E2E0033-38-93
¡ Semiconductor MSM64162
¡ Semiconductor
This version: MSM64162 Sep. 1998 Previous version: Mar. 1996
4-Bit Microcontroller with Built-in RC Oscillation Type A/D Converter and LCD Driver
GENERAL DESCRIPTION
The MSM64162 is a low power 4-bit microcontroller that employs Oki's original CPU core nX4/20. The MSM64162 has 2-channel RC oscillation type A/D converter, LCD driver for up to 80 segments, and buzzer output port. It is best suited for applications such as low power, high precision thermometers and hygrometers.
FEATURES
• Operating range Operating frequencies Operating voltage : : 32.768 kHz, 400 kHz 1.25 to 1.7 V (1.5 V spec.) 2.0 to 3.5 V (3 V spec.) 2.2 to 3.5 V (3 V spec., 1/2 duty) –40 to +85°C 2016 bytes 128 nibbles 7.5 ms @ 400 kHz 91.6 ms @ 32.768 kHz 2 channels 24 outputs; duty ratio switchable by software 80 segments (max) 63 segments (max) 44 segments (max) 1 output (4 output modes selectable) 2 channels 32.768 kHz crystal oscillator and 400 kHz RC oscillator (with an external resistor) 32.768 kHz/400 kHz (switchable by software) 32.768 kHz 1.5 V/3 V (selectable by mask option) 2 ports ¥ 4 bits 1 port ¥ 4 bits 1 port ¥ 4 bits (8 out of the 24 LCD driver outputs can be used as output-only ports by mask option.) 2 sources 7 sources 1 (incorporated into the input-only port)
Operating temperature • Memory space Internal program memory Internal data memory • Minimum instruction execution time • RC oscillation type A/D converter • LCD driver (1) At 1/4 duty and 1/3 bias (2) At 1/3 duty and 1/3 bias (3) At 1/2 duty and 1/2 bias • Buzzer driver • Capture circuit • Watchdog timer • Clock CPU clock Time base clock • Power supply voltage • I/O port Input-output port Input port Output port
: : : : : : : : : : : : : : : : : :
• Interrupt sources External interrupt Internal interrupt • Battery check circuit
: : :
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¡ Semiconductor
MSM64162
• Package options: 64-pin plastic QFP (QFP64-P-1420-1.00-BK) : (Product name : MSM64162-¥¥¥GS-BK) 80-pin plastic QFP (QFP80-P-1420-0.80-BK) : (Product name : MSM64162-¥¥¥GS-BK-F) Chip : (Product name : MSM64162-¥¥¥) ¥¥¥ indicates a code number.
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¡ Semiconductor
MSM64162
BLOCK DIAGRAM
CPU CORE: nX-4/20
BSR TR2 TR0 (4) HALT C ALU PCM PCL
TR1 PCH A11 to A8 A7 to A0 ROM 2016B
MIEF
B
A
(4)
(4)
H
L
X DB7 to DB0
Y (8) RAM 128N
IR DECODER
OSC2 OSC1 XT XT RESET
2CLK
TBC
IR
TIMING CONTROLLER
SP
ROMR (8)
INTC INT P3.3 P3.2 P3.1 P3.0 P2.3 P2.2 P2.1 P2.0
RSTG WDT
PORT3
TST1 TST2 VSSL L0 L1
INT TST 5 INT BC VR INT PORT2
LCD CAPR L23 VSS1 VSS2 VSS3 C1 C2 VDD BD ADC INT BIAS PORT0 PORT1
P1.3 P1.2 P1.1 P1.0 P0.3 P0.2 P0.1 P0.0
PORT ADDRESS DB7 to DB0 INT
RT1 RS1 CS1 IN1 RT0 CRT0 RS0 CS0 IN0
BD
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¡ Semiconductor
MSM64162
PIN CONFIGURATION (TOP VIEW)
62 VSS3 61 VSSL 60 VSS2 59 VSS1 58 P1.3 57 P1.2 56 P1.1 55 P1.0 53 P3.3 52 P3.2
54 BD
64 C2
63 C1
L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 L10 L11 L12 L13 L14 L15 L16/P5.0 L17/P5.1 L18/P5.2
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19
51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
P3.1 P3.0 P2.3 P2.2 P2.1 P2.0 RT1 RS1 CS1 IN1 IN0 CS0 RS0 CRT0 RT0 P0.3 P0.2 P0.1 P0.0
20
21
22
23
24
25
26
27
28
29
30
31
L19/P5.3 L20/P6.0 L21/P6.1 L22/P6.2 L23/P6.3 OSC1 OSC2 VDD XT XT RESET TST1 TST2
64-Pin Plastic QFP
32
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¡ Semiconductor
MSM64162
PIN CONFIGURATION (TOP VIEW) (continued)
69 L23/P6.3 68 L22/P6.2 66 L21/P6.1 65 L20/P6.0
79 RESET
72 OSC2
71 OSC1
80 TST1
78 (NC)
75 (NC)
73 (NC)
70 (NC)
TST2 P0.0 P0.1 P0.2 P0.3 RT0 (NC) CRT0 RS0 CS0 IN0 IN1 CS1 (NC) RS1 RT1 P2.0 P2.1 P2.2 P2.3 P3.0 (NC) P3.1 (NC)
67 (NC)
74 VDD
77 XT
76 XT
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
64 L19/P5.3 63 L18/P5.2 62 L17/P5.1 61 L16/P5.0 60 L15 59 (NC) 58 L14 57 L13 56 L12 55 L11 54 L10 53 (NC) 52 L9 51 L8 50 L7 49 L6 48 L5 47 L4 46 L3 45 L2 44 L1 43 L0 42 C2 41 C1
Notes: 1. Pins marked as (NC) are no-connection pins which are left open. 2. VDD should be supplied from pin 74. Pin 32 is internally connected to VDD.
P3.2 25 P3.3 26 BD 27 (NC) 28 P1.0 29 (NC) 30 P1.1 31 (VDD) 32 (NC) 33 P1.2 34 P1.3 35 VSS1 36 VSS2 37 (NC) 38 VSSL 39 VSS3 40
80-Pin Plastic QFP
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¡ Semiconductor
MSM64162
PAD CONFIGURATION
Pad Layout
50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 51 52 53 54 55 56 57 58 59 60 61 62 63 64 32 31 30 29 28 27 26 25 24 23 22 21 20 19 1 2 3 4 5 6 7 8 9 10 1112 13 14 15 16 17 18 y x
Chip Size Chip Thickness Coordinate Origin Pad Hole Size Pad Size Minimum Pad Pitch
: : : : : :
4.69 mm ¥ 4.41 mm 350 mm (typ.) Chip center 110 mm ¥ 110 mm 130 mm ¥ 130 mm 180 mm
Note: The chip substrate voltage is VDD.
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¡ Semiconductor Pad Coordinates
Pad No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Pad Name L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 L10 L11 L12 L13 L14 L15 L16/P5.0 L17/P5.1 L18/P5.2 L19/P5.3 L20/P6.0 L21/P6.1 L22/P6.2 L23/P6.3 OSC1 OSC2 VDD XT XT RESET TST1 TST2 X (µm) –2168 –1918 –1669 –1426 –1170 –934 –727 –519 –312 –104 104 311 527 791 1062 1340 1618 1897 2168 2168 2168 2168 2168 2168 2168 2168 2168 2168 2168 2168 2168 2168 Y (µm) –2042 –2042 –2042 –2042 –2042 –2042 –2042 –2042 –2042 –2042 –2042 –2042 –2042 –2042 –2042 –2042 –2042 –2042 –2042 –1714 –1424 –1134 –844 –554 –264 26 316 606 896 1186 1476 1766 Pad No. 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 Pad Name P0.0 P0.1 P0.2 P0.3 RT0 CRT0 RS0 CS0 IN0 IN1 CS1 RS1 RT1 P2.0 P2.1 P2.2 P2.3 P3.0 P3.1 P3.2 P3.3 BD P1.0 P1.1 P1.2 P1.3 VSS1 VSS2 VSSL VSS3 C1 C2 X (µm) 2168 1899 1628 1364 1100 829 565 349 141 –67 –274 –482 –689 –911 –1160 –1416 –1666 –1916 –2168 –2168 –2168 –2168 –2168 –2168 –2168 –2168 –2168 –2168 –2168 –2168 –2168 –2168
MSM64162
Y (µm) 2042 2042 2042 2042 2042 2042 2042 2042 2042 2042 2042 2042 2042 2042 2042 2042 2042 2042 1829 1563 1382 1017 688 328 6 –353 –645 –826 –1254 –1435 –1616 –1796
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¡ Semiconductor
MSM64162
PIN DESCRIPTIONS
The following tables describe the pin basic functions and secondary functions of the MSM64162. For pin, "64QFP" and "80QFP" denote 64-pin flat package and 80-pin flat package respectively. Basic Functions
Function Symbol VDD VSS1 VSS2 Power Supply VSS3 C1 C2 VSSL XT Oscillation XT OSC1 OSC2 Test TST1 TST2 Pin 64QFP 80QFP 27 59 60 62 63 64 61 28 29 25 26 31 32 74 36 37 40 41 42 39 76 77 71 72 80 1 Pad 27 59 60 62 63 64 61 28 29 25 26 31 32 Type — — — — — — — I O I O I I 0 V power supply Negative power supply (for 1.5 V spec.) Bias output for drivig LCD (–1.5 V) (for 3.0 V spec.) Negative power supply (for 3.0 V spec.) Bias output for driving LCD (–3.0 V) (for 1.5 V spec.) Bias output for driving LCD (–4.5 V). Pins for connecting a capacitor for generating LCD driving bias Negative power supply for internal logic (An internally generated constant voltage is present at this pin.) Low-speed clock oscillation input and output pins: Connect to a crystal (32.768 kHz). High-speed clock oscillation input and output pins: Connect to an external resistor for oscillation (ROS). Input pins for testing. A pull-up resistor is internally connected to these pins. System reset input pin. Setting this pin to "L" level puts this device into a reset state. Reset RESET 30 79 30 I Then, setting this pin to "H" level starts executing an instruction from address 000H. A pull-up resistor is internally connected to this pin. Description
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¡ Semiconductor Basic Functions (continued)
Function Symbol P0.0 P0.1 P0.2 P0.3 P1.0 P1.1 P1.2 P1.3 P2.0 Ports P2.1 P2.2 P2.3 P3.0 P3.1 P3.2 P3.3/MON Buzzer BD RT0 CRT0 RS0 A/D Converter CS0 IN0 RT1 RS1 CS1 IN1 47 48 49 50 51 52 53 54 37 38 39 40 41 45 44 43 42 18 19 20 21 23 25 26 27 6 8 9 10 11 16 15 13 12 47 48 49 50 51 52 53 54 37 38 39 40 41 45 44 43 42 I/O I/O I/O I/O I/O I/O I/O O O O O O I O O O I Pin 64QFP 80QFP 33 34 35 36 55 56 57 58 46 2 3 4 5 29 31 34 35 17 Pad 33 34 35 36 55 56 57 58 46 Type I I I I O O O O I/O Description 4-bit input port (P0):
MSM64162
Selectable as pull-up resistor input, pull-down resistor input, or high impedance input by the port 01 control register (P01CON). As secondary functions, P0.0 to P0.3 are assigned external interrupt functions, P0.0 and P0.1 are assigned a capture trigger function, and P0.3 is assigned an analog comparator input for battery check. 4-bit output port (P1): Selectable as NMOS open drain output or CMOS output by the port 01 control register (P01CON). P1.0 is a high current drive output port. 4-bit input-output port (P2): Following can be specified for each bit by the port 2 control registers 0 to 3 (P20CON to P23CON): (1) input or output, (2) pull-up/pull-down resistor input or high impedance input, and (3) NMOS open drain output or CMOS output. As secondary functions, P2.0 to P2.3 are assigned external interrupt functions. 4-bit input-output port (P3): Following can be specified for each bit by the port 3 control registers 0 to 3 (P30CON to P33CON): (1) input or output, (2) pull-up/pull-down resistor input or high impedance input, and (3) NMOS open drain output or CMOS output. As secondary functions, P3.0 to P3.3 are assigned external interrupt functions, P3.3 is assigned a function that monitors the RC oscillation clock for A/D converter. Output pin for the buzzer driver Resistance temperature sensor connection pin (for channel 0) Resistance/capacitance temperature sensor connection pin (for channel 0) Reference resistor connection pin (for channel 0) Reference capacitor connection pin (for channel 0) Input pin for RC oscillator circuit (for channel 0) Resistance temperature sensor connection pin (for channel 1) Reference resistor connection pin (for channel 1) Reference capacitor connection pin (for channel 1) Input pin for RC oscillator circuit (for channel 1)
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¡ Semiconductor Basic Functions (continued)
Pin 64QFP 80QFP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 43 44 45 46 47 48 49 50 51 52 54 55 56 57 58 60 61 62 63 64 65 66 68 69
MSM64162
Function Symbol L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 L10 LCD Driver L11 L12 L13 L14 L15 L16/P5.0 L17/P5.1 L18/P5.2 L19/P5.3 L20/P6.0 L21/P6.1 L22/P6.2 L23/P6.3
Pad 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
Type O O O O O O O O O O O O O O O O O O O O O O O O
Description LCD segment and common signals output pins.
LCD segment and common signals output pins. Functions as output ports by mask option.
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¡ Semiconductor Secondary Functions
Pin 64QFP 80QFP 33 34 35 36 46 47 48 49 50 51 52 53 33 34 2 3 4 5 17 18 19 20 21 23 25 26 2 3
MSM64162
Function Symbol P0.0 P0.1 P0.2 P0.3 P2.0 External Interrupt P2.1 P2.2 P2.3 P3.0 P3.1 P3.2 P3.3 Capture Trigger RC Oscillation Monitor Battery Check P0.0 P0.1
Pad 33 34 35 36 46 47 48 49 50 51 52 53 33 34
Type
Description Secondary functions of P0.0 to P0.3:
I
Level-triggered external interrupt input pins. The change of input signal level causes an interrupt to occur. Secondary functions of P2.0 to P2.3 and P3.0 to P3.3: Level-triggered external interrupt input pins. The change of input signal level causes an interrupt to occur.
I
I
Secondary functions of P0.0 and P0.1: Capture circuit trigger input pins. Secondary function of P3.3: Monitor output pin for an RC oscillation clock for A/D converter and a 400 kHz RC oscillation clock for the system clock. Secondary function of P0.3: Analog comparator input pin for battery check.
P3.3
53
26
53
O
P0.3
36
5
36
I
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¡ Semiconductor
MSM64162
MEMORY MAPS
Program Memory
Test program area
,,,,,,,,,,,,, ,,,,,,,,,,,,, ,,,,,,,,,,,,, 07E0H,,,,,,,,,,,,, ,,,,,,,,,,,,,
07FFH
32 bytes
Contents of interrupt area 03BH 2016 bytes 038H 032H 02FH 02CH 029H 03EH Interrupt area 020H CZP area 010H 026H 023H 020H Watchdog interrupt External interrupt (0) External interrupt (1) ADC interrupt 256 Hz interrupt 32 Hz interrupt 16 Hz interrupt 1 Hz interrupt 4 Hz interrupt
Start address 000H 8 bits
Program Memory Map Address 000H is the instruction execution start address by the system reset. The CZP area from address 010H to address 01FH is the start address for the CZP subroutine of 1-byte call instruction. The start address of interrupt subroutine is assigned to the interrupt address from address 020H to 03DH. The user area has 2016 bytes of address 000H to address 07DFH. No program can be stored in the test program area.
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¡ Semiconductor
MSM64162
Data Memory The data memory area consists of 8 banks and each bank has 256 nibbles (256 ¥ 4 bits). The data RAM is assigned to BANK 7 and peripheral ports are assigned to BANK 0.
7FFH 780H 77FH 700H
BANK 7 Data RAM area Unused area
Data/Stack area (128 nibbles)
Contents of 000H to 07FH Inaccessible area 07FH
SFR area
100H 0FFH 080H 07FH 000H 4 bits Unused area BANK 0 000H
Data Memory Map The data RAM area (128 nibbles) is shared by the stack area. The stack is a memory starting from address 7FFH toward the low-order addresses where 4 nibbles are used by Subroutine Call Instruction and 8 nibbles are used by an interrupt. The addresses 080H to 0FFH of BANK 0 and the addresses 700H to 77FH of BANK 7 are not assigned as the data memory, so access to these addresses has no effect. Moreover, it is impossible to access BANK 1 to BANK 6.
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¡ Semiconductor
MSM64162
ABSOLUTE MAXIMUM RATINGS (1.5 V Spec.)
(VDD = 0 V) Parameter Power Supply Voltage 1 Power Supply Voltage 2 Power Supply Voltage 3 Power Supply Voltage 4 Input Voltage 1 Input Voltage 2 Output Voltage 1 Output Voltage 2 Output Voltage 3 Output Voltage 4 Storage Temperature Symbol VSS1 VSS2 VSS3 VSSL VIN1 VIN2 VOUT1 VOUT2 VOUT3 VOUT4 TSTG Condition Ta = 25°C Ta = 25°C Ta = 25°C Ta = 25°C VSS1 Input, Ta = 25°C VSSL Input, Ta = 25°C VSS1 Output, Ta = 25°C VSS2 Output, Ta = 25°C VSS3 Output, Ta = 25°C VSSL Output, Ta = 25°C — Rating –2.0 to +0.3 –4.0 to +0.3 –5.5 to +0.3 –2.0 to +0.3 VSS1 – 0.3 to +0.3 VSSL – 0.3 to +0.3 VSS1 – 0.3 to +0.3 VSS2 – 0.3 to +0.3 VSS3 – 0.3 to +0.3 VSSL – 0.3 to +0.3 –55 to +150 Unit V V V V V V V V V V °C
RECOMMENDED OPERATING CONDITIONS (1.5 V Spec.)
(VDD = 0 V) Parameter Operating Temperature Operating Voltage External 400 kHz RC Oscillator Resistance Crystal Oscillation Frequency Symbol Top VSS1 ROS fXT Condition — — — — Range –40 to +85 –1.7 to –1.25 250 to 500 30 to 35 Unit °C V kW kHz
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¡ Semiconductor
MSM64162
ELECTRICAL CHARACTERISTICS (1.5 V Spec.)
DC Characteristics
(VDD = 0 V, VSS1 = –1.5 V, Ta = –40 to +85°C unless otherwise specified) Parameter
Symbol Measuring Circuit
Condition +100% –50% +100% –50%
Min.
Typ.
Max.
Unit
VSS2 Voltage VSS3 Voltage VSSL Voltage Crystal Oscillation Start Voltage Crystal Oscillation Hold Voltage Crystal Oscillation Stop Detection Time Internal Crystal Oscillator Capacitance External Crystal Oscillator Capacitance Internal Crystal Oscillator Capacitance Internal 400k RC Oscillator Capacitance 400k RC Oscillation Frequency POR Generation Voltage POR Non-generation Voltage Battery Check Reference Voltage VRB Temperature Variation
VSS2 VSS3 VSSL VSTA VHOLD TSTOP CG CGEX CD COS fOSC VPOR1 VPOR2 VRB DVRB
Ca, Cb, C12 = 0.1 mF Ca, Cb, C12 = 0.1 mF — Oscillation start time: within 5 seconds — — — When external CG used — —
–3.2 –4.7 –1.5 — — 0.1 10 10 10 8 80 –0.4 –1.5 –0.73
–3.0 –4.5 –1.3 — — — 15 — 15 12 220 — — –0.63 –2.0
–2.8 –4.3 –0.6 –1.45 –1.25 1000 20 30 20 16 350 0 –1.2 –0.53 —
V V V V V ms pF pF pF pF kHz V V V
2
1
External resistor ROS = 300 kW VSS1 = –1.25 to –1.7 V When VSS1 is between VPOR1 and –1.5 V No POR when VSS1 is between VPOR2 and –1.5 V Ta = 25°C —
—
mV/°C
Notes: 1. "POR" denotes Power On Reset. 2. "TSTOP" indicates that if the crystal oscillator stops over the value of TSTOP, the system reset occurs.
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¡ Semiconductor DC Characteristics (continued)
MSM64162
(VDD = 0 V, VSS1 = –1.5 V, Ta = –40 to +85°C unless otherwise specified) Parameter
Symbol
Condition
CPU in halt state
Ta = –40 to +40°C
Min. — — — — —
Typ. 2 2 5 5 40
Max. 5 30 15 40 80
Unit mA mA mA mA mA
Measuring Circuit
Supply Current 1 Supply Current 2
IDD1 IDD2
(400k RC oscillation halt) Ta = +40 to +85°C CPU in operating state Ta = –40 to +40°C (400k RC oscillation halt) Ta = +40 to +85°C
CPU in operating state Supply Current 3 IDD3 (400k RC oscillation in operation) ROS = 300 kW
CPU in halt state (400k RC oscillation
1
RT0 = 10 kW
—
150
230
mA
Supply Current 4
IDD4
halt), RC oscillator for A/D converter is in operating state
RT0 = 2 kW
—
600
900
mA
Battery check circuit in operating Supply Current 5 IDD5 state, CPU in operating state (400k RC oscillation halt) — 25 125 mA
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¡ Semiconductor DC Characteristics (continued)
MSM64162
(VDD = 0 V, VSS1 = VSSL = –1.5 V, VSS2 = –3.0 V, VSS3 = –4.5 V, Ta = –40 to +85°C unless otherwise specified) Parameter (Pin Name) Output Current 1 (P1.0) Output Current 2 (P1.1 to P1.3) (P2.0 to P2.3) (P3.0 to P3.3) Output Current 3 (BD) Output Current 4 (RT0, RT1, RS0, RS1, CRT0, CS0, CS1) Output Current 5 (When L16 to L23 are configured as output ports) Output Current 6 (OSC2)
Symbol
Condition VOH1 = –0.5 V VOL1 = VSS1 + 0.5 V VOH2 = –0.5 V VOL2 = VSS1 + 0.5 V VOH3 = –0.7 V VOL3 = VSS1 + 0.7 V VOH4 = –0.1 V VOL4 = VSS1 + 0.1 V VOH5 = –0.5 V VOL5 = VSS1 + 0.5 V VOH6 = –0.5 V VOL6 = VSS1 + 0.5 V VOH7 = –0.2 V (VDD level)
Min. –2.1 1.0 –2.1 0.2 –1.8 0.2 –1.1 0.3 –1.5 0.1 –2.1 0.2 — 4.0 — 4.0 — 4.0 —
Typ. –0.7 3.0 –0.7 0.7 –0.6 0.6 –0.6 0.6 –0.5 0.5 –0.7 0.7 — — — — — — —
Max. –0.2 9.0 –0.2 2.1 –0.2 1.8 –0.3 1.1 –0.1 1.5 –0.2 2.1 –4.0 — –4.0 — –4.0 — 0.3
Unit mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA
Measuring Circuit
IOH1 IOL1 IOH2 IOL2 IOH3 IOL3 IOH4 IOL4 IOH5 IOL5 IOH6 IOL6 IOH7 IOMH7
2
VOMH7 = VSS1 + 0.2 V (VSS1 level) VOMH7S = VSS1 – 0.2 V (VSS1 level) VOML7 = VSS2 + 0.2 V (VSS2 level) VOML7S = VSS2 – 0.2 V (VSS2 level) VOL7 = VSS3 + 0.2 V VOH = VDD (VSS3 level)
Output Current 7 (L0 to L23)
IOMH7S IOML7 IOML7S IOL7
Output Leakage Current (P1.0 to P1.3) (P2.0 to P2.3) (P3.0 to P3.3) (RT0, RT1, RS0, RS1, CRT0, CS0, CS1)
IOOH
IOOL
VOL = VSS1
–0.3
—
—
mA
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¡ Semiconductor DC Characteristics (continued)
MSM64162
(VDD = 0 V, VSS1 = VSSL = –1.5 V, VSS2 = –3.0 V, VSS3 = –4.5 V, Ta = –40 to +85°C unless otherwise specified) Parameter (Pin Name)
Symbol
Condition VIH1 = VDD (when pulled down) VIL1 = VSS1 (when pulled up) VIH1 = VDD (in a high impedance state)
Min.
Typ.
Max.
Unit mA mA mA mA mA mA
Measuring Circuit
IIH1 Input Current 1 (P0.0 to P0.3) (P2.0 to P2.3) (P3.0 to P3.3) IIL1 IIH1Z IIL1Z IIH2 Input Current 2 (IN0, IN1) IIH2Z IIL2Z IIL3 Input Current 3 (OSC1) IIH3Z IIL3Z Input Current 4 (RESET, TST1, TST2) IIH4 IIL4 VIH1
5 –60 0
18 –18 — — 18 — — –22 — — — –0.75 —
60 –5 1.0 0 60 1.0 0 –6 1.0 0 1.0 –0.3 0
VIL1 = VSS1 (in a high impedance state) –1.0 VIH2 = VDD (when pulled down) VIH2 = VDD (in a high impedance state) 5 0
3 VIL2 = VSS1 (in a high impedance state) –1.0 VIL3 = VSS1 (when pulled up) VIH3 = VDD (in a high impedance state) VIL3 = VSS1 (in a high impedance state) VIH4 = VDD VIL4 = VSS1 — –60 0 –1.0 0 –1.5 –0.3 mA mA mA mA mA mA V
Input Voltage 1 (P0.0 to P0.3) (P2.0 to P2.3) (P3.0 to P3.3) Input Voltage 2 (IN0, IN1, OSC1) Input Voltage 3 (RESET, TST1, TST2)
VIL1 VIH2 VIL2 VIH3 VIL3
— — — — —
–1.5 –0.3 –1.5 –0.3 –1.5
— — — — —
–1.2 0 –1.2 0 –1.2
V V V V V 4
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¡ Semiconductor DC Characteristics (continued)
MSM64162
(VDD = 0 V, VSS1 = VSSL = –1.5 V, VSS2 = –3.0 V, VSS3 = –4.5 V, Ta = –40 to +85°C unless otherwise specified) Parameter (Pin Name) Hysteresis Width (P0.0 to P0.3) (P2.0 to P2.3) (P3.0 to P3.3) Hysteresis Width (RESET, TST1, TST2) Input Pin Capacitance (P0.0 to P0.3) (P2.0 to P2.3) (P3.0 to P3.3)
Symbol
Condition
Min.
Typ.
Max.
Unit
Measuring Circuit
DVT1
—
0.05
0.1
0.3
V 4
DVT2
—
0.05
0.1
0.3
V
CIN
—
—
—
5.0
pF
1
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¡ Semiconductor Measuring circuit 1
MSM64162
CS0 RT0 RI0
RT0 OSC1 ROS OSC2 VSSL VDD VSS1 A Cl V
CS0
IN0
XT Crystal 32.768 kHz XT C1 C12 C2
VSS2
VSS3 Cl Ca, Cb, C12 ROS RT0 CS0 RI0 : 0.47 mF : 0.1 mF : 300 kW : 10 kW/2 kW : 820 pF : 10 kW
Ca V
Cb V
Measuring circuit 2
(*2)
(*1) VIL
INPUT
VIH
OUTPUT
A
VDD
VSS1
VSS2
VSS3
VSSL
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¡ Semiconductor Measuring circuit 3
(*3)
MSM64162
INPUT
A
VDD
VSS1
VSS2
VSS3
VSSL
Measuring circuit 4
(*3) VIL
INPUT
VIH
OUTPUT
VDD VSS1 VSS2 VSS3 VSSL
OUTPUT
Waveform Monitoring
*1 Input logic circuit to determine the specified measuring conditions. *2 Measured at the specified output pins. *3 Measured at the specified input pins.
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¡ Semiconductor A/D Converter Characteristics
MSM64162
(VDD = 0 V, VSS1 = –1.5 V, Ta = –40 to +85°C unless otherwise specified) Parameter Symbol RS0, RS1, RT0, RT0-1, RT1 Condition Min. Typ. Max. Unit
Measuring Circuit
Resistor for Oscillation
CS0, CT0, CS1 ≥ 740 pF
2.0
—
—
kW
Input Current Limiting Resistor
RI0, RI1 fOSC1
— Resistor for oscillation = 2 kW Resistor for oscillation = 10 kW Resistor for oscillation = 200 kW RT0, RT0-1, RT1 = 2 kW RT0, RT0-1, RT1 = 10 kW RT0, RT0-1, RT1 = 200 kW
1.0 165 41.8 2.55 3.89 0.990
10 221 52.2 3.04 4.18 1.0
— 256 60.6 3.53 4.35 1.010
kW 5 kHz kHz kHz — — —
Oscillation Frequency
fOSC2 fOSC3 Kf1
RS•RT Oscillation Frequency Ratio (*)
Kf2 Kf3
0.0561 0.0584 0.0637
*
Kfx is the ratio of the oscillation frequency by a sensor resistor to the oscillation frequency by a reference resistor in the same condition.
Kfx = fOSCX (RT0–CS0 Oscillation) fOSCX (RS0–CS0 Oscillation) , (x = 1, 2, 3) fOSCX (RT0-1–CS0 Oscillation) fOSCX (RS0–CS0 Oscillation) fOSCX (RT1–CS1 Oscillation) , fOSCX (RS1–CS1 Oscillation)
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¡ Semiconductor Measuring circuit 5
(CROSC1) (CROSC0)
MSM64162
RT0-1
CRT0 RT0
RS1
RS0
CS1
CS0
RT1
CT0
RI1
RI0
RT1 RS1 CS1 IN1
IN0 CS0 RS0
Oscillation Mode Designation
RESET TST1 TST2 P0.0 P0.1 P0.2 P0.3 VDD VSSL VSS1 D. U. T. P3.3 Frequency Measurement (fOSCX)
Cl RT0, RT0-1, RT1 = 2 kW/10 kW/200 kW RS0, RS1 = 10 kW RI0, RI1 = 10 kW CS0, CT0, CS1 = 820 pF Cl = 0.1 mF
RT0
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¡ Semiconductor
MSM64162
ABSOLUTE MAXIMUM RATINGS (3.0 V Spec.)
(VDD = 0 V) Parameter Power Supply Voltage 1 Power Supply Voltage 2 Power Supply Voltage 3 Power Supply Voltage 4 Input Voltage 1 Input Voltage 2 Output Voltage 1 Output Voltage 2 Output Voltage 3 Output Voltage 4 Storage Temperature Symbol VSS1 VSS2 VSS3 VSSL VIN1 VIN2 VOUT1 VOUT2 VOUT3 VOUT4 TSTG Condition Ta = 25°C Ta = 25°C Ta = 25°C Ta = 25°C VSS2 Input, Ta = 25°C VSSL Input, Ta = 25°C VSS1 Output, Ta = 25°C VSS2 Output, Ta = 25°C VSS3 Output, Ta = 25°C VSSL Output, Ta = 25°C — Rating –2.0 to +0.3 –4.0 to +0.3 –5.5 to +0.3 –4.0 to +0.3 VSS2 – 0.3 to +0.3 VSSL – 0.3 to +0.3 VSS1 – 0.3 to +0.3 VSS2 – 0.3 to +0.3 VSSL – 0.3 to +0.3 VSSL – 0.3 to +0.3 –55 to +150 Unit V V V V V V V V V V °C
RECOMMENDED OPERATING CONDITIONS (3.0 V Spec.)
(VDD = 0 V) Parameter Operating Temperature Symbol Top
"duty 1/2"
Condition —
Using LCD driver with
Range –40 to +85 –3.5 to –2.2
Unit °C
Operating Voltage
VSS2
Except using LCD driver with "duty 1/2"
V –3.5 to –2.0 90 to 500 30 to 66 kW kHz
External 400 kHz RC Oscillator Resistance Crystal Oscillation Frequency
ROS fXT
— —
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¡ Semiconductor
MSM64162
ELECTRICAL CHARACTERISTICS (3.0 V Spec.)
DC Characteristics
(VDD = 0 V, VSS2 = –3.0 V, Ta = –40 to +85°C unless otherwise specified) Parameter
Symbol Measuring Circuit
Condition +100% –50% +100% –50%
Min.
Typ.
Max.
Unit
VSS1 Voltage VSS3 Voltage VSSL Voltage Crystal Oscillation Start Voltage Crystal Oscillation Hold Voltage Crystal Oscillation Stop Detection Time Internal Crystal Oscillator Capacitance External Crystal Oscillator Capacitance Internal Crystal Oscillator Capacitance Internal 400k RC Oscillator Capacitance 400k RC Oscillation Frequency POR Generation Voltage POR Non-generation Voltage Battery Check Reference Voltage VRB Temperature Variation
VSS1 VSS3 VSSL VSTA VHOLD TSTOP CG CGEX CD COS fOSC VPOR1 VPOR2 VRB DVRB
Ca, Cb, C12 = 0.1 mF Ca, Cb, C12 = 0.1 mF — Oscillation start time: within 5 seconds — — — When external CG used — —
–1.7 –4.7 –1.9 — — 0.1 10 10 10 8 300 –0.7 –3.0 –0.73
–1.5 –4.5 –1.3 — — — 15 — 15 12 400 — — –0.63 –2.0
–1.3 –4.3 –0.6 –2.0 –2.0 1000 20 30 20 16 620 0 –2.0 –0.53 —
V V V V V ms pF pF pF pF kHz V V V
2
1
External resistor ROS = 100 kW VSS2 = –2.0 to –3.5 V When VSS2 is between VPOR1 and –3.0 V No POR when VSS2 is between VPOR2 and –3.0 V Ta = 25°C —
—
mV/°C
Notes: 1. "POR" denotes Power On Reset. 2. "TSTOP" indicates that if the crystal oscillator stops over the value of TSTOP, the system reset occurs.
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¡ Semiconductor DC Characteristics (continued)
MSM64162
(VDD = 0 V, VSS2 = –3.0 V, Ta = –40 to +85°C unless otherwise specified) Parameter
Symbol
Condition
CPU in halt state
Ta = –40 to +40°C
Min. — — — — —
Typ. 1.5 1.5 5.0 5.0 220
Max. 4.5 30 15 40 450
Unit mA mA mA mA mA
Measuring Circuit
Supply Current 1 Supply Current 2
IDD1 IDD2
(400k RC oscillation halt) Ta = +40 to +85°C CPU in operating state Ta = –40 to +40°C (400k RC oscillation halt) Ta = +40 to +85°C
CPU in operating state Supply Current 3 IDD3 (400k RC oscillation in operation) ROS = 100kW
CPU in halt state (400k RC oscillation
1
RT0 = 10 kW
—
300
450
mA
Supply Current 4
IDD4
halt), RC oscillator for A/D converter is in operating state
RT0 = 2 kW
—
1300
2000
mA
Battery check circuit in operating Supply Current 5 IDD5 state, CPU in operating state (400k RC oscillation halt) — 55 150 mA
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¡ Semiconductor DC Characteristics (continued)
MSM64162
(VDD = 0 V, VSS1 = VSSL = –1.5 V, VSS2 = –3.0 V, VSS3 = –4.5 V, Ta = –40 to +85°C unless otherwise specified) Parameter (Pin Name) Output Current 1 (P1.0) Output Current 2 (P1.1 to P1.3) (P2.0 to P2.3) (P3.0 to P3.3) Output Current 3 (BD) Output Current 4 (RT0, RT1, RS0, RS1, CRT0, CS0, CS1) Output Current 5 (When L16 to L23 are configured as output ports) Output Current 6 (OSC2)
Symbol
Condition VOH1 = –0.5 V VOL1 = VSS2 + 0.5 V VOH2 = –0.5 V VOL2 = VSS2 + 0.5 V VOH3 = –0.7 V VOL3 = VSS2 + 0.7 V VOH4 = –0.1 V VOL4 = VSS2 + 0.1 V VOH5 = –0.5 V VOL5 = VSS2 + 0.5 V VOH6 = –0.5 V VOL6 = VSS2 + 0.5 V VOH7 = –0.2 V (VDD level)
Min.
Typ.
Max.
Unit mA mA mA mA mA mA mA mA mA mA
Measuring Circuit
IOH1 IOL1 IOH2 IOL2 IOH3 IOL3 IOH4 IOL4 IOH5 IOL5 IOH6 IOL6 IOH7 IOMH7
–6.0 3.0 –6.0 0.7 –6.0 0.7 –2.5 0.7 –1.5 0.15 –6.0 0.7 — 4.0 — 4.0 — 4.0 —
–2.0 8.0 –2.0 2.0 –2.0 2.0 –1.3 1.3 –0.6 0.6 –2.0 2.0 — — — — — — —
–0.7 25 –0.7 6.0 –0.7 6.0 –0.7 2.5 –0.15 1.5 –0.7 6.0 –4.0 — –4.0 — –4.0 — 0.3
2 mA mA mA mA mA mA mA mA mA
VOMH7 = VSS1 + 0.2 V (VSS1 level) VOMH7S = VSS1 – 0.2 V (VSS1 level) VOML7 = VSS2 + 0.2 V (VSS2 level) VOML7S = VSS2 – 0.2 V (VSS2 level) VOL7 = VSS3 + 0.2 V VOH = VDD (VSS3 level)
Output Current 7 (L0 to L23)
IOMH7S IOML7 IOML7S IOL7
Output Leakage Current (P1.0 to P1.3) (P2.0 to P2.3) (P3.0 to P3.3) (RT0, RT1, RS0, RS1, CRT0, CS0, CS1)
IOOH
IOOL
VOL = VSS2
–0.3
—
—
mA
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¡ Semiconductor DC Characteristics (continued)
MSM64162
(VDD = 0 V, VSS1 = VSSL = –1.5 V, VSS2 = –3.0 V, VSS3 = –4.5 V, Ta = –40 to +85°C unless otherwise specified) Parameter (Pin Name)
Symbol
Condition VIH1 = VDD (when pulled down) VIL1 = VSS2 (when pulled up) VIH1 = VDD (in a high impedance state)
Min.
Typ.
Max.
Unit mA mA mA mA mA mA
Measuring Circuit
IIH1 Input Current 1 (P0.0 to P0.3) (P2.0 to P2.3) (P3.0 to P3.3) IIL1 IIH1Z IIL1Z IIH2 Input Current 2 (IN0, IN1) IIH2Z IIL2Z IIL3 Input Current 3 (OSC1) IIH3Z IIL3Z Input Current 4 (RESET, TST1, TST2) Input Voltage 1 (P0.0 to P0.3) (P2.0 to P2.3) (P3.0 to P3.3) Input Voltage 2 (IN0, IN1, OSC1) Input Voltage 3 (RESET, TST1, TST2) IIH4 IIL4 VIH1 VIL1 VIH2 VIL2 VIH3 VIL3
30 –300 0
90 –90 — — 90 — — –110 — — — –1.5 — — — — — —
300 –30 1.0 0 300 1.0 0 –10 1.0 0 1.0 –0.75 0 –2.4 0 –2.4 0 –2.4
VIL1 = VSS2 (in a high impedance state) –1.0 VIH2 = VDD (when pulled down) VIH2 = VDD (in a high impedance state) VIL2 = VSS2 (in a high impedance state) VIL3 = VSS2 (when pulled up) VIH3 = VDD (in a high impedance state) VIL3 = VSS2 (in a high impedance state) VIH4 = VDD VIL4 = VSS2 — — — — — — 30 0 –1.0 –300 0 –1.0 0 –3.0 –0.6 –3.0 –0.6 –3.0 –0.6 –3.0
3 mA mA mA mA mA mA V V V V V V 4
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¡ Semiconductor DC Characteristics (continued)
MSM64162
(VDD = 0 V, VSS1 = VSSL = –1.5 V, VSS2 = –3.0 V, VSS3 = –4.5 V, Ta = –40 to +85°C unless otherwise specified) Parameter (Pin Name) Hysteresis Width (P0.0 to P0.3) (P2.0 to P2.3) (P3.0 to P3.3) Hysteresis Width (RESET, TST1, TST2) Input Pin Capacitance (P0.0 to P0.3) (P2.0 to P2.3) (P3.0 to P3.3)
Symbol
Condition
Min.
Typ.
Max.
Unit
Measuring Circuit
DVT1
—
0.2
0.5
1.0
V 4
DVT2
—
0.2
0.5
1.0
V
CIN
—
—
—
5.0
pF
1
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¡ Semiconductor Measuring circuit 1
MSM64162
CS0 RT0 RI0
RT0 OSC1 ROS OSC2 VSSL VDD VSS2 A Cl V
CS0
IN0
XT Crystal 32.768 kHz XT C1 C12 C2
VSS1
VSS3 Cl Ca, Cb, C12 ROS RT0 CS0 RI0 : 0.47 mF : 0.1 mF : 100 kW : 10 kW/2 kW : 820 pF : 10 kW
Ca V
Cb V
Measuring circuit 2
(*2) OUTPUT
(*1) VIL
INPUT
VIH
A
VDD
VSS1
VSS2
VSS3
VSSL
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¡ Semiconductor Measuring circuit 3
(*3)
OUTPUT
MSM64162
INPUT
A
VDD
VSS1
VSS2
VSS3
VSSL
Measuring circuit 4
(*3) VIL
INPUT
VIH
OUTPUT
VDD VSS1 VSS2 VSS3 VSSL
Waveform Monitoring
*1 Input logic circuit to determine the specified measuring conditions. *2 Measured at the specified output pins. *3 Measured at the specified input pins.
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¡ Semiconductor A/D Converter Characteristics
MSM64162
(VDD = 0 V, VSS2 = –3.0 V, Ta = –40 to +85°C unless otherwise specified) Parameter Symbol RS0, RS1, RT0, RT0-1, RT1 Condition Min. Typ. Max. Unit
Measuring Circuit
Resistor for Oscillation
CS0, CT0, CS1 ≥ 740 pF
1.0
—
—
kW
Input Current Limiting Resistor
RI0, RI1 fOSC1
— Resistor for oscillation = 2 kW Resistor for oscillation = 10 kW Resistor for oscillation = 200 kW RT0, RT0-1, RT1 = 2 kW RT0, RT0-1, RT1 = 10 kW RT0, RT0-1, RT1 = 200 kW
1.0 200 46.5 2.79 4.115 0.990
10 239 55.4 3.32 4.22 1.0
— 277 64.3 3.85 4.326 1.010
kW 5 kHz kHz kHz — — —
Oscillation Frequency
fOSC2 fOSC3 Kf1
RS•RT Oscillation Frequency Ratio(*)
Kf2 Kf3
0.0573 0.0616 0.0659
*
Kfx is the ratio of the oscillation frequency by a sensor resistor to the oscillation frequency by a reference resistor in the same condition.
fOSCX (RT0–CS0 Oscillation) fOSCX (RS0–CS0 Oscillation) , ( x = 1 , 2, 3 ) fOSCX (RT0-1–CS0 Oscillation) fOSCX (RS0–CS0 Oscillation) fOSCX (RT1–CS1 Oscillation) , fOSCX (RS1–CS1 Oscillation)
Kfx =
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¡ Semiconductor Measuring circuit 5
MSM64162
(CROSC1) RS1 CS1 CS0 RT1 RI1 RI0
(CROSC0) RT0-1 CRT0 RT0 RT0 RS0 CT0
RT1 RS1 CS1 IN1 Oscillation Mode Designation RESET TST1 TST2 P0.0 P0.1 P0.2 P0.3 VDD
IN0 CS0 RS0
P3.3 D. U. T.
Frequency Measurement (fOSCX)
VSSL
VSS2
Cl RT0, RT0-1, RT1 = 2 kW/10 kW/200 kW RS0, RS1 = 10 kW RI0, RI1 = 10 kW CS0, CT0, CS1 = 820 pF Cl = 0.47 mF
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¡ Semiconductor
MSM64162
FUNCTIONAL DESCRIPTION
• A/D converter (ADC) The MSM64162 has a built-in 2-channel RC oscillation type A/D converter. The A/D converter is composed of a 2-channel oscillation circuit, Counter A (CNTA0-4, a 4.8-digit decade counter), Counter B (CNTB0-3, a 14-bit binary counter), and A/D Converter Control Registers 0 and 1 (ADCON0, ADCON1). By counting oscillation frequencies that vary depending on a resistor or capacitor connected to the RC oscillation circuit, the A/D converter converts resistance values or capacitance values to corresponding digital values. By using a thermistor or humidity sensor as a resistance, a thermometer or a hygrometer can be constructed. By applying a separate sensor to each channel of the 2-channel RC oscillation circuit, it is also possible to extend measure ranges or measure at two places. • LCD driver (LCD) The MSM64162 has a built-in LCD driver for 24 outputs. The LCD driver consists of 21 ¥ 4-bit display registers (DSPR0-20), the Display Control Register (DSPCON), a 24-output LCD driver circuit, and a bias generation circuit (BIAS). There are three types of driving methods: 1/4 duty, 1/3 duty and 1/2 duty. Software selects the duty mode. A mask option can select either a common driver or a segment driver for each LCD driver pin. A mask option can also specify assignment of each bit of the display register to each segment. All the display registers must be selected by a mask option. L16 to L23 of the LCD driver can be configured to be output ports by a mask option. The relationship between the duty, the bias method, and the maximum segment number follows: 1/4 duty 1/3 bias method ------- 80 segments 1/3 duty 1/3 bias method ------- 63 segments 1/2 duty 1/2 bias method ------- 44 segments • Buzzer driver (BD) The MSM64162 has a built-in buzzer driver with 2 buzzer output frequencies and 4 buzzer output modes. Each buzzer output is selected by the Buzzer Control Register (BDCON) and the Buzzer Frequency Control Register (BFCON). • Capture circuit (CAPR) The MSM64162 captures 32 Hz to 256 Hz output of the time base counter at the falling of Port 0.0 or 0.1 (P0.0 or P0.1) to "L" level when the pull-up resistor input is chosen, or at the rising to "H" level when the pull-down resistor input is chosen. The capture circuit is composed of the Capture Control Register (CAPCON) and the Capture Registers (CAPR0, CAPR1) that fetch output from the time base counter. • Watchdog timer (WDT) The MSM64162 has a built-in watchdog timer to detect CPU malfunction. The watchdog timer is composed of a 6-bit watchdog timer counter (WDTC) to count a 16 Hz output and a watchdog timer control register (WDTCON) to reset WDTC.
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¡ Semiconductor
MSM64162
• Clock generation circuit (2CLK) The clock generation circuit (2CLK) in the MSM64162 contains a 32.768 kHz crystal oscillation circuit, a 400 kHz RC oscillation circuit, and a clock control port. This circuit generates the system clock (CLK) and the time base clock (32.768 kHz). The system clock drives the CPU while the time base clock drives the time base counter and the buzzer driver. Via the contents of the frequency Control Register (FCON), the system clock can be switched between 32.768 kHz (the output of the crystal oscillation circuit) and 400 kHz (the output of the RC oscillation circuit). Note: The oscillation frequency of the RC oscillation circuit varies depending on the value of an external resistor (ROS), operating power supply voltage (VDD), and ambient temperatures (Ta). • Time base counter (TBC) The MSM64162 has a built-in time base counter (TBC) that generates clocks to be supplied to internal peripheral circuits. The time base counter is composed of 15 binary counters. The count clock of the time base is driven by the oscillation clock (32.768 kHz) of the crystal oscillation circuit. The output of the time base counter is used for the buzzer driver, the system reset circuit, the watchdog timer, the time base interrupt, the sampling clocks of each port, and the capture circuit. • I/O port Input-output ports (P2, P3) (8 bits)
Input port (P0) (4 bits) Output port (P1) (4 bits)
: Pull-up (pull-down) resistor input or highimpedance input, CMOS output or NMOS open drain output: these can be specified for each bit; external 0 interrupt : Pull-up (pull-down) resistor input or highimpedance input; external 1 interrupt : CMOS output or NMOS open drain output
• Interrupt (INTC) The MSM64162 has 9 interrupt sources (9 vector addresses), of which two are external interrupts from ports and seven are internal interrupts. Of the nine interrupt sources, only the watchdog interrupt cannot be disabled (non-maskable interrupt). The other eight interrupts are controlled by the master interrupt enable flag (MI) and the interrupt enable registers (IE0, IE1 and IE2). When an interrupt condition is met, the CPU branches to a vector address corresponding to the interrupt source. • Battery check circuit (BC) The battery check circuit (BC) detects the level of the supply voltage by comparing the voltage generated by an external supply-voltage dividing resistor (RBLD) with the internal reference voltage (Vrb).
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¡ Semiconductor
APPLICATION CIRCUITS
LC D
ROS Crystal 32.768 kHz
OSC2 OSC1 XT XT RESET P1.0 P1.1 P1.2 P1.3 P0.0 P0.1 P0.2 P0.3
L23
L0 VDD C2 C1 C VSS3 12 VSS2 VSS1 VSSL TST2 TST1
1.5 V Spec. Application Circuit
MSM64162-xxx (1.5 V spec.)
C1 1.5 V Cb Ca
Cl
IN0 CS0 RS0 CRT0 RT0 IN1 CS1 RS1 RT1 BD P3.3
Switch matrix (4 ¥ 4)
RT1 RS1 CS1 RI1
RT0 RS0 RI0
CS0
• Temperature measurement by two thermistors • CG of crystal oscillator : Internal
Buzzer
MSM64162
OSC monitor
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¡ Semiconductor
APPLICATION CIRCUITS (continued)
LC D
ROS Crystal 32.768 kHz CGEX OSC2 OSC1 XT XT RESET P1.0 P1.1 P1.2 P1.3 P0.0 P0.1 P0.2 P0.3 L23 L0 VDD C2
3.0 V Spec. Application Circuit
MSM64162-xxx (3.0 V spec.)
VSS3 VSS2
C1 C 12
Cb
C2 3V
VSS1 VSSL TST2 TST1
IN0 CS0 RS0 CRT0 RT0 IN1 CS1 RS1 RT1 BD P3.3 P3.1
Ca Cl
Switch matrix (4 ¥ 4)
RT1 RS1 CS1 RI1
RT0
RS0
CS0
RI0
• Temperature measurement by two thermistors • Battery check circuit is used • CGEX of crystal oscillator : External
RBLD Buzzer
MSM64162
OSC monitor
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¡ Semiconductor
MSM64162
PACKAGE DIMENSIONS
(Unit : mm)
QFP64-P-1420-1.00-BK
Mirror finish
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 1.25 TYP.
Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
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¡ Semiconductor
MSM64162
(Unit : mm)
QFP80-P-1420-0.80-BK
Mirror finish
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 1.27 TYP.
Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
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