R
0.5 mm-Pitch Vertical FPC Connector
XF2G
SMT Non-ZIF (Zero Insertion Force)
Connector Offers a Low-Cost, Top
Entry Alternative to Locking Types
H Enlarged top surface area makes
automatic assembly easier
H Low-profile, measures only 4.15 mm
above the circuit board
H Hold down terminal improves
connection stability during soldering
H Connectors supplied on tape reels for
automatic insertion
Ordering Information
Circuits
Part number
Quantity per reel
6
XF2G-0614-11
1,000
,
per
p reel
14
XF2G-1414-11
Order in multiples of the quantity per reel.
16
XF2G-1614-11
Note: Connectors with different circuit counts and contact locations are available on special order. Contact your Omron representative.
Specifications
Rated current
0.5 A
Rated voltage
50 VDC
Contact resistance
30 MΩ max. at 20 mVDC, 100 mA max.
Insulation resistance
100 MΩ min. at 250 VDC
Withstand voltage
250 VAC for 1 minute (with a leakage current of 1 mA max.)
Insertion tolerance
10 times
Ambient temperature
--30°C to 85°C (--22°F to 185°F); no condensation at low temperatures
J MATERIALS/FINISH
Housing
PA46 resin (UL94V-0)/natural
Contact
Copper-alloy/nickel spring substrate (2 µm) plated with tin alloy (2 µm)
XF2G
XF2G
Dimensions
Unit: mm
J XF2G-j
jj14-11
A
B
Printed Circuit Board Matching
Dimensions (Top View)
0.5
0.5¦0.05
1.6
C
4
2.95
2.4
1.6
0.5¦0.05
C¦0.05
4.15
Applicable FPC Dimensions
3.4
0.2
0.3
0.5¦0.1
B¦0.07
C¦0.05
0.5¦0.03
0.35¦0.03
2.8
5.0 min.
T=0.3±0.05
(Copper conductors)
J TABLE OF DIMENSIONS
Circuits
Part number
A
B
C
6
XF2G-0614-11
4.9 (0.193)
3.5 (0.380)
2.5 (0.098)
14
XF2G-1414-11
8.9 (0.350)
7.5 (0.295)
6.5 (0.256)
16
XF2G-1614-11
9.9 (0.390)
8.5 (0.335)
7.5 (0.295)
2
XF2G
XF2G
J TAPE AND REEL DIMENSIONS
A
B
3 (0.118)
+0.1
4±0.1
(0.157)
1.5 0
(0.055)
dia.
2 (0.079)
Direction of
drawout
330
(12.99)
dia.
11.5±0.1 E
(0.453)
C D
E
Direction of
drawout
4.4±0.1
(0.173)
Part number
6
XF2G-0614-11
14
XF2G-1414-11
16
XF2G-1614-11
B
12±0.1
(0.472)
80 (3.15) dia.
Circuits
1.75±0.1
(0.069)
A
+2
0
(0.646)
+2
0
(0 961)
(0.961)
16.4
24 4
24.4
1.3 (0.051)
1.36 (0.054)
3.5 (0.138)
2.6 (0.102)
B
C
D
E
22.4 (0.882)
5.0 (0.197)
3.1 (0.122)
16±0.3 (0.630)
30.4 (1.197)
(
)
9.0 (0.354)
7.1 (0.280)
24±0.3 ((0.945))
10.0 (0.394)
8.1 (0.319)
Precautions
J RECOMMENDED REFLOW CONDITIONS
J STORAGE
Pre-heat
Temperature: 150±10°C
Time:
60 to 120 seconds
Do not store under high humidity levels as this may cause
deterioration of the insulation.
Soldering
Temperature: 200 to 240°C
Time:
Not exceeding 30 seconds
(Not exceeding 10 seconds at 240°C
maximum temperature.)
J HANDLING THE FPC
Do not forcibly bend or pull an FPC which has been mounted and
locked. This may cause discontinuities in the FPC.
3
XF2G
XF2G
NOTE: DIMENSIONS SHOWN ARE IN MILLIMETERS. To convert millimeters to inches divide by 25.4.
R
OMRON ELECTRONICS LLC
OMRON ON-LINE
OMRON CANADA, INC.
1-800-55-OMRON
Global -- http://www.omron.com
USA -- http://www.omron.com/oei
Canada -- http://www.omron.com/oci
416-286-6465
One East Commerce Drive
Schaumburg, IL 60173
Cat. No. G011G-E3-1
05/01/2.5M
Specifications subject to change without notice.
885 Milner Avenue
Scarborough, Ontario M1B 5V8
Printed in U.S.A.
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