EE-SX1350

Photomicrosensor (Transmissive) EE-SX1350 Compact Slot / SMD Type (Slot width: 5 mm) • Unique 5 mm Slot width. • PCB surface mounting type. • High resolution with a 0.5-mm-wide aperture. Be sure to read Safety Precautions on page 3. Ordering Information Photomicrosensor Sensing method Connecting method Transmissive (slot type) SMT Appearance 9 4 9 Sensing distance 5 mm (slot width) Aperture size (H  W) (mm) Output type Model Emitter 1.4  1.4 Detector 1.4  0.5 Phototransistor EE-SX1350 Ratings, Characteristics and Exterior Specifications Absolute Maximum Ratings (Ta = 25°C) Item Symbol Rated value Unit Electrical and Optical Characteristics (Ta = 25°C) Remarks Item Forward current 30 IF mA --- *1 Pulse forward current IFP 100 mA Duty ratio: 1% Puls width: 0.1 ms Reverse voltage VR 4 V --- Value Symbol Emitter Unit MIN. TYP. MAX. Emitter Forward voltage VF --- 1.2 1.5 V IF = 30 mA Reverse current IR --- 0.01 10 A VR = 4 V Peak emission wavelength P --- 940 --- nm IF = 20 mA Light current IL 0.4 --- 4 mA IF = 20 mA, VCE = 10 V Dark current ID --- 10 200 nA VCE = 10 V, 0 lx VCE (sat) --- 0.1 0.4 V IF = 20 mA, IL = 0.1 mA P --- 900 --- nm VCE = 5 V Rising time tr --- 11 --- s VCC = 5 V, RL = 100  IL = 1 mA * Falling time tf --- 14 --- s VCC = 5 V, RL = 100  IL = 1 mA * Detector Detector CollectorEmitter voltage Condition 12 VCEO V --- EmitterCollector voltage VECO 5 V --- Collector current IC 20 mA --- Collector dissipation PC 50 mW --- *1 Topr -30 to 85 °C --- *1 Operating temperature Storage temperature Tstg -40 to 100 °C --- *1 Reflow soldering temperature Tsol 255 °C 10 sec. max. *2 *1. Continuous Forward Current and Collector Power Dissipation must be derated complying. The product should be used without freezing or condensation. *2. In case of reflow soldering, conditions which are shown at the temperature profile should be kept. Peak spectral sensitivity wavelength * Refer to the following timing diagram for tr and tf. Input Input 0 Material IL VCC t 90% 10% Output 0 Exterior Specifications Connecting method CollectorEmitter saturated voltage tr Output t tf RL Weight (g) Case SMT 0.3 PPS 1 EE-SX1350 Engineering Data (Reference value) Fig 1. Forward Current vs. Collector Dissipation Temperature Rating Fig 2. Forward Current vs. Forward Voltage Characteristics (Typical) 60 60 50 50 50 40 40 60 Fig 3. Light Current vs. Forward Current Characteristics (Typical) 4 Ta = 25ºC VCE = 5 V 3.5 20 20 10 10 40 3 Ta = 25ºC Light current IL (mA) 30 Ta =30ºC Forward current IF (mA) IF 30 Collector dissipation PC (mW) Forward current IF (mA) PC Ta= 85ºC 30 20 2.5 2 1.5 1 10 0.5 0 -40 -20 0 20 40 60 Ambient temperature Ta (ºC) 0 0 100 80 0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 Fig 4. Light Current vs. CollectorEmitter Voltage Characteristics (Typical) 10 20 30 Forward current IF (mA) 40 50 Fig 5. Relative Light Current vs. Ambient Fig 6. Dark Current vs. Ambient Temperature Characteristics (Typical) Temperature Characteristics (Typical) 1000 120 4 VCE = 10 V 0lx IF = 20 mA VCE = 5 V Ta = 25ºC 110 IF = 50 mA 2.5 IF = 40 mA 2 IF = 30 mA 1.5 IF = 20 mA 100 100 Dark current ID (nA) 3 Relative light current IL (%) 3.5 Light current IL (mA) 0 Forward voltage VF (V) 90 80 10 1 1 70 IF = 10 mA 0.5 IF = 5 mA 0.1 -30 -20 -10 60 0 -40 0 1 2 3 4 5 6 7 8 Collector-Emitter voltage VCE (V) 9 -20 10 Fig 7. Response Time vs. Load Resistance Characteristics (Typical) 0 20 40 60 80 100 Ambient temperature Ta (ºC) 0 10 20 30 40 50 60 70 80 90 Ambient temperature Ta (ºC) Fig 8. Sensing Position Characteristics Fig 9. Sensing Position Characteristics (Typical) (Typical) 10,000 VCC = 5 V IL =1 mA Ta = 25ºC 120% 120% 100% 100% 100 tf 10 tr 1 0.01 0.1 1 Load resistance RL (kΩ) Relative light current IL (%) Relative light current IL (%) Response time tr, tf (μs) 1,000 80% 60% IF = 20 mA VCE = 5 V Ta = 25ºC (Center of optical axis) 40% 20% 10 0% -1 80% 60% IF = 20 mA VCE = 5 V Ta = 25ºC 40% (Center of optical axis) 20% 0% -0.75 -0.5 -0.25 0 0.25 Distance d (mm) 0.5 0.75 1 -2 -1.5 -1 -0.5 0 0.5 Distance d (mm) 1 1.5 2 2 EE-SX1350 Safety Precautions To ensure safe operation, be sure to read and follow the Instruction Manual provided with the Sensor. CAUTION Precautions for Correct Use Do not use the product in atmospheres or environments that exceed product ratings. This product is for surface mounting. Refer to Soldering Information, Storage and Baking for details. Dispose of this product as industrial waste. This product is not designed or rated for ensuring safety of persons either directly or indirectly. Do not use it for such purposes. Precautions for Safe Use Do not use the product with a voltage or current that exceeds the rated range. Applying a voltage or current that is higher than the rated range may result in explosion or fire. Do not miswire such as the polarity of the power supply voltage. Otherwise the product may be damaged or it may burn. This product does not resist water. Do not use the product in places where water or oil may be sprayed onto the product. Dimensions and Internal Circuit (Unit: mm) Photomicrosensor Ejector pin, gate mark, or flat surface 2.0 mm dia. or 0.5 mm recess (MAX) (1) (2) (3) (6) (5) (4) 4 (6 xC 0. 2) EE-SX1350 9 Marking (upper: model, lower: lot No.) 1.4  0.5 A B 0.5 ±0.15 7 Detector Terminals are exposed in the end face of the board 2 9 Emitter 1.5 1.4 1.5 1.4 Aperture size (H x W) 1.4  1.4 5 ±0.2 Optical axis 1.5 1.4 Terminals are exposed in the end face of the board R0.3 1 1 1 (0.4) A B 1 Cross section view B-B 1 R0.3 (0.4) 1 Cross section view A-A 1 1 2.8 0.4 2.8 1 Internal circuit 1 Top view (6) (2) (5) (3) (4) Terminal No. 2 7 2 0.4 1 (1) Name (1) Anode (2) Not connected. (3) Cathode (4) Collector (5) Not connected. (6) Emitter Unless otherwise specified, the tolerances are ±0.2 mm. 3 EE-SX1350 Tape and Reel Reel (Unit: mm) * 21±0.8 dia. 2±0.5 13±0.2 dia. 80±1dia. 330±2 dia. Product name PHOTO MICROSENSOR Lot number Quantity Country of origin W1 = 17.5±1 W2 = 21.5±1 W1 W2 Tape (Unit: mm) 16 1.5 dia. 1.75 2 0.4 16 (4.3) 7.5 4 (9.3) (9.1) C K E A Tape Pull-out direction Note: Direction of product packing is upper figure. Tape quantity 400 pcs./reel 50 pcs./pack * * EE-SX1350-1 (50 pcs./pack) has no reel, only tape is attached. 4 EE-SX1350 Soldering Information Reflow soldering : Temperature profile Manual soldering 1. The reflow soldering can be implemented in two times complying with the following diagram. All the temperatures in the product must be within the diagram. 2. The recommended thickness of the metal mask for screen printing is between 0.2 and 0.25 mm. The manual soldering should not be applied to the products, otherwise the housing may be deformed and/or the Au plating may be peeled off by heat. 260°C max. 255°C Temperature (°C) 1 to 4°C/s 230°C 10 sec max. 150 to 180°C max. 1 to 4°C/sec 40 sec max. 1 to 4°C/s 120 sec max. Other notes The use of infrared lamp causes the temperature at the resin to rise particularly too high. All the temperatures in the product must be within the above diagram. Do not immerse the resin part into the solder. Even if within the above temperature diagram, there is a possibility that the gold wire in the products is broken in case that the deformation of PC board gives stress to the products. Please confirm the conditions (including material and method of flux and cleaning) of the reflow soldering fully by actual solder reflow machine prior to the mass production use. Time (s) Storage Storage conditions Treatment after open To protect the product from the effects of humidity until the package is opened, dry-box storage is recommended. If this is not possible, store the product under the following conditions: Temperature: 10 to 30 °C Humidity: 60% RH max. 1. Reflow soldering must be done within 48 hours stored at the conditions of humidity 60% RH or less and temperature 10 to 30°C. 2. If the product must be stored after it is unpacked, store it in a dry box or reseal it in a moisture-proof package with desiccant at a temperature of 10 to 30°C and a humidity of 60% RH or less. Even then, mount the product within one week. Baking In case that it could not carry out the above treatment, it is able to mount by the following baking treatment. However baking treatment shall be limited only 1 time. Recommended conditions: 60°C for 24 to 48 hours (reeled one) 100°C for 8 to 24 hours (loose one) 5 • Application examples provided in this document are for reference only. In actual applications, confirm equipment functions and safety before using the product. • Consult your OMRON representative before using the product under conditions which are not described in the manual or applying the product to nuclear control systems, railroad systems, aviation systems, vehicles, combustion systems, medical equipment, amusement machines, safety equipment, and other systems or equipment that may have a serious influence on lives and property if used improperly. Make sure that the ratings and performance characteristics of the product provide a margin of safety for the system or equipment, and be sure to provide the system or equipment with double safety mechanisms. Note: Do not use this document to operate the Unit. OMRON Corporation Electronic and Mechanical Components Company Contact: www.omron.com/ecb Cat. No. E457-E1-05 0417(0816)(O)