MSM82C53-2RS

E2O0018-27-X2 ¡ Semiconductor MSM82C53-2RS/GS/JS ¡ Semiconductor CMOS PROGRAMMABLE INTERVAL TIMER This version: Jan. 1998 MSM82C53-2RS/GS/JS Previous version: Aug. 1996 GENERAL DESCRIPTION The MSM82C53-2RS/GS/JS is programmable universal timers designed for use in microcomputer systems. Based on silicon gate CMOS technology, it requires a standby current of only 100 mA (max.) when the chip is in the nonselected state. During timer operation, power consumption is still very low only 8 mA (max.) at 8 MHz of current required. The device consists of three independent counters, and can count up to a maximum of 8 MHz (MSM82C53-2). The timer features six different counter modes, and binary count/BCD count functions. Count values can be set in byte or word units, and all functions are freely programmable. FEATURES • Maximum operating frequency of 8 MHz (MSM82C53-2) • High speed and low power consumption achieved through silicon gate CMOS technology • Completely static operation • Three independent 16-bit down-counters • 3 V to 6 V single power supply • Six counter modes available for each counter • Binary and decimal counting possible • 24-pin Plastic DIP (DIP24-P-600-2.54): (Product name: MSM82C53-2RS) • 28-pin Plastic QFJ (QFJ28-P-S450-1.27): (Product name: MSM82C53-2JS) • 32-pin Plastic SSOP(SSOP32-P-430-1.00-K): (Product name: MSM82C53-2GS-K) 1/19 ¡ Semiconductor MSM82C53-2RS/GS/JS FUNCTIONAL BLOCK DIAGRAM VCC GND 8 D7 - D0 Data Bus Buffer Counter #0 CLK0 GATE0 OUT0 8 WR RD A0 A1 CS Read/ Write Logic Counter #1 CLK1 GATE1 OUT1 Control Word Register Counter #2 CLK2 GATE2 OUT2 Internal Bus 2/19 ¡ Semiconductor MSM82C53-2RS/GS/JS PIN CONFIGURATION (TOP VIEW) D7 1 D6 2 D5 3 D4 4 D3 5 D2 6 D1 7 D0 8 CLK0 9 OUT0 10 GATE0 11 GND 12 24 Vcc 23 WR 22 RD 21 CS 20 A1 19 A0 18 CLK2 17 OUT2 16 GATE2 15 CLK1 14 GATE1 13 OUT1 24 pin Plastic DIP 32 pin Plastic SSOP NC D7 D6 D5 NC D4 D3 D2 D1 D0 CLK0 NC OUT0 GATE0 GND NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 NC Vcc WR RD NC CS A1 A0 CLK2 OUT2 GATE2 NC CLK1 GATE1 OUT1 NC (NC denotes "not connected") 27 WR 28 VCC 1 NC 26 RD 4 D5 3 D6 2 D7 28 pin Plastic QFJ D4 5 D3 6 D2 7 D1 8 D0 9 CLK0 10 NC 11 OUT0 12 GATE0 13 GND 14 NC 15 OUT1 16 GATE1 17 CLK1 18 25 NC 24 CS 23 A1 22 A0 21 CLK2 20 OUT2 19 GATE2 3/19 ¡ Semiconductor MSM82C53-2RS/GS/JS ABSOLUTE MAXIMUM RATINGS Parameter Supply Voltage Input Voltage Output Voltage Storage Temperature Power Dissipation Symbol VCC VIN VOUT TSTG PD Condition MSM82C53-2RS Rating MSM82C53-2GS MSM82C53-2JS Units V V V °C 0.9 W Respect to GND — Ta = 25°C 0.9 –0.5 to + 7 –0.5 to VCC + 0.5 –0.5 to VCC + 0.5 –55 to + 150 0.7 OPERATING RANGES Parameter Supply Voltage Operating Temperature Symbol VCC Top Condition VIL = 0.2 V, VIH = VCC -0.2 V, Operating Frequency 2.6 MHz Range 3 to 6 –40 to +85 Unit V °C RECOMMENDED OPERATING CONDITIONS Parameter Supply Voltage Operating Temperature "L" Input Voltage "H" Input Voltage Symbol VCC Top VIL VIH Min. 4.5 –40 –0.3 2.2 Typ. 5 +25 — — Max. 5.5 +85 +0.8 VCC + 0.3 Unit V °C V V DC CHARACTERISTICS Parameter "L" Output Voltage "H" Output Voltage Input Leak Current Output Leak Current Standby Supply Current Operating Supply Current Symbol VOL VOH ILI ILO ICCS ICC IOL = 4 mA IOH = –1 mA 0 £ VIN £ VCC 0 £ VOUT £ VCC CS ≥ VCC - 0.2 V VIH ≥ VCC - 0.2 V VIL £ 0.2 V tCLK = 125 ns CL = 0 pF VCC = 4.5 V to 5.5 V Ta = –40°C to +85°C Condition Min. — 3.7 –10 –10 — Typ. Max. Unit — 0.45 V — — — — — 10 10 100 V mA mA mA — — 8 mA 4/19 ¡ Semiconductor MSM82C53-2RS/GS/JS AC CHARACTERISTICS (VCC = 4.5 V to 5.5 V, Ta = –40 to +85°C) Parameter Address Set-up Time before Reading Address Hold Time after Reading Read Pulse Width Read Recovery Time Address Set-up Time before Writing Address Hold Time after Writing Write Pulse Width Data Input Set-up Time before Writing Data Input Hold Time after Writing Write Recovery Time Clock Cycle Time Clock "H" Pulse Width Clock "L" Pusle Width "H" Gate Pulse Width "L" Gate PUlse Width Gate Input Set-up Time before Clock Gate Input Hold Time after Clock Output Delay Time after Reading Output Floating Delay Time after Reading Output Delay Time after Gate Output Delay Time after Clock Output Delay Time after Address Symbol tAR tRA tRR tRVR tAW tWA tWW tDW tWD tRVW tCLK tPWH tPWL tGW tGL tGS tGH tRD tDF tODG tOD tAD MSM82C53-2 Min. 30 0 150 200 0 20 150 100 20 200 125 60 60 50 50 50 50 — 5 — — — Max. — — — — — — — — — — D.C. — — — — — — 120 90 120 150 180 Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Delay Time Condition Read Cycle Write Cycle CL = 150 pF Clock and Gate Timing Note: Timing measured at VL = 0.8 V and VH = 2.2 V for both inputs and outputs. 5/19 ¡ Semiconductor MSM82C53-2RS/GS/JS TIMING CHART WriteTiming A0 - 1 CS tAW D0 - 7 tDW WR tWW tWD tWA Read Timing A0 - 7, CS tAR RD tRR tRA tAD D0 - 7 High Impedance tRD tDF Valid High Impedance Clock & Gate Timing tCLK CLK tPWH tGS tGL GATE tODG OUT tGW tOD tPWL tGH tGS tGH 6/19 ¡ Semiconductor MSM82C53-2RS/GS/JS DESCRIPTION OF PIN FUNCTIONS Pin Symbol D7 - D 0 Name Bidirectional Data Bus Input/Output Input/Output Function Three-state 8-bit bidirectional data bus used when writing control words and count values, and reading count values upon reception of WR and RD signals from CPU. Data transfer with the CPU is enabled when this pin is at low level. When at high level, the data bus (D0 thru D7) is switched to high impedance state where neither writing nor reading can be executed. Internal registers, however, remain unchanged. Data can be transferred from MSM82C53-2 to CPU when this pin is at low level. Data can be transferred from CPU to MSM82C53-2 when this pin is at low level. One of the three internal counters or the control word register is selected by A0/A1 combination. These two pins are normally connected to the two lower order bits of the address bus. Supply of three clock signals to the three counters incorporated in MSM82C53-2. Control of starting, interruption, and restarting of counting in the three respective counters in accordance with the set control word contents. Output of counter output waveform in accordance with the set mode and count value. CS RD WR A 0 - A1 Chip Select Input Read Input Write Input Address Input Input Input Input Input CLK0 - 2 GATE0 - 2 OUT0 - 2 Clock Input Gate Input Counter Output Input Input Output SYSTEM INTERFACING Address Bus A1 A0 Control Bus 16 bits Data Bus 8 bits 8 bits A1 A0 Counter #0 OUT GATE CLK CS RD D7 - 0 MSM82C53-2 Counter #1 OUT GATE CLK WR Counter #2 OUT GATE CLK 7/19 ¡ Semiconductor MSM82C53-2RS/GS/JS DESCRIPTION OF BASIC OPERATIONS Data transfers between the internal registers and the external data bus is outlined in the following table. CS 0 0 0 0 0 0 0 0 1 0 RD 1 1 1 1 0 0 0 0 ¥ 1 WR 0 0 0 0 1 1 1 1 ¥ 1 A1 0 0 1 1 0 0 1 1 ¥ ¥ A0 0 1 0 1 0 1 0 1 ¥ ¥ Data Bus High Impedance Status Function Data Bus to Counter #0 Writing Data Bus to Counter #1 Writing Data Bus to Counter #2 Writing Data Bus to Control Word Register Writing Data Bus from Counter #0 Reading Data Bus from Counter #1 Reading Data Bus from Counter #2 Reading ¥ denotes "not specified". DESCRIPTION OF OPERATION MSM82C53-2 functions are selected by a control word from the CPU. In the required program sequence, the control word setting is followed by the count value setting and execution of the desired timer operation. Control Word and Count Value Program Each counter operation mode is set by control word programming. The control word format is out-lined below. D7 SC1 D6 SC0 D5 RL1 D4 RL0 D3 M2 D2 M1 Mode D1 M0 D0 BCD BCD Select Counter Read/Load (CS=0, A0, A1=1, 1, RD=1, WR=0) 8/19 ¡ Semiconductor • Select Counter (SC0, SC1): Selection of set counter SC1 0 0 1 1 SC0 0 1 0 1 Counter #0 Selection Counter #1 Selection Counter #2 Selection Illegal Combination Set Contents MSM82C53-2RS/GS/JS • Read/Load (RL1, RL0): Count value Reading/Loading format setting RL1 0 0 1 1 RL0 0 1 0 1 Counter Latch Operation Reading/Loading of Least Significant Byte (LSB) Reading/Loading of Most Significant Byte (MSB) Reading/Loading of LSB Followed by MSB Set Contents • Mode (M2, M1, M0): Operation waveform mode setting M2 0 0 ¥ ¥ 1 1 M1 0 0 1 1 0 0 M0 0 1 0 1 0 1 Set Contents Mode 0 (Interrupt on Terminal Count) Mode 1 (Programmable One-Shot) Mode 2 (Rate Generator) Mode 3 (Square Wave Generator) Mode 4 (Software Triggered Strobe) Mode 5 (Hardware Triggered Strobe) ¥ denotes "not specified". • BCD: Operation count mode setting BCD 0 1 Binary Count (16-bit Binary) BCD Count (4-decade Binary Coded Decimal) Set Contents After setting Read/Load, Mode, and BCD in each counter as outlined above, next set the desired count value. (In some Modes, counting is started immediately after the count value has been written). This count value setting must conform with the Read/Load format set in advance. Note that the internal counters are reset to 0000H during control word setting. The counter value (0000H) can’t be read. If the two bytes (LSB and MSB) are written at this stage (RL0 and RL1 = 1,1), take note of the following precaution. Although the count values may be set in the three counters in any sequence after the control word has been set in each counter, count values must be set consecutively in the LSB - MSB order in any one counter. 9/19 ¡ Semiconductor MSM82C53-2RS/GS/JS • Example of control word and count value setting Counter #0: Read/Load LSB only, Mode 3, Binary count, count value 3H Counter #1: Read/Load MSB only, Mode 5, Binary count, count value AA00H Counter #2: Read/Load LSB and MSB, Mode 0, BCD count, count value 1234 MVI A, 1EH OUT n3 MVI A, 6AH OUT n3 MVI A, B1H OUT n3 MVI A, 03H OUT n0 MVI A, AAH OUT n1 MVI A, 34H OUT n2 MVI A, 12H OUT n2 Counter #0 control word setting Counter #1 control word setting Counter #2 control word setting Counter #0 control value setting Counter #1 control value setting Counter #2 count value setting (LSB then MSB) Notes: n0: Counter #0 address n1: Counter #1 address n2: Counter #2 address n3: Control word register address • The minimum and maximum count values which can be counted in each mode are listed below. Mode 0 1 2 3 4 5 MIn. 1 1 2 2 1 1 Max, 0 0 0 1 0 0 — 1 cannot be counted 1 executes 10001H count — — Remarks 0 executes 10000H count (ditto in other modes) 10/19 ¡ Semiconductor Mode Definition MSM82C53-2RS/GS/JS • Mode 0 (terminal count) The counter output is set to “L” level by the mode setting. If the count value is then written in the counter with the gate input at “H” level (that is, upon completion of writing the MSB when there are two bytes), the clock input counting is started. When the terminal count is reached, the output is switched to “H” level and is maintained in this status until the control word and count value are set again. Counting is interrupted if the gate input is switched to “L” level, and restarted when switched back to “H” level. When Count Values are written during counting, the operation is as follows: 1-byte Read/Load. ............ When the new count value is written, counting is stopped immediately, and then restarted at the new count value by the next clock. 2-byte Read/Load ............. When byte 1 (LSB) of the new count value is written, counting is stopped immediately. Counting is restarted at the new count value when byte 2 (MSB) is written. • Mode 1 (programmable one-shot) The counter output is switched to “H” level by the mode setting. Note that in this mode, counting is not started if only the count value is written. Since counting has to be started in this mode by using the leading edge of the gate input as a trigger, the counter output is switched to “L” level by the next clock after the gate input trigger. This “L” level status is maintained during the set count value, and is switched back to “H” level when the terminal count is reached. Once counting has been started, there is no interruption until the terminal count is reached, even if the gate input is switched to “L” level in the meantime. And although counting continues even if a new count value is written during the counting, counting is started at the new count value if another trigger is applied by the gate input. • Mode 2 (rate generator) The counter output is switched to “H” level by the mode setting. When the gate input is at “H” level, counting is started by the next clock after the count value has been written. And if the gate input is at “L” level, counting is started by using the rising edge of the gate input as a trigger after the count value has been set. An “L” level output pulse appears at the counter output during a single clock duration once every n clock inputs where n is the set count value. If a new count value is written during while counting is in progress, counting is started at the new count value following output of the pulse currently being counted. And if the gate input is switched to “L” level during counting, the counter output is forced to switch to “H” level, the counting being restarted by the rising edge of the gate input. • Mode 3 (square waveform rate generator) The counter output is switched to “H” level by the mode setting. Counting is started in the same way as described for mode 2 above. The repeated square wave output appearing at the counter output contains half the number of counts as the set count value. If the set count value (n) is an odd number, the repeated square wave output consists of only (n+1)/2 clock inputs at “H” level and (n-1)/2 clock inputs at “L” level. If a new count value is written during counting, the new count value is reflected immediately after the change (“H” to “L” or “L” to “H”) in the next counter output to be executed. The counting operation at the gate input is done the same as in mode 2. 11/19 ¡ Semiconductor MSM82C53-2RS/GS/JS • Mode 4 (software trigger strobe) The counter output is switched to “H” level by the mode setting. Counting is started in the same way as described for mode 0. A single “L” pulse equivalent to one clock width is generated at the counter output when the terminal count is reached. This mode differs from 2 in that the “L” level output appears one clock earlier in mode 2, and that pulses are not repeated in mode 4. Counting is stopped when the gate input is switched to “L” level, and restarted from the set count value when switched back to “H” level. • Mode 5 (hardware trigger strobe) The counter output is switched to “H” level by the mode setting. Counting is started, and the gate input used, in the same way as in mode 1. The counter output is identical to the mode 4 output. The various roles of the gate input signals in the above modes are summarized in the following table. Gate Mode 0 1 2 3 4 5 (1) Counting not possible (2) Counter output forced to "H" level (1) Counting not possible (2) Counter output forced to "H" level Counting not possible (1) Start of counting (2) Retriggering "L" Level Falling Edge Counting not possible (1) Start of counting (2) Retriggering Start of counting Start of counting Counting possible Counting possible Counting possible Rising Edge "H" Level Counting possible 12/19 ¡ Semiconductor MSM82C53-2RS/GS/JS Mode 0 CLK WR OUT (n = 4) (GATE="H") 4 3 2 1 0 (n = 2) 2 1 0 WR (n = 4) GATE OUT 4 4 4 4 3 2 1 0 Mode 1 CLK WR (n = 4) GATE 4 3 2 1 0 OUT GATE 4 3 2 4 3 2 1 0 OUT (n = 4) Mode 2 CLK WR OUT GATE 4 3 2 1 4 4 3 2 1 (n = 4) 4 3 2 1 4 (n = 2) 3 2 1 2 1 2 (GATE="H") OUT (n = 4) Mode 3 CLK WR OUT GATE OUT (n = 5) (n = 4) 4 2 4 2 4 2 4 (n = 3) 2 3 2 3 3 (GATE="H") 5 4 2 5 2 5 4 2 5 2 5 4 Mode 4 CLK WR 4 3 2 1 0 OUT GATE OUT (GATE="H") 4 4 3 2 1 0 Mode 5 CLK GATE OUT GATE OUT (n = 4) (n = 4) 4 3 2 1 4 3 2 1 0 4 3 2 1 0 Note: "n" is the value set in the counter. Figures in these diagrams refer to counter values. 13/19 ¡ Semiconductor Reading of Counter Values MSM82C53-2RS/GS/JS All MSM82C53-2 counting is down-counting, the counting being in steps of 2 in mode 3. Counter values can be read during counting by (1) direct reading, and (2) counter latching (“read on the fly”). • Direct reading Counter values can be read by direct reading operations. Since the counter value read according to the timing of the RD and CLK signals is not guaranteed, it is necessary to stop the counting by a gate input signal, or to interrupt the clock input temporarily by an external circuit to ensure that the counter value is correctly read. • Counter latching In this method, the counter value is latched by writing counter latch command, thereby enabling a stable value to be read without effecting the counting in any way at all. An example of a counter latching program is given below. Counter latching executed for counter #1 (Read/Load 2-byte setting) MVI A 0 1 0 0 ¥¥¥¥ Dentotes counter latching OUT n3 Write in control word address (n3) The counter value at this point is latched. IN n1 Reading of the LSB of the counter value latched from counter #1 n1: Counter #1 address MOV B, A IN n1 MOV C, A Reading of MSB from counter #1 Example of Practical Application • MSM82C53-2 used as a 32-bit counter. MSM82C53-2 CLK0 OUT0 CLK1 OUT1 CLK2 OUT2 Use counter #1 and counter #2 Counter #1: mode 0, upper order 16-bit counter value Counter #2: mode 2, lower order 16-bit counter value This setting enables counting up to a maximum of 232. 14/19 ¡ Semiconductor MSM82C53-2RS/GS/JS NOTICE ON REPLACING LOW-SPEED DEVICES WITH HIGH-SPEED DEVICES The conventional low speed devices are replaced by high-speed devices as shown below. When you want to replace your low speed devices with high-speed devices, read the replacement notice given on the next pages. High-speed device (New) M80C85AH M80C86A-10 M80C88A-10 M82C84A-2 M81C55-5 M82C37B-5 M82C51A-2 M82C53-2 M82C55A-2 Low-speed device (Old) M80C85A/M80C85A-2 M80C86A/M80C86A-2 M80C88A/M80C88A-2 M82C84A/M82C84A-5 M81C55 M82C37A/M82C37A-5 M82C51A M82C53-5 M82C55A-5 Remarks 8bit MPU 16bit MPU 8bit MPU Clock generator RAM.I/O, timer DMA controller USART Timer PPI 15/19 ¡ Semiconductor Differences between MSM82C53-5 and MSM82C53-2 MSM82C53-2RS/GS/JS 1) Manufacturing Process These devices use a 3 m Si-Gate CMOS process technology and have the same chip size. 2) Function These devices have the same logics except for changes in AC characteristics listed in (3-2). 3) Electrical Characteristics 3-1) DC Characteristics Parameter Average Operating Current Symbol ICC MSM82C53-5 5 mA maximum (tCLK=200 ns) MSM82C53-2 8 mA maximum (tCLK=125 ns) As shown above, the characteristics of these devices are identical under the same test condition. The MSM82C53-2 satisfies the characteristics of the MSM82C53-5. 3-2) AC Characteristics Parameter Address Hold Time After Write Data Input Hold Time After Write Clock Cycle Time Symbol tWA tWD tCLK MSM82C53-5 30 ns minimum 30 ns minimum 200 ns minimum MSM82C53-2 20 ns minimum 20 ns minimum 125 ns minimum As shown above, the MSM82C53-2 satisfies the characteristics of the MSM82C53-5. 16/19 ¡ Semiconductor MSM82C53-2RS/GS/JS PACKAGE DIMENSIONS (Unit : mm) DIP24-P-600-2.54 Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 3.55 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 17/19 ¡ Semiconductor MSM82C53-2RS/GS/JS (Unit : mm) QFJ28-P-S450-1.27 Spherical surface Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin Cu alloy Solder plating 5 mm or more 1.00 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 18/19 ¡ Semiconductor MSM82C53-2RS/GS/JS (Unit : mm) SSOP32-P-430-1.00-K Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.60 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 19/19