MSM64164C

E2E0035-38-94 ¡ Semiconductor MSM64164C ¡ Semiconductor This version: Sep. 1998 MSM64164C Previous version: Apr. 1998 4-Bit Microcontroller with Built-in RC Oscillation Type A/D Converter and LCD Driver GENERAL DESCRIPTION The MSM64164C is a low power 4-bit microcontroller that employs Oki's original CPU core nX4/20. The MSM64164C is best suitable for applications such as low power, high precision thermometers and hygrometers. The MSM64P164 is a one-time-programmable ROM-version product having one-time PROM (OTP) as internal program memory. The MSM64P164 is used to evaluate the software development. The MSM64P164 differs from the MSM64164C in the polarity of the power supply. FEATURES • Operating range Operating frequencies Operating voltage : : 32.768 kHz, 400 kHz 1.25 to 1.7 V (1.5 V spec.) 2.0 to 3.5 V (3 V spec.) 2.2 to 3.5 V (3 V spec., 1/2 duty) –40 to +85°C 4064 bytes 256 nibbles 7.5 ms @ 400 kHz 91.6 ms @ 32.768 kHz 2 channels Time dividing 2-channel method Synchronous 8-bit transfer 34 outputs; duty ratio switchable by software 120 segments (max) 93 segments (max) 64 segments (max) 1 output (4 output modes selectable) 2 channels 32.768 kHz crystal oscillator and 400 kHz RC oscillator (with an external resistor) 32.768 kHz/400 kHz (switchable by software) 32.768 kHz 1.5 V/3 V (selectable by mask option) 3 ports ¥ 4 bits 1 port ¥ 4 bits 1 port ¥ 4 bits (8 out of the 34 LCD driver outputs can be used as output-only ports by mask option.) 1/41 Operating temperature • Memory space Internal program memory Internal data memory • Minimum instruction execution time • RC oscillation type A/D converter • Serial port • LCD driver (1) At 1/4 duty and 1/3 bias (2) At 1/3 duty and 1/3 bias (3) At 1/2 duty and 1/2 bias • Buzzer driver • Capture circuit • Watchdog timer • Clock CPU clock Time base clock • Power supply voltage • I/O port Input-output port Input port Output port : : : : : : : : : : : : : : : : : : : ¡ Semiconductor MSM64164C • Interrupt sources External interrupt : 2 sources Internal interrupt : 8 sources • Package options: 80-pin plastic QFP (QFP80-P-1420-0.80-BK) : (Product name : MSM64164C-¥¥¥GS-BK) 80-pin plastic QFP (QFP80-P-1414-0.65-K) : (Product name : MSM64164C-¥¥¥GS-K) 80-pin plastic TQFP (TQFP80-P-1212-0.50-K) : (Product name : MSM64164C-¥¥¥TS-K) Chip : (Product name : MSM64164C-¥¥¥) ¥¥¥ indicates a code number. • OTP version The MSM64P164 has one-time PROM (OTP) as internal program memory and is used to evaluate the software development. The MSM64P164 differs from the MSM64164C in the polarity of the power supply and operating voltage. Refer to the "MSM64P164 User's Manual" for details. 2/41 ¡ Semiconductor MSM64164C BLOCK DIAGRAM CPU CORE: nX-4/20 BSR TR2 TR0 (4) HALT C ALU PCM PCL TR1 PCH A11 to A8 A7 to A0 ROM 4064B MIEF B A (4) (4) H L X DB7 to DB0 Y (8) RAM 256N IR DECODER OSC2 OSC1 XT XT RESET 2CLK TBC IR TIMING CONTROLLER SP ROMR (8) INTC INT VSS P4.3 P4.2 P4.1 P4.0 P3.3 P3.2 P3.1 P3.0 P2.3 P2.2 P2.1 P2.0 P1.3 P1.2 P1.1 P1.0 P0.3 P0.2 P0.1 P0.0 RSTG WDT PORT4 VSS TST1 TST2 VSSL L0 L1 TST 5 INT INT INT PORT3 SIOP VR INT INT LCD CAPR L33 VSS VSS1 VSS2 VSS3 C1 C2 VDD VSS PORT1 BIAS INT PORT ADDRESS DB7 to DB0 INT BD ADC VSS VSS PORT2 VSS PORT0 BD RT1 RS1 CS1 IN1 RT0 CRT0 RS0 CS0 IN0 3/41 ¡ Semiconductor MSM64164C PIN CONFIGURATION (TOP VIEW) 70 RESET 66 OSC1 65 OSC2 72 TST2 71 TST1 80 P0.3 78 P0.1 77 P0.0 76 P1.3 75 P1.2 74 P1.1 73 P1.0 79 P0.2 67 VDD 69 XT 68 XT L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 L10 L11 L12 L13 L14 L15 L16 P2.0 P2.1 P2.2 P2.3 P3.0 P3.1 P3.2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 64 L33/P6.3 63 L32/P6.2 62 L31/P6.1 61 L30/P6.0 60 L29/P5.3 59 L28/P5.2 58 L27/P5.1 57 L26/P5.0 56 L25 55 L24 54 L23 53 L22 52 L21 51 L20 50 L19 49 L18 48 L17 47 C2 46 C1 45 VSS3 44 VSS2 43 VSS 42 VSS1 41 RT1 Note: Because pin 32 and pin 67 are internally connected with each other, VDD can be supplied from either pin 32 or pin 67. P3.3 25 P4.0 26 P4.1 27 P4.2 28 P4.3 29 BD 30 VSSL 31 VDD 32 RT0 33 CRT0 34 RS0 35 CS0 36 IN0 37 IN1 38 CS1 39 RS1 40 (QFP80-P-1420-0.80-BK) 80-Pin Plastic QFP 4/41 ¡ Semiconductor MSM64164C PIN CONFIGURATION (TOP VIEW) (continued) 62 L33/P6.3 61 L32/P6.2 60 L31/P6.1 59 L30/P6.0 58 L29/P5.3 57 L28/P5.2 56 L27/P5.1 55 L26/P5.0 54 L25 53 L24 52 L23 51 L22 50 L21 49 L20 48 L19 47 L18 46 L17 45 C2 44 C1 43 VSS3 42 VSS2 41 VSS 40 68 RESET L2 L3 L4 L5 L6 L7 L8 L9 L10 L11 L12 L13 L14 L15 L16 P2.0 P2.1 P2.2 P2.3 P3.0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 P4.2 26 27 28 29 30 31 32 33 34 35 36 37 38 64 OSC1 63 OSC2 70 TST2 69 TST1 78 P0.3 77 P0.2 76 P0.1 75 P0.0 74 P1.3 73 P1.2 72 P1.1 71 P1.0 65 VDD 67 XT 66 XT 80 L1 79 L0 P3.1 P3.2 P3.3 P4.0 P4.1 P4.3 BD VSSL VDD RT0 CRT0 RS0 CS0 IN0 IN1 CS1 RS1 RT1 VSS1 (QFP80-P-1414-0.65-K) 80-Pin Plastic QFP 39 5/41 ¡ Semiconductor MSM64164C PIN CONFIGURATION (TOP VIEW) (continued) L2 L3 L4 L5 L6 L7 L8 L9 L10 L11 L12 L13 L14 L15 L16 P2.0 P2.1 P2.2 P2.3 P3.0  78 P0.3 77 P0.2 76 P0.1 75 P0.0 80 L1 79 L0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 17 18 19 20 16 62 L33/P6.3 61 L32/P6.2 60 L31/P6.1 59 L30/P6.0 58 L29/P5.3 57 L28/P5.2 56 L27/P5.1 55 L26/P5.0 54 L25 53 L24 52 L23 51 L22 50 L21 49 L20 48 L19 47 L18 46 L17 45 C2 44 C1 43 VSS3 42 VSS2 41 VSS 68 RESET 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 64 OSC1 63 OSC2 70 TST2 69 TST1 74 P1.3 73 P1.2 72 P1.1 71 P1.0 65 VDD 67 XT 66 XT 39 P3.1 P3.2 P3.3 P4.0 P4.1 P4.2 P4.3 BD VSSL VDD RT0 CRT0 RS0 CS0 IN0 IN1 CS1 RS1 RT1 VSS1 (TQFP80-P-1212-0.50-K) 80-Pin Plastic TQFP 40 6/41 ¡ Semiconductor MSM64164C PAD CONFIGURATION Pad Layout Y X Chip Size Chip Thickness Coordinate Origin Pad Hole Size Pad Size Minimum Pad Pitch : : : : : : 5.39 mm ¥ 4.48 mm 350 mm (typ.) Chip center 100 mm ¥ 100 mm 120 mm ¥ 120 mm 180 mm Note: The chip substrate voltage is VDD. 7/41 ¡ Semiconductor Pad Coordinates Pad No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 Pad Name L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 L10 L11 L12 L13 L14 L15 L16 P2.0 P2.1 P2.2 P2.3 P3.0 P3.1 P3.2 P3.3 P4.0 P4.1 P4.2 P4.3 BD VSSL VDD RT0 CRT0 RS0 CS0 IN0 IN1 CS1 RS1 X (µm) –2545 –2314 –2083 –1852 –1621 –1390 –1159 –928 –697 –466 –235 0 235 466 697 928 1159 1390 1621 1852 2083 2314 2545 2545 2545 2545 2545 2545 2545 2545 2545 2545 2545 2545 2545 2545 2545 2545 2545 2545 Y (µm) –2090 –2090 –2090 –2090 –2090 –2090 –2090 –2090 –2090 –2090 –2090 –2090 –2090 –2090 –2090 –2090 –2090 –2090 –2090 –2090 –2090 –2090 –2090 –1880 –1670 –1460 –1250 –1040 –830 –620 –431 –74 200 410 620 830 1040 1250 1460 1670 Pad No. 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 Pad Name RT1 VSS1 VSS VSS2 VSS3 C1 C2 L17 L18 L19 L20 L21 L22 L23 L24 L25 L26 L27 L28 L29 L30 L31 L32 L33 OSC2 OSC1 VDD XT XT RESET TST1 TST2 P1.0 P1.1 P1.2 P1.3 P0.0 P0.1 P0.2 P0.3 MSM64164C X (µm) 2545 2545 2314 2083 1852 1621 1390 1159 928 697 466 235 0 –235 –466 –697 –928 –1159 –1390 –1621 –1852 –2083 –2314 –2545 –2545 –2545 –2545 –2545 –2545 –2545 –2545 –2545 –2545 –2545 –2545 –2545 –2545 –2545 –2545 –2545 Y (µm) 1880 2090 2090 2090 2090 2090 2090 2090 2090 2090 2090 2090 2090 2090 2090 2090 2090 2090 2090 2090 2090 2090 2090 2090 1775 1551 1327 1103 879 655 431 207 –207 –431 –655 –879 –1103 –1327 –1551 –1747 8/41 ¡ Semiconductor MSM64164C PIN DESCRIPTIONS Basic Functions Function Symbol VDD VSS1 VSS2 Power Supply VSS3 VSS VSSL C1, C2 XT Oscillation XT OSC1 OSC2 P1.0 to P1.3 P0.0 to P0.3 P2.0 to P4.3 Ports BD L0 to L25 L26/P5.0 to L33/P6.3 RT0 CRT0 RS0 A/D Converter CS0 IN0 RT1 RS1 CS1 IN1 Reset Test RESET TST1 TST2 Type — — — — — — — I O I O O I I/O O O O O O O O I O O O I I I I 0 V power supply Bias output for driving LCD (–1.5 V), or negative power supply at 1.5 V spec. Bias output for driving LCD (–3.0 V), or negative power supply at 3.0 V spec. Bias output for driving LCD (–4.5 V). Negative power supply for I/O port interface Negative power supply pin for internal logic (internally generated constant voltage) Pins for connecting a capacitor for generating VSS1, VSS2, and VSS3. 32.768 kHz crystal connection pins External 400 kHz oscillation resistor (ROS) connection pins Output port (P1.0 : high current output) Input port Input-output ports Output pin for the buzzer driver LCD driver pins LCD driver pins, or output ports by mask option Resistance temperature sensor connection pin Resistance/capacitance temperature sensor connection pin Reference resistor connection pin Reference capacitor connection pin Input pin for RC oscillator circuit Resistance temperature sensor connection pin Reference resistor connection pin Reference capacitor connection pin Input pin for RC oscillator circuit Reset pin Input pins for testing RC oscillation pins for A/D converter (channel 1) (CROSC1) RC oscillation pins for A/D converter (channel 0) (CROSC0) Description 9/41 ¡ Semiconductor Secondary Functions Function Symbol P0.0 P0.1 P0.2 P0.3 P2.0 P2.1 P2.2 External Interrupt P2.3 P3.0 P3.1 P3.2 P3.3 P4.0 P4.1 P4.2 P4.3 Capture Trigger P0.0 P0.1 P3.3 P4.0 Serial Port P4.1 P4.2 RC Oscillation Monitor O I/O Secondary functions of P0.0 and P0.1: I I O Capture circuit trigger input pins. Secondary functions of P3.3: This pin is assigned the data input of a serial port (SIN). Secondary functions of P4.0: This pin is assigned the data output of a serial port (SOUT). Secondary functions of P4.1: This pin is assigned the ready output of a serial port (SPR). Secondary functions of P4.2: This pin is assigned the clock I/O of a serial port (SCLK). Secondary functions of P4.3: P4.3 O I Type I Description Secondary functions of P0.0 to P0.3: Level-triggered external interrupt input pins. MSM64164C The change of input signal level causes an interrupt to occur. Secondary functions of P2.0 to P2.3, P3.0 to P3.3, and P4.0 to P4.3: Level-triggered external interrupt input pins. The change of input signal level causes an interrupt to occur. This pin is a monitor output (MON) of an RC oscillation clock (OSCCLK) for an A/D converter and a 400 kHz RC oscillation clock for a system clock. 10/41 ¡ Semiconductor MSM64164C MEMORY MAPS Program Memory Test program area ,,,,,,,,,,,,, ,,,,,,,,,,,,, ,,,,,,,,,,,,, 0FE0H,,,,,,,,,,,,, ,,,,,,,,,,,,, 0FFFH 32 bytes Contents of interrupt area 03BH 4064 bytes 038H 035H 032H 02FH 02CH 029H 026H 023H 020H Watchdog interrupt External interrupt (0) Serial port interrupt External interrupt (1) ADC interrupt 256 Hz interrupt 32 Hz interrupt 16 Hz interrupt 1 Hz interrupt 0.1 Hz interrupt 03EH Interrupt area 020H CZP area 010H Start address 000H 8 bits Program Memory Map Address 000H is the instruction execution start address by the system reset. The CZP area from address 010H to address 01FH is the start address for the CZP subroutine of 1-byte call instruction. The start address of interrupt subroutine is assigned to the interrupt address from address 020H to 03DH. The user area has 4064 bytes of address 000H to address 0FDF. No program can be stored in the test program area. 11/41 ¡ Semiconductor MSM64164C Data Memory The data memory area consists of 8 banks and each bank has 256 nibbles (256 ¥ 4 bits). The data RAM is assigned to BANK 7 and peripheral ports are assigned to BANK 0. 7FFH 780H 700H 6FFH BANK7 Data RAM area (256 nibbles) Data/Stack area (128 nibbles) Contents of 000H to 07FH Inaccessible area 07FH SFR area 100H 0FFH 080H 07FH 000H 4 bits Unused area BANK 0 000H Data Memory Map Half the data RAM area (128 nibbles) is shared by the stack area. The stack is a memory starting from address 7FFH toward the low-order addresses where 4 nibbles are used by Subroutine Call Instruction and 8 nibbles are used by an interrupt. The addresses 080H to 0FFH of BANK 0 are not assigned as the data memory, so access to these addresses has no effect. Moreover, it is impossible to access BANK 1 to BANK 6. 12/41 ¡ Semiconductor MSM64164C ABSOLUTE MAXIMUM RATINGS (1.5 V Spec.) (VDD = 0 V) Parameter Power Supply Voltage 1 Power Supply Voltage 2 Power Supply Voltage 3 Power Supply Voltage 4 Power Supply Voltage 5 Input Voltage 1 Input Voltage 2 Input Voltage 3 Output Voltage 1 Output Voltage 2 Output Voltage 3 Output Voltage 4 Output Voltage 5 Storage Temperature Symbol VSS1 VSS2 VSS3 VSSL VSS VIN1 VIN2 VIN3 VOUT1 VOUT2 VOUT3 VOUT4 VOUT5 TSTG Condition Ta = 25°C Ta = 25°C Ta = 25°C Ta = 25°C Ta = 25°C VSS1 Input, Ta = 25°C VSS Input, Ta = 25°C VSSL Input, Ta = 25°C VSS1 Output, Ta = 25°C VSS2 Output, Ta = 25°C VSS3 Output, Ta = 25°C VSS Output, Ta = 25°C VSSL Output, Ta = 25°C — Rating –2.0 to +0.3 –4.0 to +0.3 –5.5 to +0.3 –2.0 to +0.3 –5.5 to +0.3 VSS1 – 0.3 to +0.3 VSS – 0.3 to +0.3 VSSL – 0.3 to +0.3 VSS1 – 0.3 to +0.3 VSS2 – 0.3 to +0.3 VSS3 – 0.3 to +0.3 VSS – 0.3 to +0.3 VSSL – 0.3 to +0.3 –55 to +150 Unit V V V V V V V V V V V V V °C RECOMMENDED OPERATING CONDITIONS (1.5 V Spec.) (VDD = 0 V) Parameter Operating Temperature Operating Voltage External 400 kHz RC Oscillator Resistance Crystal Oscillation Frequency Symbol Top VSS1 VSS ROS fXT Condition — — — — — Range –40 to +85 –1.7 to –1.25 –5.25 to VSS1 250 to 500 30 to 35 Unit °C V V kW kHz 13/41 ¡ Semiconductor MSM64164C ELECTRICAL CHARACTERISTICS (1.5 V Spec.) DC Characteristics (VDD = 0 V, VSS1 = VSS = –1.5 V, Ta = –40 to +85°C unless otherwise specified) Parameter Symbol Condition +100% –50% +100% –50% Min. Typ. Max. Unit Measuring Circuit VSS2 Voltage VSS3 Voltage VSSL Voltage Crystal Oscillation Start Voltage Crystal Oscillation Hold Voltage Crystal Oscillation Stop Detection Time Internal Crystal Oscillator Capacitance External Crystal Oscillator Capacitance Internal Crystal Oscillator Capacitance Internal 400k RC Oscillator Capacitance 400k RC Oscillation Frequency POR Generation Voltage POR Non-generation Voltage VSS2 VSS3 VSSL VSTA VHOLD TSTOP CG CGEX CD COS fOSC VPOR1 VPOR2 Ca, Cb, C12 = 0.1 mF Ca, Cb, C12 = 0.1 mF — Oscillation start time: within 5 seconds — — — When external CG used — — –3.2 –4.7 –1.5 — — 0.1 10 10 10 8 80 –0.4 –1.5 –3.0 –4.5 –1.3 — — — 15 — 15 12 220 — — –2.8 –4.3 –0.6 –1.45 –1.25 1000 20 30 20 16 350 0 –1.2 V V V V V ms pF pF pF pF kHz V V 1 External resistor ROS = 300 kW VSS1 = –1.25 to –1.7 V When VSS1 is between VPOR1 and –1.5 V No POR when VSS1 is between VPOR2 and –1.5 V Notes: 1. "POR" denotes Power On Reset. 2. "TSTOP" indicates that if the crystal oscillator stops over the value of TSTOP, the system reset occurs. 14/41 ¡ Semiconductor DC Characteristics (continued) MSM64164C (VDD = 0 V, VSS1 = VSS = –1.5 V, Ta = –40 to +85°C unless otherwise specified) Parameter Symbol Condition CPU in halt state Ta = –40 to +40°C Min. — — — — — Typ. 2 2 5 5 40 Max. 5 30 15 40 80 Unit mA mA mA mA mA Measuring Circuit Supply Current 1 Supply Current 2 IDD1 IDD2 (400k RC oscillation halt) Ta = +40 to +85°C CPU in operating state Ta = –40 to +40°C (400k RC oscillation halt) Ta = +40 to +85°C CPU in operating state Supply Current 3 IDD3 (400k RC oscillation in operation) ROS = 300 kW Serial transfer, Ta = –40 to +40°C Supply Current 4 IDD4 fSCK = 300 kHz, CPU in operating state (400k RC oscillaiton halt) CPU in halt state (400k RC oscillation Ta = +40 to +85°C — — 7 7 25 50 mA mA 1 RT0 = 10 kW — 150 230 mA Supply Current 5 IDD5 halt), RC oscillator for A/D converter is in operating state RT0 = 2 kW — 600 900 mA 15/41 ¡ Semiconductor DC Characteristics (continued) MSM64164C (VDD = 0 V, VSS1 = VSSL = VSS = –1.5 V, VSS2 = –3.0 V, VSS3 = –4.5 V, Ta = –40 to +85°C unless otherwise specified) Parameter (Pin Name) Symbol Condition VOH1 = –0.5 V VOL1 = VSS + 0.5 V VSS = –5 V, VOH1S = –0.5 V VSS = –5 V, VOL1 = VSS + 0.5 V VOH2 = –0.5 V VOL2 = VSS + 0.5 V VSS = –5 V, VOH2S = –0.5 V VSS = –5 V, VOL2 = VSS + 0.5 V VOH3 = –0.7 V VOL3 = VSS1 + 0.7 V VOH4 = –0.1 V VOL4 = VSS1 + 0.1 V VOH5 = –0.5 V VOL5 = VSS + 0.5 V VSS = –5 V, VOH5S = –0.5 V VSS = –5 V, VOL5S = VSS + 0.5 V VOH6 = –0.5 V VOL6 = VSS1 + 0.5 V VOH7 = –0.2 V (VDD level) Min. –2.1 1.0 –36 4.0 –2.1 0.2 –9.0 1.0 –1.8 0.2 –1.1 0.3 –1.5 0.1 –2.0 0.2 –2.1 0.2 — 4.0 — 4.0 — 4.0 — Typ. –0.7 3.0 –12 12 –0.7 0.7 –3.0 3.0 –0.6 0.6 –0.6 0.6 –0.5 0.5 –0.7 0.7 –0.7 0.7 — — — — — — — Max. –0.2 9.0 –4.0 36 –0.2 2.1 –1.0 9.0 –0.2 1.8 –0.3 1.1 –0.1 1.5 –0.2 2.0 –0.2 2.1 –4.0 — –4.0 — –4.0 — 0.3 Unit mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Measuring Circuit IOH1 Output Current 1 (P1.0) IOL1 IOH1S IOL1S Output Current 2 (P1.1 to P1.3) (P2.0 to P2.3) (P3.0 to P3.3) (P4.0 to P4.3) Output Current 3 (BD) Output Current 4 (RT0, RT1, RS0, RS1, CRT0, CS0, CS1) IOH2 IOL2 IOH2S IOL2S IOH3 IOL3 IOH4 IOL4 IOH5 Output Current 5 (When L26 to L33 are IOL5 configured as output IOH5S ports) IOL5S Output Current 6 (OSC2) IOH6 IOL6 IOH7 IOMH7 Output Current 7 (L0 to L33) IOMH7S IOML7 IOML7S IOL7 Output Leakage Current (P1.0 to P1.3) (P2.0 to P2.3) (P3.0 to P3.3) (P4.0 to P4.3) (RT0, RT1, RS0, RS1, CRT0, CS0, CS1) IOOH 2 VOMH7 = VSS1 + 0.2 V (VSS1 level) VOMH7S = VSS1 – 0.2 V (VSS1 level) VOML7 = VSS2 + 0.2 V (VSS2 level) VOML7S = VSS2 – 0.2 V (VSS2 level) VOL7 = VSS3 + 0.2 V VOH = VDD (VSS3 level) IOOL VOL = VSS1 –0.3 — — mA 16/41 ¡ Semiconductor DC Characteristics (continued) MSM64164C (VDD = 0 V, VSS1 = VSSL = VSS = –1.5 V, VSS2 = –3.0 V, VSS3 = –4.5 V, Ta = –40 to +85°C unless otherwise specified) Parameter (Pin Name) Symbol Condition VIH1 = VDD (when pulled down) VIL1 = VSS (when pulled up) VIH1 = VDD, VSS = –5 V (when pulled down) Min. Typ. Max. Unit mA mA mA mA mA mA mA mA mA mA mA mA mA mA V V V V Measuring Circuit IIH1 Input Current 1 (P0.0 to P0.3) (P2.0 to P2.3) (P3.0 to P3.3) (P4.0 to P4.3) IIL1 IIH1S IIL1S IIH1Z IIL1Z IIH2 Input Current 2 (IN0, IN1) IIH2Z IIL2Z IIL3 Input Current 3 (OSC1) IIH3Z IIL3Z Input Current 4 (RESET, TST1, TST2) Input Voltage 1 (P0.0 to P0.3) (P2.0 to P2.3) (P3.0 to P3.3) (P4.0 to P4.3) Input Voltage 2 (IN0, IN1, OSC1) Input Voltage 3 (RESET, TST1, TST2) IIH4 IIL4 VIH1 VIL1 VIH1S VIL1S VIH2 VIL2 VIH3 VIL3 5.0 –60 70 18 –18 250 –250 — — 18 — — –22 — — — –0.75 — — — — — — — — 60 –5.0 660 –70 1.0 0 60 1.0 0 –6.0 1.0 0 1.0 –0.3 0 –1.2 0 –4.0 0 –1.2 0 –1.2 VIL1 = VSS = –5 V (when pulled up) –660 VIH1 = VDD (in a high impedance state) VIL1 = VSS (in a high impedance state) VIH2 = VDD (when pulled down) VIH2 = VDD (in a high impedance state) VIL2 = VSS1 (in a high impedance state) VIL3 = VSS1 (when pulled up) VIH3 = VDD (in a high impedance state) VIL3 = VSS1 (in a high impedance state) VIH4 = VDD VIL4 = VSS1 — — VSS = –5 V VSS = –5 V — — — — 0 –1.0 5.0 0 –1.0 –60 0 –1.0 0 –1.5 –0.3 –1.5 –1.0 –5.0 –0.3 –1.5 –0.3 –1.5 3 4 V V V V 17/41 ¡ Semiconductor DC Characteristics (continued) MSM64164C (VDD = 0 V, VSS1 = VSSL = VSS = –1.5 V, VSS2 = –3.0 V, VSS3 = –4.5 V, Ta = –40 to +85°C unless otherwise specified) Parameter (Pin Name) Hysteresis Width (P0.0 to P0.3) (P2.0 to P2.3) (P3.0 to P3.3) (P4.0 to P4.3) Hysteresis Width (RESET, TST1, TST2) Input Pin Capacitance (P0.0 to P0.3) (P2.0 to P2.3) (P3.0 to P3.3) (P4.0 to P4.3) Symbol Condition Min. Typ. Max. Unit Measuring Circuit DVT1 DVT1S VSS = –5 V — 0.05 0.25 0.1 1.0 0.3 1.5 V V 4 DVT2 — 0.05 0.1 0.3 V CIN — — — 5.0 pF 1 18/41 ¡ Semiconductor Measuring circuit 1 MSM64164C CS0 RT0 RI0 RT0 OSC1 ROS OSC2 VSSL VDD VSS1 A Cl V CS0 IN0 XT Crystal 32.768 kHz XT C1 C12 C2 VSS2 VSS3 VSS Ca, Cb, C12, Cl ROS RT0 CS0 RI0 : 0.1 mF : 300 kW : 10 kW/2 kW : 820 pF : 10 kW Ca V Cb V Measuring circuit 2 (*2) (*1) VIL INPUT VIH OUTPUT A VDD VSS1 VSS2 VSS3 VSSL VSS 19/41 ¡ Semiconductor Measuring circuit 3 (*3) MSM64164C INPUT A VDD VSS1 VSS2 VSS3 VSSL VSS Measuring circuit 4 (*3) VIL INPUT VIH OUTPUT VDD VSS1 VSS2 VSS3 VSSL VSS OUTPUT Waveform Monitoring *1 Input logic circuit to determine the specified measuring conditions. *2 Measured at the specified output pins. *3 Measured at the specified input pins. 20/41 ¡ Semiconductor A/D Converter Characteristics MSM64164C (VDD = 0 V, VSS1 = VSS = –1.5 V, Ta = –40 to +85°C unless otherwise specified) Parameter Symbol RS0, RS1, RT0, RT0-1, RT1 Condition Min. Typ. Max. Unit Measuring Circuit Resistor for Oscillation CS0, CT0, CS1 ≥ 740 pF 2.0 — — kW Input Current Limiting Resistor RI0, RI1 fOSC1 — Resistor for oscillation = 2 kW Resistor for oscillation = 10 kW Resistor for oscillation = 200 kW RT0, RT0-1, RT1 = 2 kW RT0, RT0-1, RT1 = 10 kW RT0, RT0-1, RT1 = 200 kW 1.0 165 41.8 2.55 3.89 0.990 10 221 52.2 3.04 4.18 1.0 — 256 60.6 3.53 4.35 1.010 kW 5 kHz kHz kHz — — — Oscillation Frequency fOSC2 fOSC3 Kf1 RS•RT Oscillation Frequency Ratio (*) Kf2 Kf3 0.0561 0.0584 0.0637 * Kfx is the ratio of the oscillation frequency by a sensor resistor to the oscillation frequency by a reference resistor in the same condition. Kfx = fOSCX (RT0–CS0 Oscillation) fOSCX (RS0–CS0 Oscillation) , (x = 1, 2, 3) fOSCX (RT0-1–CS0 Oscillation) fOSCX (RS0–CS0 Oscillation) fOSCX (RT1–CS1 Oscillation) , fOSCX (RS1–CS1 Oscillation) 21/41 ¡ Semiconductor Measuring circuit 5 (CROSC1) (CROSC0) MSM64164C RT0-1 CRT0 RT0 RS1 RS0 CS1 CS0 RT1 CT0 RI1 RI0 RT1 RS1 CS1 IN1 IN0 CS0 RS0 Oscillation Mode Designation RESET TST1 TST2 P0.0 P0.1 P0.2 P0.3 VDD VSSL VSS VSS1 D. U. T. P4.3 Frequency Measurement (fOSCX) Cl RT0, RT0-1, RT1 = 2 kW/10 kW/200 kW RS0, RS1 = 10 kW RI0, RI1 = 10 kW CS0, CT0, CS1 = 820 pF Cl = 0.1 mF RT0 22/41 ¡ Semiconductor AC Characteristics (Serial Interface) MSM64164C (VDD = 0 V, VSS1 = –1.5 V, VSS = –5 V, Ta = –40 to +85°C) Parameter SCLK Input Fall Time SCLK Input Rise Time SCLK Input "L" Level Pulse Width SCLK Input "H" Level Pulse Width SCLK Input Cycle Time SCLK Output Cycle Time SCLK Output Cycle Time SOUT Output Delay Time SIN Input Setup Time SIN Input Hold TIme Symbol tf tr tCWL tCWH tCYC Condition — — — — VSS = –5.25 V to VSS1 Min. — — 0.8 0.8 2.0 — — — 0.5 0.8 Typ. Max. — — — — — 30.5 2.5 — — — 1.0 1.0 — — — — — 0.4 — — Unit ms ms ms ms ms ms ms ms ms ms tCYC1(O) CPU is operating at 32.768 kHz. tCYC2(O) CPU is operating at 400 kHz. tDDR tDS tDH Cl = 10 pF — — tCYC SCLK (P4.2) 0V tr tCWH tDDR SOUT (P4.0) tf tCWL tDDR 0V tDS SIN (P3.3) tDH tDS 0V ("H" level = –1 V, "L" level = –4 V) 23/41 ¡ Semiconductor MSM64164C ABSOLUTE MAXIMUM RATINGS (3.0 V Spec.) (VDD = 0 V) Parameter Power Supply Voltage 1 Power Supply Voltage 2 Power Supply Voltage 3 Power Supply Voltage 4 Power Supply Voltage 5 Input Voltage 1 Input Voltage 2 Input Voltage 3 Output Voltage 1 Output Voltage 2 Output Voltage 3 Output Voltage 4 Storage Temperature Symbol VSS1 VSS2 VSS3 VSSL VSS VIN1 VIN2 VIN3 VOUT1 VOUT2 VOUT3 VOUT4 TSTG Condition Ta = 25°C Ta = 25°C Ta = 25°C Ta = 25°C Ta = 25°C VSS2 Input, Ta = 25°C VSS Input, Ta = 25°C VSSL Input, Ta = 25°C VSS2 Output, Ta = 25°C VSS3 Output, Ta = 25°C VSS Output, Ta = 25°C VSSL Output, Ta = 25°C — Rating –2.0 to +0.3 –4.0 to +0.3 –5.5 to +0.3 –4.0 to +0.3 –5.5 to +0.3 VSS2 – 0.3 to +0.3 VSS – 0.3 to +0.3 VSSL – 0.3 to +0.3 VSS2 – 0.3 to +0.3 VSS3 – 0.3 to +0.3 VSS – 0.3 to +0.3 VSSL – 0.3 to +0.3 –55 to +150 Unit V V V V V V V V V V V V °C RECOMMENDED OPERATING CONDITIONS (3.0 V Spec.) (VDD = 0 V) Parameter Operating Temperature Symbol Top "duty 1/2" Except using LCD driver with "duty 1/2" Condition — Using LCD driver with Range –40 to +85 –3.5 to –2.2 –3.5 to –2.0 –5.25 to (0.8•VSS2, –2.0 max.)* 90 to 500 30 to 66 Unit °C VSS2 Operating Voltage VSS External 400 kHz RC Oscillator Resistance Crystal Oscillation Frequency ROS fXT V — — — kW kHz * Indicates that the value of VSS is 80% of VSS2 and should not exceed –2.0 V. 24/41 ¡ Semiconductor MSM64164C ELECTRICAL CHARACTERISTICS (3.0 V Spec.) DC Characteristics (VDD = 0 V, VSS2 = VSS = –3.0 V, Ta = –40 to +85°C unless otherwise specified) Condition +100% –50% +100% –50% Min. Typ. Max. Unit Measuring Circuit Parameter Symbol VSS1 Voltage VSS3 Voltage VSSL Voltage Crystal Oscillation Start Voltage Crystal Oscillation Hold Voltage Crystal Oscillation Stop Detection Time Internal Crystal Oscillator Capacitance External Crystal Oscillator Capacitance Internal Crystal Oscillator Capacitance Internal 400k RC Oscillator Capacitance 400k RC Oscillation Frequency POR Generation Voltage POR Non-generation Voltage VSS1 VSS3 VSSL VSTA VHOLD TSTOP CG CGEX CD COS fOSC VPOR1 VPOR2 Ca, Cb, C12 = 0.1 mF Ca, Cb, C12 = 0.1 mF — Oscillation start time: within 5 seconds — — — When external CG used — — –1.7 –4.7 –1.9 — — 0.1 10 10 10 8.0 300 –0.7 –3.0 –1.5 –4.5 –1.3 — — — 15 — 15 12 400 — — –1.3 –4.3 –0.6 –2.0 –2.0 1000 20 30 20 16 620 0 –2.0 V V V V V ms pF pF pF pF kHz V V 1 External resistor ROS = 100 kW VSS2 = –2.0 to –3.5 V When VSS2 is between VPOR1 and –3.0 V No POR when VSS2 is between VPOR2 and –3.0 V Notes: 1. "POR" denotes Power On Reset. 2. "TSTOP" indicates that if the crystal oscillator stops over the value of TSTOP, the system reset occurs. 25/41 ¡ Semiconductor DC Characteristics (continued) MSM64164C (VDD = 0 V, VSS2 = VSS = –3.0 V, Ta = –40 to +85°C unless otherwise specified) Parameter Symbol Condition CPU in halt state Ta = –40 to +40°C Min. — — — — — — — Typ. 1.5 1.5 5.0 5.0 220 7.0 7.0 Max. 4.5 30 15 40 450 25 50 Unit mA mA mA mA mA mA mA Measuring Circuit Supply Current 1 Supply Current 2 Supply Current 3 IDD1 IDD2 IDD3 (400k RC oscillation halt) Ta = +40 to +85°C CPU in operating state Ta = –40 to +40°C (400k RC oscillation halt) Ta = +40 to +85°C CPU in operating state (400k RC oscillation in operation) Serial transfer, Ta = –40 to +40°C Supply Current 4 IDD4 fSCK = 300 kHz, CPU in operating state (400k RC oscillation halt) CPU in halt state (400k RC oscillation Ta = +40 to +85°C 1 RT0 = 10 kW — 300 450 mA Supply Current 5 IDD5 halt), RC oscillator for A/D converter is in operating state RT0 = 2 kW — 1300 2000 mA 26/41 ¡ Semiconductor DC Characteristics (continued) MSM64164C (VDD = 0 V, VSS1 = VSSL = –1.5 V, VSS2 = VSS = –3.0 V, VSS3 = –4.5 V, Ta = –40 to +85°C unless otherwise specified) Parameter (Pin Name) Symbol Condition VOH1 = –0.5 V VOL1 = VSS + 0.5 V VSS = –5 V, VOH1S = –0.5 V VSS = –5 V, VOL1 = VSS + 0.5 V VOH2 = –0.5 V VOL2 = VSS + 0.5 V VSS = –5 V, VOH2S = –0.5 V VSS = –5 V, VOL2 = VSS + 0.5 V VOH3 = –0.7 V VOL3 = VSS2 + 0.7 V VOH4 = –0.1 V VOL4 = VSS2 + 0.1 V VOH5 = –0.5 V VOL5 = VSS + 0.5 V VSS = –5 V, VOH5S = –0.5 V VSS = –5 V, VOL5S = VSS + 0.5 V VOH6 = –0.5 V VOL6 = VSS2 + 0.5 V VOH7 = –0.2 V (VDD level) Min. Typ. Max. Unit mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Measuring Circuit IOH1 Output Current 1 (P1.0) IOL1 IOH1S IOL1S Output Current 2 (P1.1 to P1.3) (P2.0 to P2.3) (P3.0 to P3.3) (P4.0 to P4.3) Output Current 3 (BD) Output Current 4 (RT0, RT1, RS0, RS1, CRT0, CS0, CS1) IOH2 IOL2 IOH2S IOL2S IOH3 IOL3 IOH4 IOL4 –6 3.0 –36 4.0 –6.0 0.7 –9.0 1.0 –6.0 0.7 –2.5 0.7 –1.5 0.15 –2.0 0.2 –6.0 0.7 — 4.0 — 4.0 — 4.0 — –2 8.0 –12 12 –2.0 2.0 –3.0 3.0 –2.0 2.0 –1.3 1.3 –0.6 0.6 –0.7 0.7 –2.0 2.0 — — — — — — — –0.7 25 –4 36 –0.7 6.0 –1.0 9.0 –0.7 6.0 –0.7 2.5 –0.15 1.5 –0.2 2.0 –0.7 6.0 –4.0 — –4.0 — –4.0 — 0.3 IOH5 Output Current 5 (When L26 to L33 are IOL5 configured as output I OH5S ports) IOL5S Output Current 6 (OSC2) IOH6 IOL6 IOH7 IOMH7 Output Current 7 (L0 to L33) IOMH7S IOML7 IOML7S IOL7 Output Leakage Current (P1.0 to P1.3) (P2.0 to P2.3) (P3.0 to P3.3) (P4.0 to P4.3) (RT0, RT1, RS0, RS1, CRT0, CS0, CS1) IOOH 2 VOMH7 = VSS1 + 0.2 V (VSS1 level) VOMH7S = VSS1 – 0.2 V (VSS1 level) VOML7 = VSS2 + 0.2 V (VSS2 level) VOML7S = VSS2 – 0.2 V (VSS2 level) VOL7 = VSS3 + 0.2 V VOH = VDD (VSS3 level) IOOL VOL = VSS2 –0.3 — — mA 27/41 ¡ Semiconductor DC Characteristics (continued) MSM64164C (VDD = 0 V, VSS1 = VSSL = –1.5 V, VSS2 = VSS = –3.0 V, VSS3 = –4.5 V, Ta = –40 to +85°C unless otherwise specified) Parameter (Pin Name) Symbol Condition VIH1 = VDD (when pulled down) VIL1 = VSS (when pulled up) VIH1 = VDD, VSS = –5 V (when pulled down) Min. Typ. Max. Unit mA mA mA mA mA mA mA mA mA mA mA mA mA mA V V V V Measuring Circuit IIH1 Input Current 1 (P0.0 to P0.3) (P2.0 to P2.3) (P3.0 to P3.3) (P4.0 to P4.3) IIL1 IIH1S IIL1S IIH1Z IIL1Z IIH2 Input Current 2 (IN0, IN1) IIH2Z IIL2Z IIL3 Input Current 3 (OSC1) IIH3Z IIL3Z Input Current 4 (RESET, TST1, TST2) Input Voltage 1 (P0.0 to P0.3) (P2.0 to P2.3) (P3.0 to P3.3) (P4.0 to P4.3) Input Voltage 2 (IN0, IN1, OSC1) Input Voltage 3 (RESET, TST1, TST2) IIH4 IIL4 VIH1 VIL1 VIH1S VIL1S VIH2 VIL2 VIH3 VIL3 30 –300 80 90 –90 250 –250 — — 90 — — –110 — — — –1.5 — — — — — — — — 300 –30 800 –80 1.0 0 300 1.0 0 –10 1.0 0 1.0 –0.75 0 –2.4 0 –4.0 0 –2.4 0 –2.4 VIL1 = VSS = –5 V (when pulled up) –800 VIH1 = VDD (in a high impedance state) VIL1 = VSS (in a high impedance state) VIH2 = VDD (when pulled down) VIH2 = VDD (in a high impedance state) VIL2 = VSS2 (in a high impedance state) VIL3 = VSS2 (when pulled up) VIH3 = VDD (in a high impedance state) VIL3 = VSS2 (in a high impedance state) VIH4 = VDD VIL4 = VSS2 — — VSS = –5 V VSS = –5 V — — — — 0 –1.0 30 0 –1.0 –300 0 –1.0 0 –3.0 –0.6 –3.0 –1.0 –5.0 –0.6 –3.0 –0.6 –3.0 3 4 V V V V 28/41 ¡ Semiconductor DC Characteristics (continued) MSM64164C (VDD = 0 V, VSS1 = VSSL = –1.5 V, VSS2 = VSS = –3.0 V, VSS3 = –4.5 V, Ta = –40 to +85°C unless otherwise specified) Parameter (Pin Name) Hysteresis Width (P0.0 to P0.3) (P2.0 to P2.3) (P3.0 to P3.3) (P4.0 to P4.3) Hysteresis Width (RESET, TST1, TST2) Input Pin Capacitance (P0.0 to P0.3) (P2.0 to P2.3) (P3.0 to P3.3) (P4.0 to P4.3) Symbol Condition Min. Typ. Max. Unit Measuring Circuit DVT1 DVT1S VSS = –5 V — 0.2 0.25 0.5 1.0 1.0 1.5 V V 4 DVT2 — 0.2 0.5 1.0 V CIN — — — 5.0 pF 1 29/41 ¡ Semiconductor Measuring circuit 1 MSM64164C CS0 RT0 RI0 RT0 OSC1 ROS OSC2 VSSL VDD VSS2 A Cl V CS0 IN0 XT Crystal 32.768 kHz XT C1 C12 C2 VSS1 VSS3 VSS Cl Ca, Cb, C12 ROS RT0 CS0 RI0 : 0.47 mF : 0.1 mF : 100 kW : 10 kW/2 kW : 820 pF : 10 kW Ca V Cb V Measuring circuit 2 (*2) OUTPUT (*1) VIL INPUT VIH A VDD VSS1 VSS2 VSS3 VSSL VSS 30/41 ¡ Semiconductor Measuring circuit 3 (*3) OUTPUT MSM64164C INPUT A VDD VSS1 VSS2 VSS3 VSSL VSS Measuring circuit 4 (*3) VIL INPUT VIH OUTPUT Waveform Monitoring VDD VSS1 VSS2 VSS3 VSSL VSS *1 Input logic circuit to determine the specified measuring conditions. *2 Measured at the specified output pins. *3 Measured at the specified input pins. 31/41 ¡ Semiconductor A/D Converter Characteristics MSM64164C (VDD = 0 V, VSS2 = VSS = –3.0 V, Ta = –40 to +85°C unless otherwise specified) Parameter Symbol RS0, RS1, RT0, RT0-1, RT1 Condition Min. Typ. Max. Unit Measuring Circuit Resistor for Oscillation CS0, CT0, CS1 ≥ 740 pF 1.0 — — kW Input Current Limiting Resistor RI0, RI1 fOSC1 — Resistor for oscillation = 2 kW Resistor for oscillation = 10 kW Resistor for oscillation = 200 kW RT0, RT0-1, RT1 = 2 kW RT0, RT0-1, RT1 = 10 kW RT0, RT0-1, RT1 = 200 kW 1.0 200 46.5 2.79 4.115 0.990 10 239 55.4 3.32 4.22 1.0 — 277 64.3 3.85 4.326 1.010 kW 5 kHz kHz kHz — — — Oscillation Frequency fOSC2 fOSC3 Kf1 RS•RT Oscillation Frequency Ratio (*) Kf2 Kf3 0.0573 0.0616 0.0659 * Kfx is the ratio of the oscillation frequency by a sensor resistor to the oscillation frequency by a reference resistor in the same condition. fOSCX (RT0–CS0 Oscillation) fOSCX (RS0–CS0 Oscillation) , (x = 1, 2, 3) fOSCX (RT0-1–CS0 Oscillation) fOSCX (RS0–CS0 Oscillation) fOSCX (RT1–CS1 Oscillation) , fOSCX (RS1–CS1 Oscillation) Kfx = 32/41 ¡ Semiconductor Measuring circuit 5 MSM64164C (CROSC1) RS1 CS1 CS0 RT1 RI1 RI0 (CROSC0) RT0-1 CRT0 RT0 RT0 RS0 CT0 RT1 RS1 CS1 IN1 Oscillation Mode Designation RESET TST1 TST2 P0.0 P0.1 P0.2 P0.3 VDD IN0 CS0 RS0 P4.3 D. U. T. Frequency Measurement (fOSCX) VSSL VSS VSS2 Cl RT0, RT0-1, RT1 = 2 kW/10 kW/200 kW RS0, RS1 = 10 kW RI0, RI1 = 10 kW CS0, CT0, CS1 = 820 pF Cl = 0.47 mF 33/41 ¡ Semiconductor AC Characteristics (Serial Interface) MSM64164C (VDD = 0 V, VSS2 = –3 V, VSS = –5 V, Ta = –40 to +85°C) Parameter SCLK Input Fall Time SCLK Input Rise Time SCLK Input "L" Level Pulse Width SCLK Input "H" Level Pulse Width SCLK Input Cycle Time SCLK Output Cycle Time SCLK Output Cycle Time SOUT Output Delay Time SIN Input Setup Time SIN Input Hold TIme Symbol tf tr tCWL tCWH tCYC Condition — — — — — Min. — — 0.8 0.8 2.0 — — — 0.5 0.8 Typ. Max. — — — — — 30.5 2.5 — — — 1.0 1.0 — — — — — 0.4 — — Unit ms ms ms ms ms ms ms ms ms ms tCYC1(O) CPU is operating at 32.768 kHz. tCYC2(O) CPU is operating at 400 kHz. tDDR tDS tDH tCYC Cl = 10 pF — — SCLK (P4.2) 0V tr tCWH tDDR SOUT (P4.0) tf tCWL tDDR 0V tDS SIN (P3.3) tDH tDS 0V ("H" level = –1 V, "L" level = –4 V) 34/41 ¡ Semiconductor MSM64164C FUNCTIONAL DESCRIPTION • A/D converter (ADC) The MSM64164C has a built-in 2-channel RC oscillation type A/D converter. The A/D converter is composed of a 2-channel oscillation circuit, Counter A (CNTA0-4, a 4.8-digit decade counter), Counter B (CNTB0-3, a 14-bit binary counter), and A/D Converter Control Registers 0 and 1 (ADCON0, ADCON1). By counting oscillation frequencies that vary depending on a resistor or capacitor connected to the RC oscillation circuit, the A/D converter converts resistance values or capacitance values to corresponding digital values. By using a thermistor or humidity sensor as a resistance, a thermometer or a hygrometer can be constructed. By applying a separate sensor to each channel of the 2-channel RC oscillation circuit, it is also possible to extend measure ranges or measure at two places. • Serial port (SIOP) The MSM64164C has an 8-bit synchronous serial port. Receive/transmit operation of the serial port is performed simultaneously and the serial transfer clock can select either internal or external mode. Direction of transfer data can be big endian or little endian. Each pin of the serial port is assigned as secondary functions of P3.3 and P4.0 to P4.2. Setting each bit of SIN, SOUT, SPR and SCLK of P33CON and P40CON to P42CON to "1" makes each pin valid. • LCD driver (LCD) The MSM64164C has a built-in LCD driver for 34 outputs. The LCD driver consists of 31 ¥ 4-bit display registers (DSPR0-30), the Display Control Register (DSPCON), a 34-output LCD driver circuit, and a bias generation circuit (BIAS). There are three types of driving methods: 1/4 duty, 1/3 duty and 1/2 duty. Software selects the duty mode. A mask option can select either a common driver or a segment driver for each LCD driver pin. A mask option can also specify assignment of each bit of the display register to each segment. All the display registers must be selected by a mask option. L26 to L33 of the LCD driver can be configured to be output ports by a mask option. The relationship between the duty, the bias method, and the maximum segment number follows: 1/4 duty 1/3 bias method ------- 120 segments 1/3 duty 1/3 bias method ------- 93 segments 1/2 duty 1/2 bias method ------- 64 segments • Buzzer driver (BD) The MSM64164C has a built-in buzzer driver with 15 buzzer output frequencies and 4 buzzer output modes. Each buzzer output is selected by the Buzzer Control Register (BDCON) and the Buzzer Frequency Control Register (BFCON). • Capture circuit (CAPR) The MSM64164C captures 32 Hz to 256 Hz output of the time base counter at the falling of Port 0.0 or 0.1 (P0.0 or P0.1) to "L" level when the pull-up resistor input is chosen, or at the rising to "H" level when the pull-down resistor input is chosen. The capture circuit is composed of the Capture Control Register (CAPCON) and the Capture Registers (CAPR0, CAPR1) that fetch output from the time base counter. 35/41 ¡ Semiconductor MSM64164C • Watchdog timer (WDT) The MSM64164C has a built-in watchdog timer to detect CPU malfunction. The watchdog timer is composed of a 6-bit watchdog timer counter (WDTC) to count a 16 Hz output and a watchdog timer control register (WDTCON) to reset WDTC. • Clock generation circuit (2CLK) The clock generation circuit (2CLK) in the MSM64164C contains a 32.768 kHz crystal oscillation circuit, a 400 kHz RC oscillation circuit, and a clock control port. This circuit generates the system clock (CLK) and the time base clock (32.768 kHz). The system clock drives the CPU while the time base clock drives the time base counter and the buzzer driver. Via the contents of the frequency Control Register (FCON), the system clock can be switched between 32.768 kHz (the output of the crystal oscillation circuit) and 400 kHz (the output of the RC oscillation circuit). Note: The oscillation frequency of the RC oscillation circuit varies depending on the value of an external resistor (ROS), operating power supply voltage (VDD), and ambient temperatures (Ta). • Time base counter (TBC) The MSM64164C has a built-in time base counter (TBC) that generates clocks to be supplied to internal peripheral circuits. The time base counter is composed of 15 binary counters and a 1/ 10 frequency dividing circuit. The count clock of the time base is driven by the oscillation clock (32.768 kHz) of the crystal oscillation circuit. The output of the time base counter is used for the buzzer driver, the system reset circuit, the watchdog timer, the time base interrupt, the sampling clocks of each port, and the capture circuit. • I/O port Input-output ports (P2, P3, P4) (12 bits) : Pull-up (pull-down) resistor input or highimpedance input, CMOS output or NMOS open drain output: these can be specified for each bit; external 0 interrupt Input port (P0) (4 bits) : Pull-up (pull-down) resistor input or highimpedance input; external 1 interrupt Output port (P1) (4 bits) : CMOS output or NMOS open drain output • Interrupt (INTC) The MSM64164C has ten interrupt sources (10 vector addresses), of which two are external interrupts from ports and eight are internal interrupts. Of the ten interrupt sources, only the watchdog interrupt cannot be disabled (non-maskable interrupt). The other nine interrupts are controlled by the master interrupt enable flag (MI) and the interrupt enable registers (IE0, IE1 and IE2). When an interrupt condition is met, the CPU branches to a vector address corresponding to the interrupt source. 36/41 ¡ Semiconductor APPLICATION CIRCUITS LC D ROS Crystal 32.768 kHz OSC2 OSC1 XT XT RESET P1.0 P1.1 P1.2 P1.3 P0.0 P0.1 P0.2 P0.3 L33 L0 VDD C2 C1 C 12 VSS3 Cb VSS2 VSS VSS1 Ca VSSL Cl TST2 TST1 CGEX MSM64164C-xxx (3.0 V spec.) C2 3V 5V CS 3.0 V Spec. Application Circuit Switch matrix (4 ¥ 4) RT1 RS1 CS1 RI1 RT0 • With 5 V interface • Temperature measurement by two thermistors • CGEX of crystal oscillator : External IN0 CS0 RS0 CRT0 RT0 IN1 CS1 RS1 RT1 BD P4.3 P4.2 P4.1 P4.0 P3.3 RS0 CS0 RI0 Buzzer OSC monitor SCLK SPR To serial communication SOUT interface (to 5 V (VSS) system) SIN MSM64164C 37/41 ¡ Semiconductor APPLICATION CIRCUITS (continued) LC D ROS OSC2 OSC1 XT XT RESET P1.0 P1.1 P1.2 P1.3 P0.0 P0.1 P0.2 P0.3 L33 L0 VDD C2 C1 C VSS3 12 Cb VSS2 Ca VSS VSS1 VSSL Cl TST2 TST1 1.5 V Spec. Application Circuit Crystal 32.768 kHz MSM64164C-xxx (1.5 V spec.) C1 1.5 V IN0 CS0 RS0 CRT0 RT0 IN1 CS1 RS1 RT1 BD P4.3 P4.2 P4.1 P4.0 P3.3 Switch matrix (4 ¥ 4) RT1 RS1 CS1 RI1 RT0 RS0 RI0 CS0 • Without 5 V interface • Temperature measurement by two thermistors • CG of crystal oscillator : Internal Buzzer MSM64164C 38/41 ¡ Semiconductor MSM64164C PACKAGE DIMENSIONS (Unit : mm) QFP80-P-1420-0.80-BK Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 1.27 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 39/41 ¡ Semiconductor MSM64164C (Unit : mm) QFP80-P-1414-0.65-K Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.85 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 40/41 ¡ Semiconductor MSM64164C (Unit : mm) TQFP80-P-1212-0.50-K Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.40 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 41/41