MSM9831

E2D0097-19-94 ¡ Semiconductor MSM9831-xxx ¡ Semiconductor VOICE SYNTHESIS LSI with on-chip 384Kbit MASK ROM This version: Sep. 1999 MSM9831-xxx GENERAL DESCRIPTION MSM9831 is a PCM-based Voice Synthesis LSI (Playback only) with on-chip 384Kbit Mask ROM, D/A Converter and Low-Pass Filter. Serial input interface for an external MCU makes MSM9831 a better choice for size-critical applications with less wiring pin-count in small foot-print packaging. FEATURES • 8-bit OKI Non-Linear PCM Algorithm • Sampling Frequency (Selectable on each phrase) 4.0/5.3/6.4/8.0/10.6/12.8/16.0 kHz • On-chip Mask ROM Capacity : 384 Kbits • Maximum Playback Time Length 12.0 sec. at fsam = 4.0 kHz 6.0 sec. at fsam = 8.0 kHz 3.0 sec. at fsam = 16.0 kHz • Clock Oscillation 3.5 to 4.5 MHz (Ceramic Oscillation) 3.5 to 17 MHz (External Clock) • User definable Phrase Control Table function • Maximum number of Phrases : 31 phrases • 10-bit current-output-type D/A Converter • A built-in LPF • Power Supply Voltage : +2.0 to +5.5 V (External Clock) +2.5 to +5.5V (Ceramic Oscillation) • Package: 8-Pin SOP Package (SOP8-P-250-1.27-K) (Product name: MSM9831-xxx MA) COMPARISON TABLE WITH MSM9802 MSM9831 Mask ROM Capacity Interface Oscillation Max. Phrase Number Status Signal Output D/A Converter Current Flowing 384K Bit MCU (Serial) Ceramic/External Clock 31 None Forced into the circuit MSM9802 512K Bit MCU (Parallel)/Stand-alone Ceramic/CR 63 NAR/BUSY Forced out of the circuit 1/22 ¡ Semiconductor MSM9831-xxx PIN CONFIGURATION (TOP VIEW) ST 1 8 PDWN PI 2 7 XT GND 3 6 XT AOUT 4 5 VDD 8-pin Plastic SOP BLOCK DIAGRAM 16 384-Kbit ROM 8 ST PI PDWN Serial Interface 5 16-bit Address controller 8 2-Kbit ROM Phrase Control Table 2-Kbit ROM Phrase Addres Table Reset, Power Down Timing Controller PCM Synthesizer 10 10-bit DAC LPF 8 Test ROM 2-Kbit PCM data Area 378-Kbit XT XT OSC Circuit VDD GND AOUT 2/22 ¡ Semiconductor MSM9831-xxx PIN DESCRIPTIONS Pin 1 Symbol ST I/O I Playback starter pin. Phrase Address (number) is determined by the number of times of input to PI pin while ST being held "L". Playback starts on ST's rising edge with phrase address data loaded into the LSI. When no pulse input to PImade while ST being held "L", the LSI recognizes it as "Stop Code" to stop playback. 2 PI I Address input pin. The phrase number to playback is determined by the times of pulse pulse input to PI pin while ST being held "L". 32-time pulse input has the internal counter initialized. 3 4 GND AOUT — O GND pin. Analog output pin. Built with N-MOS open-drain type, wave-form output is made in the form of changing output current. While PDWN being held "H", AOUT maintains 1/2 level output, thus the current keeps on flowing. The Pop-Noise Canceller is put into works when standby is reset to return to be active, and when entering into standby mode. 5 6 VDD XT — I Power supply pin. Insert a 0.1mF or larger by-pass capacitor in-between GND pin and this pin. Wired to the ceramic oscillator when a ceramic oscillator is in use. Input the clock signal to this pin when the external clock is selected as the timing source. Using a ceramic oscillator or an external clock can be selected with OKI's Analizing and Editing Tool. 7 8 XT PDWN O I Wired to the ceramic oscillator when a ceramic oscillator is in use. When the external clock is in use, keep this pin open. The LSI remains in standby mode while this pin is being held "L". Description 3/22 ¡ Semiconductor MSM9831-xxx ABSOLUTE MAXIMUM RATINGS (GND=0V) Parameter Power Supply Voltage Input Voltage Storage Temperature Symbol VDD VIN TSTG Condition Ta = 25°C — Rating –0.3 to +7.0 –0.3 to VDD+0.3 –55 to +150 Unit V V °C RECOMMENDED OPERATING CONDITIONS (GND=0V) Parameter Symbol Condition With a Ceramic Osc. (Note) With the external clock fOSC=3.5 MHz to 4.5 MHz Power Supply Voltage VDD With the external clock fOSC=3.5 MHz to 14.5 MHz With the external clock fOSC=3.5 MHz to 17 MHz Min. With a Ceramic Osc. VDD=2.5 V to 5.5 V (Note) Master Clock Frequency fOSC With the external clock VDD=2.0 V to 5.5 V With the external clock VDD=2.7 V to 5.5 V With the external clock VDD=3.0 V to 5.5 V Operating Temperature Top — 3.5 3.5 3.5 3.5 Range 2.5 to 5.5 2.0 to 5.5 2.7 to 5.5 3.0 to 5.5 Typ. 4.096 4.096 — — –40 to +85 Max. 4.5 4.5 14.5 17 MHz MHz MHz MHz °C Unit V V V V Note: A crystal that is usable in this LSI is described in "Functional Description" of this document. If you want to use a different crystal, it is recommended to evaluate the crystal before using it. 4/22 ¡ Semiconductor MSM9831-xxx ELECTRICAL CHARACTERISTICS DC Characteristics (VDD=2.0 to 5.0 V, GND=0 V, fOSC=4.096 MHz, Ta=–40 to +85°C, unless otherwise specified) Parameter Symbol Condition fOSC=14.5 MHz or less (VDD=2.7 V to 5.5 V) "H" Input Voltage VIH fOSC=4.5 MHz or less fOSC>14.5 MHz (VDD=2.0 V to 5.5 V) (VDD=3.0 V to 5.5 V) Min. VDD ¥ 0.8 VDD ¥ 0.85 — — — –10 fOSC=4.096 MHz fOSC=4.096 MHz fOSC=4.096 MHz fOSC=16 MHz fOSC=16 MHz fOSC=16 MHz — — — — — — — — 0.4 3.8 0.4 Typ. — — — — — — 1.2 0.4 0.2 — — — — — — 6.0 1.0 Max. — — VDD ¥ 0.2 VDD ¥ 0.15 10 — 3.0 1.0 0.7 12.0 4.0 2.8 10 50 8.9 8.9 1.9 Unit V V V V mA mA mA mA mA mA mA mA mA mA mA mA mA fOSC=14.5 MHz or less (VDD=2.7 V to 5.5 V) "L" Input Voltage VIL fOSC=4.5 MHz or less fOSC>14.5 MHz "H" Input Current "L" Input Current IIH IIL (VDD=2.0 V to 5.5 V) (VDD=3.0 V to 5.5 V) VIH=VDD VIL=GND VDD=5.5 V Dynamic Supply Current AOUT output IDD current is excluded VDD=3.0 V VDD=2.0 V VDD=5.5 V VDD=3.0 V VDD=2.0 V Standby Supply Current AOUT Output Current IDS At maximum output current Ta=–40°C to +70°C Ta=–40°C to +85°C VDD=2.0 V to 5.5 V VDD=5.5 V VDD=2.0 V IAOUT 5/22 ¡ Semiconductor AC Characteristics MSM9831-xxx (Oscillation Frequency at fOSC=4.096 MHz, VDD=2.0 to 5.0 V, GND=0 V, Ta=–40 to +85°C) Parameter Master Clock duty cycle Time before RESET input after Power On PDWN hold time after RESET input DA Converter shifting time (Pop-Noise Canceller working time) PDWN-ST setup time ST-PI setup time PI pulse width PI cycle time ST-PI hold time ST-AOUT setup time Phrase stop time Silence in-between phrases Stop ST pulse width Phrase ST-Phrase ST pulse interval Phrase ST-Stop ST pulse interval Stop ST-Phrase ST pulse interval Sampling Freqnency *2 *2 *2 *3 *2 *2 *2 *1 Symbol fduty tRST tPDH tDAR, tDAF tPDSS tSPS tPW tPC tSPH tSAS tDPS tBLN tSSW tPP tPS tSP fSAM Condition — — — — — — — — — fSAM=8.0 kHz fSAM=8.0 kHz fSAM=8.0 kHz — fSAM=8.0 kHz fSAM=8.0 kHz fSAM=8.0 kHz — Min. 40 10 10 60 1 1 0.35 0.7 1 — — — 0.35 1050 1050 500 3.9 Typ. 50 — — 64 — — — — — — — — — — — — — Max. 60 — — 68 — — 2000 4000 — 1050 700 700 2000 — — — 28.0 Unit % ms ms ms ms ms ms ms ms ms ms ms ms ms ms ms kHz *1 Proportional to the period of oscillation frequency (fOSC). *2 Proportional to the period of sampling frequency (fSAM). *3 The sampling frequency (fSAM) is determined by the oscillation frequency (fOSC) and the frequency dividing ratio selected for each phrase. 6/22 ¡ Semiconductor MSM9831-xxx TIMING DIAGRAMS 1. Power-On VDD PDWN (I) tRST ST PI (I) (I) Reset Power Down tPDH Note: A level input in combination of PDWN="L", ST="L" and PI="H" resets the LSI. After Power-On, you need to do an initial reset as shown in the above chart. 2. Activating the LSI and Standby Mode PDWN (I) AOUT (O) 1 2 IAOUT tDAR tDAF 7/22 ¡ Semiconductor 3. Playback PDWN (I) MSM9831-xxx ST (I) PI (I) tSPH tSPS AOUT (O) tPDSS tPW tPC tSAS 4. Re-inputting the address while playback is going on ST (I) PI (I) AOUT (O) tDPS tPP Current phrase stops tBLN Next phrase starts 8/22 ¡ Semiconductor MSM9831-xxx 5. Stop Code Input ST (I) PI (I) tSSW AOUT (O) tDPS tPS Current phrase stops tSP 9/22 ¡ Semiconductor MSM9831-xxx FUNCTIONAL DESCRIPTION 1. Sampling Frequency Sampling Frequency can be selected and setup on each phrase address. 7 sampling frequencies are available for user's choice in preparing Voice Data File at the pre-production stage. Select sampling frequencies to satisfy fSAM=3.9 to 28.0 kHz obtained by frequency dividing ratios in Table 1.1. Table 1.1 Sampling Frequency Sampling Frequency (fOSC=4.096MHz) 4.0kHz 5.3kHz 6.4kHz 8.0kHz 10.6kHz 12.8kHz 16.0kHz Frequency diving ratio fOSC/1024 fOSC/768 fOSC/640 fOSC/512 fOSC/384 fOSC/320 fOSC/256 2. Recording/Playback Time Figure 2.1 below shows memory allocation of on-chip 384K bit Mask ROM. The Mask ROM is partitioned into 4 data areas: user's Area, Phrase Control Table Area, Phrase Control Area and Test Data Area. Actual memory space is the total Mask ROM capacity (384K bit) indicated in this document minus 6K bit. Phrase Control Table Area 2K bit Phrase Data Control Area Test Data Area 2K bit 2K bit User's Area 378K bit Figure 2.1 Memory Allocation of on-chip Mask ROM (384K bit) 10/22 ¡ Semiconductor MSM9831-xxx The playback time is obtained by dividing the memory capacity by the bit rate. The playback time for 8-bit PCM algorithm is obrained by using the following equation. Playback time [sec] = Memory capacity [bit] Bit rate [bps] = Memory capacity [bit] Sampling frequency [Hz] ¥ 8 [bit] For example, if all phrases are stored in the MSM9802 at 8 kHz sampling frequency, the maximum playback time is as follows. Playback time = (384–6) ¥ 1024 [bit] 8000 [Hz] ¥ 8 [bit] = 6.0 [sec] 3. Playback Method The MSM9831 uses OKI non-linear PCM algorithm. In the mid-range of waveform, OKI 8-bit non-linear PCM has precision equivalent to that of 10bit straight PCM. 4. Inserting Silence In addition to normal recorded sound phrases, the MSM9831 allows a user to play back or insert silence (silent phrase). User can set up time length of silence from a minimum of 32ms to a maximum of 996ms in 32ms step when fOSC=4.096 MHz. These time lengths are directly proportioned to the clock (fOSC) period. 11/22 ¡ Semiconductor 5. Phrase Control Table MSM9831-xxx Because the LSI contains the Phrase Control Table, it is possible to play back multiple phrases in succession by a single easy control operation like controlling a single regular phrase playback. Up to 8 combined phrases including a silence can be registered in a single address in the Phrase Control Table. Further, you can use the maximum memory space for data storage because it is not required to have the same phrase data. To show an example, let's assume that your application needs to speak two similar sentences, "It is fine today" and "It is rainy today." The two sentences have the common words "it", "is" and "today". What you have to do is to prepare these common sound data, not in sentences but in words, and to store each combined phrase data in Phrase Control Table as shown in Table 4.1 and Figure 4.1 Multiple phrases can be played continuously merely by specifying a desired phrase using an X address. For an example from Table 4.1, when address "01" is specified, "It is fine today" is played, and when address"02" is specified, "It is rainy" is played. Phrase Control Table, a silence can be inserted without using the User's Area. Minimum time for silence Maximum time for silence Time unit for setting up silence 32 ms 992 ms 32 ms Table 4.1 Matrix of the Phrase Control Table No. 1 2 3 ··· X-Address (HEX) 01 02 03 ··· Y-Address (Up to 8 phrases) [01] [02] Silence [04] [03] [01] [02] Silence [05] [03] Sound Data It is (silence) fine today. It is (silence) rainy today. ··· [01] [02] [04] [09] [06] [05] [0A] [03] It is fine becoming cloudy, rainy in some areas today. 30 31 1E 1F 12/22 ¡ Semiconductor MSM9831-xxx Figure 4.1 Phrase Combination Matrix for Phrase Control Table Phrase Control Table Area No. X-Address 1 2 3 4 5 6 7 8 9 01 02 03 04 05 06 07 08 09 Setting of silence time ······· ······· Phrase Data Registration Area No. Y-Address 1 2 3 4 5 6 7 8 9 10 ············· Phrase Addigned 1 2 3 4 5 6 7 8 [01] [02] [05] [03] — — — it is rainy today Phrase it is today fine rainy cloudy snowy occasionally becoming in some areas ············· 01 02 03 04 05 06 07 08 09 0A ············· Silence (64ms) length (32ms¥n) n 1 2 ··· Silence time length 32 ms 64 ms 992 ms ··· 31 1F 31 31 1F — The silence time lengths are directly proportional to the clock (fOSC) period. 13/22 ¡ Semiconductor VDD PDWN (I) Phrase 01 Selected Phrase 02 Selected Phrase 03 Selected Phrase 01 Selected Stop Code ST (I) PI (I) AOUT (O) It is fine today Playback Phrase 01 Reset Power Down Enter into Stand-by mode Current phrase stops Playback stops It is rainy today Playback Phrase 02 It is fine becoming cloudy, rainy in some areas today. It is fine today Playback Phrase 03 Playback Phrase 01 Power Down Enter into Stand-by mode Figure 5.2 Playback timing when using phrase control data MSM9831-xxx 14/22 ¡ Semiconductor 6. Oscillation, Clock Signal Input 6-1 Using a Ceramic Oscillator Figure 6.1 shows an oscillation circuit diagram using a Ceramic Oscillator. (Select Use a Ceramic Oscillator option on selecting options) MSM9831-xxx MSM9831 XT XT XT MSM9831 XT C1 C2 External capacitor type Internal capacitor type Figure 6.1 Oscillation Circuit with an external ceramic oscillator The optimal load capacities when connecting ceramic oscillators from MURATA MFG., KYOCERA CORPORATION, and TDK CORPORATION are shown below for reference. Optimal load capacity Freq (MHz) C1 (pF) C2 (pF) 4.0 30 Built in 30 Built in 30 Built in 30 Built in 4.0 33 Built in 4.0 33 Built in 33 Built in 33 30 Built in 30 Built in 30 Built in 30 Built in 33 Built in 33 Built in 33 Built in 33 2.6 to 5.5 2.5 to 5.5 2.5 to 5.5 2.5 to 5.5 –20 to +80 –40 to +85 2.7 to 5.5 Operating Temperature Rnage (°C) –40 to +85 Ceramic oscillator Maker MURATA MFG. Type CSA4.00MG CSA4.00MGW CSAC4.00MGC CSTCC4.00MG CSA4.00MGU CST4.00MGWU CSAC4.00MGCU CSTCC4.00MGU TDK CORPORATION KYOCERA CORPORATION FCR4.0M5 FCR4.0MC5 CCR4.0MC3 KBR-4.0MSA KBR-4.0MSB KBR-4.0MKC KBR-4.0MKD KBR-4.0MKS PBRC4.00A PBRC4.00B Supply Voltage Range (V) 3.0 to 5.5 15/22 ¡ Semiconductor 6-2 Using External Clock Input Figure 6.2 shows an oscillation circuit diagram using an external clock input. MSM9831-xxx XT XT Open External Clock, etc. as the timing source Figure 6.2 Oscillation Circuit using an external clock input 16/22 ¡ Semiconductor MSM9831-xxx 7. Low-Pass Filter In this IC, all voice outputs are through the built-in low-pass filter (LPF). Figure 7.1 and Table 7.1 show the LPF frequency characteristics and LPF cutoff frequency respectively. The frequency characteristics and cutoff frequencies are directly proportional to sampling frequencies. Only the voice output through LPF in this IC is enabled. [dB] 20 10 0 –10 –20 –30 –40 –50 –60 –70 –80 10 100 1k 10k [Hz] Figure 7.1 LPF Frequency Characteristics (fSAM=8 kHz) Table 7.1 LPF Cutoff Frequency Sampling Frequency (kHz) (fSAM) 4.0 5.3 6.4 8.0 10.6 12.8 16.0 Cutoff Frequency (kHz) (fCUT) 1.2 1.6 2.0 2.5 3.2 4.0 5.0 17/22 ¡ Semiconductor Connecting the MSM9831 to Speaker Driving Amplifier MSM9831-xxx The MSM9831 uses a current output type D/A converter. When the MSM9831 is connected to a voltage input type amplifier, it is required to convert the voice signal that is output as "change of current" into the voice signal that is output as "change of voltage". The connection between the MSM9831 and MSC1157 (OKI speaker driving amplifier) when a resistor is used for the above conversion is described below. Circuit connection example 1: When VDD=5.0V and the amplitude of Ain of the MSC1157 is 2.5VP-P +5V +5V 0.1mF 0.1mF 47nF VCC Ain SP SP VDD P1.2 P1.1 P1.0 ST PI AOUT 500W 10mF + – + – XT XT 4.096MHz STBY MSC1157 VR PDWN MSM9831 MCU GND SEL GND (Ceramic oscillation is selected) Circuit connection example 2: When VDD=3.0V and the amplitude of Ain of the MSC1157 is 1.5VP-P +3V 0.1mF +3V 0.1mF 10mF + – – GND SEL GND 4.7mF + + – 620W VDD P1.2 P1.1 P1.0 ST PI AOUT 47nF Ain VCC SP SP CLK XT XT STBY MSC1157 PDWN MSM9831 MCU VR (External clock input is selected) 4.7mF + – 18/22 ¡ Semiconductor MSM9831-xxx Use a resistor with an appropriate value (RL) considering the output voltage (reference the drawing below). Relationship between AOUT pin voltage and AOUT output current at VDD=5V 6 5 IAOUT (mA) 4 3 2 1 0 0 1 2 VAOUT (V) Power down RL=500W RL=200W Maximum output current Output current at waveform center RL=5kW 3 4 5 Shift to standby (1) Normal voice waveform is obtained Shift to standby (2) Voice waveform is distorted and pop noises Playback Standby Time Power down Power down are generated when RL=5kW Playback Standby Time when RL=200W Power down 19/22 * When RL is too high ¡ Semiconductor MSM9831-xxx D/A CONVERTER OUTPUT CURRENT Relationship between supply voltage and AOUT output current (Ta=25°C, VAOUT=VDD, PCM at maximum) 6 AOUT outptu current (mA) 5 4 3 2 1 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Supply voltege (V) Relationship between ambient temperature and AOUT output current (VAOUT=VDD, PCM at maximum) 6 AOUT outptu current (mA) 5 4 3 2 1 0 –40 –20 0 20 40 60 VDD=5V VDD=3V 80 100 Ambient temperature (°C) Relationship between AOUT pin voltage and AOUT output current (Ta=25°C, VDD=5.0V, PCM at maximum) 6 AOUT outptu current (mA) 5 4 3 2 1 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 AOUT pin voltage (V) 20/22 ¡ Semiconductor MSM9831-xxx NOTES 1. Internal converter circuit The MSM9831 has not employed a voltage output type D/A converter but a current output type D/A converter. Therefore, the voice output circuit of the MSM9831 is different from that of the MSM6650 family product which has employed a voltage output type D/A converter. The voice output circuit of the MSM9831 also is different from that of the MSM9800 family product because the MSM9831 has employed a current flowing-in type D/A converter and the MSM9800 family product has employed a current flowing-out type D/A converter. (See the table below) Product name MSM6650 family MSM9800 family MSM9831 D/A converter circuit type Voltage output type Current output (flowing-out) type Current output (flowing-in) type D/A converter output circuit — P-MOS open drain N-MOS open drain Circuit connection between the MSM9831 and amplifier IC Resistor for conversion from current to voltage VDD MSM9831 AOUT D/A converter AMP GND Current flowing direction Circuit connection between the MSM9800 family product and amplifier IC Current flowing direction VDD D/A converter AOUT AMP MSM9800 family GND Resistor for conversion from current to voltage 2. Ceramic oscillator A crystal that is usable in this LSI is described in "Functional Description" of this document. If you want to use another crystal, it is recommended to evaluate the crystal before using it. 21/22 ¡ Semiconductor MSM9831-xxx PACKAGE DIMENSIONS (Unit : mm) SOP8-P-250-1.27-K Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.10 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 22/22 E2Y0002-29-62 NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party’s right which may result from the use thereof. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. No part of the contents contained herein may be reprinted or reproduced without our prior permission. MS-DOS is a registered trademark of Microsoft Corporation. 2. 3. 4. 5. 6. 7. 8. 9. Copyright 1999 Oki Electric Industry Co., Ltd. Printed in Japan