XF2H-2615-1LW

Product News FPC Connectors Low-profile FPC connectors with 0.3/0.5 mm-pitch Series Additions Original backlock mechanism ensures greater work efficiency and higher reliability. Wide Variety from ZIF (Zero Insertion Force) to Non-ZIF Low Profile XF2N XF2R Low profile of 0.9 mm Applicable FPC thickness, t = 0.2 mm Low profile of 0.9 mm Applicable FPC thickness, t = 0.12 mm General-purpose Types XF2H ■ XF2M Lineup of 10 to 53-pin types Applicable FPC thickness, t = 0.3 mm S On-board area reduced by approx. 27% (compared to existing OMRON models) Applicable FPC thickness, t = 0.3 mm Narrow Pitch XF2B Mobile phones XF2B ● ●   ●   ●   ● 0.3 mm-pitch with zigzag terminal arrangement Applicable FPC thickness, t = 0.2 mm Parsonal Computers XF2N XF2R XF2M XF2B XF2M XF2H N ■XF2L ■XF2M ■XF2B 0.3 mm-pitch Type ●0.3 mm-pitch ●On-board profile of 1.2 mm ●Rotary backlock mechanism ●Double-sided contacts ●SMT terminals Reduced On-board Area Smallest On-board Area in the Industry ●0.5 mm-pitch ●On-board profile of 2 mm ●Rotary backlock mechanism ●Double-sided contacts ●SMT terminals ●0.5 mm-pitch ●On-board profile of 1.2 mm ●Slide-locking mechanism ●Lower-contact type ●SMT terminals ■XF2L Smallest On-board Area in the Industry ●0.5 mm-pitch ●On-board profile of 1.2 mm ●Slide-locking mechanism ●Upper-contact type ●SMT terminals ■XF2J Top Entry, ZIF Type ●0.5 mm-pitch ●On-board profile of 4.15 mm ●Slide-locking mechanism ●Single-sided contacts ●SMT terminals ■XF2R Low Profile Type ●0.5 mm-pitch ●On-board profile  of 0.9 mm ●Rotary backlock  mechanism ●Double-sided    contacts ●SMT terminals ■XF2N Low Profile Type ●0.5 mm-pitch ●On-board profile  of 0.9 mm ●Rotary backlock  mechanism ●Double-sided    contacts ●SMT terminals ■形XF2H Standard Type ●0.5 mm-pitch ●On-board profile  of 2 mm ●Rotary backlock  mechanism ●Double-sided    contacts ●SMT terminals ■形XF2G Top Entry, Non-ZIF Type N-ZIF ●0.5 mm-pitch ●On-board profile of 4.15 mm ●Single-sided contacts ●SMT terminals ■形XF2E Low Profile, Non-ZIF Type ●0.8 mm-pitch ●On-board profile of 1.5 mm ●Double-sided contacts ●SMT terminals Features of Rotary Backlock Mechanism Improvement 1 Rotary slider independent of the FPC socket. Slider does not disconnect if the FPC is lifted. High reliability. A mounted FPC will not come away if excess force is applied to it. Improvement 2 Four-shrouded FPC housing. Construction prevents FPC positional displacement. Enhanced mounting reliability as the FPC is held in a four-shrouded housing and is unaffected by the slider operation. Rotary Slider Conventional Rotary Connector FPC Socket XF2 Series 1 .Mount the connector. 1 .Mount the connector. 2 .Release the rotary slider. 2 . Insert the FPC. 3 .Insert the FPC. 3 . Lock the rotary slider. Upper Contact Lower Contact Upper Contact Lower Contact 4 .Lock the rotary slider. Improvement 3 Double-sided contacts No need to discriminate between the FPC upper and lower contacts. Connector commonality makes it unnecessary to distinguish between the upper and lower contacts when connecting upper and lower PCBs. Improvement 4 Delivered with the rotary slider open (released). Reduces the labor required to mount FPCs. Assembly productivity is better than with the conventional rotary locking type, as release of the rotary slider is unnecessary. XF sm XF2B/XF2N PCB design freedom increased with bottom wall and low profile. The provision of a bottom wall eliminates exposure of terminals on the reverse side of the connector. The XF2N and XF2B have low on-board profiles of 0.9 mm and 1.2 mm respectively and the XF2B boasts a narrow pitch of 0.3 mm, contributing to downsizing of devices. XF2R Improved FPC insertion sensation. The provision of an FPC guide section makes FPC insertion easier and improves work efficiency. The effective interface length has been increased to ensure greater reliability. XF2N XF2B Molded cover provided on bottom surface. FPC guide section: A wide variety of designs ranging from 10 to 53 pins. XF2H ). Meeting a wide range of applications with a variety of models with between 10 and 53 pins. Backed by reliability proved by many years of success and a new type of rotary lock construction, a broad range of models can be used to handle a wide range of applications. 1.1 mm 5.9 Depth: mm (with the slider closed) 5.9mm XF2M On-board mounting area approx. 27% less than the XF2H. The depth has been significantly reduced to contribute to product downsizing. Features of XF2L Slide-locking Mechanism Improvement 1 Occupies the smallest on-board area and volume in the industry. Smallest on-board area and volume in the industry achieves reduced equipment size, thickness, and weight. Ultra-compact size: 18.9 mm (W) Å~ 3.5 mm (D) Å~ 1.2 mm (H)*1 for 30-pin models. *1: A maximum of 1.2 mm including tolerance. Height: 1.15 mm (1.2 mm max.) With slider open Depth: 4.6 mm max. With slider close Depth: 3.5 mm max. With slider open Bottom wall Slider guide that restricts vertical movement Holding bracket Pattern can be added to bottom of connector. Mechanism that clicks when slider stops Improvement 2 Unique slider mechanism for stability and reliability. Employs slider guide to restrict vertical movement and holding bracket to securely lock the slider. The slider guide prevents rattling when the slider is opened and closed to allow smooth operation. The holding bracket prevents the slider from becoming detached after the connector has been assembled. Improvement 3 Highest board design efficiency in the industry. Wall on reverse side of connector enhances freedom of board design. The wall on the reverse side of the connector prevents terminals from protruding. Circuit patterns can be added to the connector's Rotary Backlock Type (0.3 mm-pitch) XF2B Rotary Backlock Mechanism and 0.3 mm-pitch Design Wall provided on reverse side of connector to allow greater freedom of board design. Double-sided (upper and lower) contact structure enables component reductions. Applicable FPC thickness, t = 0.2 mm. Gold-plated type. Use FPCs with the construction recommended by OMRON. (Refer to specifications for details.) Specifications Materials/Finish Rated current 0.2A AC/DC Housing LCP resin (UL94V-0) / natural Rated voltage 50V AC/DC Slider LCP resin (UL94V-0) / black Contact resistance 50mΩ max. (at 20 mV max., 100 mA max.) Contact Spring copper alloy/nickel substrate (2μm), gold-plated contacts (0.15μm) Insulation resistance 100MΩ min. (at 250V DC) Withstand voltage 250V AC for 1 min. (leakage current: 1 mA max.) Insertion tolerance 20 times Ambient operating temperature -30 to +85°C (with no icing or condensation) Dimensions XF2B- 45-31A Printed Circuit Board Matching Dimensions (Top View) A (1.4) 0.3 A±0.05 0.6 0.3±0.05 0.6±0.05 0.75±0.05 5.4±0.1 0.3±0.05 0.75±0.05 0.6±0.05 (1.1) 0.6 B D B±0.05 0.3±0.05 Applicable FPC Dimensions 0.5 A ±0.03 0.6 ±0.02 0.3 +0.04 -0.03 2.1 1.2 0.1 C 4.5 (reinforcement board) 2.5 ±0.03 0.5 1.23 0.55 5.2 5.5 Table of Dimensions 2 1.2 1 0.25 Pins Model A B C D 17 XF2B-1745-31A 4.2 4.8 5.5 7.0 23 XF2B-2345-31A 6.0 6.6 7.3 8.8 0.3 ±0.07 0.3 ±0.02 0.6±0.02 0.3 +0.04 -0.03 B ±0.03 (B+0.6) ±0.05 2-R0.2MAX T=0.2 ±0.03 (Conductive plating) Ordering Information Pins note 1 Model 17 XF2B-1745-31A 23 XF2B-2345-31A Quantity per reel note 2 1,500 note 1. Consult your OMRON representative for enquiries related to pin-number specifications. note 2. Order an integer multiple of the quantity per reel. 7 Low-profile Rotary Backlock Type (0.5 mm-pitch) XF2N Greater Freedom of Board Design with 0.9-mm Profile and Bottom Wall Backlock mechanism makes FPC mounting significantly easier. Double-sided (upper and lower) contact structure enables component reductions. Applicable FPC thickness, t = 0.2 mm. Gold-plated type. Use FPCs with the construction recommended by OMRON. (Refer to specifications for details.) Specifications Materials/Finish Rated current 0.3A AC/DC Housing LCP resin (UL94V-0)/natural Rated voltage 50V AC/DC Slider LCP resin (UL94V-0)/black Contact resistance 40mΩmax. (at 20 mV max., 100 mA max.) Contact Spring copper alloy/nickel substrate (1.5μm), gold-plated contacts (0.15μm) Insulation resistance 100 MΩ min. (at 250 V DC) Hold-down Spring copper alloy/fused-tin plating (1.5μm) Withstand voltage 250V AC for 1 min. (leakage current: 1 mA max.) Insertion tolerance 20 times Ambient operating temperature -30 to +85°C (with no icing or condensation) Dimensions XF2N- 15-3 Printed Circuit Board Matching Dimensions (Top View) C A 0.5 Applicable FPC Dimensions (B-0.1) ±0.05 A ±0.05 Shape of connector with FPC inserted A ±0.05 0.15 0.5 1.2 (Effective interface langth for upper / lower contacts) ±0.05 1 +0.05 0 0.5 ±0.1 0.5 ±0.05 0.35 ±0.03 1 ±0.03 1.95 ±0.05 (4.12) 4.02 ±0.03 1.7 0.25 2.12 1.4 ±0.05 0.87 2.12 Shape of connector 2.5MIN B 4.34 1.62 (E-0.3) ±0.05 (D+0.4) ±0.05 5 (reinforcement board) 4.12 T=0.2 ±0.03 (Conductive plating) 0.75 Table of Dimensions A B C D Pins Model 21 XF2N-2115-3 10.0 11.1 13.0 13.8 11.8 32 XF2N-3215-3 15.5 16.6 18.5 19.3 17.3 E Ordering Information Pins note 1 Model 21 XF2N-2115-3 32 XF2N-3215-3 Quantity per reel note 2 3,000 note 1. Consult your OMRON representative for enquiries related to pin-number specifications. note 2. Order an integer multiple of the quantity per reel. 8 1.2 (4.12) (Effective interface langth) Low-profile Rotary Backlock Type (0.5 mm-pitch) XF2R FPC Insertion Sensation and Work Efficiency Significantly Improved with 0.9-mm Profile and FPC Guide Section FPC insertion sensation greatly improved with 1.1-mm FPC guide section. The effective interface length for terminals has been increased to 1.4 mm to ensure stability in applications with a lot of movement. Double-sided (upper and lower) contact structure enables component reductions. Applicable FPC thickness, t = 0.12 mm. Gold-plated type. Use FPCs with the construction recommended by OMRON. (Refer to specifications for details.) Specifications Materials/Finish Rated current 0.3A AC/DC Housing LCP resin (UL94V-0)/natural Rated voltage 50V AC/DC Slider LCP resin (UL94V-0)/brown Contact resistance 40mΩmax. (at 20 mV max., 100 mA max.) Contact Spring copper alloy/nickel substrate (1.5μm), gold-plated contacts (0.15μm) Insulation resistance 100 MΩ min. (at 250V DC) Hold-down Spring copper alloy/fused-tin plating (1.5μm) Withstand voltage 250V AC for 1 min. (leakage current: 1 mA max.) Insertion tolerance 20 times Ambient operating temperature -30 to +85°C (with no icing or condensation) Dimensions XF2R- 15-4A Printed Circuit Board Matching Dimensions (Top View) ( + & 12& *&& ,&' *&& + 2& 0      7 ', /     . .    ,    &  5  3  &0 ' *&&'       & *&&' & *&& 4 &3  *&&' & *&& & *&&' + *&&  ,! ( #          -  ,  . /  .      Applicable FPC Dimensions & *& & *&& &' *&&' %&'"() Table of Dimensions Pins Model A B C D E F G 6 XF2R-0615-4A 5.0 2.5 3.6 6.1 4.1 4.55 5.35 9 XF2R-0915-4A 6.5 4.0 5.1 7.6 5.6 6.05 6.85 18 XF2R-1815-4A 11.0 8.5 9.6 12.1 10.1 10.55 11.35 24 XF2R-2415-4A 14.0 11.5 12.6 15.1 13.1 13.55 14.35 34 XF2R-3415-4A 19.0 16.5 17.6 20.1 18.1 18.55 40 XF2R-4015-4A 22.0 19.5 20.6 23.1   "#$ ,& *&& + *&&               !
         78& *&&'  .    − 21.1 21.55 22.35 Ordering Information Pins note 1 Model Pins note 1 Model Quantity per reel note 2 6 9 18 XF2R-0615-4A XF2R-0915-4A XF2R-1815-4A 24 34 40 XF2R-2415-4A XF2R-3415-4A XF2R-4015-4A 3,000 note 1. Consult your OMRON representative for enquiries related to pin-number specifications. note 2. Order an integer multiple of the quantity per reel. 9 Reduced-area Rotary Backlock Type (0.5 mm-pitch) XF2M Reduced-area Type Requires Approx. 27% Less On-board mounting area than the XF2H Short body with depth of 5.9 mm (with slider closed). Environment-friendly type that eliminates lead from solder is available as a standard product. Double-sided (upper and lower) contact structure enables component reductions. Applicable FPC thickness, t = 0.3 mm. Specifications Materials/Finish Rated current 0.5A AC/DC Housing LCP resin (UL94V-0)/natural Rated voltage 50V AC/DC Slider LCP resin (UL94V-0)/black Contact resistance 40mΩ max. (at 20 mV max., 100 mA max.) Contact Spring copper alloy/nickel substrate (2μm), tin-alloy plating (2μm) Insulation resistance 100 MΩ min. (at 250V DC) Hold-down Spring copper alloy/fused-tin plating (1.5μm) Withstand voltage 250V AC for 1 min. (leakage current: 1 mA max.) Insertion tolerance 20 times Ambient operating temperature -30 to +85°C (with no icing or condensation) Dimensions XF2M- 15-1F Printed Circuit Board Matching Dimensions (Top View) A ±0.05 A 0.5±0.08 (0.25) 0.5 ±0.05 0.15 1.1 2.6 3.4 4.9 1.5 1.1 Reference pin mark F ±0.1 G ±0.1 B C D Applicable FPC Dimensions 0.5 ±0.1 0.5 ±0.05 0.35 ±0.03 5.9 4.62 E 3.1 2 0.6 0.92 Model 1.35 (Effective interface length) 2.5MIN 4.5 (reinforcement board) 5.2 Table of Dimensions Pins A B C D E F G 40 XF2M-4015-1F 19.5 20.6 23.5 24.1 22.1 21.1 24.5 50 XF2M-5015-1F 24.5 25.6 28.5 29.1 27.1 26.1 29.5 Ordering Information Pins note 1 Model 40 XF2M-4015-1F 50 XF2M-5015-1F Quantity per reel note 2 1,500 note 1. Consult your OMRON representative for enquiries related to pin-number specifications. note 2. Order an integer multiple of the quantity per reel. 10 (B-0.1) ±0.05 A ±0.05 T=0.3 ±0.05 (Conductive plating) Standard Rotary Backlock Type (0.5 mm-pitch) XF2H New rotary lock concept achieves high reliability and superior work efficiency. The unique rotary lock construction significantly improves work efficiency during FPC mounting. Double-sided contacts maintain a stable contact force. Discrimination between FPC upper and lower contacts in unnecessary. Applicable FPC thickness, t = 0.3 mm. Specifications Materials/Finish Rated current 0.5A AC/DC Housing PA6T resin (UL94V-0)/natural Rated voltage 50V AC/DC Slider LCP resin (UL94V-0)/black Contact resistance 30mΩ max. (at 20 mV max., 100 mA max.) Contact Spring copper alloy/nickel substrate (2μm), tin-alloy plating (2μm) Insulation resistance 100 MΩ min. (at 250V DC) Withstand voltage 250V AC for 1 min. (leakage current: 1 mA max.) Insertion tolerance 20 times Ambient operating temperature -30 to +85°C (with no icing or condensation) Hold-down Spring copper alloy/fused-tin plating (1.5μm) Dimensions XF2H- 15-1LW A B 0.5 3.2 7.3 Table of Dimensions Pins Model 10 XF2H-1015-1LW 1 A B C D E 9.1 4.5 5.6 8.5 6.5 10.1 F 12 XF2H-1215-1LW 10.1 5.5 6.6 9.5 7.5 11.1 13 XF2H-1315-1LW 10.6 6.0 7.1 10.0 8.0 11.6 14 XF2H-1415-1LW 11.1 6.5 7.6 10.5 8.5 12.1 18 XF2H-1815-1LW 13.1 8.5 9.6 12.5 10.5 14.1 20 XF2H-2015-1LW 14.1 9.5 10.6 13.5 11.5 15.1 21 XF2H-2115-1LW 14.6 10.0 11.1 14.0 12.0 15.6 22 XF2H-2215-1LW 15.1 10.5 11.6 14.5 12.5 16.1 24 XF2H-2415-1LW 16.1 11.5 12.6 15.5 13.5 17.1 25 XF2H-2515-1LW 16.6 12.0 13.1 16.0 14.0 17.6 26 XF2H-2615-1LW 17.1 12.5 13.6 16.5 14.5 18.1 28 XF2H-2815-1LW 18.1 13.5 14.6 17.5 15.5 19.1 30 XF2H-3015-1LW 19.1 14.5 15.6 18.5 16.5 20.1 32 XF2H-3215-1LW 20.1 15.5 16.6 19.5 17.5 21.1 33 XF2H-3315-1LW 20.6 16.0 17.1 20.0 18.0 21.6 34 XF2H-3415-1LW 21.1 16.5 17.6 20.5 18.5 22.1 35 XF2H-3515-1LW 21.6 17.0 18.1 21.0 19.0 22.6 36 XF2H-3615-1LW 22.1 17.5 18.6 21.5 19.5 23.1 38 XF2H-3815-1LW 23.1 18.5 19.6 22.5 20.5 24.1 40 XF2H-4015-1LW 24.1 19.5 20.6 23.5 21.5 25.1 42 XF2H-4215-1LW 25.1 20.5 21.6 24.5 22.5 26.1 45 XF2H-4515-1LW 26.6 22.0 23.1 26.0 24.0 27.6 50 XF2H-5015-1LW 29.1 24.5 25.6 28.5 26.5 30.1 53 XF2H-5315-1LW 30.6 26.0 27.1 30.0 28.0 31.6 C D (8.1) 6.74 3.44 (1.9) 2 6.35 Printed Circuit Board Matching Dimensions (Top View) Applicable FPC Dimensions B ±0.05 0.5 ±0.05 0.5 ±0.1 (0.25) (C-0.1) ±0.07 B ±0.05 0.5 ±0.05 1.5 2.3 0.35 ±0.03 1.7 (Effective interface length) 1.3 2.8MIN 2.2 note B +0.25 E ±0.1 F ±0.1 T=0.3 ±0.05 (Conductive plating) note Pattern-prohibited Area If there is a pattern or via hole in this area, a short-circuit may occur in the terminals. 11 XF2H XF2H Ordering Information Pins note 1 Model Pins note 1 Model Pins note 1 Model 10 XF2H-1015-1LW 24 XF2H-2415-1LW 35 XF2H-3515-1LW 12 XF2H-1215-1LW 25 XF2H-2515-1LW 36 XF2H-3615-1LW 13 XF2H-1315-1LW 26 XF2H-2615-1LW 38 XF2H-3815-1LW 14 XF2H-1415-1LW 28 XF2H-2815-1LW 40 XF2H-4015-1LW 18 XF2H-1815-1LW 30 XF2H-3015-1LW 42 XF2H-4215-1LW 20 XF2H-2015-1LW 32 XF2H-3215-1LW 45 XF2H-4515-1LW 21 XF2H-2115-1LW 33 XF2H-3315-1LW 50 XF2H-5015-1LW 22 XF2H-2215-1LW 34 XF2H-3415-1LW 53 XF2H-5315-1LW Quantity per reel note 2 1,500 note 1. Consult your OMRON representative for enquiries related to pin-number specifications. note 2. Order an integer multiple of the quantity per reel. We will also accept small lot orders (for 100 or 500 units). When ordering, please specify model numbers that end with -R100 for 100 units or -R500 for 500 units. 12 ZIF Slide-locking Type (0.5 mm-pitch) XF2L Greater Freedom of Board Design with Smallest On-board Area in Industry and Bottom Wall Occupies the smallest on-board area and volume in the industry. Low on-board profile of only 1.2 mm max. Highest efficiency with board design surfaces in the industry with bottom wall preventing terminal exposure. Construction employs secure locking mechanism. Applicable FPC thickness, t = 0.3 mm. Specifications Materials/Finish Rated current 0.5A AC/DC Rated voltage 50V AC/DC Contact resistance 30mΩ max. (at 20 mV DC max., 100 mA max.) Model Ordering XF2L (Upper-contact Type) Housing LCP resin (UL94V-0)/natural LCP resin (UL94V-0)/ black Slider Insulation resistance 100 MΩ min. (at 250V DC) XF2L (Lower-contact Type) LCP resin (UL94V-0)/ brown Spring copper alloy/nickel substrate (2 μm), tin-alloy plating (2 μm) Withstand voltage 250V AC for 1 min. (leakage current: 1 mA max.) Contact Insertion tolerance 30 times Hold-down Ambient operating temperature -30 to +85°C (with no icing or condensation) Spring copper alloy/fused-tin plating (1.5 μm) Dimensions XF2L- 5-1 Applicable FPC Dimensions 0.5 ±0.1 B A 0.5 ±0.08 0.35 ±0.03 1.35 (Effective interface length) (0.2) Printed Circuit Board Matching Dimensions (Top View) (D-0.1) ±0.05 A ±0.05 0.5 ±0.05 F E A ±0.05 0.5 ±0.05 (0.25) 1 0.55 1.34 2.5 MIN. 1.05 (5) reinforcement board note. 3 1 0.75 G ±0.1 H ±0.1 C XF2L- T=0.3Å}0.03 (Cnductive plating) 25-1 (Upper-contact Type) D 3.05 XF2L25-1 (Cross Section of Upper-contact Type) 4.55 1.2 MAX. 3.45 XF2L- With slider open 35-1 (Lower-contact Type) XF2L35-1 (Cross Section of Lower-contact Type) D 3.05 4.55 1.2 MAX 3.45 With slider open Table of Dimensions Upper-contact Type Lower-contact Type Pins Model A B C D E F G H Pins Model A B C D E F G H 4 XF2L-0425-1 1.5 5.9 6.9 2.6 5.88 6.88 5.28 7.28 5 XF2L-0535-1 2.0 6.4 7.4 3.1 6.38 7.38 5.78 7.78 6 XF2L-0625-1 2.5 6.9 7.9 3.6 6.88 7.88 6.28 8.28 6 XF2L-0635-1 2.5 6.9 7.9 3.6 6.88 7.88 6.28 8.28 7 XF2L-0725-1 3.0 7.4 8.4 4.1 7.38 8.38 6.78 8.78 7 XF2L-0735-1 3.0 7.4 8.4 4.1 7.38 8.38 6.78 8.78 8 XF2L-0825-1 3.5 7.9 8.9 4.6 7.88 8.88 7.28 9.28 8 XF2L-0835-1 3.5 7.9 8.9 4.6 7.88 8.88 7.28 9.28 9 XF2L-0925-1 4.0 8.4 9.4 5.1 8.38 9.38 7.78 9.78 10 XF2L-1035-1 4.5 8.9 9.9 5.6 8.88 9.88 8.28 10.28 10 XF2L-1025-1 4.5 8.9 9.9 5.6 8.88 9.88 8.28 10.28 12 XF2L-1235-1 5.5 9.9 10.9 6.6 9.99 10.88 9.28 11.28 12 XF2L-1225-1 5.5 9.9 10.9 6.6 9.88 10.88 9.28 11.28 13 XF2L-1335-1 6.0 10.4 11.4 7.1 10.38 11.38 9.78 11.78 13 XF2L-1325-1 6.0 10.4 11.4 7.1 10.38 11.38 9.78 11.78 15 XF2L-1535-1 7.0 11.4 12.4 8.1 11.38 12.38 10.78 12.78 18 XF2L-1825-1 8.5 12.9 13.9 9.6 12.88 13.88 12.28 14.28 18 XF2L-1835-1 8.5 12.9 13.9 9.6 12.88 13.88 12.28 14.28 21 XF2L-2125-1 10.0 14.4 15.4 11.1 14.38 15.38 13.78 15.78 19 XF2L-1935-1 9.0 13.4 14.4 10.1 13.38 14.38 12.78 14.78 26 XF2L-2625-1 12.5 16.9 17.9 13.6 16.88 17.88 16.28 18.28 20 XF2L-2035-1 9.5 13.9 14.9 10.6 13.88 14.88 13.28 15.28 30 XF2L-3025-1 14.5 18.9 19.9 15.6 18.88 19.88 18.28 20.28 22 XF2L-2235-1 10.5 14.9 15.9 11.6 14.88 15.88 14.28 16.28 24 XF2L-2435-1 11.5 15.9 16.9 12.6 15.88 16.88 15.28 17.28 30 XF2L-3035-1 14.5 18.9 19.9 15.6 18.88 19.88 18.28 20.28 13 XF2L XF2L Ordering Information Pins note 1 Type Model 4 Upper-contact XF2L-0425-1 5 Lower-contact XF2L-0535-1 Upper-contact XF2L-0625-1 Lower-contact XF2L-0635-1 Upper-contact XF2L-0725-1 Lower-contact XF2L-0735-1 6 7 8 9 Upper-contact XF2L-0825-1 Lower-contact XF2L-0835-1 Upper-contact XF2L-0925-1 Pins note 1 10 12 13 15 18 Type Model Pins note 1 Type Model Upper-contact XF2L-1025-1 19 Lower-contact XF2L-1935-1 Lower-contact XF2L-1035-1 20 Lower-contact XF2L-2035-1 Upper-contact XF2L-1225-1 21 Upper-contact XF2L-2125-1 Lower-contact XF2L-1235-1 22 Lower-contact XF2L-2235-1 Upper-contact XF2L-1325-1 24 Lower-contact XF2L-2435-1 Lower-contact XF2L-1335-1 26 Upper-contact XF2L-2625-1 Lower-contact XF2L-1535-1 Upper-contact XF2L-1825-1 Lower-contact XF2L-1835-1 30 − Upper-contact XF2L-3025-1 Lower-contact XF2L-3035-1 − − note 1. Consult your OMRON representative for enquiries related to pin-number and lead-free plating specifications. note 2. Order an integer multiple of the quantity per reel. note 3. Use polyimide and thermoset adhesive for reinforcement film material. 14 Quantity per reel note 2 3,000 ZIF Slide-locking Type (0.5 mm-pitch) XF2J Top-entry ZIF Connector Low on-board profile of only 4.15 mm. Adhesion face on top of the connector suits automatic mounting. Models with reverse terminal arrangement also available. Applicable FPC thickness, t = 0.3 mm. Specifications Materials/Finish Rated current 0.5A AC/DC Rated voltage 50V AC/DC Contact resistance 30mΩ max. (at 20 mV max., 100 mA max.) Insulation resistance 100 MΩ min. (at 250V DC) Withstand voltage 250V AC for 1 min. (leakage current: 1 mA max.) Insertion tolerance 30 times Ambient operating temperature -30 to +85°C (with no icing or condensation) Housing PA46 resin (UL94V-0)/natural Slider PPS resin (UL94V-0)/black LCP resin (UL94V-0)/black Contact Spring copper alloy/nickel substrate (2μm), tin-alloy plating (2μm) Hold-down Spring copper alloy/fused-tin plating (1.5μm) Dimensions XF2J- 24-11 Applicable FPC Dimensions (C-0.1) ±0.07 B ±0.05 0.5 ±0.05 0.5 ±0.1 Standard Terminal Arrangement Reverse Terminal Arrangement A A 1 0.5 0.35 ±0.03 1 0.5 3MIN B C B C D T=0.3 ±0.05 (Conductive plating) 2.95 D 2.95 4.15 4.15 2.4 3.4 0.8 1.3 0.8 2.4 (B) 1.3 0.2 3.4 0.2 2.3 2.3 Printed Circuit Board Matching Dimensions (Top View) 1.4 1 B ±0.05 0.5 ±0.05 Printed Circuit Board Matching Dimensions (Top View) 1 1.4 1.4 1 B ±0.05 0.5 ±0.05 1.6 2.9 1.6 4 2.9 4 1.6 0.5 ±0.05 1 1.4 1.6 0.4 ±0.05 Table of Dimensions Model Pins Standard Terminal Arrangement Reverse Terminal Arrangement A B C D 6 XF2J-0624-11 8 XF2J-0824-11 XF2J-0624-12 7.5 2.5 3.6 6.9 XF2J-0824-12 8.5 3.5 4.6 10 7.9 XF2J-1024-11 XF2J-1024-12 9.5 4.5 5.6 8.9 12 XF2J-1224-11 XF2J-1224-12 10.5 5.5 6.6 9.9 14 XF2J-1424-11 11.5 6.5 7.6 10.9 16 XF2J-1624-11 − XF2J-1624-12 12.5 7.5 8.6 11.9 18 XF2J-1824-11 XF2J-1824-12 13.5 8.5 9.6 12.9 20 XF2J-2024-11 XF2J-2024-12 14.5 9.5 10.6 13.9 22 XF2J-2224-11 XF2J-2224-12 15.5 10.5 11.6 14.9 24 XF2J-2424-11 XF2J-2424-12 16.5 11.5 12.6 15.9 26 XF2J-2624-11 − 17.5 12.5 13.6 16.9 28 XF2J-2824-11 − 18.5 13.5 14.6 17.9 30 XF2J-3024-11 − 19.5 14.5 15.6 18.9 15 XF2J XF2J Ordering Information Model Pins note 1 Standard Terminal Reverse Terminal Arrangement Arrangement 6 XF2J-0624-11 XF2J-0624-12 8 XF2J-0824-11 XF2J-0824-12 10 XF2J-1024-11 XF2J-1024-12 12 XF2J-1224-11 XF2J-1224-12 14 XF2J-1424-11 16 XF2J-1624-11 − XF2J-1624-12 18 XF2J-1824-11 XF2J-1824-12 20 XF2J-2024-11 XF2J-2024-12 22 XF2J-2224-11 XF2J-2224-12 24 XF2J-2424-11 XF2J-2424-12 26 XF2J-2624-11 − 28 XF2J-2824-11 − 30 XF2J-3024-11 − Quantity per reel note 2 1,000 note 1. Consult your OMRON representative for enquiries related to pin-number and lead-free plating specifications. note 2. Order an integer multiple of the quantity per reel. note 3. We will also accept small lot orders (for 100 or 500 units). When ordering, please specify model numbers that end with -R100 for 100 units or -R500 for 500 units. 16 Non-ZIF Type (0.5 mm-pitch) XF2G Top-entry ZIF Connector Low on-board profile of only 4.15 mm. Adhesion face on top of the connector suits automatic mounting. Applicable FPC thickness, t = 0.3 mm. Specifications Materials/Finish Rated current 0.5A AC/DC Rated voltage 50V AC/DC Contact resistance 30mΩ max. (at 20 mV max., 100 mA max.) Housing PA46 resin (UL94V-0)/natural Contact Spring copper alloy/nickel substrate (2μm), tin-alloy plating (2μm) Insulation resistance 100 MΩ min. (at 250V DC) Withstand voltage 250V AC for 1 min. (leakage current: 1 mA max.) Insertion tolerance 10 times Ambient operating temperature -30 to +85°C (with no icing or condensation) Dimensions XF2G- 14-11 Printed Circuit Board Matching Dimensions (Top View) A B 0.5 ±0.05 0.5 1.6 4 1.6 C Table of Dimensions Pins Model A B C 6 XF2G-0614-11 4.9 3.5 2.5 14 XF2G-1414-11 8.9 7.5 6.5 16 XF2G-1614-11 9.9 8.5 7.5 24 XF2G-2414-11 13.9 12.5 11.5 26 XF2G-2614-11 14.9 13.5 12.5 0.5 ±0.05 2.95 2.4 C ±0.05 Applicable FPC Dimensions 4.15 B ±0.07 C ±0.05 0.5 ±0.03 3.4 0.5 ±0.1 0.35 ±0.03 0.2 2.8 5 (reinforcement board) T=0.3Å}0.05 (Couductive plating) Ordering Information Pins note 1 Model 6 XF2G-0614-11 14 XF2G-1414-11 16 XF2G-1614-11 24 XF2G-2414-11 26 XF2G-2614-11 Quantity per reel note 2 1,000 note 1. Consult your OMRON representative for enquiries related to pin-number specifications. note 2. Order an integer multiple of the quantity per reel. 17 Non-ZIF Type (0.8 mm-pitch) XF2E Low on-board profile of only 1.5 mm. Double-sided contacts maintain a stable contact force. Discrimination between FPC upper and lower contacts in unnecessary. Applicable FPC thickness, t = 0.3 mm.. Specifications Materials/Finish Rated current 0.5A AC/DC Rated voltage 50V AC/DC Contact resistance 30mΩ max. (at 20 mV max., 100 mA max.) Insulation resistance 100 MΩ min. (at 250V DC) Withstand voltage 500V AC for 1 min. (leakage current: 1 mA max.) Insertion tolerance 10 times Ambient operating temperature -30 to +85°C (with no icing or condensation) Housing Glass-filled modified PA resin (UL94V-0)/milk white Contact Spring copper alloy/nickel substrate (2μm), tin-alloy plating (2 μm) Hold-down Copper-alloy/copper substrate (2μm), tin-alloy plating (2μm) Dimensions XF2E- 15-1 1.2 A C Applicable FPC Dimensions 0.8 0.2 1 0.8 ±0.15 5.6 4.9 (B-0.1) ±0.07 C ±0.05 0.8 ±0.05 0.5 ±0.05 2.8 2.85 0.6 0.3 B D T=0.3 ±0.05 (Conductive plating) 1.5 0.1 Table of Dimensions 0.2 Pins Model A B C D 5 XF2E-0515-1 7.6 4.9 3.2 6.2 6 XF2E-0615-1 8.4 5.7 4.0 7.0 7 XF2E-0715-1 9.2 6.5 4.8 7.8 8 XF2E-0815-1 10.0 7.3 5.6 8.6 9 XF2E-0915-1 10.8 8.1 6.4 9.4 10 XF2E-1015-1 11.6 8.9 7.2 10.2 12 XF2E-1215-1 13.2 10.5 8.8 11.8 15 XF2E-1515-1 15.6 12.9 11.2 14.2 17 XF2E-1715-1 17.2 14.5 12.8 15.8 20 XF2E-2015-1 19.6 16.9 15.2 18.2 C ±0.05 0 0.3 -0.05 0.8 ±0.05 (1.4) 2.8 2.1+0.1 0 0.6 (D+0.1) ±0.05 Ordering Information Pins note 1 Model Pins note 1 Model 5 XF2E-0515-1 10 XF2E-1015-1 6 XF2E-0615-1 12 XF2E-1215-1 7 XF2E-0715-1 15 XF2E-1515-1 8 XF2E-0815-1 17 XF2E-1715-1 Quantity per reel note 2 4,000 9 XF2E-0915-1 20 XF2E-2015-1 note 1. Consult your OMRON representative for enquiries related to pin-number specifications. note 2. Order an integer multiple of the quantity per reel. 18 0.4 Basic Pattern Dimensions (Reference) +0.1 0 XF2 XF2 Common Precautions for XF2 Connectors Precautions Recommended Reflow Conditions Standard reflow conditions Reflow conditions for lead-free solder (backlock type only) Preheating temperature 150 ± 10°C 150 to 180°C Time 60 to 120 s 60 to 120 s 200 to 240°C 230 to 250°C 30 s max. 30 s max. Correct Use Backlock Types Do not lock the slider without an FPC inserted. Locking the slider without an FPC inserted will cause a decrease in the dimensions between the contacts and consequently an increase in the force required to insert an FPC. ・ When designing the board, be sure to allow locking space for the slider (i.e., space for the slider when it is locked). ・The connector has a double-sided contact structure and so be sure to insert the FPC with the correct orientation. ・ When locking the slider, press it down securely with your fingers at both ends. Failing to lock the slider properly may result in contact failure. ・ Unlocking the Slider Unlock the slider manually. Place your index fingers at both ends of the slider and lift it up. Do not apply excessive force when lifting the slider. Doing so may result in the slider being damaged or detached. If the slider becomes detached, it may not be able to hold the FPC and contact failure may result. Soldering temperature Time (10 s max. at the maximum temperature 240°C) Storage 1. Do not store in locations subject to dust or high humidity levels. 2. Do not store in locations close to sources of gases such ammonia gas or sulphide gas. All Models ・ Insert the FPC right to the back of the connector. Failing to do so may result in a loss of contact reliability. ・ After mounting (and locking) the FPC, do not bend or pull it with excessive force. Doing so may result in FPC disconnection. ・ When bending the FPC after mounting to the PCB, do not bend it excessively near the place where it enters the connector. Doing so may result in a loss of contact reliability. ・ In applications where the connector may frequently be exposed to shock or vibration, or where, as part of a mechanism, connected parts may move, secure the FPC and make sure that it is not subjected to a direct load. ・ Do not perform reflow or manual soldering with the FPC inserted in the connector. Doing so may result in a loss of contact reliability. ・ Unlock the slider before removing the FPC. ・ Use an FPC with the structure recommended by OMRON. ・ Do not perform reflow or manual soldering with the slider locked. Doing so may result in a loss of contact reliability. ・ Observe a metal mask thickness of t = 0.12 to 0.15 mm. ・ Metal mask open area ratio: 90% of the printed circuit board matching dimensions in the dimensions diagrams. 19 ALL DIMENSIONS SHOWN ARE IN MILLIMETERS. To convert millimeters into inches, multiply by 0.03937. To convert grams into ounces, multiply by 0.03527. Cat. No. G011-E1-02 In the interest of product improvement, specifications are subject to change without notice. OMRON Corporation MARKETING SECTION CONNECTOR DEPARTMENT Electronic & Mechanical Components Division H.Q. Work Shop4, Manufacturing Development Center 2-1, 2-Chome, Nishikusatsu, Kusatsu-City, Shiga, 525-0035 Japan Tel: (81)77-565-5314/Fax: (81)77-565-5581 20 Printed in Japan 0503-3M (0199)