MSM514221B-30ZS

E2L0029-17-Y1 ¡ Semiconductor MSM514221B ¡ Semiconductor 262,263-Word ¥ 4-Bit Field Memory This version: Jan. 1998 MSM514221B Previous version: Dec. 1996 DESCRIRTION The OKI MSM514221B is a high performance 1-Mbit, 256K ¥ 4-bit, Field Memory. It is designed for high-speed serial access applications such as HDTVs, conventional NTSC TVs, VTRs, digital movies and Multi-media systems. It is a FRAM for wide or low end use as general commodity TVs and VTRs, exclusively. The MSM514221B is not designed for the other use or high end use in medical systems, professional graphics systems which require long term picture, and data storage systems and others. The 1-Mbit capacity fits one field of a conventional NTSC TV screen. Each of the 4-bit planes has separate serial write and read ports. These employ independent control clocks to support asynchronous read and write operations. Different clock rates are also supported that allow alternate data rates between write and read data streams. The MSM514221B provides high speed FIFO, First-In First-Out, operation without external refreshing: it refreshes its DRAM storage cells automatically, so that it appears fully static to the users. Moreover, fully static type memory cells and decoders for serial access enable refresh free serial access operation, so that the serial read and/or write control clock can be halted high or low for any duration as long as the power is on. Internal conflicts of memory access and refreshing operations are prevented by special arbitration logic. The MSM514221B's function is simple, and similar to a digital delay device whose delay-bitlength is easily set by reset timing. The delay length, number of read delay clocks between write and read, is determined by externally controlled write and read reset timings. Additional SRAM serial registers, or line buffers for the initial access of 256 ¥ 4-bit enable high speed first-bit-access with no clock delay just after the write or read reset timings. The MSM514221B is similar in operation and functionality to OKI 2-Mbit Field Memory MSM518221. 1/15 ¡ Semiconductor MSM514221B FEATURES • Single power supply: 5 V ± 10% • 512 Rows ¥ 512 Column ¥ 4 bits • Fast FIFO (First-in First-out)operation • High speed asynchronous serial access Read/Write cycle time 30 ns/40 ns/60 ns Access time 25 ns/30 ns/50 ns • Functional compatibility with OKI MSM518221 • Self refresh (No refresh control is required) • Package options: 16-pin 300 mil plastic DIP (DIP16-P-300-2.54-W1) 26/20-pin 300 mil plastic SOJ (SOJ26/20-P-300-1.27) 20-pin 400 mil plastic ZIP (ZIP20-P-400-1.27) (Product : MSM514221B-xxRS) (Product : MSM514221B-xxJS) (Product : MSM514221B-xxZS) xx indicates speed rank. PRODUCT FAMILY Family MSM514221B-30RS MSM514221B-40RS MSM514221B-60RS MSM514221B-30JS MSM514221B-40JS MSM514221B-60JS MSM514221B-30ZS MSM514221B-40ZS MSM514221B-60ZS Access Time (Max.) 25 ns 30 ns 50 ns 25 ns 30 ns 50 ns 25 ns 30 ns 50 ns Cycle Time (Min.) 30 ns 40 ns 60 ns 30 ns 40 ns 60 ns 30 ns 40 ns 60 ns 400 mil 20-pin ZIP 300 mil 26/20-pin SOJ 300 mil 16-pin DIP Package 2/15 ¡ Semiconductor MSM514221B PIN CONFIGURATION (TOP VIEW) WE 1 RSTW 2 SWCK 3 DIN0 4 DIN1 5 DIN2 6 DIN3 7 VSS 8 16 VCC 15 RE 14 RSTR 13 SRCK 12 DOUT0 11 DOUT1 10 DOUT2 9 DOUT3 16-Pin Plastic DIP RSTW 2 SWCK 3 Pin Name SWCK SRCK WE RE RSTW RSTR DIN0 - 3 DOUT0 - 3 VCC VSS NC  WE 1 DIN0 4 NC 5 NC 9 DIN1 10 DIN2 11 DIN3 12 VSS 13 26/20-Pin Plastic SOJ Serial Write Clock Serial Read Clock Write Enable Read Enable Write Reset Clock Read Reset Clock Data Input Data Output Ground (0 V) No Connection 26 VCC SRCK RE WE SWCK NC 1 3 5 7 9 25 RE 2 RSTR 4 VCC 6 RSTW 8 DIN0 NO LEAD 24 RSTR 23 SRCK 22 NC 18 NC 17 DOUT0 16 DOUT1 15 DOUT2 14 DOUT3 NC 11 DIN1 13 DIN3 15 DOUT3 17 DOUT1 19 12 NC 14 DIN2 16 VSS 18 DOUT2 20 DOUT0 20-Pin Plastic ZIP Function Power Supply (5 V) 3/15 ¡ Semiconductor MSM514221B BLOCK DIAGRAM DOUT (¥ 4) RE RSTR SRCK Data-Out Buffer (¥4) Serial Read Controller 512 Word Serial Read Register (¥ 4) Read Line Buffer Low-Half (¥ 4) Read Line Buffer High-Half (¥ 4) 256 (¥ 4) 256 (¥ 4) 120 Word Sub-Register (¥ 4) 120 Word Sub-Register (¥ 4) 256K (¥ 4) Memory Array X Decoder Read/Write and Refresh Controller 256 (¥ 4) 256 (¥ 4) Clock Oscillator Write Line Buffer Write Line Buffer Low-Half (¥ 4) High-Half (¥ 4) 512 Word Serial Write Register (¥ 4) VBB Generator Serial Write Controller Data-In Buffer (¥ 4) DIN (¥ 4) WE RSTW SWCK 4/15 ¡ Semiconductor MSM514221B OPERATION Write Operation The write operation is controlled by three clocks, SWCK, RSTW, and WE. Write operation is accomplished by cycling SWCK, and holding WE high after the write address pointer reset operation or RSTW. Each write operation, which begins after RSTW, must contain at least 130 active write cycles, i.e. SWCK cycles while WE is high. To transfer the last data to the DRAM array, which at that time is stored in the serial data registers attached to the DRAM array, an RSTW operation is required after the last SWCK cycle. Write Reset : RSTW The first positive transition of SWCK after RSTW becomes high resets the write address counters to zero. RSTW setup and hold times are referenced to the rising edge of SWCK. Because the write reset function is solely controlled by the SWCK rising edge after the high level of RSTW, the states of WE are ignored in the write reset cycle. Before RSTW may be brought high again for a further reset operation, it must be low for at least two SWCK cycles. Data Inputs : DIN0 - 3 Write Clock : SWCK The SWCK latches the input data on chip when WE is high, and also increments the internal write address pointer. Data-in setup time tDS, and hold time tDH are referenced to the rising edge of SWCK. Write Enable : WE WE is used for data write enable/disable control. WE high level enables the input, and WE low level disables the input and holds the internal write address pointer. There are no WE disable time (low) and WE enable time (high) restrictions, because the MSM514221B is in fully static operation as long as the power is on. Note that WE setup and hold times are referenced to the rising edge of SWCK. 5/15 ¡ Semiconductor Read Operation MSM514221B The read operation is controlled by three clocks, SRCK, RSTR, and RE. Read operation is accomplished by cycling SRCK, and holding RE high after the read address pointer reset operation or RSTR. Each read operation, which begins after RSTR, must contain at least 130 active read cycles, i.e. SRCK cycles while RE is high. Read Reset : RSTR The first positive transition of SRCK after RSTR becomes high resets the read address counters to zero. RSTR setup and hold times are referenced to the rising edge of SRCK. Because the read reset function is solely controlled by the SRCK rising edge after the high level of RSTR, the states of RE are ignored in the read reset cycle. Before RSTR may be brought high again for a further reset operation, it must be low for at least two SRCK cycles. Data Out : DOUT0 - 3 Read Clock : SRCK Data is shifted out of the data registers. It is triggered by the rising edge of SRCK when RE is high during a read operation. The SRCK input increments the internal read address pointer when RE is high. The three-state output buffer provides direct TTL compatibility ( no pullup resistor required). Data out is the same polarity as data in. The output becomes valid after the access time interval tAC that begins with the rising edge of SRCK. There are no output valid time restriction on MSM514221B. Read Enable : RE The function of RE is to gate of the SRCK clock for incrementing the read pointer. When RE is high before the rising edge of SRCK, the read pointer is incremented. When RE is low, the read pointer is not incremented. RE setup times (tRENS and tRDSS) and RE hold times (tRENH and tRDSH) are referenced to the rising edge of the SRCK clock. 6/15 ¡ Semiconductor Power-up and Initialization MSM514221B On power-up, the device is designed to begin proper operation after at least 100 ms after VCC has stabilized to a value within the range of recommended operating conditions. After this 100 ms stabilization interval, the following initialization sequence must be performed. Because the read and write address counters are not valid after power-up, a minimum of 130 dummy write operations (SWCK cycles) and read operations (SRCK cycles) must be performed, followed by an RSTW operation and an RSTR operation, to properly initialize the write and the read address pointer. Dummy write cycles/RSTW and dummy read cycles/RSTR may occur simultaneously. If these dummy read and write operations start while VCC and/or the substrate voltage has not stabilized, it is necessary to perform an RSTR operation plus a minimum of 130 SRCK cycles plus another RSTR operation, and an RSTW operation plus a minimum of 130 SRCK cycles plus another RSTW operation to properly initialize read and write address pointers. Old/New Data Access There must be a minimum delay of 600 SWCK cycles between writing into memory and reading out from memory. If reading from the first field starts with an RSTR operation, before the start of writing the second field (before the next RSTW operation), then the data just written will be read out. The start of reading out the first field of data may be delayed past the beginning of writing in the second field of data for as many as 119 SWCK cycles. If the RSTR operation for the first field readout occurs less than 119 SWCK cycles after the RSTW operation for the second field write-in, then the internal buffering of the device assures that the first field will still be read out. The first field of data that is read out while the second field of data is written is called “old data”. In order to read out “new data”, i.e., the second field written in, the delay between an RSTW operation and an RSTR operation must be at least 600 SRCK cycles. If the delay between RSTW and RSTR operations is more than 120 but less than 600 cycles, then the data read out will be undetermined. It may be “old data” or “new” data, or a combination of old and new data. Such a timing should be avoided. 7/15 ¡ Semiconductor MSM514221B ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings Parameter Input Output Voltage Output Current Power Dissipation Operating Temperature Storage Temperature Symbol VT IOS PD Topr Tstg Condition at Ta = 25°C, VSS Ta = 25°C Ta = 25°C — — Rating –1.0 to 7.0 50 1 0 to 70 –55 to 150 Unit V mA W °C °C Recommended Operating Conditions Parameter Power Supply Voltage Power Supply Voltage Input High Voltage Input Low Voltage Symbol VCC VSS VIH VIL Min. 4.5 0 2.4 –1.0 Typ. 5.0 0 VCC 0 Max. 5.5 0 VCC + 1 0.8 Unit V V V V DC Characteristics Parameter Input Leakage Current Output Leakage Current Output "H" Level Voltage Output "L" Level Voltage Operating Current Standby Current Symbol ILI ILO VOH VOL ICC1 ICC2 Condition 0 < VI < VCC + 1, Other Pins Tested at V = 0 V 0 < VO < VCC IOH = –5 mA IOL = 4.2 mA -30 Minimum Cycle Time, Output Open -40 -60 Input Pin = VIH / VIL Min. –10 –10 2.4 — — — — — Max. 10 10 — 0.4 50 45 35 10 mA mA Unit mA mA V V Capacitance Parameter Input Capacitance (DIN, SWCK, SRCK, RSTW, RSTR, WE, RE) Output Capacitance (DOUT) Symbol CI CO (Ta = 25°C, f = 1 MHz) Max. 7 7 Unit pF pF 8/15 ¡ Semiconductor AC Characteristics Parameter Access Time from SRCK DOUT Hold Time from SRCK DOUT Enable Time from SRCK DOUT Hold Time from RE SWCK "H" Pulse Width SWCK "L" Pulse Width Input Data Setup Time Input Data Hold Time WE Enable Setup Time WE Enable Hold Time WE Disable Setup Time WE Disable Hold Time WE "H" Pulse Width WE "L" Pulse Width RSTW Setup Time RSTW Hold Time SRCK "H" Pulse Width SRCK "L" Pulse Width RE Enable Setup Time RE Enable Hold Time RE Disable Setup Time RE Disable Hold Time RE "H" Pulse Width RE "L" Pulse Width RSTR Setup Time RSTR Hold Time SWCK Cycle Time SRCK Cycle Time Transition Time (Rise and Fall) Symbol tAC tDDCK tDECK tDDRE tWSWH tWSWL tDS tDH tWENS tWENH tWDSS tWDSH tWWEH tWWEL tRSTWS tRSTWH tWSRH tWSRL tRENS tRENH tRDSS tRDSH tWREH tWREL tRSTRS tRSTRH tSWC tSRC tT MSM514221B (VCC = 5 V ±10%, Ta = 0°C to 70°C) MSM514221B-30 MSM514221B-40 MSM514221B-60 Min. — 6 6 9 12 12 5 6 0 5 0 5 5 5 0 10 12 12 0 5 0 5 5 5 0 10 30 30 3 Max. 25 — 25 — — — — — — — — — — — — — — — — — — — — — — — — — 30 Min. — 6 6 9 17 17 5 6 0 5 0 5 10 10 0 10 17 17 0 5 0 5 10 10 0 10 40 40 3 Max. 30 — 25 — — — — — — — — — — — — — — — — — — — — — — — — — 30 Min. — 6 6 9 17 17 5 6 0 5 0 5 10 10 0 10 17 17 0 5 0 5 10 10 0 10 60 60 3 Max. 50 — 25 — — — — — — — — — — — — — — — — — — — — — — — — — 30 Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns 9/15 ¡ Semiconductor MSM514221B Notes: 1. Input signal reference levels for the parameter measurement are VIH = 2.4 V and VIL = 0.8 V. The transition time tT is defined to be a transition time that signal transfers between VIH = 2.4 V and VIL = 0.8 V. 2. AC measurements assume tT = 3 ns. 3. Read address must have more than a 600 address delay than write address in every cycle when asynchronous read/write is performed. 4. Read must have more than a 600 address delay than write in order to read the data written in a current series of write cycles which has been started at last write reset cycle: this is called "new data read". When read has less than a 119 address delay than write, the read data are the data written in a previous series of write cycles which had been written before at last write reset cycle: this is called "old data read". 5. When the read address delay is between more than 120 and less than 599, read data will be undetermined. However, normal write is achieved in this address condition. 6. Outputs are measured with a load equivalent to 2 TTL loads and 30 pF. Output reference levels are VOH = 2.4 V and VOL = 0.8 V. 10/15 ¡ Semiconductor MSM514221B TIMING WAVEFORM Write Cycle Timing (Write Reset) n Cycle SWCK 0 Cycle 1 Cycle 2 Cycle – VIH – VIL       



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 tT tRSTWS tRSTWH tWSWH tWSWL tSWC RSTW – VIH – VIL tDS tDH DIN n 0 1 2 3 – VIH – VIL WE – VIH – VIL Write Cycle Timing (Write Enable) n Cycle Disable Cycle Disable Cycle n + 1 Cycle SWCK – VIH – VIL tWENH tWDSH tWDSS tWENS WE – VIH – VIL – VIH – VIL tWWEL tWWEH DIN n n+ 1 n+2 RSTW – VIH – VIL 11/15 
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 ¡ Semiconductor MSM514221B Read Cycle Timing (Read Reset) n Cycle 0 Cycle 1 Cycle 2 Cycle SRCK – VIH – VIL tT tRSTRS tRSTRH tWSRH tWSRL tSRC RSTR tAC tDDCK – VIH – VIL DOUT n–1 n 0 1 2 – VOH – VOL – VIH – VIL RE Read Cycle Timing (Read Enable) n Cycle Disable Cycle Disable Cycle n + 1 Cycle SRCK – VIH – VIL tRENH tRDSH tRDSS tRENS RE tWREL tDDRE n tWREH – VIH – VIL tDECK DOUT n–1 Hi-Z n+1 – VOH – VOL RSTR – VIH – VIL 12/15 ¡ Semiconductor MSM514221B PACKAGE DIMENSIONS (Unit : mm) DIP16-P-300-2.54-W1 Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 1.00 TYP. 13/15 ¡ Semiconductor MSM514221B (Unit : mm) SOJ26/20-P-300-1.27 Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.80 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 14/15 ¡ Semiconductor MSM514221B (Unit : mm) ZIP20-P-400-1.27 Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 1.50 TYP. 15/15