF tCSH DA B0 B1 B2 B3 B4 B5 B6 B7 LSB 1st byte MSB B0 B1 B2 B3 B4 B5 B6 B7 LSB 2nd byte MSB B0 B1 B2 B3 B4 B5 B6 B7 LSB 2nd byte MSB When data is written to DCRAM* Command and address data Character code data Character code data of the next address * When data is written to RAM (DCRAM, ADRAM, CGRAM) continuously, addresses are internally incremented automatically. Therefore it is not necessary to specify the 1st byte to write RAM data for the 2nd and later bytes. Reset Function Reset is executed when the RESET pin is set to "L", (when turning power on, for example) and initializes all functions. Initial status is as follows. • Address of each RAM .................. address "00"H • Data of each RAM ........................ All contents are undefined • General output port ..................... All general output ports go "Low" • Display digit .................................. 16 digits • Brightness adjustment ................. 0/256 • All display lights ON or OFF ..... OFF mode • Segment output ............................ All segment outputs go "Low" • AD output ..................................... All AD outputs go "Low" Please set again according to "Setting Flowchart" after reset. 15/32 ¡ Semiconductor Description of Commands and Functions ML9206-xx 1. DCRAM data write (Specifies the address of DCRAM and writes the character code of CGROM and CGRAM.) DCRAM (Data Control RAM) has a 4-bit address to store character code of CGROM and CGRAM. The character code specified by DCRAM is converted to a 5¥7 dot matrix character pattern via CGROM or CGRAM. (The DCRAM can store 16 characters.) [Command format] LSB MSB B0 B1 B2 B3 B4 B5 B6 B7 1st byte (1st) X0 X1 X2 X3 LSB 1 0 0 0 MSB : selects DCRAM data write mode and specifies DCRAM address (Ex: Specifies DCRAM address 0H) : specifies character code of CGROM and CGRAM (written into DCRAM address 0H) B0 B1 B2 B3 B4 B5 B6 B7 2nd byte (2nd) C0 C1 C2 C3 C4 C5 C6 C7 To specify the character code of CGROM and CGRAM continuously to the next address, specify only character code as follows. The addresses of DCRAM are automatically incremented. Specification of the 1st byte is unnecessary. 16/32 ¡ Semiconductor ML9206-xx LSB MSB B0 B1 B2 B3 B4 B5 B6 B7 2nd byte (3rd) C0 C1 C2 C3 C4 C5 C6 C7 LSB MSB : specifies character code of CGROM and CGRAM (written into DCRAM address 1H) B0 B1 B2 B3 B4 B5 B6 B7 2nd byte (4th) C0 C1 C2 C3 C4 C5 C6 C7 : specifies character code of CGROM and CGRAM (written into DCRAM address 2H) LSB MSB B0 B1 B2 B3 B4 B5 B6 B7 2nd byte (17th) C0 C1 C2 C3 C4 C5 C6 C7 LSB MSB : specifies character code of CGROM and CGRAM (written into DCRAM address FH) B0 B1 B2 B3 B4 B5 B6 B7 2nd byte (18th) C0 C1 C2 C3 C4 C5 C6 C7 : specifies character code of CGROM and CGRAM (DCRAM address 0H is rewritten) X0 (LSB) to X3 (MSB): DCRAM addresses (4 bits: 16 characters) C0 (LSB) to C7 (MSB): Character code of CGROM and CGRAM (8 bits: 256 characters) [COM positions and set DCRAM addresses] HEX X0 X1 X2 X3 0 1 2 3 4 5 6 7 8 9 A B C D E F 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 COM position COM1 COM2 COM3 COM4 COM5 COM6 COM7 COM8 COM9 COM10 COM11 COM12 COM13 COM14 COM15 COM16 17/32 ¡ Semiconductor 2. CGRAM data write (Specifies the addresses of CGRAM and writes character pattern data.) ML9206-xx CGRAM (Character Generator RAM) has a 3-bit address to store 5¥7 dot matrix character patterns. A character pattern stored in CGRAM can be displayed by specifying the character code (address) by DCRAM. The address of CGRAM is assigned to 00H to 07H. (All the other addresses are the CGROM addresses.) (The CGRAM can store 8 types of character patterns.) [Command format] LSB MSB B0 B1 B2 B3 B4 B5 B6 B7 1st byte (1st) X0 X1 X2 LSB * 0 1 0 0 MSB : selects CGRAM data write mode and specifies CGRAM address. (Ex: specifies CGRAM address 00H) : specifies 1st column data (rewritten into CGRAM address 00H) B0 B1 B2 B3 B4 B5 B6 B7 2nd byte (2nd) C0 C5 C10 C15 C20 C25 C30 LSB * MSB B0 B1 B2 B3 B4 B5 B6 B7 3rd byte (3rd) C1 C6 C11 C16 C21 C26 C31 LSB * MSB : specifies 2nd column data (rewritten into CGRAM address 00H) B0 B1 B2 B3 B4 B5 B6 B7 4th byte (4th) C2 C7 C12 C17 C22 C27 C32 LSB * MSB : specifies 3rd column data (rewritten into CGRAM address 00H) B0 B1 B2 B3 B4 B5 B6 B7 5th byte (5th) C3 C8 C13 C18 C23 C28 C33 LSB * MSB : specifies 4th column data (rewritten into CGRAM address 00H) B0 B1 B2 B3 B4 B5 B6 B7 6th byte (6th) C4 C9 C14 C19 C24 C29 C34 * : specifies 5th column data (rewritten into CGRAM address 00H) To specify character pattern data continuously to the next address, specify only character pattern data as follows. The addresses of CGRAM are automatically incremented. Specification of the 1st byte is therefore unnecessary. The 2nd to 6th byte (character pattern data) are regarded as one data item, so 300 ns is sufficient for tDOFF time between bytes. 18/32 ¡ Semiconductor ML9206-xx LSB MSB B0 B1 B2 B3 B4 B5 B6 B7 2nd byte (7th) C0 C5 C10 C15 C20 C25 C30 LSB * MSB : specifies 1st column data (rewritten into CGRAM address 01H) B0 B1 B2 B3 B4 B5 B6 B7 6th byte (11th) C4 C9 C14 C19 C24 C29 C34 * : specifies 5th column data (rewritten into CGRAM address 01H) X0 (LSB) to X2 (MSB): CGRAM addresses (3 bits: 8 characters) C0 (LSB) to C34 (MSB) : Character pattern data (35 bits: 35 outputs per digit) * : Don't care [CGROM addresses and set CGRAM addresses] Refer to ROMCODE table HEX X0 X1 X2 00 01 02 03 04 05 06 07 0 1 0 1 0 1 0 1 0 0 1 1 0 0 1 1 0 0 0 0 1 1 1 1 CGROM address RAM00(00000000B) RAM01(00000001B) RAM02(00000010B) RAM03(00000011B) RAM04(00000100B) RAM05(00000101B) RAM06(00000110B) RAM07(00000111B) 19/32 ¡ Semiconductor Positional relationship between the output area of CGROM and that of CGRAM C0 C5 C10 C15 C20 C25 C30 area that corresponds to 2nd byte (1st column) area that corresponds to 3rd byte (2nd column) C1 C6 C11 C16 C21 C26 C31 C2 C7 C12 C17 C22 C27 C32 C3 C8 C13 C18 C23 C28 C33 C4 C9 C14 C19 C24 C29 C34 ML9206-xx area that corresponds to 6th byte (5th column) area that corresponds to 5th byte (4th column) area that corresponds to 4th byte (3rd column) Note: CGROM (Character Generator ROM) has an 8-bit address to generate 5¥7 dot matrix character patterns. CGRAM can store 248 types of character patterns. General-purpose code -01 is available (see ROM CODE list) and custom codes are provided on customer's request. 20/32 ¡ Semiconductor 3. ADRAM data write (specifies address of ADRAM and writes symbol data) ML9206-xx ADRAM (Additional Data RAM) has a 2-bit address to store symbol data. Symbol data specified by ADRAM is directly output without CGROM and CGRAM. (The ADRAM can store 2 types of symbol patterns for each digit.) The terminal to which the contents of ADRAM are output can be used as a cursor. [Command format] LSB MSB B0 B1 B2 B3 B4 B5 B6 B7 1st byte (1st) X0 X1 X2 X3 LSB 1 1 0 0 MSB : selects ADRAM data write mode and specifies ADRAM address (Ex: specifies ADRAM address 0H) : sets symbol data (written into ADRAM address 0H) B0 B1 B2 B3 B4 B5 B6 B7 2nd byte (2nd) C0 C1 * * * * * * To specify symbol data continuously to the next address, specify only symbol data as follows. The address of ADRAM is automatically incremented. Specification of the 1st byte is therefore unnecessary. LSB MSB B0 B1 B2 B3 B4 B5 B6 B7 2nd byte (3rd) 2nd byte (4th) C0 C1 LSB * * * * * * MSB : sets symbol data (written into ADRAM address 1H) : sets symbol data (written into ADRAM address 2H) B0 B1 B2 B3 B4 B5 B6 B7 C0 C1 LSB * * * * * * MSB B0 B1 B2 B3 B4 B5 B6 B7 2nd byte (17th) 2nd byte (18th) C0 C1 LSB * * * * * * MSB : sets symbol data (written into ADRAM address FH) : sets symbol data (ADRAM address 0H is rewritten.) B0 B1 B2 B3 B4 B5 B6 B7 C0 C1 * * * * * * X0 (LSB) to X3 (MSB) : ADRAM addresses (4 bits: 16 characters) C0 (LSB) to C1 (MSB): Symbol data (2 bits: 2-symbol data per digit) * : Don't care 21/32 ¡ Semiconductor [COM positions and ADRAM addresses] HEX X0 X1 X2 X3 0 1 2 3 4 5 6 7 8 9 A B C D E F 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 COM position COM1 COM2 COM3 COM4 COM5 COM6 COM7 COM8 COM9 COM10 COM11 COM12 COM13 COM14 COM15 COM16 ML9206-xx 4. General output port set (specifies the general output port status) The general output port is an output for 2-bit static operation. It is used to control other I/O devices and turn on LED. (static operation) When at the "High" level, this output becomes the VDD voltage, and when at the "Low" level, it becomes the ground potential. Therefore, the fluorescent display tube cannot be driven. [Command format] LSB MSB B0 B1 B2 B3 B4 B5 B6 B7 1st byte P1 P2 * * 0 0 1 0 : selects a general output port and specifies the output status P1, P2 : general output port * : don't care [Set data and set state of general output port] P1 0 1 0 1 P2 0 0 1 1 Display state of general output port Sets P1 and P2 to low Sets P1 to high and P2 to low Sets P1 to low and P2 to high Sets P1 and P2 to high (The state when power is applied or when RESET is input.) 22/32 ¡ Semiconductor 5. Display duty set (writes display duty value to duty cycle register) ML9206-xx Display duty adjusts brightness in 256 stages using 8-bit data. (maximum brightness=240/256) When power is turned on or when the RESET signal is input, the duty cycle register value is "0". Always execute this instruction before turning the display on, then set a desired duty value. [Command format] LSB MSB B0 B1 B2 B3 B4 B5 B6 B7 1st byte * LSB * * * 1 0 1 0 MSB : selects display duty set mode and sets duty value B0 B1 B2 B3 B4 B5 B6 B7 2nd byte D0 D1 D2 D3 D4 D5 D6 D7 : Sets display duty value D0 (LSB) to D7 (MSB) : display duty data (8 bits: 256 stages) * : don't care [Relation between setup data and controlled COM duty] HEX 00 01 02 D0 0 1 0 D1 0 0 1 D2 0 0 0 D3 0 0 0 D4 0 0 0 D5 0 0 0 D6 0 0 0 D7 0 0 0 COM duty 0/256 1/256 2/256 *The state when power is turned on or when RESET signal is input. F7 F8 1 0 1 0 1 0 0 1 1 1 1 1 1 1 1 1 239/256 240/256 No brightness change du to fixed blank time (16/256) FF 1 1 1 1 1 1 1 1 240/256 23/32 ¡ Semiconductor 6. Number of digits set (writes the number of display digits to the display digit register) ML9206-xx The number of digits set can display 1 to 16 digits using 4-bit data. When power is turned on or when a RESET signal is input, the number of digit register value is "0". Always execute this instruction to change the number of digits before turning the dispaly on. [Command format] LSB MSB B0 B1 B2 B3 B4 B5 B6 B7 1st byte K0 K1 K2 K3 0 1 1 0 : selects the number of digit set mode and specifies the number of digit value K0 (LSB) to K3 (MSB) : number of digit data (4 bits: 16 digits) * : don't care [Relation between setup data and controlled COM] HEX 0 1 2 3 4 5 6 7 K0 0 1 0 1 0 1 0 1 K1 0 0 1 1 0 0 1 1 K2 0 0 0 0 1 1 1 1 K3 0 0 0 0 0 0 0 0 Number of digits of COM COM1 to 16 COM1 COM1 to 2 COM1 to 3 COM1 to 4 COM1 to 5 COM1 to 6 COM1 to 7 HEX 8 9 A B C D E F K0 0 1 0 1 0 1 0 1 K1 0 0 1 1 0 0 1 1 K2 0 0 0 0 1 1 1 1 K3 1 1 1 1 1 1 1 1 Number of digits of COM COM1 to 8 COM1 to 9 COM1 to 10 COM1 to 11 COM1 to 12 COM1 to 13 COM1 to 14 COM1 to 15 *The state when power is turned on or when RESET signal is input. 24/32 ¡ Semiconductor 7. All display lights ON/OFF set (turns all dispaly lights ON or OFF) ML9206-xx All display lights ON is used primarily for display testing. All display lights OFF is primarily used for display blink and to prevent malfunction when power is turned on. This command cannot control the general output port. [Command format] LSB MSB B0 B1 B2 B3 B4 B5 B6 B7 1st byte L H ** 1 1 1 0 : selects all display lights ON or OFF mode L: sets all lights OFF H: sets all lights ON *: Don't care [Set data and display state of SEG and AD] L 0 1 0 1 H 0 0 1 1 Display state of SEG and AD Normal display Sets all outputs to Low Sets all outputs to High Sets all outputs to High (All lights ON mode has priority.) (The state when power is applied or when RESET is input.) 25/32 ¡ Semiconductor Setting Flowchart (Power applying included) Apply VDD ML9206-xx Apply VFL All display lights OFF Status of all outputs by RESET signal input General output port setting Number of digits setting Display duty setting Select a RAM to be used DCRAM Data write mode (with address setting) Address is automatically incremented CGRAM Data write mode (with address setting) Address is automatically incremented ADRAM Data write mode (with address setting) Address is automatically incremented DCRAM Character code DCRAM Is character code write ended? YES CGRAM Character code CGRAM Is character code write ended? YES ADRAM Character code ADRAM Is character code write ended? YES NO NO NO YES Another RAM to be set? NO Releases all display lights OFF mode Display operation mode End 26/32 ¡ Semiconductor Power-off Flowchart Display operation mode ML9206-xx Turn off VFL Turn off VDD 27/32 ¡ Semiconductor ML9206-xx APPLICATION CIRCUIT Heater Transformer 5¥7-dot matrix fluorescent display tube ANODE ANODE GRID (SEGMENT) (SEGMENT) (DIGIT) VDD R2 VDD C2 VDD C3 Microcontroller Output Port GND CS CP DA GND ML9206-xx P1, 2 VFL OSC0 OSC1 R1 C1 GND ZD 2 RESET VDD 2 AD1, 2 35 SEG1-35 16 COM1-16 R4 LED NPN Tr GND VDD VFL C4 GND R3 Notes: 1. The VDD value depends on the power supply voltage of the microcontroller used. Adjust the values of the constants R1, R2, R4, C1, and C2 to the power supply voltage used. 2. The VFL value depends on the fluorescent display tube used. Adjust the values of the constants R3 and ZD to the power supply voltage used. 28/32 ¡ Semiconductor Reference data ML9206-xx The figure below shows the relationship between the VFL voltage and the output current of each driver. Take care that the total power consumption to be used does not exceed the power dissipation. VFL Voltage-Output Current of Each Driver (mA) –30 –25 Output Current (mA) COM1 to COM16 (Condition: VOH=VDD–1.5 V) –20 –15 –10 –5 0 –10 AD1 and AD2 (Condition: VOH=VDD–1.5 V) SEG1 to SEG35 (Condition: VOH=VDD–1.5 V) –20 –30 –40 –50 –60 (V) VFL Voltage (VDD-n) 29/32 ¡ Semiconductor ML9206-xx ML9206-01 ROM Code 00000000B (00H) to 00000111B (07H) are the CGRAM addresses. MSB 0000 LSB 0000 RAM0 0001 0010 0011 0100 0101 0110 0111 1000 1001 1010 1011 1100 1101 1110 1111 0001 RAM1 0010 RAM2 0011 RAM3 0100 RAM4 0101 RAM5 0110 RAM6 0111 RAM7 1000 1001 1010 1011 1100 1101 1110 1111 30/32 ¡ Semiconductor ML9206-xx PACKAGE DIMENSIONS (Unit : mm) QFP64-P-1414-0.80-BK Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.87 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 31/32 ¡ Semiconductor ML9206-xx (Unit : mm) SSOP64-P-525-0.80-K Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 1.34 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 32/32 E2Y0002-29-62 NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party’s right which may result from the use thereof. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. No part of the contents contained herein may be reprinted or reproduced without our prior permission. MS-DOS is a registered trademark of Microsoft Corporation. 2. 3. 4. 5. 6. 7. 8. 9. Copyright 1999 Oki Electric Industry Co., Ltd. Printed in Japan