XF2G-0614-11

R 0.5 mm-Pitch Vertical FPC Connector XF2G SMT Non-ZIF (Zero Insertion Force) Connector Offers a Low-Cost, Top Entry Alternative to Locking Types H Enlarged top surface area makes automatic assembly easier H Low-profile, measures only 4.15 mm above the circuit board H Hold down terminal improves connection stability during soldering H Connectors supplied on tape reels for automatic insertion Ordering Information Circuits Part number Quantity per reel 6 XF2G-0614-11 1,000 , per p reel 14 XF2G-1414-11 Order in multiples of the quantity per reel. 16 XF2G-1614-11 Note: Connectors with different circuit counts and contact locations are available on special order. Contact your Omron representative. Specifications Rated current 0.5 A Rated voltage 50 VDC Contact resistance 30 MΩ max. at 20 mVDC, 100 mA max. Insulation resistance 100 MΩ min. at 250 VDC Withstand voltage 250 VAC for 1 minute (with a leakage current of 1 mA max.) Insertion tolerance 10 times Ambient temperature --30°C to 85°C (--22°F to 185°F); no condensation at low temperatures J MATERIALS/FINISH Housing PA46 resin (UL94V-0)/natural Contact Copper-alloy/nickel spring substrate (2 µm) plated with tin alloy (2 µm) XF2G XF2G Dimensions Unit: mm J XF2G-j jj14-11 A B Printed Circuit Board Matching Dimensions (Top View) 0.5 0.5¦0.05 1.6 C 4 2.95 2.4 1.6 0.5¦0.05 C¦0.05 4.15 Applicable FPC Dimensions 3.4 0.2 0.3 0.5¦0.1 B¦0.07 C¦0.05 0.5¦0.03 0.35¦0.03 2.8 5.0 min. T=0.3±0.05 (Copper conductors) J TABLE OF DIMENSIONS Circuits Part number A B C 6 XF2G-0614-11 4.9 (0.193) 3.5 (0.380) 2.5 (0.098) 14 XF2G-1414-11 8.9 (0.350) 7.5 (0.295) 6.5 (0.256) 16 XF2G-1614-11 9.9 (0.390) 8.5 (0.335) 7.5 (0.295) 2 XF2G XF2G J TAPE AND REEL DIMENSIONS A B 3 (0.118) +0.1 4±0.1 (0.157) 1.5 0 (0.055) dia. 2 (0.079) Direction of drawout 330 (12.99) dia. 11.5±0.1 E (0.453) C D E Direction of drawout 4.4±0.1 (0.173) Part number 6 XF2G-0614-11 14 XF2G-1414-11 16 XF2G-1614-11 B 12±0.1 (0.472) 80 (3.15) dia. Circuits 1.75±0.1 (0.069) A +2 0 (0.646) +2 0 (0 961) (0.961) 16.4 24 4 24.4 1.3 (0.051) 1.36 (0.054) 3.5 (0.138) 2.6 (0.102) B C D E 22.4 (0.882) 5.0 (0.197) 3.1 (0.122) 16±0.3 (0.630) 30.4 (1.197) ( ) 9.0 (0.354) 7.1 (0.280) 24±0.3 ((0.945)) 10.0 (0.394) 8.1 (0.319) Precautions J RECOMMENDED REFLOW CONDITIONS J STORAGE Pre-heat Temperature: 150±10°C Time: 60 to 120 seconds Do not store under high humidity levels as this may cause deterioration of the insulation. Soldering Temperature: 200 to 240°C Time: Not exceeding 30 seconds (Not exceeding 10 seconds at 240°C maximum temperature.) J HANDLING THE FPC Do not forcibly bend or pull an FPC which has been mounted and locked. This may cause discontinuities in the FPC. 3 XF2G XF2G NOTE: DIMENSIONS SHOWN ARE IN MILLIMETERS. To convert millimeters to inches divide by 25.4. R OMRON ELECTRONICS LLC OMRON ON-LINE OMRON CANADA, INC. 1-800-55-OMRON Global -- http://www.omron.com USA -- http://www.omron.com/oei Canada -- http://www.omron.com/oci 416-286-6465 One East Commerce Drive Schaumburg, IL 60173 Cat. No. G011G-E3-1 05/01/2.5M Specifications subject to change without notice. 885 Milner Avenue Scarborough, Ontario M1B 5V8 Printed in U.S.A.