EE-SX1330

Photomicrosensor (Transmissive) EE-SX1330 Ultra-Compact Slot / SMD Type (Slot width: 3 mm) • PCB surface mounting type. • High resolution with a 0.3-mm-wide aperture. Be sure to read Safety Precautions on page 3. Ordering Information Photomicrosensor Sensing method Appearance 5 4 Connecting method Transmissive (slot type) SMT Sensing distance Aperture size (H × W) (mm) Output type Emitter 1.4 × 1.4 3 mm (slot width) Phototransistor Detector 1 × 0.3 6 Model EE-SX1330 Ratings, Characteristics and Exterior Specifications Absolute Maximum Ratings (Ta = 25°C) Item Symbol Rated value Electrical and Optical Characteristics (Ta = 25°C) Unit Item Emitter Value Symbol MIN. TYP. MAX. Unit Condition Emitter Forward current IF 25 *1 mA Pulse forward current IFP 100 *2 mA Forward voltage VF --- 1.1 1.3 V IF = 5 mA Reverse voltage VR 5 V Reverse current IR --- --- 10 μA VR = 5 V Peak emission wavelength λP --- 940 --- nm IF = 20 mA Detector Collector-Emitter voltage VCEO 12 V Emitter-Collector voltage VECO 5 V Light current IL 100 --- 1,000 μA IF = 5 mA, VCE = 5 V Collector current IC 20 mA Dark current ID --- 10 100 nA VCE = 10 V, 0 lx VCE (sat) --- 0.1 0.4 V IF = 20 mA, IL = 100 μA λP --- 900 --- nm VCE = 5 V Rising time tr --- 19 --- μs VCC = 5 V, RL = 100 Ω, IL = 500 μA Falling time tf --- 26 --- μs VCC = 5 V, RL = 100 Ω, IL = 500 μA PC 75 *1 mW Operating temperature Topr -30 to +85 *1 °C Storage temperature Tstg -40 to +90 *1 °C Reflow soldering temperature Tsol 255 *3 °C Collector dissipation *1. Refer to the temperature rating chart if the ambient temperature exceeds 25°C. *2. Duty ratio: 1%, Pulse width: 0.1 ms *3. Complete soldering within 10 seconds for reflow soldering. Exterior Specifications Connecting method SMT Weight (g) 0.2 Material Case PPS Detector Collector-Emitter saturated voltage Peak spectral sensitivity wavelength Note: Refer to the following timing diagram for tr and tf. IL Input Vcc Input 0 t Output RL 90% Output 0 10% t tr tf 1 EE-SX1330 Engineering Data (Reference value) Fig 1. Forward Current vs. Collector Dissipation Temperature Rating Fig 2. Forward Current vs. Forward Voltage Characteristics (Typical) 120 60 Fig 3. Light Current vs. Forward Current Characteristics (Typical) 60 3,500 Ta = 25°C VCE = 5 V Ta = 25°C IF 40 20 0 -40 -20 0 20 40 60 Ambient temperature Ta (ºC) 80 20 1,500 500 0 0 0.2 0.4 0.6 0.8 1 1.2 Forward voltage VF (V) 1.4 1.6 1.8 Fig 5. Relative Light Current vs. Ambient Temperature Characteristics (Typical) 0 1,000 IF = 10 mA 40 50 0lx 110 Dark current ID (nA) Relative light current IL (%) 1,500 20 30 Forward current IF (mA) 1,000 IF = 5 mA VCE = 5 V Ta = 25ºC 2,000 10 Fig 6. Dark Current vs. Ambient Temperature Characteristics (Typical) 120 2,500 Light current IL (µA) 2,000 1,000 0 0 100 Fig 4. Light Current vs. CollectorEmitter Voltage Characteristics (Typical) 30 10 20 10 2,500 40 Light current IL (µA) 60 30 Forward current IF (mA) 80 PC Collector dissipation PC (mW) Forward current IF (mA) 40 3,000 50 100 50 100 90 100 VCE = 10 V 10 VCE = 2 V 80 1 500 2 4 6 8 10 12 Collector-Emitter voltage VCE (V) 70 60 −40 14 Fig 7. Response Time vs. Load Resistance Characteristics (Typical) 0 20 40 60 Ambient temperature Ta (°C) 80 120 IF = 5 mA VCE = 5 V Ta = 25ºC Relative light current IL (%) 100 1,000 tf 100 80 d 60 40 20 100 (Center of optical axis) d 80 60 40 20 0 1 10 Load resistance RL (kΩ) IF = 5 mA VCE = 5 V Ta = 25ºC 100 (Center of optical axis) 10 tr 0 10 20 30 40 50 60 70 80 90 Ambient temperature Ta (ºC) Fig 9. Sensing Position Characteristics (Typical) 120 VCC = 5 V IL = 0.5 mA Ta = 25°C 1 0.1 0.1 −30 −20 −10 100 Fig 8. Sensing Position Characteristics (Typical) 10,000 Response time tr, tf (μs) −20 Relative light current IL (%) 0 0 IF = 5 mA -0.6 -0.4 -0.2 0 0.2 Distance d (mm) 0.4 0.6 0 -1.2 -0.9 -0.6 -0.3 0 0.3 0.6 Distance d (mm) 0.9 1.2 2 EE-SX1330 Safety Precautions To ensure safe operation, be sure to read and follow the Instruction Manual provided with the Sensor. Precautions for Correct Use Do not use the product in atmospheres or environments that exceed product ratings. This product is for surface mounting. Refer to Soldering Information, Storage and Baking for details. Dispose of this product as industrial waste. CAUTION This product is not designed or rated for ensuring safety of persons either directly or indirectly. Do not use it for such purposes. Precautions for Safe Use Do not use the product with a voltage or current that exceeds the rated range. Applying a voltage or current that is higher than the rated range may result in explosion or fire. Do not miswire such as the polarity of the power supply voltage. Otherwise the product may be damaged or it may burn. This product does not resist water. Do not use the product in places where water or oil may be sprayed onto the product. Dimensions and Internal Circuit (Unit: mm) Photomicrosensor EE-SX1330 (6 0. 2) Ejector pin, gate mark, or flat surface 2.0 mm dia. or 0.5 mm recess (MAX) (1) Detector side (4) 4 Emitter side xC (2) (3) 6 Terminals are exposed in the end face of the board Terminals are exposed in the end face of the board (0.4) (0.4) A B 1.6 1.6 2.2 Cross section view A-A (Detector side) (1) (4) (2) (3) 0.6 1.6 Internal circuit 1.6 1×0.3 1.6 2.2 Aperture size (H x W) Detector 1 R0.3 1 1.6 Cross section view B-B (Emitter side) 1.4×1.4 1 5 1.4 3.5 1 1 0.3 ±0.15 A B Optical axis R0.3 Emitter Marking (upper: model, lower: lot No.) 1.5 1 1.4 3 ±0.2 Terminal No. 2 4 2 Name (1) Anode (2) Cathode (3) Emitter (4) Collector Unless otherwise specified, the tolerances are ±0.2 mm. 3 EE-SX1330 Tape and Reel Reel (Unit: mm) * 21±0.8 dia. 2±0.5 13±0.2 dia. 80±1dia. 330±2 dia. Product name PHOTO MICROSENSOR Lot number Quantity Country of origin W1 = 13.5±1 W2 = 17.5±1 W1 W2 Tape (Unit: mm) 1.5 dia. E K C A Tape Pull-out direction Note: Direction of product packing is upper figure. Tape quantity 1,000 pcs./reel 100 pcs./pack * * EE-SX1330-1 (100 pcs./pack) has no reel, only tape is attached. 4 EE-SX1330 Soldering Information Reflow soldering: Temperature profile Manual soldering 1. The reflow soldering can be implemented in two times complying with the following diagram. All the temperatures in the product must be within the diagram. 2. The recommended thickness of the metal mask for screen printing is between 0.2 and 0.25 mm. The manual soldering should not be applied to the products, otherwise the housing may be deformed and/or the Au plating may be peeled off by heat. 260°C max. 255°C Temperature (°C) 1 to 4°C/s 230°C 10 sec max. 150 to 180°C max. 1 to 4°C/sec 40 sec max. 1 to 4°C/s 120 sec max. Other notes The use of infrared lamp causes the temperature at the resin to rise particularly too high. All the temperatures in the product must be within the above diagram. Do not immerse the resin part into the solder. Even if within the above temperature diagram, there is a possibility that the gold wire in the products is broken in case that the deformation of PC board gives stress to the products. Please confirm the conditions (including material and method of flux and cleaning) of the reflow soldering fully by actual solder reflow machine prior to the mass production use. Time (s) Storage Storage conditions Treatment after open To protect the product from the effects of humidity until the package is opened, dry-box storage is recommended. If this is not possible, store the product under the following conditions: Temperature: 10 to 30 °C Humidity: 60% RH max. 1. Reflow soldering must be done within 48 hours stored at the conditions of humidity 60% RH or less and temperature 10 to 30°C. 2. If the product must be stored after it is unpacked, store it in a dry box or reseal it in a moisture-proof package with desiccant at a temperature of 10 to 30°C and a humidity of 60% RH or less. Even then, mount the product within one week. Baking In case that it could not carry out the above treatment, it is able to mount by the following baking treatment. However baking treatment shall be limited only 1 time. Recommended conditions: 60°C for 24 to 48 hours (reeled one) 100°C for 8 to 24 hours (loose one) 5 • Application examples provided in this document are for reference only. In actual applications, confirm equipment functions and safety before using the product. • Consult your OMRON representative before using the product under conditions which are not described in the manual or applying the product to nuclear control systems, railroad systems, aviation systems, vehicles, combustion systems, medical equipment, amusement machines, safety equipment, and other systems or equipment that may have a serious influence on lives and property if used improperly. Make sure that the ratings and performance characteristics of the product provide a margin of safety for the system or equipment, and be sure to provide the system or equipment with double safety mechanisms. Note: Do not use this document to operate the Unit. OMRON Corporation Electronic and Mechanical Components Company Contact: www.omron.com/ecb Cat. No. E456-E1-05 0417(0816)(O) Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Omron: EE-SX1330